WO2022247228A1 - Microelectronic assembly discharge, transfer, and positioning apparatus and operating method therefor - Google Patents
Microelectronic assembly discharge, transfer, and positioning apparatus and operating method therefor Download PDFInfo
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- WO2022247228A1 WO2022247228A1 PCT/CN2021/137459 CN2021137459W WO2022247228A1 WO 2022247228 A1 WO2022247228 A1 WO 2022247228A1 CN 2021137459 W CN2021137459 W CN 2021137459W WO 2022247228 A1 WO2022247228 A1 WO 2022247228A1
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- direction sliding
- sliding assembly
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- 238000004377 microelectronic Methods 0.000 title claims abstract description 41
- 238000011017 operating method Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 20
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 239000002313 adhesive film Substances 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims description 6
- 210000004400 mucous membrane Anatomy 0.000 claims description 6
- 238000001179 sorption measurement Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 abstract description 8
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000001680 brushing effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
Definitions
- Figure 1 For microelectronic components with tin, the light board crystal bonding process is shown in Figure 1. After the substrate is put into the flux coating equipment, it is transferred to the micro electronic component transfer equipment to fix the micro electronic components on the light board. Melting the tin through the reflow soldering equipment enables the microelectronic components to be reliably soldered and conducted.
- Figure 2 is the process of adding optical appearance inspection equipment according to the process of Figure 1.
- the overall output per unit time can be increased by 6 to 10 times, and multiple workstations can be saved to save equipment investment, such as tin brushing machines, tin thickness inspection machines, and reflow ovens. It can avoid the defect rate caused by the above three equipments, such as the alignment problem of the tin brushing machine or the thermal deformation of the substrate in the reflow oven.
- step S5 the laser component 12 adopts a single-point continuous irradiation method or a whole-line irradiation method.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A microelectronic assembly discharge, transfer, and positioning apparatus, comprising a connection support, a carrying platform, a first moving mechanism, a suction head, a second moving mechanism, an optical alignment mechanism, and a laser assembly. The optical alignment mechanism and the laser assembly are mounted on the top of the connection support. The first moving mechanism comprises a first base, a first X-direction sliding assembly, and a first Y-direction sliding assembly. The first X-direction sliding assembly is slidably mounted on the first base. The first Y-direction sliding assembly is slidably mounted on the first X-direction sliding assembly. The carrying assembly platform is mounted on the first Y-direction sliding assembly. The second moving mechanism comprises a second base, a second X-direction sliding assembly, a second Y-direction sliding assembly, and a second Z-direction sliding assembly. The problem of a deviation of a light-emitting angle of each microelectronic assembly caused by unevenness after soldering of microelectronic assemblies in a traditional microelectronic assembly transfer machine is effectively solved.
Description
本发明涉及显示屏加工设备领域，具体涉及一种微型电子组件排料转移定位装置及其工作方法。The invention relates to the field of display screen processing equipment, in particular to a microelectronic component discharge transfer positioning device and a working method thereof.
针对带锡的微型电子组件,其灯板固晶流程如图1所示，由基板投入到涂布助焊剂的设备后,转移到微型电子组件转移设备将微型电子组件固定在灯板上,在透过回流焊设备将锡融化使得微型电子组件可以确实地焊接导通。如图2是依照图1的流程再增加光学外观检验设备的流程.。For microelectronic components with tin, the light board crystal bonding process is shown in Figure 1. After the substrate is put into the flux coating equipment, it is transferred to the micro electronic component transfer equipment to fix the micro electronic components on the light board. Melting the tin through the reflow soldering equipment enables the microelectronic components to be reliably soldered and conducted. Figure 2 is the process of adding optical appearance inspection equipment according to the process of Figure 1.
现有的微型电子组件转移设备包含传统的吸取微型电子组件在透过摆臂的方式移动到载具或基板上在放置。或者是使用像专利201910622496.9与201911103759.1针刺型的转移方式。Existing transfer equipment for microelectronic components includes the traditional method of picking up microelectronic components and moving them to a carrier or a substrate by means of a swing arm for placement. Or use needle-punched transfer methods like patents 201910622496.9 and 201911103759.1.
