WO2007077630A1

WO2007077630A1 - Laser material processing system, program creating device and laser material processing method

Info

Publication number: WO2007077630A1
Application number: PCT/JP2006/300094
Authority: WO
Inventors: Toshiyuki Hokodate; Atsuhiro Kaneda; Shigeo Kawano
Original assignee: Mitsubishi Denki Kabushiki Kaisha
Priority date: 2006-01-06
Filing date: 2006-01-06
Publication date: 2007-07-12
Also published as: CN101142052A; JPWO2007077630A1; JP4800939B2; CN101142052B; TW200726563A; TWI296219B

Abstract

A laser material processing system (1) for boring a plurality of holes in a workpiece in a machining mode for repeating a plurality of times such a cycle as irradiating the workpiece, at a plurality of machining positions thereof, with a laser beam by one to a plurality of shots while changing the irradiating position, comprising irradiating position shifting sections (35X, 35Y) for shifting the irradiating position of the workpice (37) with a laser beam oscillated at a laser oscillating section (21), and a section (10) for controlling the oscillation timing of a laser beam oscillated at the laser oscillating section (21) and the irradiating position of laser beam shifted by the irradiating position shifting sections (35X, 35Y). The control section (10) controls the irradiating position shifting sections (35X, 35Y) such that the shift path of irradiating position shifted by the irradiating position shifting section to the boring position of a first hole when the first hole is irradiated with a laser beam in the first cycle is aligned with the shift path of irradiating position shifted by the irradiating position shifting section to the boring position of a first hole when the first hole is irradiated with a laser beam in the second and subsequent cycles.

Description

Specification

Laser processing apparatus, program creation apparatus, and laser processing method

Technical field

The present invention relates to a laser processing apparatus, a program creation apparatus, and a laser processing method for performing laser processing on a workpiece with pulsed laser light.

Background art

[0002] In recent years, with the high density mounting of electronic devices, there is a demand for downsizing printed wiring boards that form wiring layers of electronic devices. In order to reduce the size of a printed wiring board, it is necessary to accurately form (drill) through holes (via holes) for connecting the boards with a conductive layer.

[0003] In order to form such a through-hole with high accuracy, for example, a pulse oscillation type laser processing apparatus that uses a pulse laser beam focused by a lens is used. In the drilling of a workpiece such as a printed circuit board by this laser carriage device, a plurality of times of laser irradiation are performed on the same machining position in order to shorten the machining time. However, if the laser beam is continuously irradiated to the same processing position, the laser beam is irradiated after the workpiece has been melted by the previous laser beam irradiation, depending on the material used. However, the fluidity of the work piece increased, and it was difficult to obtain a work piece having a precise machining shape. For this reason, when performing laser irradiation a plurality of times on the same processing position, the next laser irradiation must be performed after the melted portion is solidified by the previous laser irradiation.

[0004] In the laser processing method described in Patent Document 1, laser irradiation is performed on each hole while sequentially scanning a plurality of drilling positions set on the workpiece. In other words, after the first laser irradiation is performed for the first drilling position, the first laser irradiation is performed for the second and subsequent drilling positions, and the second drilling position is returned to the first drilling position again. When the second laser irradiation is performed for the second and subsequent drilling positions, the above process is repeated.

Patent Document 1: Japanese Patent Application Laid-Open No. 11 192571 Disclosure of the invention

Problems to be solved by the invention

[0006] However, in the above prior art, the laser irradiation position moves on each drilling position and the laser irradiation is performed a plurality of times at each drilling position. Misalignment is likely to occur. For this reason, the machined shape of the workpiece cannot be machined with high accuracy! There was a problem with /! And! /.

[0007] The present invention has been made in view of the above, and an object of the present invention is to obtain a laser cache device, a program creation device, and a laser processing method that can accurately process a processed shape of a workpiece. To do.

