KR101544385B1 - Laser processing system and laser processing method for continuous roll patterning - Google Patents

Abstract

The laser processing system of the present invention is a laser processing system for processing a roll surface along a predetermined processing pattern while scanning a laser beam, the laser processing system comprising: a laser oscillator for generating and outputting a laser beam; A galvanometer scanner for scanning and irradiating the laser beam onto the surface of the roll, a rotary stage for supporting the roll while rotating the roll with respect to the rotation axis, a galvanometer scanner for scanning the laser beam along the processing pattern, And a control device for controlling the driving of the laser scanner, the meter scanner, and the rotary stage, wherein the laser beam is irradiated to the roll surface, the reference laser beam being perpendicular to the center path of the laser beam, The distance between the focal depth virtual plane spaced by the focal depth (DOF) Within and a processing controller which is set up to roll processing scan area of the scanner, no galvanic meter location.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing system and a laser processing method capable of continuous roll patterning,

The present invention relates to a laser machining system and a laser machining method, and more particularly, to a laser machining system and a laser machining method capable of continuous roll patterning.

The printing roll pattern is used for a liquid crystal display (LCD), a plasma display panel (PDP), an organic light emitting diode (OLED), a solar cell, a transistor, Recently, as the flat panel display has become larger in size, a continuous and continuous printing method has become necessary on the existing roll surface.

In order to fabricate an electronic device or fabricate a metal wiring, it is important to form a fine pattern on the mold surface. Examples of the pattern forming method include an ordinary etching method, E-beam machining, diamond turning, and laser machining.

In the case of the etching method, there is a limit that the depth is limited because the pattern is formed by etching and etching the metal after coating the metal and the photoresist and performing the photolithography process. In the case of E-beam machining, ultrafine patterns can be formed, but there is a problem that a large area fine pattern can not be formed because the processing time is long and the processing amount is limited. In the case of diamond lathe machining, there is a problem that it is difficult to perform two-dimensional freeform machining due to the machining characteristics.

Until now, there have been two types of roll processing using laser. The first is processing by using the focus lens while rotating the roll at high speed, and the second is processing in the scan region by using the scanner after stopping the roll It went on. However, the first method is a point machining method using a focus lens, and since the machining is performed using a single-axis stage equipped with a rotation axis of a roll and a focus lens, there is a problem that the speed is slow. The second method is a step-and-scan method in which the scanner is moved and processed while the stage is stopped, and the stage is moved step by step again after the machining. Since discontinuous points are formed in the boundary of the scan area, not only low processing quality is caused, It is difficult to perform fine patterning of a large area.

Therefore, there is a need for a laser processing method capable of continuous roll patterning so that large-area roll surfaces do not cause discontinuities and can be processed at a high speed.

SUMMARY OF THE INVENTION In view of the above technical background, an aspect of the present invention is to provide a laser processing system capable of continuously patterning a roll surface by interlocking control of driving of a galvanometer scanner and a rotary stage.

Another aspect of the present invention provides a laser processing system that includes a variable focus adjuster and a galvanometer scanner to continuously process a pattern on a roll surface while varying the focus of the laser beam in the xy plane direction as well as the z axis direction I want to.

According to another aspect of the present invention, there is provided a laser processing system capable of variably controlling the focus of a laser beam and simultaneously processing a pattern on a roll surface by interlocking the rotation of the roll with the focus control of the laser beam in the z- I want to.

Another aspect of the present invention is to provide a laser processing method capable of continuously patterning a roll surface by interlocking and controlling the driving of a galvanometer scanner and a rotary stage.

Another aspect of the present invention is a laser processing method capable of continuously processing a pattern on a roll surface by controlling the focus of a laser beam in a x-y plane direction as well as a z- .

