TWI585933B - Method and apparatus for ink marking - Google Patents

Method and apparatus for ink marking Download PDF

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Publication number
TWI585933B
TWI585933B TW104124595A TW104124595A TWI585933B TW I585933 B TWI585933 B TW I585933B TW 104124595 A TW104124595 A TW 104124595A TW 104124595 A TW104124595 A TW 104124595A TW I585933 B TWI585933 B TW I585933B
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Taiwan
Prior art keywords
ink
diluent
tray
control module
signal
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TW104124595A
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Chinese (zh)
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TW201705430A (en
Inventor
邱世杰
方藝霖
徐中于
施春豐
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日月光半導體製造股份有限公司
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Priority to TW104124595A priority Critical patent/TWI585933B/en
Priority to CN201610580872.9A priority patent/CN106394027B/en
Publication of TW201705430A publication Critical patent/TW201705430A/en
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Publication of TWI585933B publication Critical patent/TWI585933B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41KSTAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • B41K3/02Apparatus for stamping articles having integral means for supporting the articles to be stamped with stamping surface located above article-supporting surface
    • B41K3/04Apparatus for stamping articles having integral means for supporting the articles to be stamped with stamping surface located above article-supporting surface and movable at right angles to the surface to be stamped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41KSTAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • B41K3/54Inking devices

Description

油墨蓋印之方法及裝置 Ink stamping method and device

本揭露係有關油墨蓋印之方法及裝置。更具體而言,本揭露係有關油墨蓋印時油墨稀釋劑自動補償及混合之方法及裝置。 The present disclosure relates to a method and apparatus for ink stamping. More specifically, the present disclosure relates to a method and apparatus for automatically compensating and mixing ink thinner during ink stamping.

於半導體元件之製造過程中,通常會於半導體元件之封裝膠體之表面上上進行蓋印以便於對半導體元件進行一識別。而隨著半導體製程之演進,半導體元件之尺寸隨之縮小,因此蓋印技術上亦面臨許多挑戰。尤其在半導體元件之大量且快速製造之需求下,精確、清晰且高效率之蓋印技術係成為半導體元件製造中不可忽視之一個環節。 In the manufacturing process of the semiconductor device, stamping is usually performed on the surface of the encapsulant of the semiconductor device to facilitate identification of the semiconductor device. With the evolution of semiconductor processes, the size of semiconductor components has shrunk, so the stamping technology also faces many challenges. Especially in the large-scale and rapid manufacturing requirements of semiconductor components, accurate, clear and high-efficiency stamping technology has become a part of semiconductor component manufacturing.

本揭露之一方面係有關一種油墨蓋印之方法,在一實施例中,該方法包含:蓋印油墨於複數個工件之表面;由一控制模組接收一第一信號;及該控制模組回應於該第一信號進行以下操作:暫停蓋印油墨;添加一第一量之稀釋劑於該油墨中;攪拌該油墨使該第一量之該稀釋劑均勻混合於該油墨中;及進行蓋印油墨。 One aspect of the disclosure relates to a method for ink stamping. In one embodiment, the method includes: stamping ink on a surface of a plurality of workpieces; receiving a first signal by a control module; and the control module Responding to the first signal to: suspend the stamping ink; adding a first amount of diluent to the ink; stirring the ink to uniformly mix the first amount of the diluent in the ink; Printing ink.

本揭露之另一方面係有關一種用於油墨蓋印之裝置,在一實施例中,該裝置包含一控制模組、一處理機構、一蓋印頭機構、一稀釋劑儲存槽及一稀釋劑流量控制裝置。該處理機構用以承載及輸送及複數個工件,該處理機構連接該控制模組,且接受該控制模組之控制。該蓋印頭機構包含一油墨盤、一趕墨架及一膠頭座。該蓋印頭機構連 接該控制模組,且接受該控制模組之控制。該油墨盤用以容納一油墨,該趕墨架用以趕出該油墨。該膠頭座具有複數個膠頭,該等膠頭用以沾附該油墨,且將該油墨印至該處理機構上之該等工件。該稀釋劑儲存槽用以儲存一稀釋劑,且該稀釋劑儲存槽利用一管路添加該稀釋劑至該油墨盤。該稀釋劑流量控制裝置連接該控制模組,且接受該控制模組之控制以控制該稀釋劑添加至該油墨盤之量。 Another aspect of the disclosure relates to an apparatus for ink stamping. In one embodiment, the apparatus includes a control module, a processing mechanism, a capping mechanism, a diluent storage tank, and a diluent. Flow control device. The processing mechanism is configured to carry and transport a plurality of workpieces, and the processing mechanism is coupled to the control module and is controlled by the control module. The stamp head mechanism comprises an ink tray, an ink cartridge and a rubber head holder. The stamp head mechanism The control module is connected and controlled by the control module. The ink tray is for containing an ink, and the ink cartridge is used to drive out the ink. The glue head holder has a plurality of plastic heads for adhering the ink and printing the ink onto the workpieces on the processing mechanism. The diluent storage tank is used to store a diluent, and the diluent storage tank uses a line to add the diluent to the ink tray. The diluent flow control device is coupled to the control module and is controlled by the control module to control the amount of diluent added to the ink tray.

1‧‧‧用於油墨蓋印之裝置 1‧‧‧Device for ink stamping

1a‧‧‧用於油墨蓋印之裝置 1a‧‧‧Devices for ink stamping

10‧‧‧控制模組 10‧‧‧Control Module

12‧‧‧處理機構 12‧‧‧Processing agencies

13‧‧‧蓋印頭機構 13‧‧‧Printing head mechanism

14‧‧‧稀釋劑儲存槽 14‧‧‧Diluent storage tank

15‧‧‧稀釋劑流量控制裝置 15‧‧‧Diluent flow control device

16‧‧‧管路 16‧‧‧pipe

17‧‧‧檢測機構 17‧‧‧Test institutions

18‧‧‧工件 18‧‧‧Workpiece

19‧‧‧油墨 19‧‧‧Ink

20‧‧‧攪拌結構 20‧‧‧Agitating structure

121‧‧‧處理控制器 121‧‧‧Processing controller

131‧‧‧油墨盤 131‧‧‧Ink tray

131a‧‧‧第一區 131a‧‧‧First District

131b‧‧‧第二區 131b‧‧‧Second District

132‧‧‧趕墨架 132‧‧‧Inkjet rack

133‧‧‧膠頭座 133‧‧‧Adhesive seat

134‧‧‧刮刀 134‧‧‧ scraper

135‧‧‧刻板 135‧‧‧Stereo

135a‧‧‧刻痕圖案 135a‧‧‧Scratch pattern

136‧‧‧噴嘴頭 136‧‧・Nozzle head

137‧‧‧固定座 137‧‧‧ fixed seat

138‧‧‧斜坡 138‧‧‧ slope

139‧‧‧蓋印頭控制器 139‧‧‧Print head controller

151‧‧‧稀釋劑流量控制器 151‧‧‧Diluent flow controller

152‧‧‧電磁閥 152‧‧‧ solenoid valve

1331‧‧‧膠頭 1331‧‧‧ plastic head

圖1顯示根據本揭露一實施例的一種用於油墨蓋印之裝置之立體示意圖。 1 shows a perspective view of a device for ink stamping in accordance with an embodiment of the present disclosure.

圖2顯示圖1之用於油墨蓋印之裝置之系統圖。 Figure 2 shows a system diagram of the apparatus for ink stamping of Figure 1.

