WO2019119617A1

WO2019119617A1 - High-refractive-index and low-hardness transparent material laser cutting device and method

Info

Publication number: WO2019119617A1
Application number: PCT/CN2018/074523
Authority: WO
Inventors: 陈蔚; 陶沙; 赵晓杰; 张�杰; 雷志辉
Original assignee: 英诺激光科技股份有限公司; 常州英诺激光科技有限公司
Priority date: 2017-12-21
Filing date: 2018-01-30
Publication date: 2019-06-27
Also published as: CN107962305A

Abstract

Disclosed in the invention are a high-refractive-index and low-hardness transparent material laser cutting device and a method. The high-refractive-index and low-hardness transparent material laser cutting device comprises a laser device (1), a beam expanding device (2), a collimation device (3), a reflector (4), a cutting head (5) and a motion platform (7), all of which are sequentially arranged. The high-refractive-index and low-hardness transparent material laser cutting device further comprises an industrial control unit (8), and the laser device (1) has a single-pulse or pulse count adjustable pulse set output. By means of the high-refractive-index and low-hardness transparent material laser cutting device and method, a pulse laser beam can be positioned in local positions of a transparent workpiece to make the interaction between laser and transparent materials occur, and accordingly tiny, uniform and up-down through material modification to the surface and the interior of the transparent workpiece occur. According to the mechanical property of the workpiece, laser parameters and the machining path are set, the modification point size, position and strength are reasonably controlled, and high-refractive-index and low-hardness transparent material cutting can be finished in collaboration with sheet splitting operation. The device is simple in structure and easy to operate, the method is high in cutting efficiency and free of shred residue splashing, the problem about high-efficiency and high-quality cutting of the transparent materials is solved, and the high-refractive-index and low-hardness transparent material laser cutting device and method are suitable for cutting high-refractive-index, low-hardness and high-brittleness transparent materials.

Description

\¥0 2019/119617 卩(:17 称18/074523

Laser cutting device and cutting method for transparent material with high refractive index and hardness

[0001] The present application is based on a Chinese patent application filed on Jan. 21, 2017, the filing date of which is hereby incorporated by reference.

Technical Field

[0003] The present application relates to the field of laser processing technology, and relates to a laser cutting device and a cutting method, and more particularly to a laser cutting device and a cutting method for processing a high refractive index, low hardness transparent material.

BACKGROUND OF THE INVENTION

[0005] Laser processing is a process that applies the characteristics of high directivity, high output power, and high brightness of a laser to the processing of materials. It uses focusing and other methods to concentrate light energy within a certain range, thereby generating a few From high temperatures of tens of thousands of degrees Celsius to temperatures above tens of thousands of degrees Celsius, some high melting point metals and non-metallic materials can be rapidly melted or vaporized, thus drilling, cutting, welding, laser marking and heat treatment of workpieces, with non-contact processing. Features, and suitable for micro-machining of various materials. Due to its high strength, good directionality and pure color, laser processing can focus the laser beam through a series of optical systems into spots with a diameter of only a few microns to tens of microns. It has high energy density and processing temperature, so it can be used in thousands of points. In a few seconds or even a shorter period of time, various substances are melted and vaporized to achieve the function of removing the processed position, and have been widely used in the fields of the electronics industry, the clothing industry, and the mechanical manufacturing.

[0006] All laser-absorbing materials can be laser processed. The processing effect depends mainly on the absorption of light by the substance. The higher the absorption rate of the working substance on the laser, the higher the efficiency of laser processing of the substance. Otherwise, the processing is higher. The efficiency is low. For the high refractive index material, the traditional laser processing method will have the problem of poor processing quality, and it can hardly meet the processing requirements. At present, the laser processing method can be used to process some transparent materials. The principle is that the ultra-fast laser pulse is When transmitted in a transparent medium, a dynamic balance is achieved due to the self-focusing effect and the defocusing effect of the plasma generated by ionizing the air, so that the ultrafast laser pulse forms a long, relatively stable laser channel. However, the silk forming method is only applicable to a general transparent material having a low refractive index, and a transparent material having a high refractive index and a low hardness cannot be processed by a filament forming principle. Therefore, development of a laser processing apparatus suitable for processing high refractive index, high brittle transparent materials \¥0 2019/119617 卩(:1' 2018/074523 and the method is imperative.

[0007] Application Content

[0008] Therefore, the technical problem to be solved by the present application is that the conventional laser processing method for the high refractive index material may have a problem of poor processing quality, and the processing demand is hardly satisfied, thereby providing a high processing efficiency, no debris splashing, Laser cutting device and cutting method for transparent materials that are not easy to damage the workpiece.

