JP2002087834A - Method for machining transparent member by excimer laser and machined matter thereby - Google Patents
Method for machining transparent member by excimer laser and machined matter therebyInfo
- Publication number
- JP2002087834A JP2002087834A JP2000280025A JP2000280025A JP2002087834A JP 2002087834 A JP2002087834 A JP 2002087834A JP 2000280025 A JP2000280025 A JP 2000280025A JP 2000280025 A JP2000280025 A JP 2000280025A JP 2002087834 A JP2002087834 A JP 2002087834A
- Authority
- JP
- Japan
- Prior art keywords
- transparent member
- excimer laser
- processing
- processed product
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 64
- 238000003754 machining Methods 0.000 title abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 230000003287 optical effect Effects 0.000 claims description 16
- 238000003672 processing method Methods 0.000 claims description 9
- 239000011521 glass Substances 0.000 abstract description 16
- 238000013459 approach Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 12
- 230000001678 irradiating effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 102100033029 Carbonic anhydrase-related protein 11 Human genes 0.000 description 1
- 101000867841 Homo sapiens Carbonic anhydrase-related protein 11 Proteins 0.000 description 1
- 101001075218 Homo sapiens Gastrokine-1 Proteins 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/04—Processes or apparatus for producing holograms
- G03H1/0476—Holographic printer
- G03H2001/0484—Arranged to produce three-dimensional fringe pattern
Landscapes
- Chemical & Material Sciences (AREA)
- Lasers (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
- Surface Treatment Of Glass (AREA)
- Optics & Photonics (AREA)
- Holo Graphy (AREA)
- Laser Beam Processing (AREA)
- Glass Melting And Manufacturing (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、エキシマレーザー
による透明部材の加工方法およびその加工品に係り、特
に透明部材内部に各種の可視形状を形成する透明部材の
加工方法およびその加工品に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of processing a transparent member using an excimer laser and a processed product thereof, and more particularly to a method of processing a transparent member forming various visible shapes inside the transparent member and a processed product thereof. is there.
【０００２】[0002]
【従来の技術】石英ガラスなど、紫外線の吸収が少ない
透明及び半透明部材へのレーザーアブレーションによる
加工法は困難であるとされている。そのため、石英ガラ
スへの加工としてはフォトリソグラフィ技術を応用した
加工法が用いられているが、この加工法は、加工手順が
複雑で工程数が多いなどの問題がある。2. Description of the Related Art It is said that it is difficult to process a transparent or translucent member such as quartz glass which absorbs a small amount of ultraviolet light by laser ablation. For this reason, a processing method using a photolithography technique is used for processing quartz glass, but this processing method has problems such as a complicated processing procedure and a large number of steps.
【０００３】エキシマレーザーによる加工例として、流
動性物質をガラス表面に接触させて裏面からレーザー光
を照射することにより裏面に微細エッチングする方法
〔特開２０００−９４１６３（透明材料のレーザー微細
加工）〕があるが、これは表面だけの加工にとどまって
おり、内部を直接加工する方式ではない。石英ガラスの
内部に加工を施したように見せるには、加工したガラス
表面に別のガラスを張りつけるなどの加工が必要であ
る。[0003] As an example of processing by an excimer laser, a method in which a fluid substance is brought into contact with the glass surface and a laser beam is irradiated from the rear surface to finely etch the rear surface [Japanese Patent Laid-Open No. 2000-94163 (laser fine processing of transparent material)] However, this is only processing of the surface, not a method of directly processing the inside. In order to make it appear as if the inside of the quartz glass has been processed, processing such as attaching another glass to the processed glass surface is necessary.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記し
たように、石英ガラスの溝加工等は表面だけの微小エッ
チングであり、石英ガラスの内部に加工したように見せ
かけるにはガラスを張り合わせる必要があるなどの問題
があった。However, as described above, the groove processing of the quartz glass or the like is a minute etching of only the surface, and it is necessary to bond the glass to make it appear that the inside of the quartz glass is processed. There was such a problem.
【０００５】本発明は、上記状況に鑑みて、エキシマレ
ーザーを用いて透明部材内部への可視形状の微細加工を
ガラス上部より直接照射して行うことができるエキシマ
レーザーによる透明部材の加工方法およびその加工品を
提供することを目的とする。In view of the above circumstances, the present invention provides a method for processing a transparent member by using an excimer laser, which can directly irradiate visible fine processing inside the transparent member from above the glass using an excimer laser. The purpose is to provide processed products.
【０００６】[0006]
【課題を解決するための手段】本発明は、上記目的を達
成するために、 〔１〕エキシマレーザーによる透明部材の加工方法にお
いて、エキシマレーザーの所定の照射エネルギーを透明
部材に照射して、前記透明部材内に微小な変質部分を生
じさせ、前記透明部材内に可視形状を形成することを特
徴とする。According to the present invention, there is provided a method for processing a transparent member using an excimer laser, the method comprising: irradiating a transparent member with a predetermined irradiation energy of an excimer laser; A minute deteriorated portion is generated in the transparent member to form a visible shape in the transparent member.
【０００７】〔２〕上記〔１〕記載のエキシマレーザー
による透明部材の加工方法において、前記透明部材が石
英ガラスであることを特徴とする。[2] The method for processing a transparent member using an excimer laser according to the above [1], wherein the transparent member is quartz glass.