圖3顯示本揭露之用於油墨蓋印之裝置之另一實施例之系統圖。 Figure 3 shows a system diagram of another embodiment of the apparatus for ink stamping of the present disclosure.

圖4顯示圖1之蓋印頭機構之放大示意圖。 Figure 4 shows an enlarged schematic view of the stamping head mechanism of Figure 1.

圖5顯示圖1之用於油墨蓋印之裝置之正視示意圖。 Figure 5 is a front elevational view of the apparatus for ink capping of Figure 1.

圖6顯示圖1之用於油墨蓋印之裝置之作動示意圖。 Figure 6 is a schematic view showing the operation of the apparatus for ink stamping of Figure 1.

圖7顯示根據本揭露另一實施例的用於油墨蓋印之裝置之作動示意圖。 FIG. 7 is a schematic view showing the operation of the apparatus for ink capping according to another embodiment of the present disclosure.

圖8顯示根據本揭露一實施例的油墨蓋印之方法之流程示意圖。 FIG. 8 is a flow chart showing a method of ink stamping according to an embodiment of the present disclosure.

圖1顯示根據本揭露一實施例的一種用於油墨蓋印之裝置1之立體示意圖。圖2顯示圖1之用於油墨蓋印之裝置之系統圖。該裝置1包含一控制模組10、一處理機構(Handler)12、一蓋印頭機構13、一稀釋劑儲存槽14、一稀釋劑流量控制裝置15、一管路16及一檢測機構17。該控制模組10可為一單一可程式邏輯控制器(Programmable Logic Controller,PLC),由其發送控制信號至位於該稀釋劑流量控制裝置15中之一稀釋劑流量控制器151、位於該蓋印頭機構13中之一蓋 印頭控制器139及位於該處理機構12中之一處理控制器121。該稀釋劑流量控制器151、該蓋印頭控制器139及該處理控制器121可以是可程式邏輯控制器。或者,該控制模組10亦可由位於該稀釋劑流量控制裝置15中之稀釋劑流量控制器151、位於該蓋印頭機構13中之蓋印頭控制器139及位於該處理機構12中之處理控制器121所組成。 1 shows a perspective view of an apparatus 1 for ink stamping in accordance with an embodiment of the present disclosure. Figure 2 shows a system diagram of the apparatus for ink stamping of Figure 1. The device 1 includes a control module 10, a processing mechanism (Handler) 12, a capping mechanism 13, a diluent storage tank 14, a diluent flow control device 15, a conduit 16 and a detecting mechanism 17. The control module 10 can be a single programmable logic controller (PLC), which sends a control signal to a thinner flow controller 151 located in the diluent flow control device 15, located at the stamp One of the head mechanisms 13 The print head controller 139 and one of the processing controllers 12 are located in the processing controller 121. The diluent flow controller 151, the stamp head controller 139, and the process controller 121 may be programmable logic controllers. Alternatively, the control module 10 can also be processed by the diluent flow controller 151 located in the diluent flow control device 15, the capping head controller 139 located in the capping mechanism 13, and the processing located in the processing mechanism 12. The controller 121 is composed of.

圖3顯示本揭露之用於油墨蓋印之裝置1a之另一實施例之系統圖。本實施例之裝置1a與圖2之裝置1大致相同,其不同處如下所述。 在本實施例之裝置1a中,該控制模組10(圖2)可以是位於該處理機構12中之處理控制器121(亦即,該處理控制器121取代該控制模組10),由其發送控制信號至位於該稀釋劑流量控制裝置15中之稀釋劑流量控制器151及位於該蓋印頭機構13中之蓋印頭控制器139。 Figure 3 shows a system diagram of another embodiment of the apparatus 1a for ink stamping of the present disclosure. The apparatus 1a of the present embodiment is substantially the same as the apparatus 1 of Fig. 2, and the differences are as follows. In the device 1a of the embodiment, the control module 10 (FIG. 2) may be the processing controller 121 located in the processing mechanism 12 (ie, the processing controller 121 replaces the control module 10). A control signal is sent to the diluent flow controller 151 located in the diluent flow control device 15 and the stamp head controller 139 located in the head mechanism 13.

請再參考圖1及圖2,該處理機構12用以承載及輸送及複數個工件18(例如:半導體封裝元件),該處理機構12連接(例如:電性連接)該控制模組10,且接受該控制模組10之控制。在一實施例中,該處理機構12包含一處理控制器121,用以接受該控制模組10之控制,以控制該處理機構12之作動。或者,該處理控制器121本身即為該控制模組10(如圖3所示)。或者,該處理控制器121係位於該處理機構12之外,但仍控制該處理機構12之作動。 Referring to FIG. 1 and FIG. 2 again, the processing mechanism 12 is configured to carry and transport a plurality of workpieces 18 (eg, semiconductor package components), and the processing mechanism 12 is connected (eg, electrically connected) to the control module 10, and The control of the control module 10 is accepted. In one embodiment, the processing mechanism 12 includes a processing controller 121 for accepting control of the control module 10 to control the operation of the processing mechanism 12. Alternatively, the processing controller 121 itself is the control module 10 (as shown in FIG. 3). Alternatively, the process controller 121 is located outside of the processing mechanism 12, but still controls the operation of the processing mechanism 12.

該蓋印頭機構13位於該處理機構12上方,且包含一油墨盤131、一趕墨架132、一膠頭座133、一刮刀134及一刻板135。該蓋印頭機構13連接(例如:電性連接)該控制模組10(或該處理控制器121),且接受該控制模組10(或該處理控制器121)之控制。在一實施例中,該蓋印頭機構13包含一蓋印頭控制器139,用以接受該控制模組10(或該處理控制器121)之控制,以控制該蓋印頭機構13之作動。 或者,該蓋印頭控制器139係位於該蓋印頭機構13之外,但仍控制該 蓋印頭機構13之作動。該油墨盤131用以容納一油墨19。該趕墨架132係為一柵欄型式,用以趕出及/或攪拌該油墨19。該膠頭座133具有複數個膠頭1331,該等膠頭1331用以沾附該油墨19,且將該油墨19印至該處理機構12上之該等工件18。該刻板135之一表面具有複數個刻痕圖案135a,用以容納部分該油墨19。該刮刀134係為一片體,用以刮除位於該刻板135之表面上之油墨。 The stamping head mechanism 13 is located above the processing mechanism 12 and includes an ink tray 131, an ink cartridge 132, a rubber head holder 133, a doctor blade 134 and a stereotype 135. The cap mechanism 13 is connected (eg, electrically connected) to the control module 10 (or the process controller 121) and is controlled by the control module 10 (or the process controller 121). In one embodiment, the stamp head mechanism 13 includes a stamp head controller 139 for accepting control of the control module 10 (or the processing controller 121) to control the operation of the stamp head mechanism 13. . Alternatively, the stamp head controller 139 is located outside the cap head mechanism 13, but still controls the The operation of the stamping head mechanism 13 is performed. The ink tray 131 is for accommodating an ink 19. The ink cartridge 132 is a fence type for ejecting and/or agitating the ink 19. The rubber head holder 133 has a plurality of plastic heads 1331 for adhering the ink 19 and printing the ink 19 to the workpieces 18 on the processing mechanism 12. One surface of the stencil 135 has a plurality of scribe patterns 135a for accommodating a portion of the ink 19. The blade 134 is a piece for scraping off the ink on the surface of the plate 135.

