CN207367928U - SMT wafer mounting apparatus - Google Patents
SMT wafer mounting apparatus Download PDFInfo
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- CN207367928U CN207367928U CN201721042770.8U CN201721042770U CN207367928U CN 207367928 U CN207367928 U CN 207367928U CN 201721042770 U CN201721042770 U CN 201721042770U CN 207367928 U CN207367928 U CN 207367928U
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Abstract
The utility model discloses a kind of SMT wafer mounting apparatus, substrate is pasted on for wafer to be fixed, including stencil printer, crystal grain labelling machine, reflow ovens, punching mechanism and conveying mechanism, stencil printer is by default paste solder printing area on paste solder printing to substrate, it includes the first steel mesh and the second steel mesh, first steel mesh is equipped with perforative one-step print hole corresponding with a paste solder printing area, second steel mesh is equipped with corresponding with a paste solder printing area and not perforative groove, bottom portion of groove offers corresponding with secondary printing tin cream area and perforative secondary printing hole, the area in secondary printing tin cream area is less than the area in a paste solder printing area；The punching mechanism carries out stamping process to the tin paste layer on substrate；Crystal grain labelling machine is by bonding wafer to substrate；The reflow ovens carry out substrate heating cooling and reflow soldering；Conveying mechanism realizes conveying of the substrate between each mechanism.The utility model can be used for the fixed stickup of thin wafer.
Description
Technical field
The utility model is related in SMT techniques, more particularly to SMT techniques device bonding wafer being fixed on substrate.
Background technology
Paste solder printing method that what existing tin cream fixed that wafer method (Solder Die Attach) uses use, tin cream from
After steel mesh is printed onto substrate, wafer/component affixing is subsequently done again, and tin cream welding is done by reflow ovens, wafer/element etc. is fixed
On substrate.
However, due to the scaling powder (rosin) contained in tin cream material, it is obstructed since wafer sticks rear scaling powder volatilization,
It can become bubble in follow-up reflow soldering and stay in bottom, form scolding tin cavity.For thicker bonding wafer, scolding tin
Cavity will not produce serious problems, but with the development of wafer process, wafer thickness is more and more thinner, the risk exposure in scolding tin cavity
Out.Especially because chip package process is complicated, it is necessary to make gold thread welding (connection after thin bonding wafer/fixed work order is completed
Connect wafer and substrate), the process such as injection (black glue parcel wafer), especially can produce pressure in cavity position, leads to thin wafer
Cause wafer to split, cause product rejection.
Furthermore before existing bonding wafer, tin cream is printed, the tin paste layer printed due to the tension force of liquid,
Its upper surface is often arc-shaped, at this time, by bonding wafer when on tin paste layer, often since the top of tin paste layer is uneven and
So that bonding wafer tilts so that the product wafer of support is more easily broken off.
Therefore it is badly in need of a kind of surface mount device for reducing the fixation wafer that cavity produces and can be used for thin wafer.
Utility model content
The purpose of this utility model is to provide a kind of SMT printed steel mesh of fixation wafer for reducing generation and wafer is fixed
Device, fixed available for thin wafer are pasted.
To achieve the above object, the utility model discloses a kind of SMT wafer mounting apparatus, pasted for wafer to be fixed
In on substrate, including stencil printer, crystal grain labelling machine, reflow ovens and conveying mechanism, the stencil printer are used for tin
Cream is printed to default paste solder printing area on substrate, it includes the first steel mesh and the second steel mesh, first steel mesh be equipped with
The corresponding perforative one-step print hole in paste solder printing area, second steel mesh are equipped with corresponding and not with a paste solder printing area
Perforative groove, the bottom portion of groove offers corresponding with secondary printing tin cream area and perforative secondary printing hole, described secondary
The area in print solder paste area is less than the area in a paste solder printing area, and the paste solder printing area includes a paste solder printing area
With secondary paste solder printing area；The punching mechanism carries out stamping process to the tin paste layer on substrate；The crystal grain labelling machine will
Wafer is affixed on the substrate by the tin cream in paste solder printing area；The reflow ovens carry out substrate heating cooling and reflux
Welding；The conveying mechanism realizes substrate between the stencil printer, crystal grain labelling machine, reflow ovens and punching mechanism
Conveying.
