CN109587970B - Lamp bead welding method - Google Patents
Lamp bead welding method Download PDFInfo
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- CN109587970B CN109587970B CN201811504314.XA CN201811504314A CN109587970B CN 109587970 B CN109587970 B CN 109587970B CN 201811504314 A CN201811504314 A CN 201811504314A CN 109587970 B CN109587970 B CN 109587970B
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- substrate
- lamp
- transparent film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Abstract
According to the lamp bead welding method provided by the invention, the circuit of the substrate is coated with the solder paste; stretching the transparent film provided with a plurality of lamp beads according to the arrangement of the substrate circuit, so that the arrangement of the lamp beads is consistent with that of the substrate circuit; the transparent film after stretching is transferred to the circuit board that scribbles the tin cream and welds on, need not to use the chip mounter to pick up the lamp pearl in proper order and place on the circuit board line of coating the tin cream, and efficiency is higher, and because a plurality of lamp pearls all set up on same transparent film in the welding process, there is the interact power between the different lamp pearls, can offset the contractile force that the tin cream produced when melting in high temperature moreover to effectual improvement lamp pearl welded precision, guaranteed the welding yield.
Description
Technical Field
The invention relates to the technical field of electronic components, in particular to a lamp bead welding method.
Background
With the rapid development of the small-pitch display market and the higher and higher requirements on the display technology, the advantages of the Mini LED and Micro LED technologies in the display field are more and more difficult to ignore. The Mini LED display and the Micro LED display will be higher-order display technologies and will be the development trend of future display applications. Because the Mini LED and the Micro LED are small in size, the welding yield is difficult to control, and the reason is that the Mini LED and the Micro LED cannot be identified and repaired on line, so that the Mini LED and the Micro LED are the main factors for limiting the development of the Mini LED and the Micro LED at present.
At present, reflow soldering is generally adopted for soldering of LED lamp beads, firstly, solder paste is coated on a circuit to be soldered of a substrate, then the LED lamp beads are sequentially picked up from a lamp bead strip package by a chip mounter and placed on the circuit of the substrate coated with the solder paste, then the LED lamp beads and the substrate are combined through melting of the solder paste after high temperature in reflow ovens of a plurality of different temperature zones, and mechanical and electrical connection is formed.
However, due to shrinkage of the solder paste when the solder paste is melted at high temperature, the chip is inclined or shifted, so that the heat resistance is increased to affect the heat dissipation of the LED, the lamp beads are not bright or short circuit is caused, and particularly, the welding yield of the Mini LED and the Micro LED with smaller sizes is more difficult to control.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the lamp bead welding method can improve the lamp bead welding precision and is high in efficiency.
In order to solve the technical problems, the invention adopts the technical scheme that:
a lamp bead welding method comprises the following steps:
coating solder paste on the circuit board;
stretching the transparent film provided with a plurality of lamp beads according to the arrangement of the substrate circuit, so that the arrangement of the lamp beads is consistent with that of the substrate circuit;
and transferring the stretched transparent film to a substrate line coated with tin paste for welding.
The invention has the beneficial effects that: coating solder paste on the circuit board; stretching the transparent film provided with a plurality of lamp beads according to the arrangement of the substrate circuit, so that the arrangement of the lamp beads is consistent with that of the substrate circuit; the transparent film after stretching is transferred to the circuit board that scribbles the tin cream and welds on, need not to use the chip mounter to pick up the lamp pearl in proper order and place on the circuit board line of coating the tin cream, and efficiency is higher, and because a plurality of lamp pearls all set up on same transparent film in the welding process, there is the interact power between the different lamp pearls, can offset the contractile force that the tin cream produced when melting in high temperature moreover to effectual improvement lamp pearl welded precision, guaranteed the welding yield.
Drawings
FIG. 1 is a flow chart of a lamp bead welding method according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a lamp bead welding process according to an embodiment of the invention;
description of reference numerals:
1. a substrate layer; 2. an adhesive layer; 3. a lamp bead; 4. a terminal; 5. a substrate; 6. a light emitting end.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
The most key concept of the invention is that a plurality of lamp beads are uniformly arranged on the same transparent film, and the shrinkage force generated when the solder paste is melted at high temperature in the welding process is counteracted by utilizing the interaction force existing between different lamp beads, so that the welding precision of the lamp beads is effectively improved, and the welding yield is ensured.