該稀釋劑儲存槽14用以儲存一稀釋劑,且該稀釋劑儲存槽14利用該管路16添加該稀釋劑至該油墨盤131。在本實施例中,該稀釋劑儲存槽14係為一點滴瓶之態樣,且位於一固設於該處理機構12之架體上。該管路16係連接至該稀釋劑儲存槽14之下方。可以理解的是,該稀釋劑儲存槽14也可以是一容置槽之態樣,其位於該處理機構12內。 The diluent storage tank 14 is used to store a diluent, and the diluent storage tank 14 uses the line 16 to add the diluent to the ink tray 131. In this embodiment, the diluent storage tank 14 is in the form of a drop bottle and is located on a frame fixed to the processing mechanism 12. The line 16 is connected below the diluent storage tank 14. It can be understood that the diluent storage tank 14 can also be in the form of a receiving groove, which is located in the processing mechanism 12.

該稀釋劑流量控制裝置15連接(例如:電性連接)該控制模組10(或該處理控制器121),且接受該控制模組10(或該處理控制器121)之控制以控制該稀釋劑添加至該油墨盤131之量。在一實施例中,該稀釋劑流量控制裝置15包含一稀釋劑流量控制器151,用以接受該控制模組10(或該處理控制器121)之控制,以控制該稀釋劑流量控制裝置15之作動。或者,該稀釋劑流量控制器151係位於該稀釋劑流量控制裝置15之外,但仍控制該稀釋劑流量控制裝置15之作動。在本實施例中,該稀釋劑流量控制裝置15係位於位於一固設於該處理機構12之平台上。可以理解的是,該稀釋劑流量控制裝置15也可以整合至該處理機構12或該蓋印頭機構13內。該稀釋劑儲存槽14係利用該管路16連通至該稀釋劑流量控制裝置15。 The diluent flow control device 15 is connected (eg, electrically connected) to the control module 10 (or the process controller 121) and receives control of the control module 10 (or the process controller 121) to control the dilution. The amount of agent added to the ink tray 131. In one embodiment, the diluent flow control device 15 includes a diluent flow controller 151 for accepting control of the control module 10 (or the process controller 121) to control the diluent flow control device 15 Acting. Alternatively, the diluent flow controller 151 is located outside of the diluent flow control device 15, but still controls the actuation of the diluent flow control device 15. In the present embodiment, the diluent flow control device 15 is located on a platform fixed to the processing mechanism 12. It will be appreciated that the diluent flow control device 15 can also be integrated into the processing mechanism 12 or the head mechanism 13. The diluent storage tank 14 is connected to the diluent flow control device 15 by the line 16.

在本實施例中,該蓋印頭機構13更包含一攪拌結構20,用以進行自動攪拌該油墨19,使該稀釋劑均勻混合於該油墨19中。該攪拌結構20受該蓋印頭控制器139之控制,且其型式不拘,只要可執行攪拌 作業即可。在一實施例中,該攪拌結構20包含一擺動機構及該趕墨架132,該趕墨架132係連接至該擺動機構,該擺動機構受該蓋印頭控制器139之控制而帶動該趕墨架132之下端在該油墨中進行攪拌。 In the present embodiment, the stamp head mechanism 13 further includes a stirring structure 20 for automatically stirring the ink 19 to uniformly mix the diluent in the ink 19. The stirring structure 20 is controlled by the capping head controller 139, and the type thereof is not limited, as long as the stirring can be performed. You can do your homework. In one embodiment, the agitating structure 20 includes a swinging mechanism and the ink refilling frame 132. The ink refrigerating frame 132 is coupled to the swinging mechanism, and the swinging mechanism is controlled by the capping head controller 139 to drive the hurry. The lower end of the ink frame 132 is stirred in the ink.

如圖1及圖2所示,該裝置1更包括一噴嘴頭136,該噴嘴頭136可位於該油墨盤131之容納油墨之一區域(例如圖4之第二區131b)或鄰設於該油墨盤131,用以將該稀釋劑噴至該油墨盤131之第二區131b,其中較佳係將該稀釋劑噴至該油墨盤131之第二區131b之中央位置,使後續經攪拌後之油墨更加均勻。在本實施例中,該噴嘴頭136係利用一固定座137而固設於該油墨盤131上緣。該管路16係連通該噴嘴頭136及該稀釋劑流量控制裝置15,該稀釋劑係經由該噴嘴頭136添加至該油墨盤131,且該噴嘴頭136接受該稀釋劑流量控制裝置15之控制以控制該稀釋劑添加至該油墨盤131之量。於一實施例中,該稀釋劑流量控制裝置15係藉由一電磁閥152控制該稀釋劑添加至該油墨盤131之量。 As shown in FIG. 1 and FIG. 2, the apparatus 1 further includes a nozzle head 136, which may be located in an area of the ink tray 131 for accommodating ink (for example, the second area 131b of FIG. 4) or adjacent thereto. The ink tray 131 is used to spray the diluent to the second region 131b of the ink tray 131. Preferably, the diluent is sprayed to the central portion of the second region 131b of the ink tray 131 for subsequent stirring. The ink is more uniform. In the present embodiment, the nozzle head 136 is fixed to the upper edge of the ink tray 131 by a fixing base 137. The line 16 is connected to the nozzle head 136 and the diluent flow control device 15, and the diluent is added to the ink tray 131 via the nozzle head 136, and the nozzle head 136 is controlled by the diluent flow control device 15. The amount of the diluent added to the ink tray 131 is controlled. In one embodiment, the diluent flow control device 15 controls the amount of diluent added to the ink tray 131 by a solenoid valve 152.

如圖1所示,該裝置1更包括一檢測機構17,該檢測機構17監控蓋印於該等工件上油墨之圖案之品質。於一實施例中,該檢測機構17係一自動光學監測(Auto Optical Inspection,AOI)系統。在本實施例中,該檢測機構17係位於該處理機構12上工件18之移動路徑上方。然而可以理解的是,該檢測機構17也可以位於該處理機構12之外。 As shown in Figure 1, the apparatus 1 further includes a detection mechanism 17 that monitors the quality of the pattern of ink printed on the workpieces. In one embodiment, the detection mechanism 17 is an Auto Optical Inspection (AOI) system. In the present embodiment, the detecting mechanism 17 is located above the moving path of the workpiece 18 on the processing mechanism 12. However, it will be appreciated that the detection mechanism 17 may also be located outside of the processing mechanism 12.

圖4顯示圖1之蓋印頭機構之放大示意圖。該油墨盤131包含一第一區131a及一第二區131b。該刻板135位於該油墨盤131之第一區131a,該刻板135之一表面具有該等刻痕圖案135a。該油墨盤131係用以容納該油墨19,該油墨19係位於該油墨盤131之第二區131b,該稀釋劑係添加至該油墨盤131之第二區內131b之油墨19中。該趕墨架132係用以趕出及/或攪拌位於該油墨盤131之第二區內131b之油墨19及該 稀釋劑。該第二區131b具有一斜坡138,用以頂抵該趕墨架132,使得該趕墨架132可被動地略微上移,而將稀釋後之油墨19趕至位於該油墨盤131之第一區131a之該刻板135上。該刮刀134則係用以刮除該刻板135之該表面之油墨19,使得該油墨19僅位於該刻痕圖案135a內。 Figure 4 shows an enlarged schematic view of the stamping head mechanism of Figure 1. The ink tray 131 includes a first area 131a and a second area 131b. The stencil 135 is located in the first region 131a of the ink tray 131, and one surface of the stencil 135 has the scribe pattern 135a. The ink tray 131 is for accommodating the ink 19, and the ink 19 is located in the second region 131b of the ink tray 131, and the diluent is added to the ink 19 in the second region 131b of the ink tray 131. The ink cartridge 132 is configured to eject and/or agitate the ink 19 located in the second region 131b of the ink tray 131 and Thinner. The second zone 131b has a slope 138 for abutting against the ink ejector 132 such that the ink ejector 132 can be passively moved up slightly, and the diluted ink 19 is driven to the first of the ink trays 131. The plate 135 of the area 131a. The doctor blade 134 is used to scrape the ink 19 of the surface of the template 135 such that the ink 19 is only located within the score pattern 135a.