A laser processing system according to an embodiment of the present invention is a laser processing system for processing a roll surface along a predetermined processing pattern while scanning a laser beam, the laser processing system comprising: a laser oscillator for generating and outputting a laser beam; A galvanometer scanner for scanning and irradiating the laser beam on the surface of the roll with a predetermined angle, a rotary stage for supporting the roll while rotating the roll with respect to the rotation axis, A reference machining plane perpendicular to a center path of a laser beam irradiated to the roll surface and in contact with a surface of the roll, and a reference machining plane contacting the surface of the roll, (DOF) of the laser beam toward the rotation axis, Within the region between the virtual plane and a processing controller which is set up to roll processing scan area of the scanner, no galvanic meter location.

The roll processing scan area may be formed in a roll surface area between two boundary lines where the focal depth virtual plane meets the surface of the roll.

The galvanometer scanner according to claim 1, wherein the machining controller comprises: a scanner control board for controlling driving in a scan area of the galvanometer scanner; a rotary controller for controlling rotation of the galvanometer scanner about a rotation axis of the roll and rotation of the rotary stage; And the rotary motion board may be configured to transmit driving information of the rotary stage to the scanner control board.

And a variable focus adjuster positioned on a path of the laser beam and varying a focal length of the laser beam output from the laser oscillator.

The rotary motion board may be configured to be connected to a variable z axis driver of the variable focus adjuster to adjust a lens interval of the variable focus adjuster.

The rotary motion board may be configured to transmit drive information of the rotary stage to a variable z axis driver of the variable focus controller.

Z _{d and cr} satisfy the condition of the focal depth < Z _d &lt; Z _{d , cr} , where Z _d is the step from the reference machining plane to the machining surface of the roll _, , The rotary motion board drives the variable z axis driver, and if the condition of Z _d > Z _{d , cr} is satisfied, the rotary motion board can be configured to control the swing drive of the galvanometer scanner.

A laser processing method capable of continuous roll patterning according to another embodiment of the present invention is a laser processing method for processing a laser beam along a predetermined processing pattern while scanning a roll surface, Scanning the laser beam with a predetermined angle by using a galvanometer scanner to irradiate the laser beam onto the surface of the roll, rotating the roll with respect to the rotation axis of the roll, Wherein the control unit controls the driving of the galvanometer scanner and the rotation of the roll to be interlocked so as to scan the laser beam so as to control the reference machining plane contacting the surface of the roll while being perpendicular to the center path of the laser beam irradiated on the roll surface, (DOF) of the laser beam from the processing plane toward the rotation axis of the roll, Within the region between the virtual plane and a processing control step of setting up a roll machining scan area of the scanner, no galvanic meter location.

The roll processing scan area may be configured to be formed in a roll surface area between two boundary lines where the focal depth virtual plane meets the surface of the roll.

The machining control step may be operated to scan the laser beam within a roll machining scan area of the galvanometer scanner, and drive the galvanometer scanner to pivot about the rotation axis of the roll.

The laser processing method may further include varying a focal length of the laser beam using a variable focus controller.

The machining control step may control the driving of the x and y axes of the galvanometer scanner and the z axis displacement of the laser beam by adjusting the lens interval of the variable focus adjuster.

The machining control step may control the rotational drive of the roll and may control the variable z-axis of the variable focus adjuster and the x- and y-axes of the galvanometer scanner based on information about the rotational drive of the roll .

Z _{d, cr} is the maximum level difference is adjustable by said variable focus adjuster, Z _d is to say the step to process the surface of the roll from the reference machining plane, wherein the processing control step, focus depth <Z _d ≤ Z _{d , and cr} are satisfied, control is performed so as to vary the variable z-axis, and when the condition of Z _d > Z _{d, cr} is satisfied, the galvanometer scanner can be controlled to be swiveled.

According to the above-described laser machining system, it is possible to continuously process the pattern on the roll surface by interlocking the drive of the galvanometer scanner and the rotary stage.

In addition, the laser beam can be continuously patterned on the roll surface while varying the focus of the laser beam in the x-y plane direction as well as the z-axis direction using a variable focus controller and a galvanometer scanner.

In addition, the focal point of the laser beam is variably controlled and the rotation of the roll is interlocked with the focus control of the z-axis direction of the laser beam, so that laser patterning can be continuously performed on the roll surface.

Furthermore, by performing continuous laser patterning on the roll surface, an accelerating process can be achieved as a result of continuous machining during large area machining.