Referring to fig. 1 and 2, a lamp bead welding method includes the steps of:
coating solder paste on the circuit board;
stretching the transparent film provided with a plurality of lamp beads according to the arrangement of the substrate circuit, so that the arrangement of the lamp beads is consistent with that of the substrate circuit;
and transferring the stretched transparent film to a substrate line coated with tin paste for welding.
From the above description, the beneficial effects of the present invention are: coating solder paste on the circuit board; stretching the transparent film provided with a plurality of lamp beads according to the arrangement of the substrate circuit, so that the arrangement of the lamp beads is consistent with that of the substrate circuit; the transparent film after stretching is transferred to the circuit board that scribbles the tin cream and welds on, need not to use the chip mounter to pick up the lamp pearl in proper order and place on the circuit board line of coating the tin cream, and efficiency is higher, and because a plurality of lamp pearls all set up on same transparent film in the welding process, there is the interact power between the different lamp pearls, can offset the contractile force that the tin cream produced when melting in high temperature moreover to effectual improvement lamp pearl welded precision, guaranteed the welding yield.
Further, the step of coating the solder paste on the substrate circuit specifically comprises:
and coating die bonding solder paste on the circuit to be soldered on the substrate.
According to the description, the circuit to be welded on the substrate is coated with the die bonding solder paste, and the deformation amount of the die bonding solder paste is smaller than that of the common solder paste at high temperature, so that the welding precision of the lamp beads can be further improved.
Further, according to the arrangement of the substrate circuit, the transparent film provided with a plurality of lamp beads is stretched, so that the arrangement of the plurality of lamp beads and the arrangement of the substrate circuit are consistent, and the method specifically comprises the following steps:
and stretching the transparent film provided with a plurality of lamp beads in a crystal expansion mode according to the arrangement of the substrate circuit, so that the arrangement of the lamp beads is consistent with that of the substrate circuit.
According to the description, the transparent film provided with the plurality of lamp beads is stretched in the crystal expansion mode, so that the arrangement of the plurality of lamp beads is consistent with that of the substrate circuit, errors between the arrangement of the lamp beads on the stretched transparent film and the arrangement of the substrate circuit can be reduced, and the precision of subsequent welding is improved.
Further, the step of transferring the stretched transparent film to a substrate line coated with solder paste for soldering specifically comprises:
and transferring the stretched transparent film onto a substrate line coated with solder paste, and detecting whether the deviation error of each lamp bead exceeds a preset value through CCD (charge coupled device) vision while welding, if so, adjusting the lamp beads.
According to the description, the stretched transparent film is transferred to the substrate circuit coated with the solder paste, whether the deviation error of each lamp bead exceeds the preset value or not is detected through CCD vision while welding, if yes, the lamp beads are adjusted, the welding yield is effectively guaranteed, and the product quality is improved.
Further, the adjusting the lamp bead specifically comprises:
and fixing the transparent films on two sides of the lamp bead and adjusting the lamp bead.
According to the above description, the transparent films on two sides of the lamp beads are fixed and the lamp beads are adjusted, so that the influence on other adjacent lamp beads when the current lamp beads are adjusted can be prevented, and the welding stability is improved.
Further, the transparent film includes substrate layer and adhesion layer from top to bottom in proper order, the lamp pearl includes luminous end and wiring end, luminous end is connected with the wiring end electricity, the luminous end of a plurality of lamp pearls is according to presetting the interval in proper order the adhesion layer is kept away from the one side of substrate layer.
According to the above description, through setting up the transparent film includes substrate layer and adhesion layer from top to bottom in proper order, the lamp pearl includes luminous end and wiring end, luminous end is connected with the wiring end electricity, the luminous end of a plurality of lamp pearls is according to predetermineeing the interval in proper order the adhesion layer is kept away from the one side of substrate layer, uses the original packaging mode of transparent film replacement, has not only reduced the cost of generation, has still improved lamp pearl welded efficiency.
