CN109346460A - MiniLED preparation method - Google Patents
MiniLED preparation method Download PDFInfo
- Publication number
- CN109346460A CN109346460A CN201811134858.1A CN201811134858A CN109346460A CN 109346460 A CN109346460 A CN 109346460A CN 201811134858 A CN201811134858 A CN 201811134858A CN 109346460 A CN109346460 A CN 109346460A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- led chip
- preparation
- miniled
- support membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The present invention provides a kind of MiniLED preparation methods, comprising: S1 preparation surface has the support membrane of viscosity；The circuit board for being used to control LED chip conducting is arranged in the adhesive surface of support membrane according to preset rules by S2；S3 further arranges LED chip according to the arrangement of circuit board, wherein the corresponding two circuit boards arrangement of a LED chip；S4 uses encapsulation glue curing circuit board and LED chip；S5 removes support membrane, exposes the electrode pad of circuit board and LED chip；S6 connects the electrode pad of LED chip with corresponding circuit board, completes the preparation of MiniLED.In the whole process, without using bonding (Bonding) technique, the preparation efficiency and yield of MiniLED are substantially increased；And without using arriving package substrate, packaging cost is greatly reduced.
Description
Technical field
The present invention relates to technical field of semiconductors, especially a kind of miniLED preparation method.
Background technique
Traditional backlight LED has developed for many years, has technically reached bottleneck, and profit is not also relatively high, adds OLED
The high functionalities such as (Organic Light-Emitting Diode, Organic Light Emitting Diode) the frivolous of display, flexibility,
It is continuous to corrode backlight display market, so that the manufacturer not being laid out in OLED display, is all actively dropped in function and cost
On all great competitiveness new product exploitation.For OLED, the direct-type backlight of use is in addition to local dimming
The characteristic of (Local Dimming) except the self luminous high contrast effect of the OLED that can compare, can more produce the display of high curved surface
Device, and on the basis of tv product, OLED20~30% will be less than using the cost of direct-type backlight.Therefore high efficiency, low cost
Packaging method become a kind of demand.
Summary of the invention
In order to overcome the above deficiency, the present invention provides a kind of MiniLED preparation methods, effectively solve existing MiniLED
Preparation efficiency is high, the technical problems such as at high cost.
A kind of MiniLED preparation method, comprising:
S1 preparation surface has the support membrane of viscosity；
The circuit board for being used to control LED chip conducting is arranged in the adhesive surface of support membrane according to preset rules by S2；
S3 further arranges LED chip according to the arrangement of circuit board；
S4 uses encapsulation glue curing circuit board and LED chip；
S5 removes support membrane, exposes the electrode pad of circuit board and LED chip；
The electrode pad of LED chip and corresponding circuit board electrical connection are completed the preparation of MiniLED by S6.
It is further preferred that in step sl, the support membrane is prepared by PET material.
It is further preferred that in step s 4, the hardness for encapsulating glue is greater than Shao D40.
In MiniLED preparation method provided by the invention, after circuit board and LED chip are arranged in support film surface,
Solidified using encapsulation glue, finally using the electrode pad and corresponding circuit board of tin cream connection LED chip, completion pair
The preparation of MiniLED, it is simple and convenient.In the whole process, it without using bonding (Bonding) technique, substantially increases
The preparation efficiency and yield of MiniLED；And without using arriving package substrate, packaging cost is greatly reduced.
Detailed description of the invention
Fig. 1 is MiniLED preparation method flow diagram in the present invention；
Fig. 2 is the preparation process schematic diagram of MiniLED in the present invention；
Fig. 3 is MiniLED schematic diagram in an example of the invention.
Appended drawing reference:
1- support membrane, 2- circuit board, 3-LED chip, 4- electrode pad, 5- encapsulate glue, 6- tin cream.
Specific embodiment
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, Detailed description of the invention will be compareed below
A specific embodiment of the invention.It should be evident that drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing, and obtain other embodiments.
It is as shown in Figure 1 MiniLED preparation method provided by the invention, it can be seen from the figure that being prepared in the MiniLED
It include: the support membrane that S1 preparation surface has viscosity in method；S2 will be used to control the electricity of LED chip conducting according to preset rules
Road plate is arranged in the adhesive surface of support membrane；S3 further arranges LED chip according to the arrangement of circuit board；S4 uses encapsulation glue
Curing circuit plate and LED chip；S5 removes support membrane, exposes the electrode pad of circuit board and LED chip；S6 is by LED chip
Electrode pad and corresponding circuit board electrical connection, complete the preparation of MiniLED.