Compared with prior art, the utility model SMT wafer mounting apparatus includes the first steel mesh and the second steel mesh, and second
Steel mesh includes and not perforative groove corresponding with a paste solder printing area and corresponding arranged on bottom portion of groove and secondary printing tin cream area
And perforative secondary printing hole, it the first steel mesh can be used to carry out a paste solder printing on substrate to form a tin paste layer, make
Secondary paste solder printing is carried out to form secondary tin paste layer on a tin paste layer with the second steel mesh, i.e., prints tin cream at twice,
Easy to first carry out heating operation using reflow ovens after one-step print tin cream, then secondary paste solder printing is carried out, can effectively reduced secondary
Cavity produces during reflow soldering after paste solder printing, and fixed available for thin wafer is pasted.Furthermore after the utility model can be to printing
Tin paste layer carry out stamping process so that will not cause to tilt because uneven at the top of tin paste layer during bonding wafer, be conducive to make
Make thinner wafer.
It is preferred that the secondary printing hole is arranged at the bottom of the groove in point-like or wire.
More preferably, the secondary printing hole is arranged at the bottom portion of groove in cross spider shape or is arranged in point-like described recessed
The corner of trench bottom is arranged at the bottom portion of groove in parallel line shaped.The program make it that the tin cream amount of secondary paste solder printing is far small
In the tin cream amount of a paste solder printing, when pasting, the main tin cream material using a paste solder printing, which is fixed, welds wafer, and two
The tin cream material of secondary paste solder printing mainly plays preliminary connection function in bonding wafer, and a group weldering is played in reflow soldering and is made
With.Furthermore the program also causes the tin cream material of secondary tin paste layer after bonding wafer, not to be closed to adhesive surface and cause to help
Solder flux volatilization is obstructed, and in secondary reflow soldering, will not be obstructed, returned because of the scaling powder volatilization contained in tin cream material
Fluid welding can become bubble in connecing and stay in bottom.
It is preferred that the stencil printer using the first steel mesh in a paste solder printing area print solder paste of substrate to be formed
Tin paste layer；The reflow ovens carry out the substrate for printing once tin paste layer heating cooling so that in a tin paste layer
Scaling powder volatilization；The punching mechanism carries out stamping process so that the tin paste layer to a tin paste layer after cooling
Top is in horizontal plane；The stencil printer is printed using secondary tin cream of second steel mesh on a tin paste layer after stamping process
Area's print solder paste is brushed to form secondary tin paste layer；The crystal grain labelling machine is by bonding wafer to the base for being printed with secondary tin paste layer
On plate；The reflow ovens carry out reflow soldering to the substrate for being pasted with wafer.
Specifically, the stencil printer includes the first stencil printer and the second stencil printer, first tin cream
Printing machine includes the first steel mesh and by a paste solder printing area on paste solder printing to the substrate to form a tin paste layer, institute
Second steel mesh is included and by the secondary paste solder printing area on paste solder printing to the substrate to form two with the second stencil printer
Secondary tin paste layer；The reflow ovens include the first reflow ovens and the second reflow ovens, and first reflow ovens are to printing once tin cream
The substrate of layer carries out heating cooling, and second reflow ovens carry out reflow soldering, the conveyer to the substrate for being pasted with wafer
Structure realizes substrate in first stencil printer, the first reflow ovens, punching mechanism, the second stencil printer, the second reflow ovens
Conveying successively between crystal grain labelling machine.