Means for solving the problem

In order to solve the above-described problems and achieve the object, the present invention irradiates one to a plurality of shots of laser light to a plurality of processing positions of a workpiece while changing the irradiation position of the laser light. In a laser processing apparatus that performs a plurality of drilling calories on the workpiece in a processing mode in which a cycle is repeated a plurality of times, a laser light oscillation unit that oscillates laser light, and the processing of the laser light that is oscillated by the laser light oscillation unit An irradiation position moving unit that moves the irradiation position of the object, and a control unit that controls the oscillation timing of the laser beam oscillated by the laser beam oscillation unit and the irradiation position of the laser beam moved by the irradiation position moving unit. The control unit moves the irradiation position movement path that the irradiation position moving unit moves to the drilling position of the first hole when the first hole is irradiated with the laser beam in the first cycle. When the laser beam is irradiated onto the first hole after the second cycle, the irradiation position moving path that the irradiation position moving unit moves to the drilling position of the first hole is the same path. The irradiation position moving unit is controlled as described above.

The invention's effect

[0009] The laser carriage apparatus according to the present invention includes a positional deviation amount of the laser light irradiation position of the first hole in the first cycle and an irradiation position of the laser light in the first hole after the second cycle. Since the difference between the positional deviation amount and the positional deviation amount can be reduced, the machining shape of the workpiece can be machined with high accuracy. Brief Description of Drawings

FIG. 1 is a perspective view showing an internal configuration of a laser processing apparatus according to the present invention.

FIG. 2 is a functional block diagram showing a configuration of a laser processing apparatus according to the present invention.

FIG. 3 is a flowchart showing an operation procedure of the laser processing apparatus according to the first embodiment.

FIG. 4 is a diagram for explaining the order of laser irradiation positions according to the first embodiment.

FIG. 5 is a diagram for explaining a relationship between a galvano position command and a laser output.

FIG. 6 is a diagram for explaining the relationship between the galvano position command and the machining position error.

FIG. 7 is a functional block diagram showing another configuration example of the laser cafe apparatus.

FIG. 8 is a diagram showing an example of a machining program.

FIG. 9 is a flowchart showing an operation procedure of the laser processing apparatus according to the second embodiment.

FIG. 10 is a diagram for explaining the order of laser irradiation positions according to the second embodiment.

FIG. 11 is a functional block diagram showing a configuration of a laser processing apparatus according to Embodiment 3.

[FIG. 12] FIG. 12 is a diagram for explaining a galvano area for the object to be covered.

FIG. 13 is a diagram showing an example of a conventional machining program used by the laser carriage device of the third embodiment.

Explanation of symbols

[0011] 1 Laser processing equipment

10 Machining control device

11 Main control unit

12 Laser controller

13 X—Y table controller

14 Machining program storage 15 Galvano scanner controller

20 Processing drive

21 Laser oscillator

22 Image transfer optics

23 Collimation lens

24 mask

30 Laser processing section

34 f Θ lens

35X, 35Y Galvano mirror

36X, 36Y Galvano Scanner

37 Workpiece

38 X—Y table

39 Observation optics

40 Machining procedure controller

41 User program input section

42, 62 CAD conversion

43 Karoe Program

44 Procedure control section

45,65 Machining program storage

51 Galvano Area

60 Program creation device

Hl ~ Hn hole

BEST MODE FOR CARRYING OUT THE INVENTION

[0012] Embodiments of a laser cafe device, a program creation device, and a laser processing method according to the present invention will be described below in detail with reference to the drawings. The present invention is not limited to the embodiments.

Embodiment 1.

FIG. 1 is a perspective view showing an internal configuration of a laser processing apparatus according to the present invention. Laser processing The device 1 is configured so that fine holes can be drilled in the workpiece 37 by irradiation with laser light (pulse laser light) (cycle pulse mode). The laser oscillator 21 that oscillates the laser light, the laser An image transfer optical mechanism 22 that shapes light and adjusts it to a desired beam shape and beam energy, a laser processing unit 30 that performs laser processing of a workpiece, and a processing control device 10 are provided. Note that in this cycle pulse mode, a plurality of drilling positions set on the workpiece are sequentially scanned, and laser processing is performed for each hole in multiple cycles (laser light is irradiated one shot at a time). This is a Caloe process that repeats the cycle to perform multiple times.