【０００８】〔３〕上記〔１〕又は〔２〕記載のエキシ
マレーザーによる透明部材の加工方法において、前記エ
キシマレーザーの所定の照射エネルギーが１パルス当た
り、０．２５Ｊ／ｃｍ2 から１．２Ｊ／ｃｍ2 であるこ
とを特徴とする。[3] In the method for processing a transparent member using the excimer laser according to the above [1] or [2], the predetermined irradiation energy of the excimer laser is from 0.25 J / cm 2 to 1.2 J / pulse per pulse. cm 2 .
【０００９】〔４〕上記〔１〕又は〔２〕記載のエキシ
マレーザーによる透明部材の加工方法において、前記エ
キシマレーザーの焦点位置を、前記透明部材の表面と裏
面との間に設定することを特徴とする。[4] The method for processing a transparent member by the excimer laser according to the above [1] or [2], wherein the focal position of the excimer laser is set between the front surface and the rear surface of the transparent member. And
【００１０】〔５〕上記〔４〕記載のエキシマレーザー
による透明部材の加工方法において、前記エキシマレー
ザーの焦点位置を移動させ、それに伴い前記微小な変質
部分の位置を移動させることを特徴とする。[5] The method for processing a transparent member using an excimer laser according to the above [4], wherein the focal position of the excimer laser is moved, and accordingly, the position of the minutely altered portion is moved.
【００１１】〔６〕上記〔５〕記載のエキシマレーザー
による透明部材の加工方法において、前記エキシマレー
ザーの焦点位置の移動方向がＺ軸方向であることを特徴
とする。[6] The method for processing a transparent member by using an excimer laser according to the above [5], wherein the moving direction of the focal position of the excimer laser is the Z-axis direction.
【００１２】〔７〕上記〔５〕記載のエキシマレーザー
による透明体の加工方法において、前記エキシマレーザ
ーの焦点位置の移動方向がＸ軸方向であることを特徴と
する。[7] The method for processing a transparent body using an excimer laser according to the above [5], wherein the moving direction of the focal position of the excimer laser is the X-axis direction.
【００１３】〔８〕上記〔５〕記載のエキシマレーザー
による透明体の加工方法において、前記エキシマレーザ
ーの焦点位置の移動方向がＹ軸方向であることを特徴と
する。[8] The method for processing a transparent body by using an excimer laser according to the above [5], wherein the moving direction of the focal position of the excimer laser is the Y-axis direction.
【００１４】[0014]
〔９〕上記〔１〕記載のエキシマレーザー
による透明体の加工方法において、前記エキシマレーザ
ーの照射エネルギーを調整することにより、前記微小な
変質部分の位置をＺ軸方向に移動させることを特徴とす
る。[9] The method for processing a transparent body using an excimer laser according to the above [1], wherein the position of the minutely altered portion is moved in the Z-axis direction by adjusting the irradiation energy of the excimer laser. .
【００１５】〔１０〕上記〔１〕記載のエキシマレーザ
ーによる透明部材の加工方法において、薄い透明部材上
にあて板としての別の透明部材をセットし、この別の透
明部材の上方から前記エキシマレーザーを照射すること
により、前記薄い透明部材内の加工を行うことを特徴と
する。[10] In the method for processing a transparent member by the excimer laser according to the above [1], another transparent member as a patch plate is set on the thin transparent member, and the excimer laser is placed from above the other transparent member. Irradiating the thin transparent member.
【００１６】〔１１〕上記〔１〕記載のエキシマレーザ
ーによる透明部材の加工方法によって成形される透明部
材の加工品である。[11] A processed product of a transparent member formed by the method for processing a transparent member by the excimer laser described in [1].
【００１７】〔１２〕上記〔１１〕記載のエキシマレー
ザーによる透明部材の加工方法によって成形される透明
部材の加工品が光学素子であることを特徴とする。[12] A processed product of the transparent member formed by the method for processing a transparent member by the excimer laser described in [11] is an optical element.
【００１８】〔１３〕上記〔１２〕記載の透明部材の加
工品において、前記光学素子は回折格子であることを特
徴とする。[13] The processed product of the transparent member according to the above [12], wherein the optical element is a diffraction grating.
【００１９】〔１４〕上記〔１２〕記載の透明部材の加
工品において、前記光学素子はマスクであることを特徴
とする。[14] The processed product of the transparent member according to the above [12], wherein the optical element is a mask.
【００２０】〔１５〕上記〔１２〕記載の透明部材の加
工品において、前記光学素子は光導波路であることを特
徴とする。[15] The processed product of the transparent member according to the above [12], wherein the optical element is an optical waveguide.
【００２１】〔１６〕上記〔１２〕記載の透明部材の加
工品において、前記光学素子はホログラムであることを
特徴とする。[16] The processed product of the transparent member according to the above [12], wherein the optical element is a hologram.
【００２２】〔１７〕上記〔１２〕記載の透明部材の加
工品において、前記光学素子は屈折率を変化させてなる
平面レンズであることを特徴とする。[17] The processed product of the transparent member according to the above [12], wherein the optical element is a flat lens having a changed refractive index.
