CN111656505A - Bonding tool for a bonding machine, bonding machine for bonding semiconductor elements and associated method - Google Patents

Bonding tool for a bonding machine, bonding machine for bonding semiconductor elements and associated method Download PDF

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Publication number
CN111656505A
CN111656505A CN201980009949.9A CN201980009949A CN111656505A CN 111656505 A CN111656505 A CN 111656505A CN 201980009949 A CN201980009949 A CN 201980009949A CN 111656505 A CN111656505 A CN 111656505A
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China
Prior art keywords
workpiece
welding
bonding
tool
adhesive
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Granted
Application number
CN201980009949.9A
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Chinese (zh)
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CN111656505B (en
Inventor
U·恩斯特
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Kulicke and Soffa Industries Inc
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Kulicke and Soffa Industries Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
    • F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
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  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)

Abstract

A welding tool for welding a first workpiece to a second workpiece on a welder is provided. The welding tool includes a body portion for welding a first workpiece to a second workpiece on the welder. The bonding tool also includes a curing system for curing an adhesive provided between the first and second workpieces.

Description

Bonding tool for a bonding machine, bonding machine for bonding semiconductor elements and associated method
Cross Reference to Related Applications
This application claims the benefit of U.S. provisional application No. 62/621,979, filed on 25/1/2018, the contents of which are incorporated herein by reference.
Technical Field
The present invention relates to the soldering of workpieces (such as semiconductor die soldering, pick and place soldering of workpieces, etc.), and more particularly to an improved bonding tool for curing adhesives in connection with workpiece soldering operations.
Background
In connection with welding a first workpiece to a second workpiece, welding of the workpieces typically uses an adhesive (e.g., an epoxy-based adhesive). Exemplary bonding operations include semiconductor die bonding, pick and place bonding of workpieces, and the like.
For example, in conventional semiconductor die attach (also referred to as die bonding) applications, a semiconductor die is bonded (e.g., with an adhesive, etc.) to a bonding location of a substrate (e.g., a leadframe, another die in a stacked die application, a spacer, or any other substrate). Other semiconductor components (e.g., other than semiconductor die) may also be bonded/placed using the adhesive. Other types of workpieces may also be "soldered" to a soldering machine, such as a glass substrate, using an adhesive.
Curing of the adhesives used in connection with such welding operations tends to increase production time. Accordingly, it would be desirable to provide improved bonding tools, welders including such bonding tools, and related methods.
Disclosure of Invention
In accordance with an exemplary embodiment of the present invention, a welding tool for welding a first workpiece to a second workpiece on a welder is provided. The welding tool includes a body portion for welding a first workpiece to a second workpiece on the welder. The bonding tool also includes a curing system for curing an adhesive provided between the first and second workpieces.
According to another exemplary embodiment of the present invention, a welder for welding a first workpiece to a second workpiece is provided. The welder includes a welding tool. The welding tool includes (a) a body portion for welding a first workpiece to a second workpiece on a welder and (b) a curing system for curing an adhesive provided between the first workpiece and the second workpiece. The welder also includes a support structure for supporting the second workpiece during welding of the first workpiece to the second workpiece using the body portion.
According to yet another exemplary embodiment of the present invention, a method of operating a welder is provided. The method comprises the following steps: (a) causing a welding tool to carry a first workpiece; (b) initiating a welding process for welding a first workpiece to a second workpiece using a welding tool; (c) curing the adhesive provided between the first and second workpieces with a curing system of the bonding tool after step (b).
Drawings
The invention is best understood from the following detailed description when read with the accompanying drawing figures. It is emphasized that, according to common practice, the various features of the drawing are not to scale. On the contrary, the dimensions of the various features are arbitrarily expanded or reduced for clarity. Included in the drawings are the following figures:
FIG. 1 is a block diagram of a top view of elements of a welder, according to an exemplary embodiment of the present invention;
FIG. 2 is a side view block diagram of elements of the welder of FIG. 1;
3A-3D are side view block diagrams illustrating operation of a welding tool of a welder, according to exemplary embodiments of the present invention;
4A-4C are side view block diagrams illustrating operation of another bonding tool of a welder, according to another exemplary embodiment of the present invention; and
FIGS. 5A-5C are block diagrams illustrating side views of yet another bonding tool of a welder, according to still another exemplary embodiment of the invention.