目前带锡微型电子组件的做法为先在基板刷助焊剂或是锡膏,透过助焊剂或是锡膏的高黏度使得微型电子组件在排晶后可以暂时限制在位置上不致于受到轻微的震动而移位，此作法对于涂布助焊剂或是锡膏的工艺要求就会特别高,每个点位的助焊剂或是锡膏的量需要一致，当不一致时，微型电子组件就可能发生高低不平甚至移位的问题，此外因为助焊剂或是锡膏量的差异有可能进回流焊时会无法 确实地让锡与基板上的露铜位置焊好，而有机会发生假焊/空焊的问题，导致存在隐性不良问题因为回流焊设备产能较大，所以会有多台微型电子组件转移设备对应一台回流焊设备，虽然助焊剂或是锡膏可以暂时的固定住微型电子组件，但从微型电子组件转移设备透过传递治具的堆栈与搬运到回流焊设备之间，可能会发生少部分微型电子组件位移而发生不良现象。At present, the practice of microelectronic components with tin is to brush flux or solder paste on the substrate first. Through the high viscosity of flux or solder paste, the microelectronic components can be temporarily restricted in position after the chip is arranged, so as not to be slightly affected. Vibration and displacement, this method will have particularly high requirements for coating flux or solder paste. The amount of flux or solder paste at each point needs to be consistent. When inconsistent, microelectronic components may occur In addition, due to the difference in the amount of flux or solder paste, it may not be possible to solder the tin to the exposed copper on the substrate during reflow soldering, and false soldering/empty soldering may occur Due to the large production capacity of reflow soldering equipment, there will be multiple micro-electronic component transfer equipment corresponding to one reflow soldering equipment. Although flux or solder paste can temporarily fix micro-electronic components, However, between the stacking of the microelectronic component transfer equipment through the transfer jig and the transfer to the reflow soldering equipment, a small part of the microelectronic component may be displaced and cause adverse phenomena.
发明内容Contents of the invention
本发明针对现有技术的不足，提出一种微型电子组件排料转移定位装置及其工作方法，其中一种微型电子组件排料转移定位装置具体技术方案如下：Aiming at the deficiencies of the prior art, the present invention proposes a microelectronic component discharge transfer positioning device and its working method, wherein a specific technical scheme of a micro electronic component discharge transfer positioning device is as follows:
一种微型电子组件排料转移定位装置，其特征在于：包括连接支架、承载平台、第一移动机构、吸取头、第二移动机构、光学对位机构和激光组件；A device for discharging, transferring and positioning microelectronic components, characterized in that it includes a connecting bracket, a carrying platform, a first moving mechanism, a suction head, a second moving mechanism, an optical alignment mechanism and a laser component;
在所述连接支架顶部安装有光学对位机构和激光组件；An optical alignment mechanism and a laser assembly are installed on the top of the connecting bracket;
该第一移动机构包括第一基座、第一X向滑移组件和第一Y向滑移组件，所述第一X向滑移组件滑动安装在所述第一基座上，该第一Y向滑移组件滑动安装在所述第一X向滑移组件上，所述承载平台安装在所述第一Y向滑移组件上；The first moving mechanism includes a first base, a first X-direction sliding assembly and a first Y-direction sliding assembly, the first X-direction sliding assembly is slidably installed on the first base, the first The Y-direction sliding assembly is slidably installed on the first X-direction sliding assembly, and the carrying platform is installed on the first Y-direction sliding assembly;
所述第二移动机构包括第二基座、第二X向滑移组件、第二Y向滑移组件和第二Z向滑移组件；The second moving mechanism includes a second base, a second X-direction sliding assembly, a second Y-direction sliding assembly and a second Z-direction sliding assembly;
所述第二基座安装在所述连接支架上，所述第二X向滑移组件滑动安装在所述第二基座上，所述第二Y向滑移组件滑动安装在所述第二X向滑移组件上，所述第二Z向滑移组件安装在所述第二Y向滑移组件上；The second base is installed on the connecting bracket, the second X-direction sliding assembly is slidably installed on the second base, and the second Y-direction sliding assembly is slidably installed on the second On the X-direction sliding assembly, the second Z-direction sliding assembly is installed on the second Y-direction sliding assembly;
所述吸取头安装在所述第二Z向滑移组件上，所述吸取头用于吸取载板。The suction head is installed on the second Z-direction sliding assembly, and the suction head is used for suctioning the carrier board.
