201041470 、發明說明： 【發明所屬之技術領域】 本發明為一種底膠印刷方法及裝置，尤指適用 於封裝結構的一種底膠印刷方法及裝置。 【先前技術】 一般而言，一積體電路晶片（integrated circuit chip, IC chip)組裝於一印刷電路板（printed circuit board)上時，是以多數個錫球（solder ball)作為連接媒 介，該些錫球固定於印刷電路板的金屬接點上，然 後積體電路晶片再固定於該些錫球的上端。藉此’ 積體電路晶片與印刷電路板之間的電訊號傳遞能透 過該些錫球來達成。 而此種組裝方式具有一些缺失如下述：積體電 路晶片的熱膨脹係數與印刷電路板的熱膨脹係數相 比，積體電路晶片的熱膨脹係數小於印刷電路板的 許多。因此當積體電路晶片與印刷電路板受到熱循 環時，兩者的熱變形差異太大，容易造成錫球有過 大的剪應力（shear stress)，造成錫球被破壞。 為了改善上述缺失，積體電路晶片與印刷電路 板之間會填入一底膠（underfill)，該底膠將錫球覆蓋 住’並接觸積體電路晶片的底面以及印刷電路板的 頂面。底膠能減緩錫球因為熱循環而產生的剪應 力，增加錫球的使用壽命。 在填入底膠於積體電路晶片與印刷電路板之間 時，習知的作法為使用一針筒（needle)。請參考美國 專利號 5710071 之專利『process for under filling a 201041470 . flip chip semiconductor device』，其使用了一針筒將 底膠點於（dispense)積體電路晶片旁，然後底膠會因 為毛細效應（capillary effect)而被吸入至積體電路晶 片的下方。 然而’該習知的作法具有些缺失：由於針筒需 繞著積體電路晶片的邊緣移動而點膠，所以點膠作 業時間較久。另外，底膠由積體電路晶片旁流動至 積體電路晶片的下方的速度仍不夠快速，此點 待改善。 緣是，本發明人有感上述缺失可以改善，因此 提出一種設計合理且有效改善上述缺失之本發明。 【發明内容】 士本發明之主要目的在於提供一種底膠印刷方法 及裝置，其能較快速地將底膠塗佈纟晶片#，並且 較快速地讓底膠流入至晶片的下方。 马達上述目的，本發明的 ,, ’ 頁她例提出一種底膠 〇 ’包括步驟如下：加熱一封裝結構，該封裝 晶片；一基材及多數個錫球’該些錫球設 ;q 土才上，该晶片設置於該些錫球上；設置一 裝結構上，該印刷板具有-開口;設置- 刷板的頂面的一側推動至另-側，使得該 氐膠通過§亥開口而位於該晶片旁。 括步出一種底膠印刷方法’包 結構呈有—卩刷板於—封裝結構上，該封裝 " 曰曰片、一基材及多數個錫球，該些錫球設 201041470 置於該基材上，該晶片設置於該些錫球上，該印刷板 具有開口，设置一底膠於該印刷板的頂面的一側； 使用一刮刀將該底膠由該印刷板的頂面的-侧推動 至另一側，使得該底膠通過該開口而位於該晶片旁； 以及加熱該封裝結構。 ’ 本發明的又一實施例提出一種底膠印刷裝置，包 括·一支撐座；一印刷板，其設置於該支撐座的上方， 該印刷板具有多數個開口；—刮刀，其可移動地設置 於省印刷板的上方；以及一加熱模組，其設置於該支 撐座旁。 藉此，本發明具有以下有益效果：本發明只要將 印刷板上的底膠往一方向推動，即可使底膠通過印刷 板的開孔而塗佈於封裝結構的及晶片旁。另外本發明 使用加熱模組來加熱封裝結構，使得封裝結構具有較 高的溫度，如此毛細效應會更顯著，讓底膠較快速流 入至晶片的下方。 為使能更進一步了解本發明之特徵及技術内 容’請參閱以下有關本發明之詳細說明及圖式，然而 所附圖式僅供參考與說明用，並非用來對本發明加以 限制者。 【實施方式】 本發明的第一實施例提出一種底膠印刷裝置 (underfill printing apparatus) ’ 其能快速地將底膠塗 饰於晶片旁’並且快速地讓底膠流入至晶片的下 方。請參閱第一圖及第二圖，該底膠印刷裝置包括·· 一支撐座10、一印刷板20、一刮刀30及一加熱模 201041470 組40。 该支撐座10可供一封裝結構5〇放置，該支撐 座10具有一真空吸引區u，該真空吸引區11可產 生吸力而將封裝結構50吸住。 該封裝結構50包括多數個晶片5卜多數個錫球 52及一基材53。該些錫球52設置於基材53的頂面， 晶片51設置於錫球52上，因此晶片51與基材53 之間具有-間隙。該基材53可為一電路板或是一晶 ^ 圓’而本實施例的基材53為電路板。 該印刷板20設置於支撐座1〇的上方，更詳細 地說，印刷板20藉由一些固定機構或結構（圖未示） 而疋位於支撐座1〇上方。印刷板2〇的種類可為— 鋼板或一網板。 印刷板20具有多數個開口 21，該些開口 2ι垂 直地貫穿印刷板20。開口 21的形狀及尺寸對應封裝 結構50的晶片51的形狀及尺寸，而本實施例的開 口 21為一 L狀，並位於晶片51的二邊緣外。開口 21的形狀及排列有多種變化，請參閱第三圖及第四 圖，於其他實施例中，部分的開口 21可為『倒L』 狀或矩形狀等。請參閱第五圖，於其他實施例中， 矩形狀的開口 21排列成一 L形。 請重新參閱第—圖及第二圖，繼續說明第一實 施例的底膠印刷裝置的其他元件。 • 該刮刀3〇可移動地設置於該印刷板2()的上 方:更詳細地說，該刮刀3〇設置於一傳動機構（圖 未示）上，由傳動機構帶動刮刀30在印刷板2〇的 7 201041470 上方水平地移動。該傳動機構可為螺桿、氣壓缸等， 常用於產生水平運動的機構。 該加熱模組40設置於該支撐座10的左側旁， 該加熱模組40的頂面可供封裝結構5〇置放。而加 熱模組40本身可產生熱能’對封裝結構5〇加敎， 使得封裝結構50的溫度场。更詳細職，加熱模 組40可產生溫度較高的熱氣（h〇tair)，熱氣吹撫於封 裝結構50，而將熱能傳遞至封裝結構5〇。 請參閱第六圖，並配合參閱第一圖及第二圖， 第一實施例的底膠印刷裝置的第一種使用方法如 首先將封裝結構50放置於加熱模組4〇上，鈇 後啟動加熱模、址40產生熱能，封裝結# 50的溫^ 開始上升，此過程稱為『前加熱❻代“州叩）』。封裝 結構50的溫度最高可上升至3〇〇攝氏溫度。封裝結 f、、50加熱完畢’再將封裝結構50以一機械手“ 專运機構（圖未示）移動至支撐座1〇上。 一 啟動支撐座10的真空吸引區u，將封 吸住。然後將印刷板2〇設置於封裝結構5〇:， 印刷板20的開口 21位於晶片51的邊緣外，印刷板 2〇的頂面的右側會設置一底膠60。 糾刀3G在印刷板2Q的上方由右往左地移 ’將底膠6G由印刷板2G的頂面的右側推動 :=60在行經印刷㈣的—時，底膠60 曰通過開口 21而塗佈於基材53的頂面，及晶片η 旁。之後底膠60會因為毛細效應的關係，而流入至 201041470 . 晶片51的下方。 底乂上，知，只要使用刮刀3〇朝-個方向推動 膠〇，即可使底膠60塗佈於每—個晶片 不用如習知般，分別對每一 Y曰 #日山从+刀刎訂母個日日片51塗佈底膠6〇。 巧’由於封裳結構50已加熱至_^溫度，高 的二細效應，使得底膠6。較快速地流入晶片皿51 ο 栋田，第—實施例的底膠印刷裝置具有第二種 /此第一種使用方法是因應下列情況：因 為封裝結構50在離開加熱模組4〇而放置於支樓座 1 〇後，封裝結構5 〇的溫度會開始下 ，流入晶…方的速度。所以第二= 構去會在底膠60塗佈於晶片51旁後’再將封裝結 =〇达回至加熱模組4 〇上，讓封裝結構$ 〇再度被 二二t過程又稱為『後加熱㈣“Μ)』。如此 ❹ 封U冓50可維持高溫，底膠6〇能更快速地流入 至晶片51下方。 第一實施例的底膠印刷裝置具有第三種使用方 式。於第三種使用方式中，封裝結構5〇省略掉『前 加熱』作業，直接放置於支撐座1〇上進行底膠6〇 塗佈作業（底膠60塗佈於晶片51旁），之後再將封 裝結構50送至加熱模組4〇加熱，進行『後加熱』 的作業。高溫會使得毛細效應加劇，進而讓底膠6〇 快速地流入至晶片51的下方。 ’”示5上述，第一實施例的底膠印刷裝置可實質 地減少底膠60填入至封裝結構5〇的時間。 9 201041470 請參閱第七圖，本發明的第二實施例提出另一 種底膠印刷裝置，其與第一實施例的差異之處在 於：第二實施例的底膠印刷裝置更包括—第二加熱 模組70，而第二加熱模組7〇設置於該支撐座 右側旁。 