Detailed Description
As used herein, the term "workpiece" may refer to any type of structure configured for welding to another structure, or any type of structure configured for receiving another structure during a welding operation. For example, the first workpiece as described herein may be a semiconductor element, or a substrate (e.g., a glass substrate). In some applications, the first workpiece may be transparent or translucent. For example, the second workpiece as described herein may be a substrate as defined below.
As used herein, the term "semiconductor element" is intended to refer to any structure that includes (or is configured to include at a later step) a semiconductor chip or die. Exemplary semiconductor components include bare semiconductor dies, semiconductor dies on a substrate (e.g., a leadframe, a PCB, a carrier, a semiconductor chip, a semiconductor wafer, a BGA substrate, a semiconductor component, etc.), packaged semiconductor devices, flip chip semiconductor devices, dies embedded in a substrate, semiconductor die stacks, and the like. Additionally, the semiconductor elements may include elements configured for soldering or otherwise included in a semiconductor package (e.g., spacers, substrates, etc. to be soldered in a stacked die configuration).
As used herein, the term "substrate" is intended to refer to any structure to which a workpiece may be welded. Exemplary substrates include, for example, lead frames, PCBs, carriers, modules, semiconductor chips, semiconductor die, BGA substrates, semiconductor elements, and the like.
According to an exemplary aspect of the present invention, a bonding tool of a bonding machine is equipped with a curing system for curing an adhesive (e.g., epoxy) used to bond a first workpiece to a second workpiece. In a particular example: the curing system may be configured to cure the adhesive during the welding operation (see, e.g., fig. 3A-3D); the curing system may be configured to cure the adhesive after the welding operation (see, e.g., fig. 4A-4C); or the curing system may be configured to cure the adhesive after the welding operation but while welding another first workpiece to the second workpiece (see, e.g., fig. 5A-5C) or to another second workpiece.
Like reference numerals refer to like elements throughout the various figures unless otherwise specified herein.
Referring now to the drawings, FIG. 1 illustrates a top view of a welder 100 (e.g., pick and place machine, die placement machine, workpiece welder, etc.). The welder 100 includes a support structure 102 for supporting a second workpiece 104 (e.g., a substrate) associated with a welding operation. The welder 100 also includes an adhesive dispenser 106 configured to dispense adhesive 106a onto each of the weld sites 104a of the second workpiece 104 prior to welding the first workpiece 110a to the corresponding weld site 104 a. The welder further includes a pick and place system 108 configured to: (a) removing a first workpiece 110a from a first workpiece supply 110 (such as a semiconductor wafer or other workpiece supply); and (b) placing the first workpiece 110a onto the corresponding weld site 104a associated with the welding operation.
As shown in the progression of fig. 1, the second workpiece 104, which has not received any adhesive 106a from the adhesive dispenser 106, is on the left side of the support structure 102. Another second workpiece 104, which has received adhesive 106a from the adhesive dispenser 106, but has not received any first workpiece 110a on top of the dispensed adhesive 106a, is in the middle of the support structure 102 (downstream of the adhesive dispenser). Another second workpiece 104, which has received adhesive 106a from the adhesive dispenser 106 and has received a first workpiece 110a on top of the adhesive 106a, is on the right side of the support structure 102 (downstream of the pick and place system 108). Thus, an exemplary process flow is illustrated.
As will be understood by those skilled in the art, a single tool (from the pick and place system 108) may be used to "pick" the first workpiece 110a from the first workpiece supply 110 and "place" (or weld) the picked first workpiece 110a onto the weld site 104a of the second workpiece 104. However, multiple tools (from the pick and place system 108) may also be used. For example, a pick tool (from the pick and place system 108) may be provided to pick the first workpiece 110a from the first workpiece supply 110, and then the first workpiece 110a may be transferred to a place tool (from the pick and place system 108) that places/welds the first workpiece 110a onto the corresponding weld site 104 a. In yet another example, an intermediate "transfer" tool (or multiple intermediate "transfer" tools) may be provided between the picking tool and the placement tool (from the picking and placement system 108).
