CN102029450B - Method for performing lead reformation to lead-free BGA apparatus - Google Patents
Method for performing lead reformation to lead-free BGA apparatus Download PDFInfo
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- CN102029450B CN102029450B CN 201010527973 CN201010527973A CN102029450B CN 102029450 B CN102029450 B CN 102029450B CN 201010527973 CN201010527973 CN 201010527973 CN 201010527973 A CN201010527973 A CN 201010527973A CN 102029450 B CN102029450 B CN 102029450B
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Abstract
The invention relates to a method for performing lead reformation to a lead-free BGA apparatus, comprising the following steps of: (1) removing a lead-free solder ball on a lead-free BGS apparatus pad; (2) performing lead reformation to the BGS apparatus pad by utilizing a lead solder; (3) coating solder paste on the BGA apparatus pad; (4) implanting a lead solder ball on the pad of the BGA apparatus by utilizing a bumping bushing plate; and (5) soldering the lead solder ball on the BGA apparatus by utilizing lead reflow solder process; the method realizes the lead reformation of the BGA apparatus by removing the lead-free solder ball on the lead-free BGA and implanting the lead solder ball; the reformed BGA apparatus can be soldered only according to the lead solder process so as to greatly improve the production efficiency; since the number of soldering is reduced, the problems of deformation of printed board and decrease of reliability of solder joint caused by repeated heating in traditional solder process can be avoided.
Description
Technical field
The present invention relates to the circuit assembly technical field, particularly relate to a kind of method that unleaded BGA device is had the leadization transformation.
Background technology
Electronics manufacturing is in and has plumbously to unleaded transition stage, and most of components and parts are unleaded components and parts or lead, unleaded state are arranged and deposit.Abroad, for guaranteeing the long-term reliability of products such as Aero-Space electronics, medical electronics, above product does not receive the constraint of ROHS and WEEE instruction.But because China's military industry present situation, the major function electronic devices and components that promptly adopted often rely on external import and suffer external embargo, can't obtain the plumbous electronic devices and components of having of military products higher level, can only use the leadless electronic components and parts of commercial grade.Thus, domestic military-related electronics sector just must be in the face of having lead, unleaded components and parts to load in mixture problem.What is called has lead, unleaded components and parts to load in mixture existingly on same printed board sub-assembly exactly has plumbous components and parts that unleaded components and parts are arranged again.For loading in mixture being welded of circuit, adopted that splicer plants, lead-free process still has lead/all there is insoluble problem in unleaded welding procedure respectively.Use has kupper solder; Suitably improve welding temperature, prolong return time; Can realize that great majority have once being welded of lead, unleaded components and parts though be welded with the process of unleaded components and parts of lead-in wire and the unleaded components and parts of chip, simplifying to a certain extent has lead, the unleaded process implementing difficulty that loads in mixture the printed board sub-assembly.But there is limitation in this process, and the unleaded BGA device that promptly can't be welded when on loading in mixture the printed board sub-assembly, having unleaded BGA device, must use lead-free process that unleaded BGA device is welded in printed board earlier, refills other components and parts.The enforcement difficulty of this combination welding and assembling technics is higher, and unleaded BGA device stands the multiple welding cycle, also can produce certain adverse effect to its reliability.
In sum, existing common process method and have the unleaded process of lead welding all can't effectively solve the printed board that contains unleaded BGA to load in mixture problem.Therefore, provide a kind of under the prerequisite that guarantees the BGA welding spot reliability, it is very necessary reducing the process that loads in mixture combination welding and assembling technics enforcement difficulty as far as possible.
Summary of the invention
The objective of the invention is to overcome the above-mentioned defective of prior art; A kind of method that unleaded BGA device is had the leadization transformation is provided; This method has been replanted the lead welding ball through the lead-free solder ball of unleaded BGA is removed, and that has realized the BGA device has a leadization transformation; Improved BGA device only needs when being welded according to there being lead welding dress technology to carry out; Improved production efficiency greatly, and, avoided the printed board distortion and the welding spot reliability decline problem that repeatedly are welded and are heated and cause in traditional process that is welded owing to reduced the welding times of the printed board that is welded.
Above-mentioned purpose of the present invention is achieved through following technical scheme:
A kind of have the method for leadization transformation to unleaded BGA device, comprises the steps:
(1) lead-free solder ball on the unleaded BGA device pad is removed;
(2) employing has kupper solder to ward off tin for the BGA device pad, and with the lead-free solder full scale clearance on the BGA device pad;
(3), the BGA device pad is carried out soldering paste apply with web plate opening and the accurate contraposition of BGA device pad;
(4) the BGA device is positioned, adopt and to plant the ball bushing and on the pad of BGA device, implant the lead welding ball is arranged;
(5) adopt and to have plumbous solder reflow process will have the lead welding ball bonding to receive on the BGA device, that realizes the BGA device has a leadization transformation.
Above-mentioned unleaded BGA device is had in the method for leadization transformation; The method of in the step (1) lead-free solder ball on the unleaded BGA device pad being removed is: flatiron temperature is arranged in 280 ± 5 ℃ of scopes, on the BGA soldered ball, applies scaling powder simultaneously, will inhale the tin rope and place between flatiron and the clear soldered ball of quilt; Flatiron is 2～3 seconds in each pad time of staying; Lift flatiron then vertically upward and inhale the tin rope, repeatable operation repeatedly, till the soldered ball of BGA is all removed.
Above-mentioned unleaded BGA device is had in the method for leadization transformation; Method with the lead-free solder full scale clearance on the BGA device pad in the step (2) is: flatiron temperature is arranged in 280 ± 5 ℃ of scopes, on the BGA pad, applies scaling powder simultaneously, will inhale the tin rope and place between flatiron and the clear pad of quilt; Flatiron is 2～3 seconds in each pad time of staying; Lift flatiron then vertically upward and inhale the tin rope, repeatable operation repeatedly, till the lead-free solder of BGA pad is all removed.
Above-mentioned unleaded BGA device is had in the method for leadization transformation, definite method of web plate opening size is following in the step (3):
When the space between solder balls of BGA device is 0.75mm or 0.80mm; The ratio of web plate opening size and BGA device pad size is 1: 1.1, and when the space between solder balls of BGA device was 1mm, the ratio of web plate opening size and BGA device pad size was 1: 1～1: 1.1; When the space between solder balls of BGA device is 1.27mm; The ratio of web plate opening size and BGA device pad size is 1: 0.9～1: 1, and wherein opening size refers to aperture area, and pad size refers to bonding pad area.
