CN111014977A - Femtosecond laser cutting device and method for SMT laser steel mesh - Google Patents
Femtosecond laser cutting device and method for SMT laser steel mesh Download PDFInfo
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- CN111014977A CN111014977A CN201911339710.6A CN201911339710A CN111014977A CN 111014977 A CN111014977 A CN 111014977A CN 201911339710 A CN201911339710 A CN 201911339710A CN 111014977 A CN111014977 A CN 111014977A
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- femtosecond laser
- laser beam
- scanning galvanometer
- galvanometer system
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The application discloses a femtosecond laser cutting device and method for an SMT laser steel mesh. The device comprises: the device comprises a femtosecond laser, a light shaping unit, a beam splitter, a first light path turning unit, a second light path turning unit, a first scanning galvanometer system, a second scanning galvanometer system, a first processing motion platform and a second processing motion platform; the beam splitter may split the femtosecond laser beam generated by the femtosecond laser into a first femtosecond laser beam and a second femtosecond laser beam having equal power; the first light path turning unit and the second light path turning unit are respectively used for transmitting the first femtosecond laser beam to the first scanning galvanometer system and the second scanning galvanometer system; and the first scanning galvanometer system and the second scanning galvanometer system can synchronously process the same product through the first femtosecond laser beam and the second femtosecond laser beam respectively. The method may be implemented by the apparatus. This application can realize higher cutting quality and be favorable to the environmental protection.
Description
Technical Field
The application relates to the technical field of laser processing of SMT steel meshes, in particular to a femtosecond laser cutting device and method for the SMT laser steel meshes.
Background
An SMT (Surface Mounted Technology) laser steel mesh is a printing template commonly used in the SMT industry; the conventional processing mode in the industry is to adopt a fiber laser to match with a focusing cutting lens and combine laser beam coaxial blowing to carry out laser processing on the SMT template; the principle of utilization is that a laser beam is focused to melt metal, and then high-pressure coaxial blowing is utilized to blow away metal slag, so that metal cutting is realized; the method has the advantages that the cutting efficiency is high, and the time for cutting one template is from several minutes to tens of minutes; however, in such a laser-cut template, burrs are formed at the cut edges and slag is formed in the cut hole walls, and therefore, it is necessary to perform a post-process burr grinding treatment and a hole wall polishing treatment. The effective polishing of the hole wall can only adopt electrochemical polishing generally, and has the factor of no environmental protection.
The above background disclosure is only for the purpose of assisting in understanding the inventive concepts and technical solutions of the present application and does not necessarily pertain to the prior art of the present application, and should not be used to assess the novelty and inventive step of the present application in the absence of explicit evidence to suggest that such matter has been disclosed at the filing date of the present application.
Disclosure of Invention
The application provides a femtosecond laser cutting device and method for an SMT laser steel mesh, which can realize higher cutting quality and are beneficial to environmental protection.
In a first aspect, the present application provides a femtosecond laser cutting apparatus for an SMT laser steel mesh, comprising: the device comprises a femtosecond laser, a light shaping unit, a beam splitter, a first light path turning unit, a second light path turning unit, a first scanning galvanometer system, a second scanning galvanometer system, a first processing motion platform and a second processing motion platform;
the femtosecond laser, the light shaping unit and the beam splitter are arranged along an optical axis;
the light shaping unit is used for shaping the femtosecond laser beam generated by the femtosecond laser;
the beam splitter may split the femtosecond laser beam generated by the femtosecond laser into a first femtosecond laser beam and a second femtosecond laser beam having equal power;
the first light path turning unit is used for transmitting the first femtosecond laser beam to the first scanning galvanometer system;
the second light path turning unit is used for transmitting the second femtosecond laser beam to the second scanning galvanometer system;
the first processing motion platform and the second processing motion platform are used for station replacement and loading and unloading of products;
and the first scanning galvanometer system and the second scanning galvanometer system can synchronously process the same product through the first femtosecond laser beam and the second femtosecond laser beam respectively.
In some preferred embodiments, the beam splitter may cause the power of the first femtosecond laser beam and the second femtosecond laser beam to differ by no more than 1%.
In some preferred embodiments, the first light path-deflecting unit and the second light path-deflecting unit each include one or more mirrors.
In some preferred embodiments, the first machining motion platform and the second machining motion platform are both planar two-dimensional motion platforms.
In some preferred embodiments, the light shaping unit is a beam expander.
In some preferred embodiments, the beam expansion factor of the light shaping unit is 3 to 5 times.
