CN112276365B - Large-format laser polishing processing method for metal additive component - Google Patents
Large-format laser polishing processing method for metal additive component Download PDFInfo
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- CN112276365B CN112276365B CN202011211931.8A CN202011211931A CN112276365B CN 112276365 B CN112276365 B CN 112276365B CN 202011211931 A CN202011211931 A CN 202011211931A CN 112276365 B CN112276365 B CN 112276365B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/3568—Modifying rugosity
- B23K26/3576—Diminishing rugosity, e.g. grinding; Polishing; Smoothing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention discloses a large-breadth laser polishing method for a metal additive component, which can realize large-area precise polishing of a workpiece to be processed, and the method mainly adopts a system comprising: the system comprises a laser, an XY digital scanning galvanometer, an XY servo motion platform, an embedded servo control system, a high-bandwidth driver, a computer and an optical lifting platform. The processing process comprises the following steps: determining a scanning track and a scanning speed according to the size of the metal additive component to be processed and the polishing parameters; determining the motion tracks of an XY digital scanning galvanometer and an XY servo motion platform; an embedded servo control system controls the XY digital scanning galvanometer and the XY servo motion platform to realize closed-loop control, and a master-slave control framework is adopted. The invention realizes the automatic distribution of the reference tracks of the galvanometer and the motion platform of the large-format laser polishing system, introduces a master-slave control strategy on the basis of two closed-loop subsystems of the galvanometer and the motion platform, and improves the polishing quality and the polishing efficiency of large-format laser polishing.
Description
Technical Field
The invention relates to the technical field of laser polishing, in particular to a large-format laser polishing processing method for a metal additive component.
Background
The metal additive component is usually processed and formed by a manufacturing technology of layer-by-layer stacking forming, the stacking effect of the metal additive component is obviously shown on the surface of the component, and the rough surface has serious influence on the performance of the component, particularly the fatigue performance. Therefore, the polishing process is required for the components, and the consistency, stability and efficiency of the polishing process limit the development and application of laser rapid prototyping technology.
Laser polishing is a new material surface polishing method appearing in recent years, a laser beam with certain energy density and wavelength is used for irradiating a specific workpiece, thin-layer substances on the surface of the workpiece are melted or evaporated to obtain a smooth surface, and the method has the characteristics of non-contact flexible processing, no material limitation, no tool/abrasive material consumption, capability of performing complex curved surface/selected area or micro-area polishing, high polishing efficiency and the like, so that the method is rapidly developed and applied in the field of metal material polishing, and the motion quality of high-speed scanning motion of light spots directly determines the forming quality of the polished surface in the special laser polishing processing.
The laser scanning galvanometer has the characteristics of high speed and high precision, and is widely applied to the fields of laser cutting, polishing, punching and the like. However, in a system that adopts a galvanometer to perform polishing processing, the processing area of a single scan is limited, so that block processing is required when large-format processing is performed, and this processing mode reduces the processing quality and introduces splicing errors, and reduces the efficiency of laser processing, so that large-format efficient and high-precision laser polishing of metal additive components cannot be realized.
Disclosure of Invention
In order to solve the defects, the invention provides a large-format laser polishing method for a metal additive component.
The invention is realized by adopting the following technical scheme:
a large-breadth laser polishing processing method of a metal additive component adopts a system comprising a laser, an XY digital scanning galvanometer, an XY servo motion platform, an embedded servo control system, a high-bandwidth driver, a computer and an optical lifting platform, wherein the XY digital scanning galvanometer is arranged on the optical lifting platform and can be used for adjusting Z-direction displacement so as to adjust the distance from a processed test piece to the galvanometer; fixing a test piece to be processed on an XY servo motion platform, planning an upper-layer graph processing track by a computer, sending position instruction information to an embedded servo control system, and driving an XY digital scanning galvanometer and the XY servo motion platform to move by a high-bandwidth driver; the embedded servo control system simultaneously sends a control command to the laser to control the laser to emit light and finish polishing; the processing method comprises the following steps:
(1) and determining a scanning track and a scanning speed according to the size of the metal additive component to be processed and the polishing parameters. In the polishing process, the laser power is constant, and a constant-speed square wave pattern is adopted for scanning to realize polishing; determining the width of a large-format laser polishing area, namely the peak-to-peak value of a square wave pattern according to the size of the metal member; and determining the width and scanning speed of the square wave pulse according to the laser power and the technological parameters of polishing.
(2) And determining the motion tracks of the XY digital scanning galvanometer and the XY servo motion platform. The dynamic characteristics of an XY digital scanning galvanometer and an XY servo motion platform are combined to distribute scanning tracks, the tracks with large motion range and low dynamic requirement are distributed to the motion platform, and the tracks with small motion range and high dynamic requirement are distributed to the scanning galvanometer; and processing the processed square wave pattern to obtain the track of the XY servo motion platform, and further obtaining the track of the XY digital scanning galvanometer through vector decomposition.