Above-mentioned unleaded BGA device is had in the method for leadization transformation, the ball bushing of planting in the step (4) is used for there being the lead welding ball to leak to corresponding BGA pad, and the opening diameter of planting the ball bushing is than the big 0.05～0.1mm of the sphere diameter that the lead welding ball is arranged that implants.
Above-mentioned unleaded BGA device is had in the method for leadization transformation, adopting the method for planting ball device or manual placement on the pad of BGA device, to implant in the step (4) has the lead welding ball.
Wherein adopt and plant the ball device to plant the method for ball following:
(1) will there be the lead welding ball to be poured on and plant ball bushing center, and rock and plant the ball device, be rolled into unnecessary soldered ball the soldered ball feeder of planting the ball device from planting the ball bushing, and make to plant in lucky each small opening in ball bushing surface to keep a soldered ball;
(2) will plant the ball device is placed on the workbench; The BGA device that will apply simultaneously behind the soldering paste is inhaled on the suction nozzle at BGA maintenance work station; Method according to mounting BGA is aimed at, and suction nozzle is moved down, and mounts the BGA device on the tin ball of planting ball bushing surface; Then the BGA device is sucked up, will have the lead welding ball to be bonded on the corresponding pad of BGA device by the stickiness of soldering paste.
Adopt the manual method of planting ball of placing following:
The BGA device that (1) will apply soldering paste is placed on the BGA maintenance platform; Soldering paste is towards last, and will plant around the ball bushing with cushion block frock bed hedgehopping, is placed on above the BGA device; To there be the lead welding ball to be sprinkling upon uniformly and plant on the ball bushing; Use the celloidin rod to stir soldered ball, soldered ball is bled plant in the perforate of ball bushing, all filled by soldered ball up to all perforates;
(2) will have the lead welding ball to be pressed in the soldering paste of BGA device with briquetting, the amount of being pressed into is no more than 1/2 of soldered ball sphere diameter, uses the celloidin rod to stir afterwards unnecessary soldered ball is spilt through planting the ball bushing, shifts out at last and plants the ball bushing.
Above-mentioned unleaded BGA device is had in the method for leadization transformation, the lead welding ball of implanting in the step (4) that has is Sn63Pb37.
Above-mentioned unleaded BGA device is had in the method for leadization transformation, adopting the welding peak temperature that has plumbous solder reflow process will have the lead welding ball bonding to receive in the BGA device in the step (5) is 210～215 ℃.
The present invention compared with prior art has following advantage:
(1) the present invention is through having the leadization transformation to the BGA device; Efficiently solve a batch property production scene web plate correcting problem; Because the components and parts uncontrollable every batch of BGA that orders goods had lead, unleaded state, often therefore a type situation is produced web plate correcting in the past, and the present invention carries out after the BGA device has leadization; Printed board only need be coated with lead welding cream and weld; Need not to carry out web plate correcting, greatly reduce production scene web plate management difficulty, need not artificial the differentiation and control product different batches web plate because of BGA has lead, unleaded state difference;
(2) the present invention is through after having plumbous the transformation to the BGA device; Need not to use lead-free process to be welded in printed board earlier to the BGA device; Other components and parts again are welded; Reduced the printed board welding times, thereby avoided because the printed board distortion and the welding spot reliability decline problem of repeatedly being heated and causing;
(3) the present invention is through having the leadization transformation to the BGA device; Can realize soldering paste coating, paster and a welding of lead, unleaded components and parts; Its production efficiency is higher than far away has lead/unleaded BGA device welding procedure respectively, and the production efficiency that can have splicer to plant near tradition;
(4) the present invention has carried out optimal design to the used web plate opening size of printing soldering paste; A large amount of experiments show when the space between solder balls of BGA device is 0.75mm or 0.80mm; The ratio of web plate opening size and BGA device pad size is 1: 1.1; When the space between solder balls of BGA device was 1mm, the ratio of web plate opening size and BGA device pad size was 1: 1～1: 1.1, when the space between solder balls of BGA device is 1.27mm; The ratio of web plate opening size and BGA device pad size is 1: 0.9～1: 1, in this web plate opening size scope, has the quality of leadization transformation higher to the BGA device;
(5) a large amount of experiments show to adopt has plumbous solder reflow process will have the lead welding ball bonding to receive in the BGA device, and optimum welding peak temperature is 210～215 ℃, can guarantee that under this temperature the heating temperature of BGA device can be too not high; Can guarantee the welding quality of lead welding ball again; Experiment is illustrated in this temperature range welds, and the BGA device is planted ball shear strength high conformity, through fracture analysis; Fracture all belongs to plasticity to be changed, and shear strength all meets or because qualified requirement;
(6) a large amount of solder joint shearing force experiments show, adopt the inventive method to have the improved BGA device of leadization to plant ball shear strength high conformity, shear strength is superior to acceptability limit; A large amount of solder joint Metallographic Analysis experiments show have the improved BGA device of leadization to have the good binding layer, and the solder joint joint thickness is all in the reference value claimed range, so BGA device of the present invention has the leadization remodeling method feasible fully.
Description of drawings
Fig. 1 removes lead-free solder ball for BGA device of the present invention and pad has the leadization operational flowchart;
Fig. 2 carries out the operational flowchart of soldering paste printing to the pad of BGA device for the present invention;
Fig. 3 is injected with the operational flowchart of lead welding ball to the BGA device for the present invention;
Fig. 4 has lead welding ball plantation sketch map for the present invention;
Fig. 5 is plumbous solder reflow process flow chart for the present invention has;
Fig. 6 detects figure for BGA device X-ray of the present invention, and wherein a is BGA272X-ray detection figure, and b is BGA48X-ray detection figure, and c is BGA288X-ray detection figure;
Fig. 7 is a BGA device shearing test soldered ball cross-section morphology of the present invention;
Fig. 8 is a BGA device pad end metallograph of the present invention, and wherein a is a device pad end metallograph 1, and b is a device pad end metallograph 2, and c is a device pad end metallograph 3.
The specific embodiment
Below in conjunction with accompanying drawing and specific embodiment content of the present invention is done further to specify:
There is the mechanism of slicker solder soldering to be: after welding temperature reaches 183 ℃; The lead welding tin that has of molten condition contacts with the copper surface, the phenomenon of the wetting copper layer of tin solder can occur, and this moment, tin atom can be diffused in the copper layer at once; Copper atom also can be diffused in the tin instantaneous, and Pb does not participate in diffusion.In the mutual diffusion process of copper atom and tin atom, weld interface can form the gun-metal layer, and this alloy-layer is the fundamental that constitutes firm solder joint.
