JP2000340603A - Carry-in/carry-out of semiconductor work and device and method for wire bonding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve productivity and to maintain stable operating efficiency by efficiently performing one-by-one carry-in/carry-out of a semiconductor work and wire bonding work, and to form into small and compact size. SOLUTION: A semiconductor work is thrown in a work holding part 3 of a stage unit 4 one by one with a work carry-in/carry-out mechanism part 2. Here the semiconductor work is positioned, and further it is heated up to a prescribed temperature, and then rotated in a 180-degree arc by a rotating mechanism part 9 of the stage unit 4 to move to a bonding unit 6 side. After it is clamped by a clamper 7, a prescribed wire bonding work is performed with a capillary 19 of the bonding unit 6. During this work, a next semiconductor work is thrown in another work holding part 3. The semiconductor work that has already wirebonded is carried out to a next process side by work carry-in/carry-out mechanism part 2 engaging with the work holding part 3, that is rotated in a 180-degree arc to be returned to the original position.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for carrying in / out a semiconductor work and wire bonding the same, and more particularly, to carry-in / out of a semiconductor work and a wire for effectively manufacturing a single semiconductor work. The present invention relates to a bonding apparatus and a bonding method.

[0002]

2. Description of the Related Art There are various known techniques for wire bonding an IC chip or the like as a semiconductor work. For example, Japanese Patent Application Laid-Open Nos.
-364049. JP-A-4-123
No. 446, "Positioning control method" discloses a technique relating to wire bonding of an IC chip mounted on a lead frame and transferred to a position of a wire bonder, and this known technique is mounted on a lead frame. This is for accurately positioning a large number of IC chips to be wire-bonded. The "wire bonder" disclosed in Japanese Patent Application Laid-Open No. 4-364049 has a bonding stage portion having a two-tiered structure with an upper stage for wire bonding, and a lower stage for passing a wire frame after the wire bonding operation, thereby improving the efficiency of the wire bonding operation. In this case as well, a plurality of IC chips are simultaneously transferred to perform a wire bonding operation.

[0003]

As a mode of transporting a semiconductor work in a semiconductor manufacturing apparatus, for example, a wire bonder, a lead frame on which a plurality of IC chips or hollow packages, which are generally semiconductor works, can be mounted as in the above-mentioned known technique. Or, a carrier is usually used. However, in recent years, a production method of producing a single semiconductor work has been adopted in response to demands for production efficiency and productivity, such as adaptation to high-mix low-volume production, miniaturization of equipment, and reduction of lead time. As a transfer method in the case of one-piece flow, a method of transferring a semiconductor work directly from a previous process to a wire bond stage by intermittent transfer or suction holding pick and place transfer is generally used. However, this method has the following problems. In other words, in the case of intermittent conveyance using a lead frame or a carrier in the conventional conveyance mode, the positioning of the semiconductor work is completed in advance using the positioning holes,
In the case of one-piece flow, the above-described positioning cannot be performed. Therefore, it is necessary to position the semiconductor work itself before the wire bonding operation. In addition, it is necessary to heat the semiconductor work to a certain temperature or higher before performing the wire bonding operation, and a step of clamping and fixing the semiconductor work at a predetermined position is also required. As described above, when one semiconductor work is directly transferred to the wire bond stage to perform the wire bonding operation, positioning, heating,
It is necessary to perform clamping, wire bonding work, work unloading, and the like continuously on the same stage, and the total work time becomes extremely long, resulting in a problem that productivity is reduced.

[0004] The present invention has been made in view of the above-mentioned circumstances, and it is possible to flow a semiconductor work piece by piece and cope with high-quality small-quantity production. It is an object of the present invention to provide a semiconductor work carry-in / out and wire bonding apparatus and method for improving productivity by performing bonding operations in parallel, and reducing the size of the apparatus and stabilizing the operation.

[0005]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention is intended to carry out a semiconductor work consisting of a hollow package in which an IC chip is die-bonded one by one, and to carry out a wire bonding operation therebetween. A semiconductor work carrying-in / out and wire bonding apparatus, comprising: a pair of work holding units disposed at opposing positions on a rotary table for holding the semiconductor work in a position capable of wire bonding. , A stage unit for supporting the stage so as to be intermittently rotatable by 180 degrees, a lifting mechanism of the stage unit, and a work carrying-in / out mechanism arranged to engage with the work holding part of the stage unit and carry in / out the semiconductor work And a semiconductor positioned and moved to a wire bonding operation position by rotation of the stage unit And a bonding unit for carrying in and out the semiconductor work, which includes a heating unit for preheating the semiconductor work in the vicinity of the work holding unit of the stage unit. Make up. More specifically, a positioning mechanism for positioning the semiconductor work held by the work holding unit is provided near the work holding unit, and the semiconductor work on the work holding unit is provided on the bonding unit side. It is characterized in that a clamper fixed to the work holding portion is provided.