凊參閱第八圖，第二實施例的底膠印刷袭置的 使用方f如下：首先，封裴結構5〇先在加熱模組 進仃『前加熱』的作業，然後送至支撐座1〇上 底膠6〇塗佈作業。最後，再將封裝結構50送至第 進行『後加熱』的作#，使得封裂結 構50、、隹持在雨溫’讓底膠⑼更快速地流入晶片η 的下方。 模組40及70,所以杏一個6 啕雨個加養 50在第-加数：人 成塗佈作業的封裝結书 〇在弟一加熱板組7〇進行『後加熱』作 個尚，進灯塗佈作業的封裝結構5〇可在加執 進行前加熱』作業，節省整體作業時間 本發明的第三實施例提出— 其能快速地將底膠塗佈至晶片旁，並'I刷方法， 膠流入至晶片的下方。該底膠印刷==地讓肩 -實施例或第二實施例的底膠印刷 上述第 侷限。也就是指，底膠印刷方法麵/置執仃，但不 第二實施例的底膠印刷裝置的使二第-實施例或 5月參閱第九圖，並配合參一 第五圖’以第—實施例的底膠印第二圖及 實施例的底膠印刷方法執行 获置為例，第三 包括步驟如下： 10 201041470 々驟S101 ·使用加熱模組4〇來加 50,該封裝結構50具有多數個日^ # 虿夕數個日日片51、多數個錫球 及一基材53,該些錫球52位於晶片51及基材幻 之間。該基材53可為電路板或晶圓。 步驟S103:然後，將封裝結構5〇放置於 1〇上，再將一印刷板20設置於封裝結構50上Γ該 印刷板20具有多數個開口 21，開口 21的形狀可^ L狀、矩形狀等。開口 21的位置對齊於晶片51的邊 緣外。201041470, invention: [Technical Field] The present invention relates to a primer printing method and apparatus, and more particularly to a primer printing method and apparatus suitable for a package structure. [Prior Art] In general, when an integrated circuit chip (IC chip) is assembled on a printed circuit board, a plurality of solder balls are used as a connection medium. The solder balls are fixed on the metal contacts of the printed circuit board, and then the integrated circuit chips are then fixed to the upper ends of the solder balls. Thereby, the electrical signal transmission between the integrated circuit chip and the printed circuit board can be achieved by passing the solder balls. This type of assembly has some drawbacks such as the following: The thermal expansion coefficient of the integrated circuit wafer is comparable to the thermal expansion coefficient of the printed circuit board, and the thermal expansion coefficient of the integrated circuit wafer is smaller than that of the printed circuit board. Therefore, when the integrated circuit chip and the printed circuit board are subjected to thermal cycling, the difference in thermal deformation between the two is too large, which tends to cause excessive shear stress of the solder ball, causing the solder ball to be destroyed. In order to improve the above-mentioned deficiency, an underfill is filled between the integrated circuit chip and the printed circuit board, and the underfill covers the solder ball and contacts the bottom surface of the integrated circuit wafer and the top surface of the printed circuit board. The primer can reduce the shear stress of the solder ball due to thermal cycling and increase the service life of the solder ball. When filling the primer between the integrated circuit chip and the printed circuit board, it is conventional practice to use a needle. Please refer to the patent "Process for under filling a 201041470 . flip chip semiconductor device", which uses a syringe to dispense the primer to the side of the integrated circuit chip, and then the primer is due to the capillary effect ( The capillary effect is sucked into the lower side of the integrated circuit chip. However, this conventional practice has some drawbacks: since the syringe needs to be dispensed around the edge of the integrated circuit wafer, the dispensing operation takes a long time. In addition, the speed at which the primer flows from the side of the integrated circuit chip to the lower side of the integrated circuit chip is not fast enough, which is to be improved. On the contrary, the present inventors felt that the above-mentioned deletion could be improved, and therefore proposed a present invention which is rational in design and effective in improving the above-mentioned deficiency. SUMMARY OF THE INVENTION The main object of the present invention is to provide a