Support membrane by PET (Polyethylene terephthalate, poly terephthalic acid class plastics) material prepare and
At, and surface is coated with high temperature resistant glue-line, single side has weak viscosity.It is illustrated in figure 2 the preparation process schematic diagram of MiniLED,
Before arranging circuit board 2, support membrane 1 is fixed on the iron frame of intermediate hollow out, later, in sequence successively by circuit board 2
It is arranged on support membrane 1, as shown in Fig. 2 (a)；Then, it (is prepared by metal copper sheet, for connecting LED according to circuit board 2
Chip and main circuit board, for LED chip provide current transmission effect) arrangement further arrange 3 (specially upside-down mounting of LED chip
LED chip, 4 side of electrode pad are arranged towards support membrane 1), wherein corresponding two circuit boards 2 in 3 two sides of LED chip arrange, and
The setting of chip bonding pad position (can be in practical applications, each according to demand in the corresponding LED chip 3 of two circuit boards 2
LED chip configures 2 circuit boards；It can also be that a unit uses same circuit board with several LED chips, set according to actual needs
It is fixed, only need to set corresponding arrangement position in encapsulation process as desired), as shown in Fig. 2 (b)；Later, in support membrane 1
Surface is packaged and is solidified to the LED chip 3 and circuit board 2 of arrangement using encapsulation glue 5 (hardness is more than Shao D40), such as
Shown in Fig. 2 (c).Then, support membrane 1 (having weak viscosity by support membrane 1, by manually tearing removal) is removed, such as Fig. 2
(d) it shown in, and using the electrode pad 4 of LED chip 3 is connected with corresponding circuit board 2, as shown in Fig. 2 (e), completes
The preparation of MiniLED carries out the operation such as testing, sorting packaging later.Specifically, after eliminating support membrane 1, by LED chip 3
The operation that a tin cream 6 is carried out in new support substrate is transferred to circuit board 2, after completing a tin cream 6 and operating, removal branch
Support substrate.In other embodiments, the electrode pad of the realization LED chip such as conducting resinl, elargol and corresponding electricity can also be used
The electrical connection of road plate.
In instances, with upside-down mounting red LED chip 31, blue LED flip chip 32 and upside-down mounting green LED chip 33 for one
Unit is packaged, and is applied to field of backlights.In encapsulation process, circuit board 21 and circuit board 22 are arranged in red LED chip
31 two sides, circuit board 22 and the setting of circuit board 23 are arranged in 32 two sides of blue-light LED chip, circuit board 22 and circuit board 24 in green light
The electrode pad of each LED chip is connected by tin cream with corresponding circuit board later, is obtained such as Fig. 3 institute by 33 two sides of LED chip
The miniLED shown.Specifically, in the miniLED, red LED chip 31 is passing through circuit board 21 and display main circuit board just
Pole connection, is connect by circuit board 22 with the cathode of display main circuit board；Blue-light LED chip 32 passes through circuit board 23 and display
The anode connection of device main circuit board, is connect by circuit board 22 with the cathode of display main circuit board；Green LED chip 33 passes through
Circuit board 24 is connect with the anode of display main circuit board, is connect by circuit board 22 with the cathode of display main circuit board, i.e., 3
LED chip common cathode.In the encapsulating structure, red LED chip 31, blue-light LED chip 32 and green LED chip 33 it is big
Small can be 50*80~500*800 μm, corresponding, and the size of electrode pad can be 25*30~200*300 μm, real one
In example, chip size is 100*200 μm, and the size of electrode pad is 50*80 μm.After method provided by the invention, with LED
The circuit board of chip connection is much larger compared to electrode pad area, it is sufficient to meet the need of application end patch SMT technique and processing procedure
Ask, solve the problems, such as in the prior art because application end precision cause in a package can not direct patch the technical issues of.
It should be noted that above-described embodiment can be freely combined as needed.The above is only of the invention preferred
Embodiment, it is noted that for those skilled in the art, in the premise for not departing from the principle of the invention
Under, several improvements and modifications can also be made, these modifications and embellishments should also be considered as the scope of protection of the present invention.
Claims (3)
1. a kind of MiniLED preparation method, which is characterized in that include: in the MiniLED preparation method
S1 preparation surface has the support membrane of viscosity；
The circuit board for being used to control LED chip conducting is arranged in the adhesive surface of support membrane according to preset rules by S2；
S3 further arranges LED chip according to the arrangement of circuit board；
S4 uses encapsulation glue curing circuit board and LED chip；
S5 removes support membrane, exposes the electrode pad of circuit board and LED chip；
The electrode pad of LED chip and corresponding circuit board electrical connection are completed the preparation of MiniLED by S6.
2. MiniLED preparation method as described in claim 1, which is characterized in that in step sl, the support membrane is by PET
Material is prepared.
3. MiniLED preparation method as described in claim 1, which is characterized in that in step s 4, the hardness for encapsulating glue is big
Shao Yu D40.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811134858.1A CN109346460A (en) | 2018-09-28 | 2018-09-28 | MiniLED preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811134858.1A CN109346460A (en) | 2018-09-28 | 2018-09-28 | MiniLED preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109346460A true CN109346460A (en) | 2019-02-15 |
Family
ID=65306901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811134858.1A Pending CN109346460A (en) | 2018-09-28 | 2018-09-28 | MiniLED preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109346460A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111341199A (en) * | 2019-08-23 | 2020-06-26 | Tcl集团股份有限公司 | Light source assembly, method for reducing working current of backlight module and display device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101494176A (en) * | 2008-01-24 | 2009-07-29 | 彭裕港 | Method of encapsulating an electronic component |
| CN108963054A (en) * | 2017-05-26 | 2018-12-07 | 黄秀璋 | Crystal-coated light-emitting diodes and its manufacturing method |
-
2018
- 2018-09-28 CN CN201811134858.1A patent/CN109346460A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101494176A (en) * | 2008-01-24 | 2009-07-29 | 彭裕港 | Method of encapsulating an electronic component |
| CN108963054A (en) * | 2017-05-26 | 2018-12-07 | 黄秀璋 | Crystal-coated light-emitting diodes and its manufacturing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111341199A (en) * | 2019-08-23 | 2020-06-26 | Tcl集团股份有限公司 | Light source assembly, method for reducing working current of backlight module and display device |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190215 |