进一步地：在所述承载平台上安装有真空吸附装置。Further: a vacuum adsorption device is installed on the carrying platform.
进一步地：所述载板包括基板、黏膜和电子组件，该黏膜安装在基板的底部，该电子组件分别在黏膜上。Further: the carrier board includes a substrate, an adhesive film and electronic components, the adhesive film is mounted on the bottom of the substrate, and the electronic components are respectively on the adhesive film.
一种微型电子组件排料转移定位装置的工作方法，其特征在于：包括如下步骤：A working method of a microelectronic component discharge transfer positioning device, characterized in that it includes the following steps:
S1：将基板清洁后，在基板的底部贴附黏膜；S1: After the substrate is cleaned, stick a mucous membrane on the bottom of the substrate;
S2：通过微型电子组件转移机将电子组件按照设定间距放置在黏膜上形成载板；S2: Place the electronic components on the mucous membrane according to the set pitch by the micro electronic component transfer machine to form a carrier plate;
S3：第一移动机构带动吸取头吸取载板；S3: the first moving mechanism drives the suction head to absorb the carrier board;
S4：光学定位机构获取基板上的焊盘位置，第一移动机构带动吸取头移动，吸取头将载板放置到焊盘位置；S4: The optical positioning mechanism obtains the pad position on the substrate, the first moving mechanism drives the suction head to move, and the suction head places the carrier board to the pad position;
S5：激光组件对准基板上的焊盘位置发出激光，对电子元件的锡进行熔化完成焊接；S5: The laser component is aimed at the position of the pad on the substrate to emit laser light, and the tin of the electronic component is melted to complete the welding;
S6：电子组件焊接在基板上后，吸取头将完成焊接的载板取出，实现电子组件与载板的分离。S6: After the electronic components are soldered on the substrate, the suction head will take out the soldered carrier board to separate the electronic components from the carrier board.
进一步地：步骤S5中，激光组件采用单点连续照射方式或者整条照射方式。Further: in step S5, the laser component adopts a single-point continuous irradiation method or a whole-line irradiation method.
进一步地：所述基板采用透明基板。Further: the substrate is a transparent substrate.
本发明的有益效果为：本发明重点为透过一般的微型电子组件转移设备将微型电子组件依照最终所需要相对位置排列在载板上,再将微型电子透过本发明的转移设备将载板转移到基板并透过激光使得锡熔化并完成个微型电子组件与基板间的固定,可实现同时多数 颗的微型电子组件的转移且保证其平整度可以在0.005mm以下。有效解决微型电子组件703于传统微型电子组件转移机可能产生的焊接后不平整问题导致每个微型电子组件发光角度有偏差的问题。同时可以提升整体6～10倍单位时间产出量可以省去多个工站节省设备投入，如刷锡机、锡厚检察机、回流焊炉。可避免以上三台设备所造成的不良率，如刷锡机对位问题或是过完回流焊炉基板受热变形。The beneficial effects of the present invention are: the focus of the present invention is to arrange the microelectronic components on the carrier board according to the final required relative position through the general microelectronic component transfer equipment, and then transfer the microelectronic components to the carrier board through the transfer device of the present invention. Transfer to the substrate and melt the tin through the laser to complete the fixation between each microelectronic component and the substrate, which can realize the transfer of many microelectronic components at the same time and ensure that its flatness can be below 0.005mm. It effectively solves the problem that the microelectronic component 703 may have unevenness after welding caused by the traditional microelectronic component transfer machine, which leads to the deviation of the light angle of each microelectronic component. At the same time, the overall output per unit time can be increased by 6 to 10 times, and multiple workstations can be saved to save equipment investment, such as tin brushing machines, tin thickness inspection machines, and reflow ovens. It can avoid the defect rate caused by the above three equipments, such as the alignment problem of the tin brushing machine or the thermal deformation of the substrate in the reflow oven.