primer printing method and apparatus which can apply a primer to a wafer # relatively quickly and allow the primer to flow under the wafer relatively quickly. The above object of the present invention, the present invention, the method of the invention provides a primer 〇' including the steps of: heating a package structure, the package wafer; a substrate and a plurality of solder balls 'the solder balls; q soil And the wafer is disposed on the solder balls; and the printed board has an opening; and the side of the top surface of the brush board is pushed to the other side, so that the silicone passes through the opening Located next to the wafer. Including a primer printing method, the package structure has a 卩 板 于 on the package structure, the package " 曰曰 片, a substrate and a plurality of solder balls, the solder balls are placed on the base 201041470 On the material, the wafer is disposed on the solder balls, the printing plate has an opening, and a primer is disposed on one side of the top surface of the printing plate; and the primer is used by the top surface of the printing plate by using a scraper - Pushing the side to the other side such that the primer passes over the wafer through the opening; and heating the package structure. A further embodiment of the present invention provides a primer printing apparatus comprising: a support base; a printing plate disposed above the support base, the printing plate having a plurality of openings; a doctor blade movably disposed Above the provincial printing plate; and a heating module disposed beside the support. Therefore, the present invention has the following beneficial effects: as long as the primer in the printing plate is pushed in one direction, the primer can be applied to the package structure and the wafer through the opening of the printing plate. In addition, the present invention uses a heating module to heat the package structure so that the package structure has a higher temperature, so that the capillary effect is more significant, allowing the primer to flow faster below the wafer. The detailed description and drawings of the present invention are to be understood as the invention [Embodiment] A first embodiment of the present invention proposes an underfill printing apparatus 'which can quickly coat a primer to the side of the wafer' and quickly allows the primer to flow under the wafer. Referring to the first and second figures, the primer printing device comprises a support base 10, a printing plate 20, a scraper 30 and a heating mold 201041470 group 40. The support base 10 can be placed in a package structure 5, the support base 10 having a vacuum suction zone u which can generate suction to attract the package structure 50. The package structure 50 includes a plurality of wafers 5 and a plurality of solder balls 52 and a substrate 53. The solder balls 52 are disposed on the top surface of the substrate 53, and the wafer 51 is disposed on the solder balls 52. Therefore, there is a gap between the wafer 51 and the substrate 53. The substrate 53 can be a circuit board or a crystal circle. The substrate 53 of the present embodiment is a circuit board. The printing plate 20 is disposed above the support base 1 . More specifically, the printing plate 20 is placed above the support base 1 by some fixing mechanism or structure (not shown). The type of printing plate 2 can be - steel plate or a mesh plate. The printing plate 20 has a plurality of openings 21 which extend vertically