TW201722605A - Laser cutting method of brittle material, and laser cutter to reduce the temperature difference between the focused point and the surroundings of the processed material resulted from the over-concentrated distribution of laser beam energy - Google Patents

Laser cutting method of brittle material, and laser cutter to reduce the temperature difference between the focused point and the surroundings of the processed material resulted from the over-concentrated distribution of laser beam energy Download PDF

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TW201722605A
TW201722605A TW104143091A TW104143091A TW201722605A TW 201722605 A TW201722605 A TW 201722605A TW 104143091 A TW104143091 A TW 104143091A TW 104143091 A TW104143091 A TW 104143091A TW 201722605 A TW201722605 A TW 201722605A
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laser beam
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TWI715548B (en
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Zhou-Zheng Qiu
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Zheng Jun-Wen
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Abstract

The present invention is a laser cutting method of brittle material, especially a laser cutting method to reduce the occurrences of edge collapse phenomenon of brittle material, which is mainly to use a polarized optical element in the optical system of laser cutter to proceed with beam shaping modification to the laser light source. By the beam shaping modification method, the laser beam with Gaussian distribution is reshaped into a laser beam with Bessel distribution. Its effect is to reduce the temperature difference between the focused point and the surroundings of the processed material resulted from the over-concentrated distribution of laser beam energy, so as to reduce the edge collapse phenomenon due to thermal stress.

Description

硬脆材料的雷射切割方法及雷射切割機 Laser cutting method for hard and brittle materials and laser cutting machine

本發明係為一種硬脆材料的雷射切割方法,特別係一種降低硬脆材料發生崩邊現象的雷射切割方法。 The invention relates to a laser cutting method for hard and brittle materials, in particular to a laser cutting method for reducing the phenomenon of chipping of hard and brittle materials.

近年來雷射切割技術已經普遍的被用來切割發光二極體基板、藍寶石基板或強化玻離等硬質透明材料。 In recent years, laser cutting technology has been commonly used to cut hard transparent materials such as light-emitting diode substrates, sapphire substrates or reinforced glass.

雷射切割技術係透過雷射光聚焦於被加工材料上產生局部的熱熔破壞,被加工材料在經過雷射光的線性掃描後產生連續性的破壞割痕,再以機械裂片方式將被加工材料切割分離。 The laser cutting technology focuses on the material to be processed by laser light to produce local hot melt damage. The processed material undergoes a linear scan of the laser light to produce continuous damage marks, and then the material to be processed is cut by mechanical splitting. Separation.

雷射切割機,主要包括一雷射光源、一雷射光學系統及一線性掃描運動機構。 The laser cutting machine mainly comprises a laser light source, a laser optical system and a linear scanning motion mechanism.

其中雷射光源主要係提供一高能雷射光束,雷射光源可以是不同波長的高能雷射光源裝置(例如皮秒雷射,飛秒雷射等),雷射切割機通常還須要使用一能量控制器,用以調控雷射光束的能量大小。 The laser source mainly provides a high-energy laser beam, and the laser source can be a high-energy laser source device of different wavelengths (for example, picosecond laser, femtosecond laser, etc.), and the laser cutting machine usually needs to use an energy. A controller for regulating the energy of the laser beam.

其中雷射光學系統主要係調控雷射光束成可加工的高能雷射光點,其透過包括複數光學透鏡或元件等的雷射光束調控模組將雷射光源的雷射光束調控成可以聚焦於被加工物表面的高能雷射光點,其中雷射光束調控模組通常會包括有擴束鏡、反射鏡組、曲面鏡及物鏡光學元件等,其中擴束鏡係將雷射光源的雷射光束擴大成較大直徑的雷射光束,反射鏡組則用於改變雷射光束的光徑,曲面鏡及物鏡組合則調整雷射光束的焦點及其景深等聚焦效果。 The laser optical system mainly controls the laser beam into a processable high-energy laser spot, and the laser beam of the laser source is adjusted to be focused by the laser beam control module including a plurality of optical lenses or components. A high-energy laser spot on the surface of the workpiece, wherein the laser beam control module usually includes a beam expander, a mirror group, a curved mirror, and an objective optical element, wherein the beam expander expands the laser beam of the laser source In the larger diameter laser beam, the mirror group is used to change the optical path of the laser beam, and the curved mirror and the objective lens combination adjust the focus of the laser beam and its depth of field.