Fig. 2 illustrates an example of the pick and place system 108 from fig. 1, wherein a pick tool (200a ', 200b ', 200c ') is used to "pick" a first workpiece 110a from the first workpiece supply 110. The pick-up tool (200a ', 200b ', 200c ') includes a nozzle 104 (e.g., including a vacuum channel, etc.) for holding the first workpiece 110 a. An ejector system 110b including an ejector 110b1 is provided to assist in removing the first workpiece 110a from the remainder of the first workpiece supply 110.
Fig. 2 also illustrates a welding tool (200a, 200b, 200c) for welding the first workpiece 110a to the welding site 104a of the second workpiece 104. The second workpiece 104 is supported by the support structure 102. The welding tool (200a, 200b, 200c) includes a body portion 202 including a nozzle 202a, the nozzle 202a for holding the first workpiece 110a before and during welding of the first workpiece 110a to the weld site 104 a.
As provided above, the pick-up tools (200a ', 200b ', 200c ') may be identical to the bonding tools (200a, 200b, 200 c). Or they may be different. Thus, in fig. 2, the space between the picking tool (200a ', 200b ', 200c ') and the bonding tool (200a, 200b, 200c) is intended to indicate: the pick-up tool and the bonding tool may be the same; or the picking tool and bonding tool may be different and there may be transfers occurring between the picking tool and bonding tool (where such transfers may or may not involve one or more intermediate transfer tools).
Fig. 3A-3D, 4A-4C, and 5A-5C illustrate details of the example bonding tools 200a, 200b, 200C of fig. 2. That is, the bonding tool of fig. 2 (and thus included in the pick and place system of fig. 1) may be any of the bonding tools 200a, 200b, 200C shown in fig. 3A-3D, 4A-4C, and 5A-5C (or any other bonding tool within the scope of the present invention).
With particular reference to fig. 3A, the welding tool 200a includes a body portion 202 for welding the first workpiece 110a to the weld site area of the second workpiece 104. The body portion 202 includes a nozzle 202a for holding the first workpiece 110a before and during welding of the first workpiece 110a to the weld site of the second workpiece 104. The bonding tool 200a also includes a curing system 204a (such as a light-based curing system, e.g., an ultraviolet light-based curing system, a blue light-based curing system, etc.) for energizing the curing adhesive. In the examples shown in fig. 3A-3D (and the examples shown in fig. 4A-4C and fig. 5A-5C), curing system 204A may be an Ultraviolet (UV) light curing system; however, other types of curing systems (such as curing systems based on other types of light sources, thermal-based curing systems such as forced air heaters, radiant heaters, etc.) are also contemplated.
The curing system 204a includes a plurality of energy sources 204a1 (e.g., light sources such as UV light sources) and includes a wall portion 204a 2. The wall portion 204a2 is provided to direct energy (such as light, e.g., ultraviolet light, blue light, heat, etc.) from an energy source 204a1 toward the first workpiece 110a to cure the adhesive 106a (e.g., a photosensitive adhesive). In the configuration of fig. 3A-3D, curing a portion of the adhesive 106a may be performed at least partially simultaneously with welding the first workpiece 110a to the same portion of the adhesive 106 a. As shown in fig. 3A, a welded first workpiece 110a is shown. A portion of the adhesive 106a is to the left of the welded first workpiece 110 a. In fig. 3B, a bonding tool 200a is used to bond another first workpiece 110a to a portion of the adhesive 106 a. In fig. 3C, energy 204a 1' (e.g., UV light, other light, heat, etc.) is provided from an energy source 204a1 (e.g., UV light source, other light source, heat source, etc.) to cure a portion of the adhesive 106a under the first workpiece 110a currently being welded while performing the welding operation initiated in fig. 3B. At fig. 3D, the operation is complete as the welding of the first workpiece 110a to the weld of the second workpiece 104 and the curing of a portion of the adhesive 106a between the first workpiece 110a and the second workpiece 104 is complete. The curing process may take longer than the welding process; however, due to the simultaneous nature of the welding process and the curing process, the operation is still efficient in terms of time.
