KR101796198B1 - Laser processing apparatus and laser processing method using the laser processing apparatus - Google Patents
Laser processing apparatus and laser processing method using the laser processing apparatus Download PDFInfo
- Publication number
- KR101796198B1 KR101796198B1 KR1020150123208A KR20150123208A KR101796198B1 KR 101796198 B1 KR101796198 B1 KR 101796198B1 KR 1020150123208 A KR1020150123208 A KR 1020150123208A KR 20150123208 A KR20150123208 A KR 20150123208A KR 101796198 B1 KR101796198 B1 KR 101796198B1
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- KR
- South Korea
- Prior art keywords
- scanner
- laser beam
- driving
- laser
- light source
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/044—Seam tracking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
Abstract
A laser processing apparatus and a laser processing method using the same are disclosed. The disclosed laser machining apparatus includes a laser light source, a first scanner for rotating the laser beam emitted from the laser light source by driving, and a second scanner for rotating the laser beam emitted from the first scanner A second scanner for moving the emitted laser beam to a predetermined position of the object, and a scanner controller for controlling driving of the first scanner and the second scanner.
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to laser processing, and more particularly, to a laser processing apparatus capable of reducing processing time and a laser processing method using the same.
The laser processing apparatus irradiates an object to be processed with a laser beam emitted from a laser light source by using an optical system, and performs marking, exposure, etching, punching punching, scribing, dicing, and the like.
In such a laser machining operation, if a single scanner is used for machining, the desired shape can not be machined at high speed due to frequent acceleration and deceleration. In particular, when the scanner is required to perform a linear movement with a high circular motion, the processing speed may be slower.
In addition, the area (i.e., the machining field) in which the scanner can process the laser beam by scanning the object with the laser beam is limited in the optical configuration of the laser machining apparatus. In order to solve this problem, it is possible to process the entire area of the object by moving the stage in the direction parallel to the object (e.g., the x-axis and the y-axis) after loading the object on the stage. In such a machining method, there is a problem that the machining time is delayed in that the machining operation can not be performed in a state in which the workpiece is moved by the stage. On the other hand, the scanner may perform a machining operation on the object in a state in which the object always moves by the stage, and this laser machining method is called a 'flying' machining method.
The present embodiment provides a laser processing apparatus capable of reducing processing time and a laser processing method using the same.
A laser processing apparatus according to an embodiment of the present invention is a laser processing apparatus for processing an object to be processed placed on a stage using a laser, comprising: a laser light source; A first scanner for rotating the laser beam emitted from the laser light source by driving; A second scanner for moving the laser beam emitted from the first scanner to a predetermined position of the object by driving; And a scanner controller for controlling driving of the first scanner and the second scanner.
And a position tracking unit for tracking the machining position of the object and transmitting the tracking position to the scanner control unit.
And an angle amplifier which is provided between the first scanner and the second scanner and amplifies a rotation radius of the laser beam emitted from the first scanner.
The first scanner may include a pair of first and second mirrors driven with a predetermined phase difference.
A beam delivery system may be provided on the optical path of the laser beam.
A laser processing method according to one embodiment of the present invention includes a laser light source; A first scanner for rotating the laser beam emitted from the laser light source by driving; A second scanner for moving the laser beam emitted from the first scanner to a predetermined position of the object to be processed by driving; And a scanner controller for controlling driving of the first scanner and the second scanner, the method comprising: forming a hole in the object to be processed, the method comprising: Rotating the laser beam emitted from the laser light source to a size corresponding to the hole to be processed; Driving the second scanner to position the laser beam emitted from the first scanner in a machining area of the object to be processed; And emitting the laser beam from the laser light source to form the hole in the machining area of the object.
The driving of the first scanner and the second scanner can be controlled in synchronization with each other.
Wherein the step of positioning the laser beam in the machining area of the object to be processed traces the position of the machining area of the object to which the position tracking unit is moving and transmits the track to the scanner controller, And controlling the driving of the second scanner to move along the machining area of the object.
The scanner control unit may control the second scanner to perform a machining operation at a predetermined position of the object in consideration of the moving speed of the stage and the driving speed of the second scanner.
A laser processing method according to an embodiment of the present invention includes a laser light source; A first scanner for rotating the laser beam emitted from the laser light source by driving; A second scanner for moving the laser beam emitted from the first scanner to a predetermined position of the object to be processed by driving; And a scanner controller for controlling the driving of the first scanner and the second scanner, the method comprising the steps of: forming a line on the object to be processed placed on the stage using the laser processing apparatus, Driving a scanner to rotate the laser beam emitted from the laser light source; And moving the rotating laser beam along a line to be processed by driving the second scanner.
The driving of the first scanner and the second scanner can be controlled in synchronization with each other.