其中線性掃描運動機構主要係使高能聚焦的雷射光束得以線性運行於被加工物各處表面的裝置,可以是固定雷射光學系統中物鏡位置,而移動X-Y工作台上的被加工物,或者是固定工作台上的被加工物,而移動雷射光學系統中物鏡位置,移動物鏡的方法通常可以由調整雷射光束調控模組中反射鏡組的位置與角度而達成。 The linear scanning motion mechanism is mainly a device for linearly operating a high-energy focused laser beam on a surface of a workpiece, and may be a position of an objective lens in a fixed laser optical system, and moving a workpiece on the XY table, or It is the workpiece on the fixed table, and the position of the objective lens in the moving laser system can be achieved by adjusting the position and angle of the mirror group in the laser beam control module.

一般的雷射光源的光強分佈為一高斯分佈,其特徵是雷射光中心點的光強度遠高過於其周邊,雷射光源的能量極度的集中於中心點的小範圍。 The light intensity distribution of a general laser light source is a Gaussian distribution, which is characterized in that the light intensity of the laser light center point is much higher than the periphery thereof, and the energy of the laser light source is extremely concentrated in a small range of the center point.

對於具有高熱傳導性、延展性的金屬材料,進行雷射切割加工時高斯分佈的雷射光束能量集中金屬材料的被加工物上並不會在聚焦點上的材料與其周邊材料產生過度的溫度差異,因而不會發生加工材料的崩裂現象,因此可以盡量提高雷射光源的能量加快雷射切割的加工效率。 For metal materials with high thermal conductivity and ductility, the laser beam energy of the Gaussian distribution during laser cutting processing concentrates the metal material on the workpiece without excessive temperature difference between the material at the focus point and its surrounding materials. Therefore, the cracking of the processed material does not occur, so that the energy of the laser light source can be increased as much as possible to speed up the processing efficiency of the laser cutting.

對於陶瓷、玻璃或單晶等低熱傳導性又硬質的非金屬材料,能量過度集中分佈的雷射光則在聚焦點材料與其周邊材料產生相當的溫度差異,因而產生相當熱應力,其中熱應力則進而產生崩邊現象,崩邊現象則使得切割面不平整或切割面破裂,不平整或破裂切割面是習用雷射切割技術運用於硬脆非金屬材料時加工品質低劣或不穩定的原因。 For non-metallic materials with low thermal conductivity and hardness such as ceramics, glass or single crystals, the laser light with excessively concentrated energy produces a temperature difference between the focus material and its surrounding materials, thus generating considerable thermal stress, in which thermal stress is further The phenomenon of chipping occurs, and the chipping phenomenon causes the cutting surface to be uneven or the cutting surface to be broken. The uneven or broken cutting surface is the reason why the processing quality is inferior or unstable when the conventional laser cutting technology is applied to the hard and brittle non-metal materials.

對於切割非金屬材料,有些雷射切割方法是透過降低雷射光源的能量以便減少雷射破壞範圍,或以多次來回加工的方式來避免切割面不平整或破裂,雖然可以降低加工材料產生硬脆崩邊結果,但是如此一來卻明顯會降低切割加工效率。 For cutting non-metallic materials, some laser cutting methods reduce the laser damage by reducing the energy of the laser source, or avoiding unevenness or cracking of the cutting surface by multiple round-trip processing, although it can reduce the hardness of the processed material. The result of brittle collapse, but this will significantly reduce the efficiency of cutting.

