JP2016177856A - Magnetic head device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a magnetic head device excellent in the bond strength of an arm and a suspension, and highly accurate in size and shape.SOLUTION: A magnetic head device 2 comprises: an arm 4; a suspension 8 overlapping on a tip of the arm 4; a slider 10 positioned at the tip of the suspension 8; a first junction 12 positioned between the tip of the arm 4 and the suspension 8, and bonding the arm 4 and the suspension 8. The first junction 12 contains Sn or resin-based adhesive. At least one joint surface 4A of an arm-side joint surface 4A and a suspension-side joint surface 8A includes a first overlapping area 4Aa overlapping on the other joint surface 8A and a first non-overlapping area 4Ab not overlapping on the other joint surface 8A. The first junction 12 is in contact with both the arm 4 and the suspension 8 on the first overlapping area 4Aa, and a part of the first junction 12 extends to at least part of the first non-overlapping area 4Ab.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a magnetic head device.

  In the magnetic disk device, a head stack assembly (HSA) reads and writes magnetic recording. The HSA includes, for example, a carriage having a plurality of arms, and a head gimbal assembly (HGA) joined to each arm. The HGA has a suspension joined to the tip of the arm, and a slider positioned at the tip of the suspension. A magnetic head (for example, a thin film magnetic head) is incorporated in the slider. A carriage having a plurality of arms (E-shaped carriage) may be referred to as an E-block.

  Conventionally, as a main method for joining an arm and a suspension, fitting joining as described in Patent Document 1 is known. In the method described in Patent Document 1 below, a flange is formed on the suspension and a fitting hole is formed on the arm. Match the position of the flange with the position of the fitting hole, and fit the flange of the suspension into the fitting hole of the arm. Subsequently, the metal ball is introduced from the hole of the flange by the pressure shaft, and is passed through each hole. Since the diameter of the metal ball is larger than the minimum diameter of the hole of the flange, the suspension flange is pushed and bent by the metal ball, and the flange is pressed against the arm. That is, swaging (caulking) is performed. Through these procedures, the arm and the suspension are joined.

  Moreover, joining methods other than fitting joining are also known. For example, Patent Document 2 below describes joining a suspension and an arm by irradiation with a joining beam (YAG laser).

JP-A-5-303855 JP-A-7-178582

  In order to increase the storage capacity of the magnetic disk device, it is necessary to increase the number of magnetic disks mounted on the device. However, the size (height) of the magnetic disk device is limited. Therefore, in order to increase the number of magnetic disks, it is necessary to thin the arms, suspensions, and their joints, and to narrow the spaces between the arms and suspensions, thereby expanding the space for installing the magnetic disks.

  In the case of fitting joining described in Patent Document 1, the thinner the arm and suspension, the narrower the fitting range (joining portion), and the joining strength decreases. In other words, the thinner the arm and suspension, the shallower each fitting hole, and the bonding strength decreases. As the bonding strength decreases, the position of the magnetic head becomes unstable, and accurate reading and writing of magnetic recording becomes difficult. In the worst case, the suspension is detached from the arm and dropped onto the magnetic disk, and the magnetic disk is damaged.

  Moreover, in the joining using the laser of the said patent document 2, an arm and a suspension are welded in the spot of a laser. Since the size of the spot is restricted, the bonding area (bonding portion) becomes narrow, and a reliable and sufficient bonding strength cannot be obtained. Further, as the number of magnetic disks increases, the space between the suspensions becomes narrower, and it becomes difficult to accurately irradiate the laser with a desired position. As a result, reliable and sufficient bonding strength cannot be obtained.

  In order to solve the above problem, the present inventors joined the arm surface and the suspension surface via a Sn (tin) simple substance or an alloy containing Sn (Sn-based alloy), thereby providing an arm. It was also found that the joint strength of the suspension is improved. The present inventors have also found that the bonding strength between the arm and the suspension is improved even when the surface of the arm and the surface of the suspension are bonded with a resin adhesive. By using any of Sn, Sn-based alloy, and resin-based adhesive, the arm and the suspension are joined by surface contact. Therefore, even when the arm and suspension are thin, excellent bonding strength is realized.

  However, the present inventors have discovered that the following problems arise when the arm and suspension are joined using any one of Sn, Sn-based alloy, and resin-based adhesive.

  When the surface of the arm and the surface of the suspension are joined via Sn or an Sn-based alloy, the molten Sn or Sn-based alloy (molten metal) flows and protrudes from between the arm and the suspension, and fillets. Is easy to form. Large fillets detract from the accuracy of the size and shape of the HSA. For example, the positions of the arms and the suspension may be determined by forming through holes (positioning holes) in the arms and the suspension and aligning the positions of the through holes. However, if a fillet is formed in each through hole, the accuracy of the dimension of the positioning hole is impaired, and accurate positioning of the arm and the suspension becomes difficult. Even when the surface of the arm and the surface of the suspension are bonded with a resin adhesive, the uncured resin adhesive flows and easily protrudes between the arm and the suspension. If the resin adhesive protrudes too much, the resin adhesive impairs the accuracy of the size and shape of the HSA like the fillet. Hereinafter, the resin adhesive protruding from between the arm and the suspension is also referred to as “fillet” for convenience.

  With the downsizing of magnetic disk devices and the increase in magnetic disks, the size and shape of the installation of HSA mounted on the magnetic disk devices are severely restricted. Therefore, the accuracy of the size and shape of the HSA must be improved by suppressing fillet formation or growth.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a magnetic head device that is excellent in joint strength between an arm and a suspension and has high size and shape accuracy.

  A magnetic head device according to one aspect of the present invention includes an arm, a suspension that overlaps the tip of the arm, a slider that is positioned at the tip of the suspension, and a position between the tip of the arm and the suspension. A first bonding portion that includes Sn or a resin adhesive, and the arm-side bonding surface is defined as a surface of the arm surface that faces the suspension. When the side joint surface is defined as a surface of the suspension surface facing the arm, at least one of the arm side joint surface and the suspension side joint surface overlaps the other joint surface. And a first non-overlapping area that does not overlap with the other joining surface, the first joining part being on both the arm and the suspension in the first overlapping area. And it is, part of the first joint portion, and extends to at least a portion of the first non-overlapping area.

  In one aspect of the present invention, the first joint portion may include an alloy containing Sn, and the alloy may be Ag (silver), Cu (copper), Bi (bismuth), In (indium), Ni (nickel). ), Zn (zinc), P (phosphorus), and Au (gold).

  In one aspect of the present invention, the suspension is a load that overlaps the tip of the arm and is joined to the arm by the first joint, and a load in which one tip overlaps the spacer and the slider is located at the other tip. And a second joint that is located between the spacer and the load beam and joins the spacer and the load beam, and the second joint may contain Sn or a resin-based adhesive. The spacer side joint surface is defined as a surface of the spacer surface that faces the load beam, and the load beam side joint surface is defined as a surface of the load beam surface that faces the spacer. And at least one of the load beam side joining surfaces includes a second overlapping region that overlaps the other joining surface and a second non-overlapping region that does not overlap the other joining surface. Well, the second bonding portion may contact with both of the spacer and load beam in a second heavy becomes zone, part of the joint may not extend to at least a portion of the second non-overlapping region.