圖5顯示圖1之用於油墨蓋印之裝置之正視示意圖。同時參考圖4及圖5,該膠頭座133可下降以使其上之該等膠頭131沾附位於該刻板135之刻痕圖案135a內之油墨19。沾附後,該膠頭座133可上升以離開該位於該油墨盤131之該刻板135。此外,如圖5所示,該噴嘴頭136係安裝於該油墨盤131之上緣並與該管路16連接。 Figure 5 is a front elevational view of the apparatus for ink capping of Figure 1. 4 and 5, the glue head holder 133 can be lowered such that the plastic heads 131 thereon adhere to the ink 19 located in the score pattern 135a of the stencil 135. After being adhered, the headstock 133 can be raised to exit the stencil 135 located on the ink tray 131. Further, as shown in FIG. 5, the nozzle head 136 is attached to the upper edge of the ink tray 131 and connected to the conduit 16.

圖6顯示圖1之用於油墨蓋印之裝置之作動示意圖。在本實施例中,該油墨盤131可左右移動。首先,將該油墨19塗布於該刻板135上,此步驟詳述如下:將該刮刀134逆時針旋轉10度抬起,接著將該油墨盤131由右向左移動,以帶動該刮刀134後方的趕墨架132,此時該趕墨架132會因頂抵著該斜坡138(圖4)而沿著該斜坡138被動地略微上移,進而接觸該刻板135上表面。隨著該油墨盤131之持續向左移動,該趕墨架132持續將該油墨槽131第二區131b內的油墨19由左向右撥動塗布在置於該油墨盤131第一區131a中之該刻板135上表面。接著,該刮刀134順時針旋轉10度以重新下壓於該刻板135以完成油墨塗布(此時該刮刀134之下端及該趕墨架132之下端皆接觸該刻板135上表面最右側)。之後,將該油墨盤131由左向右移動,該刮刀134及該趕墨架132同時將該刻板135上表面的油墨19刮除,而保留在該刻板135之刻痕圖案135a內的油墨。 Figure 6 is a schematic view showing the operation of the apparatus for ink stamping of Figure 1. In the present embodiment, the ink tray 131 can be moved left and right. First, the ink 19 is applied to the stencil 135. The steps are detailed as follows: the razor 134 is rotated 10 degrees counterclockwise, and then the ink tray 131 is moved from right to left to drive the rear of the razor 134. The ink cartridge 132 is now inflated along the slope 138 by the top against the slope 138 (Fig. 4), thereby contacting the upper surface of the template 135. As the ink tray 131 continues to move to the left, the ink cartridge 132 continues to apply the ink 19 in the second region 131b of the ink tank 131 from left to right in the first region 131a of the ink tray 131. The upper surface of the plate 135. Next, the blade 134 is rotated 10 degrees clockwise to re-press the plate 135 to complete the ink coating (the lower end of the blade 134 and the lower end of the ink container 132 are in contact with the rightmost side of the upper surface of the plate 135). Thereafter, the ink tray 131 is moved from left to right, and the doctor blade 134 and the ink ejector 132 simultaneously scrape the ink 19 on the upper surface of the template 135 to retain the ink in the score pattern 135a of the template 135.

接著,該膠頭座133下降以使其上之該等膠頭1331於該油墨盤131中沾附油墨19(亦即,沾附位於該刻板135之刻痕圖案135a內之油墨),沾附後該膠頭座133上升以離開該油墨盤131。隨後,該油墨盤 131由右向左移動以使該膠頭座133與工件18之間淨空,此時該刮刀134逆時針旋轉10度抬起。接著,該膠頭座133再向下將油墨19轉印到工件18。最後,該膠頭座133上升至起始點。 Then, the rubber head holder 133 is lowered so that the plastic heads 1331 on the ink tray 131 are adhered to the ink tray 131 (that is, the ink in the notch pattern 135a of the template 135 is adhered), and adhered. The glue head holder 133 is then raised to leave the ink tray 131. Subsequently, the ink tray 131 is moved from right to left to make a clearance between the rubber head holder 133 and the workpiece 18, at which time the blade 134 is rotated 10 degrees counterclockwise. Next, the glue head holder 133 transfers the ink 19 down to the workpiece 18 again. Finally, the glue head holder 133 rises to the starting point.

可以理解的是,由於該油墨盤131可左右移動,因此,該噴嘴頭136及該固定座137可能不設於該油墨盤131上緣,而改設於該蓋印頭機構13之其他位置上。 It can be understood that, since the ink tray 131 can be moved to the left and right, the nozzle head 136 and the fixing seat 137 may not be disposed on the upper edge of the ink tray 131, but may be modified at other positions of the stamp head mechanism 13. .

圖7顯示根據本揭露另一實施例的用於油墨蓋印之裝置之作動示意圖。本實施例之裝置1a與圖1至圖6所示之裝置1大致相同,其不同處如下所述。在本實施例中,該油墨盤131不可移動,且其不位於該工件18之正上方。此外,該膠頭座133可上下左右移動,且該刮刀134及該趕墨架132亦可左右移動。首先,將該油墨19塗布於該刻板135上,此步驟詳述如下:將該刮刀134逆時針旋轉10度抬起,接著,該刮刀134及該趕墨架132一起由左向右移動,此時該趕墨架132會因頂抵著該斜坡138(圖4)而沿著該斜坡138被動地略微上移,進而接觸該刻板135上表面。隨著該刮刀134及該趕墨架132之持續向右移動,該趕墨架132持續將該油墨槽131第二區131b內的油墨19由左向右撥動塗布在置於該油墨盤131第一區131a中之該刻板135上表面。接著,該刮刀134順時針旋轉10度以重新下壓於該刻板135以完成油墨塗布(此時該刮刀134之下端及該趕墨架132之下端皆接觸該刻板135上表面最右側)。之後,將該刮刀134及該趕墨架132由右向左移動,該刮刀134及該趕墨架132同時將該刻板135上表面的油墨19刮除,而保留在該刻板135之刻痕圖案135a內的油墨。 FIG. 7 is a schematic view showing the operation of the apparatus for ink capping according to another embodiment of the present disclosure. The apparatus 1a of the present embodiment is substantially the same as the apparatus 1 shown in Figs. 1 to 6, and the differences are as follows. In the present embodiment, the ink tray 131 is immovable and is not located directly above the workpiece 18. In addition, the rubber head holder 133 can move up, down, left, and right, and the doctor blade 134 and the ink catcher frame 132 can also move left and right. First, the ink 19 is applied to the stencil 135. The steps are detailed as follows: the razor 134 is rotated 10 degrees counterclockwise, and then the razor 134 and the ink ejector 132 are moved from left to right. The ink ejector 132 will be passively moved up slightly along the slope 138 as a result of the abutment against the ramp 138 (Fig. 4), thereby contacting the upper surface of the stencil 135. As the doctor blade 134 and the ink ejector 132 continue to move to the right, the ink ejector 132 continues to apply the ink 19 in the second region 131b of the ink tank 131 from left to right to be placed on the ink tray 131. The upper surface of the slab 135 in the first zone 131a. Next, the blade 134 is rotated 10 degrees clockwise to re-press the plate 135 to complete the ink coating (the lower end of the blade 134 and the lower end of the ink container 132 are in contact with the rightmost side of the upper surface of the plate 135). Thereafter, the scraper 134 and the ink refilling frame 132 are moved from right to left, and the scraper 134 and the ink refilling frame 132 simultaneously scrape the ink 19 on the upper surface of the clinding plate 135, and the scoring pattern remaining on the clinding plate 135 The ink in 135a.

