CN112975158A - Transverse cutting method and system for transparent brittle material - Google Patents
Transverse cutting method and system for transparent brittle material Download PDFInfo
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- CN112975158A CN112975158A CN202110240043.7A CN202110240043A CN112975158A CN 112975158 A CN112975158 A CN 112975158A CN 202110240043 A CN202110240043 A CN 202110240043A CN 112975158 A CN112975158 A CN 112975158A
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- laser
- brittle material
- cutting
- transparent brittle
- transparent
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- 239000000463 material Substances 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000007493 shaping process Methods 0.000 claims abstract description 23
- 239000011521 glass Substances 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention relates to a transverse cutting method and a system for a transparent brittle material, which comprises the following steps: dividing the cutting track into N track units with the same length, wherein the projection length of each track unit in the X direction is delta X, and the projection length of each track unit in the Z direction is delta Z; generating and outputting a laser beam, wherein the laser beam is shaped into transversely distributed laser to complete the cutting of the transparent brittle material part corresponding to the previous track unit; stopping light emission, and driving the transparent brittle material to correspondingly move for a delta X distance and a delta Z distance along the X direction and the Z direction respectively; and generating and outputting the laser beam again, and shaping the laser beam into transverse distributed laser again to finish the cutting of the transparent brittle material part corresponding to the next track unit. The method has simple operation process, and can greatly improve the cutting efficiency of the transparent brittle material on the premise of ensuring the cutting quality.
Description
Technical Field
The invention relates to the field of material processing, in particular to a transverse cutting method and a transverse cutting system for a transparent brittle material.
Background
At present, for cutting and processing transparent and brittle materials such as glass, the following cutting methods exist:
1. the mechanical method comprises the following steps: mechanical cutting is carried out by tools such as a cutter, the cutting effect is extremely poor, and the cutting tool cannot be suitable for high-precision cutting;
2. laser cutting: if a general laser cutting head 100 is used for cutting, the laser cutting head 100 needs to be perpendicular to the glass 200, that is, as shown in fig. 1, a laser beam L1 forms a focal depth in the glass 200 in the longitudinal direction to form a perpendicular cutting surface, but since the laser cutting head 100 is limited by an optical element, the perpendicular cutting depth cannot reach more than 10mm, if the cutting surface needs to be an inclined surface, the glass needs to be inclined, and the laser cannot be effectively concentrated in the material, and the inclined cutting effect is poor, so the application range of the laser cutting method is limited;
if the galvanometer scanning cutting is adopted, scanning type cutting is required to be performed step by step in all directions along the three-dimensional profile of the glass by a laser scanning method, the operation is complex, and the cutting efficiency is low.
Disclosure of Invention
The invention aims to provide a transverse cutting method and a transverse cutting system for a transparent brittle material, wherein a transverse distribution laser can be formed in the Y direction (namely transverse direction) when light is emitted every time, so that the cutting of the transparent brittle material can be finished only by emitting light in the Y direction once, the operation process is simple, the processing time can be saved on the premise of ensuring the cutting quality and the cutting depth, and the cutting efficiency of the transparent brittle material is greatly improved.
In order to achieve the purpose, the invention adopts the following technical scheme:
a transverse cutting method of a transparent brittle material is provided, which comprises the following steps:
dividing a cutting track expected to be formed on the transparent brittle material into N oblique track units with the same length, wherein the projection length of each track unit in the X direction is delta X, and the projection length of each track unit in the Z direction is delta Z;
generating and outputting laser beams, and forming transverse distributed lasers which are distributed along the Y direction and focused in the transparent brittle material after the laser beams are expanded and shaped in sequence so as to complete the cutting of the transparent brittle material part corresponding to the previous track unit;
stopping light emission, and driving the transparent brittle material to correspondingly move for a delta X distance and a delta Z distance along the X direction and the Z direction respectively;
and generating and outputting a laser beam again, and forming transversely distributed lasers which are distributed along the Y direction and focused in the transparent brittle material after beam expanding and beam shaping of the laser beam again so as to complete cutting of the transparent brittle material part corresponding to the next track unit.
Preferably, the transparent brittle material comprises glass or sapphire.
Preferably, each of the diagonal track elements has a length of 10-50 μm.
Preferably, the laterally distributed laser is a stripe beam or a dotted beam formed by a plurality of laser spots.
