JP2003230977A - Device for positioning and holding object to be processed and beam processing apparatus having the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for positioning and holding and object to be processed in which when the object to be processed is held on a processing table, the positional deviation of the object or damage to the object due to a deflection, breakage or the like by the influence of an inertial force of each member due to movement in a direction X or Y can be prevented. <P>SOLUTION: The device for positioning and holding the object to be processed comprises an X-Y table 4 as a moving drive means, fixing guides 61, 62 fixed to a processing table 20, movable guides 63, 64 for positioning and holding the work W as the object together with the fixing guides on the table 20, an air cylinder as an energizing means for imparting an energizing force in a fixing guide direction to the movable guides, and air cylinders 81, 85 with brakes each having a brake unit as a position fixing means for fixing forward or backward moving positions of the guides 63, 64 on the table 20 as the air cylinder after the work W is positioned. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing table on which an object to be processed is placed, a moving driving means for moving and driving the processing table in XY directions, a fixed guide fixed to the processing table, and the processing. A movable guide that is movable back and forth on the table and positions and holds the workpiece together with the fixed guide on the processing table; and a biasing means that is fixed to the processing table and applies a biasing force in the fixed guide direction to the movable guide. The present invention relates to a processing object positioning and holding device including: and a beam processing device including the device.

[0002]

2. Description of the Related Art Conventionally, there has been known a beam processing apparatus for irradiating an object to be processed (hereinafter referred to as "workpiece") such as an electronic circuit board or a metal plate with an energy beam to perform processing by thermal melting. In this beam processing apparatus, there is known a method of positioning and holding a work on an XY table and moving the work within an XY plane with respect to an energy beam irradiated at a predetermined position to perform processing.

An example of a conventional work positioning and holding device for an XY table will be described below.

As shown in FIGS. 8 (a) and 8 (b), a processing table 20 is fixedly mounted on an XY table body 41,
A pair of fixed guides 21 and 22 and a pair of movable guides 23 and 24 are arranged on the processing table 20. The pair of fixed guides 21 and 22 are fixed to the processing table 20 with screws. On the other hand, the pair of movable guides 23 and 24 are fixed to the L fittings 25 and 26, respectively. Here, since the pair of movable guides 23 and 24 have the same support structure, the support structure of the movable guide 23 arranged on the left side in FIG. 8A will be described. As shown in FIG. 8B, the L fitting 25 is supported by the linear guide 27 and the air cylinder 28. The air cylinder 28 is, for example, about 1 in the axial direction of the rod by compressed air from a solenoid valve not shown.
It is controlled so that it can move back and forth by 0 mm, and the L metal fitting 25 and the movable guide 23 are integrated to form about 10 mm in the axial direction of the rod.
It is designed to move forward and backward. The linear guide 27
This is to prevent the L metal fitting 25 from rotating around the axis of the rod and to smoothly move it in parallel. The linear guide 27 and the air cylinder 28 are supported by a holding plate 29 fixed to the end surface of the processing table 20.

The operation of the work positioning and holding device constructed as described above will be described below.

First, a work W such as an electronic circuit board is used to move a work W, such as an electronic circuit board, by a pair of movable guides 23, 24 and a pair of fixed guides 21, which are not shown in the figure.
Insert between 22 and. Then, the lower surface of the work W is supported by the substrate support member 60. Then, a sensor (not shown) detects whether or not the work W is inserted, and if the insertion is confirmed, the pair of movable guides 23 and 24 are indicated by an arrow g.
And a pair of fixed guides 21 and 2 that move in the directions indicated by h.
The end surface of the work W in four directions is sandwiched between the two and the work W is positioned and held. And XY table body 4
1 starts moving to a position scheduled for beam processing. The examples of FIGS. 8A and 8B show a state in which the work W is held after being positioned at a predetermined position.

[0007]

As the work W to be positioned and held by the above-described work positioning and holding device, for example, a glass substrate having an ITO thin film formed on its surface (hereinafter, simply referred to as "glass substrate") is used. is there. The thickness of this glass substrate is currently 0.7 to 1.1 mm, but in order to reduce the weight and increase the functionality, it is, for example, 0.2.
The demand for thinner products having a thickness of about mm is increasing. The 0.2 mm-thick glass substrate is more likely to be bent or deformed and more easily broken than the 0.7-1.1 mm-thick glass substrate.