It is preferred that the SMT wafer mounting apparatus further includes flux cleaning mechanism, the flux cleaning mechanism to from
The substrate of the reflow ovens output carries out flux cleaning, and substrate is delivered to scaling powder by the conveying mechanism from the reflow ovens
Wiper mechanism.
It is preferred that the SMT wafer mounting apparatus further includes plaster mechanism, the conveying mechanism adds crystal grain labelling machine
Substrate after work is delivered to the plaster mechanism, and element is pasted onto institute by the plaster mechanism by the tin cream in paste solder printing area
State on substrate.
More preferably, patch printing hole corresponding with patch print solder paste area, the tin cream are additionally provided with the steel mesh body
Printing machine is using the second steel mesh patch print solder paste area's print solder paste on the substrate to form patch tin paste layer, the patch
Piece mechanism pastes element on the substrate by patch tin paste layer, and the paste solder printing area includes the patch print solder paste
Area.
It is preferred that the punching mechanism includes die assembly and driving mechanism, the die assembly include upper die mold and
Lower die mould, it is described formed with some longitudinal flutings corresponding with a paste solder printing sector width on the upper die mold
The positioning groove of installation base plate is offered on lower die mould, the driving mechanism drives the upper die mold relative to the lower die
Mold actions, so that the tin paste layer on the slot bottom stamping substrate of the longitudinal fluting of the upper die mold.
Brief description of the drawings
Fig. 1 a to Fig. 1 g are the flow diagrams of the surface mount method of fixed wafer described in the utility model.
Fig. 2 a to Fig. 2 b are the schematic cross-sections that the utility model carries out a paste solder printing using the first steel mesh.
Fig. 3 a to Fig. 3 b are the horizontal plane schematic diagrames that the utility model carries out a paste solder printing using the first steel mesh.
Fig. 4 a to Fig. 4 b are the schematic cross-sections that the utility model carries out a paste solder printing using the second steel mesh.
Fig. 5 a to Fig. 5 c are the horizontal plane schematic diagrames that the utility model carries out a paste solder printing using the second steel mesh.
Fig. 6 is the structure diagram of SMT wafer mounting apparatus described in the utility model.
Fig. 7 is the structure diagram of SMT wafer mounting apparatus described in another embodiment of the utility model.
Fig. 8 is the structure diagram of punching mechanism described in the utility model.
Fig. 9 a are the top views of the upper die mold of punching mechanism described in the utility model.
Fig. 9 b are the bottom views of the lower die mould of punching mechanism described in the utility model.
Figure 10 is the structure diagram of SMT wafer mounting apparatus described in another embodiment of the utility model.
Embodiment
To describe the technology contents of the utility model, construction feature, the objects and the effects in detail, below in conjunction with implementation
Mode simultaneously coordinates attached drawing to be explained in detail.
With reference to figure 6, the invention also discloses a kind of SMT wafer mounting apparatus 100, including stencil printer 30, crystalline substance
Grain labelling machine 40, reflow ovens 50, punching mechanism 80 and conveying mechanism 60, the stencil printer 30 are used for paste solder printing extremely
(default paste solder printing area includes a paste solder printing area 11, secondary paste solder printing area in default paste solder printing area on substrate 10
13), it includes the first steel mesh 31 and the second steel mesh 32.The punching mechanism 80 is to the tin paste layer (tin paste layer on substrate 10
12) stamping process is carried out；Wafer 20 is passed through tin cream (the secondary tin paste layer in paste solder printing area by the crystal grain labelling machine 40
14) affix on the substrate；The reflow ovens 50 carry out substrate 10 heating cooling and reflow soldering.The conveying mechanism 60
Realize conveying of the substrate 20 between the stencil printer 30, crystal grain labelling machine 40, reflow ovens 50 and punching mechanism 80.
With reference to figure 2a to Fig. 3 a, first steel mesh 31 includes steel mesh body 310, the steel mesh body 310 be equipped with
The corresponding perforative one-step print hole 311 in the paste solder printing area 11.