There is also provided a transparent brittle material cutting apparatus for implementing the above-described transverse cutting method, comprising:
a laser for generating and outputting a laser beam;
the beam expander is used for adjusting the laser spot size and the divergence angle;
the beam shaping system is used for shaping the laser beam expanded by the beam expander into transversely distributed laser which is distributed along the Y direction and focused in the transparent brittle material;
the moving platform is used for driving the transparent brittle material to move upwards at X, Z;
the control system is connected with the laser and the mobile platform and is used for controlling the laser to stop emitting light after the transverse distributed laser finishes cutting of the transparent brittle material part corresponding to the previous track unit; then controlling the mobile platform to correspondingly move delta X distance and delta Z distance along the X direction and the Z direction respectively; and then controlling the laser to continuously emit light, and finishing the cutting of the transparent brittle material part corresponding to the next track unit by transversely distributing laser.
Preferably, the light-emitting frequency of the laser is 100 Khz-6.25 Mhz.
Preferably, the beam shaping system comprises:
the beam shaping unit is used for shaping the laser beam expanded by the beam expander into transverse distributed laser distributed along the Y direction;
and a focusing unit for focusing the laterally distributed laser light inside the transparent brittle material.
Preferably, the beam shaping unit includes one or more of a cylindrical lens, a diffractive optical element, and a spatial modulator.
Preferably, the control system is connected with the laser and the mobile platform through a wireless communication module.
Preferably, the control system comprises an intelligent mobile terminal.
The invention has at least the following beneficial effects:
according to the invention, the cutting track in the XZ plane is microscopically divided into N track units, the laser is controlled to emit light at intervals, a piece of transversely distributed laser can be formed in the Y direction every time when the laser emits light, and the cutting of the corresponding part of one track unit is correspondingly completed, so that for each track unit, the cutting of the transparent brittle material can be completed only by emitting light in the Y direction once, repeated light emission in the Z direction for multiple times as in vibrating mirror scanning cutting is not needed, meanwhile, the material does not need to be inclined before laser cutting, the material does not need to be moved during laser cutting, the operation process is simple, the processing time can be greatly reduced on the premise of ensuring the cutting quality and the cutting depth, and the cutting efficiency of the transparent brittle material is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a laser beam cutting a transparent brittle material vertically in the prior art;
FIG. 2 is a schematic view of an XZ plane of the present invention with the entire cutting track broken away X, Z and with segmented laser cutting performed in track units;
FIG. 3 is a schematic view of the present invention for making a transverse cut through a transparent brittle material;
FIG. 4 is a schematic structural diagram of a cutting apparatus for cutting transparent brittle materials according to the present invention;
FIG. 5 is a schematic illustration of different types of laterally distributed laser light;
FIG. 6 is a diagram illustrating the effect of the present invention after cutting the transparent brittle material;
fig. 7 is a schematic structural diagram of a beam shaping system according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1:
the present embodiment provides a method for transversely cutting a transparent brittle material, as shown in fig. 2-4, which comprises the following steps:
s1, dividing the cutting track P expected to be formed on the transparent brittle material 300 into N track units P1 with the same length on the XZ plane, wherein each track unit P1 is connected in sequence, and the projection length of each track unit P1 in the X direction is Δ X, the projection length in the Z direction is Δ Z, so that the projection length of the whole cutting track P in the X direction is N × Δ X, the projection length in the Z direction is N Δ Z, and N is a positive integer greater than or equal to 2; wherein, the transparent brittle material 300 comprises glass or sapphire, etc., and the length of each track unit P1 can be determined according to the thickness of the transparent brittle material 300 to be cut, and is generally 10-50 μm;
meanwhile, the cutting trajectory P may be a regular oblique line trajectory (as shown in fig. 2) or an irregular trajectory which is not overlapped with the direction X, Z, or may also be a vertical trajectory which is overlapped only with the direction Z, and at this time, the corresponding Δ X is 0;