Fig. 4A-4C and 5A-5C are described in relation to an ultraviolet light source for providing ultraviolet light for curing of the adhesive. However, it is understood (like fig. 3A-3D) that each uv light source 204a1 may be another type of energy source (e.g., a blue light source, another type of light source, a heat source, etc.) for providing another type of energy (e.g., blue light, another type of light, heat, etc.) for adhesive curing.
Fig. 4A-4C illustrate a welding tool 200b, the welding tool 200b including a body portion 202 for welding the first workpiece 110a to the weld site area of the second workpiece 104. The body portion 202 includes a nozzle 202a for holding the first workpiece 110a before and during welding of the first workpiece 110a to the weld site of the second workpiece 104. The bonding tool 200b also includes a curing system 204 a. In contrast to the configuration shown in fig. 3A-3D, in fig. 4A-4C, curing system 204A is configured to cure a portion of adhesive 106a after first workpiece 110a is welded to the portion of adhesive 106 a. As shown in fig. 4A, the curing system is secured to (and considered part of) the bonding tool 200 b. Thus, it is contemplated that the bonding tool 200b (including the curing system 204a) is carried by a common motion system (such as via a bond head assembly or the like). The curing system 204a includes a plurality of UV light sources 204a1 and includes a wall portion 204a 2. The wall portion 204a2 is provided to direct ultraviolet light from the UV light source 204a1 toward the first workpiece 110a to cure the adhesive 106 a. In addition to wall portion 204A2, the embodiment of fig. 4A-4C (and fig. 5A-5C) includes additional guiding structures 204A3 for guiding UV light 204A 1' as desired. For example, a common curing system 204a may be used for many different applications, but the output UV light may be adjusted with application specific directing structures 204a 3.
In the configuration of fig. 4A-4C, curing a portion of the adhesive 106a may be performed immediately (or substantially immediately) after welding the first workpiece 110a to that same portion of the adhesive 106 a. As shown in fig. 4A, a welded first workpiece 110a is shown. A portion of the adhesive 106a is to the left of the welded first workpiece 110 a. In fig. 4B, a bonding tool 200a is used to bond another first workpiece 110a to a portion of the adhesive 106 a. In fig. 4C, after the welding operation of fig. 4B is completed, welding tool 200B is moved to position curing system 204a over the just-welded first workpiece 110 a. In this position, UV light 204a 1' is provided from UV light source 204a1 to cure a portion of the adhesive 106a under the first workpiece 110a shortly before it is being welded.
Fig. 5A-5C illustrate a welding tool 200C, the welding tool 200C including a body portion 202 for welding a first workpiece 110a to a weld region of a second workpiece 104. The body portion 202 includes a nozzle 202a for holding the first workpiece 110a before and during welding of the first workpiece 110a to the weld site of the second workpiece 104. The bonding tool 200b also includes a curing system 204 a. In contrast to the configuration shown in fig. 3A-3D and 4A-4C, in fig. 5A-5C, curing system 204A is configured to cure a portion of adhesive 106a at least partially during the same time period that different first workpieces 110a are welded. As shown in fig. 5A, the curing system is secured to (and considered part of) the bonding tool 200 c. Thus, it is contemplated that the bonding tool 200c (including the curing system 204a) is carried by a common motion system (e.g., by a bond head assembly, etc.). The curing system 204a includes a plurality of UV light sources 204a1 and includes a wall portion 204a 2. The wall portion 204a2 is provided to direct ultraviolet light from the UV light source 204a1 toward the first workpiece 110a to cure the adhesive 106 a. In addition to the wall portion 204a2, an additional guiding structure 204a3 is provided for guiding the UV light 204a 1' as required. For example, a common curing system 204a may be used for many different applications, but the output UV light may be adjusted with application specific directing structures 204a 3.
In the configuration of fig. 5A-5C, curing a portion of the adhesive 106a may be performed at least partially simultaneously with welding another first workpiece 110a to a different portion of the adhesive 106 a. As shown in fig. 5A, the welded first workpiece 110a is shown below the curing system 204 a. A portion of the adhesive 106a is to the right of the welded (but not yet cured) first workpiece 110 a. In fig. 5B, the welding tool 200c is used to weld another first workpiece 110a to a portion of the adhesive 106a, while the curing system 204a is used to direct UV light 204a 1' from a UV light source 204a1 to cure the portion of the adhesive 106a under the already welded first workpiece 110 a.
