CN107708329A - The method that BGA plants ball and assembling is realized in a kind of once backflow simultaneously - Google Patents
The method that BGA plants ball and assembling is realized in a kind of once backflow simultaneously Download PDFInfo
- Publication number
- CN107708329A CN107708329A CN201710771986.6A CN201710771986A CN107708329A CN 107708329 A CN107708329 A CN 107708329A CN 201710771986 A CN201710771986 A CN 201710771986A CN 107708329 A CN107708329 A CN 107708329A
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- bga
- ball
- substrate
- bga device
- assembling
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- 238000000034 method Methods 0.000 title claims abstract description 78
- 229910000679 solder Inorganic materials 0.000 claims abstract description 44
- 238000003466 welding Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 65
- 238000007639 printing Methods 0.000 claims description 51
- 238000005476 soldering Methods 0.000 claims description 39
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 18
- 229910000831 Steel Inorganic materials 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000010959 steel Substances 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000006071 cream Substances 0.000 claims description 4
- 230000004907 flux Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000004745 nonwoven fabric Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 230000003134 recirculating effect Effects 0.000 claims description 4
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 7
- 238000012360 testing method Methods 0.000 description 5
- 238000010992 reflux Methods 0.000 description 4
- 230000007812 deficiency Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a kind of once backflow to realize that BGA (ball grid array) plants ball and the method for assembling, belongs to component Assembly field simultaneously.Method proposed by the present invention can improve the reliability of welding point, and traditional ball-establishing method device-side solder joint need to undergo to flow back twice, and the intermetallic compound that solder is formed with device-side Cu pads in solder reflow process can thicken；Due to the fragility of intermetallic compound, blocked up intermetallic compounds layer can cause joint performance to reduce；Device-side, which once flows back, can reduce the thickness of intermetallic compound, so as to improve the reliability of device-side solder joint.
Description
Technical field
The present invention relates to a kind of once backflow to realize that BGA (ball grid array) plants ball and the method for assembling, belongs to first device simultaneously
Part Assembly field.
Background technology
The IC-components of BGA Package (BGA, Ball Grid Array Package) are the passes of electronic product
Key device, its price are high.Because solder joint failure, soldered ball defect, lead-free solder ball have many reasons such as leaded, it is necessary to be sealed to BGA
The soldered ball of dress device is planted ball again, then is assembled on circuit board.
Traditional bga device plants the reparation of device after the problems such as ball technique is mainly used in device solder joint failure generation
Journey is welded again, it is necessary to be planted ball after device is pulled down again.And after there is device solder joint failure in the highly reliable field such as space flight,
It is generally necessary to the bga device more renewed, the bga device after being heated is no longer used in formal product, so as to develop
Journey is not related to BGA and plants ball technique.Therefore, traditional bga device ball-establishing method is seldom applied in the highly reliable field such as space flight.
Traditional BGA plants ball and device packaging technology, carries out ball to BGA device first, plants ball and device reflow soldering,
New BGA device is formed, then by device reflow soldering in printed board, this method has following deficiency：
1) packaging technology need to carry out reflow soldering twice to the plant ball of this method to device again, i.e., the device experience one when planting ball
Secondary weld heating process, device undergoes a weld heating process again after assembling；The highest temperature of welding procedure is whole up to 215 DEG C
Individual process lasts about 6min.Weld heating process can impact to device reliability twice.
2) consider solder joint long-term reliability when BGA plants ball, typically use Sn10Pb90 compositions (270 DEG C~300 DEG C of fusing point)
High lead welding ball.Traditional high shot technique of plant is higher to requirements such as the cleannes of soldered ball, soldering paste viscosityes, and soldered ball easily occurs
Crooked quality problems.
The content of the invention
The technology of the present invention solves problem：Overcome the deficiencies in the prior art, propose that a kind of once backflow realizes BGA simultaneously
The method for planting ball and assembling.