接著,該膠頭座133由右向左移動至該刻板135上方。接著,該膠頭座133下降以使其上之該等膠頭1331於該油墨盤131中沾附油墨19(亦即,沾附位於該刻板135之刻痕圖案135a內之油墨),沾附後該 膠頭座133上升以離開該油墨盤131。隨後,該膠頭座133由左向右移動至該工件18上方。接著,該膠頭座133再向下將油墨19轉印到工件18。最後,該膠頭座133上升至起始點。 Then, the rubber head holder 133 is moved from right to left over the stereotype plate 135. Then, the rubber head holder 133 is lowered so that the plastic heads 1331 on the ink tray 131 are adhered to the ink tray 131 (that is, the ink in the notch pattern 135a of the template 135 is adhered), and adhered. After that The rubber head holder 133 rises to leave the ink tray 131. Subsequently, the glue head holder 133 is moved from left to right over the workpiece 18. Next, the glue head holder 133 transfers the ink 19 down to the workpiece 18 again. Finally, the glue head holder 133 rises to the starting point.

圖8顯示根據本揭露一實施例的油墨蓋印之方法之流程示意圖。 首先,步驟801係啟動該處理控制器121(或該控制模組10(圖2)),以控制該油墨蓋印裝置1之進行自動生產(步驟802)。該油墨蓋印裝置1之自動生產即為上述蓋印油墨19於複數個工件18之表面之動作。接著,步驟803係該處理控制器121(或該控制模組10)是否會接收到一第一信號;如果不會,則重回步驟802進行自動生產;如果會,則停機(步驟804)以進行油墨之自動稀釋作業。在本實施例中,於滿足下列四個條件之一時,該處理控制器121(或該控制模組10)會接收該第一信號。 FIG. 8 is a flow chart showing a method of ink stamping according to an embodiment of the present disclosure. First, step 801 activates the processing controller 121 (or the control module 10 (FIG. 2)) to control automatic production of the ink stamping device 1 (step 802). The automatic production of the ink stamping device 1 is the action of the above-described stamping ink 19 on the surface of a plurality of workpieces 18. Next, step 803 is whether the processing controller 121 (or the control module 10) will receive a first signal; if not, return to step 802 for automatic production; if so, then stop (step 804) Perform automatic dilution of the ink. In this embodiment, the processing controller 121 (or the control module 10) receives the first signal when one of the following four conditions is met.

條件(1):該油墨蓋印裝置1之生產時間達到預設時間。由實驗結果可知,由於稀釋劑之揮發,每經過一小時,油墨盤131中之油墨19之濃度將增加濃度流速時間1秒。由於蓋印過程中油墨19之濃度必須維持在能夠達至一最佳蓋印品質之濃度,故可設定於該油墨蓋印裝置1生產達到一預設時間(例如:一個小時、一個半小時或兩個小時)即滿足一啟動條件並啟動該自動稀釋作業。因此,該處理控制器121(或該控制模組10)會接收到一具有週期性之計時信號(即該第一信號),其中該計時信號之一計時週期可為一定值(例如:一個小時、一個半小時或兩個小時)。然而由於油墨本身之品質會隨著累計使用時間之增加而降低,於另一實施例中,亦可設定一逐漸縮短之該計時週期,例如:於第一個兩小時期滿進行一次稀釋作業,接下來則間隔一小時進行一次稀釋作業;或是於第一個兩小時期滿進行一次稀釋作業,接下來隔一小時期滿後進行一次稀釋作業,接下來每半小時進行 一次稀釋作業。上述計時週期可基於所使用之油墨種類而調整。 Condition (1): The production time of the ink stamping device 1 reaches a preset time. From the experimental results, it is known that the concentration of the ink 19 in the ink tray 131 increases the concentration flow rate time by one second every one hour after the evaporation of the diluent. Since the concentration of the ink 19 during the stamping process must be maintained at a concentration capable of achieving an optimum stamping quality, the ink stamping device 1 can be set to be produced for a predetermined period of time (for example: one hour, one and a half hours or Two hours) that a start condition is met and the automatic dilution operation is initiated. Therefore, the processing controller 121 (or the control module 10) receives a periodic timing signal (ie, the first signal), wherein one of the timing signals can be a certain period (eg, one hour) , one and a half hours or two hours). However, since the quality of the ink itself may decrease as the cumulative use time increases, in another embodiment, a gradual shortening of the chronograph period may be set, for example, a dilution operation is performed after the first two hours. Then, the dilution operation is performed once every hour; or the dilution operation is completed after the first two hours, then the dilution operation is performed after the expiration of one hour, and then every half hour. One dilution operation. The above timing period can be adjusted based on the type of ink used.

條件(2):該油墨蓋印裝置1之生產數量達到一預設數量。由於油墨之品質會隨著蓋印之工件18之數量而漸漸變差,故每當該油墨蓋印裝置1累計蓋印該等工件18之生產數量達到一預設數量時(例如:150個或200個工件),可設定為滿足一啟動條件並啟動該自動稀釋作業。此時,該處理控制器121(或該控制模組10)會接收到一計數信號(即該第一信號)。 Condition (2): The number of productions of the ink stamping device 1 reaches a predetermined number. Since the quality of the ink gradually deteriorates with the number of stamped workpieces 18, each time the ink stamping device 1 cumulatively stamps the number of the workpieces 18 to a predetermined number (for example: 150 or 200 workpieces) can be set to meet a start condition and start the automatic dilution operation. At this time, the processing controller 121 (or the control module 10) receives a count signal (ie, the first signal).

條件(3):該油墨蓋印裝置1之閒置時間達到一預設時間。由於即使該裝置1閒置而並未進行油墨之蓋印,閒置之油墨中之稀釋劑仍會漸漸揮發,而導致油墨濃度過高,故可設定於該油墨蓋印裝置1每閒置一預設時間(例如:一個小時、一個半小時或兩個小時)即滿足一啟動條件並啟動該自動稀釋作業。此時,該處理控制器121(或該控制模組10)會接收到一計時信號(即該第一信號)。 Condition (3): The idle time of the ink stamping device 1 reaches a preset time. Since the ink is not volatilized even if the device 1 is idle, the thinner in the idle ink gradually volatilizes, resulting in an ink concentration that is too high, so that the ink stamping device 1 can be set to idle for a preset time. (For example: one hour, one and a half hours or two hours) that a start condition is met and the automatic dilution operation is initiated. At this time, the processing controller 121 (or the control module 10) receives a timing signal (ie, the first signal).