  In one aspect of the present invention, the second bonding portion may include an alloy containing Sn, and the alloy is at least one selected from the group consisting of Ag, Cu, Bi, In, Ni, Zn, P, and Au. May be contained.

  In one aspect of the present invention, the suspension is a load that overlaps the tip of the arm and is joined to the arm by the first joint, and a load in which one tip overlaps the spacer and the slider is located at the other tip. And the spacer and the load beam may be directly welded.

  The magnetic head device according to one aspect of the present invention may include a carriage having a plurality of arms.

  According to the present invention, it is possible to provide a magnetic head device that has excellent joint strength between an arm and a suspension and has high size and shape accuracy.

FIG. 1 is a schematic perspective view of the magnetic head device according to the first embodiment of the present invention. FIG. 2 is a schematic top view of a magnetic disk device including the magnetic head device according to the first embodiment of the present invention. FIG. 3 is a schematic side view of the magnetic disk device shown in FIG. FIG. 4 is a schematic enlarged view of the arm, the first joint, and the suspension included in the magnetic head device shown in FIG. 5 is a schematic top view of the tip and suspension of the arm shown in FIG. 1, and b (FIG. 5 b) in FIG. 5 is the arm on the line bb in FIG. It is typical sectional drawing of one junction part and a suspension. FIG. 4 is a schematic side view of an arm, a first joint, a spacer, a second joint, a load beam, a flexure, and a slider included in a magnetic head device according to a second embodiment of the present invention. is there. In FIG. 7, a (FIG. 7a) is a schematic top view of the tip of the arm and the load beam shown in FIG. 6, and b (FIG. 7b) in FIG. 7 is the arm along the line bb in FIG. It is typical sectional drawing of a 1st junction part, a spacer, a 2nd junction part, and a load beam. FIG. 6 is a schematic top view of an arm tip and a suspension included in a magnetic head device according to a third embodiment of the present invention. It is typical sectional drawing of the arm in the IX-IX line of FIG. 8, a 1st junction part, and a spacer. FIG. 10 is a schematic top view of an arm tip and a suspension included in a magnetic head device according to a fourth embodiment of the present invention. It is typical sectional drawing of the arm in the XI-XI line of FIG. 10, a 1st junction part, and a spacer. FIG. 10 is a schematic top view of an arm tip and a load beam included in a magnetic head device according to a fifth embodiment of the present invention. It is typical sectional drawing of the arm in the XIII-XIII line | wire of FIG. 12, a 1st junction part, a spacer, a 2nd junction part, and a load beam. In FIG. 14, a (FIG. 14a) is a schematic top view of the tip of the arm and the suspension provided in the magnetic head device according to the sixth embodiment of the present invention, and b (FIG. 14b) in FIG. It is typical sectional drawing of the arm in the bb line of 14a, a 1st junction part, and a suspension. It is typical sectional drawing of the arm with which the magnetic head apparatus based on 7th Embodiment of this invention is equipped, a 1st junction part, and a spacer (a part of suspension). In FIG. 16, a (FIG. 16a) is a schematic diagram showing the first step of the method of manufacturing the magnetic head device according to the comparative example of the present invention, and b (FIG. 16b) in FIG. 16 is shown in FIG. 6a. It is a typical sectional view of an arm with which a magnetic head device manufactured through the 1st process is provided, the 1st joined part, and a suspension.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or equivalent components are denoted by the same reference numerals. The present invention is not limited to the following embodiment.

(First embodiment)
The magnetic head device according to the first embodiment is a head stack assembly (HSA). As shown in FIGS. 1, 2, 3, and 4, the HSA 2 is positioned at a carriage 6 having a plurality of arms 4, a suspension 8 that overlaps the distal end portion of each arm 4, and a distal end portion of each suspension 8. The slider 10 includes a first joint 12 that is located between the tip of the arm 4 and the suspension 8 and joins the arm 4 and the suspension 8. In other words, the HSA 2 includes a carriage 6 having a plurality of arms 4, a head gimbal assembly (HGA 11) joined to the tip of each arm 4, a first joint 12 that joins the arm 4 and the HGA 11, Is provided. Each of the arm 4 and the suspension 8 may be flat or substantially plate-shaped. Each of the arm 4 and the suspension 8 may extend in a predetermined direction. That is, each of the arm 4 and the suspension 8 may be long. The suspension 8 may overlap only on one side of the tip of the arm 4. One suspension 8 may overlap the surface of the distal end portion of the arm 4, and another suspension 8 may overlap the back surface of the distal end portion of the arm 4. That is, the tip of one arm 4 may be sandwiched between a pair of suspensions 8. Each slider 10 incorporates a magnetic head (for example, a thin film magnetic head). The plurality of arms 4 and the HGA 11 overlap each other at a predetermined interval in the same direction. For convenience of explanation, the number of arms 4 shown in the figure is three, but the number of arms 4 is not limited. For convenience of explanation, the number of suspensions 8 and sliders 10 shown in the figure is four, but the number of suspensions 8 and sliders 10 is not limited.

  The HSA 2 is mounted on a magnetic disk device 18 (HDD) including a plurality of magnetic disks 16. The plurality of magnetic disks 16 are attached to the spindle motor 20 and are stacked at a predetermined interval. Each magnetic disk 16 may be disposed between a pair of HGAs 11. Each slider 10 located at the tip of the HGA 11 faces the magnetic disk 16. A portion of the carriage 6 located on the opposite side of the arm 4 is a coil portion 14. The coil part 14 and a pair of permanent magnets 22 facing each other with the coil part 14 therebetween constitute a voice coil motor (VCM; Voice Coil Motor). For convenience of explanation, the number of magnetic disks 16 shown is two, but the number of magnetic disks 16 is not limited.

  The 1st junction part 12 contains Sn or a resin adhesive. The 1st junction part 12 should just contain any one among Sn or a resin adhesive. The 1st junction part 12 may contain Sn simple substance. The 1st junction part 12 may consist only of Sn single-piece | unit. The 1st junction part 12 may contain the alloy containing Sn. The 1st junction part 12 may consist only of the alloy containing Sn. The alloy containing Sn may contain at least one selected from the group consisting of Ag, Cu, Bi, In, Ni, Zn, P and Au. Hereinafter, an alloy containing Sn may be referred to as “Sn-based alloy”. The resin-based adhesive included in the first joint 12 means a resin-based adhesive that has already been cured. The 1st junction part 12 may consist only of the hardened | cured resin-type adhesive agent. The resin adhesive may be, for example, a thermosetting resin. The thermosetting resin may be, for example, an epoxy resin or a phenol resin.

