CN113438825A - SMT (surface mount technology) chip mounting method and LED (light emitting diode) packaging device - Google Patents
SMT (surface mount technology) chip mounting method and LED (light emitting diode) packaging device Download PDFInfo
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- CN113438825A CN113438825A CN202110732683.XA CN202110732683A CN113438825A CN 113438825 A CN113438825 A CN 113438825A CN 202110732683 A CN202110732683 A CN 202110732683A CN 113438825 A CN113438825 A CN 113438825A
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- 238000000034 method Methods 0.000 title claims abstract description 73
- 238000004806 packaging method and process Methods 0.000 title abstract description 7
- 238000005516 engineering process Methods 0.000 title description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 82
- 230000001680 brushing effect Effects 0.000 claims abstract description 43
- 229910000679 solder Inorganic materials 0.000 claims abstract description 23
- 238000005476 soldering Methods 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims abstract description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 10
- 239000010959 steel Substances 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 5
- 238000007791 dehumidification Methods 0.000 claims description 4
- 239000011324 bead Substances 0.000 abstract description 20
- 238000010586 diagram Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 235000019580 granularity Nutrition 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses an SMT chip mounting method and an LED packaging device, wherein the SMT chip mounting method comprises the following steps: step S10, brushing tin for the first time: printing solder paste on the PCB; step S20, first reflow: sending the PCB into a reflow oven for reflow soldering; step S30, brushing tin for the second time: taking the PCB out of the reflow oven, and printing solder paste on the PCB again; step S40, die attachment: pasting glue on the PCB, and pasting a component on the PCB; step S50, second reflow soldering: and sending the PCB with the attached components into a reflow furnace again for reflow soldering. On the basis of the prior art process flow, before the chip is attached, the tin brushing and reflow soldering processes are added, so that the voidage is reduced, tin beads can be avoided, the voidage is less than 3%, the proportion is less than 0.1%, and no tin beads larger than 10um are generated.
Description
Technical Field
The invention relates to the technical field of SMT (surface mount technology) chip mounting, in particular to a SMT chip mounting method and an LED packaging device.
Background
The Circuit of the existing LED packaging products is conducted by SMT reflow soldering, the SMT paster refers to the abbreviation of a series of process flows processed on the basis of a PCB (printed Circuit Board), and the PCB is a printed Circuit board. SMT is an abbreviation of Surface mount Technology (Surface Mounted Technology) and is one of the most popular techniques and processes in the electronic assembly industry.
The SMT process has high production efficiency and is easy for automatic management, but the key indexes, namely the voidage and the tin bead management and control are not easy to control, at present, the standard definition of the voidage in the industry is generally less than 15% -35%, and the standard definition of the tin bead is generally less than 200 um. The voidage is too high, which indicates that the material is not in good contact with the PCB after welding and influences heat dissipation; the tin bead is too large, and the risk of fatal short circuit exists.
The reasons for the above two are: as shown in fig. 1 and 2, in the current process, a chip or other components attached with a solder paste are inevitably pressed downward, and the key bonding material solder paste is composed of a plurality of small granular media, and the pressure causes gaps to be generated when the solder paste is bonded with a PAD of a PCB PAD (PAD) or extrudes granular solder balls out of the PAD, and a larger void ratio and solder balls are generated after high-temperature reflow soldering.
Disclosure of Invention
The invention mainly aims to provide an SMT chip mounting method and an LED packaging device, aiming at reducing the void ratio in the SMT chip mounting process and avoiding generating tin beads.
In order to achieve the above object, the present invention provides an SMT sheet mounting method, comprising the steps of:
step S10, brushing tin for the first time: printing solder paste on the PCB;
step S20, first reflow: sending the PCB into a reflow oven for reflow soldering;
step S30, brushing tin for the second time: taking the PCB out of the reflow oven, and printing solder paste on the PCB again;
step S40, die attachment: pasting glue on the PCB, and pasting a component on the PCB;
step S50, second reflow soldering: and sending the PCB with the attached components into a reflow furnace again for reflow soldering.
A further technical solution of the present invention is that, before the step S10, the method further includes:
step S00, dehumidification: and dehumidifying the PCB.
The further technical scheme of the invention is that in the step S00, the PCB is dehumidified for 30-60min at the temperature of 150-170 ℃.