The laser oscillator 21 oscillates laser light and sends it to the image transfer optical mechanism 22. The image transfer optical mechanism 22 includes a collimation lens 23 and a mask 24. The collimation lens 23 irradiates the laser beam from the laser oscillator 21 to adjust (parallelize) the optical axis, and the mask 24 shapes the beam shape of the laser beam.

[0015] The laser processing unit 30 includes a galvanometer mirror 35X, 35Y, a galvanometer scanner 36 mm, 36Y, f—

It has a Θ lens 34, a to-be-powered object (work) 37, an X-— table 38, and an observation optical mechanism (vision sensor) 39.

[0016] The galvano scanners 36 and 36 have a function of moving the irradiation position of the object 37 by changing the trajectory of the laser beam, in order to scan the laser beam in the X-Υ direction. Rotate the gal non mirrors 35Χ and 35Υ to a predetermined angle. The galvanometer mirrors 35 and 35 reflect the laser light (light beam) emitted from the mask 24 of the image transfer optical mechanism 22 and deflect it at an arbitrary angle. The galvanometer mirror 35Χ deflects the laser beam in the X direction, and the galvanometer mirror 35Υ deflects the laser beam in the Υ direction. The f-Θ lens 34 deflects the laser light in a direction perpendicular to the surface of the object 37 and condenses (irradiates) the laser light on the processing position (surface) of the object 37.

[0017] The to-be-powered object 37 is a printed circuit board or the like, and is subjected to a plurality of drilling forces. The X—Y table 38 is used to mount the object 37 to be moved, and freely moves in a two-dimensional plane of the X and Y axes by driving an X axis motor and a Y axis motor (not shown).

The observation optical mechanism 39 detects the height of the workpiece 37 in the Z-axis direction. The height (information) of the workpiece 37 detected by the observation optical mechanism 39 in the Z-axis direction is sent to the machining controller 10. Then, the machining control device 10 controls the height direction of the workpiece 37 based on this information.

The processing control device 10 is configured by a computer device such as a personal computer, and controls the laser oscillator 21, the image transfer optical mechanism 22, and the laser force feeding unit 30 by NC (Numerical Control) control or the like.

[0020] With this configuration, the laser processing apparatus 1 shapes the laser light emitted from the laser oscillator 21 by the image transfer optical mechanism 22 and adjusts it to a desired beam shape and beam energy. The beam is deflected to an angle, and is imaged and irradiated at a predetermined position of the object 37 through the f-Θ lens 34. Thereby, a hole (concave portion) having an opening diameter corresponding to the beam diameter of the laser beam is processed at a predetermined irradiation position of the workpiece 37. In Embodiment 1, laser irradiation is performed a plurality of times for the processing position of one hole.

FIG. 2 is a functional block diagram showing the configuration of the laser cache device according to the present invention. The laser processing device 1 includes a processing control device 10 and a processing drive device 20. The processing drive device 20 is a means for performing laser processing, and corresponds to the laser oscillator 21, the image transfer optical mechanism 22, and the laser processing unit 30 shown in FIG.

[0022] The machining control device 10 is a device that controls the machining drive device 20, and includes a main control unit 11, a laser control unit 12, an XY table control unit 13, a machining program storage unit 14, and a galvano scanner control. Come with part 15.

[0023] The laser control unit 12 performs control related to laser light (laser light oscillation, optical axis adjustment, etc.). The laser control unit 12 controls the laser oscillator 21 to control the oscillation (timing, power, etc.) of the laser beam, and controls the collimation lens 23 and the mask 24 to adjust the optical axis of the laser beam and adjust the beam shape. Control. The laser controller 12 controls the position of the f Θ lens 34 to deflect the laser beam in a direction perpendicular to the surface of the workpiece 37.