  The material constituting the arm 4 (base of the arm 4) is not particularly limited, and may be, for example, Al (aluminum). A part or the whole of the surface of the arm 4 may be a protective layer made of Ni-P (Ni containing phosphorus). That is, the arm 4 may have a base made of Al or the like and a protective layer that covers part or all of the surface of the base. The first joint 12 may be located on the protective layer that forms the surface of the arm 4. The material constituting the entire carriage 6 (excluding the coil portion 14) may be the same as the material constituting the arm 4. A part of the surface of the carriage 6 (excluding the coil portion 14) or the entire surface may be the protective layer. The material constituting the suspension 8 (the base of the suspension 8) is not particularly limited, and may be, for example, SUS (stainless steel).

  Based on FIG. 5b, the 1st junction part 12 is demonstrated in detail. Note that the cross section shown in FIG. 5B corresponds to the cross section in the Vb-Vb line direction of FIG. However, the vertical relationship between the arm 4 and the suspension 8 in FIG. 5b does not necessarily match the vertical relationship between the arm 4 and the suspension 8 in the cross section in the direction of the Vb-Vb line in FIG. Further, the vertical relationship between the arm 4 and the suspension 8 in FIGS. 7b, 9, 11, 13, and 14b, which will be described later, also corresponds to the cross section in the direction of the Vb-Vb line in FIG. 4 and the vertical relationship between the suspension 8 and the vertical relationship between the arm 4 and the suspension 8 in the cross section in the direction of the Vb-Vb line in FIG.

  As shown in FIG. 5 b, the arm side joint surface 4 </ b> A is defined as a surface of the surface of the arm 4 that faces the suspension 8. The suspension-side joining surface 8A is defined as a surface facing the arm 4 in the surface of the suspension 8. Of the arm-side joining surface 4A and the suspension-side joining surface 8A, the arm-side joining surface 4A includes a first overlapping region 4Aa that overlaps with the suspension-side joining surface 8A, and a first non-overlapping region 4Ab that does not overlap with the suspension-side joining surface 8A. ,including. The entire suspension-side joint surface 8 </ b> A overlaps the surface of the suspension 8. In the cross section perpendicular to the extending direction (longitudinal direction) of the arm 4 and the suspension 8, the width of the arm 4 is wider than the width of the suspension 8. In other words, the width of the arm 4 in the short direction is wider than the width of the suspension 8 in the short direction. The first joint 12 is in contact with both the arm 4 and the suspension 8 in the first overlapping region 4Aa. A part of the first joint 12 extends to at least a part of the first non-overlapping region 4Ab. In other words, a part of the first joint portion 12 covers at least a part of the first non-overlapping region 4Ab. In other words, the first joint 12 (fillet) protruding from between the arm 4 and the suspension 8 extends to at least a part of the first non-overlapping region 4Ab. A part of the first joint portion 12 may extend over the entire first non-overlapping region 4Ab.

  A portion of the first joint 12 covers a portion of the side surface 8B of the suspension 8 that is substantially perpendicular to the first non-overlapping region 4Ab. In other words, a portion of the first joint 12 extends to a portion of the side surface 8B of the suspension 8 that is substantially perpendicular to the first non-overlapping region 4Ab. In other words, a part of the first joint portion 12 covers a part of the side surface 8B of the suspension 8 sharing one side with the suspension side joint surface 8A. In other words, the first joint portion 12 (fillet) protruding from between the arm 4 and the suspension 8 extends to a part of the side surface 8B of the suspension 8 adjacent to the suspension-side joint surface 8A.

  The first joint 12 (fillet) protruding from between the arm 4 and the suspension 8 is located inside the outer edge of the first non-overlapping region 4Ab, and the first joint 12 (fillet) is arm-side joined. It is formed along a groove between the surface 4A and the side surface 8B of the suspension 8 substantially perpendicular to the joint surface. In other words, the fillet is formed along the outer edge of the suspension 8 or the outer edge of the suspension-side joint surface 8A.

  HSA2 which concerns on 1st embodiment may be manufactured by the manufacturing method provided with the following 1st process and the 2nd process following a 1st process. Below, the manufacturing method in case the 1st junction part 12 contains Sn is demonstrated.

  In the first step, one or both of the arm-side joining surface 4A and the suspension-side joining surface 8A are covered with an Sn-based alloy or Sn alone. In other words, in the first step, a film containing Sn is formed on at least one of the arm-side bonding surface 4A and the suspension-side bonding surface 8A. In the first step, the entire surface of one or both of the arm 4 and the suspension 8 may be covered with an Sn-based alloy or Sn alone. That is, in the first step, the entire surface of the arm 4 may be covered with a film containing Sn, and the entire surface of the suspension 8 may be covered with a film containing Sn. Hereinafter, the film formed on the surface of the arm 4 in the first step is referred to as “arm film”. A film formed on the surface of the suspension 8 in the first step is referred to as a “suspension film”. The composition of the first joint 12 can be controlled by adjusting the composition of the arm film or the suspension film, for example. At least one of the arm film and the suspension film may contain Sn. When there is an arm film containing Sn, there is no need for a suspension film. When there is a suspension film containing Sn, the arm film may be omitted. In the first step, an arm film may be formed on the protective layer constituting the surface of the arm 4.

  The method of forming the arm film and the suspension film may be, for example, plating, sputtering, or chemical vapor deposition (CVD). The plating may be either electrolytic plating or electroless plating. According to these forming methods, the composition and thickness of each of the arm film and the suspension film can be freely adjusted. By performing a masking step before the first step, only a part (for example, the arm side joint surface 4A) of the surface of the arm 4 may be exposed and the other part may be covered with a mask. In the first step after the masking step, the arm film may be formed only on the exposed portion (for example, the arm side joint surface 4A) of the surface of the arm 4. By performing a masking step before the first step, only a part (for example, the suspension side joint surface 8A) of the surface of the suspension 8 may be exposed and the other part may be covered with a mask. In the first step after the masking step, the suspension film may be formed only on the exposed portion of the surface of the suspension 8 (for example, the suspension side bonding surface 8A). The masking step may be covering the arm 4 or the suspension 8 with a resin film. That is, the mask may be a resin film. The resin film used for the masking process is different from the resin adhesive contained in the first joint 12. In the first step, the base of the arm 4 may be exposed on a surface (side surface 4B) adjacent to the arm-side joining surface 4A. In this case, in the second step, the molten metal is difficult to spread on the side surface 4B, and the formation or growth of the fillet in the vicinity of the side surface 4B of the arm 4 is easily suppressed. In the first step, the back surface of the arm side bonding surface 4A may be covered with the arm film, and the back surface of the arm side bonding surface 4A may not be covered with the arm film.