With reference to figure 2a and Fig. 2 b, Fig. 3 a and Fig. 3 b, during work, the first steel mesh 31 is placed on the base by stencil printer 30
On plate 10 (as shown in Fig. 2 a or Fig. 3 a), print solder paste is with the substrate on the substrate 10 for covering first steel mesh 31
A paste solder printing area 11 on 10 forms a tin paste layer 12 (as shown in Fig. 2 b or Fig. 3 b).
With reference to figure 4a to Fig. 5 a, second steel mesh 32 includes steel mesh body 320, is offered on the steel mesh body 320
With the corresponding not perforative groove 322 in a paste solder printing area 11,322 bottom of groove offers and a tin
Cream Printing Zone 11 corresponds to and perforative secondary printing hole 321.The area in the secondary paste solder printing area 13 is less than a tin
The area of cream Printing Zone 11 (a paste solder printing area).One paste solder printing area 11 is equipped with one or more secondary print
Brush hole 321.
Wherein, substrate 10 is equipped with a paste solder printing area 11 and secondary tin cream area 13, and secondary paste solder printing area 13 is located at
In paste solder printing area 11, a tin paste layer 12 is printed in a paste solder printing area 11, is printed in secondary paste solder printing area 13
Secondary tin paste layer 14, secondary tin cream are printed on a tin paste layer 12 from 14.Wherein, the secondary printing hole 321 can be in point
Shape is arranged at the bottom of the groove 322, can also wire be arranged at the bottom of the groove 322.Specifically, the secondary print
Brush hole 321 can be arranged at 322 bottom of groove in cross, can also be in the corner that point-like is arranged at the groove 322,
322 bottom of groove can be arranged in parallel line shaped.
With reference to 4a and Fig. 4 b, Fig. 5 a and Fig. 5 b, during work, the second steel mesh 32 is placed on the substrate 10 by stencil printer 30
Above (as shown in Fig. 4 a or Fig. 5 a), print solder paste is with the substrate 10 on the substrate 10 for covering second steel mesh 32
Secondary paste solder printing area 13 form secondary tin paste layer 14 (as shown in Fig. 4 b or Fig. 4 b).
Wherein, stencil printer 30 prints a tin paste layer 12 using the first steel mesh 31 on substrate, uses the second steel mesh
Secondary tin paste layer 14 is printed on a tin paste layer 12 after punching press.The back side of wafer 20 is affixed to print by crystal grain labelling machine 40
On substrate brushed with secondary tin paste layer 14.Reflow ovens 50 carry out heating cooling to the substrate 10 for printing once tin paste layer, to viscous
The substrate 10 for posting wafer 20 carries out reflow soldering.Punching mechanism 80 carries out the top for heating a tin paste layer 12 after cooling
Stamping process, so that the top of a tin paste layer 12 is in horizontal plane.
With reference to figure 8 to Fig. 9 b, the punching mechanism 80 includes die assembly and driving mechanism (not shown), the mould
Component includes upper die mold 81 and lower die mould 82, formed with some with a paste solder printing area on the upper die mold 81
Width corresponds to the longitudinal fluting 811 of (tin paste layer 12), and the positioning that installation base plate 10 is offered on the lower die mould 82 is recessed
Groove 821, the driving mechanism drives the upper die mold 81 to be acted relative to the lower die mould 82, so that the upper mold mould
The top of a tin paste layer 12 on the slot bottom stamping substrate 10 of the longitudinal fluting 811 of tool 81.
With reference to 4a and Fig. 4 b, Fig. 5 a and Fig. 5 b, during work, the second steel mesh 32 is placed on the substrate 10 by stencil printer 30
Above (as shown in Fig. 4 a or Fig. 5 a), print solder paste is with the substrate 10 on the substrate 10 for covering second steel mesh 32
Secondary paste solder printing area 13 form secondary tin paste layer 14 (as shown in Fig. 4 b or Fig. 4 b).