【００２３】〔１８〕上記〔１１〕記載の透明部材の加
工品において、前記透明部材内部に造形物、マーク、記
号、文字が形成された透明部材の加工品であることを特
徴とする。[18] The processed product of the transparent member according to the above [11], characterized in that it is a processed product of a transparent member having a shaped object, a mark, a symbol, and a character formed inside the transparent member.
【００２４】〔１９〕上記〔１８〕記載の透明部材の加
工品において、前記透明部材内部に形成される造形物、
マーク、記号、文字を側面からの光照射により浮かび上
がらせ表示することを特徴とする。[19] In the processed product of the transparent member according to the above [18], a molded article formed inside the transparent member,
Marks, symbols, and characters are displayed by being raised by light irradiation from the side.
【００２５】〔２０〕上記〔１１〕記載の透明部材の加
工品において、前記透明部材内部に流路が形成された透
明部材の加工品であることを特徴とする。[20] The processed product of the transparent member according to the above [11], which is a processed product of a transparent member having a flow path formed inside the transparent member.
【００２６】〔２１〕上記〔１１〕記載の透明部材の加
工品において、前記透明部材内部に目盛が形成された透
明部材の加工品であることを特徴とする。[21] The processed product of the transparent member according to the above [11], which is a processed product of a transparent member having a scale formed inside the transparent member.
【００２７】[0027]
【発明の実施の形態】以下、本発明の実施の形態につい
て詳細に説明する。Embodiments of the present invention will be described below in detail.
【００２８】図１は本発明にかかる透明部材の加工品の
製造装置の概略図、図２はその装置を用いたレーザーに
よる加工方法の説明図である。FIG. 1 is a schematic diagram of an apparatus for manufacturing a processed product of a transparent member according to the present invention, and FIG. 2 is an explanatory view of a laser processing method using the apparatus.
【００２９】図１において、Ｘ軸、Ｙ軸、Ｚ軸方向に微
小駆動可能なステージ１上に透明部材２をセットし、そ
の透明部材２にエキシマレーザー３を照射して透明部材
２内部に微小な変質部分を生じさせ、可視形状を形成さ
せる。In FIG. 1, a transparent member 2 is set on a stage 1 which can be finely driven in the X-axis, Y-axis, and Z-axis directions. This causes a deteriorated portion to form a visible shape.
【００３０】このようにして、透明部材の加工品を得る
ことができる。Thus, a processed product of the transparent member can be obtained.
【００３１】図２（ａ）に示すように、エキシマレーザ
ー１２の焦点位置を横方向でかつ上方に移動すると、そ
れに対応して微小な変質部分１１Ｂの位置をａ→ｂ→ｃ
へと移動させることができる。As shown in FIG. 2A, when the focal position of the excimer laser 12 is moved in the horizontal direction and upward, the position of the minute altered portion 11B is correspondingly changed from a → b → c.
Can be moved to
【００３２】また、図２（ｂ）に示すように、例えば、
１ｍｍ厚若しくはそれ以上の透明部材としての石英ガラ
ス１１に対して、エキシマレーザー１２のエネルギーを
１パルス当たり０．２５Ｊ／ｃｍ2 から１．２Ｊ／ｃｍ
2 に変化させて石英ガラス１１上部より照射する。この
とき、焦点はガラス内部１１Ａに合わせておく（ｄ位
置）。次に、エキシマレーザー１２のエネルギーが０．
２５Ｊ／ｃｍ2 になると、板厚の１／２近傍にてガラス
に微小な変質部分１１Ｃが生じ（ｅ位置）、エネルギー
を増加させるにつれて、微小な変質部分の位置が表面に
近づく。なお、ガラスの最上層への微小な変質部分の形
成は、１．２Ｊ／ｃｍ2 となる。As shown in FIG. 2B, for example,
Energy of the excimer laser 12 is applied to the quartz glass 11 as a transparent member having a thickness of 1 mm or more from 0.25 J / cm 2 to 1.2 J / cm 2 per pulse.
The irradiation is changed from 2 to 2 from above the quartz glass 11. At this time, the focal point is set to the inside 11A of the glass (position d). Next, the energy of the excimer laser 12 is set to 0.1.
At 25 J / cm 2 , a microscopically altered portion 11C is generated in the glass near half the plate thickness (position e), and the position of the microscopically altered portion approaches the surface as the energy is increased. Note that the formation of a minutely altered portion on the uppermost layer of glass is 1.2 J / cm 2 .
【００３３】図３は本発明のＺ軸方向に多層の微小な変
質部分（溝）を生じさせる透明部材の加工方法の説明図
である。FIG. 3 is an explanatory view of a method of processing a transparent member according to the present invention, in which a multi-layered minutely altered portion (groove) is formed in the Z-axis direction.
【００３４】この実施例では、図３（ａ）に示すように
透明部材２１内のエキシマレーザー２２の焦点を下層に
合わせて微小な変質部分（溝）２３を加工した後に、図
３（ｂ）に示すように、焦点位置を表面方向（Ｚ方向）
に移動させて再度エキシマレーザー２２を照射すると、
上層の微小な変質部分（溝）２４の加工が行われる。In this embodiment, as shown in FIG. 3A, after the excimer laser 22 in the transparent member 21 is focused on the lower layer to process a minutely altered portion (groove) 23, FIG. As shown in the figure, the focal position is set in the surface direction (Z direction).