In some preferred embodiments, the femtosecond laser has a single pulse energy of 200-300 uJ.
In some preferred embodiments, the laser wavelength of the femtosecond laser is 1030 nm.
In some preferred embodiments, the femtosecond laser has a power of 100W.
In some preferred embodiments, the beam splitter may split the femtosecond laser beam generated by the femtosecond laser into a plurality of first femtosecond laser beams and a plurality of second femtosecond laser beams having equal power; the first light path turning unit, the second light path turning unit, the first scanning galvanometer system, the second scanning galvanometer system, the first processing motion platform and the second processing motion platform are all in a plurality.
In a second aspect, the present application provides a femtosecond laser cutting method for an SMT laser steel mesh, including:
generating a beam of femtosecond laser;
shaping the beam of femtosecond laser to obtain a shaped femtosecond laser;
dividing the shaped femtosecond laser into a first femtosecond laser beam and a second femtosecond laser beam with equal power;
respectively transmitting the first femtosecond laser beam and the second femtosecond laser beam to a first scanning galvanometer system and a second scanning galvanometer system so that the first scanning galvanometer system and the second scanning galvanometer system synchronously process the same product through the first femtosecond laser beam and the second femtosecond laser beam respectively;
and performing station replacement and loading and unloading on the product by adopting multiple stations.
In some preferred embodiments, the one femtosecond laser beam is shaped to obtain a shaped femtosecond laser beam, specifically: and performing beam expansion and divergence angle debugging on the beam of femtosecond laser to obtain the beam expanded femtosecond laser.
In some preferred embodiments, the power of the first femtosecond laser beam and the second femtosecond laser beam differ by no more than 1%.
In some preferred embodiments, the first femtosecond laser beam and the second femtosecond laser beam are each plural in number; the number of the first scanning galvanometer system and the second scanning galvanometer system is multiple.
In some preferred embodiments, said synchronizing the processing of the same product is in particular: and synchronously carrying out pattern splicing processing on the same product.
In a third aspect, the present application provides a computer readable storage medium having stored therein program instructions which, when executed by a processor of a computer, cause the processor to perform the above-described method.
Compared with the prior art, the beneficial effects of the embodiment of the application are as follows:
adopt the femto second laser of high pulse energy, produce multi beam femto second laser after plastic and beam split, get into a plurality of scanning mirror system that shakes respectively after the light path is turned over, use a plurality of scanning mirror system that shakes to process the steel sheet of SMT steel mesh through the mode of scanning cutting many times, characteristics through femto second laser high pulse energy and ultrashort pulse width clear away metal material plasmatization, the switching mode of cooperation a plurality of stations produces the processing, can realize with the equal cutting efficiency of optic fibre laser cutting SMT laser steel mesh, and can reduce subsequent polishing and polishing production processes. The SMT laser steel mesh which is cut by adopting a mode of femtosecond laser scanning for multiple times has no metal burrs at the edge of a cutting hole, has small hole wall roughness, does not need burr grinding treatment and hole wall polishing treatment, and is favorable for environmental protection. The embodiment of the application can meet the production and application requirements of the high-end SMT laser steel mesh and can realize higher cutting quality.
Drawings
Fig. 1 is a schematic structural view of a femtosecond laser cutting apparatus for an SMT laser steel mesh according to an embodiment of the present application;
FIG. 2 is a schematic flowchart illustrating a femtosecond laser cutting method for an SMT laser steel mesh according to an embodiment of the present application;
fig. 3 shows that the femtosecond laser cutting device for the SMT laser steel mesh performs splicing synchronous processing on the patterns according to an embodiment of the present application.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the embodiments of the present application more clearly apparent, the present application is further described in detail below with reference to fig. 1 to 3 and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element. The connection may be for fixation or for circuit connection.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description of the embodiments and simplifying the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present application, "a plurality" means two or more unless specifically defined otherwise.
The embodiment provides a femto second laser cutting device of SMT laser steel mesh, includes: the device comprises a femtosecond laser 1, a light shaping unit 2, a beam splitter 3, a first light path turning unit 20, a second light path turning unit 6, a first scanning galvanometer system 7, a second scanning galvanometer system 8, a first processing motion platform 9 and a second processing motion platform 10.
In the present embodiment, the femtosecond laser 1, the light shaping unit 2, and the beam splitter 3 are arranged in this order along the optical axis.
The femtosecond laser 1 is a laser generating source for generating high-peak power narrow-pulse width laser; wherein, the laser power is preferably 100W, the single pulse energy is preferably 200-.