The present invention technical solution be：
The method that BGA plants ball and assembling is realized in a kind of once backflow simultaneously, is included the step of this method：
(1) soldered ball in BGA device is removed；
(2) Printing Paste on the pad of BGA device；
(3) Printing Paste on substrate；
(4) plant ball is carried out on the soldering paste of the substrate obtained in step (3)；
(5) BGA device is mounted on the soldered ball for the substrate that step (4) obtains；
(6) backflow assembling is carried out, obtains the assembly containing BGA device.
In described step (1), the method for removing the soldered ball in BGA device is：
I lies against BGA device pin on workbench upward, and scaling powder is filled on BGA device surface using hairbrush；
Ii removes the soldered ball in BGA device using blade type solder horn；The width of described solder horn is 10-15mm；
Blade type solder horn is affixed on by iii to be inhaled on tin rope, for clearing up the remaining scolding tin on BGA device surface, is slided and is inhaled tin
Rope, and not to BGA device surface applying power；
Iv gently cleans the bond pad surface of BGA device with absolute ethyl alcohol non-woven fabrics, removes residual flux.
In described step (ii), the method that the soldered ball in BGA device is removed using blade type solder horn is：Flatiron is light
BGA device surface is pasted, from BGA device while gently scooping up the soldered ball of melting to opposite side, then will stay on solder horn
Unnecessary scolding tin is cleared up on wet sponge；According to said method remove all device surface soldered balls.
In described step (2), the method for Printing Paste is：The technique that mould printing is used on the pad of BGA device
Carry out Printing Paste.
Use mould printing technique carry out Printing Paste process for：BGA device is fixed on workbench, by template
The pad of BGA device is directed at, the pad of template and BGA device is in close contact by pressuring template edge, is stained with soldering paste with scraper and opens
Beginning Printing Paste, scraper and template are printed into 35-55 degree angle, uniformly firmly, scraper uniform motion, one-step print；It is completed for printing
Put down afterwards and lift template.
In described step (3), the method for Printing Paste is：Carried out on the pad of substrate using the technique of mould printing
Printing Paste.
Use mould printing technique carry out Printing Paste process for：Substrate is fixed on workbench, by template pair
The pad of quasi- substrate, it is in close contact the pad of template and substrate by pressuring template edge, being stained with soldering paste with scraper starts printing weldering
Cream, scraper and template are printed into 35-55 degree angle, uniformly firmly, scraper uniform motion, one-step print；Put down and lift after being completed for printing
Template.
In described step (4), soldered ball is positioned over using full-automatic chip mounter when carrying out plant ball on the soldering paste of substrate
On the soldering paste of substrate, step includes：
I makes a charging tray, and charging tray is positioned in the box body of a plane；Multiple manholes are carried on charging tray, it is circular
The diameter of through hole is bigger 0.07-0.12mm than Diameter of Solder Ball, and the material of charging tray is steel plate, and the thickness of steel plate is 0.1-0.15mm, will
Soldered ball is positioned in the manhole of charging tray, then the charging tray for being placed with soldered ball is positioned over to the feed bin position of full-automatic chip mounter
Put；
Ii puts Board position by what the substrate for being printed with soldering paste was positioned over full-automatic chip mounter；
Iii carries out attachment programming according to the position of pad on the position of soldered ball in feed bin and substrate；
Iv is mounted soldered ball to the pad locations of substrate one by one using the program finished.
In described step (5), method BGA device being mounted on the soldered ball of substrate is：
I makes frock, and supports BGA device with the frock；The frock is with reeded flat board, the madial wall of the flat board
On also carry a breach；The size of groove is smaller 0.2mm than the size of BGA device, and the frock is used to support BGA device, the frock
On groove be used to make somebody a mere figurehead the soldering paste position of BGA device；The pad of BGA device is down；
The frock for being placed with BGA device is positioned over the feed bin position of full-automatic chip mounter by ii, then by the base after plant ball
What plate was positioned over full-automatic chip mounter puts Board position；
Iii carries out attachment programming according to the position of soldered ball on the position of BGA device in feed bin and substrate；
Iv is mounted BGA device to the soldered ball of substrate using the program finished.
