CN212217443U - Coaxial light path structure and laser engraving equipment - Google Patents
Coaxial light path structure and laser engraving equipment Download PDFInfo
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- CN212217443U CN212217443U CN202020380845.9U CN202020380845U CN212217443U CN 212217443 U CN212217443 U CN 212217443U CN 202020380845 U CN202020380845 U CN 202020380845U CN 212217443 U CN212217443 U CN 212217443U
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Abstract
The utility model relates to a coaxial light path structure and laser engraving device, coaxial light path structure includes: a laser; the optical path component receives and transmits laser emitted by the laser; an image positioning device that emits positioning light; and the beam combining mirror receives and reflects the laser emitted by the light path component to form a reflection light path, the beam combining mirror also transmits the positioning light emitted by the image positioning device to form a transmission light path, and the reflection light path and the transmission light path are coaxial and act on the region to be processed of the workpiece together. Laser engraving apparatus comprising: a frame; the displacement assembly is connected with the rack and the workbench to drive the workbench to move relative to the rack; the laser, the light path component, the image positioning device and the beam combining mirror are arranged on the machine frame, laser emitted by the laser is reflected by the beam combining mirror after passing through the light path component to form a reflection light path, positioning light emitted by the image positioning device penetrates through the beam combining mirror to be projected to form a projection light path, and the reflection light path and the projection light path are coaxial to focus on a workpiece on the workbench to form a light spot.
Description
Technical Field
The utility model relates to a laser engraving technical field especially relates to a coaxial light path structure and laser engraving equipment.
Background
Laser marking machines are used in more and more places as an advanced fine processing device. The focusing light spot of the laser marking machine is less than 0.01mm, and the repeated positioning precision of the laser marking machine is less than 0.01 mm. In order to obtain an accurate machining effect and eliminate position deviation caused by different workpiece tolerances, a high-precision laser marking machine is provided with a Charge Coupled Device (CCD) camera for auxiliary positioning, an image positioning device shoots the position of a region to be machined, and feeds the position back to the laser marking machine, and then the laser marking machine carries out accurate machining on the region to be machined.
The working method of the existing common laser marking machine is that the laser marking machine moves through an image positioning device and enters a laser light path to be processed to be snapshotted and positioned, then the image positioning device moves out of the laser light path, and then laser marking is carried out. For example, an image positioning device (CCD camera) and a laser head marking device are respectively installed at two different positions, a workpiece is firstly moved to the position under the image positioning device (CCD camera) to be positioned and then moved to the position under a laser marking head to be marked, and due to the fact that the marking position is carried out based on positioning information of the image positioning device, if the positioning information is inaccurate, the marking position of the laser head marking device is deviated. Because the workpiece needs to be moved to the position under the laser head marking device for marking after being positioned by the image positioning device, for example, the moving device is driven by a gear set, a moving error occurs due to a gear meshing gap during moving, and finally, an error exists between the position of the workpiece below the laser marking device and a theoretical position, so that an error occurs in a marking result.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is necessary to provide a coaxial optical path structure to solve the above technical problems.
A coaxial optical circuit structure, comprising:
a laser;
the optical path component receives and transmits the laser emitted by the laser;
an image positioning device that emits positioning light; and
the beam combining mirror receives and reflects the laser emitted by the light path component to form a reflection light path, the beam combining mirror further transmits the positioning light emitted by the image positioning device to form a transmission light path, and the reflection light path and the transmission light path are coaxial and act on an area to be processed of the workpiece together.
In one embodiment, the laser, the image positioning device and the beam combining mirror are fixedly connected with each other, so that the relative positions of the laser, the image positioning device and the beam combining mirror are unchanged before and after the coaxial optical path structure works.
In one embodiment, the laser comprises a first laser and a second laser which are detachably connected with the optical path component and emit laser light with different wave bands respectively.
In one embodiment, the optical path assembly at least comprises a laser input piece, a reflecting mirror assembly, a diaphragm assembly and a beam expanding mirror assembly, and the first laser and the second laser are respectively detachably connected with the laser input piece.
In one embodiment, the image positioning device comprises a CMOS area-array camera or a CCD camera.