[0024] The XY table control unit 13 controls the XY table 38 to move the object 37 on the XY table 38 in the XY direction. The galvano scanner control unit 15 controls the galvano scanners 36X and 36Y to rotate the galvano mirrors 35X and 35Y to a predetermined angle to scan the laser light in the XY directions.

In the first embodiment, the X—Y table control unit 13 causes the X—Y table 38 to be covered. The workpiece 37 is moved in the X—Y direction, and the laser light is scanned in the X—Υ direction by the galvano scanner control unit 15 to irradiate a predetermined machining position of the workpiece 37 with laser irradiation. Do. X—Υ table control unit 13 and galvano scanner control unit 15 control the position of 38—Υ table 38 and control the laser beam based on the machining program and NC program described later! Scan in the direction.

The machining program storage unit 14 stores various programs and the like for performing the laser force measurement of the workpiece 37. The machining program storage unit 14 stores, for example, a machining program related to a machining procedure of the force object 37, an NC program, and the like. The machining program includes information on the order of galvano areas to be machined, information on the order of machining positions (holes) of the object 37, information on the timing of laser beam irradiation, information on the number of times of laser beam irradiation, etc. . The main control unit 11 includes a laser control unit 12, a Χ— 13 table control unit 13, and power! ] Controls the program storage unit 14 and the galvano scanner control unit 15.

Next, an operation procedure of the laser processing apparatus according to Embodiment 1 will be described. FIG. 3 is a flowchart showing an operation procedure of the laser processing apparatus according to the first embodiment, and FIG. 4 is a diagram for explaining the order of the laser irradiation positions according to the first embodiment.

[0028] Here, as an example of laser processing, for example, the laser processing apparatus 1 uses a laser pulse in a cycle pulse mode from the first processing hole HI to the ηth (η is a natural number of 2 or more) th processing hole Ηη. A description will be given of the case where the operation is performed. Here, as an example of laser processing of the laser cage apparatus 1, a case where there are four or more processing holes (η is four or more) will be described.

[0029] When the laser cache processing of the workpiece 37 by the laser cache device 1 is started, the table controller 13 is based on the machining program and the NC program in the machining program storage unit 14. The position of the Χ—Χ table 38 is controlled. As a result, the target object 37 on the table 38 is moved so that the laser beam is irradiated to a predetermined gallon area (area where the processing position is controlled by the galvano scanners 36 and 36) 51. Move in the direction.

As an initial setting, the galvano scanner control unit 15 controls the galvano scanners 36 Χ and 36 よう so that the irradiation position of the laser light becomes the default coordinates of the galvano area 51 (for example, the origin (the center point of the galvano area)).

[0031] First, the galvano scanner control unit 15 performs the η-th machining position based on the machining program. Command the galvano position to the galvano scanners 36X, 36Y so that the position (force hole Hn) is the laser beam irradiation position. Thus, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the nth processing position (processing hole Hn) becomes the irradiation position of the laser light (step S110). At this time, the laser control unit 12 does not oscillate the laser beam from the laser oscillator 21.

[0032] Next, the galvano scanner control unit 15 instructs the galvano scanners 36X and 36Y to make a galvano position command so that the first machining position (force hole HI) becomes the irradiation position of the laser beam based on the machining program. To do. As a result, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the first machining position (machining hole HI) becomes the irradiation position of the laser beam (step S120) (l) o

Then, the laser control unit 12 oscillates laser light from the laser oscillator 21. As a result, the laser beam is shaped by the image transfer optical mechanism 22 and adjusted to a desired beam shape and beam energy. Further, the laser light emitted from the mask 24 is reflected and deflected by the galvanometer mirrors 35X and 35Y, and is imaged and irradiated on the processing hole HI of the object 37 through the f-Θ lens 34. The As a result, the first shot of the processing hole HI (first hole) is processed (step S130).