Further, the adhesive force of the adhesive layer ranges from 150 to 300 gf/inch.
It can be known from the above-mentioned description, through the scope of the adhesive force that sets up the adhesion layer, guaranteed the adsorption affinity between lamp pearl and the transparent film, prevent that the lamp pearl that leads to because the adhesive force is too low from droing.
Further, the material of the adhesion layer is acrylate adhesive, the basis weight of the adhesion layer ranges from 30 to 80 grams per square meter, and the thickness of the adhesion layer ranges from 25 to 50 micrometers.
Further, the material of substrate layer is polyvinyl chloride, the basis weight scope of substrate layer is 50 to 150 grams per square meter, the thickness scope of substrate layer is 50 to 150 microns.
According to the description, the interaction force between different lamp beads after the transparent film is stretched is jointly guaranteed through the material, the basis weight range and the thickness of the adhesion layer and the base material layer, so that the welding precision is improved, and the welding yield is guaranteed.
Example one
Referring to fig. 1 and 2, a lamp bead welding method includes the steps of:
coating solder paste on the circuit of the substrate 5;
the coating of the solder paste on the circuit of the substrate 5 specifically comprises the following steps:
coating die bonding solder paste on a circuit to be welded of the substrate 5;
stretching the transparent film provided with a plurality of lamp beads 3 according to the arrangement of the circuit of the substrate 5, so that the arrangement of the lamp beads 3 is consistent with the arrangement of the circuit of the substrate 5;
according to the arrangement of 5 circuits of base plate, stretch the transparent film that is equipped with a plurality of lamp pearls 3 for the arrangement of a plurality of lamp pearls 3 with the arrangement of 5 circuits of base plate is unanimous specifically do:
stretching a transparent film provided with a plurality of lamp beads 3 in a crystal expansion mode according to the arrangement of the circuit of the substrate 5, so that the arrangement of the lamp beads 3 is consistent with the arrangement of the circuit of the substrate 5;
transferring the stretched transparent film to a substrate 5 line coated with solder paste for welding;
the step of transferring the stretched transparent film to a substrate 5 line coated with solder paste for welding specifically comprises the following steps:
transferring the stretched transparent film onto a circuit of a substrate 5 coated with solder paste, visually detecting whether the offset error of each lamp bead 3 exceeds a preset value through a CCD (charge coupled device) while welding, and if so, adjusting the lamp beads 3;
the adjustment the lamp pearl 3 specifically do:
fixing transparent films on two sides of the lamp bead 3 and adjusting the lamp bead 3;
the transparent film sequentially comprises a substrate layer 1 and an adhesion layer 2 from top to bottom, the lamp beads 3 comprise light-emitting ends 6 and wiring ends 4, the light-emitting ends 6 are electrically connected with the wiring ends 4, and the light-emitting ends 6 of the lamp beads 3 are sequentially adhered to one surface, far away from the substrate layer 1, of the adhesion layer 2 according to preset intervals;
the adhesive force of the adhesive layer 2 ranges from 150 to 300 gf/inch;
the material of the adhesion layer 2 is acrylate adhesive, the basis weight range of the adhesion layer 2 is 30-80 grams per square meter, and the thickness range of the adhesion layer 2 is 25-50 micrometers;
the material of substrate layer 1 is polyvinyl chloride, the basis weight scope of substrate layer 1 is 50 to 150 grams per square meter, the thickness scope of substrate layer 1 is 50 to 150 microns.