In one embodiment, the image-locating device includes an LED locating light source that emits locating light.
In one embodiment, the beam combiner comprises a glass substrate and a coating disposed on the glass substrate.
In one embodiment, the dust collector is used for collecting waste gas or dust generated in work.
In one embodiment, the beam combiner further comprises a lifting assembly for driving the beam combiner to lift.
A laser engraving apparatus comprising:
a frame;
the workbench is arranged on the rack;
the displacement assembly is connected with the rack and the workbench to drive the workbench to move relative to the rack; the laser, the light path component, the image positioning device and the beam combining mirror are arranged on the machine frame, laser emitted by the laser is reflected by the beam combining mirror after passing through the light path component to form a reflection light path, positioning light emitted by the image positioning device penetrates through the beam combining mirror to be projected to form a projection light path, and the reflection light path and the projection light path are coaxial to focus on a workpiece on the workbench to form a light spot.
Has the advantages that: the laser emitted by the light path component is received and reflected by the beam combining mirror to form a reflection light path, the beam combining mirror also transmits the positioning light emitted by the image positioning device to form a transmission light path, and the reflection light path and the transmission light path are coaxial and act on the region to be processed of the workpiece together. That is, the image positioning device and the workpiece do not move during working, so that the problem of marking position deviation caused by movement errors when the workpiece moves between the image positioning device and the laser head marking device in the prior art is solved;
in addition, the process of etching the to-be-processed area of the workpiece by the laser emitted by the laser and the process of positioning the to-be-processed area of the workpiece by the image positioning device are carried out simultaneously, so that the positioning and the etching are not required to be carried out successively, the processing time is shortened, and the processing efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of a coaxial optical circuit configuration in one embodiment of the present application;
FIG. 2 is a top view of the structure shown in FIG. 1;
FIG. 3 is a schematic structural diagram of a laser engraving apparatus in one embodiment of the present application;
fig. 4 is a front view of the structure shown in fig. 3.
Reference numerals: a. a region to be machined of the workpiece; b. light spots; 10. a frame; 11. a base; 12. a support frame; 100. a laser; 100a, a first laser; 100b, a second laser; 200. an optical path component; 210. a laser input; 220. a mirror assembly; 221. a first reflector; 222. a second reflector; 223. a third reflector; 224. a fourth mirror; 230. a diaphragm assembly; 240. a beam expander assembly; 300. an image positioning device; 400. a beam combining mirror; 500. a lifting assembly; 510. a bearing seat; 520. a drive shaft; 600. a displacement assembly; 610. a first direction moving assembly; 620. a second direction moving assembly; 700. a work bench.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Fig. 1 is a schematic diagram of a coaxial optical path structure in an embodiment of the present application, where the coaxial optical path structure includes a laser 100, an optical path component 200, an image positioning device 300, and a beam combining mirror 400, laser light emitted by the laser 100 passes through the optical path component 200 and then irradiates onto the beam combining mirror 400, the beam combining mirror 400 reflects the laser light to form a reflection optical path, positioning light emitted by the image positioning device 300 irradiates onto the beam combining mirror 400 and penetrates through the beam combining mirror 400 to form a projection optical path, and the reflection optical path and the projection optical path are overlapped and jointly act on a region a to be processed of a workpiece. The region a to be processed of the workpiece is located below the beam combiner 400.
The positioning light emitted from the image positioning apparatus 300 is visible light, and may be red light emitted from a diode and having a wavelength band of 650nm, for example. The laser light emitted by the laser 100 is invisible to the naked eye, and may be, for example, laser light having a wavelength band of 1064 nm. When the red light with the wave band of 650nm and the laser with the wave band of 1064nm are superposed, the position of the spot b marked by the red light in the region a to be processed of the workpiece is the position where the laser contacts the region a to be processed of the workpiece, and therefore, the position of the spot b of the red light captured by the image positioning device 300 is the position where the laser is processed.