1 is a schematic view showing a laser processing system according to an embodiment of the present invention.
FIGS. 2A and 2B are views for setting a scan region when processing a roll surface using a laser processing system according to an embodiment of the present invention.
FIG. 3 is a schematic view showing a state in which a laser processing system according to an embodiment of the present invention is transported in a direction parallel to a rotation axis of a roll.
FIG. 4 is a view showing an exemplary processing pattern to be processed on the surface of a roll using a laser processing system according to an embodiment of the present invention, wherein (A) is a view showing a roll, (B) (C) is a view obtained by dividing the machining pattern to be machined on the surface by the scan area when machining by the step-and-scan method, and (D) Fig.
5 is a block diagram illustrating a machining controller configuration of a laser machining system according to an embodiment of the present invention.
Fig. 6 is a view exemplarily showing a processing pattern requiring reverse rotation of the roll. Fig.
7A and 7B are views showing reference coordinates of a roll as an object to be processed.
8 is a view for explaining a z-axis step difference compensation method of a laser machining system according to an embodiment of the present invention.
9A and 9B are views for explaining driving of the variable focus adjuster of the laser processing system according to an embodiment of the present invention.
10A to 10D are diagrams for explaining a processing scenario of a laser machining system according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and the same or similar components are denoted by the same reference numerals throughout the specification.

The term "on " in the present invention means to be located above or below the object member, and does not necessarily mean that the object is located on the upper side with respect to the gravitational direction.

1 is a schematic view showing a laser processing system according to an embodiment of the present invention.

Referring to FIG. 1, a laser processing system 100 according to the present embodiment is a system for processing a laser beam L along a predetermined processing pattern while scanning the surface of a roll 50, and includes a laser oscillator 10, A focus adjuster 20, a galvanometer scanner 30, and an F-theta lens 40. A telecentric lens may be used instead of the F-theta lens 40. When the laser beam L is generated and output from the laser oscillator 10, the laser beam L is transmitted to the galvanometer scanner 30 through the variable focus adjuster 20. The galvanometer scanner 30 reflects the incident laser beam L toward the reference processing plane of the roll 50. At this time, the laser beam L passes through the F-theta lens 40, Scanning is done. The reference processing plane may be defined as a plane perpendicular to the center path of the laser beam L irradiated toward the roll 50 via the galvanometer scanner 30 and in contact with the surface of the roll 50 .

The variable focus adjuster 20 is located on the path of the laser beam L outputted from the laser oscillator 10 and adjusts the interval between the concave lens 23 and the convex lens 25 provided therein to adjust the distance The focal position of the beam L is varied in the z-axis direction (direction perpendicular to the reference processing plane). For example, when the convex lens 25 is fixed and the concave lens 23 is reciprocated along the path of the laser beam L, the laser beam L arriving at the surface of the roll 50, The focal point of the light beam is varied in the z-axis direction. Laser processing can be performed without driving the variable focus adjuster 20 according to processing conditions, and may be omitted from the configuration of the laser processing system 100. [ The driving of the variable focus adjuster will be described later.

The galvanometer scanner 30 receives laser machining data on the processing pattern of the surface of the roll 50 and applies two galvanometers 301 and 303 to control the scan position of the laser beam L can do. The galvanometers 301 and 303 can control the scan position of the laser beam L to move on the x-y plane by using the servomotors 301a and 303a and the mirrors 301b and 303b connected thereto. An encoder (not shown) may be connected to the servo motors 301a and 303a to detect the positions of the mirrors 301b and 303b according to the rotation of the servo motors 301a and 303a and output a feedback signal.

FIGS. 2A and 2B are views for setting a scan region when processing a roll surface using a laser processing system according to an embodiment of the present invention.

The galvanometer scanner 30 of the laser processing system 100 has a constant planar machining scan area S and the galvanometers 301 and 303 are positioned within the planar machining scan area S on the mirrors 301b, The laser beam L is moved and processed. The planar processing scan area S may be formed as a rectangular area having a first width (width in the x-axis direction) of a mm and a second width of b mm, and is usually a square area (a = .

