JPS59105328A - Feeder for solder material for die bonder - Google Patents

Abstract

PURPOSE:To supply a plurality of the solder materials in a matrix shape while they are driven to matrix-shaped arbitrary positions, and to arrange the solder materials only in desired number within a desired solder-material supply range by installing a main body on a stage moving on a horizontal plane in the biaxial directions. CONSTITUTION:A solder-material supply arm 6, which sucks solder-material foil pieces 5 cut by a cutter 13 cutting a tape-shaped solder material 4 in predetermined length, moves the foil pieces vertically before and behind and supplies the pellet placing surface of a frame 3 with the foil pieces, is provided. The main body (S) is installed on the stage 9 driven on the horizontal plane in the biaxial directions by two pulse motors 12, 12 while being synchronized with supply operation. The stage 9 is driven and controlled by a command from a control section and stopped at the arbitrary positions arranged crosswise in a matrix manner, and the foil pieces 5 are fed in a matrix shape of 3X3 at a maximum by the supply arm 6.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a brazing material supplying device in the die bonding process of semiconductor IC chips, particularly when bonding with a eutectic alloy that requires a brazing material.

In general, die bonding of semiconductor pellets for integrated circuits, transistors, etc. includes a method of fixing using paste and a method of fixing using eutectic alloying of the adhesive surface of the pellet.
In order to obtain good thermal and electrical contact, a fixing method using eutectic alloying is excellent. The fixing method using eutectic alloying involves attaching the pellet to the pellet fixing surface of a lead frame or case at a high temperature of 400'C or more, and then bonding the metal such as Au on the pellet fixing surface and the back surface of the pellet. It causes a eutectic alloying reaction with silicon to bond the pellets together. If the pellet size is large, if you want to obtain a tighter pellet adhesion state, or if you want a special alloy bond, it is necessary to supply a piece of foil to serve as a brazing material on the pellet placement surface. In this method, tape-shaped brazing material is cut into arbitrary lengths and supplied before pellets are placed. However, in the IC assembly process where a wide variety of products are being produced, the pellet size is frequently changed, and it is necessary to change the width of the raw material and the cutting length of the raw material each time. There has been a strong need for a device that can easily change the amount of brazing material supplied.

The present invention solves the above-mentioned problems by installing the main body of the brazing material supplying device on a stage that moves in biaxial directions and on a horizontal plane, and by driving the stage to an arbitrary position in a matrix to supply the brazing material. The present invention is characterized in that a plurality of brazing materials are supplied in a matrix, and a desired number of brazing materials can be placed in a desired brazing material supply range without changing the tape even when the pellet size is changed. Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 shows an example of the configuration of a die bonder. In FIG. 1, a frame 3 is supplied and conveyed by a frame conveying claw 2 from a frame supply unit 1, and a soldering material foil piece 5 such as Au cut into an appropriate length from a tape-shaped soldering material 4 is attached to a soldering material supplying arm 6. It is further fed on the heating conveyance section 7 to one die bonding position. On the other hand, the semiconductor pellet 8 to be die-bonded is aligned on a pellet alignment stage 9 using a pellet attitude recognition device (not shown), and fixed onto the frame 3 by a die bonding arm 10. 11 is a lead frame storage section. As the pellet size and shape change, the supply amount and position of the brazing material are changed, but conventionally the supply arm 6 reciprocates between the heating conveyance section 7 and the tape-shaped brazing material 4 at a constant stroke. Therefore, since the foil pieces 5 are supplied to fixed positions on the frame 3, the position of the foil pieces 5 and the amount of supply must be adjusted manually by the operator. Therefore, as shown in FIG. 2, the present invention includes a brazing material supplying device including a tape-shaped brazing material 4, a cutter 13 for cutting the brazing material 4 into a predetermined length, and a brazing material foil cut by the cutter 13. a brazing material supplying arm 7 that sucks the piece 5 and moves it up and down and back and forth to supply it to the pellet mounting surface of the frame 3;
5, the main body S of the brazing material supply device is connected to two pulse motors 1 in synchronization with the supply operation.
2 and 12 on a stage 9 that is driven on a horizontal plane in two axial directions. Then, the feeding device according to the present invention drives and controls the stage 9 according to a command from the control unit to stop it at an arbitrary position arranged in a matrix in the vertical and horizontal directions, and feeds the foil piece 5 with the feeding arm 6 as shown in FIG. As shown in the figure, it is supplied in a maximum of 3x3 matrix. 6' shows the state in which the supply arm 6 supplies the foil piece 5 to the frame 3.

In the present invention, as shown in FIG. 4 (1) to (1x), the supply amount and layout of brazing material can be freely controlled on software as the pellet size and shape changes, and automation is also easy. Since it is possible to set an appropriate brazing material supply amount and brazing material arrangement pitch, it contributes to cost reduction in the die bonding process using precious metals. The brazing material supply operation is repeated as many times as the number of brazing materials to be supplied, but it can be performed while the pellets are swinging, and if more than one brazing material is required, the pellet size is large and the swinging time is long. It has no negative effect on the machine index.

As described above, according to the present invention, the supply amount and arrangement of brazing material can be set arbitrarily, making it possible to reduce the cost of brazing material.
In addition, since all of these can be controlled by software, it has the effect of being fully automated.

[Brief explanation of drawings]

Figure 1 is an explanatory diagram of the configuration of the die bonder, Figure 2 is a configuration diagram showing an embodiment of the present invention, Figure 3 is a diagram of the brazing material supply arrangement of this embodiment, and Figures 4 (i) to (1X) are FIG. 2 is a brazing material supply layout diagram showing an example of a material supply method. 1...Lead frame supply section, 6...Raw material supply arm, 9...Stage Patent applicant NEC Corporation Fig. 3, Fig. 4,, l,) 5

Claims (1)

[Claims] (1) A tape-shaped brazing material for fixing semiconductor pellets to a lead frame or case, etc. is cut into brazing material foil pieces of appropriate length, and the brazing material supply arm supplies the soldering material foil pieces to the leads that are supplied and conveyed from the frame supply section. A die bonder supplying device for supplying brazing material to a pellet mounting surface such as a frame or a case, characterized in that a main body of the device including a brazing material supply arm is installed on a stage that is driven in biaxial directions on a horizontal surface. brazing material supply device.