In described step (6), the method for carrying out backflow assembling is：The substrate for being pasted with BGA device is positioned over backflow
Welded in stove, the heating rate of reflow soldering curve is less than 3 DEG C/s, 205~220 DEG C of maximum temperature, and the recirculating zone time is
60~120s, rate of temperature fall are 1~6 DEG C/s, after the solder paste melts in BGA device and substrate, form qualified BGA solder joints.
Beneficial effect
(1) charging tray that makes of the present invention can ensure that soldered ball is put into hole and be fixed, at the same will not occur due to hole is small can not
The problem of pickup；
(2) present invention has made device accommodating tool, it is ensured that soldering paste is not touched when the device after print soldering paste is placed down
Touch, while supporting device, the Fixture Design and processing are simple and easy, easy to operate；
(3) present invention in substrate plant ball soldered ball is mounted as component using mounting device, this method not by
The influence of the parameters such as device appearance and size, soldered ball quantity, Diameter of Solder Ball, ball spacing；
(4) method proposed by the present invention reduces BGA device and plants ball and assemble in reflux course by the risk of thermal failure, passes
The ball-establishing method of system is once heated at reflux to device respectively after device plants ball and when device assembles respectively, and the present invention
Method only can once be realized to device heating plants ball and assembling, reduces the influence of device heat-shock；
(5) method proposed by the present invention can solve the soldered ball offset problem during BGA device plant ball, and traditional BGA plants
When ball method plants ball using high lead (Pb90Sn10) soldered ball, easy generating device offset problem.This project uses high lead
(Pb90Sn10) when soldered ball once flows back, because soldered ball is acted on by device and substrate-side soldering paste simultaneously, offset in the absence of soldered ball
Phenomenon；
(6) method proposed by the present invention can improve the reliability of welding point, and traditional ball-establishing method device-side solder joint needs
Experience flows back twice, and the intermetallic compound that solder is formed with device-side Cu pads in solder reflow process can thicken；Due to gold
The fragility of compound between category, blocked up intermetallic compounds layer can cause joint performance to reduce；Device-side, which once flows back, to be reduced
The thickness of intermetallic compound, so as to improve the reliability of device-side solder joint；
(7) there is leaded work using what the achievement of the present invention realized the unleaded BGA device of satellite data processor product, and
It ensure that the reliability of solder joint；The electronic product of satellite fields realizes that unleaded BGA device is unleaded first at home；Product is subjected to
Every environmental test examination of satellite positive sample, steady quality, there is leading advantage of the same trade in reliability etc..
Brief description of the drawings
Fig. 1 is the method flow schematic diagram of the present invention；
Fig. 2 is the structural representation of the charging tray of the present invention；
Fig. 3 is the structural representation of the frock of the present invention.
