CN113146031A - Scanning microscopic ultrafast laser processing system based on dynamic field of view concatenation - Google Patents
Scanning microscopic ultrafast laser processing system based on dynamic field of view concatenation Download PDFInfo
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- CN113146031A CN113146031A CN202110418778.4A CN202110418778A CN113146031A CN 113146031 A CN113146031 A CN 113146031A CN 202110418778 A CN202110418778 A CN 202110418778A CN 113146031 A CN113146031 A CN 113146031A
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- 238000004621 scanning probe microscopy Methods 0.000 claims abstract description 6
- 230000003760 hair shine Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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Abstract
The invention discloses a scanning microscopic ultrafast laser processing system based on dynamic field splicing, which comprises a workbench, a femtosecond laser, a scanning galvanometer, an objective lens, a 4f unit and a controller, wherein the workbench is connected with the femtosecond laser; the workbench is used for placing a workpiece; the femtosecond laser is used for generating a femtosecond laser beam; the scanning galvanometer is arranged on a light path of the femtosecond laser, and the femtosecond laser beam can realize dynamic linear scanning of the femtosecond laser beam in a plane area range after being reflected by the scanning galvanometer; the objective lens is arranged on the light path of the scanning galvanometer and used for focusing the femtosecond laser beam output by the scanning galvanometer to the surface of a workpiece; the 4f unit is arranged between the scanning galvanometer and the objective lens and is used for enabling the scanning range of the galvanometer to pass through the objective lens to the maximum extent; the controller is used for enabling the femtosecond laser beam output by the scanning galvanometer to be continuously output to a region to be processed of the workpiece. The invention utilizes the dynamic field splicing scanning microscopy to control laser to carry out seamless large-area processing, thereby realizing high-precision and high-efficiency processing.
Description
Technical Field
The invention belongs to the technical field of laser processing, and particularly relates to a scanning microscopic ultrafast laser high-precision and high-efficiency processing system based on dynamic field splicing.
Background
The laser processing has the advantages of high precision, compatibility with various materials and the like, is particularly suitable for being combined with a computer numerical control technology to construct a high-precision automatic processing system, and the processing technologies such as laser cutting, laser welding, laser photoetching and the like are widely applied in various fields.
With the advent of ultrafast femtosecond laser technology in the 80 s of the 20 th century, laser micromachining technology has come to further development. The femtosecond laser pulse has extremely short pulse width and extremely short interaction time with the material, thereby greatly reducing the heat effect in the laser processing process and further improving the processing precision and the processing quality; furthermore, the femtosecond laser pulses have extremely high peak power, so that the femtosecond laser can process almost all materials. These characteristics provide new opportunities for increasing high-end manufacturing, high precision manufacturing, and smart manufacturing requirements.
However, in the laser processing technology, there is a problem that high precision processing is often incompatible with large area high efficiency processing. The scanning microscopy provides a thought for solving the problem, the point light source is used for point-by-point fast scanning diffraction limit point imaging of a sample in combination with the fast scanning performance of the galvanometer and the microscopy performance of the objective, and then line scanning results are arranged in order to form a two-dimensional image.
At present, in order to realize large-area imaging, a method mainly adopted is to divide a material into a plurality of areas, scan and image each area one by one, and finally splice the images. However, in practical applications, the method causes image distortion at the edge of the partition due to optical aberration, and generates systematic errors during the stitching process, thereby reducing the quality and accuracy of the imaging.
Disclosure of Invention
Aiming at the defects or the improvement requirements of the prior art, the invention provides a scanning microscope ultrafast laser processing system based on dynamic field splicing, which combines a high-efficiency and high-precision scanning microscope technology with a large-stroke range three-axis servo displacement table to realize the synchronization of the scanning microscope and the three-axis servo displacement table, thereby continuously, efficiently and precisely processing the material with a view field larger than that of the scanning microscope without splicing all areas together, and eliminating the problems of stitching error and processing quality reduction caused by overlapping and mismatching of laser processing.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a scanning microscopic ultrafast laser processing system based on dynamic field splicing comprises a workbench, a femtosecond laser, a scanning galvanometer, an objective lens, a 4f unit and a controller;
the workbench is used for placing a workpiece and driving the workpiece to move in the space;
the femtosecond laser is used for generating a femtosecond laser beam;
the scanning galvanometer is arranged on a light path of the femtosecond laser, and the femtosecond laser beam can realize dynamic linear scanning of the femtosecond laser beam in a plane area range after being reflected by the scanning galvanometer;
the objective lens is arranged on the light path of the scanning galvanometer and used for focusing the femtosecond laser beam output by the scanning galvanometer to the surface of a workpiece;
the 4f unit is arranged between the scanning galvanometer and the objective lens and is used for enabling the scanning range of the galvanometer to pass through the objective lens to the maximum extent;
the controller is respectively connected with the workbench, the femtosecond laser and the scanning galvanometer, and plans the cooperative path of the workbench and the scanning galvanometer according to the workpiece so that the femtosecond laser beams output by the scanning galvanometer are continuously output to the region to be processed of the workpiece.