Fig. 5A-5C also illustrate the spacer 206. As will be understood by those skilled in the art, it may be desirable for a common curing system to be used across multiple applications having different space requirements. Spacers 206 are provided to indicate that spacers (e.g., adjustable mechanisms) can be provided to allow for spacing requirements for different applications.
The embodiments of fig. 3A-3D, 4A-4C, and 5A-5C are exemplary in nature. Different configurations are also contemplated within the scope of the present invention. In addition, the present invention is described primarily with respect to a UV light source for providing adhesive curing; however, it is understood that different types of energy sources (e.g., blue light sources, other light sources, heat sources) may also be employed.
The use of a UV light source in connection with the present invention may find particular application where the first workpiece is a glass substrate, which may be transparent and/or translucent, such that the UV light may efficiently cure the adhesive under the glass substrate.
Although the invention is illustrated and described herein with reference to specific embodiments, the invention is not intended to be limited to the details shown. Rather, various modifications may be made in the details within the scope and range of equivalents of the claims and without departing from the invention.

Claims (21)

1. A welding tool for welding a first workpiece to a second workpiece on a welder, the welding tool comprising:
a body portion for welding a first workpiece to a second workpiece on the welder; and
a curing system for curing an adhesive provided between a first workpiece and a second workpiece.
2. The bonding tool of claim 1, wherein the curing system comprises a light source.
3. The bonding tool of claim 2, wherein the curing system is an ultraviolet curing system and the light source is an ultraviolet light source.
4. The bonding tool of claim 3, wherein the curing system comprises a wall portion for directing ultraviolet light from an ultraviolet light source of the ultraviolet light curing system toward the first workpiece to cure the adhesive.
5. The bonding tool of claim 1, wherein the curing system comprises a heater for heating the adhesive.
6. The bonding tool of claim 1, wherein the curing system is configured to cure the adhesive during bonding of a workpiece to a substrate with the body portion.
7. The bonding tool of claim 1, wherein the curing system is configured to cure the adhesive after bonding a workpiece to a substrate with the body portion.
8. The bonding tool of claim 1, wherein the curing system is configured to cure the adhesive while the body portion is bonding another workpiece to a substrate.
9. The bonding tool of claim 1, wherein the first workpiece is a semiconductor component.
10. The bonding tool of claim 1, wherein the workpiece comprises a semiconductor die.
11. The bonding tool of claim 1, wherein the workpiece is a glass substrate.
12. The bonding tool of claim 1, wherein the workpiece is transparent.
13. The bonding tool of claim 1, wherein the workpiece is translucent.
14. A welder for welding a first workpiece to a second workpiece, the welder comprising:
a welding tool comprising (a) a body portion for welding a first workpiece to a second workpiece on a welder and (b) a curing system for curing an adhesive provided between the first workpiece and the second workpiece; and
a support structure for supporting a second workpiece during welding of a first workpiece to the second workpiece with the body portion.
15. The welding machine of claim 14, further comprising a motion system for carrying the welding tool including the curing system.
16. The bonding machine of claim 14, wherein the bonding machine is a die placement machine and the bonding tool is a die placement tool.
17. A method of operating a welder, the method comprising the steps of:
(a) causing a welding tool to carry a first workpiece;
(b) initiating a welding process for welding a first workpiece to a second workpiece using a welding tool;
(c) curing the adhesive provided between the first and second workpieces with a curing system of the bonding tool after step (b).
18. The method of claim 17, wherein step (c) occurs simultaneously with at least a portion of step (b).
19. The method of claim 17, wherein step (c) occurs after completion of the welding process initiated in step (b).
20. The method of claim 17, wherein step (c) occurs after completion of the welding process initiated in step (b) and at least partially during welding of the other first workpiece to the other portion of the second workpiece.
21. The method of claim 17, wherein step (c) comprises curing the adhesive after step (b) using ultraviolet light from the curing system.
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