Embodiment
The method that BGA plants ball and assembling is realized in a kind of once backflow simultaneously, and this method prints soldering paste first on substrate and plants ball,
And will be positioned over after the BGA device print soldering paste without soldered ball on soldered ball, soldering paste once returns with BGA soldered balls when whole plate assembles on substrate
Stream fusing, includes the step of this method：
(1) soldered ball in BGA device is removed；
The method detailed of removal is：I lies against BGA device pin on workbench upward, using hairbrush in BGA device table
Face fills scaling powder；Ii removes the soldered ball in BGA device using blade type solder horn, and the width of solder horn is 10-15mm；Remove
Flatiron is gently pasted to BGA device surface during soldered ball, from BGA device while gently scooping up the soldered ball of melting to opposite side, then will be stopped
The unnecessary scolding tin stayed on solder horn is cleared up on wet sponge；According to said method remove all device surface soldered balls；Iii is by knife
Chip solder horn, which is affixed on, to be inhaled on tin rope, for clearing up the remaining scolding tin on BGA device surface, should gently be slided and be inhaled tin rope, should not be right
BGA device surface applying power；Iv gently cleans the bond pad surface of BGA device with absolute ethyl alcohol non-woven fabrics, is helped for removing residual
Solder flux, surface answer flux-free to remain；It is required that the bond pad surface of BGA device it is smooth, it is smooth, without it is raised, without residual tin；
(2) Printing Paste on the pad of BGA device；
The detailed way of Printing Paste is：Printing Paste is carried out using the technique of mould printing on the pad of BGA device,
Operating process is as follows：
BGA device is fixed on workbench, by template be aligned BGA device pad, light pressuring template edge make template with
The pad of BGA device is in close contact, and is stained with soldering paste with scraper and is started Printing Paste, scraper and template and printed into 35-55 degree angle,
It is even to exert oneself, scraper uniform motion, one-step print；Put down after being completed for printing and lift template；
(3) Printing Paste on substrate；
The detailed way of Printing Paste is：Printing Paste, behaviour are carried out using the technique of mould printing on the pad of substrate
It is as follows to make process：
Substrate is fixed on workbench, template is aligned to the pad of substrate, light pressuring template edge makes template and substrate
Pad is in close contact, and being stained with soldering paste with scraper starts Printing Paste, scraper and template into the printing of 35-55 degree angle, uniformly firmly, scrapes
Knife uniform motion, one-step print；Put down after being completed for printing and lift template；
(4) plant ball is carried out on the soldering paste of the substrate obtained in step (3), soldered ball is positioned over base using full-automatic chip mounter
On the soldering paste of plate；
Detailed way is as follows：
I makes a charging tray, and charging tray is positioned in the box body of a plane；Multiple manholes are carried on charging tray, it is circular
The diameter of through hole is bigger 0.07-0.12mm than Diameter of Solder Ball, and the material of charging tray is steel plate, and the thickness of steel plate is 0.1-0.15mm, will
Soldered ball is positioned in the manhole of charging tray, then the charging tray for being placed with soldered ball is positioned over to the feed bin position of full-automatic chip mounter
Put；Ii puts Board position by what the substrate for being printed with soldering paste was positioned over full-automatic chip mounter；Iii according to the position of soldered ball in feed bin and
The position of pad carries out attachment programming on substrate；Iv is mounted soldered ball to the pad locations of substrate one by one using the program finished；
(5) BGA device is mounted on the soldered ball for the substrate that step (4) obtains；
Detailed way is：
I makes frock, and supports BGA device with the frock；The frock is with reeded flat board, the madial wall of the flat board
On also carry a breach；The size of groove is smaller 0.2mm than the size of BGA device, and the frock is used to support BGA device, the frock
On groove be used to make somebody a mere figurehead the soldering paste position of BGA device；The pad of BGA device is down；
The frock for being placed with BGA device is positioned over the feed bin position of full-automatic chip mounter by ii, then by the base after plant ball
What plate was positioned over full-automatic chip mounter puts Board position；
Iii carries out attachment programming according to the position of soldered ball on the position of BGA device in feed bin and substrate；
Iv is mounted BGA device to the soldered ball of substrate using the program finished, i.e. the pad of BGA device and all welderings
Ball is uniform contact；
(6) backflow assembling；
The substrate for being pasted with BGA device that step (5) obtains is positioned in reflow ovens and welded, reflow soldering curve
Heating rate be less than 3 DEG C/s, 205~220 DEG C of maximum temperature, the recirculating zone time is 60~120s, rate of temperature fall is 1~6 DEG C/
s.After solder paste melts in BGA device and substrate, qualified BGA solder joints are formed, realize plant ball and the assembling of BGA device.
Template used in described step (3) is identical with the template used in step (2).