In the above-described conventional work positioning and holding device, the air cylinder 2 is operated by the compressed air to move the movable guide 23 back and forth for positioning in the X direction as described above.
8, the holding force of the movable guide 23 pressing and holding the glass substrate changes in proportion to the air pressure of the compressed air. Therefore, when positioning and holding a glass substrate having a thickness of 0.2 mm, the movable guide 23 moves forward and backward within a range in which the glass substrate can be positioned and held.
It is necessary to set the air pressure of the compressed air for operating the air cylinder 28 as low as possible. The same applies to the movable guide 24 that performs positioning in the Y direction.

However, if the air pressure of the compressed air is set low, the compressed air in the air cylinder will expand or contract due to the influence of the inertial force of each member due to the driving of the XY table. Then, the pair of movable guides 23, 24
However, there is a problem that the holding force of the glass substrate becomes small and the glass substrate is displaced, and conversely, the holding force of the movable guide becomes large and the glass substrate is damaged such as bending and bending. In particular, when the acceleration of the XY table is increased to improve the processing speed (for example, 1G to 3G), the influence of the inertial force becomes larger and this problem is likely to occur.

The above-mentioned problem is not limited to the glass substrate, but may similarly occur when positioning and holding a work made of, for example, a plastic material or a metal material.

The present invention has been made in view of the above problems, and an object of the present invention is to exert an influence of inertial force of each member due to movement in XY directions when an object to be processed is held on a processing table. Then, it is an object of the present invention to provide a processing object positioning and holding device capable of preventing the positional deviation of the processing object and the occurrence of damage such as bending and bending.

[0012]

In order to achieve the above-mentioned object, the invention of claim 1 has a processing table on which an object to be processed is placed, and a movement driving means for moving the processing table in XY directions. A fixed guide fixed to the processing table, a movable guide that can move back and forth on the processing table to position and hold an object to be processed on the processing table together with the fixed guide, and a fixed guide fixed to the processing table to the movable guide. A workpiece positioning and holding device including a biasing unit that applies a biasing force in the direction of the fixed guide. It is characterized in that a position fixing means for fixing the position is provided. In the processing object positioning and holding apparatus according to the present invention, after the processing object is positioned on the processing table, the position fixing means fixes the advancing / retreating movement position of the movable guide on the processing table. When the machining table moves, for example, even if an inertial force in the direction of the urging force is generated by the urging means, the position of the movable guide on the machining table does not change due to this inertial force.
As a result, regardless of the magnitude of the biasing force of the biasing means, the holding force of the workpiece by the movable guide does not change due to the influence of the inertial force during acceleration / deceleration. As a result, when the processing table is moved by the movement driving means, the holding force of the movable guide becomes small and the position of the object to be processed is displaced, or conversely, the holding force of the movable guide becomes large. As a result, it is possible to prevent a problem that the object to be processed is damaged, such as bent or bent.

According to a second aspect of the present invention, in the workpiece positioning and holding apparatus according to the first aspect, the urging means is constituted by an air cylinder, and the movable body is movable in association with the forward and backward movement of the rod of the air cylinder. The guide is configured to move forward and backward on the working table, and a lock mechanism that locks the forward and backward moving position of the rod by sandwiching the peripheral surface of the rod is provided as the position fixing means. Is. In the workpiece positioning and holding apparatus according to the present invention, since the movable guide moves forward and backward with respect to the working table in conjunction with the forward and backward movement of the rod of the air cylinder, the forward and backward movement position of the rod is locked by the lock mechanism. The forward / backward position of the movable guide on the processing table can be fixed.