Further, in order to achieve the above object, the present invention carries out a semiconductor work consisting of a hollow package in which an IC chip is die-bonded, and carries it in and out, while carrying out a wire bonding operation therebetween. And a wire bonding method, comprising: a first step of loading one semiconductor work into one of a pair of work holding portions disposed opposite to each other on a stage unit that is intermittently rotated by 180 degrees; A second procedure of positioning the semiconductor work at a predetermined position of the work holding unit, a third procedure of rotating the stage unit by 180 degrees, and positioning and moving the semiconductor work to a wire bonding work position; A fourth step of clamping the semiconductor work to the work holding portion, and performing a wire bonding operation of the semiconductor work. A fifth procedure, a sixth procedure of rotating the stage unit by 180 degrees to return the semiconductor work on which the wire bonding has been performed to the original position, and removing the semiconductor workpiece on which the wire bonding has been performed on the workpiece holding unit. A seventh procedure of unloading the semiconductor device, wherein one of the semiconductor workpieces on the workpiece holding part disposed opposite to each other on the stage unit is being wire-bonded during the wire-bonding operation; The present invention is characterized by a semiconductor work carry-in / out and wire bonding method for carrying out a work and carrying in a new semiconductor work.

The semiconductor work is carried into one work holding part of the stage unit by the carry-in / out mechanism, and is held in a position enabling wire bonding by the positioning mechanism. In this state, the semiconductor work is heated to an appropriate temperature. Next, the stage unit is rotated by 180 degrees, the semiconductor work is transferred to the bonding unit side, the semiconductor work is clamped, and a wire bonding operation is performed. in this case,
A new semiconductor work is carried into another work holding part, and preliminary work is performed. When the wire bonding operation is completed, the stage unit is automatically rotated by 180 degrees, the semiconductor work on which the wire bonding operation has been completed is returned to the original position, and a new semiconductor work is transferred to the bonding unit. The semiconductor work returned to the original position is carried out to the next process side by the work carrying-in / out mechanism. Hereinafter, the same operation as described above is repeated.

[0008]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a semiconductor device according to an embodiment of the present invention; FIG. 1 shows a semiconductor work carry-in / out and wire bonding apparatus 1 (hereinafter simply referred to as a wire bonding apparatus 1) of the present invention roughly divided into a work-in / out mechanism 2 for a semiconductor work and a semiconductor work held in a wire-bondable state. A pair of work holders 3 and 3 are disposed to face each other, and these are alternately rotated to a 180-degree rotation position, a lifting mechanism 5 of the stage unit 4, and a wire bonding operation. It comprises a bonding unit 6, a clamper 7, and the like.

First, the stage unit 4 will be described with reference to FIGS. The stage unit 4 is a rotary table 8
A rotation mechanism 9 that intermittently rotates this by 180 degrees,
Work holding parts 3, 3 and the like are arranged at target positions opposite to each other with the rotating shaft 10 of the rotating mechanism part 9 interposed therebetween. Also,
As shown in FIG. 1, the stage unit 4 is provided with an elevating mechanism 5 for elevating the stage unit 4. The structure of the elevating mechanism 5 and the rotating mechanism 9 is a well-known technique, and a description thereof will be omitted. Also, as shown in FIG.
Is provided with a holding hole 11 for holding a semiconductor work, and a heating means 12 disposed below the holding hole. Holding hole 1
A vacuum suction system (not shown) is engaged with and disposed at 1. Also,
The heating means 12 comprises, for example, a cartridge type heater,
It is connected to a power supply control unit (not shown). In addition, the vacuum suction systems of the pair of work holding units 3 and 3 are independent of each other,
ON / OFF of vacuum suction can be performed independently.