為了改進習用雷射切割非金屬材料所發生的加工品質低劣或不穩定的原因,本發明提供一種雷射切割方法,特別是一種降低硬脆材料發生崩邊現象的雷射切割方法,主要係在雷射切割機的光學系統中對雷射光源進行光束整型改質,透過光束整型改質方法將高斯分佈的雷射光束改型成一貝索分怖的雷射光束,其效果可以減少雷射光束能量過度集中分佈所造成被加工材料在聚焦點與其周邊材料之間的溫度差異,降低因熱應力所產生崩邊現象。 In order to improve the processing quality of the conventional laser cutting non-metallic materials, the invention provides a laser cutting method, in particular, a laser cutting method for reducing the chipping phenomenon of hard and brittle materials, mainly in the laser cutting method. In the optical system of the laser cutting machine, the laser source is modified by beam shaping, and the Gaussian-distributed laser beam is modified into a Bezoic laser beam by the beam shaping modification method, and the effect can reduce the lightning. The excessive concentration of the beam energy causes the temperature difference between the material to be processed and the surrounding material to reduce the chipping caused by thermal stress.

本發明提供一種雷射切割機,包括一雷射光源、一雷射光束調控模組及一線性掃描運動機構,其中雷射光束調控模組中使用一偏極化光學元件,透過該偏極化元件將該雷射光束形成一偏極化雷射光束,其中該偏極化光學元件係選自一偏極化錐鏡,透過該偏極化錐鏡將高斯分佈的雷射光束轉換成光強度較均勻的偏極化貝索光束,減少雷射光束能量過度集中分佈於中心點,因而造成加工材料在聚焦點與其周邊的加工界面產生溫度差異過大的問題,因而可以降低熱應力所產生崩邊的現象,其明顯利益是不必降低切割加工的效率又可提高切割加工的品質。 The invention provides a laser cutting machine, comprising a laser light source, a laser beam control module and a linear scanning motion mechanism, wherein a polarized optical component is used in the laser beam control module, and the polarization is transmitted through the polarization The component forms the laser beam into a polarized laser beam, wherein the polarized optical component is selected from a polarization cone mirror, and the Gaussian-distributed laser beam is converted into light intensity through the polarization cone mirror The more uniform polarization Besau beam reduces the excessive concentration of the laser beam energy at the center point, thus causing the problem that the processing material is too different in temperature at the processing interface between the focus point and its periphery, thereby reducing the thermal stress caused by chipping. The obvious advantage is that it does not have to reduce the efficiency of the cutting process and improve the quality of the cutting process.

11‧‧‧雷射光源裝置 11‧‧‧Laser light source device

12‧‧‧能量控制器 12‧‧‧Energy Controller

13‧‧‧雷射光束 13‧‧‧Laser beam

21‧‧‧擴束鏡 21‧‧‧ Beam expander

211‧‧‧雷射光束 211‧‧‧Laser beam

22‧‧‧偏極化錐鏡 22‧‧‧Polarized cone mirror

221‧‧‧偏極化雷射光束 221‧‧‧Polarized laser beam

23‧‧‧反射鏡組 23‧‧‧Mirror group

24‧‧‧曲面鏡 24‧‧‧ curved mirror

25‧‧‧物鏡 25‧‧‧ Objective lens

251‧‧‧雷射聚焦光束 251‧‧‧Laser focused beam

3‧‧‧被加工物件 3‧‧‧Processed objects

圖一 係為本發明雷射切割機的光學系統的示意圖。 Figure 1 is a schematic illustration of the optical system of the laser cutting machine of the present invention.