Example two
In this embodiment, a specific application scenario is combined to further explain how the method for welding the lamp bead of the present invention is implemented:
1. coating die bonding solder paste on a circuit to be welded of the substrate 5;
specifically, a traditional coating machine can be adopted for coating the die bond solder paste, and different die bond solder paste usage amounts can be selected according to different models of the LED lamp beads 3;
2. stretching a transparent film provided with a plurality of LED lamp beads 3 in a crystal expansion mode according to the arrangement of the circuit of the substrate 5, so that the arrangement of the LED lamp beads 3 is consistent with that of the circuit of the substrate 5;
specifically, the range and the shape of the stretched transparent film of the crystal expanding machine can be set according to the arrangement of the basic circuit, so that the arrangement of the LED lamp beads 3 is consistent with the arrangement of the circuit of the substrate 5;
3. transferring the stretched transparent film onto a circuit of a substrate 5 coated with solder paste, visually detecting whether the offset error of each LED lamp bead 3 exceeds a preset value through a CCD (charge coupled device) while welding, and if so, adjusting the LED lamp beads 3;
3.1, the adjustment LED lamp pearl 3 specifically do:
fixing transparent films on two sides of the LED lamp bead 3 and adjusting the LED lamp bead 3;
specifically, the LED lamp beads 3 can be adjusted by a mechanical arm;
the transparent film sequentially comprises a substrate layer 1 and an adhesion layer 2 from top to bottom, the LED lamp beads 3 comprise light-emitting ends 6 and wiring ends 4, the light-emitting ends 6 are electrically connected with the wiring ends 4, and the light-emitting ends 6 of the LED lamp beads 3 are sequentially adhered to one surface, far away from the substrate layer 1, of the adhesion layer 2 according to preset intervals;
preferably, the wiring terminals 6 are positive electrodes and negative electrodes of the LED lamp beads 3, the light emitting terminals 6 of the LED lamp beads 3 are sequentially and adjacently adhered to one surface of the adhesion layer 2 away from the substrate layer 1, and the LED lamp beads 3 are directly arranged on the transparent film, so that the LED lamp beads 3 on the same transparent film can be simultaneously placed on the substrate 5 in a manner of stretching the transparent film at one time, and each LED lamp bead 3 does not need to be sequentially taken off from the lamp beads 3 and then respectively placed on the substrate 5 as in the prior art;
the adhesive force of the adhesive layer 2 ranges from 150 to 2300 gf/inch;
the material of the adhesion layer 2 is acrylate adhesive, the basis weight range of the adhesion layer 2 is 30-80 grams per square meter, and the thickness range of the adhesion layer 2 is 25-50 micrometers;
the material of substrate layer 1 is polyvinyl chloride, the basis weight scope of substrate layer 1 is 50 to 150 grams per square meter, the thickness scope of substrate layer 1 is 50 to 150 microns.
In summary, in the lamp bead welding method provided by the invention, the substrate circuit is coated with the solder paste; stretching the transparent film provided with a plurality of lamp beads according to the arrangement of the substrate circuit, so that the arrangement of the lamp beads is consistent with that of the substrate circuit; transferring the stretched transparent film to a substrate line coated with solder paste for welding, wherein a chip mounter is not required to pick up lamp beads in sequence and place the lamp beads on the substrate line coated with solder paste, the efficiency is higher, in the welding process, as a plurality of lamp beads are all arranged on the same transparent film, and interaction force exists among different lamp beads, the shrinkage force generated when the solder paste is melted at high temperature can be counteracted, so that the welding precision of the lamp beads is effectively improved, the welding yield is ensured, the transparent film provided with the plurality of lamp beads is stretched in a crystal expansion mode, so that the arrangement of the plurality of lamp beads is consistent with the arrangement of the substrate line, the error between the arrangement of the lamp beads on the stretched transparent film and the sequencing of the substrate line can be reduced, the subsequent welding precision is improved, the stretched transparent film is transferred to the substrate line coated with the solder paste, and whether the offset error of each lamp bead exceeds a preset value or not is detected through visual inspection while welding, if, then adjust the lamp pearl, the effectual welding yield of having guaranteed improves product quality, through the material, basis weight scope and the thickness that set up adhesion layer and substrate layer respectively, has guaranteed the interact power between the tensile back different lamp pearls of transparent film jointly to improve welding precision, guaranteed the welding yield.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (6)
1. A lamp bead welding method is characterized by comprising the following steps:
coating solder paste on the circuit board;
stretching the transparent film provided with a plurality of lamp beads according to the arrangement of the substrate circuit, so that the arrangement of the lamp beads is consistent with that of the substrate circuit;
transferring the stretched transparent film to a substrate circuit coated with solder paste for welding;
the transparent film sequentially comprises a substrate layer and an adhesion layer from top to bottom, the lamp beads comprise light-emitting ends and wiring ends, the light-emitting ends are electrically connected with the wiring ends, and the light-emitting ends of the plurality of lamp beads are sequentially adhered to one surface, far away from the substrate layer, of the adhesion layer according to preset intervals;
the material of the adhesion layer is acrylate adhesive, the basis weight range of the adhesion layer is 30-80 grams per square meter, and the thickness range of the adhesion layer is 25-50 micrometers;
the material of substrate layer is polyvinyl chloride, the basis weight scope of substrate layer is 50 to 150 grams per square meter, the thickness scope of substrate layer is 50 to 150 microns.