In the case of a curved surface such as a roll surface, a scan region is formed in a region further reduced in a direction perpendicular to the rotation axis of the roll (x-axis direction in the drawing) than in the case of planar processing. That is, the laser beam L has a certain depth of focus (DOF) around a focus having the strongest intensity, and the laser processing is performed within the range of the DOF. In general, the depth of focus (DOF) is defined as the distance at which the intensity at the focus is I _max , the intensity being I _max (1 / e). Thus, when machining along the roll surface, the scan area can be set to an area that falls within a range spaced apart in the direction toward the rotation axis of the roll by the depth of focus DOF with respect to the reference machining plane.

2A, two boundary lines (FIG. 2A) in which a virtual plane (hereinafter referred to as a "focal depth virtual plane") spaced from the reference processing plane toward the rotational axis of the roll by the depth of focus DOF A roll processing scan area S 'is defined within an area between the two boundary lines. That is, assuming that a straight line distance between the two boundary lines is a ', a first width (width in the x-axis direction) of the roll processing scan area S' is a ' Width &quot; is equal to &quot; b &quot; equal to the vertical width of the planar processing scan region S.

The roll processing scan area S 'may vary depending on the radius r of the roll 50. The larger the radius r of the roll 50 is from the same plane machining scan area S, The first width a 'of the processed scan area S' becomes larger. However, if the radius r of the roll 50 is sufficiently large to include the planar machining scan area S in an area between the reference machining plane and the DOF virtual plane, the roll machining scan area S 'and the scan area S ) Are the same.

On the other hand, the size of the first width a 'of the roll processing scan area S' is determined by the following formulas 1 and 2 according to the radius r of the roll 50 and the focal depth DOF of the laser beam L: .

Where r is the radius of the roll and θ _DOF is the central angle between the boundary line where the DOF virtual plane meets the roll surface and the line where the reference machining plane meets the roll surface.

That is, the first width a 'of the roll processing scan area S' is determined by the radius r of the roll 50 and the focal depth DOF of the laser beam L using Equations (1) and (2) ).

Referring to FIG. 2B, when the first width a 'of the roll processing scan area S' is smaller than the first width a of the planar processing scan area S, the roll processing scan area S ' And a longer rectangular shape.

FIG. 3 is a view schematically showing a state in which a laser processing system according to an embodiment of the present invention is transported in a direction parallel to a rotational axis of rotation of a roll.

3, the scanner 30 of the laser processing system 100 according to the present embodiment can be transported in the direction (Y-axis direction) parallel to the rotation axis of the roll 50 using the linear motor 35 . The Y axis is indicated by a Y axis in order to distinguish the direction parallel to the y axis which is the driving axis of the laser beam L by the galvanometer mirror or the axis of the scanner 30.

That is, the scanner 30 of the laser processing system 100 according to the present embodiment can scan and process the laser beam L in the x-axis and y-axis directions within the scan area, It is possible to expand the machining area by moving it in the axial direction. In other words, the galvanometers 301 and 303 can drive the laser beam L in the y-axis direction within the scanning range by the galvanometer scanner 30, and the galvanometer scanner 30 can move The galvanometer scanner 30 can be moved by the linear motor 35 in the Y-axis direction.

FIG. 4 is a view showing an exemplary processing pattern to be processed on the surface of a roll using a laser processing system according to an embodiment of the present invention, wherein (A) is a view showing a roll, (B) (C) is a view obtained by dividing the machining pattern to be machined on the surface by the scan area when machining by the step-and-scan method, and (D) Fig.

The scan area S can be set for laser processing the surface of the roll 50 shown in FIG. 4A by the processing pattern F shown in FIG. 4 (B) 4 (C), the entire area is divided into a scan area S and the scanner is sequentially moved by the scan area S (step-and-scan method).