本發明實施例中,本發明提供一種雷射切割方法,其係使用包括下列裝置進行雷射切割程序:提供一雷射光源,及其光束的能量控制器;提供一雷射光學系統,其包括有擴束鏡、反射鏡組、曲面鏡及物鏡等光學元件的光束調控模組;以及提供一線性掃描運動機構,雷射切割程序中利用線性掃描運動機構,將該光學系統所產生的聚焦雷射光束循序掃描聚焦於被加工物表面上;其中光束調控模組中使用至少一偏極化錐鏡,透過該偏極化錐鏡將高斯分佈的雷射光束改型成一貝索分怖的雷射光束,同時將該雷射光束偏極化。 In an embodiment of the present invention, the present invention provides a laser cutting method using a laser cutting program comprising: providing a laser light source and an energy controller thereof; and providing a laser optical system including a beam steering module having optical components such as a beam expander, a mirror group, a curved mirror, and an objective lens; and a linear scanning motion mechanism for utilizing a linear scanning motion mechanism in the laser cutting program to generate a focused beam of the optical system The beam is sequentially scanned and focused on the surface of the workpiece; wherein the beam steering module uses at least one deflecting cone mirror, and the Gaussian-distributed laser beam is transformed into a Besso-distributed thunder through the polarizing cone mirror The beam is beamed while the laser beam is polarized.

實施例中,本發明提供一種雷射切割機的光學系統,其包括一雷射光源及一雷射光束調控模組;其中雷射光源包括雷射光源裝置,及其雷射光束的能量控制器;其中雷射光束調控模組至少包括:一擴束鏡,其係用以擴大該雷射光束的直徑;一偏極化錐鏡,其係透過偏極化錐鏡將該雷射光束形成一偏極化雷射光束;一反射鏡組,其包括數反射鏡,係用以調控雷射光束的路徑;一曲面鏡,其係用以調整雷射光束的聚焦景深;以及一物鏡,其係用於聚焦該雷射光束,將雷射光束聚焦於被加工物件的表面上。 In an embodiment, the present invention provides an optical system for a laser cutting machine, comprising a laser light source and a laser beam control module; wherein the laser light source comprises a laser light source device, and an energy controller of the laser beam The laser beam control module includes at least: a beam expander mirror for expanding the diameter of the laser beam; and a polarization cone mirror that forms the laser beam by a polarization cone mirror a polarized laser beam; a mirror set including a number of mirrors for regulating the path of the laser beam; a curved mirror for adjusting the focused depth of field of the laser beam; and an objective lens For focusing the laser beam, focusing the laser beam onto the surface of the object being processed.

實施例中,進行雷射切割程序時使用包括下列裝置:一雷射光源,適用於切割發光二極體基板、藍寶石基板或強化玻離等硬質透明材料的雷射光源包括有皮秒雷射或飛秒雷射等,習知的波長為266nm與2000nm之間的雷射光源皆可被應用於切個割硬質透明的非金屬材料,本實施例使用波長為1064nm的飛秒雷射;一能量控制器,其係用以調控雷射光束的能量大小,雷射光束的能量大小則由切割程序的加工條件來決定;一雷射光學系統,其包括有擴束鏡、反射鏡組、偏極化錐鏡、曲面鏡及物鏡等光學元件的光束調控模組;其中擴束鏡,係利用一或複數透鏡組合以數倍增加方式將雷射光源的雷射光束擴束成較大直徑的雷射光束,較大直徑雷射光束的能量較為分散,可以避免傷害其後的光束調控光學元件;其中反射鏡組,係因應雷射切割機的空間有效利用問題要求而調整雷射光束的路徑,利用複數個反射鏡將雷射光源引導至輸出光束的物鏡上。此外,雷射光束可以耦合進入光纖,利用光纖對雷射光束進行傳輸,因此該反射鏡組亦可改由使用 光纖模組。 In an embodiment, the laser cutting process is performed using the following devices: a laser light source, and a laser source suitable for cutting a hard transparent material such as a light emitting diode substrate, a sapphire substrate or a reinforced glass, including a picosecond laser or For femtosecond lasers, conventional laser sources with wavelengths between 266 nm and 2000 nm can be applied to cut a hard transparent non-metallic material. This embodiment uses a femtosecond laser with a wavelength of 1064 nm; a controller for regulating the energy of the laser beam, the energy of the laser beam being determined by the processing conditions of the cutting program; a laser optical system comprising a beam expander, a mirror group, and a polar A beam steering module for an optical component such as a cone mirror, a curved mirror, and an objective lens; wherein the beam expander expands the laser beam of the laser source into a larger diameter mine by using a combination of one or a plurality of lenses in a multiple increase manner The beam of light, the energy of the larger diameter laser beam is more dispersed, can avoid damage to the subsequent beam-regulating optical components; wherein the mirror group is required for the space efficient use of the laser cutting machine Adjusting the path of the laser beam, the laser light beam guided to the objective lens by using a plurality of the output mirror. In addition, the laser beam can be coupled into the fiber and the laser beam can be transmitted by the fiber. Therefore, the mirror group can also be used instead. Fiber optic module.

