CN213945283U

CN213945283U - Processing device for ultrafast laser PCB material

Info

Publication number: CN213945283U
Application number: CN202022773827.XU
Authority: CN
Inventors: 蒋仕彬
Original assignee: Hangzhou Yinhu Laser Technology Co ltd
Current assignee: Hangzhou Yinhu Laser Technology Co ltd
Priority date: 2020-11-25
Filing date: 2020-11-25
Publication date: 2021-08-13
Anticipated expiration: 2030-11-25

Abstract

The utility model discloses a processingequipment of ultrafast laser PCB material, including frame, laser instrument, beam expanding lens, laser light path, laser head and workstation, the laser beam that the laser instrument sent is expanded the beam through the beam expanding lens and is back conveyed to the laser head through the laser light path to focus on the processing platform and treat processing material department, its characterized in that: the laser is arranged on the servo lifting table, a laser light path is provided with a pair of transverse reflectors and a pair of vertical reflectors with the mirror surfaces forming an angle of 45 degrees with the horizontal plane, the laser head is provided with a Z-axis driving mechanism, and a two-dimensional vibrating mirror and a focusing mirror are arranged on the laser head; the workbench is provided with an X-axis driving mechanism and a Y-axis driving mechanism; the laser mainly comprises a seed laser, a fiber amplifier and a pulse controller. The utility model discloses the realization has both taken into account machining precision and efficiency to the quick processing of PCB material, has guaranteed again that the processing department does not blacken.

Description

Processing device for ultrafast laser PCB material

Technical Field

The utility model relates to a processingequipment of PCB material, concretely relates to adopt laser to carry out the device processed to the PCB material.

Background

PCB (Printed Circuit Board) is used as a connection carrier for important components or circuits in 3C products, and plays an increasingly important role with the arrival of the 5G era. In order to meet the requirements of electronic products on development in the directions of high density, miniaturization and high reliability and greatly reduce the volume of the electronic products, the PCB material is developed from a single surface to double surfaces, multiple layers and flexibility and is developed in the directions of high precision, high density and high reliability, and the volume, the cost and the performance are continuously reduced. This puts higher demands on the processing of PCB materials.

Laser forming is a contactless, direct-forming processing mode, the processed product has no raw edges, burrs, dust and high cutting precision, the thermal shock to a processed part is small in the processing process, a workpiece compounded by multiple materials can be cut at one time, mechanical stress and workpiece deformation cannot be generated, and laser is widely applied to processing of PCB materials due to the fact that device damage cannot be caused. For example, chinese invention patent CN101402158A discloses a laser cutting method for PCB board, comprising the following steps: cutting off the PCB: cutting the PCB at the designated position of the PCB at least once by adopting laser until the PCB is cut off; cleaning the cut section: and (3) polishing the cut section of the PCB by adopting laser with corresponding parameters according to the thickness of the PCB, so that black matters at the cut section of the PCB are vaporized. In addition, the laser processing is also applied to occasions such as PCB hard board splitting and drilling, FPC soft board appearance cutting and drilling, FPC cover film cutting and the like.

When the PCB material is processed by laser forming, the difficult points to be solved are as follows: blackening, machining efficiency and precision, and PCB cutting thickness range. For example, the chinese patent CN101402158A mentioned above uses carbon dioxide laser to cut, which has a large thermal influence and a black edge, so that a step of cleaning the cut section must be added, which reduces the processing efficiency, and increases the cutting gap and significantly reduces the processing precision. In addition, the thickness range of the PCB which is cut by laser in the prior art is generally below 2mm, and the larger the thickness is, the lower the processing efficiency is.

Therefore, it is desirable to provide a laser processing device for PCB material, which solves the blackening problem in the prior art and simultaneously considers the processing efficiency and precision.

Disclosure of Invention

The utility model aims at providing a processingequipment of ultrafast laser PCB material realizes the high accuracy rapid machining of PCB material to make the material not blacken in the course of working.