The invention will be further described with reference to the accompanying drawings and examples.
Embodiment
Due to the cost control of fast intelligence connection satellite, substantial amounts of unleaded BGA device is applied in certain data processor product, is adopted
There is leaded work with The inventive method achieves unleaded BGA device, as shown in figure 1, the process of this method is：
(1) soldered ball in BGA device is removed
I lies against the unleaded BGA device pin of 1738 pins in data processor product on workbench upward, uses
Hairbrush fills scaling powder on BGA device surface；
Ii removes the soldered ball in BGA device using the blade type solder horn that width is 15mm；Remove during soldered ball that flatiron is light
BGA device surface is pasted, from BGA device while gently scooping up the soldered ball of melting to opposite side, then will stay on solder horn
Unnecessary scolding tin is cleared up on wet sponge；According to said method remove all device surface soldered balls；
Blade type solder horn is affixed on by iii to be inhaled on tin rope, for clearing up the remaining scolding tin on BGA device surface, should gently be slided
It is dynamic to inhale tin rope, should not be to BGA device surface applying power；
Iv gently cleans the bond pad surface of BGA device with absolute ethyl alcohol non-woven fabrics, and for removing residual flux, surface should
Flux-free remains；The bond pad surface of BGA device is smooth, it is smooth, without it is raised, without residual tin；
(2) Printing Paste on the pad of BGA device；
BGA device is fixed on workbench, by template be aligned BGA device pad, light pressuring template edge make template with
The pad of BGA device is in close contact, and being stained with soldering paste with scraper starts Printing Paste, and into about 45 degree of angles are printed for scraper and template,
It is even to exert oneself, scraper uniform motion, one-step print；Put down after being completed for printing and lift template；
(3) Printing Paste on substrate；
Substrate is fixed on workbench, template is aligned to the pad of substrate, light pressuring template edge makes template and substrate
Pad is in close contact, and being stained with soldering paste with scraper starts Printing Paste, the into about 45 degree of angle printings of scraper and template, uniformly firmly, scrapes
Knife uniform motion, one-step print；Put down after being completed for printing and lift template.
(4) plant ball is carried out on the soldering paste of the substrate obtained in step (3), soldered ball is positioned over base using full-automatic chip mounter
On the soldering paste of plate；
I makes a charging tray, as shown in Fig. 2 and charging tray is positioned in the box body of a plane；25 × 25 are carried on charging tray
Manhole, the diameter of manhole is bigger 0.1mm than Diameter of Solder Ball, and the material of charging tray is steel plate, and the thickness of steel plate is 0.15mm,
Soldered ball is positioned in the manhole of charging tray, then the charging tray for being placed with soldered ball is positioned over to the feed bin position of full-automatic chip mounter
Put；
Ii puts Board position by what the substrate for being printed with soldering paste was positioned over full-automatic chip mounter；
Iii carries out attachment programming according to the position of pad on the position of soldered ball in feed bin and substrate；
Iv is mounted soldered ball to the pad locations of substrate one by one using the program finished；
(5) BGA device is mounted on the soldered ball for the substrate that step (4) obtains；
I makes frock, as shown in figure 3, and supporting BGA device with the frock；The frock is with reeded flat board, and this is flat
A breach is also carried on the madial wall of plate；The size of groove is 42.3mm, smaller 0.2mm than BGA device body dimension, and the frock is used
In the soldering paste position that the groove in support BGA device, the frock is used to make somebody a mere figurehead BGA device；The pad of BGA device is down；
The frock for being placed with BGA device is positioned over the feed bin position of full-automatic chip mounter by ii, then by the base after plant ball
What plate was positioned over full-automatic chip mounter puts Board position；
Iii carries out attachment programming according to the position of soldered ball on the position of BGA device in feed bin and substrate；
Iv is mounted BGA device to the soldered ball of substrate using the program finished, i.e. the pad of BGA device and all welderings
Ball is uniform contact；
(6) backflow assembling；
The substrate for being pasted with BGA device that step (5) obtains is positioned in hot air reflux stove and welded, hot air reflux
The heating rate of welding curve be 1.1 DEG C/s, and maximum temperature is 218 DEG C, and the recirculating zone time is 85s, rate of temperature fall for 2.3 DEG C/
s.After solder paste melts in BGA device and substrate, qualified BGA solder joints are formed, realize plant ball and the assembling of BGA device.