The further technical scheme of the invention is that in the step S10 and the step S30, the thickness of the steel mesh adopted in the tin brushing process is 0.06-0.12 mm.
In a further technical solution of the present invention, in the steps S10 and S30, the area of the open hole of the steel mesh is 60% of the area of the pad.
The further technical scheme of the invention is that in the step S20 and the step S50, the furnace temperature curve of the reflow furnace is matched with the melting point curve of the solder paste.
The further technical scheme of the invention is that a heating-up area and a cooling-down area are arranged in the reflow furnace, in the step S20 and the step S50, the temperature of the PCB board is raised to the melting point temperature of the solder paste within 1-5min of the heating-up area, and the detention time of the PCB board within the cooling-down area is 1-5 min.
The further technical scheme of the invention is that a reflow zone is arranged in the reflow furnace, and the residence time of the PCB in the reflow zone is 50-150 s.
The further technical scheme of the invention is that in the step S20 and the step S50, the welding speed is 50-100 mm/min.
In order to achieve the above object, the present invention further provides an LED package device, which is manufactured by the SMT chip mounting method described above.
The SMT chip mounting method and the LED packaging device have the advantages that: on the basis of the prior art process flow, before the chip is attached, the tin brushing and reflow soldering processes are added, so that the voidage is reduced, tin beads can be avoided, the voidage is less than 3%, the proportion is less than 0.1%, and no tin beads larger than 10um are generated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of a process flow of a SMT patch in the prior art;
FIG. 2 is a schematic diagram of an LED light source using a prior art SMT chip process;
FIG. 3 is a schematic process flow diagram of a first embodiment of the SMT chip method of the invention;
FIG. 4 is a schematic diagram of an LED light source configuration using a process flow of the SMT chip bonding method of the invention;
FIG. 5 is a schematic process flow diagram of a second embodiment of the SMT chip method of the invention;
FIG. 6 is a diagram illustrating the corresponding phenomenon in a process flow using SMT according to the prior art;
FIG. 7 is a diagram illustrating the corresponding phenomenon in the process flow of the SMT patch method of the present invention;
FIG. 8 is a schematic diagram showing the appearance of the main functional areas of a process flow using a SMT patch of the prior art;
FIG. 9 is a schematic diagram showing the appearance of the main functional areas of the process flow using the SMT chip method of the present invention.
The objects, features and advantages of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a solution in consideration of the fact that the SMT mounting scheme in the prior art is easy to generate larger voidage and tin beads.
The SMT chip mounting method adopts the technical scheme that the procedures of printing solder paste and reflow soldering are added on the flow in the prior art once more. The first tin brushing is that no extruded tin is combined with the PCB PAD, the second tin brushing is that the first tin is combined with the second tin brushing, and no cavity or tin bead is generated twice.
Specifically, referring to fig. 3 and 4, the present invention provides an SMT pick and place method, and a preferred embodiment of the SMT pick and place method of the present invention includes the following steps:
step S10, brushing tin for the first time: and printing solder paste on the PCB.
It is worth emphasizing that in the first tin brushing process, the tin and the PCB are naturally fused without extrusion, and the tin and the PCB can be well combined.
In the embodiment, the thickness of the steel mesh adopted in the first tin brushing process is 0.06-0.12mm, and the open area of the steel mesh is 60% of the area of the bonding pad.
Step S20, first reflow: and sending the PCB into a reflow oven for reflow soldering.
In the first reflow soldering process, the furnace temperature curve of the reflow furnace is matched with the melting point curve of the solder paste.
The reflow furnace is internally provided with an heating area, a reflow area and a cooling area, wherein the PCB is heated to the melting point temperature of the solder paste within 1-5min of the heating area, the detention time within 1-5min of the cooling area is 50-150s of the reflow area. The welding speed is 50-100 mm/min.
Step S30, brushing tin for the second time: and taking the PCB out of the reflow oven, and printing the solder paste on the PCB again.
It is important to emphasize that during the second brushing, the tin and tin are combined with the medium, similarly compatible, and will be well combined even if a certain pressure exists, so that voids and tin beads can be avoided after die attachment and the second reflow.
The thickness of the steel mesh adopted in the second tin brushing process is 0.06-0.12mm, and the open area of the steel mesh is 60% of the bonding pad neps, which is the same as the first tin brushing.