其中偏極化錐鏡,本實施例中使用一偏極化錐鏡,其目的係透過偏極化錐鏡的錐鏡結構將高斯分佈的雷射光束改型成一貝索分怖的雷射光束以避免能量集中分佈中心點,並透過偏極化錐鏡的偏極化光學效果將該雷射光束形成一偏極化雷射光束以調控能量分佈的方式,其中偏極化雷射光束的能量高點係圍繞於光學焦點的周圍而順序移轉形成環狀分佈,其效果尤其有助於降低光學焦點的中心與周圍之間的能量吸收效果的差異,因而可以有效減少其間的熱應力;其中曲面鏡及物鏡,係利用曲面鏡與物鏡的組合可以決定雷射光束的聚焦景深,對於不同的雷射切割加工操作條件則須使用不同聚焦景深的設計,則調整曲面鏡與物鏡之間的距離以調整雷射光束的聚焦景深,物鏡則利用其聚焦功能將雷射光束聚焦於被加工物件的表面上;以及一線性掃描運動機構,藉由循序改變X座標與Y座標進行線性掃描,雷射切割程序中利用線性掃描運動機構,將該光學系統所產生的雷射光束循序掃描的聚焦於被加工物表面上,本實施例係採用將被加工物件固定於工作台上,僅線性掃描式的移動聚焦物鏡,藉由調整雷射光束調控模組中的反射鏡組的位置與角度,讓不同位置的物鏡皆能皆接到受雷射光束,因此循序移動雷射光學系統中物鏡位置可以讓雷射光束線性掃描聚焦於被加工物表面上。 In the embodiment, a polarization cone mirror is used. In this embodiment, a polarization cone mirror is used, and the purpose is to transform the Gaussian-distributed laser beam into a Besso-derived laser beam through the cone mirror structure of the polarization cone mirror. In order to avoid concentration of energy, the center point is distributed, and the laser beam is polarized by a polarization mirror to form a polarized laser beam to regulate the energy distribution, wherein the energy of the polarized laser beam is adjusted. The high point is sequentially rotated around the optical focus to form an annular distribution, and the effect thereof particularly helps to reduce the difference in energy absorption between the center and the periphery of the optical focus, thereby effectively reducing the thermal stress therebetween; Curved mirrors and objective lenses use a combination of curved mirrors and objective lenses to determine the depth of focus of the laser beam. For different laser cutting operations, different focal depths must be used to adjust the distance between the curved mirror and the objective. To adjust the focused depth of field of the laser beam, the objective lens uses its focusing function to focus the laser beam onto the surface of the object being processed; and a linear scanning motion mechanism, Linear scanning is performed by sequentially changing the X coordinate and the Y coordinate. The laser scanning mechanism uses a linear scanning motion mechanism to sequentially scan the laser beam generated by the optical system on the surface of the workpiece. This embodiment adopts The object to be processed is fixed on the workbench, and only the linear scanning type moving focusing objective lens can adjust the position and angle of the mirror group in the laser beam control module, so that the objective lenses at different positions can be received by the laser. The beam, thus moving the objective lens position in the laser system in sequence, allows the laser beam to be linearly scanned to focus on the surface of the workpiece.

