JPS6258646A - Mounting device - Google Patents

Abstract

PURPOSE:To automatize bonding of a semiconductor chip to a stem by a method wherein the stem is placed on a placing stage by a stem carrying mechanism and the chip is fed on the stem by a mounting arm. CONSTITUTION:The interior of a case 17 is full of inert gas which is supplied by a gas feed pipe 18. A stem 3 is grasped by a chucking mechanism 9, is put in the case 17 through an opening part 19 and is placed on a placing stage 2, while a semiconductor chip 16 attracted to the capillary 15 of a mounting arm 13 is fed on the stem 3 on the placing stage 2. Then, a shutter 21 is actuated by a rotary solenoid 20 and the opening part 19 is blocked. Then, a heating unit 1 is passed a current and a die-bonding of the semiconductor chip 16 to the stem 3 ends.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a mounting device that performs die bonding for fixing a semiconductor laser chip to a stem, for example, in a semiconductor laser manufacturing process.

[Technical background of the invention and its problems]

Recently, many semiconductor lasers have been introduced for use in compact discs and optical information processing equipment. This semiconductor laser has a structure in which a semiconductor chip is fixed on a stem, and a die bonding device is used as a means for fixing the semiconductor chip to the stem.

This die bonding equipment uses a heating device to heat the mounting table on which the stem is placed in an inert gas atmosphere to heat the stem to approximately 200°C, while the semiconductor chip is adsorbed by a capillary installed in the mount arm. and feed it onto the stem.

The semiconductor chip is then welded onto the stem by melting indium deposited on the surface of the stem and gold deposited on the surface of the semiconductor chip.

However, the conventional die bonding apparatus requires highly accurate positioning when placing the semiconductor chip on the stem supplied on the mounting table. In other words, semiconductor lasers are generally bonded by protruding the semiconductor chip from the end face of the stem by several microns, but if the protrusion is large, the heat generated when the laser beam is emitted will not be conducted to the stem.
Durability decreases. On the other hand, if the amount of protrusion is small, there is a problem that the laser beam emitted from the semiconductor chip is blocked by the stem. Therefore, in order to position the semiconductor chip with high precision, an operator visually observes the position under a microscope. For this reason, the only mounting device available is a manual type, which reduces production efficiency.

[Purpose of the invention]

This invention was made in view of the above-mentioned circumstances, and its purpose is to provide a mounting device that can automatically perform die bonding between a semiconductor chip and a stem, thereby improving production efficiency. It is about providing.

[Summary of the invention]

In order to achieve the above object, the present invention supplies the stem to the mounting table using a stem conveyance mechanism, and
The semiconductor chip is supplied to the mounted stem by a mount arm, and the semiconductor chip is automatically positioned with respect to the stem.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described based on the drawings.

Reference numeral 1 in FIGS. 1 and 2 is a heating device, which is connected to a power source (not shown) and controlled to heat to 300 to 500°C. A mounting table 2 is provided on the upper part of the heating device 1, and a stem 3 of a semiconductor laser is positioned and placed on this mounting table 2 by a stem conveying mechanism 4, which will be described later. That is, 5 is a main shaft of the stem conveyance mechanism 4, and this main shaft 5 is configured to be vertically and rotatably movable by a drive mechanism 6. One end of a transport arm 7 is fixed to the main shaft 5, and a chuck mechanism 9 is provided at the other end with a plate 8 interposed therebetween. This chuck mechanism 9 is composed of a pair of chuck pieces 10.10 pivotally supported on the plate 8, and these chuck pieces 10.10 are opened and closed by a solenoid 11 attached to the plate 8.

Further, triangular pawls 12.12 facing each other are provided at the tip of the chuck piece 10.10, and engage with a V-groove 3as3a provided on the outer periphery of the stem 3 so that the stem 3
I am now able to grasp it. On the other hand, 13 is a mount arm that is rotated by a cam mechanism 14, and a capillary 15 is provided at the tip of this mount arm 13.

This capillary 15 is connected to a vacuum pump or the like so that a semiconductor chimp 16 is vacuum-adsorbed on its tip surface and supplied to the stem 3. Further, the mounting table 2 is surrounded by a case 17, and a part of this case 17 is equipped with a gas supply pipe 18 to create an inert gas atmosphere inside.
is connected.

The upper surface of the case 17 is provided with an opening 19 into which the chuck mechanism 9 and the capillary 15 of the mount arm 13 can be inserted. This opening 19 has a shutter 21 which is rotated to open and close by a rotary solenoid 20.
is provided.

Next, the operation of the mounting device configured as described above will be explained. The inside of the case 17 is maintained in an inert gas atmosphere by an inert gas supplied through a gas supply pipe 18. First, when the stem 3 is gripped by the chuck mechanism 9 of the stem transport mechanism 4, the transport arm 7 rotates to face the opening 19 of the case 17. next,
The rotary lens 20 is activated, the shutter 21 is rotated, and the opening 19 is opened. When the opening 19 opens,
The main shaft 5 is lowered and the chuck mechanism 9 is moved together with the transport arm 7.
The whole thing goes down. When the stem 3 gripped by the chuck mechanism 9 enters the case 17 through the opening 19 and faces the mounting table 2, the chuck mechanism 9 is opened by the solenoid 11, and the stem 3 is positioned and placed on the mounting table 2. At the same time, the chuck mechanism 9 rises and escapes from the case 17. On the other hand, the capillary 15 of the mount arm 13
The semiconductor chip 16 attracted to the capillary 15 is supplied onto the stem 3 of the mounting table 2, but since the semiconductor chip 16 attracted to the capillary 15 has been positioned in advance, it can be positioned and mounted at a predetermined position on the stem 3 with high precision. be placed. When the semiconductor chip 16 is supplied to the stem 3, the rotary solenoid 20 operates the shutter 21 and the opening 19 is closed. Next, the heating device 1 is energized,
Since the heating device 1 is heated to 300 to 500°C, the stem 3 is heated to about 2000°C via the mounting table 2.

Therefore, the indium on the surface of the stem 3 is melted, and the gold on the surface of the semiconductor chip 16 is melted, and the semiconductor chip 16 is fused onto the stem 3 in an inert gas atmosphere.

In other words, die bonding of the semiconductor chip 16 to the stem 3 is completed.

C. Effects of the Invention] As described above, according to the present invention, the stem is placed on the mounting table using the stem conveyor frame 5, and the semiconductor chip is supplied onto the stem by the mount arm, so that the stem can be placed on the mounting table. Bonding of semiconductor chips can be performed automatically to improve production efficiency, and since the mounting table is surrounded by a case and bonding is performed in an inert gas atmosphere, quality and reliability can be improved. It has the effect of being able to.

[Brief explanation of the drawing]

The drawings show one embodiment of the present invention, with FIG. 1 being a perspective view and FIG. 2 being a longitudinal sectional front view. 2... Mounting table, 3... Stem, 4... Stem transport mechanism, 13... Mount arm, 15... Capillary, 16... Semiconductor chip, 17... Case, 19...
...Opening, 21...Shutter.

Claims (1)

[Claims] a mounting table for mounting a stem; a stem transport mechanism for gripping the stem, supplying it to the mounting table and placing it; a mount arm having a capillary for adsorbing a semiconductor chip and supplying it onto the stem; A mount comprising: a case that surrounds a mounting base to form an inert gas atmosphere inside; and an opening provided in the case and opened by a shutter when transporting the stem and mounting a semiconductor chip on the stem. Device.