[0009] In order to solve the above technical problem, the technical solution of the present application is:

[0010] The present application provides a high refractive index, low hardness transparent material laser cutting device comprising a laser, a beam expanding device, a collimating device, a mirror, a cutting head and a motion platform, which are arranged in sequence, and also for controlling The laser, the cutting head and the industrial control unit of the motion platform, the laser having a single pulse or a pulse number output with adjustable pulse number.

[0011] Preferably, the pulse width of the laser is no more than 1118.

[0012] Preferably, the bottom of the cutting head is provided with a moving platform, the cutting head focuses the laser beam on the processed workpiece on the moving platform, and the moving platform drives the workpiece to move.

[0013] Preferably, the beam expanding device is a beam expander for expanding a laser beam generated by a laser; the collimating device is a collimator for correcting a laser beam; Focusing the laser beam

[0014] The present application also provides a method for laser cutting using the high refractive index, low hardness transparent material laser cutting device, which includes the following steps:

[0015] 81, the transparent workpiece to be processed is fixed on the surface of the moving platform, and the laser processing path is set by the industrial control unit

[0016] 82, turning on the laser, focusing the laser focus on the inside of the transparent workpiece;

[0017] 83. The control motion platform moves according to the laser processing path, so that the laser beam forms a modified region inside the workpiece according to the laser processing path;

[0018] 84, the laser processed workpiece is subjected to splitting treatment.

[0019] Preferably, the processing path is at least two parallel lines or at least two concentric circles.

[0020] Preferably, the distance between two adjacent parallel lines or two adjacent concentric circles is not more than 10^1111.

[0021] Preferably, the parallel line processing path is a set of flats extending along the length or width of the transparent workpiece \¥0 2019/119617 卩(:17 means 18/074523 line line composition; concentric circle machining path consists of a row of concentric circles arranged along the length or width of the transparent workpiece.

[0022] Preferably, the splitting process is infrared laser heating, chemical etching, ultrasonic splitting or mechanical splitting

[0023] Preferably, the workpiece to be processed is fixed to the surface of the moving platform by vacuum adsorption.

[0024] The above technical solution of the present application has the following advantages over the prior art:

[0025] (1) The high refractive index, low hardness transparent material laser cutting device described in the present application comprises a laser, a beam expanding device, a collimating device, a mirror, a cutting head and a motion platform, which are sequentially disposed, and further includes An industrial control unit for controlling the laser, the cutting head and the motion platform, the laser having a single pulse or a pulse number output with adjustable pulse number. The laser cutting device can position the pulsed laser beam inside the transparent workpiece, and the interaction between the laser and the transparent material occurs at various local positions in the transparent workpiece, thereby generating a small, uniform, and up-and-down material on the surface and inside of the transparent workpiece. The laser parameters and processing paths can be set according to the mechanical properties of the transparent workpiece, so that the size, position and strength of the modified points can be reasonably controlled, and the cutting of the transparent material can be completed by the subsequent splitting operation. The device is simple in structure and easy to operate, and solves the problem of high-efficiency cutting of transparent materials with high refractive index and low hardness, and is especially suitable for cutting transparent materials with low hardness and high brittleness.

[0026] (2) The method for laser cutting using the high refractive index, low hardness transparent material laser cutting device described in the present application first sets a laser processing path, then focuses the laser focus inside the transparent workpiece, and controls the motion. The platform moves according to the processing path so that the concentrated beam is processed in the transparent workpiece to form a modified region, and is processed by concentric circles or parallel lines. The principle is that single line processing cannot cause cracks in the material, double lines or more Line processing can produce cracks, and finally the splitting process is completed, that is, the cutting process of the transparent workpiece is completed. This processing method can generate the interaction between the laser and the transparent material inside the transparent workpiece, and then the material modification change occurs on the surface and inside of the material. The cutting efficiency is high, no slag splashing occurs, and the laser processing is performed in advance. The path is pre-processed and does not damage the workpiece during subsequent splinting, especially for the processing of high refractive index, high brittle transparent materials.

BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to make the content of the present application easier to understand clearly, the following embodiments are combined according to the specific embodiments of the present application. \¥0 2019/119617 卩 (: 1' 2018/074523 with the accompanying drawings, further details of this application,

1 is a schematic structural view of a transparent material laser cutting device according to an embodiment of the present application;

2 is a flow chart of a laser cutting method for a transparent material according to an embodiment of the present application;

3 is a schematic view showing a processing path of a method for cutting a transparent material according to Embodiment 1 of the present application;

4 is a schematic view showing a processing path of a transparent material cutting method according to Embodiment 2 of the present application.