The reason that unleaded BGA is not suitable for the lead welding lead-free process is: the precondition that the lead welding lead-free process is arranged is that no lead-coat dissolves in the liquid phase scolder; Because the weldering end of unleaded BGA is SAC (SAC) soldered ball; Its welding mechanism is different from leaded device; Need the soldered ball fusing in the welding process, plumbous temperature is too low can't to realize reliable soldering and have.In addition, even if through improving the fusing of temperature overtime chien shih soldered ball, also might produce fusing point is 174 ℃ SnPbAg alloy, and then causes Lift-off (solder joint is peeled off) phenomenon.So unleaded BGA has been not suitable for the lead welding lead-free process.Unleaded BGA has plumbousization to be implanted with the realization of lead welding ball through kind.
Unleaded BGA has the key of leadization enforcement to be the leadization that has of unleaded BGA device end pad.That is, the lead-free solder ball of unleaded BGA is removed, adopting has kupper solder that device end pad is implemented to ward off process of tin, adopts suction tin rope to remove the scolder on the BGA pad again, to guarantee no longer to retain the lead-free solder ball residue on the BGA pad.Thereby guarantee the reliable soldering that lead welding ball and BGA pad are arranged of planting.
Therefore unleaded BGA's has a leadization transformation, mainly comprises four steps, and be followed successively by: (1) BGA device pad has the leadization processing, comprises that lead-free solder ball removal and pad have leadization processing, (2) soldering paste printing, (3) BGA to have that the lead welding ball is planted, (4) reflow soldering.
Detailed process is following:
One, the BGA pad has leadization
Be illustrated in figure 1 as the BGA pad plumbous metallization processes flow process is arranged.
The BGA pad has leadization practical implementation method following:
(1) removes lead-free solder ball
Flatiron temperature is arranged in 280 ± 5 ℃ of scopes; On the BGA soldered ball, apply an amount of R type rosin scaling powder simultaneously; To inhale the tin rope and place between flatiron and the clear soldered ball of quilt, each soldered ball time of staying of flatiron is 2～3 seconds, lifts flatiron then vertically upward and inhales the tin rope; Repeatable operation repeatedly, till the soldered ball of BGA is all removed.
(2) pad has leadization
Adopt flatiron and have kupper solder to ward off tin for the BGA pad; On the BGA pad, apply an amount of R type rosin scaling powder then; To inhale the tin rope and place between flatiron and the clear pad of quilt, each pad time of staying of flatiron is 2～3 seconds, lifts flatiron then vertically upward and inhales the tin rope.Guarantee the lead-free solder full scale clearance of all pads in the BGA encapsulation printed board.
(3) cleaning
With absolute ethyl alcohol latex foam cleaning pad and plate face.Solder pad space length cleans at microscopically less than the BGA requirement on devices of 1mm.
(4) check
Adopt microexamination, require all pads smooth, do not have warp, not damaged; Solder mask between the pad does not have breakage; Bond pad surface does not have fifth wheel.
Two, soldering paste printing
Be illustrated in figure 2 as BGA soldering paste typography flow process.
BGA soldering paste printing practical implementation method is following:
(1) makes tin cream web plate and plant the ball bushing
A. make the tin cream web plate
The tin cream web plate is to be used to apply the frock that the pad soldering paste is printed in the BGA encapsulation.Web plate thickness selects 0.15 for use, and bore size is decided according to the encapsulation of BGA device.
B. make and plant the ball bushing
Planting the ball bushing is the tin ball to be leaked to corresponding pad promptly be used for the frock that the tin ball is planted.General bore size increases by 0.05～0.1mm on former sphere diameter basis.
(2) device and web plate location
A. according to screen printer equipment difference device is located.Generally speaking, appearance and size≤289mm
2Should make the device supporting plate; Appearance and size>=289mm
2The BGA device can directly be placed on the guide rail of screen printer.
The pad at device diagonal angle overlaps with the web plate perforate fully when b. requiring contraposition.
(3) paste solder printing
A. tin cream stirs
Take out in the refrigerator and should at room temperature place 2h, manually a direction stirs that (or mixer stirs 3～5min) and can use after evenly.
B. tin cream is bitten
A certain amount of tin cream is added on the web plate, and hand-held scraper applies a downward pressure to it, and scraper angle is 45, and scraper pressure is advisable with the tin cream scraping that satisfies on the web plate.Scrape the back demoulding.
(4) check
With the microexamination soldering paste situation of biting, require scolder to answer N/D, should not have bridge joint between pad, do not have the limit phenomenon of collapsing, solder thickness should be even.
Three, BGA has the plantation of slicker solder ball
Being illustrated in figure 3 as BGA has slicker solder ball plantation technological process, has been illustrated in figure 4 as lead welding ball plantation sketch map.
The BGA device has slicker solder ball plantation practical implementation method following:
(1) device is located and is planted the ball bushing and locate
A. device is located: the difference according to ball-establishing method is located device.
If adopt and to plant the ball device and then device is placed on the device pallet of planting the ball device, the adjustment device position, make device four limits respectively with pallet on the red-label line parallel, the open vacuum pump is fixed device.
Plant the ball mode if adopt by hand, then manufacture the device pallet, device is placed on the pallet, its device soldering paste is faced up.
B. bushing is located: the difference according to ball-establishing method is located bushing
If adopt and to plant the ball device, then bushing is fixed on the bushing support, fixedly note should not making bushing to be out of shape during bushing.Adjustment BGA reprocesses the guide rail of system; The PCB fixed support is positioned at plants ball device top; The bushing support is rotated on the PCB fixed support of the system of reprocessing, ball device height is planted in adjustment, through the range estimation of the perforate on bushing device position; Adjustment bushing backing positions, magnifying glass down the inspection device all perforates should with device pad centering.
Attention: PCB fixed support regulating wheel, the guide rail regulating wheel after the completion centering BGA reprocessed in the system are fixed.
Plant the ball mode if adopt by hand, then need not bushing is fixed, when the tin ball is placed, carry out manual aligning.
(2) the tin ball is placed
The tin ball is selected: if use the high viscosity scaling powder, should select the soldered ball with BGA device soldered ball same diameter; If the use soldering paste should be selected than the smaller soldered ball of BGA device soldered ball diameter.
The tin ball is placed: the main employing planted ball device and manual the placement.