條件(4):一油墨濃度偵測器偵測到油墨濃度高於一預設值。在一實施例中,可增設一油墨濃度偵測器以即時監控油墨濃度。不論該裝置1是否在進行油墨之蓋印,只要當該油墨濃度偵測器偵測到油墨濃度高於一預設值即滿足一啟動條件並啟動該自動稀釋作業。此時,該處理控制器121(或該控制模組10)會接收到一濃度信號(即該第一信號)。 Condition (4): An ink concentration detector detects that the ink concentration is higher than a predetermined value. In one embodiment, an ink concentration detector can be added to monitor the ink concentration in real time. Regardless of whether the device 1 is performing ink stamping, if the ink concentration detector detects that the ink concentration is higher than a preset value, a start condition is satisfied and the automatic dilution operation is started. At this time, the processing controller 121 (or the control module 10) receives a concentration signal (ie, the first signal).

當該處理控制器121(或該控制模組10)於上述條件(1)-(4)之任一條件下接收到該第一信號時,該處理控制器121(或該控制模組10)回應於該第一信號進行以下操作。步驟804係停機,亦即,該處理控制器121(或該控制模組10)控制該油墨蓋印裝置1暫停蓋印油墨。也就是,停止該處理機構12及該蓋印頭機構13。接著,步驟805係利用該稀釋劑流量控制裝置15添加稀釋劑於位於該油墨盤131第二 區131b內之該油墨19中。此時,所添加之稀釋劑之劑量為一第一量。 由實驗結果可知,添加10ml稀釋劑會使得油墨的濃度流速時間減少1秒,因此,在本實施例中,該第一量設定為10ml。添加稀釋劑之方式為利用上述稀釋劑流量控制裝置15將位於該稀釋劑儲存槽14之稀釋劑經由該管路16及該噴嘴頭136添加至該油墨盤131之第二區內131b之油墨19中(圖4)。該稀釋劑流量控制裝置15中可具有多組不同參數以因應不同油墨之種類以調整該第一量。接著,步驟806係通知該蓋印頭控制器139以利用一攪拌結構20進行自動攪拌該油墨,使該第一量之該稀釋劑均勻混合於該油墨中。該攪拌結構20受該蓋印頭控制器139之控制,且其型式不拘,只要可執行攪拌作業即可。在本實施例中,該攪拌結構20包含一擺動機構及該趕墨架132,該趕墨架132係連接至該擺動機構,該擺動機構受該蓋印頭控制器139之控制而帶動該趕墨架132之下端在該油墨中進行攪拌。除上述條件(1)-(3)之任一條件之外,於另一實施例中,亦可由一手動開關提供該第一信號至該處理控制器121(或該控制模組10),以進行上述添加稀釋劑之動作。 When the processing controller 121 (or the control module 10) receives the first signal under any of the conditions (1)-(4), the processing controller 121 (or the control module 10) The following operations are performed in response to the first signal. Step 804 is stopped, that is, the processing controller 121 (or the control module 10) controls the ink stamping device 1 to pause the printing of the ink. That is, the processing mechanism 12 and the stamp head mechanism 13 are stopped. Next, step 805 uses the diluent flow control device 15 to add a diluent to the second ink tray 131. The ink 19 in the region 131b. At this time, the dose of the added diluent is a first amount. From the experimental results, it was found that the addition of 10 ml of the diluent reduced the concentration flow time of the ink by 1 second, and therefore, in the present embodiment, the first amount was set to 10 ml. The diluent is added by the diluent flow control device 15 to add the diluent located in the diluent storage tank 14 to the ink 19 in the second zone 131b of the ink tray 131 via the line 16 and the nozzle head 136. Medium (Figure 4). The diluent flow control device 15 can have multiple sets of different parameters to adjust the first amount in response to different ink types. Next, step 806 informs the stamp head controller 139 to automatically agitate the ink using a stirring structure 20 to uniformly mix the first amount of the diluent in the ink. The agitating structure 20 is controlled by the capping head controller 139, and its type is not limited as long as a stirring operation can be performed. In this embodiment, the agitating structure 20 includes a swinging mechanism and the ink refilling frame 132. The ink refrigerating frame 132 is coupled to the swinging mechanism, and the swinging mechanism is controlled by the capping head controller 139 to drive the hurry. The lower end of the ink frame 132 is stirred in the ink. In addition to any of the conditions (1)-(3) above, in another embodiment, the first signal may be provided by the manual switch to the processing controller 121 (or the control module 10) to The above action of adding a diluent is performed.

接著,步驟807係測試蓋印一假片。步驟808係檢測該假片之品質,藉由確認蓋印該假片之品質以確認該油墨之濃度。此檢測步驟可由該檢測機構17自動進行或由人工進行。若蓋印該假片之品質合格,則重回步驟802進行自動生產,亦即,進行蓋印油墨於工件18。倘若該假片之品質不合格(油墨濃度過高),則由該檢測機構17或由操作員發出一第二信號至該處理控制器121(或該控制模組10)。該第二信號可以由該檢測機構17自動發出,或由操作員利用一手動開關發出。該處理控制器121(或該控制模組10)回應於該第二信號進行以下操作。 Next, step 807 tests to stamp a dummy. Step 808 detects the quality of the dummy sheet and confirms the density of the ink by confirming the quality of the printed sheet. This detection step can be performed automatically by the detection mechanism 17 or manually. If the quality of the stamp is qualified, then return to step 802 for automatic production, i.e., stamping ink on the workpiece 18. If the quality of the dummy is unacceptable (the ink concentration is too high), a second signal is sent from the detecting mechanism 17 or the operator to the processing controller 121 (or the control module 10). The second signal can be automatically issued by the detection mechanism 17 or by an operator using a manual switch. The processing controller 121 (or the control module 10) performs the following operations in response to the second signal.

重新回到步驟804之停機步驟,亦即,該處理控制器121(或該 控制模組10)控制該油墨蓋印裝置1暫停蓋印油墨。也就是,停止該處理機構12及該蓋印頭機構13。接著,步驟805係利用該稀釋劑流量控制裝置15添加稀釋劑於該油墨19中。此時,所添加之稀釋劑之劑量為一第二量。該第二量係與該第一量係相同或不同。添加稀釋劑之方式為利用上述稀釋劑流量控制裝置15將位於該稀釋劑儲存槽14之稀釋劑經由該管路16及該噴嘴頭136添加至該油墨盤131之第二區內131b之油墨19中(圖4)。接著,步驟806係通知該蓋印頭控制器139以利用該攪拌結構20進行自動攪拌該油墨,使該第二量之該稀釋劑均勻混合於該油墨中。接著,步驟807係測試蓋印一假片。步驟808係檢測該假片之品質,若蓋印該假片之品質合格,則重回步驟802進行自動生產。 Returning to the shutdown step of step 804, that is, the processing controller 121 (or the The control module 10) controls the ink stamping device 1 to pause the printing of the ink. That is, the processing mechanism 12 and the stamp head mechanism 13 are stopped. Next, step 805 uses the diluent flow control device 15 to add diluent to the ink 19. At this time, the dose of the added diluent is a second amount. The second amount is the same as or different from the first amount. The diluent is added by the diluent flow control device 15 to add the diluent located in the diluent storage tank 14 to the ink 19 in the second zone 131b of the ink tray 131 via the line 16 and the nozzle head 136. Medium (Figure 4). Next, step 806 informs the stamp head controller 139 to automatically agitate the ink using the agitation structure 20 to uniformly mix the second amount of the diluent into the ink. Next, step 807 tests to stamp a dummy. Step 808 is to detect the quality of the dummy piece. If the quality of the dummy piece is stamped, the process returns to step 802 for automatic production.