In order to achieve the purpose of the invention, the technical scheme adopted by the utility model is as follows: a processing device for ultrafast laser PCB materials comprises a rack, a laser, a beam expander, a laser path, a laser head and a workbench, wherein a laser beam emitted by the laser is transmitted to the laser head through the laser path after being expanded by the beam expander and is focused to a position of a material to be processed on a processing platform, a servo lifting table is connected with the rack, the laser is arranged on the servo lifting table, a pair of transverse reflectors with the mirror surfaces parallel to a horizontal plane and a pair of vertical reflectors with the mirror surfaces forming an angle of 45 degrees with the horizontal plane are arranged in the laser path, the laser head is provided with a Z-axis driving mechanism which enables the laser head to move up and down relative to the rack, and a two-dimensional vibrating mirror and a focusing mirror are arranged on the laser head; the workbench is provided with an X-axis driving mechanism and a Y-axis driving mechanism; the laser uses a fiber laser as a seed laser, the wavelength of a laser beam output by the seed laser is between 1020 nanometers and 1090 nanometers, the laser beam output by the seed laser is subjected to energy amplification through a fiber amplifier, and a pulse controller controls and outputs pulse laser with the pulse width larger than 1ps and smaller than 300 ps.

In the technical scheme, the laser beams are translated by utilizing the pair of transverse reflectors, so that the laser beams reach the vertical plane where the laser heads are located in a front-mounted mode, and then the laser beams are moved downwards to the two-dimensional vibrating mirror by the pair of vertical reflectors, and therefore the interference between the laser heads moving along the Z axis and the rack is avoided.

In the technical scheme, the pair of transverse reflectors are fixed on the frame, the first vertical reflector is positioned above the laser head and fixed relative to the frame, the second vertical reflector is positioned on the laser head, laser emitted by the laser passes through the beam expander and then is reflected for 90 degrees for the second time by the pair of transverse reflectors to realize translation, and then enters the two-dimensional vibrating mirror after being reflected by the first vertical reflector and the second vertical reflector, and the two-dimensional vibrating mirror adjusts the direction of a light beam and then is focused on a processed material on the workbench by the focusing mirror. The position of the first vertical reflector is unchanged, so that the laser beam can be received and reflected downwards, and the second vertical reflector is positioned on the laser head and keeps unchanged relative position with the two-dimensional vibrating mirror along with the movement of the laser head in the Z-axis direction.

In the technical scheme, the peak power of the laser is 0.3 MW-0.5 MW.

In the above technical solution, in the laser output, the time between adjacent laser pulses is less than 90 ns.

Or the laser output is pulse train output, the time between adjacent laser pulses in the same pulse train is less than 90ns, and the time interval between two adjacent pulse trains is 200 ns-500 ns.

According to the preferable technical scheme, in the same pulse train, the pulse width is firstly changed from small to big and then from big to small.

In a further aspect, the pulse width of the output laser varies according to the cutting or drilling location during a laser cutting or drilling process.

Because of the application of the technical scheme, compared with the prior art, the utility model has the following advantages:

1. the utility model discloses a wavelength is at the infrared laser between 1020 nanometer ~ 1090 nanometer, through pulse width setting and the power control of selecting the laser beam, realizes the quick processing to the PCB material, has both taken into account machining precision and efficiency, has guaranteed again that the processing department does not blacken, has solved the difficult problem in the processing of PCB material.

2. The utility model discloses a set up servo elevating platform, the adjustment of the laser light path of being convenient for utilizes the cooperation of a plurality of speculum to avoid laser head and frame to interfere to can conveniently utilize triaxial actuating mechanism to adjust the laser head and treat the relative position of processing material.

Drawings

Fig. 1 is a schematic view of an apparatus according to a first embodiment of the present invention.

Wherein: 1. a frame; 2. a laser; 3. a beam expander; 4. a laser light path; 5. a laser head; 6. a transverse mirror; 7. a vertical mirror; 8. a Z-axis drive mechanism; 9. a two-dimensional galvanometer; 10. a focusing mirror; 11. an X-axis drive mechanism; 12. a Y-axis drive mechanism; 13. a three-dimensional galvanometer; 14. servo elevating platform.