图1为本发明的整体结构图；Fig. 1 is the overall structural diagram of the present invention;
图2为图1的A向示意图；Fig. 2 is a schematic diagram of direction A of Fig. 1;
图中附图说明为，连接支架1、承载平台2、第一基座3、第一X向滑移组件4、第一Y向滑移组件5、吸取头6、第二基座7、第二X向滑移组件8、第二Y向滑移组件9、第二Z向滑移组件10、光学对位机构11、激光组件12、载板13、基板14、黏膜15、电子组件16、真空吸附装置17。The drawings in the figure show that the connection bracket 1, the carrying platform 2, the first base 3, the first X-direction sliding assembly 4, the first Y-direction sliding assembly 5, the suction head 6, the second base 7, the first Two X-direction sliding components 8, a second Y-direction sliding component 9, a second Z-direction sliding component 10, an optical alignment mechanism 11, a laser component 12, a carrier plate 13, a substrate 14, a mucous membrane 15, an electronic component 16, Vacuum suction device 17.
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
如图1和图2所示：As shown in Figure 1 and Figure 2:
一种微型电子组件排料转移定位装置，包括连接支架1、承载平台2、第一移动机构、吸取头6、第二移动机构、光学对位机构11和激光组件12；A device for discharging, transferring and positioning microelectronic components, including a connecting bracket 1, a carrying platform 2, a first moving mechanism, a suction head 6, a second moving mechanism, an optical alignment mechanism 11 and a laser component 12;
在连接支架1顶部安装有光学对位机构11和激光组件12；An optical alignment mechanism 11 and a laser assembly 12 are installed on the top of the connecting bracket 1;
该第一移动机构包括第一基座3、第一X向滑移组件4和第一Y向滑移组件5，第一X向滑移组件4滑动安装在第一基座3上，该第一Y向滑移组件5滑动安装在第一X向滑移组件4上，承载平台2安装在第一Y向滑移组件5上，在承载平台2上安装有真空吸附装置17，通过该真空吸附装置17使得载板稳当的固定在承载平台上；The first moving mechanism includes a first base 3, a first X-direction sliding assembly 4 and a first Y-direction sliding assembly 5, the first X-direction sliding assembly 4 is slidably installed on the first base 3, and the first X-direction sliding assembly 4 is slidably installed on the first base 3. A Y-direction sliding assembly 5 is slidably installed on the first X-direction sliding assembly 4, the carrying platform 2 is installed on the first Y-direction sliding assembly 5, and a vacuum adsorption device 17 is installed on the carrying platform 2, through which the vacuum The adsorption device 17 makes the carrier plate firmly fixed on the carrying platform;
第二移动机构包括第二基座7、第二X向滑移组件8、第二Y向滑移组件9和第二Z向滑移组件10；The second moving mechanism includes a second base 7, a second X-direction sliding assembly 8, a second Y-direction sliding assembly 9 and a second Z-direction sliding assembly 10;
第二基座7安装在连接支架1上，第二X向滑移组件8滑动安装在第二基座7上，第二Y向滑移组件9滑动安装在第二X向滑移组件8上，第二Z向滑移组件10安装在第二Y向滑移组件9上；The second base 7 is installed on the connecting bracket 1, the second X-direction sliding assembly 8 is slidably installed on the second base 7, and the second Y-direction sliding assembly 9 is slidably installed on the second X-direction sliding assembly 8 , the second Z-direction sliding assembly 10 is installed on the second Y-direction sliding assembly 9;
吸取头6安装在第二Z向滑移组件10上，吸取头6用于吸取载板13。在本实施例中，载板13包括基板14、黏膜15和电子组件16，该黏膜15安装在基板14的底部，该电子组件16分别在黏膜15上。The suction head 6 is installed on the second Z-direction sliding assembly 10 , and the suction head 6 is used for suctioning the carrier board 13 . In this embodiment, the carrier 13 includes a substrate 14 , an adhesive film 15 and electronic components 16 , the adhesive film 15 is mounted on the bottom of the substrate 14 , and the electronic components 16 are respectively on the adhesive film 15 .