請參閱圖一所示,該圖係為本發明雷射切割機的光學系統的實施例示意圖。 Referring to FIG. 1, the figure is a schematic diagram of an embodiment of an optical system of the laser cutting machine of the present invention.

本發明雷射切割機的光學系統係包括一雷射光源及一雷射光束調控模組,其中雷射光源包括一雷射光源裝置11及其能量控制器12,本實施例的雷射光源裝置11使用波長為1064nm的飛秒雷射,其雷射光源經過能量控制器12輸出一雷射光束13。 The optical system of the laser cutting machine of the present invention comprises a laser light source and a laser beam control module, wherein the laser light source comprises a laser light source device 11 and an energy controller 12 thereof, and the laser light source device of the embodiment 11 uses a femtosecond laser having a wavelength of 1064 nm, the laser source of which outputs a laser beam 13 through the energy controller 12.

其中雷射光束調控模組係利用複數光學透鏡或光學元件所組成,其中雷射光束調控模組2至少包括:一擴束鏡21,其係用以擴大該雷射光束13的直徑,雷射光束13透過擴束鏡21形成雷射光束211,雷射光束211的光束直徑較大於雷射光束13;一偏極化錐鏡22,其係透過偏極化錐鏡22將該雷射光束211形成一偏極化雷射光束221;一反射鏡組23,其係因應雷射切割機的空間利用要求而調整雷射光束的路徑,利用複數個反射鏡將偏極化雷射光束221引導至輸出光束的物鏡上,此外因應雷射切割機的空間設計需求,在擴束鏡21與偏極化錐鏡22之間亦可安排反射鏡組 23來改變雷射光束的路徑;以及一曲面鏡24及一物鏡25,其組合係用以調整雷射輸出光束的焦距及聚焦景深,其中物鏡25將偏極化雷射光束221聚焦成雷射聚焦光束251,並且聚焦於被加工物件3的表面上。 The laser beam control module is composed of a plurality of optical lenses or optical components, wherein the laser beam control module 2 includes at least: a beam expanding mirror 21 for expanding the diameter of the laser beam 13 and the laser The beam 13 is formed by the beam expander 21 to form a laser beam 211 having a larger beam diameter than the laser beam 13; a deflecting cone 22 that transmits the laser beam 211 through the deflecting cone 22 Forming a polarization laser beam 221; a mirror group 23, which adjusts the path of the laser beam according to the space utilization requirements of the laser cutter, and uses a plurality of mirrors to guide the polarization laser beam 221 to On the objective lens of the output beam, in addition to the spatial design requirements of the laser cutting machine, a mirror group can also be arranged between the beam expander 21 and the deflecting cone 22 23 to change the path of the laser beam; and a curved mirror 24 and an objective lens 25, the combination of which is used to adjust the focal length and focus depth of the laser output beam, wherein the objective lens 25 focuses the polarized laser beam 221 into a laser The light beam 251 is focused and focused on the surface of the object 3 to be processed.

11‧‧‧雷射光源裝置 11‧‧‧Laser light source device

12‧‧‧能量控制器 12‧‧‧Energy Controller

13‧‧‧雷射光束 13‧‧‧Laser beam

21‧‧‧擴束鏡 21‧‧‧ Beam expander

211‧‧‧雷射光束 211‧‧‧Laser beam

22‧‧‧偏極化錐鏡 22‧‧‧Polarized cone mirror

221‧‧‧偏極化雷射光束 221‧‧‧Polarized laser beam

23‧‧‧反射鏡組 23‧‧‧Mirror group

24‧‧‧曲面鏡 24‧‧‧ curved mirror

25‧‧‧物鏡 25‧‧‧ Objective lens

251‧‧‧雷射聚焦光束 251‧‧‧Laser focused beam

3‧‧‧被加工物件 3‧‧‧Processed objects

Claims (4)