To the excimer laser 22 again,
The processing of the finely altered portion (groove) 24 of the upper layer is performed.
【００３５】上方よりエキシマレーザー照射を行うた
め、加工位置を平面内（Ｘ，Ｙ平面）で移動することが
でき、またエキシマレーザー強度を変えることにより深
さ（Ｚ軸）方向にも変えることができる。したがって、
ガラス内部における３次元可視形状の加工（例えば、３
次元溝加工）が可能となる。Since the excimer laser irradiation is performed from above, the processing position can be moved in a plane (X, Y plane), and can also be changed in the depth (Z axis) direction by changing the excimer laser intensity. it can. Therefore,
Processing of three-dimensional visible shape inside glass (for example, 3
Dimensional groove machining).
【００３６】図４は本発明のＸ軸方向にエキシマレーザ
ーを連続的に移動することにより、半透明に加工された
部分を形成する透明部材の加工方法の説明図である。FIG. 4 is an explanatory view of a method for processing a transparent member for forming a translucent portion by continuously moving an excimer laser in the X-axis direction according to the present invention.
【００３７】この図に示すように、透明部材３１の左側
からエキシマレーザー３２を連続的にＸ軸に沿って移動
させることにより、表面の状態にかかわらず半透明に加
工された部分３３を透明部材３１内部に形成することが
できる。As shown in this figure, by continuously moving the excimer laser 32 along the X-axis from the left side of the transparent member 31, the semi-transparent part 33 regardless of the state of the surface can be transparent member. 31 can be formed inside.
【００３８】以下、上記した透明部材の加工方法によっ
て製造される透明部材の加工品について説明する。Hereinafter, a processed product of a transparent member manufactured by the above-described method of processing a transparent member will be described.
【００３９】図５は本発明のエキシマレーザーを所定ピ
ッチでＸ軸方向に移動することにより所定ピッチの溝を
形成する透明部材の加工方法の説明図である。FIG. 5 is an explanatory view of a method for processing a transparent member in which grooves of a predetermined pitch are formed by moving the excimer laser of the present invention in the X-axis direction at a predetermined pitch.
【００４０】この図に示すように、エキシマレーザー４
２を所定ピッチでＸ軸方向に移動することにより、透明
部材４１の内部に所定ピッチの溝４３を形成することが
でき、例えば、回折格子を得ることができる。As shown in this figure, the excimer laser 4
By moving 2 at a predetermined pitch in the X-axis direction, grooves 43 having a predetermined pitch can be formed inside the transparent member 41, and for example, a diffraction grating can be obtained.
【００４１】図６は本発明の薄い透明部材の加工方法の
説明図である。FIG. 6 is an explanatory view of a method for processing a thin transparent member according to the present invention.
【００４２】この図に示すように、薄い透明部材４５内
に加工を施したい場合には、薄い透明部材４５の上部に
別のあて板としての透明部材４６をセットして、薄い透
明部材４５内部に焦点を設定したエキシマレーザー４２
を、透明部材４６の上方から薄い透明部材４５内部に照
射して、加工を行うことができる。As shown in this figure, when it is desired to process the inside of the thin transparent member 45, a transparent member 46 is set on the thin transparent member 45 as another cover plate. Excimer laser 42 focused on
Can be applied to the inside of the thin transparent member 45 from above the transparent member 46 to perform processing.
【００４３】図７は本発明の透明部材の加工方法による
多層マスクの透明部材の加工品の製造方法を示す図であ
る。FIG. 7 is a view showing a method of manufacturing a processed product of a transparent member of a multilayer mask by the method of processing a transparent member of the present invention.
【００４４】まず、図７（ａ）に示すように、エキシマ
レーザー５２の焦点を透明部材５１の下層（深め）に合
わせて、加工を行い、図７（ｂ）に示すように、下層に
第１のマスク５３を形成する。次に、エキシマレーザー
５２の焦点を透明部材５１の中層に合わせて上記と同様
に第２のマスク５４を形成する。最後に、透明部材５１
の上層に第３のマスク５５を形成する。このようにして
得られた多層マスクは、図７（ｃ）に示すように、光ビ
ーム５６の焦点を第２のマスク５４にあてると、第１の
マスク５３と第３のマスク５５には焦点があっていない
ので影響はないことになる。First, as shown in FIG. 7 (a), the excimer laser 52 is focused on the lower layer (deeper) of the transparent member 51, and processing is performed, and as shown in FIG. One mask 53 is formed. Next, the excimer laser 52 is focused on the middle layer of the transparent member 51, and a second mask 54 is formed as described above. Finally, the transparent member 51
A third mask 55 is formed on the upper layer. As shown in FIG. 7C, when the focus of the light beam 56 is focused on the second mask 54, the multilayer mask thus obtained is focused on the first mask 53 and the third mask 55. There is no effect because there is no
【００４５】このような透明部材の加工法を用いること
により、多層ホログラムや多層光導波路が形成される透
明部材の加工品を得ることができる。By using such a method for processing a transparent member, a processed product of a transparent member on which a multilayer hologram or a multilayer optical waveguide is formed can be obtained.