FIG. 3 shows a semiconductor work 15 in which an IC chip 14 is housed in a hollow package 13 having wires 24. Note that the IC chip 14 is arranged by being die-bonded to the hollow package 13. FIG. 4 shows an outline of the wire bonding operation of the semiconductor work 15 described above.
The C chip 14 is wire-bonded to the wire 24 by a bonding unit 6 described later.

[0011] As shown in FIG.
The semiconductor unit 15 includes a transfer unit 16 having a vacuum suction pick and place transfer mechanism capable of holding the semiconductor work 15 by suction and transferring the semiconductor work 15 to a predetermined position, and holding the semiconductor work 15 in a holding hole of one work holding unit 3 of the stage unit 4. The semiconductor work 1 mounted on the work holding unit 3 after being put into the work holding unit 3
5 is held by suction and transported to the next process side.

In the vicinity of the work holding portion 3 of the stage unit 4, the semiconductor work 1 held in the work holding portion 3 is provided.
Positioning tools 17 and 18 for positioning the position 5 are provided. The positioning tools 17 and 18 are arranged opposite to each other, and function to engage the semiconductor work 15 held in the work holding portion 3 in the front-rear direction to set the semiconductor work 15 at a predetermined wire bonding workable position. I do.

The bonding unit 6 for performing the wire bonding operation of the semiconductor work 15 includes a capillary 19.
And a bonding head 20 that holds the bonding head, and a bonding unit main body 21 that incorporates an XYZ drive mechanism (not shown) for moving the bonding head 20 in the XYZ directions.
The wire bonding operation is performed by exciting the capillary 19 with ultrasonic waves.

As the clamper 7, a wind clamper 22 is used in the present embodiment. This wind clamper 22
Is supported by a spring mechanism (not shown) in the bonding unit 21 so that a spring force always acts downward. Therefore, when the wind clamper 22 is pressed from below, a clamping force acts on the pressed side. The window clamper 22 is provided with a hole 23 through which the work holding portion 3 can be inserted. When the work holding portion 3 and the semiconductor work 15 held by the work holding portion 3 pass through the hole 23 and approach the capillary 19, the wind clamper 22 is The semiconductor work 15 is formed so that the semiconductor work 15 is clamped by being pressed from below and exerting a clamping force on the work holding portion 3 side.

Next, a method of carrying in / out the semiconductor work 15 by the bonding apparatus 1 having the above structure and a wire bonding operation method will be described with reference to a flowchart of FIG. First, the transport unit 16 of the work loading / unloading mechanism 2 performs 1
The semiconductor work 15 is vacuum-adsorbed to the individual pieces, and the semiconductor work 15 is transported to the position of the holding hole 11 of one work holding part 3 of the stage unit 4 to carry in the work (step 100). Here, the semiconductor work 15 is positioned at an accurate holding position by the positioning tools 17 and 18, and the semiconductor work 15 is moved to the work holding section 3.
Is held by vacuum suction. In this state, preliminary heating is performed by the heating means 12 to heat the semiconductor work 15 to a predetermined temperature (step 101).

Next, the stage unit 4 is rotated by the rotating mechanism 9.
Is rotated by 180 degrees to move the work holding portion 3 holding the semiconductor work 15 at a predetermined position to the bonding unit 6 side (step 102). In this state, the lifting mechanism 5 is operated to raise the stage unit 4, push the wind clamper 22 upward, and clamp the work holder 3 and the semiconductor work 15 by the wind clamper 22 (step 103). The clamping force is about 0.5
To about 1 kgf. In this state, the semiconductor work 15
The capillary 19 is moved to the wire bonding position of (1), and a predetermined wire bonding operation is performed (step 1).
04).

On the other hand, another wire holding unit 3 located at a position opposite to the work holding unit 3 holding the semiconductor work 15 on which the wire bonding operation is being performed is positioned at a position where the semiconductor work 15 can be loaded. Therefore, the work loading / unloading mechanism 2 is operated to set the next semiconductor work 1
5 is transferred to the work holding unit 3 side, and the holding, positioning, heating, and the like of the semiconductor work 15 are performed in advance. This operation is performed in parallel with the previous wire bonding operation of the semiconductor work 15.