According to the technical scheme, a collimation beam expanding lens is further arranged between the femtosecond laser and the scanning galvanometer.
According to the technical scheme, the system further comprises an observation light path unit, wherein the observation light path unit comprises a light source, a beam splitting cubic mirror and a CCD camera, if the light source is arranged above the workbench, light beams emitted by the light source are incident on the beam splitting cubic mirror to be transmitted, the light beams are transmitted to the objective lens through the beam splitting cubic mirror and then focused light is output, the focused light is incident on the workbench and irradiated on a workpiece of the workbench, reflected light generated by the workpiece irradiated by the focused light is collected and returned by the objective lens, and the reflected light is imaged on the CCD camera after being reflected by the beam splitting cubic mirror;
if the light source is arranged below the workbench, the workpiece is a transparent workpiece, a light beam emitted by the light source irradiates the workpiece of the workbench, reflected light generated by the irradiated workpiece is focused by the objective lens, reflected by the beam splitting cubic mirror and imaged on the CCD camera;
the CCD camera is connected with a display, and the display is connected with the controller.
According to the technical scheme, the workbench is provided with the vacuum chuck for adsorbing the workpiece.
The invention has the following beneficial effects: according to the invention, ultrafast femtosecond laser beams emitted by a femtosecond laser enter a scanning galvanometer, enter an objective lens through a 4f unit and finally reach a workbench to process a workpiece, and a controller combines the motion of the scanning galvanometer and the motion of the workbench (the workbench can do XYZ three-axis motion), so that the laser is controlled by using a dynamic field-of-view splicing scanning microscopy technology to process a large area in a seamless manner while high-speed scanning is maintained, and high-precision and high-efficiency processing is realized.
By correctly configuring the controller, the invention can convert the patterns to be processed into corresponding servo axis and galvanometer scanning microscopic motion, ensure that the command track is kept in a scanning microscopic field, and simultaneously carry out seamless large-area processing in an XY servo axis field of view without the command of step scanning executed by the servo axis; in the invention, the motion of the scanning microscope takes the dynamic tracking error of the servo shaft as a part of the track of the servo shaft and corrects the dynamic tracking error in real time, thereby ensuring high processing precision and improving the processing efficiency; the invention fixes the microscope objective on the Z axis, and realizes high-efficiency, high-precision and large-area three-dimensional manufacturing by controlling the movement of the Z axis and combining a dynamic field splicing scanning microscope system.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is a schematic diagram of the present invention for processing a large area workpiece.
In the figure: 1-a femtosecond laser; 2-a first mirror; 3-collimating beam-expanding lens; 5-scanning a galvanometer; 7-4f units; 9-a second mirror; 10-an objective lens; 11-beam splitting cube; 12-a CCD camera; 13-a light source; 14-a controller; 15-a display; 16-the work bench.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
As shown in fig. 1, a scanning microscopic ultrafast laser processing system based on dynamic field splicing comprises a worktable 16, a femtosecond laser 1, a scanning galvanometer 5, an objective lens 10, a 4f unit 7 and a controller 14;
the workbench 16 is used for placing a workpiece and driving the workpiece to move in space, so that the workpiece can move in XYZ axes;
the femtosecond laser 1 is used for generating a femtosecond laser beam;
the scanning galvanometer 5 is arranged on a light path of the femtosecond laser 1, the femtosecond laser beam can realize dynamic linear scanning of the femtosecond laser beam in a plane area range after being reflected by the scanning galvanometer, and a first reflecting mirror 2 can be arranged between the femtosecond laser and the scanning galvanometer for saving space;
the objective lens 10 is arranged on the light path of the scanning galvanometer 5 and is used for focusing the femtosecond laser beam output by the scanning galvanometer to the surface of a workpiece;
the 4f unit 7 is arranged between the scanning galvanometer and the objective lens and is used for enabling the scanning range of the galvanometer to pass through the objective lens to the maximum extent, the 4f unit is composed of a pair of convex lenses, and a second reflecting mirror 9 can be arranged between the 4f unit and the objective lens for saving space;
the controller 14 is respectively connected with the workbench 16, the femtosecond laser 1 and the scanning galvanometer 5, and the controller plans the cooperative path of the workbench and the scanning galvanometer according to the workpiece so as to continuously output the femtosecond laser beams output by the scanning galvanometer to the region to be processed of the workpiece.