Outer row's solder joint outward appearance is examined using 45 power microscopes to the BGA device after assembling, and internal welding is examined using X-ray machine
Point mass, solder joint pattern, bubble etc. meets ECSS-Q-ST-70-38C aerospace standards.
3 BGA devices assembling exemplar after assembling is carried out according to ECSS-Q-ST-70-38C environmental test standard
Random vibration test and 500 temperature cycling tests, outer row's solder joint outward appearance is examined using 45 power microscopes after experiment, and use X
Ray machine examines internal quality of welding spot, and butt welding point has carried out incision test according to standard requirement, and quality of welding spot meets ECSS-Q-
Requirement of the ST-70-38C standards to solder joint after experiment.
Claims (10)
1. the method that BGA plants ball and assembling is realized in a kind of once backflow simultaneously, it is characterised in that is included the step of this method：
(1) soldered ball in BGA device is removed；
(2) Printing Paste on the pad of BGA device；
(3) Printing Paste on substrate；
(4) plant ball is carried out on the soldering paste of the substrate obtained in step (3)；
(5) BGA device is mounted on the soldered ball for the substrate that step (4) obtains；
(6) backflow assembling is carried out.
2. the method that BGA plants ball and assembling is realized in a kind of once backflow according to claim 1 simultaneously, it is characterised in that：
In described step (1), the method for removing the soldered ball in BGA device is：
I lies against BGA device pin on workbench upward, and scaling powder is filled on BGA device surface using hairbrush；
Ii removes the soldered ball in BGA device using blade type solder horn；The width of described solder horn is 10-15mm；
Blade type solder horn is affixed on by iii to be inhaled on tin rope, for clearing up the remaining scolding tin on BGA device surface, is slided and is inhaled tin rope, and
Not to BGA device surface applying power；
Iv gently cleans the bond pad surface of BGA device with absolute ethyl alcohol non-woven fabrics, removes residual flux.
3. the method that BGA plants ball and assembling is realized in a kind of once backflow according to claim 2 simultaneously, it is characterised in that：
In described step (ii), the method that the soldered ball in BGA device is removed using blade type solder horn is：Flatiron is gently pasted to BGA devices
Part surface, from BGA device while gently scooping up the soldered ball of melting to opposite side, the unnecessary scolding tin that then will stay on solder horn
Cleared up on wet sponge；According to said method remove all device surface soldered balls.
4. the method that BGA plants ball and assembling is realized in a kind of once backflow according to claim 1 simultaneously, it is characterised in that：
In described step (2), the method for Printing Paste is：Printed on the pad of BGA device using the technique of mould printing
Soldering paste.
5. the method that BGA plants ball and assembling is realized in a kind of once backflow according to claim 4 simultaneously, it is characterised in that：
Use mould printing technique carry out Printing Paste process for：BGA device is fixed on workbench, template is directed at BGA
The pad of device, it is in close contact the pad of template and BGA device by pressuring template edge, being stained with soldering paste with scraper starts printing weldering
Cream, scraper and template are printed into 35-55 degree angle, uniformly firmly, scraper uniform motion, one-step print；Put down and lift after being completed for printing
Template.
6. the method that BGA plants ball and assembling is realized in a kind of once backflow according to claim 1 simultaneously, it is characterised in that：
In described step (3), the method for Printing Paste is：Printing weldering is carried out using the technique of mould printing on the pad of substrate
Cream.
