CN113178408A - Discharging, transferring and positioning device for miniature electronic assembly and working method of discharging, transferring and positioning device - Google Patents
Discharging, transferring and positioning device for miniature electronic assembly and working method of discharging, transferring and positioning device Download PDFInfo
- Publication number
- CN113178408A CN113178408A CN202110593565.5A CN202110593565A CN113178408A CN 113178408 A CN113178408 A CN 113178408A CN 202110593565 A CN202110593565 A CN 202110593565A CN 113178408 A CN113178408 A CN 113178408A
- Authority
- CN
- China
- Prior art keywords
- direction sliding
- sliding assembly
- assembly
- substrate
- moving mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007599 discharging Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims description 21
- 238000004377 microelectronic Methods 0.000 claims abstract description 30
- 230000003287 optical effect Effects 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 36
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 17
- 210000004400 mucous membrane Anatomy 0.000 claims description 12
- 238000001179 sorption measurement Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 230000000712 assembly Effects 0.000 claims 3
- 238000000429 assembly Methods 0.000 claims 3
- 238000005476 soldering Methods 0.000 description 9
- 230000004907 flux Effects 0.000 description 8
- 230000001680 brushing effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A discharging, transferring and positioning device for a miniature electronic component comprises a connecting bracket, a bearing platform, a first moving mechanism, a suction head, a second moving mechanism, an optical alignment mechanism and a laser component; the top of the connecting bracket is provided with an optical alignment mechanism and a laser assembly; the first moving mechanism comprises a first base, a first X-direction sliding assembly and a first Y-direction sliding assembly, the first X-direction sliding assembly is slidably mounted on the first base, the first Y-direction sliding assembly is slidably mounted on the first X-direction sliding assembly, and the bearing platform is mounted on the first Y-direction sliding assembly; the second moving mechanism comprises a second base, a second X-direction sliding assembly, a second Y-direction sliding assembly and a second Z-direction sliding assembly. The problem that the light-emitting angle of each microelectronic assembly is deviated due to the fact that the microelectronic assembly is not flat after welding possibly generated by a traditional microelectronic assembly transfer machine is effectively solved.
Description
Technical Field
The invention relates to the field of display screen processing equipment, in particular to a discharging, transferring and positioning device for a miniature electronic assembly and a working method of the discharging, transferring and positioning device.
Background
For a tinned microelectronic assembly, a lamp panel die bonding process is as shown in fig. 1, a substrate is put into equipment for coating soldering flux, the substrate is transferred to microelectronic assembly transfer equipment to fix the microelectronic assembly on the lamp panel, and tin is melted through reflow soldering equipment so that the microelectronic assembly can be soldered and conducted reliably. Fig. 2 is a flow chart of adding an optical appearance inspection device according to the flow chart of fig. 1.
The conventional microelectronic device transfer apparatus comprises a conventional micro-electronic device which is moved to a carrier or a substrate via a swing arm. Alternatively, a needle-punching type of transfer such as those disclosed in 201910622496.9 and 201911103759.1 may be used.
At present, a method for manufacturing a micro electronic component with tin includes brushing a flux or a tin paste on a substrate, and after the micro electronic component is subjected to crystal arrangement, the micro electronic component can be temporarily limited in position so as not to be displaced due to slight vibration through the high viscosity of the flux or the tin paste, so that the process requirement for coating the flux or the tin paste is particularly high, the amount of the flux or the tin paste at each point needs to be consistent, and when the flux or the tin paste is inconsistent, the micro electronic component may have the problem of unevenness or displacement, and in addition, because the difference of the flux or the tin paste amount may cause that tin cannot be welded well with the copper-exposed position on the substrate during reflow soldering, and the problem of false soldering/empty soldering may occur, so that hidden defects exist, because the productivity of reflow soldering equipment is large, a plurality of micro electronic component transferring equipment correspond to one reflow soldering equipment, although the soldering flux or solder paste may temporarily fix the microelectronic assembly, a small portion of the microelectronic assembly may be displaced and may be undesirably moved between the microelectronic assembly transfer apparatus and the reflow apparatus through the stack of the transfer jig.