In a preferred embodiment of the present invention, as shown in fig. 1, a collimation and beam expanding lens 3 is further disposed between the femtosecond laser and the scanning galvanometer, and the collimation and beam expanding lens is composed of a pair of convex lenses.
In a preferred embodiment of the present invention, as shown in fig. 1, the system further includes an observation optical path unit, where the observation optical path unit includes a light source 13 (which may be an LED illumination light source), a beam splitting cube 11 and a CCD camera 12, and if the light source is disposed above the workbench, a light beam emitted by the light source is incident on the beam splitting cube to be transmitted, and is transmitted to the objective lens through the beam splitting cube to output a focused light, and the focused light is incident on the workbench and is irradiated onto a workpiece on the workbench, and a reflected light generated by the workpiece being irradiated by the focused light is collected by the objective lens and returned, and is reflected by the beam splitting cube to be imaged on the CCD camera;
if the light source is arranged below the workbench, the workpiece is a transparent workpiece, a light beam emitted by the light source irradiates the workpiece of the workbench, and reflected light generated by the irradiated workpiece is focused by the objective lens, reflected by the beam splitting cubic mirror and imaged on the CCD camera;
the CCD camera is connected to a display 15 which is connected to the controller 14.
In the preferred embodiment of the present invention, not shown in the figures, the vacuum chuck for adsorbing the workpiece is disposed on the worktable, so that various additional functions of sample adsorption, backlight illumination, leveling, etc. can be realized.
The invention mainly comprises an optical system and a control system, wherein the optical system is divided into a laser light path and an observation light path, the control system is divided into the control of laser and the control of a three-axis servo displacement table and a microscopic scanning system, the control is realized by a computer, and the high-precision and high-efficiency large-area processing can be realized.
The pattern shown in fig. 2 is processed, the scanning range of the scanning galvanometer is shown in a dotted line frame, and the motion path of the platform is shown in a black line, so that the scanning galvanometer can continuously cover the whole pattern in the moving process of the platform. The working principle is as follows:
1) the femtosecond laser generates femtosecond laser pulse with specific wavelength, and the femtosecond laser pulse enters the collimation beam expander through the reflector to change laser beam into collimated (parallel) beam, so that uniform and fine light spots with high power density can be obtained by using the objective lens;
2) the collimated laser beam enters a scanning microscope system consisting of a galvanometer, a 4f unit, a reflector (only reflecting laser with specific wavelength and allowing light with other wavelengths to pass through) and an objective lens, and finally reaches an XY servo displacement platform to realize rapid high-precision processing in the field range of the objective lens;
3) the LED light source sequentially passes through the beam splitting cubic mirror, the reflector and the objective lens (fixed on a Z axis) to reach a sample on the XY servo displacement platform, and then reaches the beam splitting cubic mirror according to an original light path through sample reflection, or the LED light source transmits from the bottom of the sample to reach the objective lens and the beam splitting cubic mirror, and then is reflected by the beam splitting cubic mirror to a CCD camera for imaging, so that a real-time processing pattern is obtained;
4) the controller combines the motion of the scanning microscope system and the motion of the XYZ three-axis servo shaft to expand the view field of the scanning microscope, partial motion of the scanning microscope system is replaced by the constant motion of the servo shaft, the processed pattern is ensured to be always in the view field of the scanning microscope while the displacement table has large-range stroke (60mm multiplied by 60mm), and the seamless large-area high-speed high-precision processing, namely the dynamic view field splicing scanning microscope technology, is realized while the high-speed scanning of the scanning microscope is maintained;
5) DMC software is used on a computer to optimize the execution sequence of the combined motion path of the processed patterns of the dynamic field-of-view stitching scanning microscope system, and meanwhile, the controller controls the laser to be matched with the overall motion of the dynamic field-of-view stitching scanning microscope system, so that the scanning microscope ultrafast laser high-precision and high-efficiency processing based on dynamic field stitching is finally realized.
Lasers in the present invention include, but are not limited to: KGW femtosecond laser, titanium sapphire femtosecond laser, and the like, and suitable optical elements such as a reflector, a lens, an objective lens and the like are selected, so that the laser can be suitable for lasers with different wavelengths and different powers.