Plant the ball device and plant ball: an amount of solder ball is poured on the bushing center, rocks and plant the ball device, be rolled into unnecessary soldered ball the soldered ball feeder of planting the ball device from bushing, make the bushing surface keep a soldered ball in each small opening just.To plant the ball device is placed on the workbench; The device that will apply simultaneously behind the soldering paste is inhaled on the suction nozzle at BGA maintenance work station; Method according to mounting BGA is aimed at, and suction nozzle is moved down, and mounts the BGA device on the tin ball of planting ball device bushing surface; Then the BGA device is sucked up, soldered ball is bonded on the corresponding pad of BGA device by the stickiness of soldering paste.With the outer rim that tweezers are clamped the BGA device, close vavuum pump, with the soldered ball of BGA device towards on be placed on the workbench, inspection has or not the place that lacks soldered ball, if having, uses the tweezers polishing.
The manual placement: the BGA device that will apply soldering paste is placed on the BGA maintenance platform; Soldering paste is towards last, and will plant around the ball bushing with cushion block frock bed hedgehopping, is placed on above the BGA device; Be sprinkling upon solder ball on the bushing uniformly; Use the celloidin rod to stir the tin ball and make it to bleed and all filled by the tin ball up to all perforates in the perforate of bushing, with briquetting the tin ball is pressed in the tin cream at last, the amount of being pressed into is no more than 1/2 of sphere diameter.Simultaneously tin ball box is placed on bushing below, uses the celloidin rod to stir unnecessary tin ball is bled in the tin ball box and puts into returnable bottle.Shift out and plant the ball bushing, inspection and polishing.See diagrammatic sketch 4.
(3) check
Fill situation with microexamination tin ball, do not have after requiring the tin ball to fill many balls or scarce ball phenomenon, the position deviation of all tin balls should be not more than 25%.
Four, reflow soldering
Be illustrated in figure 5 as the solder reflow process flow process.
Reflow soldering practical implementation method is following:
(1) reflow soldering
Requirement is according to there being plumbous solder reflow process curve welding to plant the BGA device of ball.The welding peak temperature of backflow welding zone generally should be higher than 20～25 ℃ of soldering paste fusing points, preferred 210～215 ℃.
(2) cleaning
Latex foam or nonwoven with being soaked with absolute ethyl alcohol are cleaned solder joint.Use microscope during operation.
(3) check
A. microscopic examination: inspection BGA soldered ball outward appearance, require soldered ball not have short connect, do not have many balls, scarce ball phenomenon, all tin ball shapes sizes are consistent, and side-play amount is not more than 10%.
The b.X optical check: whether the bulk properties of main test solder joint and defective exist cavitation etc. like solder joint.
Above-mentioned process and technological parameter draw on a large amount of engineer testing bases.Engineer testing has been selected the unleaded BGA device of a large amount of different ball bar numbers, sphere diameter, sphere gap for use, adopts different technical parameters to weld, and then testpieces is carried out x-ray examination, pushes the ball and test and Metallographic Analysis.
Embodiment 1:
One, basic condition
(1) components and parts
Device name is TMS320C6211GFN, and PBGA plastic packaging, ball bar number are 288, and sphere gap is 0.8, and sphere diameter is 0.45.
(2) scolder and solder flux
Scolder (comprising soldering paste and tin ball) has been selected kupper solder for use, like the Sn63Pb37 soldering paste, answers 4.1.1 bar regulation among the accord with Q J3086-99.
Solder flux is selected R type or RMA type solder flux for use, should meet the GB9491-88 regulation.
(3) production, testing tool and equipment
Suction tin rope
Temperature control flatiron: answer 4.2.2 among the accord with Q J3086-99,4.2.3 bar regulation.
Drying box:
Plant ball device or ball attachment machine
Microscope
Solder paste stirrer
Reflow welding stove: answer among the accord with Q J3086-99 regulation of a.b.d in the 4.3.4.2 bar.
Maintenance station or maintenance system: answer 4.3.5 bar regulation among the accord with Q J3086-99.
The device supporting plate
Two, process implementing step
Step (1), components and parts visual examination
Inspection device specification, model determine whether to be unleaded BGA.
Through microscopy, use microexamination BGA outward appearance in case of necessity, require its surface encapsulation not damaged, crackle, ball array at grade, package floor track and soldering-resistance layer are intact, no foreign matter.
Step (2), BGA pad have leadization
A, the no shot of removal
Flatiron temperature is arranged on 280 ℃; On the BGA soldered ball, apply an amount of R type rosin scaling powder simultaneously; To inhale the tin rope and place between flatiron and the clear soldered ball of quilt, each time of staying of flatiron is 2～3 seconds, lifts flatiron then vertically upward and inhales the tin rope; Repeatable operation repeatedly, till the soldered ball of BGA is all removed.
B, pad have leadization
Adopt flatiron and have kupper solder to ward off tin for the BGA pad; On the BGA pad, apply an amount of R type rosin scaling powder then; To inhale the tin rope and place between flatiron and the clear pad of quilt, each pad time of staying of flatiron is 2～3 seconds, lifts flatiron then vertically upward and inhales the tin rope.3 lead-free solder full scale clearances of repeatable operation with all pads in the assurance BGA encapsulation printed board.
C, cleaning
With absolute ethyl alcohol latex foam cleaning pad and plate face.Solder pad space length cleans at microscopically less than the BGA requirement on devices of 1mm.
D, check
Adopt microexamination, require all pads smooth, do not have warp, not damaged; Solder mask between the pad does not have breakage; Bond pad surface does not have fifth wheel.
E, deposit
Device after the inspection is put into drying box, and humidity is controlled in 20%～40% scope, takes out when planting ball.
Step (3), soldering paste printing
A, making tin cream web plate
MS320C6211GFN tin cream web plate thickness is 0.15mm, and the ratio of web plate bore size and pad size is 1: 1.1.
The ball bushing is planted in b, making
It is 0.3mm that TMS320C6211GFN plants ball bushing thickness, bore size 0.5mm.
C, device and web plate location
According to screen printer equipment difference device is located.Generally speaking, appearance and size≤289mm
2Should make the device supporting plate; Appearance and size>=289mm
2The BGA device can directly be placed on the guide rail of screen printer.
The pad at device diagonal angle overlaps with the web plate perforate fully when requiring contraposition.
D, paste solder printing
1), take out tin cream in the refrigerator and should at room temperature place 2h, manually a direction stirs that (or mixer stirs 3～5min) and can use after evenly.
2), a certain amount of tin cream is added on the web plate, hand-held scraper applies a downward pressure to it, and scraper angle is 45, and scraper pressure is advisable with the tin cream scraping that satisfies on the web plate.Scrape the back demoulding.