When the movement of the scanner and the scan control of the laser beam L by the mirror of the galvanometer scanner are interlocked, the conveyance path K of the scanner is set according to the form of the processing pattern F as shown in Fig. 4 (D) . The conveying path K of the scanner shown in FIG. 4D can be set by a combined path in which the Y-axis driving of the scanner and the rotational driving (R-axis driving) of the roll 50 are interlocked. Thus, while the scanner moves along the conveying path K, the galvanometer controls the laser beam L in the scan area so that it can move along the processing pattern F and be processed.

The processing pattern F may be prepared in advance and prepared as CAD data, and input to the processing controller to be a driving control reference for the scanner and the roll.

5 is a block diagram illustrating a machining controller configuration of a laser machining system according to an embodiment of the present invention.

5, the machining controller according to the present embodiment includes a scanner control board 130, a Y-axis stage motion board 140, and a rotary motion board 150. As shown in FIG. The scanner control board 130 is connected to the x-axis driver 131 and the y-axis driver 133 of the galvanometer scanner 30 to control driving of the galvanometer x-axis 135 and y-axis 137, respectively . The galvanometer x-axis and y-axis control signals are input to the x- and y-axis encoders in the scanner head 30. The Y-axis stage motion board 140 receives a Y-axis driving signal from the scanner head 30 to control movement in the Y-axis direction. The Y-axis driving signal is also supplied to the scanner control board 130 and is combined with the galvanometer x-axis and y-axis driving signals to drive the scanner head 30. [

The rotary motion board 150 controls the rotation driving (R axis driving) of the roll 50 as an object to be processed and transmits the R axis driving signal to the variable z axis driver 151, The focus position of the laser beam L can be varied in the z-axis direction by controlling the driving of the lens 23. [ The rotary motion board 150 may transmit an R-axis driving signal, which is a rotation driving signal of the rotary stage, to the scanner control board 130, and may be combined with the galvanometer x-axis and y-axis driving signals. The rotary motion board 150 is connected to a T-axis motion driver 153 to control rotation of the scanner head 30 in the T-axis direction. The T-axis driving signal for controlling the T-axis direction rotational driving is transmitted to the variable z-axis driver 151 and the scanner control board 130 and is supplied to the galvanometer x-axis, y-axis driving signal, It is possible to control the operation of the scanner head 30 or the variable focus adjuster 20 in conjunction with each other.

Hereinafter, a processing control method applied in accordance with the machining area will be described with reference to FIGS. 6 to 9. FIG.

6A and 6B are views showing a reference pattern of a roll, which is an object to be processed, according to an embodiment of the present invention.

6 and 7, a description will be given of the roll surface machining in which the galvanometer scanner is rotated along the rotation direction of the roll and the machining area is further expanded.

7, the T-axis direction may be defined as a direction perpendicular to the rotation axis of the roll 50 and in contact with the surface of the roll 50, and the z-axis direction may be defined by the center path of the laser beam L, 50 toward the center C of the cross section. The y-axis direction is parallel to the rotation axis of the roll 50, and the x-axis direction can be defined as a direction perpendicular to the y-z plane.

As shown in FIG. 6, in order to continuously process the portion A, it is necessary to ideally convert the rotation direction of the roll 50 inversely. Instead, the roll 50 is rotated in the positive direction at the minimum speed The galvanometer scanner 30 may be rotated at a predetermined angle along the T axis to move the scan area S to allow continuous processing. Therefore, the position information of the R axis, which is the rotation direction of the roll, the Y axis, which is parallel to the rotation axis of the roll, and the T axis, which is the turning direction of the galvanometer scanner 30, are transmitted to the scanner, And then compares the corrected pattern data with the processing pattern data, and then transmits the corrected command to the galvanometer scanner 30 through the scanner control board.

8 is a view for explaining a z-axis step difference compensation method of a laser machining system according to an embodiment of the present invention.

Referring to FIG. 8, a basic roll surface processing using a galvanometer scanner and a roll surface processing using a variable focus controller together with a galvanometer scanner are described.