According to a third aspect of the present invention, in the workpiece positioning and holding apparatus according to the first or second aspect, the fixed guide and the movable guide are provided with a rolling contact member which makes a rolling contact with the workpiece. It is a feature. In the workpiece positioning and holding device according to the present invention, when the movable guide moves, the rolling contact member provided on the movable guide contacts the workpiece to move the workpiece, and the rolling guide is provided on the fixed guide. The object to be processed is sandwiched between the rolling contact member and the rolling contact member, and positioned and held. As described above, since the rolling contact members provided on the movable guide and the fixed guide make rolling contact with the object to be processed, friction at the contact portion is small, and the movable guide and the fixed guide make sliding contact with the object to be processed. In comparison, the movement of the object to be processed can be carried out smoothly. As a result, it is possible to prevent the positioning failure of the object to be processed.

According to a fourth aspect of the present invention, in the workpiece positioning and holding apparatus according to the third aspect, the movable guide is provided with a plurality of the rolling contact members, and the movable guide is XY.
It is characterized in that it is configured to swing at a predetermined angle in a plane. In the workpiece positioning and holding apparatus according to the present invention, since the movable guide is provided with the plurality of rolling contact members, it is possible to more stably position and hold the workpiece as compared with the case where there is one rolling contact member. Become.
Further, since the movable guide oscillates, even if the processing accuracy of the object to be machined is poor, a plurality of rolling contact members provided on the movable guide come into contact with the object to be machined, and some of the rolling contact members come into partial contact. Instead, the plurality of rolling contact members each hold the object to be processed with a substantially uniform force.

According to a fifth aspect of the present invention, a beam source that repeatedly emits a pulsed energy beam, a beam irradiation means that guides and irradiates an energy beam emitted from the beam source to an object to be processed, and the object to be processed. An XY table that relatively moves an object and an irradiation point of the energy beam with respect to the object to be processed, a positioning holding unit that positions and holds the object to be processed on the XY table, the beam source and the beam source based on processing control data. A beam processing apparatus comprising a control means for controlling an XY table, wherein the processing object positioning and holding device according to claim 1, 2, 3 or 4 is used as the positioning and holding device. is there. In the beam processing apparatus according to the present invention, the processing object positioning device accurately positions and holds the processing object at a predetermined position on the XY table. Therefore, the processing object is misaligned or the XY table is driven. Preventing the displacement of the object, it is possible to perform beam processing with high accuracy.

According to a sixth aspect of the present invention, in the beam processing apparatus according to the fifth aspect, the beam source is a YAG laser. In the beam processing apparatus of the sixth aspect, since the beam source is the YAG laser, the manufacturing cost of the apparatus can be reduced as compared with, for example, an excimer laser.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment in which the present invention is applied to a positioning device for a processing object in a laser processing apparatus using a YAG (yttrium aluminum garnet) laser which is a solid-state laser will be described below. Figure 1
FIG. 1 is a schematic configuration diagram of an entire laser processing apparatus according to this embodiment. The same parts as those of the conventional example are designated by the same reference numerals and the description thereof will be omitted.

The laser processing apparatus is a YAG laser apparatus 1,
Work positioning / holding device 2, work transfer device 3, XY table 4 as movement driving means, main controller 5
It is mainly composed of.

FIG. 2 is a diagram for explaining a schematic configuration of the YAG laser device 1. The YAG laser device 1 has a Y
It is composed of an AG laser oscillator 10 and a processing head 11. The YAG laser oscillator 10 includes a laser rod 12 which is a rod-shaped crystal body of YAG doped with an appropriate amount of Nd (neodymium) and a laser chamber 12 having a lamp for exciting the same, and an optical path of stimulated emission light emitted from the laser chamber 12. And a front mirror 13 and a rear mirror 14 that are opposed to each other at a predetermined distance.

The laser chamber 12 emits stimulated emission light, as indicated by the alternate long and short dash line in the figure. In addition, a shutter 15 is provided between the rear mirror 14 and the laser chamber 12.
And the Q switch 16 are attached. The front mirror 13 is a mirror having a reflectance capable of transmitting a part of light, and is attached to the optical path of the stimulated emission light emitted from the laser chamber 12, with the center of the mirror surface thereof being directly aligned. The rear mirror 14 has a mirror surface capable of substantially total reflection, and is attached so as to face the front mirror 13. The stimulated emission light emitted from the laser chamber 12 is generated by the front mirror 13 and the rear mirror 1.
Amplified during multiple reflections to and from 4. The shutter 15 blocks the optical path of the stimulated emission light emitted from the laser chamber 12 and suppresses the amplification of the stimulated emission light. The Q switch 16 has a number of merits (Q) as a resonator between the front mirror 13 and the rear mirror 14.
Value) to generate a population inversion of excited atoms and to extract a high-power laser pulse. In addition,
Depending on the required output, the Q switch 16 may not be used.