本揭露之油墨蓋印之方法及裝置,由於其可自動補償及混合稀釋劑,因此可確保油墨蓋印過程中油墨之濃度,進而可達到最佳之蓋印品質。此外,該稀釋劑之補償及混合可經由自動化來完成,亦即,可改善習知以人工方式進行稀釋作業而耗費過多時間之問題,採用本揭露之油墨蓋印之方法及裝置可節省作業時間,提高生產效能,而且可減少人力之配置。 The method and device for ink stamping of the present disclosure can ensure the concentration of the ink during the ink stamping process, thereby achieving the best stamping quality, since it can automatically compensate and mix the diluent. In addition, the compensation and mixing of the diluent can be completed by automation, that is, the problem that the conventional manual dilution operation takes too much time can be improved, and the method and apparatus for ink stamping of the present disclosure can save operation time. Improve production efficiency and reduce manpower configuration.

如本文中所使用且不另外定義,術語「大致」、「實質上」及「約」用於描述並考慮較小變化。當與事件或情形結合使用時,該術語可係指其中事件或情形明確發生之情況以及其中事件或情形極近似於發生之情況。舉例而言,該術語可係指小於或等於±10%,如小於或等於±5%、小於或等於±4%、小於或等於±3%、小於或等於±2%、小於或等於±1%、小於或等於±0.5%、小於或等於±0.1%或小於或等於±0.05%。 As used herein and without additional definitions, the terms "substantially", "substantially" and "about" are used to describe and consider minor variations. When used in connection with an event or circumstance, the term may refer to a situation in which an event or circumstance occurs explicitly and where the event or circumstance is very similar. For example, the term can mean less than or equal to ±10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1 %, less than or equal to ±0.5%, less than or equal to ±0.1% or less than or equal to ±0.05%.

另外,有時在本文中按範圍格式呈現量、比率及其他數值。應理解,此類範圍格式是為了便利及簡潔起見而使用,且應靈活地理 解,不僅包括明確地指定為範圍限制之數值,而且包括涵蓋於該範圍內之所有個別數值或子範圍,如同明確地指定每一數值及子範圍一般。 In addition, quantities, ratios, and other values are sometimes presented in a range format herein. It should be understood that such range formats are used for convenience and brevity and should be flexible and geographically The solution includes not only the numerical value of the range limitation, but also all individual values or sub-ranges that are included in the range, as if each value and sub-range are explicitly specified.

雖然已參考本發明之特定實施例描述並說明本發明,但此等描述及說明並不限制本發明。熟習此項技術者應理解,在不脫離如所申請專利範圍界定之本發明的真實精神及範圍之情況下,可做出各種改變且可用等效物替代。圖示可能未必按比例繪製。歸因於製造製程及容限,本發明中之藝術再現與實際設備之間可存在區別。可存在並未特定說明之本發明的其他實施例。應將本說明書及圖式視為說明性之而非限制性的。可做出修改,以使特定情況、材料、物質組成、方法或製程適應於本發明之目標、精神及範圍。所有此類修改都意欲屬於在此申請專利範圍之範圍內。雖然本文揭示之方法已參考按特定次序執行之特定操作加以描述,但應理解,可在不脫離本發明之教示之情況下組合、細分或重新排序這些操作以形成等效方法。因此,除非本文中特別指示,否則操作之次序及分組並非本發明之限制。 The present invention has been described and illustrated with reference to the particular embodiments of the invention. It will be understood by those skilled in the art that various changes can be made and substituted by equivalents without departing from the true spirit and scope of the invention as defined by the appended claims. The illustrations may not necessarily be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the artistic representations of the present invention and actual devices. There may be other embodiments of the invention that are not specifically described. The description and drawings are to be regarded as illustrative rather Modifications may be made to adapt a particular situation, material, material composition, method or process to the object, spirit and scope of the invention. All such modifications are intended to fall within the scope of the patent application. Although the methods disclosed herein have been described with reference to the specific operations performed in a particular order, it is understood that these operations can be combined, sub-divided or re-ordered to form an equivalent method without departing from the teachings of the invention. Therefore, the order of operations and groupings are not limiting of the invention unless specifically indicated herein.

1‧‧‧用於油墨蓋印之裝置 1‧‧‧Device for ink stamping

12‧‧‧處理機構 12‧‧‧Processing agencies

13‧‧‧蓋印頭機構 13‧‧‧Printing head mechanism

131‧‧‧油墨盤 131‧‧‧Ink tray

132‧‧‧趕墨架 132‧‧‧Inkjet rack

133‧‧‧膠頭座 133‧‧‧Adhesive seat

1331‧‧‧膠頭 1331‧‧‧ plastic head

134‧‧‧刮刀 134‧‧‧ scraper

135‧‧‧刻板 135‧‧‧Stereo

136‧‧‧噴嘴頭 136‧‧・Nozzle head

137‧‧‧固定座 137‧‧‧ fixed seat

14‧‧‧稀釋劑儲存槽 14‧‧‧Diluent storage tank

15‧‧‧稀釋劑流量控制裝置 15‧‧‧Diluent flow control device

16‧‧‧管路 16‧‧‧pipe

17‧‧‧檢測機構 17‧‧‧Test institutions

18‧‧‧工件 18‧‧‧Workpiece

19‧‧‧油墨 19‧‧‧Ink

Claims (24)