As shown in fig. 1, the laser 100, the optical path assembly 200, the image positioning device 300 and the beam combining mirror 400 are all fixedly connected to a frame 10. The process of positioning the region a to be processed of the workpiece by the image positioning device 300 and the process of etching the region a to be processed of the workpiece by the laser emitted by the laser 100 are performed simultaneously; namely, the positioning and the etching are not required to be carried out in sequence, so that the working time is shortened, and the working efficiency is improved. Moreover, since the image positioning device 300 does not need to move to enter and leave the optical path of the laser light emitted from the laser 100 when operating, there is no movement error, thereby improving the processing accuracy. That is, the laser 100, the image positioning device 300 and the beam combining mirror 400 are fixedly connected to each other through the frame 10, and before and after the operation of the coaxial optical path structure, the relative positions of the laser 100, the image positioning device 300 and the beam combining mirror 400 with respect to the frame 10, and thus the relative positions of the laser 100, the image positioning device 300 and the beam combining mirror 400, are unchanged.
In one embodiment, the beam combining mirror 400 is made of a glass substrate and a coating disposed on the glass substrate, the positioning light emitted from the image positioning device 300 can pass through the glass substrate and the coating to form a transmission light path, the laser light emitted from the laser 100 is reflected after being irradiated on the coating to form a reflection light path, and the transmission light path and the reflection light path are overlapped. The coating is usually an optical coating, which is a process for coating one or more layers of metal or dielectric films on a glass substrate, and is used for meeting the requirements of enhancing the reflection of laser and enhancing the transmittance of visible light.
In one embodiment, as shown in FIG. 1, the optical path assembly 200 includes a laser input 210, a mirror assembly 220, an aperture assembly 230, and a beam expander lens assembly 240. The mirror assembly 220 is used for changing the direction of the laser light path, the diaphragm assembly 230 is used for limiting the size of the light beam, and the beam expanding mirror assembly 240 is used for changing the diameter and the divergence angle of the light beam. The mirror assembly 220 includes at least a first mirror 221, a second mirror 222, a third mirror 223, and a fourth mirror 224, and in other embodiments, the number of mirrors may be increased or decreased as desired. The laser 100 is connected with the laser input part 210, laser emitted by the laser 100 enters the laser input part 210, then the laser sequentially passes through the first reflector 221, the diaphragm assembly 230, the second reflector 222, the beam expanding lens assembly 240, the third reflector 223 and the fourth reflector 224, finally irradiates the beam combining mirror 400, and is reflected to a workpiece through the beam combining mirror 400, so as to process the workpiece.
As shown in fig. 2, fig. 2 is a top view of the structure shown in fig. 1, and in one embodiment, as shown in fig. 1 and 2, the laser 100 includes a first laser 100a and a second laser 100b, the first laser 100a and the second laser 100b are capable of emitting laser light in different wavelength bands, and the first laser 100a and the second laser 100b share an optical path assembly 200. The first laser 100a and the second laser 100b are detachably connected to the optical path assembly 200, respectively. The first laser 100a is coupled into the laser input 210 of the optical circuit assembly 200 when the first laser 100a is in operation, and the second laser 100b is coupled into the laser input 210 of the optical circuit assembly 200 when the second laser 100b is in operation. Therefore, the coaxial optical path structure in this embodiment can be compatible with different lasers 100, and different lasers 100 can share the coaxial optical path structure, thereby saving the equipment cost.
In one embodiment, the image positioning device 300 may comprise a CMOS (Complementary Metal Oxide Semiconductor) area-array camera or a CCD (charged coupled device) camera. The image positioning device 300 further includes an LED positioning light source that emits positioning light. The LED positioning light source is a blue LED lamp, a red LED lamp or a white LED lamp.
Fig. 3 is a schematic structural diagram of a laser engraving apparatus in an embodiment of the present application, the laser engraving apparatus including a coaxial optical path structure in any one of the embodiments. The laser engraving apparatus can perform laser engraving on the semiconductor IC chip to perform product coding or nameplate identification or the like on the semiconductor IC chip. As shown in fig. 3, the laser engraving apparatus includes a frame 10, a table 700 is provided on the frame 10, a semiconductor IC chip is mounted on the table 700, and laser light is emitted by a laser 100 provided on the frame 10 to perform etching. Specifically, a laser 100, an optical path component 200, an image positioning device 300 and a beam combining mirror 400 are arranged on the machine frame 10, laser emitted by the laser 100 is reflected by the beam combining mirror 400 after passing through the optical path component 200 to form a reflected optical path, positioning light emitted by the image positioning device 300 passes through the beam combining mirror 400 to be projected to form a projected optical path, and the reflected optical path and the projected optical path are coaxial to focus on a workpiece on the workbench 700 to form a light spot b.