Disclosure of Invention
The invention provides a discharging, transferring and positioning device for a miniature electronic component and a working method thereof, aiming at the defects of the prior art, wherein the specific technical scheme of the discharging, transferring and positioning device for the miniature electronic component is as follows:
the utility model provides a miniature electronic component arranges material and shifts positioner which characterized in that: the device comprises a connecting bracket, a bearing platform, a first moving mechanism, a suction head, a second moving mechanism, an optical alignment mechanism and a laser assembly;
an optical alignment mechanism and a laser assembly are arranged at the top of the connecting support;
the first moving mechanism comprises a first base, a first X-direction sliding assembly and a first Y-direction sliding assembly, the first X-direction sliding assembly is slidably mounted on the first base, the first Y-direction sliding assembly is slidably mounted on the first X-direction sliding assembly, and the bearing platform is mounted on the first Y-direction sliding assembly;
the second moving mechanism comprises a second base, a second X-direction sliding assembly, a second Y-direction sliding assembly and a second Z-direction sliding assembly;
the second base is installed on the connecting support, the second X-direction sliding assembly is installed on the second base in a sliding mode, the second Y-direction sliding assembly is installed on the second X-direction sliding assembly in a sliding mode, and the second Z-direction sliding assembly is installed on the second Y-direction sliding assembly;
the suction head is arranged on the second Z-direction sliding assembly and used for sucking the carrier plate.
Further: and a vacuum adsorption device is arranged on the bearing platform.
Further: the carrier plate comprises a substrate, a mucous membrane and electronic components, wherein the mucous membrane is arranged at the bottom of the substrate, and the electronic components are respectively arranged on the mucous membrane.
A working method of a discharging, transferring and positioning device of a miniature electronic component is characterized in that: the method comprises the following steps:
s1: after cleaning the substrate, adhering a mucous membrane to the bottom of the substrate;
s2: placing the electronic components on a mucous membrane according to a set interval by a miniature electronic component transfer machine to form a carrier plate;
s3: the first moving mechanism drives the suction head to suck the support plate;
s4: the optical positioning mechanism obtains the position of a bonding pad on the substrate, the first moving mechanism drives the suction head to move, and the suction head places the support plate at the position of the bonding pad;
s5: the laser assembly is aligned to the position of the bonding pad on the substrate to emit laser, and tin of the electronic element is melted to complete welding;
s6: after the electronic component is welded on the substrate, the suction head takes out the welded carrier plate to realize the separation of the electronic component and the carrier plate.
Further: in step S5, the laser module employs a single-point continuous irradiation method or a whole line irradiation method.
Further: the substrate is a transparent substrate.
The invention has the beneficial effects that: the key point of the invention is to arrange the microelectronic components on the carrier plate according to the final required relative position through the general microelectronic component transfer equipment, then transfer the microelectronic components to the substrate through the transfer equipment of the invention, melt the tin through the laser and finish the fixation between the microelectronic components and the substrate, thus realizing the transfer of a plurality of microelectronic components at the same time and ensuring the flatness of the microelectronic components to be below 0.005 mm. The problem that the light-emitting angle of each microelectronic assembly is deviated due to the fact that the microelectronic assembly 703 is not flat after welding possibly generated by a traditional microelectronic assembly transfer machine is effectively solved. Meanwhile, the output of the whole machine in 6-10 times of unit time can be improved, a plurality of work stations can be saved, and equipment investment can be saved, such as a tin brushing machine, a tin thickness inspection machine and a reflow soldering furnace. The defect rate caused by the three devices can be avoided, such as the alignment problem of a tin brushing machine or the thermal deformation of the substrate of the reflow oven after the tin brushing machine is used.
Drawings
FIG. 1 is an overall block diagram of the present invention;
FIG. 2 is a schematic view of FIG. 1 taken along line A;
the attached drawings in the figure illustrate that the connecting bracket 1, the bearing platform 2, the first base 3, the first X-direction sliding assembly 4, the first Y-direction sliding assembly 5, the suction head 6, the second base 7, the second X-direction sliding assembly 8, the second Y-direction sliding assembly 9, the second Z-direction sliding assembly 10, the optical alignment mechanism 11, the laser assembly 12, the carrier plate 13, the substrate 14, the mucous membrane 15, the electronic assembly 16 and the vacuum adsorption device 17.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 and 2:
a discharging, transferring and positioning device for a miniature electronic component comprises a connecting bracket 1, a bearing platform 2, a first moving mechanism, a suction head 6, a second moving mechanism, an optical alignment mechanism 11 and a laser component 12;
an optical alignment mechanism 11 and a laser assembly 12 are arranged at the top of the connecting bracket 1;
the first moving mechanism comprises a first base 3, a first X-direction sliding assembly 4 and a first Y-direction sliding assembly 5, the first X-direction sliding assembly 4 is slidably mounted on the first base 3, the first Y-direction sliding assembly 5 is slidably mounted on the first X-direction sliding assembly 4, the bearing platform 2 is mounted on the first Y-direction sliding assembly 5, a vacuum adsorption device 17 is mounted on the bearing platform 2, and the bearing plate is stably fixed on the bearing platform through the vacuum adsorption device 17;
the second moving mechanism comprises a second base 7, a second X-direction sliding assembly 8, a second Y-direction sliding assembly 9 and a second Z-direction sliding assembly 10;
the second base 7 is arranged on the connecting support 1, the second X-direction sliding assembly 8 is arranged on the second base 7 in a sliding mode, the second Y-direction sliding assembly 9 is arranged on the second X-direction sliding assembly 8 in a sliding mode, and the second Z-direction sliding assembly 10 is arranged on the second Y-direction sliding assembly 9;
the suction head 6 is mounted on the second Z-direction sliding assembly 10, and the suction head 6 is used for sucking the carrier plate 13. In the present embodiment, the carrier 13 includes a substrate 14, a film 15, and electronic components 16, the film 15 is mounted on the bottom of the substrate 14, and the electronic components 16 are respectively on the film 15.