一種油墨蓋印之方法,其包含:蓋印油墨於複數個工件之表面;由一控制模組接收一第一信號;及該控制模組回應於該第一信號進行以下操作:暫停蓋印油墨;添加一第一量之稀釋劑於該油墨中;攪拌該油墨使該第一量之該稀釋劑均勻混合於該油墨中;及進行蓋印油墨。 A method for ink stamping, comprising: stamping ink on a surface of a plurality of workpieces; receiving a first signal by a control module; and the control module responding to the first signal to perform the following operations: pausing the stamping ink Adding a first amount of a diluent to the ink; agitating the ink to uniformly mix the first amount of the diluent in the ink; and performing a stamping ink. 如請求項1之方法,進一步包含一測試蓋印一假片之步驟,並藉由確認蓋印該假片之品質以確認該油墨之濃度。 The method of claim 1, further comprising the step of testing a stamp to confirm the density of the ink by confirming the quality of the stamp. 如請求項2之方法,其中若確認該油墨之濃度過高,則該控制模組回應於一第二信號進行以下操作:暫停蓋印油墨;添加一第二量之稀釋劑於該油墨中;攪拌該油墨使該第二量之該稀釋劑均勻混合於該油墨中;及進行蓋印油墨。 The method of claim 2, wherein if the concentration of the ink is too high, the control module performs the following operations in response to a second signal: pausing the printing ink; adding a second amount of the diluent to the ink; The ink is agitated to uniformly mix the second amount of the diluent in the ink; and the stamping ink is applied. 如請求項3之方法,其中該第一量係與該第二量相同。 The method of claim 3, wherein the first quantity is the same as the second quantity. 如請求項3之方法,其中該第一量係與該第二量不同。 The method of claim 3, wherein the first quantity is different from the second quantity. 如請求項3之方法,其中該第二信號係回應於一手動開關而發出。 The method of claim 3, wherein the second signal is issued in response to a manual switch. 如請求項1之方法,其中該第一信號係具有週期性之一計時信號。 The method of claim 1, wherein the first signal has a periodic timing signal. 如請求項7之方法,其中該計時信號之一計時週期係一定值。 The method of claim 7, wherein one of the timing signals has a certain period of time. 如請求項7之方法,其中該計時信號之一計時週期係逐漸縮短。 The method of claim 7, wherein the timing period of one of the timing signals is gradually shortened. 如請求項7之方法,其中該計時信號之一計時週期可根據該油墨之種類調整。 The method of claim 7, wherein the timing period of one of the timing signals is adjustable according to the type of the ink. 如請求項1之方法,其中該第一信號係一計數信號,該計數信號係於累計蓋印該等工件之一預設數量時發出。 The method of claim 1, wherein the first signal is a counting signal, and the counting signal is issued when the preset number of the workpieces is cumulatively stamped. 如請求項1之方法,進一步包含一監控蓋印於該等工件上油墨之圖案之品質之步驟。 The method of claim 1 further comprising the step of monitoring the quality of the pattern of ink printed on the workpieces. 一種用於油墨蓋印之裝置,其包含:一控制模組;一處理機構,用以承載及輸送及複數個工件,該處理機構連接該控制模組,且接受該控制模組之控制;一蓋印頭機構,包含一油墨盤、一趕墨架及一膠頭座,該蓋印頭機構連接該控制模組,且接受該控制模組之控制,該油墨盤用以容納一油墨,該趕墨架用以趕出該油墨,該膠頭座具有複數個膠頭,該等膠頭用以沾附該油墨,且將該油墨印至該處理機構上之該等工件;一稀釋劑儲存槽,用以儲存一稀釋劑,且該稀釋劑儲存槽利用一管路添加該稀釋劑至該油墨盤;及一稀釋劑流量控制裝置,連接該控制模組,且接受該控制模組之控制以控制該稀釋劑添加至該油墨盤之量。 An apparatus for ink stamping, comprising: a control module; a processing mechanism for carrying and conveying and a plurality of workpieces, the processing mechanism being connected to the control module and receiving control of the control module; The stamping head mechanism comprises an ink tray, an ink cartridge and a rubber head holder. The stamping head mechanism is connected to the control module and is controlled by the control module. The ink tray is for accommodating an ink. The ink cartridge is used to drive out the ink, the rubber head holder has a plurality of plastic heads for adhering the ink, and printing the ink to the workpieces on the processing mechanism; a diluent storage a tank for storing a diluent, wherein the diluent storage tank uses a pipeline to add the diluent to the ink tray; and a diluent flow control device connected to the control module and controlled by the control module To control the amount of diluent added to the ink tray. 如請求項13之裝置,其中該控制模組係為一可程式邏輯控制器(Programmable Logic Controller,PLC)。 The device of claim 13, wherein the control module is a Programmable Logic Controller (PLC). 如請求項13之裝置,其中該蓋印頭機構更包含一刮刀及一刻板,該油墨盤包含一第一區及一第二區,該刻板之一表面具有 複數個刻痕圖案,該刻板位於該油墨盤之第一區,該油墨係位於該油墨盤之第二區,該稀釋劑係添加至該油墨盤之第二區內之油墨,該趕墨架用以趕出位於該油墨盤之第二區內之油墨及該稀釋劑,且將稀釋後之油墨趕至位於該油墨盤之第一區之該刻板上,該刮刀係用以刮除該刻板之該表面之油墨,該等膠頭用以沾附位於該刻板之刻痕圖案內之油墨。 The device of claim 13, wherein the capping mechanism further comprises a scraper and a cliche, the ink disc comprising a first zone and a second zone, one surface of the one of the plates having a plurality of score patterns, the template is located in a first area of the ink tray, the ink is located in a second area of the ink tray, and the diluent is added to the ink in the second area of the ink tray, the ink cartridge Used to drive out the ink and the diluent located in the second zone of the ink tray, and drive the diluted ink to the stencil on the first zone of the ink tray, the squeegee is used to scrape the stencil The ink of the surface, the glue head is used to adhere the ink located in the nick pattern of the stencil. 如請求項15之裝置,更包括一噴嘴頭,位於該油墨盤之第二區,該管路係連通該噴嘴頭,該稀釋劑係經由該噴嘴頭添加至該油墨盤之第二區,且該噴嘴頭接受該稀釋劑流量控制裝置之控制以控制該稀釋劑添加至該油墨盤之量。 The device of claim 15 further comprising a nozzle head located in the second region of the ink tray, the conduit being connected to the nozzle tip, the diluent being added to the second region of the ink tray via the nozzle tip, and The nozzle tip is controlled by the diluent flow control device to control the amount of diluent added to the ink tray. 如請求項13之裝置,更包括一噴嘴頭,鄰設於該油墨盤,該管路係連通該噴嘴頭,該稀釋劑係經由該噴嘴頭添加至該油墨盤,且該噴嘴頭接受該稀釋劑流量控制裝置之控制以控制該稀釋劑添加至該油墨盤之量。 The device of claim 13, further comprising a nozzle head adjacent to the ink tray, the pipeline is connected to the nozzle head, the diluent is added to the ink tray via the nozzle head, and the nozzle head receives the dilution Control of the flow control device to control the amount of diluent added to the ink tray. 如請求項13之裝置,其中該控制模組回應於一第一信號而進行以下操作:停止該處理機構及該蓋印頭機構;控制該稀釋劑流量控制裝置以添加一第一量之稀釋劑於該油墨盤中;控制該趕墨架以攪拌該油墨使該第一量之該稀釋劑於該油墨盤中均勻混合;及啟動該處理機構及該蓋印頭機構。 The device of claim 13, wherein the control module performs the following operations in response to a first signal: stopping the processing mechanism and the stamp head mechanism; and controlling the diluent flow control device to add a first amount of thinner In the ink tray; controlling the ink cartridge to agitate the ink to uniformly mix the first amount of the diluent in the ink tray; and initiating the processing mechanism and the stamp head mechanism. 如請求項18之裝置,其中該第一信號係具有週期性之一計時信號。 The device of claim 18, wherein the first signal has a periodic timing signal. 如請求項19之裝置,其中該計時信號之一計時週期係一定值。 The device of claim 19, wherein one of the timing signals has a certain period of time. 如請求項19之裝置,其中該計時信號之一計時週期係逐漸縮短。 The apparatus of claim 19, wherein the timing period of one of the timing signals is gradually shortened. 如請求項19之裝置,其中該計時信號之一計時週期可根據該油墨之種類調整。 The device of claim 19, wherein the timing period of one of the timing signals is adjustable according to the type of the ink. 如請求項18之裝置,其中該第一信號係一計數信號,該計數信號係於累計蓋印該等工件中之一預設數量時發出。 The device of claim 18, wherein the first signal is a count signal that is issued when a predetermined number of the workpieces are cumulatively stamped. 如請求項13之裝置,進一步包含一檢測機構,用以監控蓋印於該等工件上油墨之圖案之品質。 The apparatus of claim 13 further comprising a detection mechanism for monitoring the quality of the pattern of ink printed on the workpieces.
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