Wherein, stencil printer 30 prints a tin paste layer 12 on the substrate 10 using the first steel mesh 31, and reflow ovens 50 are right
The substrate 10 of printing once tin paste layer 12 carries out heating cooling, stencil printer 30 using the second steel mesh after the cooling period once
Secondary tin paste layer 14 is printed on tin paste layer 12.The back side of wafer 20 is affixed to and is printed with secondary tin paste layer by crystal grain labelling machine 40
On 14 substrate.Reflow ovens 50 carry out reflow soldering to the substrate 10 for being pasted with wafer 20.
With reference to figure 5c, the secondary tin paste layer 14 is arranged on a tin paste layer 12 in point-like, can also be in wire
It is arranged on a tin paste layer 12.Specifically, can be in that cross spider shape is set with continued reference to secondary tin paste layer 14 described in Fig. 5 c
In on a tin paste layer 12, the secondary tin paste layer 14 can be in point-like be arranged at a tin paste layer 12 corner or
Other positions on tin paste layer, or be arranged in parallel line shaped on a tin paste layer 12.
With reference to figure 1a to Fig. 1 g, description the utility model fixes the surface mount of wafer using SMT wafer mounting apparatus 100
Method, comprises the following steps：With reference to figure 1a to Fig. 1 b, a paste solder printing area 11 of the stencil printer 30 on the substrate 10
Print solder paste, to form a tin paste layer 12；The substrate 10 for printing a tin paste layer 12 is delivered to reflow ovens by conveying mechanism 60
50, reflow ovens 50 carry out a tin paste layer 12 on substrate 10 heating cooling and (substrate 10 are carried out to heat for the first time cold
But), so that the scaling powder on a tin paste layer 12 volatilizees；With reference to figure 1c and Fig. 1 d, conveying mechanism 60 is by substrate 10 after cooling
Punching mechanism 80 is delivered to, punching press action is carried out on the tin paste layer 12 of punching mechanism 80 after the cooling period, by a tin
Top (upper surface) punching press of layer of paste 12 is in horizontal plane；With reference to figure 1d and Fig. 1 e, stencil printer 30 after punching press described one
Secondary 13 print solder paste of paste solder printing area on secondary tin paste layer 12, to form secondary tin paste layer 14, the secondary tin paste layer 14
Area is less than a tin paste layer 12；With reference to figure 1f, conveying mechanism 60 conveys the substrate 10 for being printed with secondary tin paste layer 14
To crystal grain labelling machine 40, the back of wafer 20 is pasted onto the secondary tin paste layer 14 of the substrate 10 by crystal grain labelling machine 40
On.The substrate 10 for being pasted with wafer 20 is delivered to reflow ovens 50 by conveying mechanism 60, and with reference to figure 1g, reflow ovens 50 are to being pasted with crystalline substance
The substrate 10 of circle 20 carries out reflow soldering, i.e., second of heating is carried out to substrate 10 and is cooled down, a tin paste layer 12 and secondary tin cream
14 heating and melting of layer form soldering-tin layer 21 and are pasted on so that the wafer 20 is fixed on the substrate 10.Wherein, the scaling powder
Including rosin, certainly, scaling powder can also be other compositions.Heating the substrate 10 cooled down for the first time can be turned again by manually
Stencil printer 30 is moved to, also stencil printer 30 can be delivered to by conveying mechanism 60.