2. The lamp bead welding method according to claim 1, wherein the step of coating solder paste on the substrate line specifically comprises:
and coating die bonding solder paste on the circuit to be soldered on the substrate.
3. A lamp bead welding method according to claim 1, wherein the step of stretching the transparent film provided with the plurality of lamp beads according to the arrangement of the substrate circuit, so that the arrangement of the plurality of lamp beads is consistent with the arrangement of the substrate circuit specifically comprises:
and stretching the transparent film provided with a plurality of lamp beads in a crystal expansion mode according to the arrangement of the substrate circuit, so that the arrangement of the lamp beads is consistent with that of the substrate circuit.
4. The lamp bead welding method according to claim 1, wherein the step of transferring the stretched transparent film onto a substrate line coated with solder paste for welding specifically comprises:
and transferring the stretched transparent film onto a substrate line coated with solder paste, and detecting whether the deviation error of each lamp bead exceeds a preset value through CCD (charge coupled device) vision while welding, if so, adjusting the lamp beads.
5. The lamp bead welding method according to claim 4, wherein the adjusting of the lamp bead specifically comprises:
and fixing the transparent films on two sides of the lamp bead and adjusting the lamp bead.
6. A lamp bead welding method according to claim 1, wherein the adhesive force of said adhesive layer ranges from 150 to 300 gf/inch.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811504314.XA CN109587970B (en) | 2018-12-10 | 2018-12-10 | Lamp bead welding method |
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|---|---|---|---|
| CN201811504314.XA CN109587970B (en) | 2018-12-10 | 2018-12-10 | Lamp bead welding method |
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| CN109587970A CN109587970A (en) | 2019-04-05 |
| CN109587970B true CN109587970B (en) | 2020-12-01 |
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| CN112874863B (en) * | 2021-02-07 | 2022-09-06 | 东莞阿尔泰显示技术有限公司 | Packaging structure, stacking packaging structure and technology of LED lamp beads |
| CN112864055A (en) * | 2021-02-07 | 2021-05-28 | 东莞阿尔泰显示技术有限公司 | Transfer process and transfer equipment for LED lamp beads |
| CN112864294A (en) * | 2021-02-07 | 2021-05-28 | 东莞阿尔泰显示技术有限公司 | Preparation process of LED display module |
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| CN1269698A (en) * | 1999-04-02 | 2000-10-11 | 阿尔卑斯电气株式会社 | Fitting structure of chip element and fitting method thereof |
| CN103872002A (en) * | 2008-03-05 | 2014-06-18 | 伊利诺伊大学评议会 | Stretchable and foldable electronic devices |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6205656B1 (en) * | 1997-10-01 | 2001-03-27 | Arthur Henry Adams | Automated application of photovoltaic cells to printed circuit boards |
| JP4389471B2 (en) * | 2003-05-19 | 2009-12-24 | パナソニック株式会社 | Electronic circuit connection structure and connection method |
| CN104091878B (en) * | 2014-06-19 | 2017-02-15 | 东莞市万丰纳米材料有限公司 | Package-free LED light source module manufacturing method |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1269698A (en) * | 1999-04-02 | 2000-10-11 | 阿尔卑斯电气株式会社 | Fitting structure of chip element and fitting method thereof |
| CN103872002A (en) * | 2008-03-05 | 2014-06-18 | 伊利诺伊大学评议会 | Stretchable and foldable electronic devices |
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