As shown in fig. 3, the frame 10 includes a base 11 and a support 12 disposed above the base 11, the displacement assembly 600 and the worktable 700 are disposed on the base 11, and the laser 100, the optical path assembly 200, the image positioning apparatus 300, and the beam combiner 400 are disposed on the support 12. The optical path assembly 200 includes a laser input 210, a mirror assembly 220, a diaphragm assembly 230, and a beam expander lens assembly 240. The reflecting mirror assembly 220 at least comprises a first reflecting mirror 221, a second reflecting mirror 222, a third reflecting mirror 223 and a fourth reflecting mirror 224, the laser 100 is connected with the laser input member 210, laser emitted by the laser 100 propagates in the horizontal direction and enters the laser input member 210, then the laser sequentially passes through the first reflecting mirror 221, the diaphragm assembly 230, the second reflecting mirror 222, the beam expanding mirror assembly 240 and the third reflecting mirror 223, the laser changes the propagation direction after passing through the third reflecting mirror 223 from horizontal propagation to vertical propagation, and the laser is reflected by the fourth reflecting mirror 224 located below the third reflecting mirror 223 and then restores the horizontal propagation direction again.
As shown in fig. 3, in one embodiment, the laser engraving apparatus further includes a lifting assembly 500 for driving the beam combining mirror 400 to lift and lower to adjust a vertical distance between the beam combining mirror 400 and the worktable 700, the laser is reflected by the beam combining mirror 400 and focused on a workpiece on the worktable 700 to form a spot b, and the lifting assembly 500 changes the distance between the beam combining mirror 400 and the worktable 700, so as to change a size of the spot b focused on the workpiece. Specifically, the image positioning device 300, the beam combiner 400 and the fourth reflector 224 are all fixedly connected to the lifting assembly 500, and the lifting assembly 500 is further connected to the supporting frame 12, so that the lifting assembly 500 can drive the image positioning device 300, the beam combiner 400 and the fourth reflector 224 to lift and lower together. The size of the light spot b is accurately controlled through the lifting assembly 500, so that the control range of the light spot b reaches 10um-40 um.
Fig. 4 is a front view of the structure shown in fig. 3, and in one embodiment, as shown in fig. 4, the lifting assembly 500 includes a carrier 510 and a driving shaft 520 screwed to the carrier 510 and disposed in a vertical direction, the driving shaft 520 is driven by a driving member to perform a lifting motion, and the driving shaft 520 is lifted to drive the carrier 510 to lift. The fourth reflector 224 is fixedly connected to the carrying base 510, and the carrying base 510 is further fixedly connected to the image positioning device 300 and the beam combiner 400.
In one embodiment, as shown in fig. 3, the displacement assembly 600 includes a first direction moving assembly 610 and a second direction moving assembly 620, and the projection of the line of the first direction and the line of the second direction on the horizontal plane form an acute angle or a right angle. For example, the first direction moving unit 610 may be an X-axis direction moving unit, and the second direction moving unit 620 may be a Y-axis direction moving unit. The first direction moving assembly 610 includes a first slider having a first guide rail sliding along the first guide rail, and the second direction moving assembly 620 includes a second guide rail disposed on the first slider and a second slider sliding along the second direction. The work table 700 is provided on the second slider.