The light shaping unit 2 is used to shape the femtosecond laser beam generated by the femtosecond laser 1. In the present embodiment, the light shaping unit 2 is a beam expander; the beam expander 2 is used for expanding the femtosecond laser beam emitted from the femtosecond laser 1 and adjusting the divergence angle of the laser beam, and the beam expander with the beam expansion multiple of 3-5 times can be selected.
The beam splitter 3 can split the femtosecond laser beam generated by the femtosecond laser 1 into two first femtosecond laser beams a and second femtosecond laser beams B with equal power; that is, the femtosecond laser beam is divided into two. The beam splitting ratio of the beam splitter 3 is 1: 1, namely the output power of two split beams of laser, namely a first femtosecond laser beam A and a second femtosecond laser beam B, is equal, and the error cannot exceed 1%.
The first light path turning unit 20 serves to propagate the first femtosecond laser beam a to the first galvanometer system 7. In the present embodiment, the first optical path deflecting unit 20 includes a first reflecting mirror 4 and a second reflecting mirror 5, and can perform optical path deflection on the first femtosecond laser beam a, thereby deflecting and reflecting the first femtosecond laser beam a to the light inlet of the first galvanometer scanner system 7; the first reflecting mirror 4 and the second reflecting mirror 5 are both mirrors having a 45-degree reflecting function.
The second optical path turning unit 6 is configured to propagate the second femtosecond laser beam B to the second scanning galvanometer system 8. In this embodiment, the second optical path turning unit 6 is a reflecting mirror, and can perform optical path turning on the second femtosecond laser beam B, so as to turn and reflect the second femtosecond laser beam B to the light inlet of the second scanning galvanometer system 8; the second light path turning unit 6 is a mirror with a 45-degree reflection function.
In other embodiments, the first light path-bending unit 20 and the second light path-bending unit 6 each include a plurality of mirrors.
The first processing motion platform 9 and the second processing motion platform 10 are used for station replacement and loading and unloading of products. The product refers to SMT steel mesh. The first processing motion platform 9 and the second processing motion platform 10 are bearing platforms for placing SMT steel meshes; the first processing motion platform 9 and the second processing motion platform 10 are both provided with an SMT steel mesh clamping jig, and the size range in which the SMT steel mesh can be placed is 370-736 mm.
The first movement axis Y1 and the second movement axis Y2 are two movement axes in the horizontal direction. The first machining motion platform 9 is mounted and fixed on the first motion axis Y1 so as to perform controllable motion; the second processing motion platform 10 is mounted and fixed on the second motion axis Y2 so as to perform controllable motion. Wherein, the motion strokes of the first motion shaft Y1 and the second motion shaft Y2 are both 0-800 mm.
The third movement axis X is a movement axis in the vertical direction, that is, a movement axis perpendicular to the horizontal direction. The first movement axis Y1 and the second movement axis Y2 are fixed on the third movement axis X, so that the movement of the first processing movement platform 9 and the second processing movement platform 10 in the vertical direction can be realized, and further, the station replacement and the loading and unloading of the product can be realized. The range of the motion stroke of the third motion axis X is 0 to 1600 mm.
In this way, the first machining motion platform 9 and the second machining motion platform 10 can both perform two-dimensional motion on a plane, that is, the first machining motion platform 9 and the second machining motion platform 10 are both planar two-dimensional motion platforms. In other embodiments, the first machining motion platform 9 and the second machining motion platform 10 are three-dimensional motion platforms that are movable in space along three axes.
The first scanning galvanometer system 7 and the second scanning galvanometer system 8 both adopt scanning galvanometer systems in the prior art; the scanning galvanometer system is used for enabling the laser beams to form two-dimensional plane track scanning movement, and moving processing is carried out after focusing is carried out to form a focusing point. The first scanning galvanometer system 7 and the second scanning galvanometer system 8 realize plane track motion and realize the motion track splicing function of the two scanning galvanometers through a motion control card. In the present embodiment, the first galvanometer scanning system 7 and the second galvanometer scanning system 8 comprise high-speed drilling function galvanometers with incident light diameter of 8mm and scanning speed of 1-5mm/s, and comprise telecentric lenses with scanning range of 100mm x 100 mm.
The first femtosecond laser beam A and the second femtosecond laser beam B respectively enter the scanning galvanometer entrance hole of the first scanning galvanometer system 7 and the scanning galvanometer entrance hole of the second scanning galvanometer system 8. The first galvanometer scanning system 7 and the second galvanometer scanning system 8 are mounted in parallel. In this way, the first scanning galvanometer system 7 and the second scanning galvanometer system 8 can process the same product synchronously by the first femtosecond laser beam a and the second femtosecond laser beam B, respectively.