[0033] Reference numerals in the figures are indicated as: 1 - laser; 2 - beam expanding device; 3 - collimating device; 4 - mirror; 5 - cutting head; 6 - transparent workpiece; 7 - motion platform; unit.

The present application may be embodied in a variety of different forms and should not be construed as being limited to the embodiments set forth herein. To the person skilled in the art, the application will be defined by the claims. In the drawings, the size and relative dimensions of the various devices are exaggerated for clarity. Furthermore, the terms "comprising," "having," and "said" are intended to cover a non-exclusive inclusion.

DETAILED DESCRIPTION

Embodiment 1

[0037] This embodiment provides a transparent material laser cutting device for cutting a transparent material, especially a transparent material having low hardness and high brittleness. The cutting apparatus shown in Figure 1, includes a laser arranged sequentially along an optical path of a laser 1, beam expander means 2, a collimator device 3, a mirror 4 and the cutting head 5, wherein the laser is a pulse less than 1! ₁₈ A pulsed laser that produces a laser beam in the infrared, visible, and ultraviolet bands, the pulsed laser having a single pulse or a subpulse number adjustable pulse group output. The beam expanding device 2 is a beam expanding mirror for expanding the pulsed laser light generated by the laser 1; the collimating device 3 is a laser collimator for correcting the laser beam to improve the collimation of the laser beam The mirror 4 is configured to deflect the direction of the laser beam adjusted by the collimating device 3 to cause the laser beam to enter the cutting head 5 located behind the mirror 4. In this embodiment, the mirror 4 will be horizontally oriented. The laser beam is changed to a vertical direction, and the cutting head 5 is used to focus the laser beam and laser-process the workpiece.

[0038] In addition, the cutting device further comprises a moving platform 7 for carrying and moving the transparent workpiece 6 to be processed, the moving platform 7 being movable in the direction, and further comprising for controlling the laser 1, the cutting head 5 and the mobile platform The industrial control unit 8 of 7, the industrial control unit 8 is a computer.

[0039] This embodiment further provides a method for cutting a transparent material with high refractive index and low hardness by using the cutting device. \¥0 2019/119617 卩(:1' 2018/074523 cutting method, especially for the transparent material with small hardness and high brittleness, as shown in Figure 2, including the following steps:

[0040] 1. The transparent workpiece 6 to be processed is fixed to the surface of the moving platform 7 by vacuum adsorption, and the laser processing path is set by the industrial control unit 8. In this embodiment, the laser processing path is at least two parallel lines, The spacing between two adjacent parallel lines is not more than 10^1111. As shown in FIG. 3, the parallel lines may extend along the length direction or the width direction of the transparent workpiece 6, and may be several strips;

[0041] 82, turn on the laser 1, through the industrial control unit 8 set to focus the laser focus on the inside of the transparent workpiece 6;

[0042] 83. The control motion platform 7 moves according to the laser processing path to cause the laser beam to process the transparent workpiece 6. During the processing, according to the mechanical properties of the thickness and hardness of the transparent workpiece, suitable laser parameters are selected within the workpiece. Forming a modified region;

[0043] 4. The laser processed workpiece is subjected to splitting treatment by means of infrared laser heating, so that the transparent workpiece 6 is broken along the edge of the formed modified region to complete the cutting of the transparent material.

Embodiment 2

[0045] The embodiment provides a transparent material laser cutting device for cutting a high refractive index and low hardness transparent material, in particular, a transparent material having a small hardness and a high brittleness. As shown said cutting means, including a laser disposed sequentially along the light path of a laser 1, a beam expander device 2, a collimator device 3, a mirror 4 and the cutting head 5, wherein the laser is a pulse width of less than 1! 1 ₈ A pulsed laser that produces a laser beam in the infrared, visible, and ultraviolet bands, the pulsed laser having a single pulse or a subpulse number adjustable pulse group output. The beam expanding device 2 is a beam expanding mirror for expanding the pulsed laser light generated by the laser 1; the collimating device 3 is a laser collimator for correcting the laser beam to improve the collimation of the laser beam The mirror 4 is used to deflect the direction of the laser beam adjusted by the collimating device 3, so that the laser beam enters the cutting head 5 located behind the mirror 4. In this embodiment, the mirror 4 will be horizontal. The laser beam is changed to a vertical direction, and the cutting head 5 is used to focus the laser beam and provide laser processing of the workpiece.