E, check
With the microexamination soldering paste situation of biting, require scolder to answer N/D, should not have bridge joint between pad, do not have the limit phenomenon of collapsing, solder thickness should be even.
Step (4), BGA have the plantation of slicker solder ball
A, apply the device location behind the soldering paste and plant ball bushing location
1), device location: device is placed on the device pallet of planting the ball device, the adjustment device position, make device four limits respectively with pallet on the red-label line parallel, the open vacuum pump is fixed device.
2), bushing location: bushing is fixed on the bushing support, fixedly notes should not making bushing to be out of shape during bushing.Adjustment BGA reprocesses the guide rail of system; The PCB fixed support is positioned at plants ball device top; The bushing support is rotated on the PCB fixed support of the system of reprocessing, ball device height is planted in adjustment, through the range estimation of the perforate on bushing device position; Adjustment bushing backing positions, magnifying glass down the inspection device all perforates should with device pad centering.PCB fixed support regulating wheel, the guide rail regulating wheel then BGA reprocessed in the system are fixed.
B, tin ball are placed
The tin ball is selected: select the 0.45mm soldered ball.
The tin ball is placed: an amount of solder ball is poured on the bushing center, rocks and plant the ball device, be rolled into unnecessary soldered ball the soldered ball feeder of planting the ball device from bushing, make the bushing surface keep a soldered ball in each small opening just.To plant the ball device is placed on the workbench; The device that will apply simultaneously behind the soldering paste is inhaled on the suction nozzle at BGA maintenance work station; Method according to mounting BGA is aimed at, and suction nozzle is moved down, and mounts the BGA device on the tin ball of planting ball device bushing surface; Then the BGA device is sucked up, soldered ball is bonded on the corresponding pad of BGA device by the stickiness of soldering paste.With briquetting the tin ball is pressed in the tin cream, the amount of being pressed into is no more than 1/2 of sphere diameter.With the outer rim that tweezers are clamped the BGA device, close vavuum pump, with the soldered ball of BGA device towards on be placed on the workbench, inspection has or not the place that lacks soldered ball, if having, uses the tweezers polishing.
C, check
Fill situation with microexamination tin ball, do not have after requiring the tin ball to fill many balls or scarce ball phenomenon, the position deviation of all tin balls should be not more than 25%.
Step (5), reflow soldering
A, solder reflow process parameter:
Calandria is provided with temperature and is on the maintenance work station: 215 ℃;
Calandria is provided with temperature and is under the maintenance work station: 210 ℃;
The speed of conveyer belt is set at 60cm/min.
B|, cleaning
Latex foam or nonwoven with being soaked with absolute ethyl alcohol are cleaned solder joint.Use microscope during operation.
C, check
1), microscopic examination: inspection BGA soldered ball outward appearance, require soldered ball not have shortly to connect, do not have many balls, lack the ball phenomenon, all tin ball shapes sizes are consistent, side-play amount is not more than 10%.
2), x-ray examination: whether the bulk properties of main test solder joint and defective exist cavitation etc. like solder joint.
Step (6), solder joint Non-Destructive Testing
A, there is splicer to plant on pcb board to paste the TMS320C6211GFN device that is welded with leadization by tradition and carries out the X-RAY detection, detection solder joint situation;
B, the BGA device correctly there is the concealed solder joint inspection of TMS320C6211GFN of leadization, detects solder joint sedimentation situation.
C, environmental test and electric performance test
Breadboard is carried out temperature shock test, be used to the ability of examining solder joint heatproof degree to impact.Experimental condition is:
High temperature :+75 ± 2 ℃;
Low temperature :-55 ± 3 ℃;
Temperature change rate :≤5min;
The temperature spot time of staying: 30min;
Cycle-index: 10 times.
Carry out the circuit function test before and after the environmental test respectively, the circuit board function is normal, no change before and after the environmental test.Concrete test situation is seen second portion: test data and analysis.
Step (7), destructive testing
Choose test specimen respectively and carry out destructive tests such as solder joint shearing force testing and Metallographic Analysis, to obtain immediate data.Concrete test data and analysis situation are seen second portion: test data and analysis.
Embodiment 2:
One, basic condition
(1) components and parts
Device name is IDT71V416S10BEI, and PBGA (plastic packaging) ball bar number is 48, and sphere gap is 0.75, and sphere diameter is 0.4.
(2) scolder and solder flux
With " embodiment 1 ".
(3) production, testing tool and equipment
With " embodiment 1 ".
Two, process implementing step
Step (1), components and parts visual examination
With " embodiment 1 ".
Step (2), BGA pad have leadization
A, the no shot of removal
Flatiron temperature is arranged on 270 ℃; On the BGA soldered ball, apply an amount of R type rosin scaling powder simultaneously; To inhale the tin rope and place between flatiron and the clear soldered ball of quilt, each time of staying of flatiron is 2～3 seconds, lifts flatiron then vertically upward and inhales the tin rope; Repeatable operation repeatedly, till the soldered ball of BGA is all removed.
B, pad have leadization
With " embodiment 1 ".
C, cleaning
With absolute ethyl alcohol latex foam cleaning pad and plate face.Requirement is cleaned at microscopically.
D, check
With " embodiment 1 ".
E, deposit
With " embodiment 1 ".
Step (3), soldering paste printing
A, making tin cream web plate
IDT71V416S10BEI tin cream web plate thickness is 0.15mm, and bore size is 1: 1.1.
The ball bushing is planted in b, making
It is 0.3mm that IDT71V416S10BEI plants ball bushing thickness, bore size 0.45mm.
C, device and web plate location
Adopt screen printer equipment that device is located.Make the device pallet.
The pad at device diagonal angle overlaps with the web plate perforate fully when requiring contraposition.
D, paste solder printing
With " embodiment 1 ".
E, check
With " embodiment 1 ".
Step (4), BGA have the plantation of slicker solder ball
A, apply the device location behind the soldering paste and plant ball bushing location
With " embodiment 1 ".
B, tin ball are placed
The tin ball is selected: select the 0.4mm soldered ball.
The tin ball is placed: with " embodiment 1 ".
C, check
With " embodiment 1 ".
Step (5), reflow soldering
With " embodiment 1 ".
Step (6), solder joint Non-Destructive Testing
A. there is splicer to plant on pcb board to paste the IDT71V416S10BEI device that is welded with leadization by tradition and carries out the X-RAY detection, detection solder joint situation;
B. the concealed solder joint inspection of IDT71V416S10BEI that the BGA device is correctly had leadization detects solder joint sedimentation situation.