The present embodiment will be described with reference to the femtosecond laser cutting method of the SMT laser steel mesh of this embodiment, that is, the laser processing method of the SMT laser steel mesh. The femtosecond laser cutting method for the SMT laser steel mesh of the present embodiment can be implemented by the femtosecond laser cutting device for the SMT laser steel mesh of the present embodiment. The femtosecond laser cutting method for the SMT laser steel mesh of this embodiment includes steps S1 to S5.
And step S1, generating a beam of femtosecond laser.
Specifically, a femtosecond laser 1 generates a beam of femtosecond laser.
And step S2, shaping one beam of femtosecond laser to obtain the shaped femtosecond laser.
The femtosecond laser generated by the femtosecond laser 1 is shaped by the light shaping unit 2 and then changed into a shaped femtosecond laser. In this embodiment, the beam expansion and the adjustment of the divergence angle of the femtosecond laser generated by the femtosecond laser 1 are specifically performed by the light shaping unit 2, so as to obtain the expanded femtosecond laser.
Step S3, dividing the shaped femtosecond laser into a first femtosecond laser beam a and a second femtosecond laser beam B having equal power.
The shaped femtosecond laser beam passes through the beam splitter 3 and then becomes a first femtosecond laser beam a and a second femtosecond laser beam B having equal power.
And step 4, transmitting the first femtosecond laser beam A and the second femtosecond laser beam B to the first scanning galvanometer system 7 and the second scanning galvanometer system 8 respectively, so that the first scanning galvanometer system 7 and the second scanning galvanometer system 8 can process the same product synchronously through the first femtosecond laser beam A and the second femtosecond laser beam B respectively.
The first femtosecond laser beam a and the second femtosecond laser beam B are respectively propagated to the first light path bending unit 20 and the second light path bending unit 6, and then are respectively propagated to the first scanning galvanometer system 7 and the second scanning galvanometer system 8. The first femtosecond laser beam A and the second femtosecond laser beam B are respectively scanned and focused by the first scanning galvanometer system 7 and the second scanning galvanometer system 8 to form focusing points. The two scanning galvanometer systems are installed in parallel, and the same product can be processed through the motion control card, in particular to splicing and processing of patterns on the same product.
The present embodiment is explained by way of an example. The SMT steel mesh 11 is an actually processed product. The stitched pattern 12 is an example of a pattern listed, and "E" in the pattern "EFG" is processed by the first scanning galvanometer system 7, "G" is processed by the second scanning galvanometer system 8, and "F" is stitched under the editing control of the control software by the first scanning galvanometer system 7 and the second scanning galvanometer system 8 together. Therefore, the pattern splicing processing of the same product can be synchronously realized.
And step S5, performing station replacement and loading and unloading on the product by adopting multiple stations.
Through the motion platform with the multi-station function, alternate machining of two SMT steel meshes can be achieved, and waiting time for feeding and discharging is reduced. The motion platforms with multi-station function are a first processing motion platform 9 and a second processing motion platform 10. The first processing motion platform 9 and the second processing motion platform 10 move the stations through one Y-direction motion axis and two X-direction motion axes, and move the SMT steel mesh on the stations right below the two scanning galvanometer systems for alternate switching processing.
In the present embodiment, the number of the first femtosecond laser beams a and the second femtosecond laser beams B is one; in other embodiments, the number of the first femtosecond laser beams a and the second femtosecond laser beams B may be multiple, and accordingly, the first optical path bending unit 20, the second optical path bending unit 6, the first galvanometer scanning system 7, the second galvanometer scanning system 8, the first processing motion stage 9, and the second processing motion stage 10 are also multiple.
According to the method, a single femtosecond laser is adopted, then light splitting is carried out, cutting is carried out in a double-scanning galvanometer machining head mode, and production machining is carried out in a double-station switching mode. Therefore, the double-scanning galvanometer system and the double-station mode can realize the same cutting efficiency as the SMT laser steel mesh cutting by the optical fiber laser, and can reduce subsequent grinding and polishing production procedures. The SMT laser steel mesh which is cut by adopting a femtosecond laser multi-scanning mode has no metal burrs at the edge of a cut hole, small hole wall roughness and no need of burr grinding treatment and hole wall polishing treatment. The embodiment can meet the production and application requirements of the high-end SMT laser steel mesh and can realize higher cutting quality.