The configuration of the YAG laser oscillator 10 is an example, and the present invention is not limited to this. As another configuration, for example, there is one using LD excitation.

The processing head 11 has an aperture 17,
An epi-illumination mirror 18 and an imaging lens 19 are provided. The aperture 17 is a light shielding plate having a shutter mechanism capable of changing the area of the opening, and the center of the opening is attached so as to match the optical path of the laser light emitted from the YAG laser oscillator 10. The epi-illumination mirror 18 bends the optical path of laser light by 90 degrees. The imaging lens 19 focuses the laser light on the work W to form an image.

In the YAG laser device 1 configured as described above, the stimulated emission light emitted from the laser chamber 12 is affected by the Q switch 16 while reciprocating between the front mirror 13 and the rear mirror 14. It is sent out as laser light to the aperture 17 through the front mirror 13. After passing through the aperture 17, the laser light has its optical path bent at 90 degrees by an epi-illumination mirror 18 and enters an imaging lens 19. The laser light that has entered the imaging lens 19 is condensed and irradiated vertically downward on the work W.

The work positioning / holding device 2 serves to position the work W as the object to be worked on the working table 20 and to hold the work W so as not to be displaced during the working. FIG. 3 is a plan view of the work positioning and holding device 2 seen from the upper side in FIG. A pair of fixed guides 61 and 62 and a pair of movable guides 6 are provided on the processing table 20 fixed to the XY table body 41 (not shown).
3, 64 are provided. These fixed guides 61,
62 and the movable guides 63 and 64 have a U-shape, and cam followers 65 to 72 whose cylindrical surfaces are rotatable are provided at the U-shaped tip end portions thereof, respectively. Since the cylindrical surfaces of the cam followers 65 to 72 make rolling contact with the end surface of the work, the work can be smoothly positioned at the time of positioning as compared with the case where the guide makes sliding contact with the work. The pair of fixed guides 61 and 62 are fixed to the processing table 20 via a holder (not shown).

Since the pair of movable guides 63, 64 have the same support structure, the support structure of the movable guide 63 arranged on the left side in FIG. 3 will be described. 4 (a)-
(C) is an enlarged explanatory view of the movable guide 63. Figure 4
As shown in (c), the movable guide 63 is screwed to the rotatable flange 73. A rotary shaft 74 is fixedly mounted on the flange 73, and the rotary shaft 74 is rotatably supported by a pair of ball bearings 76 and 77 arranged in a housing 75.
It can be rotated together with 3. Also, the housing 75
Is fixed to the L metal fitting 78, and this L metal fitting 78 is
As shown in FIG. 4A, a pair of linear guides 79, 8
0 and an air cylinder 81 with a brake. The pair of linear guides 79, 80 prevent the L fitting 78 from rotating around the axis of the rod 81a and move it in parallel. Then, the pair of linear guides 79, 80 and the air cylinder 8 with a brake
1 is supported by a holding plate 82 fixed to the end surface of the processing table 20.

As the air cylinder 81 with a brake, for example, a cell top cylinder ULKP series under the trade name of CKD Corporation can be used. The air cylinder 81 with a brake has a brake portion 81b as a lock mechanism for the rod 81a. The brake portion 81b is provided with a swash plate that sandwiches the rod 81a and applies a brake. Normally, the swash plate sandwiches the rod 81a by the biasing force of the spring and is in a locked state. The brake is released by supplying compressed air to the brake portion 81b and separating the swash plate from the rod 81a against the biasing force of the spring. The air cylinder 81 with a brake is controlled by compressed air from a solenoid valve (not shown) so that it can move back and forth by about 10 mm in the axial direction of the rod 81a. Therefore, the L metal fitting 78, the housing 75, the flange 73, the movable guide 63, and the like are integrally moved to move back and forth by about 10 mm in the axial direction of the rod 81a.