Step S40, die attachment: and pasting glue on the PCB, and pasting the component on the PCB.
Step S50, second reflow soldering: and sending the PCB with the attached components into a reflow furnace again for reflow soldering.
And (3) as in the first reflow soldering, heating the PCB to the melting point temperature of the solder paste in the heating area of the reflow furnace for 1-5min, and staying for 1-5min in the cooling area of the reflow furnace and 50-150s in the reflow area of the reflow furnace. The welding speed is 50-100 mm/min.
According to the technical scheme, on the basis of the prior art process flow, before the wafer is attached, the tin brushing and reflow soldering processes are added, the void ratio is reduced, tin balls can be prevented from being generated, the void ratio is smaller than 3%, the proportion is smaller than 0.1%, and no tin balls larger than 10um are generated.
Referring to fig. 5, a second embodiment of the SMT pick and place method of the present invention is provided, and the difference between this embodiment and the first embodiment shown in fig. 3 is that, in this embodiment, the step S10 further includes the following steps before the first tin brushing:
step S00, dehumidification: and dehumidifying the PCB.
It can be understood that, in the embodiment, the PCB is dehumidified before the first tin brushing, so that the PCB can be better combined with the tin paste.
Specifically, in the embodiment, when the PCB is dehumidified, the PCB is dehumidified for 30-60min at the temperature of 150-.
According to the technical scheme, on the basis of the prior art process flow, before the wafer is attached, the processes of tin brushing, reflow soldering and dehumidification are added, so that the void ratio can be further reduced, and tin beads are prevented from being generated.
The SMT mounting method and test results thereof according to the present invention will be described with reference to fig. 6 to 9.
The principle of greatly reducing the cavities and the tin beads is as follows:
the cause of voids and tin beads:
when pasting wafer or other subassemblies, there is a decurrent extrusion force, and pressure transmission is to tin cream and PCB board combined surface, and tin cream itself comprises the spheroid of a lot of granularities, under the effect of pressure, can produce two phenomena:
A. extrusion slit-forming of cavities
B. Extruding the granular tin ball out of the bonding pad to form a tin ball
(II) the reason for brushing tin with no hollow tin beads twice is as follows:
A. brushing tin for the first time: the tin is naturally fused with the PCB without extrusion, and the tin is well combined with the PCB;
B. brushing tin for the second time: tin and tin are similarly compatible with the media combination and will bond well with some pressure.
Second, the specific operation description of the SMT sheet mounting method of the present invention is shown in table one:
watch 1
Thirdly, testing purposes:
the effect of two tin swipes on voids, tin beads and performance was evaluated.
Fourth, test materials, as shown in table two:
watch two
And fifthly, test evaluation items:
1. process verification
1.1 detection standard and conditions:
solder paste amount detection equipment: SPI;
and (3) standard of solder paste amount: the volume range is-60-180% (taking the open pore volume of the steel mesh as a reference);
and (3) detecting the effect standard after printing: the cavity is less than 25 percent, and the tin bead is less than 120um (the distance between the pad electrodes is generally about 150um, and the short circuit risk is caused when the diameter of the tin bead is too large);
the area of the steel mesh opening is fixed to be 60% of the area of the bonding pad;
1.2 verification results, as shown in Table three
Watch III
Wherein, the effect diagram of the primary tin brushing process in the prior art is shown in fig. 6, and the effect diagram of the SMT chip mounting method adopting the secondary tin brushing process is shown in fig. 7.
1.3 comparison of appearance of one-time tin brushing process and two-time tin brushing process
As shown in fig. 8 and 9, fig. 8 is an appearance effect diagram of the one-time tin brushing process, fig. 9 is an appearance effect diagram of the two-time tin brushing process, and as can be seen from fig. 8 and 9, the appearance of the main functional area of the two-time tin brushing process and the one-time tin brushing process is not different.
2. Parameter comparison
2.1 data summary, as shown in Table four:
watch four
It can be seen from table four that the difference between the overall brightness and the lighting effect is within 2%, and the influence of tin brushing on the brightness is not large.