Those skilled in the art will appreciate that all or part of the processes of the embodiments methods may be performed by a computer program, which may be stored in a computer-readable storage medium and executed to perform the processes of the embodiments methods. And the aforementioned storage medium includes: various media capable of storing program codes, such as ROM or RAM, magnetic or optical disks, etc.
The foregoing is a further detailed description of the present application in connection with specific/preferred embodiments and is not intended to limit the present application to that particular description. For a person skilled in the art to which the present application pertains, several alternatives or modifications to the described embodiments may be made without departing from the concept of the present application, and these alternatives or modifications should be considered as falling within the scope of the present application.
Claims (10)
1. The utility model provides a femto second laser cutting device of SMT laser steel mesh which characterized in that includes: the device comprises a femtosecond laser, a light shaping unit, a beam splitter, a first light path turning unit, a second light path turning unit, a first scanning galvanometer system, a second scanning galvanometer system, a first processing motion platform and a second processing motion platform;
the femtosecond laser, the light shaping unit and the beam splitter are arranged along an optical axis;
the light shaping unit is used for shaping the femtosecond laser beam generated by the femtosecond laser;
the beam splitter may split the femtosecond laser beam generated by the femtosecond laser into a first femtosecond laser beam and a second femtosecond laser beam having equal power;
the first light path turning unit is used for transmitting the first femtosecond laser beam to the first scanning galvanometer system;
the second light path turning unit is used for transmitting the second femtosecond laser beam to the second scanning galvanometer system;
the first processing motion platform and the second processing motion platform are used for station replacement and loading and unloading of products;
and the first scanning galvanometer system and the second scanning galvanometer system can synchronously process the same product through the first femtosecond laser beam and the second femtosecond laser beam respectively.
2. The apparatus of claim 1, wherein: the beam splitter may cause the power of the first femtosecond laser beam and the second femtosecond laser beam to differ by no more than 1%.
3. The apparatus of claim 1, wherein: the light shaping unit is a beam expander.
4. The apparatus of claim 1, wherein: the beam splitter may split the femtosecond laser beam generated by the femtosecond laser into a plurality of first femtosecond laser beams and a plurality of second femtosecond laser beams having equal power; the first light path turning unit, the second light path turning unit, the first scanning galvanometer system, the second scanning galvanometer system, the first processing motion platform and the second processing motion platform are all in a plurality.
5. A femtosecond laser cutting method for an SMT laser steel mesh is characterized by comprising the following steps:
generating a beam of femtosecond laser;
shaping the beam of femtosecond laser to obtain a shaped femtosecond laser;
dividing the shaped femtosecond laser into a first femtosecond laser beam and a second femtosecond laser beam with equal power;
respectively transmitting the first femtosecond laser beam and the second femtosecond laser beam to a first scanning galvanometer system and a second scanning galvanometer system so that the first scanning galvanometer system and the second scanning galvanometer system synchronously process the same product through the first femtosecond laser beam and the second femtosecond laser beam respectively;
and performing station replacement and loading and unloading on the product by adopting multiple stations.
6. The method according to claim 5, wherein the shaping of the beam of femtosecond laser light to obtain a shaped femtosecond laser light comprises: and performing beam expansion and divergence angle debugging on the beam of femtosecond laser to obtain the beam expanded femtosecond laser.
7. The method of claim 5, further comprising: the power of the first femtosecond laser beam and the second femtosecond laser beam differ by no more than 1%.
8. The method of claim 5, further comprising: the first femtosecond laser beam and the second femtosecond laser beam are both multiple in number; the number of the first scanning galvanometer system and the second scanning galvanometer system is multiple.
9. The method according to claim 5, wherein said synchronizing the processing of the same product is in particular: and synchronously carrying out pattern splicing processing on the same product.
10. A computer-readable storage medium characterized by: the computer-readable storage medium has stored therein program instructions which, when executed by a processor of a computer, cause the processor to carry out the method according to any one of claims 5 to 9.
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| CN201911339710.6A CN111014977A (en) | 2019-12-23 | 2019-12-23 | Femtosecond laser cutting device and method for SMT laser steel mesh |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113146031A (en) * | 2021-04-19 | 2021-07-23 | 武汉理工大学 | Scanning microscopic ultrafast laser processing system based on dynamic field of view concatenation |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113146031A (en) * | 2021-04-19 | 2021-07-23 | 武汉理工大学 | Scanning microscopic ultrafast laser processing system based on dynamic field of view concatenation |
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