[0034] Next, the galvano scanner control unit 15 instructs the galvano scanners 36X and 36Y to send a galvano position command so that the second machining position (force hole H2) becomes the laser beam irradiation position based on the machining program. To do. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the second processing position (processing hole H2) becomes the irradiation position of the laser beam (step S140) (2). Then, the laser control unit 12 oscillates laser light from the laser oscillator 21. Thereby, the first shot is processed in the processing hole H2 (second hole) (step S150).

After this, although not shown in FIG. 3, the galvano scanner control unit 15 determines that the third and subsequent (up to (n−2)) machining positions of the laser beam are based on the machining program. A galvano position command is issued to the galvano scanners 36X and 36Y so that the irradiation position is reached, and the first shot is processed in the third and subsequent (up to (n−2)) holes.

[0036] Next, the galvano scanner control unit 15 determines the (n-1) th based on the machining program. A galvano position command is issued to the galvano scanners 36X and 36Y so that the machining position (the machining hole H (n-1)) is the laser beam irradiation position. As a result, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the (n−l) -th processing position (calorie hole H2) becomes the irradiation position of the laser beam (step S160) (n) .

Then, the laser control unit 12 oscillates laser light from the laser oscillator 21. As a result, the first shot of the processing hole H (n-1) ((n-1)) hole is processed (step S170).

[0038] Next, the galvano scanner control unit 15 instructs the galvano scanners 36X and 36Y to provide a galvano position command so that the nth machining position (force hole Hn) becomes the laser beam irradiation position based on the machining program. To do. As a result, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the n-th processing position (processing hole H2) becomes the irradiation position of the laser beam (step S 180) (n + 1). Then, the laser control unit 12 oscillates laser light from the laser oscillator 21. As a result, the first shot of the processing hole Hn (nth hole) is processed (step S190).

[0039] The main control unit 11 determines whether or not the laser cache processing in the galvano area 51 has been completed (step S200). Since the first embodiment is a laser calorie in the cycle pulse mode, the main control unit 11 determines that the laser caulking process in the galvano area 51 has not ended (No in step S200). Then, the galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y so that the first machining position (machining hole HI) becomes the irradiation position of the laser beam based on the machining program. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the first processing position (processing hole HI) becomes the irradiation position of the laser beam (step S120). The laser controller 12 oscillates the laser beam from the laser oscillator 21. As a result, the second shot of the processing hole HI (first hole) is processed (step S130).

[0040] After that, the galvano scanner control unit 15 sets the galvano scanner so that the second to n-th machining positions (force holes H2 to Hn) become the laser beam irradiation positions based on the machining program. The galvano position command is issued to 36X and 36Y, and the laser control unit 12 oscillates the laser beam from the laser oscillator 21 at each processing position. As a result, the 2nd to nth The galvano scanners 36 X and 36Y control the galvanometer mirrors 35X and 35Y so that the machining position (force hole HI to Hn) is the laser beam irradiation position, and machining holes Hl to Hn (1st hole to nth hole) ) The second shot's processing power is performed (Steps S140 to S190)

[0041] Then, the main control unit 11 determines whether or not the laser cache process in the galvano area 51 has been completed (step S200). The processes in steps S120 to S200 are repeated until the main control unit 11 determines that the laser cache process in the galvano area 51 has been completed.

[0042] When the main control unit 11 determines that the laser cache processing in the galvano area 51 has been completed (step S200, Yes), the galvano scanner control unit 15 and the laser control unit 12 operate in the galvano area 51. The position of the XY table 38 is controlled so that the laser-caching process is finished and the next galvano area 51 can be processed. Then, the next galvano area 51 is processed.

Here, the relationship between the galvano position command and the laser output of the laser light will be described. FIG. 5 is a diagram for explaining the relationship between the galvano position command and the laser output. As shown in FIG. 5, in the first embodiment, first, the galvano scanner control unit 15 issues a galvano position command to the position of the nth hole with respect to the galvano scanners 36X and 36Y. At this time, laser output (oscillation) by the laser oscillator 21 is not performed. Next, the galvano scanner control unit 15 issues a galvano position command to the position of the first hole to the galvano scanners 36X and 36Y. At this time, the laser oscillator 21 performs laser output at the position of the first hole. Thereafter, from the second hole to the nth hole, the galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y, and the laser oscillator 21 performs laser output at each hole (position).