When the wire bonding operation is completed, the stage unit 4 is rotated by 180 degrees to return the work holding portion 3 holding the wire-bonded semiconductor work 15 to the original position (step 105). Along with this operation, another work holding unit 3 and the next semiconductor work 15 held by the unit and completed in the preparation work before the wire bonding work are transferred to the wire bonding unit 6 side, and are subjected to a predetermined wire bonding work. Is performed. Further, the semiconductor work 15 on the work holding unit 3 which has returned to the original position is carried out to the next process side by the work carrying-in / out mechanism 2 (step 106). Thereafter, by repeating the same cycle, the semiconductor workpieces 15 are continuously wire-bonded one by one and carried out. As described above, in the bonding apparatus 1 of the present invention, since the semiconductor work 15 is carried in and out simultaneously with the wire bonding operation, the loss time is greatly reduced. In addition, since the exchange of the pair of work holding parts 3 and 3 is performed by the rotating operation by the rotating mechanism, the time required for this is extremely short, and the operation rate can be improved.

[0019]

According to the present invention, since the wire bonding operation and the loading / unloading of the semiconductor work are performed in parallel,
The loss time is small, and the productivity can be greatly improved. Further, the device structure is made of a compact and small device using the rotary table 8 and the like, so that the device cost can be reduced.
Further, the loss time required for transfer between the components is extremely short, the operation rate can be improved, and stable operation can be achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the overall schematic structure of a semiconductor work carry-in / out and wire bonding apparatus according to the present invention.

FIG. 2 is a perspective view showing a detailed structure around a stage unit in FIG. 1;

FIG. 3 is a perspective view showing one of the semiconductor works in the present invention.

FIG. 4 is a schematic view showing an outline of a wire bonding operation.

FIG. 5 is a flowchart for explaining a method for carrying in / out a semiconductor work and wire bonding according to the present invention;

[Explanation of symbols]

Reference Signs List 1 semiconductor work carry-in / out and wire bonding device (wire bonding device) 2 work carry-in / out mechanism unit 3 work holding unit 4 stage unit 5 elevating mechanism unit 6 bonding unit 7 clamper 8 rotation table 9 rotation mechanism unit 10 rotation shaft 11 Holding hole portion 12 Heating means 13 Hollow package 14 IC chip 15 Semiconductor work 16 Transport unit 17 Positioning tool 18 Positioning tool 19 Capillary 20 Bonding unit body 21 Bonding unit body 22 Wind clamper 23 Hole 24 Wire

Claims (3)

[Claims] 1. An apparatus for carrying in and out a semiconductor work comprising a semiconductor package formed of a hollow package having an IC chip die-bonded therein, and carrying out a wire bonding operation between the semiconductor work and a wire bonding apparatus. A stage unit disposed at opposing positions on the rotary table and supporting a pair of work holding units for holding the semiconductor work in a position enabling wire bonding so as to be intermittently rotatable by 180 degrees; An elevating mechanism, a work loading / unloading mechanism arranged to engage with the work holding part of the stage unit for carrying in / out the semiconductor work, and positioning movement to a wire bonding work position by rotation of the stage unit Bonding unit for performing a wire bonding operation of the semiconductor work thus formed. And a heating means for preheating the semiconductor work is built in the vicinity of the work holding portion of the stage unit, and the semiconductor work carry-in / out and wire bonding apparatus is provided. 2. A positioning mechanism for positioning the semiconductor work held by the work holding part is provided near the work holding part, and a semiconductor work on the work holding part is provided on the bonding unit side. 2. The apparatus according to claim 1, further comprising a clamper fixed to the work holding unit. 3. A method for loading and unloading a semiconductor work comprising a hollow package in which an IC chip is die-bonded, and loading and unloading a semiconductor work, and performing a wire bonding operation therebetween, and a wire bonding method.
A first procedure of loading one of the semiconductor works into one of a pair of work holding sections disposed opposite to each other on a stage unit which is intermittently rotated; A second procedure of positioning the semiconductor work at a position, a third procedure of rotating the stage unit by 180 degrees, and positioning and moving the semiconductor work to a wire bonding work position, and clamping the semiconductor work to the work holding part at that position. A fourth procedure for performing a wire bonding operation on the semiconductor work, a sixth procedure for rotating the stage unit by 180 degrees to return the semiconductor work after the wire bonding operation to the original position. And a seventh step of sequentially carrying out the semiconductor work on which the wire bonding operation has been performed on the work holding unit. Of the semiconductor workpiece on the workpiece holding portion provided to face on stage unit 1
A method for loading and unloading a semiconductor work and a wire bonding method, wherein during the wire bonding work, the semiconductor work that has been subjected to the wire bonding work is carried out and a new semiconductor work is carried in.