The processing area (scan area) of the scanner is determined by the F-theta lens (or telecentric lens) at the time of planar processing, but the processing area of the scanner is changed according to the diameter of the roll at the time of roll processing. In general, laser machining is preferably performed within a range of depth of focus (DOF), and in order to continuously process a processing pattern (e.g., a pre-designed CAD drawing) on a roll surface, (The direction perpendicular to the rotation axis of the roll and the center path of the laser beam) of the scan area so that the maximum change amount in the direction is smaller than or equal to the focal depth DOF so that the scanner scans in the set xy plane range Can be controlled to be driven. Therefore, when the basic roll surface is machined, the scan area becomes smaller as the roll diameter is smaller than that of the flat surface.

The real-time position information (R-axis driving information and Y-axis driving information) of the rotary stage (the stage on which the roll is mounted and rotated) and the Y-axis stage are received from the x and y axis encoders of the scanner control board and compared with the coordinates And the processing is performed while being corrected by the scanner.

As described above, the variable focus adjuster 20 can be applied to compensate for the reduction of the scan area during the roll surface machining and to enlarge the scan area. That is, by changing the focal point of the laser beam L irradiated on the roll surface by the galvanometer scanner in an area deviating from the focal depth DOF of the laser beam L, the scan area is expanded in the x- can do.

Referring to FIG. 8, the laser beam L scanned by the galvanometer scanner 30 passes through the F-theta lens 40 and is uniformly scanned. However, since the surface of the roll 50 is curved, the laser beam L off the center path reaches the machining surface spaced a predetermined distance Z _d from the reference machining plane. Therefore, since the laser beam L focused on the reference machining plane is out of focus on the machined surface, it is necessary to vary the focus of the laser beam L according to the spaced distance Z _d . Assuming that the radius of the roll 50 is r and the central angle with respect to the central path of the machining surface point at which the laser beam L has reached is θ, the distance Z _d from the reference machining plane to the machining surface is expressed by the following equations Can be calculated as follows.

At this time, the center angle corresponding to the distance Z _{d, cr} to, machining from a reference machining plane surface when said adjustable up to a step at a variable focus adjuster (20) Z _{d, cr} can be defined as θ _cr.

On the other hand, the roll rotation axis is very large in acceleration / deceleration and causes an error in the reverse rotation or a mechanical load. Therefore, it is necessary to additionally add a shaft (T axis) to which a relatively light weight galvanometer scanner is fixed so that the shape of the processing pattern can be reversed, so that the galvanometer scanner Can be driven and processed. At this time, the T axis means an axis about which the scanner rotates around the rotation axis of the roll.

The rotary motion board 150 selectively drives the variable z axis driver 151 according to the magnitude of the distance Z _d from the reference machining plane of the roll 50 to the machining surface of the roll 50, Or is configured to drive the T-axis motion driver 153 to swivel the galvanometer scanner.

That is, if Z _d is greater than or equal to the maximum step difference Z _{d , cr} (focus depth <Z _d ≤ Z _{d , cr} ) greater than the focus depth DOF and adjustable by the variable focus adjuster 20 _, 150 drives the variable z axis driver 151, and if Z _d is greater than Z _{d , cr} (Z _d > Z _{d , cr} ) The rotary motion board 150 drives the T axis motion driver 153. Therefore, if the distance from the reference machining plane of the roll 50 to the machining surface of the roll 50 is within the maximum step difference (Z _{d , cr} ) adjustable by the variable focus adjuster 20 (Z _d ≤ Z _{d, cr),} wherein, while fixing the roll 50 or scanning the laser beam (L) to the xyz axes to drive the variable focus adjuster 20 and the galvanometer scanner 30 in a state in which rotation at a low speed The surface of the roll 50 can be patterned. When the distance from the reference machining plane to the machining surface deviates from the maximum step difference (Z _{d , cr} ) adjustable by the variable focus adjuster 20, the variable focus adjuster 20 and the galvanometer The surface of the roll 50 can be patterned while scanning the laser beam L by driving the meter scanner 30.

The T-axis motion driver 153 transmits the T-axis motion drive signal to the variable z-axis driver 151 for the above-described drive control, and the variable z-axis driver 151 reflects the T- It is possible to control the variable z-axis drive. In addition, the rotary motion board 150 transmits the R-axis motion drive signal of the rotary stage to the scanner control board 130, and the T-axis motion driver 153 transmits the T-axis motion drive signal to the scanner control board 130 Axis and y-axis driving of the galvanometer scanner 30 can be controlled by reflecting the distance of the machining surface relative to the machining reference plane.