  In the second step, the first overlapping region 4Aa of the arm-side bonding surface 4A and the suspension-side bonding surface 8A are overlapped and heated. That is, the suspension side bonding surface 8A is brought into contact with the first overlapping region 4Aa of the arm side bonding surface 4A, and at least one or both of the arm film and the suspension film are melted by heating. As a result, the first joint portion 12 is formed from one or both of the arm membrane and the suspension membrane. The arm-side joining surface 4A and the suspension-side joining surface 8A are joined by the first joining portion 12. The arm-side bonding surface 4A may be rephrased as a bonded surface on the arm 4 side. The suspension-side bonding surface 8A may be rephrased as a bonded surface on the suspension 8 side. When performing a masking process before a 1st process, you may perform the process of peeling a mask from the arm 4 or the suspension 8 after a 2nd process.

  In the second step, molten metal is generated by melting the arm film or the suspension film. The molten metal wets and spreads over at least a part of the first non-overlapping region 4Ab. In particular, the molten metal tends to wet and spread to the portion where the arm film or suspension film is formed. A part (small fillet) of the first joint portion 12 is formed on the first non-overlapping region 4Ab by solidifying the molten metal that has spread wet. Since the first non-overlapping region 4Ab is interposed between the first overlapping region 4Aa and the side surface 4B of the arm, the molten metal hardly reaches the side surface 4B of the arm 4 from the first overlapping region 4Aa. It is difficult to collect in the vicinity of the side surface 4B, and it is difficult to flow down the side surface 4B of the arm. Accordingly, fillet formation or growth is suppressed on the side surface 4B of the arm. In the second step, the molten metal wets and spreads not only to the first non-overlapping region 4Ab but also to a part of the side surface 8B of the suspension 8 substantially perpendicular to the first non-overlapping region 4Ab. Fillet formation or growth is likely to be suppressed. In other words, the molten metal tends to accumulate along a groove between the arm-side joining surface 4A and the side surface 8B of the suspension 8 that is substantially perpendicular to the joining surface, and the arm side surface 4B that is away from the side surface 8B of the suspension 8. It is difficult to collect in the vicinity. As a result, the formation or growth of the fillet in the vicinity of the side surface 4B of the arm is easily suppressed.

  Based on the principle as described above, the HSA 2 in which the formation or growth of the fillet in the vicinity of the side surface 4B of the arm is suppressed can be obtained. That is, HSA2 with high size and shape accuracy is obtained.

  If there is no first non-overlapping region 4Ab, the fillet is likely to be formed near the side surface 4B of the arm, and the accuracy of the size and shape of the HSA 2 is likely to be impaired. The reason will be described with reference to FIGS. 16a and 16b.

  FIG. 16a shows the arm 4 and the suspension 8 after the first step (before joining). FIG. 16b shows the first joint 12 and the fillet 40 formed by the second process using the arm 4 and the suspension 8 in FIG. 16a. The cross section of the arm 4 in FIGS. 16 a and 16 b is perpendicular to the longitudinal direction of the arm 4. The cross section of the suspension 8 in FIGS. 16 a and 16 b is perpendicular to the longitudinal direction of the suspension 8. As shown in FIG. 16a, the arm side joint surface 4A and the suspension side joint surface 8A completely overlap each other in the lateral direction of the arm 4 and the suspension 8, respectively. That is, neither the arm-side joining surface 4A nor the suspension-side joining surface 8A has the first non-overlapping region. In the second step, molten metal is generated by heating the arm film 34 or the suspension film 38. When the arm 4 and the suspension 8 are brought into contact with each other, since there is no first non-overlapping region, the molten metal flows from between the arm 4 and the suspension 8 to the side surfaces of the arm 4 and the suspension 8 to be solidified. As a result, a large fillet 40 protruding in the short direction of each of the arm 4 and the suspension 8 is formed.

  The fillet 40 impairs the accuracy of the size and shape of the HSA 2 (magnetic head device), similar to so-called burrs. For example, in manufacturing the HSA 2, positioning holes may be formed in the arm 4 and the suspension 8 in order to align the arm 4 and the suspension 8. When fillets are formed in these positioning holes, the accuracy of the positioning hole dimensions is impaired, and it is difficult to accurately determine the positions of the arm 4 and the suspension 8. Further, the fillet may fall off the HSA 2 and damage the surface of the magnetic disk 16.

  On the other hand, according to the first embodiment, as described above, the first non-overlapping area 4Ab functions as a margin (margin) where the molten metal spreads in the second step, so that the molten metal accumulates in the vicinity of the side surface 4B of the arm. It is difficult to suppress the formation or growth of fillets in the vicinity of the side surface 4B of the arm.

  The heating method in the second step may be, for example, an atmosphere heating method such as reflow. In the second step, the arm side joining surface 4A and the suspension side joining surface 8A may be heated at 150 to 450 ° C., for example. By heating in this temperature range, the first joint portion 12 is easily formed, and the joint strength between the arm 4 and the suspension 8 is easily improved. The first joint 12 may be formed by joining the arm-side joining surface 4A and the suspension-side joining surface 8A by laser heating. However, as the distance between the suspensions 8 becomes narrower, it becomes more difficult to accurately irradiate each joint surface with laser. On the other hand, when the atmosphere heating method is used, regardless of the distance between the suspensions 8, heat is easily transmitted uniformly to each joint surface, so that unevenness or variation in joint strength among the plurality of first joint portions 12 is easily suppressed. .

  The Sn content in the first joint portion 12 may be, for example, 40% by mass or more and less than 100% by mass. When the Sn content is 40% by mass or more, the bonding strength is easily improved. The Sn content in the first joint 12 is freely controlled, for example, by adjusting the Sn content in the arm film or suspension film formed in the first step.

  The thickness of the 1st junction part 12 may be 2-50 micrometers, for example, and may be 5-30 micrometers. The thickness of the first joint portion 12 may be rephrased as the distance between the arm 4 and the suspension 8 joined via the first joint portion 12. The thickness of the first joint 12 is freely controlled, for example, by adjusting the thickness of the arm film or suspension film formed in the first process. By controlling the thickness of the first bonding portion 12 to 2 μm or more, the bonding strength is easily improved. By controlling the thickness of the first bonding portion 12 to 50 μm or less, the components constituting the arm film or suspension film in the second step are melted and flowed out (that is, bleeding) and fillet formation or growth is necessary and sufficient. Easy to control.

  The thickness of the suspension 8 may be, for example, 0.05 to 0.3 mm. The thickness of the arm 4 may be 0.3 to 1.0 mm, for example.

  The Sn-based alloy used in the first step may be, for example, a solder or a braze material. The Sn-based alloy may contain at least one selected from the group consisting of Ag, Cu, Bi, In, Ni, Zn, P, and Au in addition to Sn. By using an Sn-based alloy containing these elements, the first joint 12 is easily formed in the second step, and the joint strength is easily improved. When one of the arm film and the suspension film contains Sn, the other film may not contain Sn. For example, when one of the arm film and the suspension film contains Sn, the other film is a film made of at least one selected from the group consisting of Ag, Cu, Bi, In, Ni, Zn, P, and Au. It may be. That is, the other film may be a film made of an element other than Sn. The arm film may be composed of two overlapping films, one of which may contain Sn and the other film may not contain Sn. Similarly, the suspension membrane may be composed of two overlapping membranes.