Wherein the step of moving the rotating laser beam along a line to be machined transmits a machining position of the object to be machined to which the position tracking unit is moving to a scanner control unit, And controlling the driving of the second scanner to move along the machining position.
The scanner control unit may control the second scanner to perform a machining operation at a predetermined position of the object in consideration of the moving speed of the stage and the driving speed of the second scanner.
A laser processing method according to an embodiment of the present invention is a laser processing method for processing an object to be processed placed on a stage using a laser, comprising the steps of: generating a laser beam from a laser light source; Rotating the laser beam emitted from the laser light source by driving; And moving the laser beam to a predetermined position of the object by driving.
According to the embodiment, by controlling the linear motion and the rotational motion of the laser beam by driving different scanners, time for converting from linear motion to rotational motion or time for converting from linear motion to linear motion is reduced, It is possible to greatly reduce the time required for machining.
When the stage moves, the position tracking unit transmits the position signal of the object being moved by the stage to the scanner control unit. The scanner control unit controls the scanner in consideration of the moving speed of the object and the scanning speed of the scanner, The machining operation can be performed while the object is moving. Therefore, since the laser machining operation can be performed continuously without interruption, the time required for machining the object can be greatly reduced.
1 schematically shows a laser processing apparatus according to an embodiment of the present invention.
2 schematically shows a structure of a first scanner in a laser processing apparatus according to an embodiment of the present invention.
3 is a diagram for explaining the function of an angle amplifier in a laser processing apparatus according to an embodiment of the present invention.
4 schematically shows a laser processing apparatus according to another embodiment of the present invention.
FIG. 5 shows a process of forming holes in an object to be processed by using a laser processing apparatus according to an embodiment of the present invention.
6 shows a process of forming lines on an object to be processed by using a general laser processing apparatus.
FIG. 7 illustrates a process of forming lines on an object to be processed by using a laser processing apparatus according to an embodiment of the present invention.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.
Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "electrically connected" with another part in between . Also, when an element is referred to as "comprising ", it means that it can include other elements as well, without departing from the other elements unless specifically stated otherwise.
Fig. 1 schematically shows a
Referring to FIG. 1, a
The
The
3, the
The
A beam transmission system (not shown) may be provided on the optical path of the laser beam L. The beam transmission system is for transmitting the laser beam L emitted from the
The
A focusing
The
4 schematically shows a
The
The
5 shows a process of forming holes h1, h2, h3 and h4 in the object W by using the
1 and 5, the
Next, the
Next, the laser beam L is emitted from the
When the formation of the hole h1 is completed, the
The laser beam L can be emitted from the
When the formation of the holes h2 is completed, the above process for machining the holes h1 and h2 to be processed next can be repeated.
6 shows a process of forming lines on an object to be processed by using a general laser processing apparatus.
Referring to FIG. 6, a general laser processing apparatus forms a line in a straight line when forming a line on a workpiece W. The
FIG. 7 shows a process of forming lines on an object to be processed by using the
Referring to FIGS. 1 and 7, the
According to the embodiment shown in Fig. 7, the
While the present invention has been described in connection with certain exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
100, 200 ... The
120, 220 ... The
140, 240 ... The
160, 260 ... Focusing lens W ... Object to be processed
S ... Stage L ... Laser beam
121 ... The
270 ... Positioning units h1, h2, h3, h4 ... hall
L1, L2 ... Processing
320, 420 ... Processing width
Claims (14)
A laser light source;
A first scanner for rotating the laser beam emitted from the laser light source on the object by driving;
A second scanner for linearly moving the laser beam emitted from the first scanner on the object by driving;
An angle amplifier provided between the first scanner and the second scanner for amplifying a rotation radius of the laser beam emitted from the first scanner; And
And a scanner controller for controlling driving of the first scanner and the second scanner,
Wherein the first scanner includes a pair of first and second mirrors driven with a phase difference of 90 degrees,
Wherein the first and second mirrors control the laser beam along a sine function or a cosine function.
And a position tracking unit for tracking the machining position of the object to be processed and transmitting the tracking position to the scanner control unit.
And a beam delivery system is provided on the optical path of the laser beam.
Driving the first scanner to rotate the laser beam emitted from the laser light source to a size corresponding to the hole to be processed;
Driving the second scanner to position the laser beam emitted from the first scanner in a machining area of the object to be processed; And
And emitting the laser beam from the laser light source to form the hole in the machining area of the object to be processed.
Wherein the driving of the first scanner and the driving of the second scanner are controlled in synchronization with each other.
Wherein the step of positioning the laser beam in the machining area of the object to be processed traces the position of the machining area of the object to which the position tracking unit is moving and transmits the track to the scanner controller, And controlling driving of the second scanner to move along the machining area of the object.
Wherein the scanner control unit controls the second scanner to perform a machining operation at a predetermined position of the object in consideration of the moving speed of the stage and the driving speed of the second scanner.
Driving the first scanner to rotate the laser beam emitted from the laser light source; And
And driving the second scanner to move the rotating laser beam along a line to be machined.
Wherein the driving of the first scanner and the driving of the second scanner are controlled in synchronization with each other.
Wherein the step of moving the rotating laser beam along a line to be machined transmits a machining position of the object to be machined to which the position tracking unit is moving to a scanner control unit, And controlling the driving of the second scanner to move along the machining position.
Wherein the scanner control unit controls the second scanner to perform a machining operation at a predetermined position of the object in consideration of the moving speed of the stage and the driving speed of the second scanner.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150123208A KR101796198B1 (en) | 2015-08-31 | 2015-08-31 | Laser processing apparatus and laser processing method using the laser processing apparatus |
PCT/KR2016/008775 WO2017039169A1 (en) | 2015-08-31 | 2016-08-10 | Laser processing device and laser processing method using same |
TW105126487A TWI645928B (en) | 2015-08-31 | 2016-08-19 | Laser processing apparatus and laser processing method using the laser processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020150123208A KR101796198B1 (en) | 2015-08-31 | 2015-08-31 | Laser processing apparatus and laser processing method using the laser processing apparatus |
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KR20170025997A KR20170025997A (en) | 2017-03-08 |
KR101796198B1 true KR101796198B1 (en) | 2017-11-09 |
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KR1020150123208A KR101796198B1 (en) | 2015-08-31 | 2015-08-31 | Laser processing apparatus and laser processing method using the laser processing apparatus |
Country Status (3)
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KR (1) | KR101796198B1 (en) |
TW (1) | TWI645928B (en) |
WO (1) | WO2017039169A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US20210187682A1 (en) * | 2019-12-24 | 2021-06-24 | Fanuc Corporation | Workpiece transfer system |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017211982B4 (en) * | 2017-07-13 | 2019-04-18 | Trumpf Laser- Und Systemtechnik Gmbh | Method and device for joining at least two workpieces |
KR102189459B1 (en) * | 2019-08-28 | 2020-12-11 | 주식회사 유니오텍 | Method for drilling hole and the drilling apparatus |
KR102654236B1 (en) * | 2022-03-07 | 2024-04-03 | 주식회사 코윈디에스티 | Laser processing system with improved homogeneity of laser beam |
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JPH10289943A (en) * | 1997-04-16 | 1998-10-27 | Canon Inc | Stage device and manufacture thereof |
JP5207827B2 (en) * | 2008-05-22 | 2013-06-12 | キヤノン株式会社 | Galvano device, processing device, method for obtaining mirror tilt angle in galvano device, and processing method |
KR101186245B1 (en) * | 2010-05-26 | 2012-09-27 | 한국기계연구원 | Laser processing system and laser processing method using the same |
KR101388181B1 (en) * | 2012-09-04 | 2014-04-30 | (주)하드램 | Laser cutting apparatus for glass substrate and method for cutting glass substrate |
CN105102171B (en) * | 2013-02-13 | 2018-01-30 | 住友化学株式会社 | The manufacture device of optical member adhering body |
JP5364856B1 (en) * | 2013-02-27 | 2013-12-11 | 三菱重工業株式会社 | Processing device, processing method |
KR20140144390A (en) * | 2013-06-10 | 2014-12-19 | (주)엔에스 | Film Cutting Apparatus and Method Using a Laser |
JP6345064B2 (en) * | 2013-11-22 | 2018-06-20 | 三菱電機株式会社 | Deformable mirror and laser processing apparatus |
TWM486507U (en) * | 2014-03-13 | 2014-09-21 | Tong Tai Machine & Tool Co Ltd | Laser machining system, detection module and determination circuit |
-
2015
- 2015-08-31 KR KR1020150123208A patent/KR101796198B1/en active IP Right Grant
-
2016
- 2016-08-10 WO PCT/KR2016/008775 patent/WO2017039169A1/en active Application Filing
- 2016-08-19 TW TW105126487A patent/TWI645928B/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210187682A1 (en) * | 2019-12-24 | 2021-06-24 | Fanuc Corporation | Workpiece transfer system |
JP2021100763A (en) * | 2019-12-24 | 2021-07-08 | ファナック株式会社 | Workpiece conveyance system |
US11679462B2 (en) * | 2019-12-24 | 2023-06-20 | Fanuc Corporation | Workpiece transfer system |
JP7420548B2 (en) | 2019-12-24 | 2024-01-23 | ファナック株式会社 | Workpiece conveyance system |
Also Published As
Publication number | Publication date |
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TWI645928B (en) | 2019-01-01 |
TW201713445A (en) | 2017-04-16 |
WO2017039169A1 (en) | 2017-03-09 |
KR20170025997A (en) | 2017-03-08 |
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