Concrete test situation is seen second portion: test data and analysis
Step (7), destructive testing
Choose test specimen respectively and carry out destructive tests such as solder joint shearing force testing and Metallographic Analysis, to obtain immediate data.Concrete test data and analysis situation are seen second portion: test data and analysis.
Embodiment 3:
One, basic condition
(1), components and parts
Device name is PCI9656BA, and PBGA (plastic packaging) ball bar number is 272, and sphere gap is 1.27, and sphere diameter is 0.75.
(2), scolder and solder flux
With " embodiment 1 ".
(3), production, testing tool and equipment
With " embodiment 1 ".
Two, process implementing step
Step (1), components and parts visual examination
With " embodiment 1 ".
Step (2), BGA pad have leadization
A, the no shot of removal
With " embodiment 2 ".
B, pad have leadization
With " embodiment 1 ".
C, cleaning
With " embodiment 1 ".
D, check
With " embodiment 1 ".
E, deposit
With " embodiment 1 ".
Step (3), soldering paste printing
A, making tin cream web plate
PCI9656BA tin cream web plate thickness is 0.15mm, and bore size is 1: 1.
The ball bushing is planted in b, making
It is 0.3mm that PCI9656BA plants ball bushing thickness, bore size 0.8mm.
C|, device and web plate location
With " embodiment 1 ".
D, paste solder printing
With " embodiment 1 ".
E, check
With " embodiment 1 ".
Step (4), BGA have the plantation of slicker solder ball
A, apply the device location behind the soldering paste and plant ball bushing location
With " embodiment 1 ".
B, tin ball are placed
The tin ball is selected: select the 0.75mm soldered ball.
The tin ball is placed: with " the 1st embodiment ".
C, check
With " embodiment 1 ".
Step (5), reflow soldering
With " embodiment 1 ".
Step (6), solder joint Non-Destructive Testing
A. there is splicer to plant on pcb board to paste the PCI9656BA device that is welded with leadization by tradition and carries out the X-RAY detection, detection solder joint situation;
B. the concealed solder joint inspection of PCI9656BA that the BGA device is correctly had leadization detects solder joint sedimentation situation.
Concrete test situation is seen second portion: test data and analysis
Step (7), destructive testing
Choose test specimen respectively and carry out destructive tests such as solder joint shearing force testing and Metallographic Analysis, to obtain immediate data.Concrete test data and analysis situation are seen second portion: test data and analysis.
Embodiment 4:
One, basic condition
(1) components and parts
Device name is EP2C70F67216, and PBGA (plastic packaging) ball bar number is 672, and sphere gap is 1mm, and sphere diameter is 0.6mm.
(2) scolder and solder flux
With " embodiment 1 ".
(3) production, testing tool and equipment
With " embodiment 1 ".
Two, process implementing step
Step (1), components and parts visual examination
With " embodiment 1 ".
Step (2), BGA pad have leadization
With " embodiment 1 ".
Step (3), soldering paste printing
A, making tin cream web plate
EP2C70F67216 tin cream web plate thickness is 0.15mm, and bore size is 1: 1.1.
The ball bushing is planted in b, making
It is 0.3mm that EP2C70F67216 plants ball bushing thickness, bore size 0.65mm.
C, device and web plate location
With " embodiment 1 ".
D, paste solder printing
With " embodiment 1 ".
E, check
With " embodiment 1 ".
Step (4), BGA have the plantation of slicker solder ball
A, apply the device location behind the soldering paste and plant ball bushing location
With " embodiment 1 ".
B, tin ball are placed
The tin ball is selected: select the 0.6mm soldered ball.
The tin ball is placed: with " the 1st embodiment ".
C, check
With " embodiment 1 ".
Step (5), reflow soldering
A, solder reflow process parameter:
Calandria is provided with temperature and is on the maintenance work station: 215 ℃;
Calandria is provided with temperature and is under the maintenance work station: 215 ℃;
The speed of conveyer belt is set at 60cm/min.
B, cleaning
With " embodiment 1 ".
C, check
With " embodiment 1 ".
Step (6), solder joint Non-Destructive Testing
A. there is splicer to plant on pcb board to paste the EP2C70F67216 device that is welded with leadization by tradition and carries out the X-RAY detection, detection solder joint situation;
B. the concealed solder joint inspection of EP2C70F67216 that the BGA device is correctly had leadization detects solder joint sedimentation situation.
Concrete test situation is seen second portion: test data and analysis
Step (7), destructive testing
Choose test specimen respectively and carry out destructive tests such as solder joint shearing force testing and Metallographic Analysis, to obtain immediate data.Concrete test data and analysis situation are seen second portion: test data and analysis.
Embodiment 5:
One, basic condition
(1) components and parts
Device name is EP20K600EBC652-2X, and PBGA (plastic packaging metal-back) ball bar number is 652, and sphere gap is 1.27, and sphere diameter is 0.75.
(2) scolder and solder flux
With " embodiment 1 ".
(3) production, testing tool and equipment
With " the 1st embodiment ".
Two, process implementing step
Step (1), components and parts visual examination
With " embodiment 1 ".
Step (2), BGA pad have leadization
A, the no shot of removal
With " embodiment 2 ".
B, pad have leadization
With " embodiment 1 ".
C, cleaning
With " embodiment 1 ".
D, check
With " embodiment 1 ".
E, deposit
With " embodiment 1 ".
Step (3), soldering paste printing
A, making tin cream web plate
EP20K600EBC652-2X tin cream web plate thickness is 0.15mm, and bore size is 1: 0.9.
The ball bushing is planted in b, making
It is 0.3mm that EP20K600EBC652-2X plants ball bushing thickness, bore size 0.8mm.
C, device and web plate location
With " embodiment 1 ".
D, paste solder printing
With " embodiment 1 ".
E, check
With " embodiment 1 ".
Step (4), BGA have the plantation of slicker solder ball
A, apply the device location behind the soldering paste and plant ball bushing location
With " embodiment 1 ".
B, tin ball are placed
The tin ball is selected: select the 0.75mm soldered ball.
The tin ball is placed: with " the 1st embodiment ".
C, check
With " embodiment 1 ".
Step (5), reflow soldering
With " embodiment 1 ".
Step (6), solder joint Non-Destructive Testing
A. there is splicer to plant on pcb board to paste the EP20K600EBC652-2X device that is welded with leadization by tradition and carries out the X-RAY detection, detection solder joint situation;
B. the concealed solder joint inspection of EP20K600EBC652-2X that the BGA device is correctly had leadization detects solder joint sedimentation situation.