(3) And the computer sends the track information obtained by preprocessing to the embedded servo control system, and the embedded servo control system simultaneously and respectively sends control instructions to the XY digital scanning galvanometer and the XY servo motion platform.
(4) The XY digital scanning galvanometer and the XY servo motion platform respectively detect motion displacement, the XY digital scanning galvanometer acquires angular displacement information by an annular grating sensor and feeds back the angular displacement information to the embedded servo control system, and the XY servo motion platform acquires position displacement information by a linear grating sensor and feeds back the position displacement information to the embedded servo control system; and the XY digital scanning galvanometer and the XY servo motion platform respectively realize position closed-loop control.
(5) The XY digital scanning galvanometer and the XY servo motion platform adopt a master-slave control framework, the error integration module compares the collected angular displacement information of the XY digital scanning galvanometer and the position displacement information of the XY servo motion platform with a target reference signal to obtain real-time error information, and feeds the real-time error information back to the XY digital scanning galvanometer subsystem for rapid error compensation, so that the precise motion of the polishing track is realized.
The invention is further improved in that the embedded servo control system adopts an ARM + FPGA control framework, and the XY digital scanning galvanometer and the XY servo motion platform can be controlled by a control board card.
The invention is further improved in that, in the step (2), the distribution of the scanning tracks respectively needs to satisfy: the scanning range of the XY digital scanning galvanometer is smaller than the allowable processing range of the galvanometer and is as small as possibleAvoid producing the light field distortion, namely:
(ii) a The acceleration of the XY servo motion platform is smaller than the allowable acceleration of the motion platform and is as small as possible to ensure the performance of the motion platform, namely:
(ii) a The vector sum of the motion tracks of the XY digital scanning galvanometer and the XY servo motion platform obtained by decomposition is a target motion track, namely:
。
the further improvement of the invention is that in the step (2), the moving average value low-pass filtering processing is carried out on the processed square wave pattern, and the track of the XY servo motion platform is obtained by selecting proper filtering parameters.
In step (5), the error synthesis module comprises a motion synthesis module and a safety protection module. The motion synthesis module converts the collected angle information of the XY digital scanning galvanometer into displacement information and synthesizes the displacement information with the displacement information of the XY servo motion platform to obtain actual processing displacement; the actual processing displacement is compared with the reference processing displacement to obtain the initial error of the polishing processing system; the safety protection module outputs the initial error of the polishing system as the error of the polishing system, meanwhile, the initial error of the polishing system is integrated, if the error integral value exceeds the angular motion range of the XY digital scanning galvanometer, the error of the output polishing system is zero, and the safety protection of the XY digital scanning galvanometer is realized.
The invention has the following beneficial technical effects:
the invention provides a large-format laser polishing method for a metal additive component. By adopting the embedded servo control system with ARM + FPGA control framework, the control of the XY digital scanning galvanometer and the XY servo motion platform by one control board card is realized, thereby fundamentally eliminating splicing errors and improving the processing quality and the processing efficiency of laser polishing.
By the XY digital scanning galvanometer, the XY servo motion platform track distribution principle and the specific track distribution method, and the large-format laser processing system controlled by master-slave motion is developed, the dynamic performance and precision of system motion can be effectively improved, and compared with the processing method which only adopts the XY digital scanning galvanometer, the processing breadth and processing efficiency are improved on one hand, and the large-format high-efficiency processing is realized; on the other hand, the introduction of the XY servo motion platform and the corresponding control strategy further improves the dynamic performance of the processing system and expands the processing range of the system. The safety protection module is introduced, so that the safety of the XY digital scanning galvanometer in the machining process can be ensured, and the error feedback is automatically stopped under the condition of over-motion stroke feedback.
Drawings
Fig. 1 is a schematic diagram of a hardware structure according to the present invention.
FIG. 2 is a schematic diagram of a control system according to the present invention.
FIG. 3 is a schematic diagram of an error synthesis module according to the present invention.
Fig. 4 is a schematic diagram of a motion trajectory of the optimized platform in the embodiment of the present invention.
Detailed Description
The invention is further illustrated with reference to the following figures and examples.