9A and 9B are views for explaining driving of the variable focus adjuster of the laser processing system according to an embodiment of the present invention.

Referring to FIG. 9, the principle of the variable focus adjuster 20 is to mechanically change the distance d value between the concave lens 23 and the convex lens 25 to change the focal length f. In general, if d becomes long, the focal length f becomes shorter, and experimentally, a proportional expression of d and f (or Z _d ) is obtained, and d is changed by a desired Z _d .

The variable focus adjuster 20 has a limitation in the range of adjusting the distance d when it includes only the function of adjusting the distance between one convex lens 25 and one concave lens 23. Therefore, Z _d > Z _{d , cr} ), the T-axis motion driver 153 is driven to rotate the scanner 30 by? _Cr so that Z _d = 0 and then re-machined.

10A to 10D are diagrams for explaining a processing scenario of a laser machining system according to an embodiment of the present invention.

는 하기 수학식 2와 같이 로터리 스테이지의 회전경로 벡터

와 스캐너(30)의 가공경로 벡터

의 벡터합으로 계산될 수 있다(도 10의 (B)참조).In the laser machining system of this embodiment, when the rotational direction of the rotary stage for rotating the roll 50 and the machining direction of the galvanometer scanner 30 are the same as in Fig. 10 (A)

Is expressed by the following equation (2)

And the processing path vector of the scanner 30

(See Fig. 10 (B)).

는 스캐너(30)의 x축 경로 벡터

와 y축 경로 벡터

의 합이다.here,

Axis path vector of the scanner 30

And y-axis path vectors

.

If only the stage equipped with the rotary stage and the uniaxial focus lens is constituted, the machining path is shortened and the machining speed is also reduced (see Fig. 10 (C)).

는 오브젝티브 렌즈의 1축 방향(y축 방향) 가공경로 벡터이다.10 (C)

Axis direction (y-axis direction) processing path vector of the objective lens.

는 상대적으로 음의 방향으로 움직이게 되고, 로터리 스테이지 회전방향과 반대 방향의 가공 경로를 구성할 수 있다.On the other hand, when the machining direction is the direction opposite to the rotation direction of the roll 50, the roll 50 has to be rotated in the reverse direction in the past. However, in the laser machining system according to the present embodiment, , The scanner 30 may be driven in the direction opposite to the rotation direction of the rotary stage along the T axis path in a state in which the rotation speed of the rotary stage is reduced or stopped. Referring to FIG. 10D, as the scanner 30 rotates in the direction opposite to the rotation direction of the rotary stage along the T axis path, the x axis path vector of the scanner 30

Is relatively moved in the negative direction, and can form a machining path in the direction opposite to the rotational direction of the rotary stage.

 While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, And it goes without saying that the invention belongs to the scope of the invention.

100: laser processing system L: laser beam
10: laser oscillator 20: variable focus adjuster
23: concave lens 25: convex lens
30: galvanometer scanner 35: linear motor
40: F-theta lens 50: Roll
130: scanner control board 131: x-axis driver
133: y-axis driver 135: galvanometer x-axis
137: Galvanometer y axis 150: Rotary motion board
151: z axis driver 153: T axis motion driver
301, 303: Galvanometer scanner 301a, 303a: Servo motor
301b, 303b: mirror F: machining pattern
K: Feed path S: Scan area

Claims (14)