【００４６】図８は本発明の透明部材の加工方法による
平面レンズの透明部材の加工品の製造方法を示す図であ
る。FIG. 8 is a view showing a method of manufacturing a processed product of a transparent member of a flat lens by the method of processing a transparent member of the present invention.
【００４７】まず、図８（ａ）に示すように、透明部材
６１内にエキシマレーザー６２を照射して、溝（変質部
分）６３を形成し、図８（ｂ）に示すように、その溝
（変質部分）６３を所定位置に複数個形成する。する
と、図８（ｃ）に示すように、加工前の平面レンズの屈
折率の変化により、平面レンズの特性を変化させること
ができる。First, as shown in FIG. 8 (a), an excimer laser 62 is applied to the inside of the transparent member 61 to form a groove (transformed portion) 63, and as shown in FIG. A plurality of (altered portions) 63 are formed at predetermined positions. Then, as shown in FIG. 8C, the characteristics of the flat lens can be changed by changing the refractive index of the flat lens before processing.
【００４８】この加工方法は、当然絞りや開口数（Ｎ
Ａ）の変化を持たせることもできる。In this processing method, the aperture and the numerical aperture (N
A) can be varied.
【００４９】また、部分的な箇所のみ屈折率を変化させ
たレンズの加工を行うこともできる。Further, it is also possible to process a lens in which the refractive index is changed only at a partial portion.
【００５０】図９は本発明の透明部材の加工方法による
透明部材内部に形成される造形物を有する透明部材の加
工品の製造方法を示す図である。FIG. 9 is a view showing a method of manufacturing a processed product of a transparent member having a model formed inside the transparent member by the method of processing a transparent member of the present invention.
【００５１】まず、図９（ａ）に示すように、透明部材
７１の下層にエキシマレーザー７２を照射して、溝（変
質部分）７３を形成し、図９（ｂ）に示すように順次上
層に溝（変質部分）７３を形成し、図９（ｃ）を経て、
図９（ｄ）に示すように、溝７３（変質部分）の集合体
である透明部材内部に形成される造形物７４を形成する
ことができる。First, as shown in FIG. 9A, the lower layer of the transparent member 71 is irradiated with an excimer laser 72 to form a groove (deformed portion) 73, and as shown in FIG. A groove (degraded portion) 73 is formed in FIG.
As shown in FIG. 9D, it is possible to form a modeled object 74 formed inside a transparent member which is an aggregate of the grooves 73 (altered portions).
【００５２】この加工方法により、マーク、記号などを
透明部材７１内部に形成することができる。With this processing method, marks, symbols and the like can be formed inside the transparent member 71.
【００５３】図１０は本発明の透明部材の加工方法によ
る文字入れをした透明部材の加工品及びその文字の表示
方法を示す図である。FIG. 10 is a view showing a processed product of a transparent member in which characters are inserted by the method of processing a transparent member of the present invention and a method of displaying the characters.
【００５４】図１０（ａ）に示すように、透明部材７５
にエキシマレーザーを照射して所定の文字７６を透明部
材７５内部に形成することができる。As shown in FIG. 10A, the transparent member 75
A predetermined character 76 can be formed inside the transparent member 75 by irradiating the transparent member 75 with an excimer laser.
【００５５】そのようにして形成された文字７６は、図
１０（ｂ）に示すように、透明部材７５の側面から光７
７を照射して散乱光７８を発生させ、浮かび上がらせ表
示することができる。As shown in FIG. 10 (b), the characters 76 thus formed are illuminated by light 7 from the side of the transparent member 75.
7 scattered light 78 is generated, and the scattered light 78 emerges and can be displayed.
【００５６】このような表示は、例えば、時計のガラス
盤にブランド品のマークを入れるなど偽物防止などに用
いることができる。Such a display can be used to prevent counterfeiting, for example, by placing a brand mark on the glass plate of the watch.
【００５７】図１１は本発明の透明部材の加工方法によ
る流路を有する透明部材の加工品及びその加工方法の説
明図である。FIG. 11 is an explanatory view of a processed product of a transparent member having a flow channel according to the method of processing a transparent member of the present invention and a method of processing the same.
【００５８】まず、図１１（ａ）に示すように、透明部
材８１内部にエキシマレーザー８２を照射して所定の長
さの溝８３を形成し、次に、図１１（ｂ）に示すよう
に、その溝８３の両端に穴８４を加工すると、溝８３を
流路８５として用いることができる。当然、予め穴８４
を加工しておき、その穴８４を連通する流路８５を直接
エキシマレーザー８２を照射して形成するようにしても
よい。First, as shown in FIG. 11A, an excimer laser 82 is applied to the inside of the transparent member 81 to form a groove 83 having a predetermined length. Then, as shown in FIG. When holes 84 are formed at both ends of the groove 83, the groove 83 can be used as the flow path 85. Naturally, the holes 84
May be formed, and the flow path 85 communicating with the hole 84 may be formed by directly irradiating the excimer laser 82.
【００５９】図１２は本発明の透明部材の加工方法によ
る目盛を有する透明部材の加工品の製造方法を示す図で
ある。FIG. 12 is a diagram showing a method of manufacturing a processed product of a transparent member having a scale by the method of processing a transparent member of the present invention.