7. the method that BGA plants ball and assembling is realized in a kind of once backflow according to claim 6 simultaneously, it is characterised in that：
Use mould printing technique carry out Printing Paste process for：Substrate is fixed on workbench, template is directed at substrate
Pad, is in close contact the pad of template and substrate by pressuring template edge, and being stained with soldering paste with scraper starts Printing Paste, scraper and
Template is printed into 35-55 degree angle, uniformly firmly, scraper uniform motion, one-step print；Put down after being completed for printing and lift template.
8. the method that BGA plants ball and assembling is realized in a kind of once backflow according to claim 1 simultaneously, it is characterised in that：
In described step (4), soldered ball is positioned over to the weldering of substrate when carrying out plant ball on the soldering paste of substrate using full-automatic chip mounter
On cream, step includes：
I makes a charging tray, and charging tray is positioned in the box body of a plane；Multiple manholes, manhole are carried on charging tray
Diameter it is bigger 0.07-0.12mm than Diameter of Solder Ball, the material of charging tray is steel plate, and the thickness of steel plate is 0.1-0.15mm, by soldered ball
It is positioned in the manhole of charging tray, then the charging tray for being placed with soldered ball is positioned over to the feed bin position of full-automatic chip mounter；
Ii puts Board position by what the substrate for being printed with soldering paste was positioned over full-automatic chip mounter；
Iii carries out attachment programming according to the position of pad on the position of soldered ball in feed bin and substrate；
Iv is mounted soldered ball to the pad locations of substrate one by one using the program finished.
9. the method that BGA plants ball and assembling is realized in a kind of once backflow according to claim 1 simultaneously, it is characterised in that：
In described step (5), method BGA device being mounted on the soldered ball of substrate is：
I makes frock, and supports BGA device with the frock；The frock is with reeded flat board, on the madial wall of the flat board also
With a breach；The size of groove is smaller 0.2mm than the size of BGA device, and the frock is used to support BGA device, in the frock
Groove is used for the soldering paste position for making somebody a mere figurehead BGA device；The pad of BGA device is down；
The frock for being placed with BGA device is positioned over the feed bin position of full-automatic chip mounter by ii, then puts the substrate after plant ball
Be placed in full-automatic chip mounter puts Board position；
Iii carries out attachment programming according to the position of soldered ball on the position of BGA device in feed bin and substrate；
Iv is mounted BGA device to the soldered ball of substrate using the program finished.
10. the method that BGA plants ball and assembling is realized in a kind of once backflow according to claim 1 simultaneously, it is characterised in that：
In described step (6), the method for carrying out backflow assembling is：The substrate for being pasted with BGA device is positioned in reflow ovens and carried out
Welding, the heating rate of reflow soldering curve are less than 3 DEG C/s, 205~220 DEG C of maximum temperature, and the recirculating zone time is 60~120s,
Rate of temperature fall is 1~6 DEG C/s, after the solder paste melts in BGA device and substrate, forms qualified BGA solder joints.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111048428A (en) * | 2019-11-29 | 2020-04-21 | 深圳先进技术研究院 | Method for manufacturing implantable medical device |
| RU2807567C1 (en) * | 2023-04-21 | 2023-11-16 | Акционерное общество "Научно-производственный центр "Алмаз-Фазотрон" | Method for cleaning water-washable flux from boards with the installation of leadless microcircuits |
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|---|---|
| CN107708329B (en) | 2019-05-24 |
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Effective date of registration: 20231101 Address after: 710075, four floor, building 1B, zone F, 8 Guangde Road, Yanta District, Xi'an, Shaanxi. Patentee after: Xi'an spaceflight Hengxing precision electromechanical Co.,Ltd. Address before: No. 150, Changan District West Street, Xi'an, Shaanxi Province Patentee before: XI''AN INSTITUTE OF SPACE RADIO TECHNOLOGY |