JPH0521485A - Eutectic bonding tape cutter - Google Patents

Abstract

PURPOSE:To provide a cutting means capable of cutting straightly an eutectic bonding tape hard to be bent. CONSTITUTION:A heating means 100 which heats the eutectic bonding tape 52 is installed prior to cutting eutectic bonding tape 52 with a cutting means 5. Since the eutectic bonding tape 52 is heated and softened by the heating means 100, the tape can be cut straightly by means of the cutting device 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a eutectic bonding tape cutting device, and more particularly to a means for satisfactorily cutting a eutectic bonding tape with a cutting device.

[0002]

2. Description of the Related Art As a eutectic bonding device for mounting a bare chip on a substrate heated to a eutectic temperature, a bonding tape is cut into a predetermined length by a cutting device, and the cut tape piece is taken up by a tape transfer head. Then, it is known that the chip is transferred to a substrate and a bare chip is mounted on this tape piece.

The applicant of the present invention has previously provided means for freely adjusting the cutting length of the tape in this type of eutectic bonding apparatus (Japanese Patent Laid-Open No. 3-20050). In this device, the pitch feed amount of the tape is adjusted, and the tape is cut at a predetermined length by the cutting unit.

[0004]

This kind of tape is formed into an ultrathin tape by using a metal material having good conductivity, such as gold, an alloy of gold and silicon, an alloy of gold and tin, or the like. As shown in FIG. 3, the tape 52 formed of gold or an alloy of gold and silicon is soft and can be cut straight by a cutting portion as shown by a broken line a. However, since the tape 52 formed of an alloy of gold and tin is quite stiff, when it is cut by the cutting portion, a twist due to the strength of its own waist is generated, and as shown by a broken line b in FIG. It tended to be difficult to cut.

Therefore, an object of the present invention is to provide a means for cutting a strong tape made of an alloy of gold and tin or the like straight by a cutting portion.

[0006]

To this end, the present invention is provided with heating means for heating the eutectic bonding tape prior to the cutting of the tape by the cutting portion.

[0007]

In the above structure, by heating the tape in advance, the tape having a high rigidity is also softened, so that the tape can be cut straight by the cutting portion.

[0008]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a front view of a eutectic bonding apparatus, in which A is a basic machine, and a sub-transfer head 7 and a bonding head 8 are provided on the front surface of a main body portion 20 of the basic machine.
Then, the tape transfer heads 9 are arranged side by side at intervals. Each of the heads 7 to 9 has nozzles 22 and 23 that suck the bare chip P and a nozzle 24 that sucks a tape piece (described later). Reference numeral 13 is a drive unit provided on the lower side of the basic machine A, and reference numerals 14, 15 and 16 are a rod, an oscillator, and a rod driven by the drive unit 13.
When the rod is driven, the rod 14 moves up and down, and the oscillator 15
By swinging, the three heads 7 to 9 simultaneously reciprocally slide laterally along the guide 10 provided on the front surface of the main body 20.

Below the basic machine A, a bare chip P supply device 1, a bare chip P positional deviation correction stage 2, a positioning part 3 for a substrate 11, a bonding tape (described later) supply device 4 and a cutting device 5 are provided. Are lined up at intervals. As mentioned above, the three heads 7-9
By simultaneously reciprocating in the lateral direction, the sub-mounting head 7 transfers the bare chip P of the supply device 1 to the correction stage 2, and the bonding head 8 moves the bare chip P whose positional deviation is corrected by the correction stage 2. Is transferred to the substrate 11, and the tape transfer head 9 transfers the tape piece of the supply device 4 to the substrate 11.

The supply device 1 is constructed by mounting a rotating device 36 on an XY table 35 and mounting a turntable 37 on the rotating device 36. A plurality of chip supply bodies equipped with bare chips P such as wafers 5 are mounted on the turntable 37, and each wafer 5 is equipped with bare chips P of different types. XY table 35
Is operated, the wafer 5 moves in the XY directions, and the desired bare chip P on the wafer 5 is located immediately below the nozzle 22. When the bare chips P on the wafer 5 are out of stock or the type of the bare chips P is changed,
When the rotating device 36 is operated, the turntable 37 is rotated and the other wafer 5 is moved below the head 7.
As the chip supply body, a tray or the like is frequently used in addition to the wafer 5.

The correction stage 2 is provided with a correction claw 41. When the correction claw 41 slides in the XY directions by means (not shown), the bare chip P transferred onto the correction stage 2 by the head 7 is moved. Correct the positional deviation in the XYθ directions.