through the printing plate 20. The shape and size of the opening 21 corresponds to the shape and size of the wafer 51 of the package structure 50, and the opening 21 of the embodiment is an L shape and is located outside the two edges of the wafer 51. The shape and arrangement of the openings 21 are variously changed. Please refer to the third and fourth figures. In other embodiments, the partial openings 21 may be "inverted" or rectangular. Referring to the fifth figure, in other embodiments, the rectangular openings 21 are arranged in an L shape. Referring again to the first and second figures, the other elements of the primer printing apparatus of the first embodiment will be described. • The scraper 3 is movably disposed above the printing plate 2 (): in more detail, the scraper 3 is disposed on a transmission mechanism (not shown), and the driving mechanism drives the scraper 30 on the printing plate 2 〇 7 201041470 moves horizontally above. The transmission mechanism can be a screw, a pneumatic cylinder, etc., and is often used for a mechanism that produces horizontal motion. The heating module 40 is disposed on the left side of the support base 10. The top surface of the heating module 40 can be placed in the package structure. The heating module 40 itself generates thermal energy, which is applied to the package structure 5 to make the temperature field of the package structure 50. More in detail, the heating module 40 can generate a higher temperature hot gas, which is blown to the package structure 50 and transfers the heat energy to the package structure 5〇. Please refer to the sixth figure, and with reference to the first figure and the second figure, the first method of using the primer printing device of the first embodiment is as follows: firstly, the package structure 50 is placed on the heating module 4〇, and then started. The heating mode and the address 40 generate thermal energy, and the temperature of the package junction #50 starts to rise. This process is called “preheating and heating”. The temperature of the package structure 50 can be raised up to 3 〇〇 Celsius. After f, 50 is heated, the package structure 50 is moved to the support base 1 by a robotic mechanism (not shown). As soon as the vacuum suction zone u of the support base 10 is activated, it will be sealed. The printing plate 2 is then placed on the package structure 5: the opening 21 of the printing plate 20 is located outside the edge of the wafer 51, and a primer 60 is disposed on the right side of the top surface of the printing plate 2''. The knives 3G are moved from right to left over the printing plate 2Q. The primer 6G is pushed from the right side of the top surface of the printing plate 2G: = 60 is printed (4), and the primer 60 is coated through the opening 21. It is placed on the top surface of the substrate 53, and next to the wafer η. The primer 60 then flows into the lower side of the wafer 51 due to the capillary effect. On the bottom cymbal, it is known that as long as the squeegee is used to push the squeegee in one direction, the primer 60 can be applied to each wafer without conventionally, as for each Y曰#日山从+刀刎 母 母 母 日 51 51 51 51 51 51 51 51 Qiao' because the sealing structure 50 has been heated to _^ temperature, high two-fine effect, making the primer 6. Flowing into the wafer holder 51 relatively quickly, the primer printing apparatus of the first embodiment has the second/first use method in response to the following situation: since the package