With reference to figure 10, in another embodiment of the utility model, stencil printer have two, reflow ovens have two, two
Stencil printer is respectively the first stencil printer 301 and the second stencil printer 302, and first stencil printer 301 wraps
Include the first steel mesh 31 and a paste solder printing area 11 on paste solder printing to the substrate 10 is formed into a tin paste layer 12, so
Second stencil printer 302 includes the second steel mesh 32 and forms the secondary paste solder printing area 13 of paste solder printing to the substrate 10
Secondary tin paste layer 14；The reflow ovens include the first reflow ovens 501 and the second reflow ovens 502, and first reflow ovens 501 are to print
Substrate 10 brushed with a tin paste layer 12 carries out heating cooling, and second reflow ovens 502 are to being pasted with the substrate 10 of wafer 20
Reflow soldering is carried out, punching mechanism 80 carries out stamping process to heating a tin paste layer 12 after cooling, so that a tin paste layer
12 top is in horizontal plane.Wafer 20 is passed through tin cream (the secondary tin paste layer in paste solder printing area by the crystal grain labelling machine 40
14) affix on the substrate；The conveying mechanism 60 realizes that substrate 10 flows back in first stencil printer 301, first
It is defeated successively between stove 501, punching mechanism 80, the second stencil printer 302, crystal grain labelling machine 40, the second reflow ovens 5022
Send.Wherein, can be by the first stencil printer 301, the first reflow ovens 501, punching mechanism 80, the second stencil printer 302, crystal grain
Labelling machine 40, the second reflow ovens 502 are arranged successively in active line, conveying mechanism 50 include through the first stencil printer 301,
The conveying of first reflow ovens 501, punching mechanism 80, the second stencil printer 302, crystal grain labelling machine 40, the second reflow ovens 502
Band.Wherein, the first reflow ovens 501 can also be replaced by other heating furnaces and cooling furnace.
With reference to figure 7, in the SMT wafer mounting apparatus 100, be additionally provided with before stencil printer 30 feeding board 71,
Feed mechanism 72, substrate 10 to be processed are arranged on feeding board 71, and substrate 10 to be processed is sent into tin cream and printed by feed mechanism 72
Brush machine 30.
With continued reference to Fig. 7, in the SMT wafer mounting apparatus 100, between stencil printer 30 and reflow ovens 50 also
Equipped with tin cream inspection body 73, the substrate 10 that conveying mechanism 60 processes stencil printer 30 (prints once tin paste layer 12
Substrate 10 and be printed with the substrate 10 of secondary tin paste layer 14) be delivered to tin cream inspection body 73, tin cream inspection body 73 checks
Whether the tin cream on substrate 10 is qualified, rejects substandard product.The substrate 10 of passed examination is delivered to crystal grain by conveying mechanism 60
Labelling machine 40.
Wherein, some chip structures are more complicated, not only need to paste wafer 20, it is also necessary to paste some elements, for this
Plaster mechanism 74 is additionally provided between crystal grain labelling machine 40 and reflow ovens, for this reason, printing secondary tin cream in stencil printer 30
While layer 14, patch is also printed with the patch print solder paste area of substrate 10 and pastes tin paste layer 16 (as shown in Figure 5 b), institute
Stating paste solder printing area includes the patch print solder paste area.It is further opened with the steel plate 32 and the patch print solder paste area pair
The patch paste solder printing hole 15 (as shown in Figure 5 a) answered, for while secondary tin paste layer 14 are printed in stencil printer 30,
Tin paste layer 16 is pasted to form patch by 15 print solder paste of patch paste solder printing hole.Conveying mechanism 60 is by crystal grain labelling machine 40
The substrate 10 machined is delivered to plaster mechanism 74, and plaster mechanism 74 carries out component affixing to the substrate for completing bonding wafer,
Element is pasted tin paste layer 16 by patch to be pasted on substrate 10.
With continued reference to Fig. 7, flux cleaning mechanism 75 is additionally provided with after the reflow ovens 50, the conveying mechanism 60 will add
Substrate 10 after heat or reflow soldering is sent into flux cleaning mechanism 75, carries out flux cleaning.
