JPS6363569A - Wire shaped solder quantitatively feeding mechanism - Google Patents

Abstract

PURPOSE:To improve the shape of a solder flow, to facilitate the work and to improve the quality by feeding a wire like solder from a discharging nozzle after melting the solder fed out in a fixed quantity with its cutting. CONSTITUTION:A wire like solder 1 is fed in a constant amount to the inside of a cutting die 8 from a feeding roller 3, descended in the arrow mark A direction by a cam 4 and a solder nozzle 5 approaches to the base plate 10 on a heating stage 11, holding a constant distance. Simultaneously with the motion of the cam 4 the cutting punch 6 provided with the upper and lower driving mechanism cuts the wire like solder 1 by descending the inside of a cutting die 8 and melts the wire like solder 1 at the inner part of the solder discharging nozzle 5 heated by a heater 7 with its further descent. The wire like solder 1 is pushed out of the tip of the solder discharging nozzle 5 by the cutting punch 6 and fed onto the surface of the base plate 10. After completion of the feeding, it is ascended by the motion of the cam 4 and one stage is completed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wire-shaped solder quantitative supply mechanism, and more particularly to a wire-shaped semi-uniform solder quantitative supply mechanism used in a semiconductor device assembly process.

[Conventional technology]

FIGS. 3A and 3B are a front view including a partial cross section and an enlarged sectional view of a main part, showing an example of a conventional wire-shaped solder supply mechanism.

Conventionally, this type of wire-shaped solder supply mechanism has a spool 22.
The tip of the wire-shaped solder 21 is guided by a cylindrical solder supply nozzle 25, and a fixed amount is sent to the tip of the solder supply nozzle 25 by a feeding mechanism consisting of a feeding roller 23, etc., and by the rotation of the cam 24, it is moved in the direction of arrow B1. The wire-shaped solder 21 was brought into direct contact with the substrate 10, which had been previously heated above the solder melting point and placed on the heating stage 11, to melt it.

[Problem that the invention seeks to solve]

In the conventional wire-shaped solder supply mechanism described above, a fixed amount of wire-shaped solder is sent out to the tip of the nozzle and is melted and supplied by contacting the pre-heated substrate surface, but the surface temperature of the substrate is lower than the solder temperature. At the time of contact, heat is absorbed by the solder and the nozzle, the surface temperature drops, and the tip of the wire-shaped solder deforms as shown in Figure 3 (b), causing problems such as variations in the supply position and melting. There is a disadvantage that it occurs. In order to solve these problems, the temperature of the substrate surface was set higher than the solder melting point. There is a problem in that the alloying with the material metal becomes difficult and the fluidity of the solder becomes dull in a short period of time, which is a major constraint on the work.

[Means for solving problems]

The wire-shaped solder fixed quantity supply mechanism of the present invention includes a solder feeding mechanism that feeds out a fixed amount of wire-shaped solder, a half [1 LIJ cutting machine side] and a cut wire-shaped half Ill that cuts the wire-shaped solder that has been fed out. The wire-shaped solder is surrounded by a heater for melting the solder, and is equipped with a half-discharge nozzle that guides and discharges the melted wire-shaped solder in the direction of the soldering object.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

1 and 2 are front views, partially in section, of first and second embodiments of the present invention.

The first embodiment includes a solder wire 1, a spool 2, a feed roller 3, a cam 4, a solder discharge nozzle 5, a cutting bond 6, a heater 7, a cutting die 8, and a plate 9.

The wire-shaped solder 1 is wound around a spool 2, and one end of the wire is fed by a fixed amount into a cutting die 8 by a feed roller 3 connected to and driven by, for example, a motor (not shown). The mechanism of this embodiment mounted on the plate 9 is lowered in the direction of arrow A by a cam 4 rotated by a drive means (not shown), and the solder discharge nozzle 5 approaches the substrate 10 on the heating stage 11 and maintains a constant distance. . In synchronization with the operation of the cam 4, a cutting punch 6 equipped with a vertical drive mechanism descends inside the cutting die 8 to cut the wire-shaped solder 1, and further descends to release the solder discharge nozzle 5 heated by the heater 7. The wire-shaped solder 1 is melted inside. Furthermore, the wire-shaped solder 1 is pushed out from the tip of the solder discharge nozzle 5 by the cutting punch 6 and is supplied to the surface of the substrate 10. After the supply is completed, the mechanism of this embodiment is raised by the operation of the cam 4, and one step is completed.

According to this embodiment, since the melted wire A'-shaped soil 1111 is discharged in a fixed amount from the solder discharge nozzle 5, it can be supplied to the surface of the substrate 10 at the correct supply position and without variation in the supply direction. .

In the second embodiment, a mechanism having the same configuration as the first embodiment described above is mounted on the base 12.

The mechanism for melting the wire-shaped solder 1 and supplying it in a fixed amount from the semi-conductor nostle 5 is the same as that of the first embodiment. The wire-shaped solder 1, which is held in a cylindrical fit and connected to a rotating motor 15 by a component clamp 1 (), rotates at a constant speed, and is melted in synchronization with the rotational movement, is transferred from the half II + exposed nozzle 5 to the solder joint. Supplied to 17,
Perform earth 111 combination. Therefore, the same effect as the first embodiment can be obtained.

〔Effect of the invention〕

As explained above, the present invention provides a mechanism for cutting, roughening and melting wire-shaped solder fed out at a constant rate, and then supplying it from a discharge nozzle.5. It is possible to supply solder while keeping it at a low temperature, slow down the oxidation rate, obtain a stable solder supply position, improve the shape of the solder flow, and have the effect of making work easier and improving quality. be.

[Brief explanation of drawings]

1 and 2 are front views including partial cross sections of the first and second embodiments of the present invention, and FIGS. 3(a) and 3(b) are portions showing an example of a conventional wire-shaped solder supply mechanism. FIG. 2 is a front view including a cross section and an enlarged sectional view of a main part.

Claims (1)

[Claims] A solder feeding mechanism that feeds out a fixed amount of wire-shaped solder, a solder cutting mechanism that cuts the fed-out wire-shaped solder, and a heater that melts the cut wire-shaped solder, and the wire-shaped solder that has been melted. A wire-shaped solder quantitative supply mechanism characterized by comprising a solder discharge nozzle that guides and discharges solder in the direction of an object to be soldered.