structure 50 is placed away from the heating module 4 After 1 支 of the branch, the temperature of the package structure 5 〇 will start to flow into the crystal. Therefore, the second = configuration will be applied after the primer 60 is applied to the wafer 51, and then the package junction is returned to the heating module 4 ,, so that the package structure $ 〇 is again referred to as the two-two process. After heating (4) "Μ". Thus, the sealing U 冓 50 can maintain high temperature, and the primer 6 〇 can flow under the wafer 51 more quickly. The primer printing device of the first embodiment has a third use mode. In the three modes of use, the package structure 5 omits the "pre-heating" operation, and is directly placed on the support base 1 to perform the primer coating operation (the primer 60 is applied on the side of the wafer 51), and then the package is packaged. The structure 50 is sent to the heating module 4 for heating, and the "post-heating" operation is performed. The high temperature causes the capillary effect to be intensified, and the primer 6 〇 quickly flows into the lower side of the wafer 51. The underprint printing apparatus of the example can substantially reduce the time during which the primer 60 is filled into the package structure 5 。. 9 201041470 Referring to the seventh figure, a second embodiment of the present invention proposes another offset printing apparatus, which is different from the first embodiment in that the primer printing apparatus of the second embodiment further includes a second heating. The module 70 is disposed, and the second heating module 7 is disposed beside the right side of the support. Referring to the eighth figure, the user of the primer printing of the second embodiment is as follows: First, the sealing structure 5 first enters the "preheating" operation of the heating module, and then is sent to the support base. The primer is applied to the primer 6 〇. Finally, the package structure 50 is sent to the "post-heating" process so that the sealing structure 50 is held at the rain temperature to allow the primer (9) to flow more rapidly below the wafer η. Modules 40 and 70, so apricot a 6 啕 rain add 50 in the first-plus number: the packaged book of the person-applied work 〇 in the brothers a heating plate group 7 〇 "post-heating" as a still, into the light The package structure of the coating operation can be pre-heated before the operation, saving the overall working time. The third embodiment of the present invention proposes that it can quickly apply the primer to the wafer, and the 'I brush method, The glue flows down to the bottom of the wafer. The primer printing == grounding shoulder - the primer of the embodiment or the second embodiment is printed as described above. That is to say, the primer printing method surface/setting, but not the second embodiment of the primer printing device of the second embodiment or the ninth drawing of May, and with the fifth figure - The bottom offset printing of the second embodiment of the embodiment and the execution method of the primer printing method of the embodiment are taken as an example, and the third comprises the following steps: 10 201041470 Step S101 - Using a heating module 4 to add 50, the package structure 50 has Most of the days ^ # 虿 数 several days of the film 51, a plurality of solder balls and a substrate 53, the solder balls 52 are located between the wafer 51 and the substrate magic. The substrate 53 can be a circuit board or a wafer. Step S103: Then, the package structure 5〇 is placed on the 1〇, and then a printed board 20 is disposed on the package structure 50. The printed board 20 has a plurality of openings 21, and the shape of the opening 21 can be L-shaped or rectangular. Wait. The position of the opening 21 is aligned outside the edge of the wafer 51.