[0046] In addition, the cutting device further comprises a moving platform 7 for carrying and moving the transparent workpiece 6 to be processed, the moving platform 7 being movable in the direction, and further comprising for controlling the laser 1, the cutting head 5 and the mobile platform The industrial control unit 8 of 7, the industrial control unit 8 is a computer.

[0047] The embodiment further provides a method for performing high refractive index and low hardness transparent materials by using the cutting device. \¥0 2019/119617 卩(:1' 2018/074523 cutting method, especially for the transparent material with small hardness and high brittleness, as shown in Figure 2, including the following steps:

[0048] 1. The transparent workpiece 6 to be processed is fixed to the surface of the motion platform 7 by vacuum adsorption, and the laser processing path is set by the industrial control unit 8. In this embodiment, the laser processing path is at least two concentric circles, The spacing between two adjacent concentric circles is not greater than 10^1111, as shown in FIG. 4, or as a switchable embodiment, the laser processing path may be sequentially arranged by a set of concentric circles along the length or width direction of the transparent workpiece 6. Cloth

[0049] 82, turn on the laser 1, through the industrial control unit 8 set to focus the laser focus on the inside of the transparent workpiece 6;

[0050] 83. The control motion platform 7 moves according to the laser processing path to cause the laser beam to process the transparent workpiece 6. During the processing, according to the mechanical properties of the thickness and hardness of the transparent workpiece 6, the appropriate laser parameters are selected in the workpiece. Forming a modified region internally;

[0051] 4. The laser-processed workpiece is subjected to splitting treatment by means of infrared laser heating, so that the transparent workpiece 6 is broken along the edge of the formed modified region to complete the cutting of the transparent material.

[0052] It is to be understood that the above-described embodiments are merely illustrative of the embodiments and are not intended to limit the embodiments. Other variations or modifications of the various forms may be made by those skilled in the art in light of the above description. There is no need and no way to exhaust all of the implementations. Obvious changes or variations resulting therefrom are still within the scope of protection created by this application.

Summary of invention

technical problem

Problem solution

Advantageous effects of the invention

Claims

\¥0 2019/119617 卩(:1' 2018/074523

Claim

[Claim 1] A high refractive index, low hardness transparent material laser cutting device, comprising: a laser, a beam expanding device, a collimating device, a mirror, a cutting head, and a motion platform, which are sequentially disposed, and includes For controlling the laser, the cutting head and the motion control unit of the motion platform, the laser has a single pulse or a pulse number output with adjustable pulse number.

[Claim 2] The high refractive index, low hardness transparent material laser cutting device according to claim 1, wherein the laser has a pulse width of not more than 1!1 ₈ .

[Claim 3] The high refractive index, low hardness transparent material laser cutting device according to claim 2, wherein the cutting head bottom is provided with a moving platform, the cutting head focuses the laser beam on the movement Machining the workpiece on the platform, the moving platform drives the movement of the workpiece

[Claim 4] The high refractive index, low hardness transparent material laser cutting device according to claim 3, wherein the beam expanding device is a beam expander for expanding a laser beam generated by a laser The collimating device is a collimator for correcting a laser beam; the cutting head is for focusing a laser beam.

[Claim 5] A method of laser cutting using a high refractive index, low hardness transparent material laser cutting device according to any one of claims 1 to 4, comprising the steps of:

31. Fix the transparent workpiece to be processed on the surface of the moving platform, and set the laser processing path by the industrial control unit;

2. Turn on the laser to focus the laser focus on the inside of the transparent workpiece;

83. controlling the motion platform to move according to the laser processing path, so that the laser beam forms a modified region inside the workpiece according to the laser processing path;

4. Split the laser processed workpiece.

[Claim 6] The high refractive index, low hardness transparent material laser cutting method according to claim 5, wherein the processing path is at least two parallel lines or at least two concentric circles.

[Claim 7] The high refractive index, low hardness transparent material laser cutting method according to claim 6, wherein the distance between two adjacent parallel lines or two adjacent concentric circles is not more than 10^1111. \¥0 2019/119617 卩(:1' 2018/074523

[Claim 8] The high refractive index, low hardness transparent material laser cutting method according to claim 7, wherein the parallel line processing path is composed of a set of parallel lines extending along a length or a width direction of the transparent workpiece The concentric machining path consists of a series of concentric circles arranged along the length or width of the transparent workpiece.

[Claim 9] The high refractive index, low hardness transparent material laser cutting method according to claim 8, wherein the lobing treatment is infrared laser heating, chemical etching, ultrasonic lobes or mechanical lobes.

[Claim 10] The high refractive index, low hardness transparent material laser cutting method according to claim 9, wherein the workpiece to be processed is fixed to the surface of the moving platform by vacuum suction.