【００６０】この図に示すように、透明部材９１内部に
エキシマレーザーをＸ軸とＹ軸に移動させて照射するこ
とで、目盛（スケール）９２を形成することができる。
なお、ここで、目盛（スケール）とは、スケールパター
ン（エンコーダなど）をも含むとする。As shown in this figure, a scale 92 can be formed by irradiating the inside of the transparent member 91 with an excimer laser moving in the X-axis and the Y-axis.
Here, the graduation (scale) includes a scale pattern (encoder or the like).
【００６１】また、透明部材内部の加工により、超音波
素子などのキャリブレーションに用いることもできる。The processing inside the transparent member can be used for calibration of an ultrasonic element or the like.
【００６２】更に、上記実施例としては透明部材として
説明したが、半透明部材であっても内部にエキシマレー
ザー加工が可能であるものについては、本発明が適用で
きることは明らかである。その意味では、ここでは、透
明部材は、半透明部材をも包含する広義の意味で用いる
ものとする。Furthermore, although the above embodiment has been described as a transparent member, it is clear that the present invention can be applied to a translucent member that can be internally processed by excimer laser. In that sense, the transparent member is used here in a broad sense including a translucent member.
【００６３】また、透明部材としては、石英ガラスで実
証したが普通のガラス、アクリル等への展開が可能であ
る。更に、１本のビームで確かめたが複数のビーム、光
源が同じか別かの違い等、対象物の拡大と加工手段の拡
大を図ることができる。As the transparent member, quartz glass has been demonstrated, but it can be applied to ordinary glass, acrylic and the like. Furthermore, although it has been confirmed with one beam, it is possible to enlarge the object and the processing means, such as a difference between a plurality of beams and the same or different light sources.
【００６４】なお、本発明は上記実施例に限定されるも
のではなく、本発明の趣旨に基づいて種々の変形が可能
であり、これらを本発明の範囲から排除するものではな
い。It should be noted that the present invention is not limited to the above-described embodiment, but various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.
【００６５】[0065]
【発明の効果】以上、詳細に説明したように、本発明に
よれば、以下のような効果を奏することができる。As described above, according to the present invention, the following effects can be obtained.
【００６６】（Ａ）透明部材内部に直接可視形状の微細
加工を施すことができるため、加工工数を大幅に低減す
ることができる。(A) Fine processing of a visible shape can be directly performed inside the transparent member, so that the number of processing steps can be greatly reduced.
【００６７】（Ｂ）透明部材内部に２次元の可視形状の
微細加工を施すことができる。特に、多層にわたる微細
加工を容易に行うことができる。(B) Fine processing of a two-dimensional visible shape can be performed inside the transparent member. In particular, fine processing over multiple layers can be easily performed.
【００６８】（Ｃ）各種、光学素子や装飾造形、スケー
ルを施した透明部材の加工品を容易に得ることができ
る。(C) Various types of optical elements, decorative moldings, and processed products of scaled transparent members can be easily obtained.
【図１】本発明にかかる透明部材の加工品の製造装置の
概略図である。FIG. 1 is a schematic view of an apparatus for manufacturing a processed product of a transparent member according to the present invention.
【図２】本発明にかかる透明部材の加工品の製造装置を
用いたレーザーによる加工方法の説明図である。FIG. 2 is an explanatory diagram of a laser processing method using the apparatus for manufacturing a processed product of a transparent member according to the present invention.
【図３】本発明のＺ軸方向に多層の微小な変質部分
（溝）を生じさせる透明部材の加工方法の説明図であ
る。FIG. 3 is an explanatory view of a method for processing a transparent member for producing a multilayer minutely deteriorated portion (groove) in the Z-axis direction according to the present invention.
【図４】本発明のＸ軸方向にエキシマレーザーを連続的
に移動することにより、半透明に加工された部分を形成
する透明部材の加工方法の説明図である。FIG. 4 is an explanatory view of a method for processing a transparent member for forming a semi-transparent part by continuously moving an excimer laser in the X-axis direction according to the present invention.
【図５】本発明のエキシマレーザーを所定ピッチでＸ軸
方向に移動することにより所定ピッチの溝を形成する透
明部材の加工方法の説明図である。FIG. 5 is an explanatory view of a method for processing a transparent member for forming grooves of a predetermined pitch by moving the excimer laser of the present invention in the X-axis direction at a predetermined pitch.
【図６】本発明の薄い透明部材の加工方法の説明図であ
る。FIG. 6 is an illustration of a method for processing a thin transparent member according to the present invention.
【図７】本発明の透明部材の加工方法による多層マスク
の透明部材の加工品の製造方法を示す図である。FIG. 7 is a view showing a method of manufacturing a processed product of a transparent member of a multilayer mask by the method of processing a transparent member of the present invention.
【図８】本発明の透明部材の加工方法による平面レンズ
の透明部材の加工品の製造方法を示す図である。FIG. 8 is a diagram illustrating a method of manufacturing a processed product of a transparent member of a planar lens by the method of processing a transparent member of the present invention.
