JP2008009661A5

JP2008009661A5 -

Info

Publication number: JP2008009661A5
Application number: JP2006178823A
Authority: JP
Filing date: 2006-06-28
Publication date: 2009-05-28
Anticipated expiration: 2026-06-28

Claims

Laser processing for setting processing data based on a desired processing pattern for a laser processing apparatus capable of processing a desired processing pattern by irradiating a laser beam onto a three-dimensional processing target surface of the processing target A data setting device,
A machining condition setting unit for setting machining conditions for machining with a desired machining pattern;
Based on the processing conditions set by the processing condition setting unit, a processing data generation unit for generating processing data for performing actual processing,
With
The machining condition setting unit further includes
Machining pattern input means for inputting machining pattern information;
A machining surface profile input means for inputting profile information relating to the three-dimensional shape of the machining target surface;
A moving speed input means for inputting the moving condition of the surface to be machined;
With
The laser processing data setting device, wherein the processing data generation unit generates processing data based on the processing conditions set by the processing condition setting unit and a three-dimensional processing target surface.

The laser processing data setting device according to claim 1,
As the machining conditions for the circumferential machining target surface, the machining surface profile input means can specify the coordinates and / or radius of the circumference of the circumferential machining target surface,
The laser processing data setting device, wherein the moving speed input means is configured to be able to specify a rotational speed of a circumferential processing target surface.

The laser processing data setting device according to claim 1 or 2,
A laser characterized in that the machining surface profile input means can designate a change state of the circumference as a machining condition when the circumferential radius of the circumferential workpiece surface changes continuously or discretely. Processing data setting device.

The laser processing data setting device according to any one of claims 1 to 3,
The machining surface profile input means can specify the circumference radius of the circumferential machining target surface as a machining condition for the rotating circumferential machining target surface,
The moving speed input means can specify the rotational speed of the circumferential processing target surface,
The machining data generation unit follows the circumferential machining target surface along the circumference based on the radius of the circumference input from the machining surface profile input unit and the rotation angle input from the moving speed input unit. The laser processing data setting device is divided into a plurality of regions and assigned to perform processing in each divided region every time the circumferential processing target surface rotates.

The laser processing data setting device according to claim 4,
The machining data generation unit is configured to be able to adjust the allocation of divided areas to the circumferential machining target surface according to the distribution of the machining data amount in the circumferential direction of the generated machining data. Data setting device.

A laser processing apparatus capable of processing a processing pattern by adjusting a focal position of laser light with respect to a three-dimensional processing target surface of a processing target,
A laser oscillation unit for generating laser light;
As a laser beam scanning system for scanning the laser beam emitted from the laser oscillation unit in the work area,
A beam expander including an incident lens and an exit lens, the optical axis of the incident lens and the exit lens being aligned with the optical axis of the laser light emitted from the laser oscillation unit; A beam expander that can adjust the focal length of the laser light by changing the relative distance of
A first mirror for scanning the laser light transmitted through the beam expander in a first direction;
A second mirror for causing the laser beam reflected by the first mirror to scan in a second direction substantially orthogonal to the first direction;
A laser beam scanning system having
A laser control unit for controlling the laser oscillation unit and the laser beam scanning system;
A machining condition setting unit for setting machining conditions for machining with a desired machining pattern;
Based on the processing conditions set by the processing condition setting unit, a processing data generation unit for generating processing data for performing actual processing,
With
The machining condition setting unit further includes
Machining pattern input means for inputting machining pattern information;
A machining surface profile input means for inputting profile information relating to the three-dimensional shape of the machining target surface;
A moving speed input means for inputting the moving condition of the surface to be machined;
With
The laser processing apparatus, wherein the processing data generation unit generates processing data based on a processing condition set by the processing condition setting unit and a three-dimensional processing target surface.

It is a laser processing apparatus of Claim 6, Comprising:
The first mirror and the second mirror are composed of galvanometer mirrors, which are connected to a galvanometer scanner that can rotate around a substantially orthogonal rotation axis to constitute an X-axis scanner and a Y-axis scanner,
The beam expander constitutes a Z-axis scanner capable of adjusting the relative distance between the incident lens and the outgoing lens along these optical axes,
The laser beam scanning system is configured such that the X-axis scanner, the Y-axis scanner, and the Z-axis scanner can scan the laser beam in the X-axis, Y-axis, and Z-axis directions.

Laser processing for setting processing data based on a desired processing pattern for a laser processing apparatus capable of processing a desired processing pattern by irradiating a laser beam onto a three-dimensional processing target surface of the processing target A data setting method,
A step of inputting machining pattern information, profile information relating to the three-dimensional shape of the machining target surface, and moving conditions of the machining target surface in order to set machining conditions by the machining condition setting means for machining with a desired machining pattern When,
A step of generating processing data for performing actual processing so that the processing data generation means matches the three-dimensional processing target surface based on the processing conditions set by the processing condition setting means;
A laser processing data setting method comprising:

Laser processing for setting processing data based on a desired processing pattern for a laser processing apparatus capable of processing a desired processing pattern by irradiating a laser beam onto a three-dimensional processing target surface of the processing target A data setting program,
A function for inputting machining pattern information, profile information relating to the three-dimensional shape of the machining target surface, and movement conditions for the machining target surface in order to set the machining conditions by the machining condition setting means for machining with a desired machining pattern. When,
A function for generating processing data for performing actual processing so that the processing data generating means matches the three-dimensional processing target surface based on the processing conditions set by the processing condition setting means;
A machining data setting program characterized by causing a computer to realize the above.