一種雷射切割機,包括一雷射光源、一雷射光束調控模組及一線性掃描運動機構,其中雷射光束調控模組中使用一偏極化光學元件,透過該偏極化光學元件將雷射光源的雷射光束轉型成一偏極化雷射光束,因而減少雷射光束能量過度集中分佈所造成加工界面的溫度差異,因而降低熱應力所產生崩邊的現象。 A laser cutting machine includes a laser light source, a laser beam control module and a linear scanning motion mechanism, wherein a polarized optical component is used in the laser beam control module, and the polarized optical component is used The laser beam of the laser source is transformed into a polarized laser beam, thereby reducing the temperature difference of the processing interface caused by the excessive concentration of the laser beam energy, thereby reducing the phenomenon of chipping caused by thermal stress. 如申請專利範圍第1項的雷射切割機,其中該偏極化光學元件係選自一偏極化錐鏡。 A laser cutting machine according to claim 1, wherein the polarized optical element is selected from a polarization cone mirror. 一種雷射切割方法,其係使用包括下列裝置進行雷射切割程序:提供一雷射光源,及其光束的能量控制器;提供一雷射光學系統,其包括有擴束鏡、反射鏡組、曲面鏡及物鏡等光學元件的光束調控模組;以及提供一線性掃描運動機構,雷射切割程序中利用線性掃描運動機構,將該光學系統所產生的聚焦雷射光束循序掃描於被加工物表面上;其中光束調控模組中使用至少一偏極化錐鏡,透過該偏極化錐鏡將高斯分佈的雷射光束轉型成一貝索分怖的雷射光束,同時偏極化該雷射光束。 A laser cutting method for performing a laser cutting program using a device comprising: a laser source, and an energy controller of the beam; and a laser optical system including a beam expander, a mirror group, a beam steering module for an optical component such as a curved mirror and an objective lens; and a linear scanning motion mechanism for scanning a focused laser beam generated by the optical system on the surface of the workpiece by using a linear scanning motion mechanism in a laser cutting program The light beam control module uses at least one polarization cone mirror through which the Gaussian-distributed laser beam is transformed into a Besso-derived laser beam, and the laser beam is polarized simultaneously. . 一種雷射切割機的光學系統,其包括一雷射光源及一雷射光束調控模組;其中雷射光源包括一雷射光源裝置,及其雷射光束的能量控制器;其中雷射光束調控模組至少包括:一擴束鏡,其係用以擴大該雷射光束的直徑;一偏極化錐鏡,其係透過偏極化錐鏡將該雷射光束形成一偏極化雷射光束;一反射鏡組,其包括數反射鏡,係用以調控雷射光束的路徑;一曲面鏡,其係用以調整雷射光束的聚焦景深;以及一物鏡,其係用於聚焦該雷射光束,將雷射光束聚焦於被加工物件表面上。 An optical system of a laser cutting machine, comprising a laser light source and a laser beam control module; wherein the laser light source comprises a laser light source device and an energy controller of the laser beam; wherein the laser beam is regulated The module includes at least: a beam expander mirror for expanding a diameter of the laser beam; and a polarization cone mirror that forms a polarized laser beam through the polarization cone mirror a mirror set comprising a number of mirrors for regulating the path of the laser beam; a curved mirror for adjusting the focused depth of field of the laser beam; and an objective lens for focusing the laser The beam focuses the laser beam on the surface of the object being processed.
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CN109604838A (en) * 2018-12-24 2019-04-12 大族激光科技产业集团股份有限公司 Semiconductor laser processing unit (plant)
CN111151873A (en) * 2018-11-06 2020-05-15 大族激光科技产业集团股份有限公司 Laser cutting device and method for brittle material

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US9138913B2 (en) * 2005-09-08 2015-09-22 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
CN105081586B (en) * 2015-09-14 2017-11-21 郑州轻工业学院 A kind of laser processing and device

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CN111151873A (en) * 2018-11-06 2020-05-15 大族激光科技产业集团股份有限公司 Laser cutting device and method for brittle material
CN109604838A (en) * 2018-12-24 2019-04-12 大族激光科技产业集团股份有限公司 Semiconductor laser processing unit (plant)

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