s2, starting a laser, generating and outputting a laser beam L, and after beam expansion and beam shaping of the laser beam L in sequence, forming a transversely distributed laser L 'distributed along the Y direction and focused inside the transparent brittle material 300, further, processing the transversely distributed laser L' inside the transparent brittle material 300 to complete cutting of the transparent brittle material 300 portion corresponding to the previous track unit P1; in this embodiment, as shown in fig. 5, the laterally distributed laser L' may be a strip beam with a length of 5-20mm (preferably 10 mm), or may be a dotted beam formed by a plurality of laser spots with a diameter of 2-10 μm; meanwhile, since the transversely distributed laser L 'is focused inside the transparent brittle material 300 and has energy impact on the surrounding environment, on the premise that the length of the track unit P1 is very small, when the transversely distributed laser L' is processed inside the transparent brittle material 300, the transparent brittle material 300 does not need to be moved, the surrounding environment at the focused point is completely acted with the laser, such as cracks and the like, and the cutting of the corresponding part of the track unit P1 is considered to be completed, so that the transparent brittle material 300 does not need to be moved when the corresponding part of each track unit P1 is cut, and the transparent brittle material 300 does not need to be inclined;
s3, controlling the laser to stop emitting light, and driving the transparent brittle material 300 to correspondingly move by a delta X distance and a delta Z distance along the X direction and the Z direction respectively;
s4, starting the laser again, generating and outputting a laser beam L, and after beam expanding and beam shaping of the laser beam L in sequence again, forming a transversely distributed laser L 'which is distributed along the Y direction and focused inside the transparent brittle material 300, wherein the transversely distributed laser L' is processed inside the transparent brittle material 300 to complete cutting of the portion of the transparent brittle material 300 corresponding to the next track unit P1;
s5, repeating steps S3-S4 to complete the cutting of the transparent brittle material 300 along the whole cutting trajectory P, the cutting effect is shown in fig. 6.
Example 2:
the present embodiment provides a transparent brittle material cutting apparatus for implementing the transverse cutting method described in embodiment 1, as shown in fig. 4, which includes:
a laser 1 for generating and outputting a laser beam L; in the embodiment, the light emitting frequency of the laser 1 is 100Khz to 6.25 Mhz;
a beam expander 2 for adjusting the laser spot size and the divergence angle;
a beam shaping system 3 for shaping the laser beam L expanded by the beam expander 2 into transversely distributed laser beams L' distributed along the Y direction and focused inside the transparent brittle material 300;
the moving platform 4 is used for driving the transparent brittle material 300 to move upwards at X, Z;
the control system is connected with the laser 1 and the mobile platform 4 through a wireless communication module (such as a Wifi, 4G/5G communication module, etc.), and is used for controlling the laser 1 to stop emitting light after the transversely distributed laser L' finishes cutting the part of the transparent brittle material 300 corresponding to the previous track unit P1; then the mobile platform 4 is controlled to correspondingly move delta X distance and delta Z distance along the Y direction and the Z direction respectively; then controlling the laser 1 to continuously emit light, and finishing the cutting of the part of the transparent brittle material 300 corresponding to the next track unit P1 through the transversely distributed laser L'; in this embodiment, the control system includes an intelligent mobile terminal such as a smart phone, a tablet computer, and a desktop computer, so as to perform remote intelligent control.
Example 3:
the present embodiment differs from embodiment 2 only in that, as shown in fig. 7, the beam shaping system 3 includes:
a beam shaping unit 8, configured to shape the laser beam L expanded by the beam expander 2 into laterally distributed laser beams L' distributed along the X direction, in this embodiment, the beam shaping unit 8 includes one or more of a cylindrical lens, a DOE (diffractive Optical Element), a spatial modulator, and the like;
and a focusing unit 9 for focusing the laterally distributed laser light L' inside the transparent brittle material 300.
In summary, the cutting track in the XZ plane is microscopically divided into N track units, the laser is controlled to emit light at intervals, a piece of transversely distributed laser can be formed in the Y direction each time the laser emits light, and the cutting of the corresponding part of one track unit is correspondingly completed, so that for each track unit, the cutting of the transparent brittle material can be completed only by emitting light in the Y direction once, repeated light emission in the Z direction as in galvanometer scanning cutting is not needed, meanwhile, the material does not need to be inclined before laser cutting, the material does not need to be moved during laser cutting, the operation process is simple, the processing time can be greatly reduced on the premise that the cutting quality and the cutting depth (when the cutting track is a vertical track coincident with the Z direction, the cutting depth can be more than or equal to 10 mm), and the cutting efficiency of the transparent brittle material is improved.