A working method of a discharging, transferring and positioning device of a miniature electronic component 16 comprises the following steps:
s1: after cleaning the substrate 14, sticking a mucous membrane 15 on the bottom of the substrate 14;
s2: placing the electronic components 16 on the adhesive film 15 by a micro electronic component 16 transfer machine according to a set interval to form a carrier plate 13;
s3: the first moving mechanism drives the suction head 6 to suck the support plate 13;
s4: the optical positioning mechanism obtains the position of a bonding pad on the substrate 14, the first moving mechanism drives the suction head 6 to move, and the suction head 6 places the support plate 13 at the position of the bonding pad;
s5: the laser assembly 12 emits laser light to align with the pad position on the substrate 14, and melts tin of the electronic component to complete welding, and the substrate 14 is a transparent substrate. (ii) a
S6: after the electronic component 16 is soldered on the substrate 14, the suction head 6 takes out the soldered carrier 13, thereby separating the electronic component 16 from the carrier 13.
In this embodiment, in step S5, the laser module 12 adopts a single-point continuous irradiation method or a whole irradiation method.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. The utility model provides a miniature electronic component arranges material and shifts positioner which characterized in that: the device comprises a connecting bracket, a bearing platform, a first moving mechanism, a suction head, a second moving mechanism, an optical alignment mechanism and a laser assembly;
an optical alignment mechanism and a laser assembly are arranged at the top of the connecting support;
the first moving mechanism comprises a first base, a first X-direction sliding assembly and a first Y-direction sliding assembly, the first X-direction sliding assembly is slidably mounted on the first base, the first Y-direction sliding assembly is slidably mounted on the first X-direction sliding assembly, and the bearing platform is mounted on the first Y-direction sliding assembly;
the second moving mechanism comprises a second base, a second X-direction sliding assembly, a second Y-direction sliding assembly and a second Z-direction sliding assembly;
the second base is installed on the connecting support, the second X-direction sliding assembly is installed on the second base in a sliding mode, the second Y-direction sliding assembly is installed on the second X-direction sliding assembly in a sliding mode, and the second Z-direction sliding assembly is installed on the second Y-direction sliding assembly;
the suction head is arranged on the second Z-direction sliding assembly and used for sucking the carrier plate.
2. The discharging, transferring and positioning device for microelectronic assemblies according to claim 1, wherein: and a vacuum adsorption device is arranged on the bearing platform.
3. The discharging, transferring and positioning device for microelectronic assemblies according to claim 1, wherein: the carrier plate comprises a substrate, a mucous membrane and electronic components, wherein the mucous membrane is arranged at the bottom of the substrate, and the electronic components are respectively arranged on the mucous membrane.
4. A working method of a discharging, transferring and positioning device of a miniature electronic component is characterized in that: the method comprises the following steps:
s1: after cleaning the substrate, adhering a mucous membrane to the bottom of the substrate;
s2: placing the electronic components on a mucous membrane according to a set interval by a miniature electronic component transfer machine to form a carrier plate;
s3: the first moving mechanism drives the suction head to suck the support plate;
s4: the optical positioning mechanism obtains the position of a bonding pad on the substrate, the first moving mechanism drives the suction head to move, and the suction head places the support plate at the position of the bonding pad;
s5: the laser assembly is aligned to the position of the bonding pad on the substrate to emit laser, and tin of the electronic element is melted to complete welding;
s6: after the electronic component is welded on the substrate, the suction head takes out the welded carrier plate to realize the separation of the electronic component and the carrier plate.
5. The method as claimed in claim 4, wherein the positioning device comprises: in step S5, the laser module employs a single-point continuous irradiation method or a whole line irradiation method.