2.2 detailed test data
The color temperature of tin brushing at one time is-2700K, as shown in the fifth table,
table five shows that tin is brushed for one time to 6500K, and the tin is brushed as shown in Table six:
TABLE sixty-two brushing tin-2700K, as shown in Table 7:
TABLE seventy secondary tin brushing-6500K, as shown in TABLE eighthly:
table eight
3. Reliability of
3.1 reliability conditions, as shown in Table nine:
watch nine
3.2 results of the experiment
A. The results of the cold and heat shock are shown in Table ten:
B. the vulcanization results (luminous flux maintenance rates) are shown in table eleven:
| categories | 0H | 4H | 8H | 16H |
| Brushing tin once | 100％ | 96.50％ | 97.77％ | 96.81％ |
| Secondary tin brushing | 100％ | 97.49％ | 99.20％ | 98.58％ |
Table eleven C, aging results, as shown in table twelve:
| categories | 0H | 500H | 1000H | 2000H | 3000H |
| Brushing tin once | 100％ | 98.61％ | 99.03％ | 98.94％ | 98.97％ |
| Secondary tin brushing | 100％ | 98.37％ | 101.39％ | 99.43％ | 98.57％ |
Watch twelve
In summary, the SMT mounting method of the present invention has the following beneficial effects: on the basis of the prior art process flow, before the chip is attached, the tin brushing and reflow soldering processes are added, so that the voidage is reduced, tin beads can be avoided, the voidage is less than 3%, the proportion is less than 0.1%, and no tin beads larger than 10um are generated.
In order to achieve the above object, the present invention further provides an LED package device, wherein the LED package device is manufactured by using the SMT pick-and-place method as described above, and the principles and advantages of the SMT pick-and-place method have been described in detail above and are not described herein again.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. An SMT pick and place method, comprising the steps of:
step S10, brushing tin for the first time: printing solder paste on the PCB;
step S20, first reflow: sending the PCB into a reflow oven for reflow soldering;
step S30, brushing tin for the second time: taking the PCB out of the reflow oven, and printing solder paste on the PCB again;
step S40, die attachment: pasting glue on the PCB, and pasting a component on the PCB;
step S50, second reflow soldering: and sending the PCB with the attached components into a reflow furnace again for reflow soldering.
2. An SMT patch method according to claim 1 wherein said step S10 is preceded by:
step S00, dehumidification: and dehumidifying the PCB.
3. An SMT patch method according to claim 2, wherein the PCB board is dehumidified for 30-60min at a temperature of 150-170 ℃ in step S00.
4. An SMT patch according to claim 1 wherein the thickness of the steel mesh used during the tin brushing process in steps S10 and S30 is 0.06-0.12 mm.
5. An SMT patch according to claim 4 wherein in steps S10 and S30, the steel mesh open area is 60% of the pad area.
6. An SMT patch method according to claim 1, wherein the oven temperature profile of the reflow oven and the melting point profile of the solder paste are matched in steps S20 and S50.
7. An SMT chip method according to claim 6, wherein an elevated temperature region and a reduced temperature region are disposed within the reflow oven, and in steps S20 and S50, the PCB board is elevated to a solder paste melting point temperature within 1-5min of the elevated temperature region, and a dwell time within 1-5min of the reduced temperature region.
8. An SMT chip method according to claim 7, wherein a reflow region is disposed within the reflow oven, and a residence time of the PCB board in the reflow region is 50-150 s.
9. An SMT patch according to claim 8 wherein the welding speed in steps S20 and S50 is 50-100 mm/min.
10. An LED package device, wherein the LED package device is manufactured by the SMT pad method according to any of claims 1 to 9.
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Cited By (3)
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| CN114430625A (en) * | 2022-01-25 | 2022-05-03 | 中国船舶重工集团公司第七二四研究所 | One-time welding process for reducing voidage of LGA welding spots |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113695695A (en) * | 2021-09-27 | 2021-11-26 | 东莞市大为新材料技术有限公司 | Method for soldering tin paste for semiconductor chip |
| CN114430625A (en) * | 2022-01-25 | 2022-05-03 | 中国船舶重工集团公司第七二四研究所 | One-time welding process for reducing voidage of LGA welding spots |
| CN114430625B (en) * | 2022-01-25 | 2023-12-12 | 中国船舶集团有限公司第七二四研究所 | One-time welding process for reducing cavity rate of LGA welding spot |
| CN114727485A (en) * | 2022-04-22 | 2022-07-08 | 湖南维胜科技电路板有限公司 | PCB with high element integration level and production method thereof |
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