1. A laser processing system for processing a roll surface along a predetermined processing pattern while scanning a laser beam,
A laser oscillator for generating and outputting the laser beam;
A galvanometer scanner that reflects the laser beam at a predetermined angle and scans and irradiates the laser beam onto the roll surface;
A rotary stage for supporting the roll and supporting the roll while rotating the roll with respect to the rotary shaft;
Wherein the galvanometer scanner and the rotary stage are interlocked with each other so as to scan the laser beam along the machining pattern, and a reference machining plane perpendicular to the center path of the laser beam irradiated on the roll surface, And a machining controller for setting a roll machining scan area of the galvanometer scanner within an area between the reference machining plane and a focal depth virtual plane spaced by a focal depth (DOF) of the laser beam from a rotation axis of the roll,
Lt; / RTI &gt;
Wherein the machining controller comprises:
A scanner control board for controlling driving in the scan area of the galvanometer scanner,
And a rotary motion board for controlling the rotational speed of the rotary stage to be continuously variable,
Wherein the rotary motion board is configured to transmit driving information of the rotary stage to the scanner control board in real time. The method according to claim 1,
Wherein the roll processing scan area is formed in a roll surface area between two boundary lines where the focal depth virtual plane meets the surface of the roll. The method according to claim 1,
Wherein the rotary motion board is configured to control the pivot drive about the rotational axis of the roll of the galvanometer scanner. The method of claim 3,
Further comprising a variable focus adjuster located on a path of the laser beam and varying a focal length of the laser beam output from the laser oscillator. 5. The method of claim 4,
The rotary motion board includes:
Wherein the variable focus adjuster is connected to a variable z axis driver of the variable focus adjuster to adjust the lens spacing of the variable focus adjuster. 6. The method of claim 5,
Wherein the rotary motion board is configured to transmit drive information of the rotary stage to a variable z-axis driver of the variable focus adjuster. The method according to claim 6,
Z _{d , cr} is a maximum step difference adjustable by the variable focus adjuster,
And a step from the reference machining plane to the machining surface of the roll is Z _d ,
If the condition of the focus depth < Z _d &lt; Z _{d , cr} is satisfied, the rotary motion board drives the variable z-
Characterized in that the rotary motion board is configured to control the pivotal drive of the galvanometer scanner if the condition Z _d & _{gt ; d d , cr} is satisfied. A laser processing method for processing a laser beam along a predetermined processing pattern while scanning the surface of a roll,
Generating and outputting the laser beam;
Reflecting the laser beam at a predetermined angle using a galvanometer scanner, scanning the laser beam and irradiating the surface of the roll;
Rotating the roll with respect to a rotation axis of the roll;
And controlling the driving of the galvanometer scanner and the rotation of the roll so as to scan the laser beam along the processing pattern and controlling a reference to be perpendicular to the center path of the laser beam irradiated on the roll surface, A machining plane and a roll machining scan region of the galvanometer scanner are located within an area between the reference machining plane and a focal depth virtual plane spaced from the reference machining plane by a focal depth DOF of the laser beam Processing control step
Lt; / RTI &gt;
The machining control step includes:
Controlling the rotation speed of the roll to be continuously variable according to the processing pattern,
And controlling the x-axis and the y-axis of the galvanometer scanner based on real-time information on rotational drive of the roll. 9. The method of claim 8,
Wherein the roll processing scan area is set to be formed in a roll surface area between two boundary lines where the focal depth virtual plane meets the surface of the roll. 9. The method of claim 8,
The machining control step includes:
Driving the laser beam to scan within a roll machining scan area of the galvanometer scanner,
Characterized in that the galvanometer scanner is driven to pivot about the rotation axis of the roll. 9. The method of claim 8,
Further comprising the step of varying a focal length of the laser beam using a variable focus adjuster. 12. The method of claim 11,
The machining control step includes:
Controls the driving of the x and y axes of the galvanometer scanner,
And controlling the z-axis displacement of the laser beam by adjusting a lens interval of the variable focus adjuster. 12. The method of claim 11,
The machining control step includes:
And controlling the variable z-axis of the variable focus adjuster based on information on the rotational drive of the roll. 14. The method of claim 13,
Z _{d, cr} is a maximum step difference adjustable by the variable focus adjuster,
And Z _d is a step from the reference machining plane to the machining surface of the roll,
The machining control step includes:
And controls the variable z-axis to vary when the condition of the focal depth < Z _d &lt; Z _{d, cr} is satisfied,
And when the condition of Z _d > Z _{d, cr} is satisfied, the galvanometer scanner is controlled so as to be swiveled.

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