  In the first step, one of the arm-side joining surface 4A and the suspension-side joining surface 8A may be covered with Sn alone or an Sn-based alloy, and the other joining surface is a metal having a higher melting point than Sn alone. Alternatively, it may be covered with a metal having a melting point higher than that of the Sn-based alloy. When such a 1st process is implemented, the excessive fusion | melting and bleeding of each joint surface in a 2nd process, and formation or growth of a fillet are easy to be suppressed. As a result, the first joint portion 12 tends to be thick. The metal whose melting point is higher than that of Sn alone or an Sn-based alloy is, for example, Ni alone or Ni containing P. Therefore, in the first step, one bonding surface may be covered with a film made of Sn alone or an Sn-based alloy, and the other bonding surface may be covered with a film made of Ni alone or a film made of Ni containing P. The film made of Ni containing P can be formed from, for example, an electroless nickel plating solution containing a phosphorus compound. The phosphorus compound may be, for example, a hypophosphite such as sodium hypophosphite.

  When the 1st junction part 12 contains a resin adhesive, or when the 1st junction part 12 consists of resin adhesives, what is necessary is just to manufacture HSA2 with the following manufacturing methods, for example.

  In the first step, one or both of the arm-side joint surface 4A and the suspension-side joint surface 8A are covered with an uncured resin adhesive. In other words, in the first step, a film containing an uncured resin adhesive is formed on at least one of the arm-side bonding surface 4A and the suspension-side bonding surface 8A.

  In the second step, the suspension-side joining surface 8A is brought into contact with the first overlapping region 4Aa of the arm-side joining surface 4A, and the resin adhesive between the arm 4 and the suspension 8 is cured. For example, when the resin adhesive is a thermosetting type, the first overlapping region 4Aa of the arm-side bonding surface 4A and the suspension-side bonding surface 8A are overlapped and heated. As a result, the resin adhesive is cured and the first joint portion 12 is formed.

  Even when the first joint 12 is formed using a resin adhesive, in the second step, the uncured resin adhesive flows in the same manner as the molten metal. However, according to the first embodiment, the first non-overlapping region 4Ab functions as a margin (margin) where the resin adhesive spreads out in the second step, so that the resin adhesive accumulates in the vicinity of the side surface 4B of the arm. It is difficult to suppress the formation or growth of the fillet on the side surface 4B of the arm. That is, when the first joint 12 is formed from a resin-based adhesive, the fillet is formed in the vicinity of the side surface 4B of the arm by the same mechanism as when the first joint 12 is formed from Sn alone or an Sn-based alloy. Growth is suppressed. In a 1st process, you may expose the base material of the arm 4 in the surface (side surface 4B) adjacent to 4A of arm side joining surfaces. In this case, in the second step, the uncured resin adhesive hardly spreads on the side surface 4B, and the formation or growth of the fillet in the vicinity of the side surface 4B of the arm 4 is easily suppressed. In the first step, the back surface of the arm side bonding surface 4A may be covered with an uncured resin adhesive, and the back surface of the arm side bonding surface 4A may not be covered with an uncured resin adhesive.

  As described above, in the first embodiment, the first joint 12 connects the arm 4 and the suspension 8 chemically or physically regardless of whether the first joint 12 includes Sn or a resin adhesive. To join. Therefore, according to the first embodiment, the joint strength between the arm 4 and the suspension 8 is improved as compared with the case where a conventional mechanical joining method such as fitting joining is used. In the first embodiment, a part of the first joint 12 protrudes from between the arm 4 and the suspension 8 and is in contact with the first non-overlapping area 4 Ab of the arm 4 and the side surface 8B of the suspension 8. Accordingly, the contact area between the first joint 12, the arm 4, and the suspension 8 is larger than when the first joint 12 does not protrude from between the arm 4 and the suspension 8. Furthermore, in the first embodiment, since the first joint portion 12 can be formed by surface contact, it is not necessary to thicken the arm 4 and the suspension 8 in order to form the fitting hole. In other words, in the first embodiment, even when the arm 4 and the suspension 8 are thin enough to prevent joint bonding, the bonding strength is not easily lost. For these reasons, according to the HSA 2 according to the first embodiment, it is possible to increase the number of the magnetic disks 16 by reducing the thickness of the arm 4 and the suspension 8 while ensuring the bonding strength. As a result, it is possible to realize the magnetic disk device 18 having higher reliability and larger capacity than the conventional one.

  The magnetic head device (HSA2) according to the first embodiment of the present invention has been described above, but the present invention is not limited to the first embodiment. Also in other embodiments described below, a magnetic head device having excellent arm and suspension bonding strength and high size and shape accuracy is provided by the same mechanism as in the first embodiment. Below, only the difference between 1st embodiment and other embodiment is demonstrated, and the description about the matter which is common in 1st embodiment and other embodiment is abbreviate | omitted.

(Second embodiment)
As shown in FIG. 6, in the HSA according to the second embodiment, the suspension 8 includes a spacer 50, a load beam 54, and a flexure 56. That is, the suspension 8 includes the spacer 50, the load beam 54, and the flexure 56. The spacer 50 overlaps the tip of the arm 4, and the first joint 12 is located between the tip of the arm 4 and the spacer 50. That is, the first joint portion 12 joins the arm 4 and the spacer 50. One end of the load beam 54 overlaps the spacer 50. The second joint portion 52 is located between the spacer 50 and the load beam 54 and joins the spacer 50 and the load beam 54. A flexure 56 is installed at the other tip of the load beam 54, and the slider 10 is positioned on the surface of the flexure 56.

  The spacer 50 in the second embodiment is a part of the suspension 8. That is, the spacer 50 corresponds to the suspension 8 in the first embodiment in that the first joint 12 is joined to the arm 4. In the second embodiment, as in the case of the first embodiment, the first non-overlapping region 4Ab of the arm 4 functions as a margin (margin) where the molten metal or the resin-based adhesive spreads out in the second step. Therefore, it is difficult for molten metal or resin adhesive to accumulate in the vicinity of the side surface 4B of the arm, and the formation or growth of fillets in the vicinity of the side surface 4B of the arm is suppressed.

  The 2nd junction part 52 contains Sn or a resin adhesive. The specific composition of the second joint portion 52 may be the same as that of the first joint portion 12 described above. Below, the 2nd junction part 52 is demonstrated in detail based on FIG. 7b. FIG. 7B is a cross section of the arm 4, the first joint portion 12, the spacer 50, the second joint portion 52, and the load beam 54, and is a cross section taken along the line bb of FIG. 7A.