It should be noted that the technical features of the above embodiments 1 to 3 can be arbitrarily combined, and the technical solutions obtained by combining the technical features belong to the scope of the present application.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A transverse cutting method of a transparent brittle material is characterized by comprising the following steps:
dividing a cutting track expected to be formed on the transparent brittle material into N oblique track units with the same length, wherein the projection length of each track unit in the X direction is delta X, and the projection length of each track unit in the Z direction is delta Z;
generating and outputting laser beams, and forming transverse distributed lasers which are distributed along the Y direction and focused in the transparent brittle material after the laser beams are expanded and shaped in sequence so as to complete the cutting of the transparent brittle material part corresponding to the previous track unit;
stopping light emission, and driving the transparent brittle material to correspondingly move for a delta X distance and a delta Z distance along the X direction and the Z direction respectively;
and generating and outputting a laser beam again, and forming transversely distributed lasers which are distributed along the Y direction and focused in the transparent brittle material after beam expanding and beam shaping of the laser beam again so as to complete cutting of the transparent brittle material part corresponding to the next track unit.
2. The transverse cutting method according to claim 1, wherein the transparent brittle material comprises glass or sapphire.
3. The cross-cutting method of claim 1, wherein each of the diagonal track elements has a length of 10-50 μm.
4. The cross-cutting method of claim 1, wherein the cross-distributed laser is a bar beam or a dotted beam formed by a plurality of laser spots.
5. A transparent brittle material cutting apparatus for carrying out the transverse cutting method according to any one of claims 1 to 4, characterized by comprising:
a laser for generating and outputting a laser beam;
the beam expander is used for adjusting the laser spot size and the divergence angle;
the beam shaping system is used for shaping the laser beam expanded by the beam expander into transversely distributed laser which is distributed along the Y direction and focused in the transparent brittle material;
the moving platform is used for driving the transparent brittle material to move upwards at X, Z;
the control system is connected with the laser and the mobile platform and is used for controlling the laser to stop emitting light after the transverse distributed laser finishes cutting of the transparent brittle material part corresponding to the previous track unit; then controlling the mobile platform to correspondingly move delta X distance and delta Z distance along the X direction and the Z direction respectively; and then controlling the laser to continuously emit light, and finishing the cutting of the transparent brittle material part corresponding to the next track unit by transversely distributing laser.
6. The apparatus for cutting transparent brittle material as claimed in claim 5, wherein the laser has an output frequency of 100Khz to 6.25 Mhz.
7. The transparent brittle material cutting apparatus as claimed in claim 5, wherein the beam shaping system comprises:
the beam shaping unit is used for shaping the laser beam expanded by the beam expander into transverse distributed laser distributed along the Y direction;
and a focusing unit for focusing the laterally distributed laser light inside the transparent brittle material.
8. The apparatus for cutting transparent brittle material as claimed in claim 7, characterized in that the beam shaping unit comprises one or more of a cylindrical lens, a diffractive optical element, a spatial modulator.
9. The apparatus according to claim 7, wherein the control system is connected to the laser and the movable platform via a wireless communication module.
10. The transparent brittle material cutting apparatus according to claim 7, wherein the control system comprises a smart mobile terminal.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110240043.7A CN112975158A (en) | 2021-03-04 | 2021-03-04 | Transverse cutting method and system for transparent brittle material |
| PCT/CN2021/108528 WO2022183668A1 (en) | 2021-03-04 | 2021-07-27 | Transversal cutting method and system for transparent brittle material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110240043.7A CN112975158A (en) | 2021-03-04 | 2021-03-04 | Transverse cutting method and system for transparent brittle material |
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| CN112975158A true CN112975158A (en) | 2021-06-18 |
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| CN202110240043.7A Pending CN112975158A (en) | 2021-03-04 | 2021-03-04 | Transverse cutting method and system for transparent brittle material |
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| WO (1) | WO2022183668A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022183668A1 (en) * | 2021-03-04 | 2022-09-09 | 武汉华工激光工程有限责任公司 | Transversal cutting method and system for transparent brittle material |
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2021
- 2021-03-04 CN CN202110240043.7A patent/CN112975158A/en active Pending
- 2021-07-27 WO PCT/CN2021/108528 patent/WO2022183668A1/en active Application Filing
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| WO2022183668A1 (en) | 2022-09-09 |
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Application publication date: 20210618 |