【図９】本発明の透明部材の加工方法による透明部材内
部に形成される造形物を有する透明部材の加工品の製造
方法を示す図である。FIG. 9 is a view showing a method of manufacturing a processed product of a transparent member having a model formed inside a transparent member by the method of processing a transparent member of the present invention.
【図１０】本発明の透明部材の加工方法による文字入れ
を有する透明部材の加工品及びその文字の表示方法を示
す図である。FIG. 10 is a view showing a processed product of a transparent member having a character box by the method of processing a transparent member of the present invention and a method of displaying the characters.
【図１１】本発明の透明部材の加工方法による流路を有
する透明部材の加工品の製造方法を示す図である。FIG. 11 is a view showing a method of manufacturing a processed product of a transparent member having a flow channel by the method of processing a transparent member of the present invention.
【図１２】本発明の透明部材の加工方法による目盛を有
する透明部材の加工品の製造方法を示す図である。FIG. 12 is a view showing a method of manufacturing a processed product of a transparent member having a scale by the method of processing a transparent member of the present invention.
１ ステージ ２，２１，３１，４１，５１，６１，７１，７５，８
１，９１ 透明部材 ３，１２，２２，３２，４２，５２，６２，７２，８２
エキシマレーザー １１ 石英ガラス １１Ａ ガラス内部 １１Ｂ，１１Ｃ 微小な変質部分 ２３ 下層の溝 ２４ 上層の溝 ３３ 半透明に加工された部分 ４３ 所定ピッチの溝 ４５ 薄い透明部材 ４６ 透明部材（あて板） ５３ 下層の第１のマスク ５４ 中層の第２のマスク ５５ 上層の第３のマスク ５６ 光ビーム ６３，７３ 溝（変質部分） ７４ 透明部材内部に形成される造形物 ７６ 文字 ７７ 光 ７８ 散乱光 ８３ 所定の長さの溝 ８４ 穴 ８５ 流路 ９２ 目盛（スケール：スケールパターン）1 stage 2,21,31,41,51,61,71,75,8
1,91 Transparent member 3,12,22,32,42,52,62,72,82
Excimer laser 11 Quartz glass 11A Inside glass 11B, 11C Minor alteration part 23 Lower groove 24 Upper groove 33 Translucent part 43 Predetermined pitch groove 45 Thin transparent member 46 Transparent member (plate) 53 Lower layer The first mask 54 The second mask in the middle layer 55 The third mask in the upper layer 56 Light beam 63, 73 Groove (transformed part) 74 Modeling object formed inside the transparent member 76 Character 77 Light 78 Light 78 Scattered light 83 Predetermined length Groove 84 Hole 85 Channel 92 Scale (Scale: Scale pattern)
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｇ０２Ｂ 3/00 Ｇ０２Ｂ 3/00 Ｚ ５Ｆ０７１ 5/18 5/18 ５Ｆ０７２ 5/32 5/32 Ｇ０３Ｈ 1/04 Ｇ０３Ｈ 1/04 Ｈ０１Ｓ 3/00 Ｈ０１Ｓ 3/00 Ｂ 3/225 3/223 Ｅ Ｆターム(参考） 2H049 AA02 AA12 AA33 AA43 AA45 AA60 CA05 CA22 CA28 2K008 BB03 DD02 DD22 EE07 HH01 4E068 CA02 CA03 CA11 DB13 4G014 AH08 AH23 4G059 AA01 AA13 AB05 AC30 5F071 AA06 JJ10 5F072 AA06 SS06 YY06 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) G02B 3/00 G02B 3/00 Z 5F071 5/18 5/18 5F072 5/32 5/32 G03H 1/04 G03H 1/04 H01S 3/00 H01S 3/00 B 3/225 3/223 EF term (reference) 2H049 AA02 AA12 AA33 AA43 AA45 AA60 CA05 CA22 CA28 2K008 BB03 DD02 DD22 EE07 HH01 4E068 CA02 CA03 CA11 DB13 4G014 AH59 A23H AA01 AA13 AB05 AC30 5F071 AA06 JJ10 5F072 AA06 SS06 YY06
Claims (21)
ーを透明部材に照射して、前記透明部材内に微小な変質
部分を生じさせ、前記透明部材内に可視形状を形成する
ことを特徴とするエキシマレーザーによる透明部材の加
工方法。An excimer laser characterized in that a predetermined irradiation energy of an excimer laser is applied to a transparent member to generate a minutely altered portion in the transparent member and form a visible shape in the transparent member. Processing method of transparent member according to the above.
透明部材の加工方法において、前記透明部材が石英ガラ
スであることを特徴とするエキシマレーザーによる透明
部材の加工方法。2. The method for processing a transparent member using an excimer laser according to claim 1, wherein the transparent member is quartz glass.
による透明部材の加工方法において、前記エキシマレー
ザーの所定の照射エネルギーが１パルス当たり０．２５
Ｊ／ｃｍ2 から１．２Ｊ／ｃｍ2 であることを特徴とす
るエキシマレーザーによる透明部材の加工方法。3. The method for processing a transparent member using an excimer laser according to claim 1, wherein the predetermined irradiation energy of the excimer laser is 0.25 per pulse.
Working method of the transparent member by excimer laser, characterized in that the J / cm 2 is 1.2 J / cm 2.