With continued reference to Fig. 7, the SMT wafer mounting apparatus 100 further includes AOI (Automatic Optic
Inspection) inspection body 76, the conveying mechanism 60 is by the substrate 10 for pasting wafer or pastes wafer and element
Substrate 10 be delivered to AOI inspection bodies 76 and checked, check that (or bonding wafer and element glue 10 bonding wafer of substrate
Patch) it is whether qualified.In Fig. 7, blanking board 77 is equipped with after AOI inspection bodies 76, the conveying mechanism 60 will complete AOI and check
Substrate 10 be delivered in blanking board 77 and carry out blanking.
Above disclosed is only the preferred embodiment of the utility model, certainly cannot be new to limit this practicality with this
The interest field of type, therefore the equivalent variations made according to present utility model application the scope of the claims, still belong to the utility model and are covered
Scope.
Claims (9)
1. a kind of SMT wafer mounting apparatus, substrate is pasted on for wafer to be fixed, it is characterised in that：Including：
Stencil printer, tin paste layer is formed by default paste solder printing area on paste solder printing to substrate, it include the first steel mesh with
Second steel mesh, first steel mesh are equipped with corresponding with a paste solder printing area and perforative one-step print hole, second steel
Net is equipped with corresponding with a paste solder printing area and not perforative groove, and the bottom portion of groove offers and secondary printing tin cream area pair
Answer and perforative secondary printing hole, the area in the secondary printing tin cream area are less than the area in a paste solder printing area, institute
Stating paste solder printing area includes a paste solder printing area and secondary paste solder printing area；
Punching mechanism, stamping process is carried out to the tin paste layer on substrate；
Crystal grain labelling machine, wafer is affixed on the substrate by the tin cream in paste solder printing area；
Reflow ovens, carry out substrate heating cooling and reflow soldering；
Conveying mechanism, realizes that substrate is defeated between the stencil printer, crystal grain labelling machine, reflow ovens and punching mechanism
Send.
2. SMT wafer mounting apparatus as claimed in claim 1, it is characterised in that：The secondary printing hole is in point-like or line
Shape is arranged at the bottom of the groove.
3. SMT wafer mounting apparatus as claimed in claim 2, it is characterised in that：The secondary printing hole is set in cross spider shape
It is placed in the bottom portion of groove or is arranged at the corner of the bottom portion of groove in point-like or is arranged at the groove-bottom in parallel line shaped
Portion.
4. SMT wafer mounting apparatus as claimed in claim 1, it is characterised in that：The stencil printer uses the first steel mesh
In a paste solder printing area print solder paste of substrate to form a tin paste layer；The reflow ovens are to printing once tin paste layer
Substrate carries out heating cooling, so that the scaling powder volatilization in a tin paste layer；The punching mechanism to it is after cooling once
Tin paste layer carries out stamping process so that the top of a tin paste layer is in horizontal plane；The stencil printer uses the second steel mesh
The secondary paste solder printing area print solder paste on a tin paste layer after stamping process is to form secondary tin paste layer；The crystal grain glues
Attaching mechanism is by bonding wafer to being printed with the substrate of secondary tin paste layer；The reflow ovens also carry out the substrate for being pasted with wafer
Reflow soldering.
5. SMT wafer mounting apparatus as claimed in claim 4, it is characterised in that：The stencil printer includes the first tin cream
Printing machine and the second stencil printer, first stencil printer include the first steel mesh and by paste solder printings to the substrate
A paste solder printing area to form a tin paste layer, so the second stencil printer include the second steel mesh and by paste solder printing extremely
Secondary paste solder printing area on the substrate is to form secondary tin paste layer；The reflow ovens include the first reflow ovens and the second reflux
Stove, first reflow ovens carry out heating cooling to the substrate for printing once tin paste layer, and second reflow ovens are to being pasted with
The substrate of wafer carries out reflow soldering, and the conveying mechanism realizes substrate in first stencil printer, the first reflow ovens, punching
Conveying successively between press mechanism, the second stencil printer, the second reflow ovens and crystal grain labelling machine.