  As shown in FIG. 7 b, the spacer-side bonding surface 50 </ b> A is defined as a surface of the spacer 50 that faces the load beam 54. The load beam side bonding surface 54 </ b> A is defined as a surface of the load beam 54 that faces the spacer 50. Of the spacer side bonding surface 50A and the load beam side bonding surface 54A, the load beam side bonding surface 54A includes a second overlapping region 54Aa that overlaps the spacer side bonding surface 50A and a second non-overlapping region that does not overlap the spacer side bonding surface 50A. 54 Ab. In other words, the width of the load beam 54 in the short direction is wider than the width of the spacer 50. The second joint portion 52 is in contact with both the spacer 50 and the load beam 54 in the second overlapping region 54Aa of the load beam 54. A portion (small fillet) of the second joint portion 52 extends to at least a portion of the second non-overlapping area 54Ab of the load beam 54. A part of the second joint portion 52 also extends to a part of the side surface 50B of the spacer 50 adjacent to the spacer-side joint surface 50A. Since the spacer 50 is a part of the suspension 8, the side surface 50 </ b> B of the spacer 50 is paraphrased as the side surface 8 </ b> B of the suspension 8.

  When the second bonding portion 52 is an alloy containing Sn, HSA may be manufactured by the following manufacturing method. First, as in the first step, one or both of the spacer-side bonding surface 50A and the load beam-side bonding surface 54A are covered with Sn alone or an Sn-based alloy. Subsequently, as in the second step, the second overlapping portion 54A is formed by overlapping the second overlapping region 54Aa of the load beam side bonding surface 54A and the spacer side bonding surface 50A, and heating them. . In other words, the suspension 8 (the load beam 54 to which the spacer 50 is bonded) is formed. Subsequently, the spacer 50 that is a part of the suspension 8 is joined to the arm 4 via the first joint 12 by performing the first step and the second step.

  When the 2nd junction part 52 contains a resin adhesive, or when the 2nd junction part 52 consists of a resin adhesive, what is necessary is just to manufacture HSA with the following manufacturing methods, for example. First, as in the first step, one or both of the spacer-side bonding surface 50A and the load beam-side bonding surface 54A are covered with an uncured resin adhesive. Subsequently, as in the second step, the spacer-side bonding surface 50A is brought into contact with the second overlapping area 54Aa of the load beam-side bonding surface 54A, and the resin adhesive between the spacer 50 and the load beam 54 is removed. Harden. For example, when the resin-based adhesive is a thermosetting type, the second overlapping region 54Aa of the load beam side bonding surface 54A and the spacer side bonding surface 50A are overlapped and heated. As a result, the resin-based adhesive is cured and the second joint portion 52 is formed.

  In the second embodiment, when the second joint portion 52 is formed, the second non-overlapping area 54Ab of the load beam 54 functions as a margin (margin) where the molten metal or uncured resin adhesive spreads out. As a result, molten metal or uncured resin-based adhesive is unlikely to accumulate in the vicinity of the side surface 54B of the load beam 54, and fillet formation or growth on the side surface 54B of the load beam 54 is suppressed.

  In the second embodiment, the second joint 52 joins the spacer 50 and the load beam 54 chemically or physically. Accordingly, the bonding strength of the spacer 50 and the load beam 54 is improved as compared with the case where a conventional mechanical bonding method such as fitting bonding is used. In the second embodiment, a part of the second joint portion 52 protrudes from between the spacer 50 and the load beam 54, and is in contact with the second non-overlapping area 54 </ b> Ab of the load beam 54 and the side surface 50 </ b> B of the spacer 50. Therefore, the contact area between the second joint 52, the spacer 50, and the load beam 54 is larger than when the second joint 52 does not protrude from between the spacer 50 and the load beam 54. Furthermore, since the 2nd junction part 52 can be formed by surface contact, it is not necessary to thicken the spacer 50 and the load beam 54 in order to form a fitting hole. That is, even when the spacer 50 and the load beam 54 are so thin that joint bonding cannot be performed, the bonding strength between the spacer 50 and the load beam 54 is not easily lost.

  In another aspect of the second embodiment, of the spacer side joint surface and the load beam side joint surface, the spacer side joint surface overlaps the load beam side joint surface, and the load beam side joint surface overlaps with the second overlap region. And a second non-overlapping area that may not be included. That is, the width of the spacer may be larger than the width in the short direction of the load beam. In this case, a part (small fillet) of the second joint portion 52 protruding from between the spacer and the load beam may extend to at least a part of the second non-overlapping region of the spacer. Further, a part of the second joint portion may also extend to a part of the side surface of the load beam adjacent to the load beam side joint surface.

(Third embodiment)
As shown in FIGS. 8 and 9, in the HSA according to the third embodiment, a circular hole penetrates the suspension 8 in the direction in which the arm 4 and the suspension 8 overlap. This hole is referred to as a suspension through hole 8C. Further, a circular hole passes through the arm 4 in the same direction. This hole is referred to as an arm through hole 4C. The central axis of the suspension through hole 8C coincides with the central axis of the arm through hole 4C. The inner diameter of the suspension through hole 8C is larger than the inner diameter of the arm through hole 4C. As shown in FIG. 8, the arm through hole 4C and the surface of the arm 4 surrounding the arm through hole 4C (first non-overlapping region) are exposed inside the suspension through hole 8C. A part of the first joint portion 12 is formed along the inner periphery of the suspension through-hole 8 </ b> C and the outer edge of the suspension 8.

  FIG. 9 is a cross section of the arm 4, the suspension 8, and the first joint portion 12 according to the third embodiment, and is a cross section taken along line IX-IX in FIG. In the pair of cross sections shown in FIG. 9, the pair of inner walls of the arm through hole 4 </ b> C is located inside the pair of side surfaces 4 </ b> B of the arm 4. In addition, the pair of inner walls of the suspension through-hole 8C is positioned inside the pair of side surfaces 8B of the suspension 8. Except for these points, each of the pair of cross sections shown in FIG. 9 is substantially the same as the cross section of FIG. That is, each of the pair of cross sections shown in FIG. 9 is substantially the same as the cross sections of the arm 4, the suspension 8, and the first joint portion 12 in the first embodiment. Therefore, in the third embodiment, as in the case of the first embodiment, the first non-overlapping region 4Ab of the arm 4 functions as a margin (margin) where the molten metal or the resin-based adhesive spreads in the second step. . Therefore, it is difficult for molten metal or resin adhesive to accumulate in the vicinity of the side surface 4B of the arm, and formation or growth of fillets in the vicinity of the side surface 4B of the arm is suppressed.