Detailed Description

The invention will be further described with reference to the following drawings and examples:

the first embodiment is as follows: the utility model provides a processingequipment of ultrafast laser PCB material, refers to fig. 1 and shows, has frame 1, laser instrument 2, beam expanding mirror 3, laser light path 4, laser head 5 and workstation, is connected with frame 1 and is equipped with servo elevating platform 14, and laser instrument 2 sets up on servo elevating platform 14, have a pair of mirror surface and the parallel horizontal mirror 6 of horizontal plane and a pair of mirror surface and horizontal plane become 45 vertical speculum 7 in the laser light path 4, laser head 5 has the Z axle actuating mechanism 8 that makes its relative frame 1 up-and-down motion, installs two-dimentional galvanometer 9 and focusing mirror 10 on the laser head.

The laser beam processing device comprises a laser head, a pair of transverse reflectors 6, a first vertical reflector, a second vertical reflector, a beam expander, a pair of transverse reflectors, a two-dimensional vibrating mirror 9 and a focusing mirror 10, wherein the pair of transverse reflectors 6 are fixed on a rack, the first vertical reflector is positioned above the laser head and fixed relative to the rack, the second vertical reflector is positioned on the laser head, laser emitted by the laser passes through the beam expander and then is reflected for two times by the pair of transverse reflectors for realizing translation, the laser enters the two-dimensional vibrating mirror 9 after being reflected by the first vertical reflector and the second vertical reflector successively, and the two-dimensional vibrating mirror 9 adjusts.

The workbench is provided with an X-axis driving mechanism 11 and a Y-axis driving mechanism 12, and is matched with a Z-axis driving mechanism 8 to realize the relative motion of the laser head 5 and the processed material. Therefore, under the matching of the driving mechanism and the two-dimensional galvanometer, the focusing point of the laser beam can scan at the corresponding position of the processed material according to the set path, and the cutting or drilling of the PCB material is realized.

The laser is a fiber laser as a seed laser, the wavelength of a laser beam output by the seed laser is 1020-1090 nanometers, the laser beam output by the seed laser is subjected to energy amplification by a fiber amplifier and then outputs laser, the output laser is pulse output, the pulse width is larger than 1ps and smaller than 300ps, the pulse width variation is controlled by a controller, and the peak power of the laser is 0.3-0.5 MW.

The laser beam pulse output in this embodiment can be adjusted according to the processing requirements.

For example, the pulse output may be uniformly distributed pulses in time, with the time between adjacent laser pulses being less than 90 ns.

Different pulses in the same pulse train may have different pulse widths depending on the processing requirements. Preferably, in the same pulse train, the pulse width is changed from small to large and then from large to small.

Claims

1. The utility model provides a processingequipment of ultrafast laser PCB material, includes frame, laser instrument, beam expanding lens, laser light path, laser head and workstation, the laser beam that the laser instrument sent passes through laser light path after the beam expanding lens expands and conveys the laser head to focus on the processing platform and treat processing material department, its characterized in that: the laser head is provided with a Z-axis driving mechanism which enables the laser head to move up and down relative to the rack, and the laser head is provided with a two-dimensional vibrating mirror and a focusing mirror; the workbench is provided with an X-axis driving mechanism and a Y-axis driving mechanism; the laser uses a fiber laser as a seed laser, the wavelength of a laser beam output by the seed laser is between 1020 nanometers and 1090 nanometers, the laser beam output by the seed laser is subjected to energy amplification through a fiber amplifier, and a pulse controller controls and outputs pulse laser with the pulse width larger than 1ps and smaller than 300 ps.

2. The processing device of ultrafast laser PCB material of claim 1, wherein: the pair of transverse reflectors are fixed on the frame, the first vertical reflector is located above the laser head and fixed relative to the frame, the second vertical reflector is located on the laser head, laser emitted by the laser is reflected for two times by the pair of transverse reflectors for 90 degrees after passing through the beam expander to realize translation, the laser enters the two-dimensional vibrating mirror after being reflected by the first vertical reflector and the second vertical reflector successively, and the two-dimensional vibrating mirror adjusts the direction of a light beam and then is focused on a processed material on the workbench by the focusing mirror.

3. The processing device of ultrafast laser PCB material of claim 1, wherein: the peak power of the laser is 0.3 MW-0.5 MW.