Concrete test situation is seen second portion: test data and analysis
Step (7), destructive testing
Choose test specimen respectively and carry out destructive tests such as solder joint shearing force testing and Metallographic Analysis, to obtain immediate data.Concrete test data and analysis situation are seen second portion: test data and analysis.
Embodiment 6:
One, basic condition
(1) components and parts
Device name is EP2S90F1020C5, CBGA (pottery envelope metal-back), and the ball bar number is 1020, and sphere gap is 1mm, and sphere diameter is 0.6mm.
(2) scolder and solder flux
With " embodiment 1 ".
(3) production, testing tool and equipment
With " embodiment 1 ".
Two, process implementing step
Step (1) components and parts visual examination
With " embodiment 1 ".
Step (2) BGA pad has leadization
A, the no shot of removal
Flatiron temperature is arranged on 285 ℃; On the BGA soldered ball, apply an amount of R type rosin scaling powder simultaneously; To inhale the tin rope and place between flatiron and the clear soldered ball of quilt, each time of staying of flatiron is 2～3 seconds, lifts flatiron then vertically upward and inhales the tin rope; Repeatable operation repeatedly, till the soldered ball of BGA is all removed.
B, pad have leadization
With " embodiment 1 ".
C, cleaning
With " embodiment 1 ".
D, check
With " embodiment 1 ".
E, deposit
With " embodiment 1 ".
Step (3) soldering paste printing
A, making tin cream web plate
EP2S90F1020C5 tin cream web plate thickness is 0.15mm, and bore size is 1: 1.
The ball bushing is planted in b, making
It is 0.3mm that EP2S90F1020C5 plants ball bushing thickness, bore size 0.8mm.
C, device and web plate location
With " embodiment 1 ".
D, paste solder printing
With " embodiment 1 ".
E, check
With " embodiment 1 ".
Step (4) BGA has the plantation of slicker solder ball
A, apply the device location behind the soldering paste and plant ball bushing location
With " embodiment 1 ".
B, tin ball are placed
The tin ball is selected: select the 0.6mm soldered ball.
The tin ball is placed: with " the 1st embodiment ".
C, check
With " embodiment 1 ".
Step (5) reflow soldering
With " embodiment 1 ".
Step (6) solder joint Non-Destructive Testing
A. there is splicer to plant on pcb board to paste the EP2S90F1020C5 device that is welded with leadization by tradition and carries out the X-RAY detection, detection solder joint situation;
B. the concealed solder joint inspection of EP2S90F1020C5 that the BGA device is correctly had leadization detects solder joint sedimentation situation.
Concrete test situation is seen second portion: test data and analysis
Step (7) destructive testing
Choose test specimen respectively and carry out destructive testings such as solder joint shearing force testing and Metallographic Analysis, to obtain immediate data.Concrete test data and analysis situation are seen second portion: test data and analysis.
Test data and analysis
One, test specimen distribution condition
Choose the test specimen that embodiment 1～embodiment 6 welds respectively and carry out destructive tests such as solder joint shearing force testing and Metallographic Analysis, to obtain immediate data.The test specimen distribution condition is seen table 1.
Table 1:
Two, test data analyzer
(1) solder joint Non-Destructive Testing data analysis
A.J1～J4, X1～X30 have carried out the X-RAY detection, and testing result draws, and soldered ball is even, no bubble, no bridge joint.Part test part X-RAY detection case is seen Fig. 6;
B. the BGA device has correctly been carried out the concealed solder joint inspection of ERSA SPACE, testing result shows that four side weld point printing opacities are good, and the solder joint sedimentation is consistent;
C. the circuit board with circuit function is carried out electric performance test, the circuit board function is normal, no change before and after the test;
D. temperature shock test
Breadboard is carried out temperature shock test, and the test front and back are carried out the circuit function test respectively and X-RAY detects, equal no change before and after the test.
(2) destructive testing data analysis
A, shearing force testing data analysis
1) data preparation
The test specimen solder joint is carried out shearing force testing, and shear force value is the measured data of carrying out shearing force testing in the table 2.And calculate the shearing mean force by test side.Compare with the reference value that calculates shearing mean force.As shear mean force and then think qualified greater than reference value.
Wherein, Because the device shearing force does not have direct criterion; With reference among " microelectronic component Test Methods And Procedures " GJB 548B-2005 to the requirement of BGA solder joint shear strength; Contact area computational methods by its regulation calculate the contact area that the device weldering is held, and table look-up then to have drawn the anti-shearing force reference value of all kinds of device lists weldering ends.
Each test specimen solder joint anti-shearing force value is seen table 2 (J1～J4 respectively chooses 20 solder joints).
Table 2:
Device name: TMS320C6211GFN unit: g
Device name: IDT71V416S10BEI unit: g
Device name: PCI9656BA unit: g
Device name: EP2C70F67216 unit: g
2) data analysis
Through the lot of data analytical work, device is planted ball shear strength high conformity, through fracture analysis and with consult reference materials and compare, fracture all belongs to plasticity and changes (shearing test soldered ball fracture apperance is seen Fig. 7), shear strength is superior to the data acceptability limit.
B, Metallographic Analysis
The key data that solder joint Metallographic Analysis experiment is obtained is the solder joint joint thickness; All BGA devices to the device on feature board have carried out the Metallographic Analysis test; Obtain the joint thickness between soldered ball and device pad; Plant the ball quality with checking, wherein the listed joint thickness of table 3 is the mean value of actual measured value.Concrete data are seen table 3.
Table 3:
Unit: μ m
Can find out that from above data each solder joint joint thickness all in the reference value claimed range, explains that BGA has plumbous metallization processes all can obtain the good binding layer, proves that process is feasible, correct.Part test specimen solder joint binder course metallography microscope pattern is seen Fig. 8.
(3) conclusion
Through multiple test such as x-ray, concealed solder joint inspection, electric performance test, temperature shock, shearing force testing, Metallographic Analysis examination, can reach a conclusion: that adopts that above-mentioned technological process, process can realize unleaded BGA device has a leadization transformation.
The above; Be merely the best specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, any technical staff who is familiar with the present technique field is in the technical scope that the present invention discloses; The variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.
The content of not doing to describe in detail in the specification of the present invention belongs to this area professional and technical personnel's known technology.