  In the third embodiment, in the second step, the arm-side joining surface 4A and the suspension-side joining surface 8A are overlapped so that the central axis of the suspension through-hole 8C coincides with the central axis of the arm through-hole 4C. That is, the positions of the arms 4 and the suspension 8 are accurately determined by matching the positions of the positioning holes. If a fillet is formed in each through hole, the accuracy of the dimension of each through hole is impaired, and accurate positioning of the arm 4 and the suspension 8 becomes difficult. However, in the third embodiment, as in the case of the first embodiment, the first non-overlapping area 4Ab of the arm 4 functions as a margin (margin) where the molten metal or the resin-based adhesive spreads in the second step. . Therefore, it is difficult for molten metal or resin adhesive to accumulate in the vicinity of the inner wall of the arm through hole 4C, and the formation or growth of fillets in the inner wall of the arm through hole 4C is suppressed. Therefore, the position of the arm 4 can be accurately determined by positioning the arm through hole 4C.

(Fourth embodiment)
As shown in FIG. 10, in the HSA according to the fourth embodiment, the inner diameter of the suspension through hole 8C is smaller than the inner diameter of the arm through hole 4C. In the fourth embodiment, a part of the first joint 12 is formed along the inner circumference of the arm through hole 4 </ b> C and the outer edge of the suspension 8.

  FIG. 11 is a cross section of the arm 4, the suspension 8, and the first joint portion 12 according to the fourth embodiment, and is a cross section taken along the line XI-XI of FIG. As shown in FIG. 11, in the fourth embodiment, each of the arm-side joining surface 4A and the suspension-side joining surface 8A has a first overlapping region and a first non-overlapping region.

  That is, the arm side joining surface 4A includes a first overlapping region 4Aa that overlaps with the suspension side joining surface 8A and a first non-overlapping region 4Ab that does not overlap with the suspension side joining surface 8A. The suspension side joining surface 8A includes a first overlapping region 8Aa that overlaps with the arm side joining surface 4A and a first non-overlapping region 8Ab that does not overlap with the arm side joining surface 4A. The first joint portion 12 is in contact with both the arm 4 and the suspension 8 in the first overlapping region 4Aa of the arm 4. In other words, the first joint portion 12 is in contact with both the arm 4 and the suspension 8 in the first overlapping region 8Aa of the suspension 8.

  One end of the first joint portion 12 extends to at least a part of the first non-overlapping region 4Ab of the arm 4. One end of the first joint portion 12 extends to a part of the side surface 8B of the suspension 8 adjacent to the suspension side joint surface 8A. In the fourth embodiment, the first non-overlapping region 4Ab of the arm 4 functions as a margin (margin) where the molten metal or the resin adhesive spreads in the second step. Therefore, the molten metal or the resin adhesive hardly accumulates in the vicinity of the side surface 4B of the arm 4, and the formation or growth of the fillet in the vicinity of the side surface 4B of the arm 4 is suppressed.

  The other end of the first joint 12 extends to at least a part of the first non-overlapping region 8Ab of the suspension 8. The other end of the first joint 12 extends to a part of the inner wall of the arm through hole 4C adjacent to the arm-side joint surface 4A. In the fourth embodiment, the first non-overlapping region 8Ab of the suspension 8 functions as a margin (margin) where the molten metal or the resin-based adhesive spreads in the second step. Therefore, the molten metal or the resin-based adhesive hardly accumulates in the vicinity of the inner wall of the suspension through hole 8C, and the formation or growth of the fillet in the inner wall of the suspension through hole 8C is suppressed. Therefore, the position of the suspension 8 can be accurately determined by the alignment of the suspension through-hole 8C.

(Fifth embodiment)
As shown in FIGS. 12 and 13, in the HSA according to the fifth embodiment, as in the second embodiment, the spacer 50 overlaps the distal end portion of the arm 4, and the first joint portion 12 includes the arm 4 and the spacer 50. (Part of the suspension 8) is joined. One end of the load beam 54 overlaps the spacer 50, and the second joint 52 joins the spacer 50 and the load beam 54.

  In the fifth embodiment, a circular through hole is formed in each of the arm 4, the spacer 50, and the load beam 54 in the direction in which the arm 4, the spacer 50, and the load beam 54 overlap. The through hole formed in the spacer 50 is referred to as a spacer through hole 50C. The through hole formed in the load beam 54 is referred to as a load beam through hole 54C. The central axes of the arm through hole 4C, the spacer through hole 50C, and the load beam through hole 54C coincide with each other. The inner diameter of the load beam through hole 54C is substantially equal to the inner diameter of the arm through hole 4C. The inner diameter of the spacer through hole 50C is larger than the inner diameter of the arm through hole 4C. A part of the first joint portion 12 protrudes from between the arm 4 and the spacer 50, and is formed along the inner periphery of the spacer through hole 50 </ b> C and the outer edge of the spacer 50. A part of the second joint 52 protrudes from between the spacer 50 and the load beam 54 and is formed along the inner periphery of the spacer through hole 50 </ b> C and the outer edge of the spacer 50.

  13 is a cross section of the arm 4, the first joint portion 12, the spacer 50, the second joint portion 52, and the load beam 54 according to the fifth embodiment, and is a cross section taken along line XIII-XIII in FIG. In the pair of cross sections shown in FIG. 13, the pair of inner walls of the arm through hole 4 </ b> C is located inside the pair of side surfaces 4 </ b> B of the arm 4. The pair of inner walls of the spacer through-hole 50C is located inside the pair of side surfaces 8B of the spacer 50. A pair of inner walls of the load beam through hole 54C is located inside the pair of side surfaces 54B of the load beam 54. Except for these points, each of the pair of cross sections shown in FIG. 13 is substantially the same as the cross section of FIG. That is, each of the pair of cross sections shown in FIG. 13 is substantially the same as the cross section of the arm 4, the first joint 12, the spacer 50, the second joint 52, and the load beam 54 in the second embodiment.

  In the fifth embodiment, similarly to the second embodiment, when the second joint portion 52 is formed, the second non-overlapping region 54Ab of the load beam 54 has a margin (wet of molten metal or uncured resin adhesive). Functions as a margin). As a result, molten metal or uncured resin-based adhesive is unlikely to accumulate in the vicinity of the side surface 54B of the load beam 54 and the load beam through hole 54C. Therefore, the formation or growth of fillets in the side surface 54B of the load beam 54 and the load beam through hole 54C is suppressed. Therefore, in the fifth embodiment, the position of the load beam 54 can be accurately determined by positioning the load beam through hole 54C.

(Sixth embodiment)
As shown in FIGS. 14 a and 14 b, in the sixth embodiment, the width of the suspension 8 in the short direction is wider than the width of the arm 4 in the short direction. In the sixth embodiment, among the arm-side joining surface 4A and the suspension-side joining surface 8A, the suspension-side joining surface 8A is not overlapped with the first overlapping region 8Aa that overlaps the arm-side joining surface 4A and the arm-side joining surface 4A. One non-overlapping area 8Ab. The first joint 12 is in contact with both the arm 4 and the suspension 8 in the first overlap region 8Aa, and a part of the first joint 12 extends to at least a part of the first non-overlap region 8Ab of the suspension 8. Exist. A part of the first joint portion 12 also extends to a part of the side surface 4B of the arm 4 adjacent to the arm side joint surface 4A.