In one embodiment, the frame 10 is further provided with a dust collecting device for collecting exhaust gas and dust generated during operation. For example, the dust collecting device is provided on the base to collect exhaust gas and dust, ensuring cleanliness of a working environment.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A coaxial optical circuit structure, comprising:
a laser (100);
an optical path component (200) for receiving and transmitting the laser light emitted by the laser (100);
an image positioning device (300) that emits positioning light; and
the beam combining mirror (400) receives and reflects the laser emitted by the light path component (200) to form a reflection light path, the beam combining mirror (400) also transmits the positioning light emitted by the image positioning device (300) to form a transmission light path, and the reflection light path and the transmission light path are coaxial and act on the region (a) to be processed of the workpiece together.
2. The coaxial optical path structure of claim 1, wherein the laser (100), the image positioning device (300) and the beam combiner (400) are fixedly connected to each other, so that the relative positions of the laser (100), the image positioning device (300) and the beam combiner (400) are unchanged before and after the operation of the coaxial optical path structure.
3. The coaxial optical circuit structure of claim 1, wherein the laser (100) comprises a first laser (100a) and a second laser (100b) for emitting laser light of different wavelength bands, respectively, detachably connected to the optical circuit assembly (200).
4. The coaxial optical circuit structure of claim 3, wherein the optical circuit assembly (200) comprises at least a laser input (210), a mirror assembly (220), a diaphragm assembly (230), and a beam expander assembly (240), the first and second lasers (100a, 100b) being removably connected to the laser input (210), respectively.
5. The coaxial optical path structure of claim 1, wherein the image positioning device (300) comprises a CMOS area-array camera or a CCD camera.
6. The coaxial optical path structure of claim 5, wherein the image positioning device (300) comprises an LED positioning light source emitting positioning light.
7. The coaxial optical circuit structure of claim 1, wherein the combiner mirror (400) comprises a glass substrate and a coating disposed on the glass substrate.
8. The coaxial optical circuit structure of claim 1, further comprising a dust collecting device for collecting exhaust gas or dust generated by the operation.
9. The coaxial optical circuit structure of claim 1, further comprising a lifting assembly (500) for driving the beam combiner (400) to lift and lower.
10. A laser engraving apparatus, comprising:
a frame (10);
a work table (700) provided on the frame (10);
a displacement assembly (600) connecting the frame (10) and the worktable (700) to drive the worktable (700) to move relative to the frame (10); the laser positioning device comprises a rack (10), a laser (100), a light path component (200), an image positioning device (300) and a beam combining mirror (400), wherein the laser (100) is arranged on the rack (10), the laser is reflected by the beam combining mirror (400) to form a reflection light path after passing through the light path component (200), the positioning light emitted by the image positioning device (300) passes through the beam combining mirror (400) to be projected to form a projection light path, and the reflection light path and the projection light path are coaxial to focus on a workpiece on the workbench (700) to form a light spot (b).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020380845.9U CN212217443U (en) | 2020-03-24 | 2020-03-24 | Coaxial light path structure and laser engraving equipment |
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| CN202020380845.9U CN212217443U (en) | 2020-03-24 | 2020-03-24 | Coaxial light path structure and laser engraving equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112846485A (en) * | 2020-12-31 | 2021-05-28 | 武汉华工激光工程有限责任公司 | Laser processing monitoring method and device and laser processing equipment |
| CN117900656A (en) * | 2024-03-19 | 2024-04-19 | 东莞市迪奥数控设备有限公司 | Laser engraving and milling machine and engraving and milling method |
-
2020
- 2020-03-24 CN CN202020380845.9U patent/CN212217443U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112846485A (en) * | 2020-12-31 | 2021-05-28 | 武汉华工激光工程有限责任公司 | Laser processing monitoring method and device and laser processing equipment |
| CN117900656A (en) * | 2024-03-19 | 2024-04-19 | 东莞市迪奥数控设备有限公司 | Laser engraving and milling machine and engraving and milling method |
| CN117900656B (en) * | 2024-03-19 | 2024-06-04 | 东莞市迪奥数控设备有限公司 | Laser engraving and milling machine and engraving and milling method |
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Effective date of registration: 20220726 Address after: 518000 101, building 6, Wanyan Industrial Zone, Qiaotou community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's Semiconductor Equipment Technology Co.,Ltd. Address before: 518051 Dazu laser building, 9 new West Road, North Nanshan District high tech park, Shenzhen, Guangdong Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
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