一种微型电子组件16排料转移定位装置的工作方法，包括如下步骤：A working method of a microelectronic assembly 16 discharge transfer positioning device, comprising the following steps:
S1：将基板14清洁后，在基板14的底部贴附黏膜15；S1: After the substrate 14 is cleaned, stick the adhesive film 15 on the bottom of the substrate 14;
S2：通过微型电子组件16转移机将电子组件16按照设定间距放置在黏膜15上形成载板13；S2: Place the electronic components 16 on the mucous membrane 15 according to the set interval by the transfer machine of the micro electronic components 16 to form the carrier plate 13;
S3：第一移动机构带动吸取头6吸取载板13；S3: the first moving mechanism drives the suction head 6 to suck the carrier plate 13;
S4：光学定位机构获取基板14上的焊盘位置，第一移动机构带动吸取头6移动，吸取头6将载板13放置到焊盘位置；S4: The optical positioning mechanism obtains the position of the pad on the substrate 14, the first moving mechanism drives the suction head 6 to move, and the suction head 6 places the carrier board 13 to the position of the pad;
S5：激光组件12对准基板14上的焊盘位置发出激光，对电子元件的锡进行熔化完成焊接，基板14采用透明基板。；S5: The laser component 12 emits laser light at the position of the pad on the substrate 14 to melt the tin of the electronic component to complete the welding, and the substrate 14 is a transparent substrate. ;
S6：电子组件16焊接在基板14上后，吸取头6将完成焊接的载板13取出，实现电子组件16与载板13的分离。S6 : After the electronic component 16 is soldered on the substrate 14 , the suction head 6 takes out the soldered carrier 13 to separate the electronic component 16 from the carrier 13 .
其中，在本实施例中，步骤S5中，激光组件12采用单点连续照射方式或者整条照射方式。Wherein, in this embodiment, in step S5, the laser component 12 adopts a single-point continuous irradiation method or a whole-line irradiation method.
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。It will be apparent to those skilled in the art that the invention is not limited to the details of the above-described exemplary embodiments, but that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Accordingly, the embodiments should be regarded in all points of view as exemplary and not restrictive, the scope of the invention being defined by the appended claims rather than the foregoing description, and it is therefore intended that the scope of the invention be defined by the appended claims rather than by the foregoing description. All changes within the meaning and range of equivalents of the elements are embraced in the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。In addition, it should be understood that although this specification is described according to implementation modes, not each implementation mode only includes an independent technical solution, and this description in the specification is only for clarity, and those skilled in the art should take the specification as a whole , the technical solutions in the various embodiments can also be properly combined to form other implementations that can be understood by those skilled in the art.