The XYZ three-axis servo displacement stage of the present invention includes, but is not limited to: the displacement range of the XY plane is 60mm multiplied by 60mm or 130mm multiplied by 130mm, the displacement range of the Z axis is +/-30 mm, and the displacement precision can reach hundreds of nanometer-level servo axes and the like.
In the invention, the laser, the LED light source, the scanning microscope system and the servo shaft are controlled in a matched manner through the controller on the computer in an integrated manner; at the same time, the execution sequence of the combined motion path of the processed patterns of the dynamic field-of-view stitching scanning microscope system is optimized by using proper software.
The invention has the following beneficial effects:
1) after the controller is configured correctly, the pattern to be processed can be converted into the corresponding servo axis and galvanometer scanning microscopic motion, seamless large-area processing is carried out in the XY servo axis view field while the command track is kept in the scanning microscopic view field, and the command of step scanning by the servo axis is not required;
2) the motion of the scanning microscope takes the dynamic tracking error of the servo shaft as a part of the track of the servo shaft, and corrects the dynamic tracking error in real time, so that the processing efficiency can be improved while the high processing precision is ensured;
3) the microscope objective is fixed on a Z axis, and efficient, high-precision and large-area three-dimensional manufacturing is realized by controlling the movement of the Z axis and combining a dynamic field-of-view splicing scanning microscope system.
In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (4)
1. A scanning microscopic ultrafast laser processing system based on dynamic field splicing is characterized by comprising a workbench, a femtosecond laser, a scanning galvanometer, an objective lens, a 4f unit and a controller;
the workbench is used for placing a workpiece and driving the workpiece to move in the space;
the femtosecond laser is used for generating a femtosecond laser beam;
the scanning galvanometer is arranged on a light path of the femtosecond laser, and the femtosecond laser beam can realize dynamic linear scanning of the femtosecond laser beam in a plane area range after being reflected by the scanning galvanometer;
the objective lens is arranged on the light path of the scanning galvanometer and used for focusing the femtosecond laser beam output by the scanning galvanometer to the surface of a workpiece;
the 4f unit is arranged between the scanning galvanometer and the objective lens and is used for enabling the scanning range of the galvanometer to pass through the objective lens to the maximum extent;
the controller is respectively connected with the workbench, the femtosecond laser and the scanning galvanometer, and plans the cooperative path of the workbench and the scanning galvanometer according to the workpiece so that the femtosecond laser beams output by the scanning galvanometer are continuously output to the region to be processed of the workpiece.
2. The scanning microscopy ultrafast laser processing system based on dynamic field of view splicing as claimed in claim 1, wherein a collimating beam expander is further disposed between said femtosecond laser and said scanning galvanometer.
3. The scanning microscopy ultrafast laser processing system based on dynamic field of view concatenation of claim 1, characterized by, that, the system also includes observing the light path unit, the said observation light path unit includes light source, beam splitting cube mirror and CCD camera, if the said light source is set up above the work station, the light beam that the said light source sends out is incident on the beam splitting cube mirror and transmitted, output the focusing light after transmitting to the objective lens through the beam splitting cube mirror, the focusing light is incident on the work station and shines on the work piece of the work station, the reflected light that the work piece is produced by the focusing light radiation is collected by the objective lens and returned, image on CCD camera after being reflected by the beam splitting cube mirror;
if the light source is arranged below the workbench, the workpiece is a transparent workpiece, a light beam emitted by the light source irradiates the workpiece of the workbench, reflected light generated by the irradiated workpiece is focused by the objective lens, reflected by the beam splitting cubic mirror and imaged on the CCD camera;
the CCD camera is connected with a display, and the display is connected with the controller.
4. The scanning microscopy ultrafast laser processing system based on dynamic field of view tiling of claim 1, wherein a vacuum chuck for sucking a workpiece is disposed on said worktable.
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| CN113805438A (en) * | 2021-08-30 | 2021-12-17 | 武汉理工大学 | Deep ultraviolet micro projection photoetching parallel manufacturing system and method adopting single-step method |
| CN113909677A (en) * | 2021-10-22 | 2022-01-11 | 吉林大学 | Two-photon polymerization high-power exposure method and system for galvanometer-assisted cyclic scanning |
| CN114918532A (en) * | 2022-06-17 | 2022-08-19 | 烟台魔技纳米科技有限公司 | Rapid scanning type nanoscale three-dimensional laser processing device and method |
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Application publication date: 20210723 |
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