The L metal fitting 78 is provided with a pair of rotation angle regulation pins 83, 84 for regulating the rotation angle of the movable guide 63. These rotation angle regulation pins 83, 84 are provided.
The front end portions of are inserted into a pair of through holes 63a and 63b formed in the movable guide 63, respectively. The outer diameters of the pair of rotation angle regulating pins 83 and 84 are, for example, φ4 mm, whereas the inner diameters of the pair of through holes 63a and 63b are φ4.2 mm.
The movable guide 63 oscillates about ± 1 ° about the rotation shaft 74 by this play amount.

The work transfer device 3 mounts and removes a work on and from the processing table. As shown in FIG. 1, a plurality of suction pads 31 convey the work while suctioning the work top surface under vacuum.

The XY table 4 is mainly composed of an XY table body 41 and an XY table controller 42 for controlling the XY table body 41. The work positioning and holding device 2 is arranged in the XY table body 41 as described above.

The main controller 5 controls the entire laser processing apparatus, and includes the YAG laser apparatus 1,
The work transfer device 3 and the XY table controller 42 are connected.

The operation of positioning and holding the work W on the processing table 20 fixed to the XY table body 41 in the laser processing apparatus configured as described above will be described. As the work W, for example, as shown in FIG. 6, a 0.2 mm-thick glass substrate 100 or the like in which an ITO thin film 102 is formed on the surface of a glass plate 101 is targeted.

First, in FIG. 5 (a), the work W is placed between the pair of fixed guides 61 and 62 and the pair of movable guides 63 and 64 on the machining table 20 of the XY table body 41 by the work transfer device 3. Perform the placing operation. At this time, the movable guide 63 is opened in the direction indicated by the arrow c by the force of the air cylinder 81 with the brake, and the movable guide 64 is opened in the direction indicated by the arrow d by the force of the air cylinder 85 with the brake. Next, when compressed air is supplied to the brake portion 81b of the air cylinder 81 with a brake to release the brake and a force in the direction indicated by the arrow e is applied to the rod 81a, the L metal fitting 78 and the housing 7 (not shown) are provided.
A force in the direction indicated by arrow e is applied to the movable guide 63 via the flange 5 and the flange 5. At the same time, when compressed air is supplied to the brake portion 85b of the air cylinder 85 with brake to release the brake and a force in the direction indicated by the arrow f is applied to the rod 85a, a force in the direction indicated by the arrow f is applied to the movable guide 64. give. Then, the cylindrical surfaces of the pair of cam followers 65, 66 of the movable guide 63 and the cylindrical surfaces of the pair of cam followers 67, 68 of the movable guide 64 contact the end surface of the work W, and the work W in the directions indicated by arrows e and f. To move. At this time, since the cylinders of the cam followers 65 to 68 are rotatable, the workpiece W can be positioned more smoothly than when the cylindrical surface and the workpiece W end surface make rolling contact and sliding contact. . Then, as shown in FIG. 5B, as the work W moves, it comes into contact with the cam followers 69 to 72 of the pair of fixed guides 61 and 62.
As a result, the four end surfaces of the work W are sandwiched and positioned and held between the cam followers 69 to 72 of the pair of fixed guides 61 and 62 and the cam followers 65 to 68 of the pair of movable guides 63 and 64. Since the glass substrate 100 as the work W has a thickness of 0.2 mm and is thinner than the conventional product, the pair of air cylinders 81 and 85 with brakes are operated with the smallest possible air pressure within a positionable range. I am trying.

If the machining accuracy of the work W is poor and, for example, the angles of the four corners are not accurately formed at 90 °, only one cam follower will hit one side of the work W and the stress will be applied to that part. There is a possibility that the work W will be concentrated and the work W will be bent or deformed. Since the pair of movable guides 63 and 64 according to the present embodiment are configured to swing ± 1 ° as described above, each of the cam followers 65 to 68 satisfactorily follows the end surface of the work W, and the stress It is possible to prevent the glass substrate from being bent or deformed due to the concentration of light.