による透明部材の加工方法において、前記エキシマレー
ザーの焦点位置を、前記透明部材の表面と裏面との間に
設定することを特徴とするエキシマレーザーによる透明
部材の加工方法。4. A method for processing a transparent member by using an excimer laser according to claim 1, wherein a focal position of the excimer laser is set between a front surface and a back surface of the transparent member. Processing method of transparent member according to the above.
透明部材の加工方法において、前記エキシマレーザーの
焦点位置を移動させ、それに伴い前記微小な変質部分の
位置を移動させることを特徴とするエキシマレーザーに
よる透明部材の加工方法。5. A method for processing a transparent member by using an excimer laser according to claim 4, wherein a focal position of the excimer laser is moved, and a position of the minute altered portion is moved accordingly. Processing method of transparent member.
透明部材の加工方法において、前記エキシマレーザーの
焦点位置の移動方向がＺ軸方向であることを特徴とする
エキシマレーザーによる透明部材の加工方法。6. The method for processing a transparent member by using an excimer laser according to claim 5, wherein a moving direction of a focal position of the excimer laser is a Z-axis direction.
透明部材の加工方法において、前記エキシマレーザーの
焦点位置の移動方向がＸ軸方向であることを特徴とする
エキシマレーザーによる透明部材の加工方法。7. The method for processing a transparent member using an excimer laser according to claim 5, wherein the moving direction of the focal position of the excimer laser is the X-axis direction.
透明部材の加工方法において、前記エキシマレーザーの
焦点位置の移動方向がＹ軸方向であることを特徴とする
エキシマレーザーによる透明部材の加工方法。8. The method for processing a transparent member using an excimer laser according to claim 5, wherein the moving direction of the focal position of the excimer laser is the Y-axis direction.
透明部材の加工方法において、前記エキシマレーザーの
照射エネルギーを調整することにより、前記微小な変質
部分の位置をＺ軸方向に移動させることを特徴とするエ
キシマレーザーによる透明部材の加工方法。9. The method for processing a transparent member using an excimer laser according to claim 1, wherein the position of the minutely altered portion is moved in the Z-axis direction by adjusting the irradiation energy of the excimer laser. Of a transparent member using an excimer laser.
る透明部材の加工方法において、薄い透明部材上にあて
板としての別の透明部材をセットし、該別の透明部材の
上方から前記エキシマレーザーを照射することにより、
前記薄い透明部材内の加工を行うことを特徴とするエキ
シマレーザーによる透明部材の加工方法。10. The method for processing a transparent member by using an excimer laser according to claim 1, wherein another transparent member is set as a plate on the thin transparent member, and the excimer laser is irradiated from above the another transparent member. By doing
A method for processing a transparent member using an excimer laser, wherein the processing is performed on the inside of the thin transparent member.
る透明部材の加工方法によって成形される透明部材の加
工品。11. A processed product of a transparent member formed by the method for processing a transparent member by the excimer laser according to claim 1.
よる透明部材の加工方法によって成形される透明部材の
加工品が光学素子であることを特徴とする透明部材の加
工品。12. A processed product of a transparent member, wherein the processed product of a transparent member formed by the method of processing a transparent member by the excimer laser according to claim 11 is an optical element.
おいて、前記光学素子は回折格子であることを特徴とす
る透明部材の加工品。13. The processed product of a transparent member according to claim 12, wherein said optical element is a diffraction grating.
おいて、前記光学素子はマスクであることを特徴とする
透明部材の加工品。14. The processed product of a transparent member according to claim 12, wherein said optical element is a mask.
おいて、前記光学素子は光導波路であることを特徴とす
る透明部材の加工品。15. The processed product of a transparent member according to claim 12, wherein the optical element is an optical waveguide.
おいて、前記光学素子はホログラムであることを特徴と
する透明部材の加工品。16. The processed product of a transparent member according to claim 12, wherein the optical element is a hologram.
おいて、前記光学素子は屈折率を変化させてなる平面レ
ンズであることを特徴とする透明部材の加工品。17. The processed product of a transparent member according to claim 12, wherein the optical element is a planar lens having a changed refractive index.
おいて、前記透明部材内部に造形物、マーク、記号、文
字が形成された透明部材の加工品であることを特徴とす
る透明部材の加工品。18. The processed product of a transparent member according to claim 11, wherein the processed product of the transparent member has a molded object, a mark, a symbol, and a character formed inside the transparent member. Goods.
おいて、前記透明部材内部に形成された造形物、マー
ク、記号、文字を側面からの光照射により浮かび上がら
せ表示することを特徴とする透明部材の加工品。19. The processed product of a transparent member according to claim 18, wherein a modeled object, a mark, a symbol, and a character formed inside said transparent member are raised and displayed by light irradiation from the side, and are displayed. Processed parts.
おいて、前記透明部材内部に流路が形成された透明部材
の加工品であることを特徴とする透明部材の加工品。20. The processed product of the transparent member according to claim 11, wherein the processed product of the transparent member has a flow path formed inside the transparent member.
おいて、前記透明部材内部に目盛が形成された透明部材
の加工品であることを特徴とする透明部材の加工品。21. The processed product of a transparent member according to claim 11, which is a processed product of a transparent member having a scale formed inside the transparent member.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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