步驟S105 :接著，將一 20的頂面的右側。 底膠60設置於該印刷板 ❹ 步驟S107 :再來，使用一刮刀3〇將底膠6〇由 印刷板20的頂面的右側推動至左側，使得底膠的 通過該些開口 21而塗佈於晶片51旁，之後底膠6〇 會因為毛細效應流入至晶片51的下方。因為封裝結 構50具有較高的溫度，所以毛細效應會較顯著，底 膠60因此能較快速地流入至晶片51的下方。- 步驟S109:最後，可額外地將封裝結構5〇送回 至加熱模組40中，再度加熱封裝結構5〇，使得封裝 結構50維持高溫，從而讓底膠6〇更快速地流入至 晶片51的下方。 上述步驟S101及S109中，封裝結構5〇可加熱 至300攝氏溫度以下。 本發明的第四實施例提出另一種底膠印刷方 法’其也能快速地將底膠塗佈至晶片旁，並且快速 地讓底膠流入至晶片的下方。第四實施例的底膠印 11 201041470 7方法也可在上述第一實施例或第 印刷裝置執行。 … 請參閱第十圖，並配合參閱第一圖、第二圖及 五圖’以第一實施例的底膠印刷裝置為例，第四 實施例的底膠印刷方法執行時，包括步驟如下： 步驟S201 .首先，將一封裝結構5〇放置於支撐 座ίο上’然後將一印刷板2〇設置於封裝結構上。 ^封裂、、、。構50具有多數個晶片51、多數個錫球 —基材53’該些錫球52位於晶片51及基材幻之 ，《亥基材53可為電路板或晶圓。該印刷板具 J多數個開口 21 ’開口 21的形狀可為L狀、矩形& 4。開口 21的位置對齊於晶片51的邊緣外。 步驟S203 :接菩，蔣_ 1¾ Ff^ /Γ A 加的頂_側將底膠6〇設置於印刷板 £步驟⑽：再來，使用—刮刀30將底膠60由 P刷板20的頂面的右側推動至左側，使得底膠6〇 通過該些開π 21而塗佈於基材53的頂面，並位於 =51旁Μ ’之後底膠6〇會因為毛細效應流入 至晶片51的下方。 40 壤加…杈組40加熱封裝結構5〇 上升。封裝結構50具有較高的溫度 :二=會更顯著，從而讓底膠6〇更快速地流 至曰曰片51的下方。而封裝結構50加熱後的溫度， 低於300攝氏溫度。 设幻/皿度 12 201041470 g綜合上述的各實施例的說明可知，本發明的底 膠印刷方法及裝置確實能減少底膠塗佈於晶片的時 ^尤其疋曰曰片數量越多時，其節省的時間越多。 且底璆流人至晶片的τ方的時間也確實能 少。 惟以上所述僅為本發明之較佳實施例，非意欲 侷限本發明之專利保護範圍，故舉凡運用本發明說 明書及圖式内容所為之等效變化，均同理皆包含於 本發明之權利保護範圍内，合予陳明。 【圖式簡單說明】 第一圖係本發明第一實施例的底膠印刷裝置的立體 組合圖。 第一圖係本發明第一實施例的底膠印刷裝置的立體 分解圖。 弟三圖係本發明第一實施例的印刷板的開口形狀的 示意圖。 第四圖係本發明第—實施例的印刷板的開口形狀的 另一示意圖。 第五圖係本發明第—實施例的印刷板的開口形狀的 另一示意圖。 第/、圖係本發明第一實施例的底膠印刷裝置的使用 示意圖。 第七圖係本發明第二實施例的底膠印刷裝置的立體 組合圖。 第八圖係本發明第二實施例的底膠印刷裝置的使用 示意圖。 13 201041470 第九圖係本發明第三實 流程圖。 第十圖係本發明第四實 流程圖。 施例的底 施例的底 【主要元件符號說明】 10支撐座 膠印刷方法的步驟 膠印刷方法的步驟 11真空吸引區 20印刷板 21開口 刮刀 4〇加熱模組 封裝結構 51晶片 52錫球 53基材 底膠 7〇第二加熱模組 步驟S101至S109 步驟S201至S207 14Step S105: Next, the right side of the top surface of a 20 is placed. The primer 60 is disposed on the printing plate. Step S107: Next, the primer 6 is pushed from the right side of the top surface of the printing plate 20 to the left side by using a doctor blade 3, so that the primer is coated through the openings 21. Next to the wafer 51, the underfill 6 流入 then flows under the wafer 51 due to the capillary effect. Since the package structure 50 has a higher temperature, the capillary effect is more remarkable, and the underfill 60 can therefore flow into the lower portion of the wafer 51 more quickly. - Step S109: Finally, the package structure 5 can be additionally sent back to the heating module 40, and the package structure 5 is heated again, so that the package structure 50 is maintained at a high temperature, so that the primer 6 流入 flows into the wafer 51 more quickly. Below. In the above steps S101 and S109, the package structure 5 can be heated to a temperature lower than 300 degrees Celsius. The fourth embodiment of the present invention proposes another primer printing method which can also quickly apply the primer to the side of the wafer and quickly allow the primer to flow under the wafer. Under offset printing of the fourth embodiment 11 201041470 The method can also be carried out in the first embodiment or the printing apparatus described above. Referring to the tenth figure, and referring to the first figure, the second figure and the fifth figure, taking the primer printing device of the first embodiment as an example, when the primer printing method of the fourth embodiment is executed, the steps are as follows: Step S201. First, a