6. SMT wafer mounting apparatus as claimed in claim 1, it is characterised in that：Flux cleaning mechanism is further included, it is described to help
Solder flux wiper mechanism carries out flux cleaning to the substrate exported from the reflow ovens, and the conveying mechanism is by substrate from described time
Stream stove is delivered to flux cleaning mechanism.
7. SMT wafer mounting apparatus as claimed in claim 1, it is characterised in that：Further include plaster mechanism, the conveying mechanism
Substrate after crystal grain labelling machine is processed is delivered to the plaster mechanism, and element is passed through paste solder printing area by the plaster mechanism
On tin cream paste on the substrate.
8. SMT wafer mounting apparatus as claimed in claim 7, it is characterised in that：On the steel mesh body of second steel mesh also
Equipped with patch printing hole corresponding with patch print solder paste area, the stencil printer using the second steel mesh on the substrate
To form patch tin paste layer, element is pasted onto patch print solder paste area's print solder paste by the plaster mechanism by patch tin paste layer
On the substrate, the paste solder printing area includes the patch print solder paste area.
9. SMT wafer mounting apparatus as claimed in claim 1, it is characterised in that：The punching mechanism include die assembly and
Driving mechanism, the die assembly include upper die mold and lower die mould, formed with some with described one on the upper die mold
The corresponding longitudinal fluting of secondary paste solder printing sector width, the positioning groove of installation base plate, the drive are offered on the lower die mould
Motivation structure drives the upper die mold relative to the lower die mold actions, so that the slot bottom of the longitudinal fluting of the upper die mold
Tin paste layer on stamping substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721042770.8U CN207367928U (en) | 2017-08-10 | 2017-08-10 | SMT wafer mounting apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721042770.8U CN207367928U (en) | 2017-08-10 | 2017-08-10 | SMT wafer mounting apparatus |
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| CN207367928U true CN207367928U (en) | 2018-05-15 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107346748A (en) * | 2017-08-10 | 2017-11-14 | 乐依文半导体(东莞)有限公司 | The surface mount method and SMT wafer mounting apparatus of fixed wafer |
| CN110808221A (en) * | 2019-11-11 | 2020-02-18 | 东莞记忆存储科技有限公司 | SMT and DA process integration method for SIP packaging |
| CN113438825A (en) * | 2021-06-30 | 2021-09-24 | 江西省兆驰光电有限公司 | SMT (surface mount technology) chip mounting method and LED (light emitting diode) packaging device |
| US11651973B2 (en) | 2020-05-08 | 2023-05-16 | International Business Machines Corporation | Method and apparatus of processor wafer bonding for wafer-scale integrated supercomputer |
-
2017
- 2017-08-10 CN CN201721042770.8U patent/CN207367928U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107346748A (en) * | 2017-08-10 | 2017-11-14 | 乐依文半导体(东莞)有限公司 | The surface mount method and SMT wafer mounting apparatus of fixed wafer |
| CN107346748B (en) * | 2017-08-10 | 2023-11-21 | 联测优特半导体(东莞)有限公司 | Surface pasting method for fixing wafer and SMT wafer fixing device |
| CN110808221A (en) * | 2019-11-11 | 2020-02-18 | 东莞记忆存储科技有限公司 | SMT and DA process integration method for SIP packaging |
| CN110808221B (en) * | 2019-11-11 | 2022-03-29 | 东莞记忆存储科技有限公司 | SMT and DA process integration method for SIP packaging |
| US11651973B2 (en) | 2020-05-08 | 2023-05-16 | International Business Machines Corporation | Method and apparatus of processor wafer bonding for wafer-scale integrated supercomputer |
| CN113438825A (en) * | 2021-06-30 | 2021-09-24 | 江西省兆驰光电有限公司 | SMT (surface mount technology) chip mounting method and LED (light emitting diode) packaging device |
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