Then, after it is confirmed by a detection sensor (not shown) that the work W is placed, positioned and held, a pair of air cylinders 81 and 8 with brakes are provided.
The supply of compressed air to the brake parts 81b and 85b of No. 5 is stopped to lock the rods 81a and 85a. And
The XY table body 41 starts to move to a predetermined position for grooving or boring the work W.

Since the pair of brake-equipped air cylinders 81 and 85 are fixed to the working table 20, the rods 81a and 85a are connected to the brake portions 81b and 8 respectively.
When the brake is applied and locked by 5b, the rods 81a and 85a are fixed to the working table 20. Further, since the pair of movable guides 63, 64 move forward and backward integrally with the rods 81a, 85a, respectively, the pair of movable guides 63, 64 are also fixed to the working table 20. Thus, when the XY table body 41 moves, the advancing / retreating movement positions of the pair of movable guides 63, 64 on the processing table 20 are fixed, and the pair of movable guides 63, 64 is affected by the inertial force during acceleration / deceleration. Therefore, the holding force of the work W does not change. As a result,
When the processing table 20 is moved by driving the XY table body 41, the holding force of the pair of movable guides 63, 64 becomes small and the work W is displaced, or conversely, the pair of movable guides 63, 64. It is possible to prevent a problem that the work W has a large holding force to cause damage such as bending and bending of the work W.

As described above, according to the present embodiment, by using the pair of air cylinders 81 and 85 with the brake, the XY table body 41 is driven and the working table 20 is driven.
When the is moved, the work W is displaced,
It is possible to prevent the problem that the work W is damaged, such as bent or bent.

In the above embodiment, the processing table 2
Although a pair of air cylinders 81 and 85 with a brake are used to fix the pair of movable guides 63 and 64 to 0, the movable guide itself is sandwiched by disc brakes or the like to fix the forward / backward movement position. May be.

Further, in the above-mentioned embodiment, the vacuum system for carrying the work while carrying out vacuum suction with a plurality of suction pads has been described. However, in this vacuum system, static electricity is generated on the work and dust or dirt adheres to the work. There was a risk of Therefore, instead of the vacuum method, as shown in FIG.
As shown in (a) and (b), it is possible to use a mechanical system in which the end portion of the work is chucked and conveyed. More specifically, from the state shown in FIG. 7A, first, the pair of rods 32a and 32b of the air cylinder 32 move inward to each other, then the pair of air chucks 33 and 34 are closed, and the state shown in FIG.
As shown in (b), the work W is chucked and conveyed to the processing table 20 (not shown). Processing table 20
When the workpiece W is placed on the air cylinder 32, the air cylinder 32 descends to a predetermined height, and first, the pair of air chucks 33, 3 is placed.
4 opens, and then the pair of rods 32 of the air cylinder 32
a and b move to the outside of each other. In this way, the mechanical method of chucking and transporting the end of the work is suitable for transporting the glass substrate 100, etc., since static electricity is not generated and dust or dirt is unlikely to adhere to the work W.

Further, in the above embodiment, the apparatus for processing the work by using the YAG laser has been described, but the present invention is not limited to this, and a CO ₂ laser or an excimer laser may be used. Further, when the work is not processed at a plurality of locations or when laser processing is performed by scanning laser light, the work is positioned and held on a fixed processing table without providing the XY table. Good. Further, although the example in which the glass substrate having the ITO thin film formed on the surface is processed as the work has been described, the present invention is not limited to this, and it is also possible to process a plate-shaped work made of a ceramic material or a metal material.

[0041]

According to the inventions of claims 1 to 6, since the forward / backward movement position of the movable guide on the working table is fixed by the position fixing means, regardless of the magnitude of the biasing force by the biasing means. An excellent effect that the holding force of the object to be processed by the movable guide does not change due to the influence of the inertial force during acceleration / deceleration, and the positional deviation of the object to be processed and damage such as bending and bending can be prevented. There is.

In particular, according to the invention of claim 3, since the rolling contact member is positioned in rolling contact with the object to be machined, the object to be machined is positioned as compared with the case where the guide is in sliding contact with the object to be machined. With this, it is possible to smoothly move the workpiece, and it is possible to prevent an improper positioning of the workpiece.

In particular, according to the invention of claim 4, since a plurality of rolling contact members are provided on the movable guide, it is possible to more stably position and hold the object to be machined, as compared with the case where there is only one rolling contact member. There is an excellent effect that
Further, since the movable guide oscillates, even if the processing accuracy of the object to be machined is poor, some of the rolling contact members provided on the movable guide do not hit one side, and the plurality of rolling contact members are substantially uniform. Since the object to be processed is held by various forces, there is also an excellent effect that it is possible to prevent the object to be processed from being bent or deformed.

In particular, according to the fifth and sixth aspects of the invention, it is possible to prevent the positioning error of the object to be processed and the positional displacement of the object to be caused by the driving of the XY table, thereby enabling highly accurate beam processing. It has an excellent effect.

In particular, according to the invention of claim 6, since the beam source is a YAG laser, there is an excellent effect that the manufacturing cost of the device can be reduced as compared with, for example, an excimer laser.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a laser processing apparatus according to an embodiment.

FIG. 2 is a schematic configuration diagram of a YAG laser device.

FIG. 3 is a plan view of the work positioning and holding device 2 seen from the upper side in FIG.

4A to 4C are enlarged explanatory views of a movable guide 63. FIG.

5A and 5B are operation explanatory views for positioning and holding a work on a processing table.

FIG. 6 is a perspective view of a glass substrate.

7 (a) and 7 (b) are explanatory views of the handling operation of the substrate transfer device.

8A and 8B are configuration explanatory views of a work positioning and holding device according to a conventional technique.

[Explanation of symbols]

1 YAG laser device 2 Work positioning and holding device 3 Work transfer device 4 XY table 5 Main controller 10 YAG laser oscillator 20 processing table 61,62 Fixed guide 63, 64 movable guide 63a, 63b through holes 65-72 Cam Follower 73 Flange 74 rotation axis 75 housing 76,77 bearing 78 L metal fittings 79,80 Linear guide 81,85 Air cylinder with brake 81a, 85a rod 81b, 85b Brake part 82 holding plate 83, 84 Rotation angle control pin 100 Glass substrate with ITO thin film W work

Claims (6)

[Claims] 1. A processing table on which an object to be processed is placed, a movement driving means for moving and driving the processing table in XY directions, a fixed guide fixed to the processing table, and a reciprocating movement on the processing table. Processing target including a movable guide that positions and holds the processing target on the processing table together with the fixed guide, and a biasing unit that is fixed to the processing table and applies a biasing force in the fixed guide direction to the movable guide. In the object positioning and holding apparatus, after the positioning of the object to be processed by the urging means, position fixing means for fixing the advancing / retreating movement position of the movable guide on the processing table is provided. Holding device. 2. The apparatus for positioning and holding a workpiece according to claim 1, wherein the urging means comprises an air cylinder, and the movable guide is linked with the advancing / retreating movement of a rod of the air cylinder. An apparatus for positioning and holding an object to be machined, which is configured to move forward and backward, and as the position fixing means, a lock mechanism that locks the forward and backward moving position of the rod by sandwiching the peripheral surface of the rod is provided. . 3. The workpiece positioning and holding device according to claim 1, wherein the fixed guide and the movable guide are
A processing object positioning and holding device comprising a rolling contact member which makes rolling contact with the processing object. 4. The workpiece positioning and holding apparatus according to claim 3, wherein the movable guide is provided with a plurality of the rolling contact members, and the movable guide is swung by a predetermined angle in an XY plane. Positioning and holding device for processed objects. 5. A beam source that repeatedly emits a pulsed energy beam, a beam irradiation means that guides and irradiates the energy beam emitted from the beam source to the object to be processed, the object to be processed, and the object to be processed. An XY table that relatively moves the irradiation point of the energy beam with respect to the object, a positioning holding unit that positions and holds the object to be processed on the XY table, and the beam source and the XY table based on processing control data. A beam processing apparatus comprising a control means, wherein the processing object positioning and holding apparatus according to claim 1, 2, 3 or 4 is used as the positioning and holding means. 6. The beam processing apparatus according to claim 5, wherein the beam source is a YAG laser.