The structure of a large-format laser polishing system of a metal additive component adopted by the invention is shown in figure 1, the large-format laser polishing system comprises a laser 1, an XY digital scanning galvanometer 2, an XY servo motion platform 3, an embedded servo control system, a high-bandwidth driver, a computer and an optical lifting platform 4, wherein the XY digital scanning galvanometer 2 is arranged on the optical lifting platform 4 and can be used for adjusting Z-direction displacement so as to adjust the distance from a processed test piece to the galvanometer; fixing a test piece to be processed on an XY servo motion platform 3, planning an upper-layer graph processing track by a computer, sending position instruction information to an embedded servo control system, and driving an XY digital scanning galvanometer 2 and the XY servo motion platform 3 to move by a high-bandwidth driver; the embedded servo control system simultaneously sends a control command to the laser 1 to control the laser to emit light, and polishing is finished; the processing method comprises the following steps:
(1) and determining a scanning track and a scanning speed according to the size of the metal additive component to be processed and the polishing parameters. In the polishing process, the laser power is constant, and a constant-speed square wave pattern is adopted for scanning to realize polishing; determining the width of a large-format laser polishing area, namely the peak-to-peak value of a square wave pattern according to the size of the metal member; and determining the width and scanning speed of the square wave pulse according to the laser power and the technological parameters of polishing.
(2) Determining the motion tracks of the XY digital scanning galvanometer 2 and the XY servo motion platform 3. The dynamic characteristics of the XY digital scanning galvanometer 2 and the XY servo motion platform 3 are combined to distribute scanning tracks, the tracks with large motion range and low dynamic requirement are distributed to the motion platform, and the tracks with small motion range and high dynamic requirement are distributed to the scanning galvanometer; and processing the processed square wave pattern to obtain the track of the XY servo motion platform 3, and further obtaining the track of the XY digital scanning galvanometer 2 through vector decomposition.
(3) And the computer sends the track information obtained by preprocessing to the embedded servo control system, and the embedded servo control system simultaneously and respectively sends control instructions to the XY digital scanning galvanometer 2 and the XY servo motion platform 3.
(4) The XY digital scanning galvanometer 2 and the XY servo motion platform 3 respectively detect motion displacement, the XY digital scanning galvanometer 2 acquires angular displacement information by an annular grating sensor and feeds back the angular displacement information to the embedded servo control system, and the XY servo motion platform 3 acquires position displacement information by a linear grating sensor and feeds back the position displacement information to the embedded servo control system; the XY digital scanning galvanometer 2 and the XY servo motion platform 3 respectively realize position closed-loop control.
(5) As shown in fig. 2, the XY digital scanning galvanometer 2 and the XY servo motion platform 3 adopt a master-slave control architecture, and the error integration module compares the acquired angular displacement information of the XY digital scanning galvanometer 2 and the position displacement information of the XY servo motion platform 3 with a target reference signal to obtain real-time error information, and feeds the real-time error information back to the XY digital scanning galvanometer 2 subsystem for rapid error compensation to realize accurate motion of a polishing track.
Furthermore, the embedded servo control system adopts an ARM + FPGA control framework, and the XY digital scanning galvanometer 2 and the XY servo motion platform 3 can be controlled by a control board card.
Further, in step (2), the distribution of the scanning tracks needs to satisfy: the scanning range of the XY digital scanning galvanometer 2 is smaller than the allowable processing range of the galvanometer and is as small as possible so as to avoid generating light field distortion, namely:
(ii) a The acceleration of the XY servo motion stage 3 is smaller than the allowable acceleration of the motion stage and as small as possible to ensure the performance of the motion stage, that is:
(ii) a The vector sum of the motion tracks of the XY digital scanning galvanometer 2 and the XY servo motion platform 3 obtained by decomposition is a target motion track, namely:
。
further, in the step (2), the moving average low-pass filtering processing is performed on the processed square wave pattern, and the track of the XY servo motion platform 3 is obtained by selecting a suitable filtering parameter, as shown in fig. 4.
Further, in step (5), the error synthesis module includes a motion synthesis module and a safety protection module, as shown in fig. 3. The motion synthesis module converts the collected angle information of the XY digital scanning galvanometer 2 into displacement information and synthesizes the displacement information with the displacement information of the XY servo motion platform 3 to obtain actual processing displacement; the actual processing displacement is compared with the reference processing displacement to obtain the initial error of the polishing processing system; the safety protection module outputs the initial error of the polishing system as the error of the polishing system, meanwhile, the initial error of the polishing system is integrated, if the error integral value exceeds the angular motion range of the XY digital scanning galvanometer 2, the error of the output polishing system is zero, and the safety protection of the XY digital scanning galvanometer 2 is realized.