Claims (8)
1. one kind has the method for leadization transformation to unleaded BGA device, it is characterized in that comprising the steps:
(1) lead-free solder ball on the unleaded BGA device pad is removed; The method of removing is: flatiron temperature is arranged in 280 ± 5 ℃ of scopes, on the BGA soldered ball, applies scaling powder simultaneously, will inhale the tin rope and place between flatiron and the clear soldered ball of quilt; Flatiron is 2～3 seconds in each pad time of staying; Lift flatiron then vertically upward and inhale the tin rope, repeatable operation repeatedly, till the soldered ball of BGA is all removed;
(2) employing has kupper solder to ward off tin for the BGA device pad, and with the lead-free solder full scale clearance on the BGA device pad, the method for removing is: flatiron temperature is arranged in 280 ± 5 ℃ of scopes; Simultaneously on the BGA pad, apply scaling powder; To inhale the tin rope and place between flatiron and the clear pad of quilt, flatiron is 2～3 seconds in each pad time of staying, lifts flatiron then vertically upward and inhales the tin rope; Repeatable operation repeatedly, till the lead-free solder of BGA pad is all removed;
(3), the BGA device pad is carried out soldering paste apply with web plate opening and the accurate contraposition of BGA device pad;
(4) the BGA device is positioned, adopt and to plant the ball bushing and on the pad of BGA device, implant the lead welding ball is arranged;
(5) adopt and to have plumbous solder reflow process will have the lead welding ball bonding to receive on the BGA device, that realizes the BGA device has a leadization transformation.
2. according to claim 1 a kind ofly have the method for leadization transformation to unleaded BGA device, and it is characterized in that: definite method of web plate opening size is following in the said step (3):
When the space between solder balls of BGA device is 0.75mm or 0.80mm; The ratio of web plate opening size and BGA device pad size is 1: 1.1; When the space between solder balls of BGA device is 1mm; The ratio of web plate opening size and BGA device pad size is 1: 1～1: 1.1, and when the space between solder balls of BGA device was 1.27mm, the ratio of web plate opening size and BGA device pad size was 1: 0.9～1: 1.
3. a kind of method that unleaded BGA device is had the leadization transformation according to claim 1; It is characterized in that: the ball bushing of planting in the said step (4) is used for there being the lead welding ball to leak to corresponding BGA pad, and the opening diameter of planting the ball bushing is than the big 0.05～0.1mm of the sphere diameter that the lead welding ball is arranged that implants.
4. according to claim 1 a kind ofly have the method for leadization transformation to unleaded BGA device, it is characterized in that: adopt in the said step (4) and plant ball device or manual method of placing and on the pad of BGA device, implant the lead welding ball is arranged.
5. according to claim 4 a kind ofly have the method for leadization transformation to unleaded BGA device, it is characterized in that: the ball device is planted in said employing, and to plant the method for ball following:
(1) will there be the lead welding ball to be poured on and plant ball bushing center, and rock and plant the ball device, be rolled into unnecessary soldered ball the soldered ball feeder of planting the ball device from planting the ball bushing, and make to plant in lucky each small opening in ball bushing surface to keep a soldered ball;
(2) will plant the ball device is placed on the workbench; The BGA device that will apply simultaneously behind the soldering paste is inhaled on the suction nozzle at BGA maintenance work station; Method according to mounting BGA is aimed at, and suction nozzle is moved down, and mounts the BGA device on the tin ball of planting ball bushing surface; Then the BGA device is sucked up, will have the lead welding ball to be bonded on the corresponding pad of BGA device by the stickiness of soldering paste.
6. according to claim 4 a kind ofly have the method for leadization transformation to unleaded BGA device, it is characterized in that: saidly adopt the manual method of planting ball of placing following:
The BGA device that (1) will apply soldering paste is placed on the BGA maintenance platform; Soldering paste is towards last, and will plant around the ball bushing with cushion block frock bed hedgehopping, is placed on above the BGA device; To there be the lead welding ball to be sprinkling upon uniformly and plant on the ball bushing; Use the celloidin rod to stir soldered ball, soldered ball is bled plant in the perforate of ball bushing, all filled by soldered ball up to all perforates;
(2) will have the lead welding ball to be pressed in the soldering paste of BGA device with briquetting, the amount of being pressed into is no more than 1/2 of soldered ball sphere diameter, uses the celloidin rod to stir afterwards unnecessary soldered ball is spilt through planting the ball bushing, shifts out at last and plants the ball bushing.
7. according to claim 1 a kind ofly have the method for leadization transformation to unleaded BGA device, and it is characterized in that: the lead welding ball of implanting in the said step (4) that has is Sn63Pb37.
8. according to claim 1 a kind ofly have the method for leadization transformation to unleaded BGA device, and it is characterized in that: adopting the welding peak temperature that has plumbous solder reflow process will have the lead welding ball bonding to receive in the BGA device in the said step (5) is 210～215 ℃.
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| CN103785922A (en) * | 2014-03-04 | 2014-05-14 | 昆山泰威尔电子科技有限公司 | Blocking disc used for solder ball |
| CN105142354A (en) * | 2015-07-15 | 2015-12-09 | 中山市晔汇电子有限公司 | Improved SMT chip mounting technology |
| CN107350585A (en) * | 2017-06-26 | 2017-11-17 | 安徽华东光电技术研究所 | A kind of method of flat gold plated lead manual welding |
| CN107708329B (en) * | 2017-08-31 | 2019-05-24 | 西安空间无线电技术研究所 | A kind of primary method to flow back while realizing BGA plant ball and assembling |
| CN109511234B (en) * | 2019-01-04 | 2021-07-30 | 无锡中微高科电子有限公司 | Method for correcting position degree of solder ball for BGA package |
| CN112951730B (en) * | 2021-01-26 | 2024-03-29 | 北京遥感设备研究所 | Three-dimensional stacking process method for substrate |
| CN113766823B (en) * | 2021-09-10 | 2023-06-02 | 上海无线电设备研究所 | BGA ball mounting device and method based on SMT repair station |
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| SG97164A1 (en) * | 2000-09-21 | 2003-07-18 | Micron Technology Inc | Individual selective rework of defective bga solder balls |
| CN1750750A (en) * | 2004-09-15 | 2006-03-22 | 华为技术有限公司 | Method for realizing connection of other device by BGA package device pin repair |
| US7771541B2 (en) * | 2007-03-22 | 2010-08-10 | International Business Machines Corporation | Method of removing metallic, inorganic and organic contaminants from chip passivation layer surfaces |
| CN101553092B (en) * | 2009-05-19 | 2012-05-23 | 北京遥测技术研究所 | Method of welding printed circuit board containing mixed lead components and leadless components |
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