  In the sixth embodiment, when the second joint portion 52 is formed, the second non-overlapping region 8Ab of the suspension 8 functions as a margin (margin) where the molten metal or the uncured resin-based adhesive spreads. Further, the molten metal or the uncured resin-based adhesive spreads wet not only on the first non-overlapping area 8Ab of the suspension 8 but also on a part of the side surface 4B of the arm 4 adjacent to the arm-side joining surface 4A. For these reasons, the molten metal or the uncured resin adhesive hardly accumulates in the vicinity of the side surface 8B of the suspension 8, and the formation or growth of fillets on the side surface 8B of the suspension 8 is suppressed. In the first step of the sixth embodiment, the substrate of the suspension 8 may be exposed on the surface (side surface 8B) adjacent to the suspension side bonding surface 8A. In many cases, the molten metal or the uncured resin adhesive spreads on the side surface 8B in the second step by exposing the base material of the suspension 8 having poor wettability to metal or uncured resin adhesive to the side surface 8B. It is difficult to suppress the formation or growth of fillets in the vicinity of the side surface 8B of the suspension 8. In the first step of the sixth embodiment, the back surface of the suspension side bonding surface 8A may be covered with a suspension film or an uncured resin adhesive. The back surface of the suspension side bonding surface 8A may not be covered with the suspension film or the uncured resin adhesive.

(Seventh embodiment)
FIG. 15 is a cross-sectional view of the vicinity of the tip of the arm 4 in a direction perpendicular to the longitudinal direction of the arm 4. As shown in FIG. 15, in the seventh embodiment, a part of the arm-side joining surface forms a recess. The entire spacer 50 (or suspension 8) is located inside the recess. Of the arm-side joint surface, the bottom of the recess and a part of the inner wall are the first overlapping region 4Aa. Of the surface of the spacer 50 (or the suspension 8), the portions facing the bottom of the recess and a part of the inner wall are all spacer-side joining surfaces 50A (or suspension-side joining surfaces 8A). The arm-side joint surface 4A surrounding the remaining portion of the inner wall of the recess and the recess is the first non-overlapping region 4Ab. The first joint portion 12 fills a space between the bottom of the recess and a part of the inner wall and the spacer 50 (or the suspension 8). A part of the first joint 12 extends to the first non-overlapping region 4Ab of the arm 4. Further, a part of the first joint portion 12 extends to a part of the upper surface of the spacer 50 (or the suspension 8) facing the side opposite to the bottom of the recess.

  In the seventh embodiment, when the second joint portion 52 is formed, the second non-overlapping region 4Ab of the arm 4 functions as a margin (margin) where the molten metal or the uncured resin adhesive spreads out. Further, the molten metal or the uncured resin adhesive spreads not only on the second non-overlapping area 4Ab of the arm 4 but also on a part of the upper surface of the spacer 50 (or the suspension 8). For these reasons, the molten metal or the uncured resin adhesive hardly accumulates in the vicinity of the side surface 4B of the arm 4 and the formation or growth of the fillet on the side surface 4B of the arm 4 is suppressed.

(Other embodiments)
The magnetic head device is located between one arm 4, a suspension 8 that overlaps the tip of the arm 4, a slider 10 that is located at the tip of the suspension 8, and the tip of the arm 4 and the suspension 8. A head arm assembly (HAA) including a first joint 12 that joins the arm 4 and the suspension 8, and the first joint 12 includes Sn.

  The spacer 50 and the load beam 54 may be directly welded, for example, by spot welding. In this case, the second joint portion 52 may not be formed between the spacer 50 and the load beam 54.

  The magnetic head device according to one aspect of the present invention is applied to, for example, an HSA mounted on a hard disk drive (HDD).

  2 ... HSA (magnetic head device), 4 ... arm, 4A ... arm side joining surface, 4Aa ... first overlap region of arm, 4Ab ... first non-overlap region of arm, 6 ... carriage, 8 ... suspension, 8A ... suspension Side joining surface, 8Aa ... first overlapping area of suspension, 8Ab ... first non-overlapping area of suspension, 10 ... slider, 11 ... HGA, 12 ... first joining part, 14 ... coil part, 16 ... magnetic disk, 18 ... Magnetic disk drive, 20 ... spindle motor, 22 ... permanent magnet, 34 ... arm film, 38 ... suspension film, 40 ... fillet, 50 ... spacer, 50A ... spacer side joining surface, 52 ... second joining part, 54 ... load beam 54A ... Load beam side joint surface, 54Aa ... Second overlap region of load beam, 54Ab ... Second non-overlap region of load beam, 5 ... flexure.

Claims (6)

Arm,
A suspension overlapping the tip of the arm;
A slider located at the tip of the suspension;
A first joint that is located between the tip of the arm and the suspension, and joins the arm and the suspension;
With
The first joint includes Sn or a resin adhesive,
The arm side joint surface is defined as a surface of the arm surface facing the suspension,
When the suspension side joint surface is defined as a surface of the suspension surface facing the arm,
Of the arm-side joint surface and the suspension-side joint surface, at least one joint surface includes a first overlap region that overlaps the other joint surface and a first non-overlap region that does not overlap the other joint surface. ,
The first joint is in contact with both the arm and the suspension in the first overlap region,
A portion of the first joint extends to at least a portion of the first non-overlapping region;
Magnetic head device. The first joint includes an alloy containing Sn;
The alloy contains at least one selected from the group consisting of Ag, Cu, Bi, In, Ni, Zn, P and Au;
The magnetic head device according to claim 1. The suspension is
A spacer that overlaps the tip of the arm and is joined to the arm by the first joint;
A load beam in which one tip overlaps the spacer and the slider is located on the other tip;
A second joint that is located between the spacer and the load beam and joins the spacer and the load beam;
Including
The second joint includes Sn or a resin adhesive,
The spacer side bonding surface is defined as a surface of the spacer surface facing the load beam,
When the load beam side joint surface is defined as a surface of the load beam surface facing the spacer,
Of the spacer side bonding surface and the load beam side bonding surface, at least one bonding surface has a second overlapping region that overlaps the other bonding surface and a second non-overlapping region that does not overlap the other bonding surface. Including
The second joint is in contact with both the spacer and the load beam in the second overlap region;
A portion of the joint extends to at least a portion of the second non-overlapping region;
The magnetic head device according to claim 1. The second joint includes an alloy containing Sn;
The alloy contains at least one selected from the group consisting of Ag, Cu, Bi, In, Ni, Zn, P and Au;
The magnetic head device according to claim 3. The suspension is
A spacer that overlaps the tip of the arm and is joined to the arm by the first joint;
A load beam in which one tip overlaps the spacer and the slider is located on the other tip;
Including
The spacer and the load beam are directly welded,
The magnetic head device according to claim 1. Comprising a carriage having a plurality of said arms;
The magnetic head device according to claim 1.

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