Claims (3)
1. A large-breadth laser polishing processing method of a metal additive component is characterized in that a system adopted by the large-breadth laser polishing processing method comprises a laser, an XY digital scanning galvanometer, an XY servo motion platform, an embedded servo control system, a high-bandwidth driver, a computer and an optical lifting platform, wherein the XY digital scanning galvanometer is installed on the optical lifting platform and can be used for adjusting Z-direction displacement so as to adjust the distance between a processed test piece and the galvanometer; fixing a test piece to be processed on an XY servo motion platform, planning an upper-layer graph processing track by a computer, sending position instruction information to an embedded servo control system, and driving an XY digital scanning galvanometer and the XY servo motion platform to move by a high-bandwidth driver; the embedded servo control system adopts an ARM + FPGA control framework, the XY digital scanning galvanometer and the XY servo motion platform can be controlled by a control board card, and meanwhile, a control instruction is sent to the laser to control the light emission of the laser so as to finish polishing processing; the processing method comprises the following steps:
(1) determining a scanning track and a scanning speed according to the size of the metal additive component to be processed and the polishing parameters, wherein in the polishing process, the laser power is constant, and the constant-speed square wave pattern is adopted for scanning to realize polishing; determining the width of a large-format laser polishing area, namely the peak-to-peak value of a square wave pattern according to the size of the metal member; determining the width and scanning speed of the square wave pulse according to the laser power and the technological parameters of polishing;
(2) determining the motion tracks of an XY digital scanning galvanometer and an XY servo motion platform, distributing the scanning tracks by combining the dynamic characteristics of the XY digital scanning galvanometer and the XY servo motion platform, distributing the tracks with large motion range and low dynamic requirement to the motion platform, and distributing the tracks with small motion range and high dynamic requirement to the scanning galvanometer; carrying out moving average low-pass filtering processing on the processed square wave pattern to obtain the track of an XY servo motion platform, and further carrying out vector decomposition to obtain the track of an XY digital scanning galvanometer;
(3) the computer sends track information obtained by preprocessing to the embedded servo control system, and the embedded servo control system simultaneously and respectively sends control instructions to the XY digital scanning galvanometer and the XY servo motion platform;
(4) the XY digital scanning galvanometer and the XY servo motion platform respectively detect motion displacement, the XY digital scanning galvanometer acquires angular displacement information by an annular grating sensor and feeds back the angular displacement information to the embedded servo control system, and the XY servo motion platform acquires position displacement information by a linear grating sensor and feeds back the position displacement information to the embedded servo control system; the XY digital scanning galvanometer and the XY servo motion platform respectively realize position closed-loop control;
(5) the XY digital scanning galvanometer and the XY servo motion platform adopt a master-slave control framework, the error integration module compares the collected angular displacement information of the XY digital scanning galvanometer and the position displacement information of the XY servo motion platform with a target reference signal to obtain real-time error information, and feeds the real-time error information back to the XY digital scanning galvanometer subsystem for rapid error compensation, so that the precise motion of the polishing track is realized.
2. The large format laser polishing processing method according to claim 1, wherein in the step (2), the distribution of the scanning tracks respectively needs to satisfy: the scanning range of the XY digital scanning galvanometer is smaller than the allowable processing range of the galvanometer so as to avoid generating light field distortion, namely:
(ii) a The acceleration of the XY servo motion platform is smaller than the allowable acceleration of the motion platform, so that the performance of the motion platform can be ensured, namely:
(ii) a The vector sum of the motion tracks of the XY digital scanning galvanometer and the XY servo motion platform obtained by decomposition is a target motion track, namely:
。
3. the large-format laser polishing method according to claim 1, wherein in step (5), the error integration module includes a motion synthesis module and a safety protection module, wherein the motion synthesis module converts the collected angle information of the XY digital scanning galvanometer into displacement information, and synthesizes the displacement information with the displacement information of the XY servo motion platform to obtain the actual processing displacement; the actual processing displacement is compared with the reference processing displacement to obtain the initial error of the polishing processing system; the safety protection module outputs the initial error of the polishing system as the error of the polishing system, meanwhile, the initial error of the polishing system is integrated, if the error integral value exceeds the angular motion range of the XY digital scanning galvanometer, the error of the output polishing system is zero, and the safety protection of the XY digital scanning galvanometer is realized.
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| CN113523541B (en) * | 2021-06-30 | 2023-06-16 | 南方科技大学 | Laser scanning synchronous stopping method and device |
| CN113448287B (en) * | 2021-07-08 | 2022-10-25 | 西安交通大学 | Photoelectric cooperative control method for large-amplitude laser processing |
| CN113910085B (en) * | 2021-09-26 | 2022-11-18 | 江苏集萃华科智能装备科技有限公司 | Control method, control device and control system of metal mirror polishing production line |
| CN115196589B (en) * | 2022-09-16 | 2023-01-10 | 清华大学 | Micro-nano preparation method and device |
| CN117620419B (en) * | 2024-01-23 | 2024-03-29 | 深圳市智鼎自动化技术有限公司 | Intelligent laser scanning galvanometer system |
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