The positioning unit 3 includes XY tables 17 and 18
The heating device 19 is placed on the heating device 19, and the heating box 42 is placed on the heating device 19. The substrate 11 is positioned on the heating device 19 and is placed at a eutectic temperature (eg about 4 ° C).
It is heated to 00 ° C). Also, the XY tables 17, 18
Is operated to move the substrate 11 in the XY directions to mount the tape piece transferred by the tape transfer head 9 at a predetermined position, and the bonding head 8 mounts the bare chip P on the tape piece. To do. Next, the details of the bonding tape supply device 4 will be described with reference to FIGS.

In FIG. 2, reference numeral 51 denotes a supply reel around which a bonding tape 52 is wound, and a pitch feed means 4 for sandwiching the tape 52 drawn from the reel 51 from above and below and feeding the pitch is provided below the supply reel. Has been.
The pitch feeding means 4 is the same as that disclosed in the above-mentioned Japanese Patent Laid-Open No. 3-20050 and is illustrated in a simplified manner.

Next, the cutting device 5 for the bonding tape 52
Will be described in detail. Reference numeral 90 denotes a guide block of the tape 52 provided in front of the pitch feeding means 4, and a guide groove 90a of the tape 52 is provided on the upper surface of the guide block. 9
1 is a tape 52 provided on the upper part of the guide block 90.
The cam follower 92, which is a pressing block of the above, is attached to the lower portion of the pressing block, and is in contact with the cam 93 driven by the motor M. A heater 100 is embedded inside the guide block 90, and the heat of the guide block 90 causes the guide block 90 to become
It is heated to 00 ° C and therefore this guide block 9
The tape 52 pitch-fed over 0 is also heated to substantially the same temperature. The heating means for the tape 52 is not limited to this embodiment, but the guide block 90, which is the guide means for the tape 52 as in this embodiment, is also used as the heating means for the tape 52. If you heat while holding the tape 52 with the pressing block 91,
Since the presser block 91 is also heated by the heat transfer of the guide block 90, the tapes 52 can be heated to a predetermined temperature with good heat efficiency by the blocks 90 and 91, and the tape 52 can be prevented from being thermally deformed. Of course, the pressing block 91
A heater may be embedded in the block, or both blocks 90,
91, may be heated by an external heating means such as a heat block.

Reference numeral 94 denotes a blade portion provided on the front portion of the guide block 90, which is supported by the pin 95. 96 is a cam provided below it, 97 is a cam follower, 98
Is an elevator, and the pin 95 is erected on the elevator 98. When the motor M is driven, the pressing block 91 descends to press the tape 52, and the blade portion 94 rises in this state, so that the tape 52 and the block 9 are moved.
The tape piece 52a cut by the edges of 0 and 91 is taken up by the tape transfer head 9.

The present apparatus has the above-mentioned structure, and the operation of the whole apparatus will be described below. The tape 52 drawn from the supply reel 51 is pitch fed by the pitch feeding means 4. When the pitch feeding of the tape 52 is stopped, the pressing blocks 91 are lowered to hold the tape 52 by the rotation of the cams 93 and 96, and the blade portion 94 is raised in this state, whereby the tape 52 is cut. .. In this case, the tape 52 is heated to several 100 ° C. by the heat transfer of the guide block 90.
The tape 52 has been heated up to become soft and therefore the tape 52 is cut straight as shown in FIG.

Next, the tape transfer head 9 arrives directly above the blade portion 94, and the cut tape piece 52a is adsorbed by a vacuum force to be taken up and transferred onto the substrate 11.
Next, the bonding head 8 takes up the bare chip P on the correction stage 2 and mounts it on this tape piece 52a, and the bare chip P is eutectic bonded.

[0019]

As described above, according to the present invention, the heating means for heating the eutectic bonding tape prior to the cutting of the tape by the cutting portion is provided, so that the elastic tape is softened in advance and straightened. Can be cut.

[Brief description of drawings]

FIG. 1 is a front view of a eutectic bonding device according to the present invention.

FIG. 2 is a side view of a eutectic bonding device according to the present invention.

FIG. 3 is a cutaway view of a eutectic bonding tape according to the present invention.

FIG. 4 is a cutaway view of a conventional eutectic bonding tape

[Explanation of symbols]

 4 Pitch feeding means 5 Cutting device 51 Supply reel 52 Eutectic bonding tape 100 Heating means

Claims (1)

Claim: What is claimed is: 1. A supply reel for leading out a eutectic bonding tape, a pitch feeding means for the eutectic bonding tape, and a fixed eutectic bonding tape which is located downstream of the pitch feeding means. A cutting device that cuts at each pitch,
A eutectic bonding tape cutting device, comprising: heating means for heating the eutectic bonding tape prior to this cutting.