6. The method for operating a discharging, transferring and positioning device of microelectronic assemblies as claimed in claim 5, wherein the method comprises: the substrate is a transparent substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110593565.5A CN113178408A (en) | 2021-05-28 | 2021-05-28 | Discharging, transferring and positioning device for miniature electronic assembly and working method of discharging, transferring and positioning device |
| PCT/CN2021/137459 WO2022247228A1 (en) | 2021-05-28 | 2021-12-13 | Microelectronic assembly discharge, transfer, and positioning apparatus and operating method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110593565.5A CN113178408A (en) | 2021-05-28 | 2021-05-28 | Discharging, transferring and positioning device for miniature electronic assembly and working method of discharging, transferring and positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113178408A true CN113178408A (en) | 2021-07-27 |
Family
ID=76927205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110593565.5A Pending CN113178408A (en) | 2021-05-28 | 2021-05-28 | Discharging, transferring and positioning device for miniature electronic assembly and working method of discharging, transferring and positioning device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113178408A (en) |
| WO (1) | WO2022247228A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022247228A1 (en) * | 2021-05-28 | 2022-12-01 | 重庆翰博显示科技研发中心有限公司 | Microelectronic assembly discharge, transfer, and positioning apparatus and operating method therefor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117080106B (en) * | 2023-09-21 | 2024-02-06 | 北京海炬电子科技有限公司 | Real-time co-location detection device for LED chip mass transfer and use method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006032446A (en) * | 2004-07-13 | 2006-02-02 | Toshiba Corp | Mounting method for semiconductor component, and mounting device |
| CN110911334B (en) * | 2019-11-13 | 2021-06-15 | 东莞普莱信智能技术有限公司 | Positioning and laminating device and method for miniature electronic element |
| CN111715999A (en) * | 2020-05-28 | 2020-09-29 | 南昌欧菲显示科技有限公司 | Semiconductor device soldering apparatus and semiconductor device soldering method |
| CN111834262B (en) * | 2020-07-24 | 2023-08-08 | 錼创显示科技股份有限公司 | Microelectronic element transfer device and microelectronic element transfer method |
| CN113178408A (en) * | 2021-05-28 | 2021-07-27 | 重庆翰博显示科技研发中心有限公司 | Discharging, transferring and positioning device for miniature electronic assembly and working method of discharging, transferring and positioning device |
-
2021
- 2021-05-28 CN CN202110593565.5A patent/CN113178408A/en active Pending
- 2021-12-13 WO PCT/CN2021/137459 patent/WO2022247228A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022247228A1 (en) * | 2021-05-28 | 2022-12-01 | 重庆翰博显示科技研发中心有限公司 | Microelectronic assembly discharge, transfer, and positioning apparatus and operating method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022247228A1 (en) | 2022-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI699846B (en) | Apparatus and method for repairing led substrate | |
| CN113178408A (en) | Discharging, transferring and positioning device for miniature electronic assembly and working method of discharging, transferring and positioning device | |
| JP6995899B2 (en) | Defective LED removal device | |
| CN113097363B (en) | Repair equipment and repair method for micro light-emitting diode backboard | |
| CN212412015U (en) | Double-chip die bonder | |
| CN115206816A (en) | Method for heating and welding chip by heating plate | |
| CN215731597U (en) | Discharging, transferring and positioning device for miniature electronic component | |
| CN109587970B (en) | Lamp bead welding method | |
| CN213278026U (en) | High-precision and high-efficiency positioning and laminating device for miniature electronic element | |
| CN111508861B (en) | Semiconductor element bonding apparatus | |
| CN113013307A (en) | Display module fault chip repairing method | |
| TWI734956B (en) | Laser welding device for semiconductor element and method for using the same | |
| JP3246282B2 (en) | Display panel module manufacturing apparatus and display panel module manufacturing method | |
| CN110571159A (en) | instant self-compensation method for improving large-scale chipset positioning accuracy | |
| CN215200237U (en) | Semiconductor substrate laser cutting fixing jig | |
| CN115842073A (en) | Glass-based Mini-LED backlight substrate and preparation method thereof | |
| US11942432B2 (en) | Method for packaging COF | |
| CN104853540A (en) | SMT chip packaging process | |
| JP2889688B2 (en) | Method and apparatus for assembling electronic components | |
| CN212276148U (en) | Panel crimping check out test set | |
| JP5017041B2 (en) | Component mounting method and apparatus | |
| JP2012164706A (en) | Mounting device and mounting method of mounted member | |
| TWI650826B (en) | Fpc pre-main bonding machine | |
| TWI810025B (en) | Ultra-small led chip rework apparatus using transfer method and rework method thereof | |
| JP4579658B2 (en) | Mounting device and mounting method for mounted member |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |