CN214684799U - Laser processing carrier and laser processing device - Google Patents

Abstract

The utility model relates to the technical field of laser processing, and discloses a laser processing carrier and a laser processing device, which comprise a clamp assembly used for clamping a workpiece; the clamp assembly comprises a bearing seat, a clamping head and a clamping head, wherein the bearing seat is provided with a bearing surface, and the bearing surface is an inclined surface forming a first inclination angle with a horizontal plane, so that a to-be-cut surface of a workpiece can face to cutting laser when the clamp assembly is placed on the bearing surface; and the positioning assembly is used for positioning and limiting the clamp assembly on the bearing surface. Compare current laser beam machining carrier, the utility model discloses a laser beam machining carrier's year seat provides the loading end for the anchor clamps subassembly, bears the inclined plane of personally submitting first angle of inclination, and the anchor clamps subassembly is put in when the loading end is last, the face of waiting to cut of machined part because of the slope of loading end, and then takes place the slope deflection that the angle is first angle of inclination to finally can be towards cutting laser, and then cutting laser can pierce through according to predetermined cutting route and wait the cutting plane.

Description

Laser processing carrier and laser processing device

Technical Field

The utility model relates to a laser beam machining technical field especially relates to a laser beam machining carrier and laser beam machining device.

Background

Laser cutting is the process of melting and evaporating a workpiece by energy released when a laser beam is irradiated on the surface of the workpiece, so as to achieve the purposes of cutting and carving.

When the existing laser cutter cuts a workpiece, the workpiece can be horizontally fixed and placed on the carrying platform, the laser cutter is located right above the workpiece, laser of which the laser light path extends along the vertical direction can be emitted to the surface to be cut of the workpiece, and then the workpiece is processed to obtain a desired cut. The problems are that: 1. for a general workpiece (mainly, a sheet-shaped workpiece with a relatively thin thickness, such as leather, etc.), when the workpiece is horizontally placed on the platform, it can be ensured that the surface to be cut of the workpiece is basically kept horizontal and faces the cutting laser, so that the cutting laser can directly cut through the surface to be cut of the workpiece according to a preset path to obtain a desired cut. However, as shown in fig. 1 to 3, some workpieces 100 have a more specific shape, and the workpieces 100 are sheet-like as a whole, but have a groove-like structure formed at the middle portion thereof. When the workpiece 100 is placed horizontally on the stage (the workpiece 100 is in an inclined state in fig. 1), the surface 101 to be cut (the dotted area in fig. 1) on the workpiece 100 actually includes a first portion 1011 that is approximately perpendicular to the horizontal plane and a second portion 1012 that is parallel to the horizontal plane. A first cut B is cut at the first portion 1011 (i.e., a first cut B is cut through the first portion 1011 in a direction approximately perpendicular to the side wall of the channel structure), and a second cut C is cut at the second portion 1012; however, the method is limited in that the existing stage carries the workpiece 100 only in a single manner, and the workpiece 100 can only be placed horizontally, and further the first portion 1011 to be cut into the first cut surface B is required to be in a large-angle inclined state relative to the horizontal plane, so that the laser emitted from top to bottom cannot be irradiated onto the side wall of the first portion 1011 to cut the first cut surface B, that is, the cutting laser of the existing laser cutter is difficult to perform laser cutting processing on the workpiece 100, and thus the arc-shaped first cut surface B and the straight second cut surface C as shown in fig. 3 cannot be obtained at the same time, that is, the desired cut 102 cannot be obtained; 2. the traditional laser cutting adopts the invisible positioning cutting, and the cutting precision is low; 3. although a few laser cutters are additionally provided with the visual imaging positioning device, the visual imaging positioning device is generally required to be moved above a workpiece to produce an imaging picture, and after positioning calculation is completed, the laser cutters are moved to positions to be cut above the workpiece to cut, so that the working process is complicated and time-consuming; 4. the existing laser cutter is generally only capable of cutting one workpiece on a carrying platform, after the cutting is finished, the laser cutter needs to stop working, and after the loading, unloading and replacement of the workpiece are finished, the next workpiece can be cut, so that the working efficiency is low.

Therefore, it is desirable to provide a laser processing carrier and a laser processing apparatus to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a laser beam machining carrier, when it bears the machined part, can make the cutting surface orientation cutting laser of treating of machined part to make cutting laser can pierce through according to predetermined cutting route and treat the cutting surface.

To achieve the purpose, the utility model adopts the following technical proposal:

a laser processing carrier for bearing a workpiece to be subjected to a laser cutting process, comprising:

the clamp assembly is used for clamping a workpiece;

the clamp assembly comprises a bearing seat, a clamping head and a clamping head, wherein the bearing seat is provided with a bearing surface, and the bearing surface is an inclined surface forming a first inclination angle with a horizontal plane, so that a to-be-cut surface of a workpiece can face to cutting laser when the clamp assembly is placed on the bearing surface;

and the positioning assembly is used for positioning and limiting the clamp assembly on the bearing surface.

Optionally, the first angle of inclination is 55 ° to 65 °.

Optionally, the method further comprises:

and the clamping assembly is arranged on the carrying seat and is used for clamping and fixing the clamp assembly on the carrying surface.

Optionally, the positioning assembly includes a plurality of positioning posts and positioning holes corresponding to the positioning posts, one of the fixture assembly and the carrier is provided with the positioning posts, and the other is provided with the positioning holes.

Optionally, the carrier seat is further provided with an air exhaust cavity communicated with the bearing surface and an air outlet communicated with the air exhaust cavity.

Optionally, the clamp assembly comprises:

the first clamping plate is provided with a first avoidance through hole for avoiding the to-be-cut surface;

the second clamping plate is detachably connected with the first clamping plate, a second avoidance through hole communicated with the first avoidance through hole is formed in the second clamping plate, and clamping spaces used for clamping workpieces are formed between the second clamping plate and the first clamping plate at intervals.

Another object of the present invention is to provide a laser processing apparatus, the laser processing carrier thereof can make the cutting surface of the workpiece facing the cutting laser when bearing the workpiece, so that the cutting laser can penetrate the cutting surface according to the predetermined cutting path.

To achieve the purpose, the utility model adopts the following technical proposal:

a laser processing apparatus comprising:

the laser processing carrier is arranged on the frame;

and the laser cutting mechanism comprises a laser cutter, and the laser cutter is used for emitting cutting laser to a machined part carried on the laser machining carrier.

Optionally, the method further comprises:

the feeding assembly is arranged on the rack, the laser processing carriers are arranged on the output ends of the feeding assembly, the feeding assembly can drive the laser processing carriers to move in a reciprocating mode to a material changing working position and a cutting working position, one feeding assembly and one laser processing carrier form a group of feeding processing mechanisms, and at least two groups of feeding processing mechanisms are arranged on the rack side by side;

the laser cutting mechanism further comprises a displacement driving assembly, the laser cutter is arranged at the output end of the displacement driving assembly, and the laser cutter can move to the position above the cutting working position of any one feeding processing mechanism.

Optionally, the laser processing apparatus further includes:

the visual positioning assembly comprises a camera and a beam combiner, the beam combiner is arranged at the light outlet end of the laser cutter, the center shaft of the light outlet end penetrates through the center of the beam combiner, and the camera is arranged at one side of the beam combiner and can acquire reflected imaging light of a workpiece borne on the laser processing carrier through the beam combiner so as to be used for visually positioning a to-be-cut surface on the workpiece.

Optionally, the method further comprises:

and the light supplementing light source is arranged on the rack and used for supplementing light to the machined part borne on the laser machining carrier.

The utility model has the advantages that:

compare current laser beam machining carrier, the utility model discloses a laser beam machining carrier's year seat provides the loading end for the anchor clamps subassembly, bears the inclined plane of personally submitting first angle of inclination, the anchor clamps subassembly place in when on the loading end, the machined part wait the cutting surface because of the slope of loading end, and then take place the slope deflection that the angle is first angle of inclination to finally can be towards cutting laser, and then make cutting laser can pierce through according to predetermined cutting route and wait the cutting surface.

And be supporting have the utility model discloses a laser beam machining device of laser beam machining carrier, when the laser beam machining carrier bears the machined part, it can make waiting of machined part cutting surface towards cutting laser to make cutting laser can pierce through according to predetermined cutting route and wait the cutting plane, and then obtain the incision of wanting.

Drawings

FIG. 1 is a schematic illustration of a prior art work piece without laser cutting;

FIG. 2 is a schematic illustration of a prior art laser cut workpiece;

FIG. 3 is an enlarged view of a portion of FIG. 2 at A;

fig. 4 is a schematic structural view of the laser processing carrier installed on the feeding assembly according to the present invention;

fig. 5 is a schematic structural view of the clamp component hidden from the laser processing carrier according to the present invention;

fig. 6 is a schematic front view of the clamp assembly provided by the present invention clamping a workpiece;

fig. 7 is a schematic back view of the clamp assembly provided by the present invention clamping a workpiece;

fig. 8 is a schematic view of a laser processing apparatus provided by the present invention;

fig. 9 is a schematic view of a side-by-side feed machining mechanism in a laser machining apparatus provided by the present invention;

fig. 10 is a schematic view of a laser cutting principle of the laser processing apparatus provided by the present invention.

In the figure:

x, a first direction;

100. processing a workpiece; 101. cutting a surface to be cut; 1011. a first region; 1012. a second region; 102. cutting; B. a first cut section; C. a second cut section;

1. a clamp assembly; 11. a first splint; 111. positioning holes; 12. a second splint; 13. a locking block;

2. a carrier base; 21. a bearing surface; 22. an air draft cavity; 23. an air outlet;

3. a positioning assembly; 31. a positioning column;

4. a clamping assembly; 41. a clamping cylinder; 42. a clamping block;

5. a feeding assembly;

6. a laser cutting mechanism; 61. a laser cutter; 611. a galvanometer; 612. a flying light path reflection mirror assembly; 613. a lens; 614. a dynamic focus lens barrel; 62. a displacement drive assembly;

7. a visual positioning assembly; 71. a camera; 72. a beam combining mirror; 73. a lens;

8. a light source for light supplement;

9. and a frame.

Detailed Description

In order to make the technical problem solved by the present invention, the technical solution adopted by the present invention and the technical effect achieved by the present invention clearer, the technical solution of the present invention will be further explained by combining the drawings and by means of the specific implementation manner.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used in the orientation or positional relationship shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

Example one

As shown in fig. 1 to 3, some workpieces 100 have a more specific shape, and the workpieces 100 are sheet-like as a whole, but have a groove-like structure formed at a middle portion thereof. When the workpiece 100 is placed horizontally on the stage (the workpiece 100 is in an inclined state in fig. 1), the surface 101 to be cut (the dotted area in fig. 1) on the workpiece 100 actually includes a first portion 1011 that is approximately perpendicular to the horizontal plane and a second portion 1012 that is parallel to the horizontal plane. A first cut B is cut at the first portion 1011 (i.e., a first cut B is cut through the first portion 1011 in a direction approximately perpendicular to the side wall of the channel structure), and a second cut C is cut at the second portion 1012; however, the method of carrying the workpiece 100 by the existing stage is limited to be single, and only the workpiece 100 can be placed horizontally, and further the first portion 1011 for cutting the first cut surface B needs to be in a large-angle inclined state relative to the horizontal plane, so that the laser emitted from top to bottom cannot irradiate the side wall of the first portion 1011 to cut the first cut surface B, that is, the cutting laser of the existing laser cutter is difficult to perform laser cutting processing on the workpiece 100, and thus the first cut surface B and the second cut surface C as shown in fig. 3 cannot be obtained at the same time, that is, the desired cut 102 cannot be obtained.

In order to solve the above problem, as shown in fig. 4 to 7, the present embodiment provides a laser processing carrier for carrying a workpiece 100 to be subjected to a laser cutting process. The laser processing carrier comprises a clamp assembly 1, a carrier seat 2 and a positioning assembly 3. The clamp assembly 1 is used for clamping a workpiece 100; the bearing seat 2 is provided with a bearing surface 21, the bearing surface 21 is an inclined surface which forms a first inclination angle with the horizontal plane, so that when the clamp assembly 1 is placed on the bearing surface 21, the surface 101 to be cut of the workpiece 100 can face to the cutting laser; the positioning assembly 3 is used for positioning and limiting the clamp assembly 1 on the bearing surface 21. Specifically, in the present embodiment, the angle of the first inclination angle is 55 ° -65 °; more specifically, the angle of the first inclination angle is 60 °. It should be noted that the specific angle of the first inclined angle may be adjusted and designed according to the structural characteristics of the surface 101 to be cut of the workpiece 100, and only the cutting laser can penetrate the surface 101 to be cut according to the preset cutting path to obtain the desired cut 102.

But for the specific construction of the clamp assembly 1. As shown in fig. 6-7, in the present embodiment, the clamp assembly 1 includes a first clamping plate 11 and a second clamping plate 12. A first avoidance through hole for avoiding the to-be-cut surface 101 is formed in the first clamping plate 11; the second clamping plate 12 is detachably connected with the first clamping plate 11, a second avoiding through hole communicated with the first avoiding through hole is formed in the second clamping plate 12, and a clamping space for clamping the workpiece 100 is formed between the second clamping plate 12 and the first clamping plate 11 at intervals. Specifically, a plurality of locking blocks 13 are bolted to the first clamp plate 11. After the workpiece 100 with the main body profile in the shape of a thin sheet is placed on the first clamping plate 11, the second clamping plate 12 is pressed on the workpiece 100, and then the locking block 13 is pressed on the second clamping plate 12, so that the workpiece 100 is clamped between the first clamping plate 11 and the second clamping plate 12. Moreover, because the first clamping plate 11 and the second clamping plate 12 are respectively provided with the first avoiding through hole and the second avoiding through hole, the to-be-cut surface 101 can be exposed, and the clamp assembly 1 can ensure that the laser cutting processing of the to-be-cut surface 101 is not influenced when clamping the machined part 100.

Compared with the existing laser processing carrier, the carrier seat 2 of the laser processing carrier of the embodiment provides the bearing surface 21 for the clamp assembly 1, the bearing surface 21 is an inclined surface with a first inclination angle, when the clamp assembly 1 is placed on the bearing surface 21, the to-be-cut surface 101 of the workpiece 100 is inclined by the bearing surface 21, so that the inclination deflection with the first inclination angle occurs, and finally the to-be-cut surface 101 can face the cutting laser, so that the cutting laser can penetrate through the to-be-cut surface 101 according to a preset cutting path, and the notch 102 shown in fig. 2 is obtained.

In addition, as shown in fig. 4-5, in the present embodiment, the laser processing carrier further includes a clamping assembly 4. The clamping assembly 4 is disposed on the carrier 2, and the clamping assembly 4 is used for clamping and fixing the fixture assembly 1 on the bearing surface 21. Specifically, the clamping assembly 4 includes a clamping cylinder 41 and a clamping block 42. The clamping cylinder 41 is fixed on one side of the bearing surface 21 through bolts, and the clamping block 42 is fixed on the output end of the clamping cylinder 41 and can be opposite to the bearing surface 21 to move towards and away from the bearing surface. When the clamp assembly 1 in the shape of a flat plate is placed on the bearing surface 21 and positioned by the positioning assembly 3, the clamp assembly 1 can be further clamped by the clamping block 42, so that the clamp assembly 1 is stably fixed on the bearing surface 21 and is not prone to deviation, and the processing precision of subsequent laser cutting is improved. In this embodiment, there are two clamping assemblies 4, and it is contemplated that in some other embodiments there may be only one clamping assembly 4, or three or more clamping assemblies. The clamping assembly 4 may also be a clamping jaw or other known clamping device.

But for the specific structure of the positioning assembly 3. Specifically, as shown in fig. 4-7, the positioning assembly 3 includes a plurality of positioning posts 31 and positioning holes 111 corresponding to the positioning posts 31, the carrier 2 is provided with the positioning posts 31, and the fixture assembly 1 is provided with the positioning holes 111. The positioning post 31 is inserted into the positioning hole 111 to position the fixture assembly 1 on the carrier 2. It should be noted that the positioning post 31 may be provided on the jig assembly 1, and the positioning hole 111 may be provided on the carriage 2.

Further, as shown in fig. 5, in this embodiment, the carrier 2 is further provided with an air exhausting cavity 22 communicating with the carrying surface 21, and an air outlet 23 communicating with the air exhausting cavity 22, so as to communicate with an air exhausting device (not shown in the figure). When carrying out laser cutting to machined part 100, under updraft ventilator's convulsions effect, smog, the impurity that the cutting produced can be discharged through exhaust chamber 22, air outlet 23, and then guarantee that the environment is clean, eliminate smog, the harmful effects that impurity probably caused laser cutting's machining precision.

Example two

As shown in fig. 1 to 10, the present embodiment provides a laser processing apparatus. The laser processing apparatus includes a frame 9 and a laser cutting mechanism 6. The frame 9 is provided with a laser processing carrier provided in the first embodiment; the laser cutting mechanism 6 includes a laser cutter 61, and the laser cutter 61 is configured to emit a cutting laser onto the workpiece 100 carried on the laser processing carrier. When the laser processing carrier carries the workpiece 100, the laser processing carrier can make the surface 101 to be cut of the workpiece 100 face the cutting laser emitted by the laser cutter 61, so that the cutting laser can penetrate the surface 101 to be cut according to a preset cutting path, and a desired cut 102 is obtained.

Specifically, as shown in fig. 8 and 10, the laser cutter 61 includes a laser generator (not shown in the drawings) for generating a laser beam, a flying optical path folding mirror assembly 612 for transmitting the laser beam, a dynamic focusing lens barrel 614 for receiving the laser beam emitted from the flying optical path folding mirror assembly 612 and performing primary focusing, a galvanometer 611 for performing deviation adjustment on the optical path of the laser beam emitted from the dynamic focusing lens barrel 614, and a lens 613 for final focusing at the light output end of the galvanometer 611. The laser generator emits a laser beam to the flying optical path reflection mirror assembly 612, the laser beam is reflected by the flying optical path reflection mirror assembly 612 and transmitted to the dynamic focusing lens barrel 614, the dynamic focusing lens barrel 614 is located between the flying optical path reflection mirror assembly 612 and the vibrating mirror 611, a focusing lens (not shown) is arranged in the dynamic focusing lens barrel 614, wherein an arrow D in fig. 10 represents a moving direction of the focusing lens of the dynamic focusing lens barrel 614, preliminary focusing of the laser beam is realized by adjusting a distance between the focusing lens and a light outlet end of the flying optical path reflection mirror assembly 612, the laser beam subjected to the preliminary focusing processing is transmitted to the vibrating mirror 611, and after a laser path is adjusted by a deflection motion of the vibrating mirror 611, the laser subjected to the laser path adjustment is finally focused and irradiated onto the workpiece 100 through the lens 613.

Note that the galvanometer 611 is an excellent vector scanning device. The motor is a special swing motor, the basic principle is that the electrified coil generates moment in the magnetic field, but different from the rotating motor, the rotor is added with reset moment by a mechanical torsion spring or an electronic method, the magnitude of the reset moment is in direct proportion to the angle of the rotor deviating from the balance position, when the coil is electrified with certain current and the rotor deflects to a certain angle, the electromagnetic moment is equal to the magnitude of the reset moment, so the motor can not rotate like a common motor and can only deflect, the deflection angle is in direct proportion to the current and is the same as a galvanometer, and therefore, the vibrating mirror 611 is called a galvanometer scanning vibrating mirror. The term of the scanning galvanometer is called high-speed scanning galvanometer. The lens 613, the flying optical path catadioptric lens assembly 612, and the dynamic focusing lens barrel 614 are similar to the existing structure of the laser cutter 61, for example, the flying optical path catadioptric lens assembly 612 is a lens barrel for folding back the optical path of the laser beam actually, the dynamic focusing lens barrel 614 is a focusing lens provided with a position adjustment motor, and the distance between the focusing lens and the light exit end of the flying optical path catadioptric lens assembly 612 can be adjusted, and the lens 613 is a focusing lens for focusing, and therefore description is omitted.

In addition, the conventional laser processing apparatus has a large problem. The method is mainly characterized in that the traditional laser cutting adopts invisible positioning cutting, and the cutting precision is low; although a few laser cutters are provided with the visual imaging positioning device, the visual imaging positioning device is usually moved to the upper side of the workpiece 100, then the visual imaging positioning device generates an imaging picture, and after the positioning calculation is completed, the laser cutter 61 is moved to the position to be cut above the workpiece 100 to cut, so that the working process is complicated and time-consuming.

In order to solve the above problem, the laser processing apparatus further includes a visual positioning assembly 7, and the visual positioning assembly 7 is used for positioning the surface to be cut 101. The visual positioning assembly 7 mainly includes a camera 71 and a beam combiner 72, the beam combiner 72 is disposed at a light exit end (specifically, at the light exit end of the lens 613) of the laser cutter 61, a central axis of the light exit end of the lens 613 passes through a center of the beam combiner 72, and the camera 71 is disposed at one side of the beam combiner 72 and can obtain reflected imaging light of the workpiece 100 carried on the laser processing carrier through the beam combiner 72, so as to visually position the surface to be cut 101 on the workpiece 100. More specifically, the visual positioning assembly 7 further includes a lens 73 positioned between the camera 71 and the beam combiner 72. In this embodiment, the inclination angle of the beam combiner 72 with respect to the horizontal plane is 45 °, and the central axes of the camera 71 and the lens 73 extend to the beam combiner 72 along the horizontal direction. The laser cutting device has the advantages that the visual positioning is realized by additionally arranging the visual positioning assembly 7, and the beam combining mirror 72 of the visual positioning assembly 7 can realize synchronous visual positioning in the laser cutting process. Compared with the prior art, the vision imaging positioning device is firstly moved above the workpiece 100 to produce imaging pictures, and after the positioning calculation is completed, the laser cutter 61 is moved to the position above the workpiece 100 to be cut, and the cutting is carried out through the vision positioning structure and the vision positioning mode.

It should be noted that the camera 71 is a conventional CCD camera (CCD, a Charge coupled Device, and a CCD image sensor). The beam combiner 72 is a semi-transparent reflector, which combines two or more wavelengths of light into a single optical path by transmission and reflection, respectively. Because of the use of zinc selenide, zinc sulfide, or germanium material coated with an optimally designed film, the beam combiner 72 generally transmits infrared light and reflects visible light in the infrared CO₂The beam combiner 72 is used when the high power laser is aligned with a helium-neon visible diode laser.

For clarity of the working process, in summary, the reflected light from the surface of the workpiece 100 enters the camera 71 through the beam combiner 72 and the lens 73, and the camera 71 realizes visual positioning; the laser beam emitted by the laser cutter 61 passes through the flying optical path reflection mirror assembly 612, the dynamic focusing lens barrel 614, the galvanometer 611, the lens 613 and the beam combining mirror 72 in sequence, and is finally focused into cutting laser to be emitted to the to-be-cut surface 101 of the workpiece 100, and then according to the coaxial visual positioning of the visual positioning assembly 7 and the preset cutting path, under the deflection control of the galvanometer 611 of the laser cutter 61 and the position adjustment control of the dynamic focusing lens barrel 614, the laser cutter 61 continuously changes the laser divergence angle to adjust the focal height, so as to penetrate through the to-be-cut surface 101 according to the preset cutting path, and further obtain the desired cut 102. For a clearer understanding of the predetermined cutting path, the dashed line around the surface 101 to be cut in fig. 1 is the predetermined cutting path, which is described with reference to fig. 1. It is contemplated that other cutting paths may be designed to achieve the desired final cut, depending on the actual cutting needs.

Further, in order to ensure the sufficiency of the light source, the positioning accuracy of the visual positioning assembly 7 is ensured. As shown in fig. 8, the laser processing apparatus further includes a fill-in light source 8. Light filling light source 8 sets up in frame 9, and light filling light source 8 is used for the machined part 100 light filling that bears on to the laser beam machining carrier, and then guarantees that light is sufficient, and camera 71 can acquire clear image, and then guarantees positioning accuracy.

In addition, the conventional laser cutting machine generally performs cutting processing on only one workpiece 100 on the stage, and after the cutting is completed, the laser cutting machine 61 needs to be stopped, and after the workpiece 100 is mounted, dismounted and replaced, the next workpiece 100 can be cut, so that the working efficiency is low. To solve the above problems.

Further, as shown in fig. 8-9, in the present embodiment, the laser processing apparatus further includes a feeding assembly 5. The feeding assembly 5 is arranged on the rack 9, the laser processing carrier provided in the first embodiment is arranged at the output end of the feeding assembly 5, the feeding assembly 5 can drive the laser processing carrier to move to and fro between a material changing working position and a cutting working position, one feeding assembly 5 and one laser processing carrier form a group of feeding processing mechanisms, two groups of feeding processing mechanisms are arranged on the rack 9 side by side along a first direction, and X in the drawing represents the first direction; the laser cutting mechanism 6 further comprises a displacement driving assembly 62, the laser cutter 61 is arranged at the output end of the displacement driving assembly 62, and the laser cutter 61 can move to the position above the cutting working position of any feeding processing mechanism. The displacement driving assembly 62 can adopt the existing linear cylinder and nut screw pair to drive the laser cutter 61 to move above the cutting working position of any feeding processing mechanism. The laser cutting machining method has the advantages that when the machined parts 100 on one group of feeding machining mechanisms are subjected to laser cutting machining, the laser machining carriers on the other group of feeding machining mechanisms can move to the material changing working positions, the machined parts 100 which are machined are detached, the machined parts 100 to be machined are loaded, and then the machined parts 100 are moved to the corresponding cutting working positions to wait for cutting machining. By the design, the laser cutting mechanism 6 can alternately process the machined parts 100 on the two feeding processing mechanisms, so that the working efficiency is improved, and the laser cutter 61 is prevented from being idle in the material changing process. It should be noted that the feeding processing machine may also be arranged in three or more groups side by side according to the situation.

EXAMPLE III

The present embodiment provides a laser processing method that performs laser cutting processing of a workpiece 100 based on the laser processing apparatus in the second embodiment. As shown in fig. 4-10, the laser processing method includes the steps of:

s10, placing the clamp assembly 1 holding the workpiece 100 on the bearing surface 21 of the carrier 2, which forms a first inclination angle with the horizontal plane, so that the surface 101 to be cut of the workpiece 100 can face to the cutting laser; specifically, the first inclination angle is 60 ° in the present embodiment;

s20, positioning and limiting the clamp assembly 1 on the bearing surface 21 through the positioning assembly 3;

s30, performing visual shooting through the visual positioning component 7, calculating a coordinate origin according to the actual position of the workpiece 100 carried on the laser processing carrier, and generating a preset cutting path according to the coordinate origin;

s40, according to the coaxial visual positioning and the preset cutting path of the visual positioning assembly 7, under the control of the deflection of the galvanometer 611 of the laser cutter 61 and the adjustment of the dynamic focusing lens barrel 614, the laser cutter 61 continuously changes the divergence angle of the laser to adjust the focal height, and then emits the cutting laser to the preset cutting path to penetrate the surface 101 to be cut, so as to obtain the desired cut 102. In particular, a cut 102 having a first cut section B and a second cut section C is obtained as shown in fig. 3.

By adopting the laser processing method, when the laser processing carrier bears the processed piece 100, the to-be-cut surface 101 of the processed piece 100 can be arranged in a 60-degree inclined state, so that the to-be-cut surface 101 faces towards the cutting laser, the optical path of the cutting laser is close to the vertical to-be-cut surface 101, the cutting laser can penetrate through the to-be-cut surface 101 according to the preset cutting path, a required notch 102 is obtained, and the problem that the cutting is influenced because the cutting laser is not perpendicular to the to-be-cut surface 101 when the processed piece 100 is horizontally placed in the prior art is solved. And the coaxial visual positioning greatly improves the laser processing efficiency and can carry out the visual positioning while carrying out the laser cutting.

Further, as shown in fig. 4-9, the laser processing apparatus further includes a feeding assembly 5. The feeding assembly 5 is arranged on the rack 9, the laser processing carrier provided by the first embodiment is arranged on the output end of the feeding assembly 5, the feeding assembly 5 can drive the laser processing carrier to move to and fro between the material changing working position and the cutting working position, one feeding assembly 5 and one laser processing carrier form a group of feeding processing mechanisms, and two groups of feeding processing mechanisms are arranged on the rack 9 side by side along a first direction; the laser cutting mechanism 6 further comprises a displacement driving assembly 62, the laser cutter 61 is arranged at the output end of the displacement driving assembly 62, and the laser cutter 61 can move to the position above the cutting working position of any feeding processing mechanism.

Therefore, the laser processing method specifically includes the following steps before S10:

s5, conveying the laser processing carrier of the feeding processing mechanism, which is required to load the workpiece 100 to be processed, to a material changing work position, and then executing S10; specifically, in the present embodiment, the two sets of feeding and processing mechanisms, which carry the processed workpiece 100 and are in the idle state, belong to the feeding and processing mechanisms that need to load the workpiece 100 to be processed.

Before S30, the laser processing method specifically includes the following steps:

and S25, conveying the laser processing carrier loaded with the feeding processing mechanism of the processed piece 100 to be processed to a cutting work position, and then executing S30.

After the execution of S30, the processing device further returns to re-execute S5, and thus the alternating processing of the workpieces 100 in the two feeding processing mechanisms can be realized.

The laser processing method provided by the embodiment has the advantages that when the workpiece 100 on one feeding processing mechanism group is subjected to laser cutting processing, the laser processing carrier on the other feeding processing mechanism group can move to the material changing working position, a worker unloads the workpiece 100 which is processed, loads the workpiece 100 to be processed, and then moves to the corresponding cutting working position to wait for cutting processing. Therefore, the laser cutting mechanism 6 can alternately process the workpieces 100 on the two feeding processing mechanisms, the working efficiency is improved, and the laser cutter 61 is prevented from being idle in the material changing process.

The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.

Claims (10)

1. A laser machining carrier for carrying a workpiece (100) to be subjected to a laser cutting process, comprising:

the clamp assembly (1) is used for clamping a workpiece (100);

the clamp comprises a carrying seat (2), wherein a carrying surface (21) is arranged on the carrying seat (2), the carrying surface (21) is an inclined surface which forms a first inclination angle with the horizontal plane, so that when the clamp assembly (1) is placed on the carrying surface (21), a surface (101) to be cut of a workpiece (100) can face to cutting laser;

the positioning assembly (3) is used for positioning and limiting the clamp assembly (1) on the bearing surface (21).

2. The laser-machining carrier of claim 1, wherein the first tilt angle is 55 ° -65 °.

3. The laser-machining carrier of claim 1, further comprising:

the clamping assembly (4) is arranged on the carrying seat (2), and the clamping assembly (4) is used for clamping and fixing the clamp assembly (1) on the carrying surface (21).

4. The laser processing carrier of claim 1, wherein the positioning assembly (3) comprises a plurality of positioning posts (31) and positioning holes (111) corresponding to the positioning posts (31), one of the fixture assembly (1) and the carrier (2) is provided with the positioning posts (31), and the other is provided with the positioning holes (111).

5. The laser processing carrier of claim 1, wherein the carrier (2) is further provided with an air exhaust cavity (22) communicated with the carrying surface (21) and an air outlet (23) communicated with the air exhaust cavity (22).

6. The laser machining carrier of any one of claims 1-5, characterized in that the clamp assembly (1) comprises:

the first clamping plate (11) is provided with a first avoidance through hole for avoiding the to-be-cut surface (101);

the second clamping plate (12) is detachably connected with the first clamping plate (11), a second avoiding through hole communicated with the first avoiding through hole is formed in the second clamping plate (12), and a clamping space used for clamping a workpiece (100) is formed between the second clamping plate (12) and the first clamping plate (11) at intervals.

7. A laser processing apparatus, comprising:

a machine frame (9) on which a laser machining carrier according to any one of claims 1-6 is arranged;

and the laser cutting mechanism (6) comprises a laser cutter (61), and the laser cutter (61) is used for emitting cutting laser to a workpiece (100) carried on the laser processing carrier.

8. The laser processing apparatus according to claim 7, further comprising:

the feeding assembly (5) is arranged on the rack (9), the laser processing carrier is arranged on the output end of the feeding assembly (5), the feeding assembly (5) can drive the laser processing carrier to move to and fro between a material changing working position and a cutting working position, one feeding assembly (5) and one laser processing carrier form a group of feeding processing mechanisms, and at least two groups of feeding processing mechanisms are arranged on the rack (9) side by side;

the laser cutting mechanism (6) further comprises a displacement driving assembly (62), the laser cutter (61) is arranged at the output end of the displacement driving assembly (62), and the laser cutter (61) can move to the position above the cutting working position of any one feeding processing mechanism.

9. The laser processing apparatus of claim 7, further comprising:

the visual positioning assembly (7) comprises a camera (71) and a beam combiner (72), the beam combiner (72) is arranged at the light outlet end of the laser cutter (61), the central axis of the light outlet end penetrates through the center of the beam combiner (72), and the camera (71) is arranged on one side of the beam combiner (72) and can acquire reflected imaging light of a workpiece (100) carried on the laser processing carrier through the beam combiner (72) so as to be used for visually positioning a to-be-cut surface (101) on the workpiece (100).

10. The laser processing apparatus of claim 9, further comprising:

and the light supplementing light source (8) is arranged on the rack (9), and the light supplementing light source (8) is used for supplementing light to a machined part (100) borne on the laser processing carrier.

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