Claims (6)
- 一种微型电子组件排料转移定位装置，其特征在于：包括连接支架、承载平台、第一移动机构、吸取头、第二移动机构、光学对位机构和激光组件；A device for discharging, transferring and positioning microelectronic components, characterized in that it includes a connecting bracket, a carrying platform, a first moving mechanism, a suction head, a second moving mechanism, an optical alignment mechanism and a laser component;在所述连接支架顶部安装有光学对位机构和激光组件；An optical alignment mechanism and a laser assembly are installed on the top of the connecting bracket;该第一移动机构包括第一基座、第一X向滑移组件和第一Y向滑移组件，所述第一X向滑移组件滑动安装在所述第一基座上，该第一Y向滑移组件滑动安装在所述第一X向滑移组件上，所述承载平台安装在所述第一Y向滑移组件上；The first moving mechanism includes a first base, a first X-direction sliding assembly and a first Y-direction sliding assembly, the first X-direction sliding assembly is slidably installed on the first base, the first The Y-direction sliding assembly is slidably installed on the first X-direction sliding assembly, and the carrying platform is installed on the first Y-direction sliding assembly;所述第二移动机构包括第二基座、第二X向滑移组件、第二Y向滑移组件和第二Z向滑移组件；The second moving mechanism includes a second base, a second X-direction sliding assembly, a second Y-direction sliding assembly and a second Z-direction sliding assembly;所述第二基座安装在所述连接支架上，所述第二X向滑移组件滑动安装在所述第二基座上，所述第二Y向滑移组件滑动安装在所述第二X向滑移组件上，所述第二Z向滑移组件安装在所述第二Y向滑移组件上；The second base is installed on the connecting bracket, the second X-direction sliding assembly is slidably installed on the second base, and the second Y-direction sliding assembly is slidably installed on the second On the X-direction sliding assembly, the second Z-direction sliding assembly is installed on the second Y-direction sliding assembly;所述吸取头安装在所述第二Z向滑移组件上，所述吸取头用于吸取载板。The suction head is installed on the second Z-direction sliding assembly, and the suction head is used for suctioning the carrier board.
- 根据权利要求1所述一种微型电子组件排料转移定位装置，其特征在于：在所述承载平台上安装有真空吸附装置。The device for discharging, transferring and locating microelectronic components according to claim 1, wherein a vacuum adsorption device is installed on the carrying platform.
- 根据权利要求1所述一种微型电子组件排料转移定位装置，其特征在于：所述载板包括基板、黏膜和电子组件，该黏膜安装在基板的底部，该电子组件分别在黏膜上。According to claim 1, the device for discharging, transferring and positioning micro electronic components is characterized in that: the carrier board includes a substrate, an adhesive film and electronic components, the adhesive film is mounted on the bottom of the substrate, and the electronic components are respectively on the adhesive film.
- 一种微型电子组件排料转移定位装置的工作方法，其特征在 于：包括如下步骤：A working method of a miniature electronic component discharge transfer positioning device is characterized in that: comprising the following steps:S1：将基板清洁后，在基板的底部贴附黏膜；S1: After the substrate is cleaned, stick a mucous membrane on the bottom of the substrate;S2：通过微型电子组件转移机将电子组件按照设定间距放置在黏膜上形成载板；S2: Place the electronic components on the mucous membrane according to the set pitch by the micro electronic component transfer machine to form a carrier plate;S3：第一移动机构带动吸取头吸取载板；S3: the first moving mechanism drives the suction head to absorb the carrier board;S4：光学定位机构获取基板上的焊盘位置，第一移动机构带动吸取头移动，吸取头将载板放置到焊盘位置；S4: The optical positioning mechanism obtains the pad position on the substrate, the first moving mechanism drives the suction head to move, and the suction head places the carrier board to the pad position;S5：激光组件对准基板上的焊盘位置发出激光，对电子元件的锡进行熔化完成焊接；S5: The laser component is aimed at the position of the pad on the substrate to emit laser light, and the tin of the electronic component is melted to complete the welding;S6：电子组件焊接在基板上后，吸取头将完成焊接的载板取出，实现电子组件与载板的分离。S6: After the electronic components are soldered on the substrate, the suction head will take out the soldered carrier board to separate the electronic components from the carrier board.
- 根据权利要求4所述一种微型电子组件排料转移定位装置的工作方法，其特征在于：步骤S5中，激光组件采用单点连续照射方式或者整条照射方式。According to claim 4, the working method of the device for discharging, transferring and locating microelectronic components is characterized in that: in step S5, the laser component adopts a single-point continuous irradiation method or a whole-line irradiation method.
- 根据权利要求5所述一种微型电子组件排料转移定位装置的工作方法，其特征在于：所述基板采用透明基板。According to claim 5, the working method of the discharge, transfer and positioning device for microelectronic components is characterized in that: the substrate is a transparent substrate.
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| CN202110593565.5A CN113178408A (en) | 2021-05-28 | 2021-05-28 | Discharging, transferring and positioning device for miniature electronic assembly and working method of discharging, transferring and positioning device |
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