package structure 5 is placed on the support frame ί' and then a printed board 2 is placed on the package structure. ^Cracking, ,,. The structure 50 has a plurality of wafers 51, a plurality of solder balls-substrate 53', and the solder balls 52 are located on the wafer 51 and the substrate. The substrate 53 can be a circuit board or a wafer. The printing plate has a plurality of openings 21'. The shape of the opening 21 may be L-shaped, rectangular & The position of the opening 21 is aligned outside the edge of the wafer 51. Step S203: Take the bud, Jiang _ 13⁄4 Ff^ / Γ A plus top _ side set the primer 6 于 on the printing plate £ step (10): again, use the squeegee 30 to apply the primer 60 from the top of the P brush plate 20 The right side of the face is pushed to the left side, so that the primer 6〇 is applied to the top surface of the substrate 53 through the openings π 21, and the primer 6 位于 is located next to the side of the substrate 51, and the primer 6 流入 flows into the wafer 51 due to the capillary effect. Below. 40 soil plus... 杈 group 40 heating package structure 5 〇 rise. The package structure 50 has a higher temperature: two = will be more pronounced, allowing the primer 6 to flow more quickly below the cymbal 51. The temperature after heating of the package structure 50 is less than 300 degrees Celsius. According to the description of the above embodiments, the primer printing method and apparatus of the present invention can reduce the time when the primer is applied to the wafer, especially when the number of the crepe is larger. The more time you save. And the time to flow to the τ side of the wafer is really small. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, the equivalents of the present invention and the equivalents of the drawings are all included in the present invention. Within the scope of protection, it is given to Chen Ming. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a perspective assembled view of a primer printing apparatus according to a first embodiment of the present invention. The first drawing is a perspective exploded view of a primer printing apparatus according to a first embodiment of the present invention. The third figure is a schematic view showing the opening shape of the printing plate of the first embodiment of the present invention. The fourth drawing is another schematic view of the opening shape of the printing plate of the first embodiment of the present invention. Fig. 5 is another schematic view showing the opening shape of the printing plate of the first embodiment of the present invention. Fig. / is a schematic view showing the use of the primer printing apparatus of the first embodiment of the present invention. Figure 7 is a perspective assembled view of a primer printing apparatus according to a second embodiment of the present invention. The eighth drawing is a schematic view showing the use of the primer printing apparatus of the second embodiment of the present invention. 13 201041470 The ninth diagram is a third actual flow chart of the present invention. The tenth figure is a fourth actual flow chart of the present invention. The bottom of the bottom example of the example [Description of main components] 10 steps of the support printing method Step 11 of the printing method Vacuum suction zone 20 Printing plate 21 Opening blade 4 Heating module Packaging structure 51 Wafer 52 Tin ball 53 Substrate primer 7〇 second heating module steps S101 to S109 Steps S201 to S207 14