Thereby, the first shot processing from the first hole to the n-th hole is completed, and the second shot processing from the first hole to the n-th hole is performed. That is, the galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y from the first hole to the nth hole, and laser output (second shot) is performed by the laser oscillator 21 in each hole.

Next, the relationship between the galvano position command and the machining position error will be described. FIG. 6 is a diagram for explaining the relationship between the galvano position command and the machining position error. Galvanski When the channel controller 15 issues a galvano position command to the galvano scanners 36X and 36Y so that the predetermined processing position becomes the laser beam irradiation position, the galvano scanner 36X is set so that the processing position becomes the laser beam irradiation position. , 36Y controls the Galvano mirrors 35X, 35Y.

However, the laser beam irradiation position causes a predetermined positioning error (deviation amount) according to the movement path (distance, direction) of the previous irradiation position force. In other words, the galvano position command and the actual galvano position (irradiation position) deviation (overshoot or undershoot) will occur.

[0047] For example, in the conventional process! /, The galvano position when processing the first shot of the first hole moves to the default coordinate force, such as the origin, to the processing position of the first hole. . However, the galvano position when machining the second shot of the first hole moves the machining position force of the nth hole to the machining position of the first hole. For this reason, in the first hole, the actual positional deviation of the galvano position differs between the first shot and the second shot. As a result, according to the conventional machining procedure, the first hole has an elliptical shape or a dharma shape by looking at the machining surface force of the workpiece 37, so that the machining shape of the workpiece can not be machined with high accuracy.

[0048] On the other hand, in Embodiment 1, when processing the first shot of the first hole, a galvano position command is issued to the position of the nth hole to move the galvano position, and then the nth hole A galvano position command is issued from the position to the first hole machining position to move the galvano position. As a result, the displacement amount of the actual galvano position in the first shot of the first hole and the displacement amount of the actual galvano position in the second and subsequent shots of the first hole are substantially the same.

In the first embodiment, the machining program storage unit 14 of the machining control device 10 stores the machining program in advance, and the laser force check is performed based on the machining program. The program may be configured to receive and use the external device force of the machining control device 10 as well. Hereinafter, a case where a laser program is acquired from an external device and laser processing is performed will be described with reference to FIGS. 7 and 8. FIG.

[0050] In this case, for example, a laser program is created by the laser carriage device 1, and the laser carriage device 1 performs laser force checking based on the machining program. That is, a machining program stored in the machining program storage unit 14 of the force control device 10 shown in FIG. 2 is created by an external device, and laser force is measured using the created cache program. . FIG. 7 is a functional block diagram showing another configuration example of the laser processing apparatus according to the first embodiment, and achieves the same function as the laser processing apparatus 1 shown in FIG. 2 among the components in FIG. The same numbers are assigned to the constituent elements, and duplicate descriptions are omitted.

The laser processing apparatus 1 here is a program creation apparatus 60 that creates a machining program to be stored in the machining program storage unit 14 in addition to the machining control apparatus 10 and the cache drive apparatus 20. It has.

The program creation device 60 is configured by a device such as a personal computer, and includes a user program input unit 41 and a CAD (Computer Aided Design) conversion unit 62. The user program input unit 41 inputs a user program (gerber type coordinate program) indicating a drilling position (coordinates) on the workpiece 37.

The CAD conversion unit 62 converts the user program from the user program input unit 41 into a processing program having an appropriate format suitable for the laser processing apparatus 1. The CAD converter 62 has a configuration that allows the user to specify the galvano area range, conversion format, etc. (main movement in the X direction, main movement in the Y direction, and the movement path with the shortest distance) according to the processing purpose. .

[0055] Further, the CAD conversion unit 62 adds a parameter for commanding on / off of the laser beam (laser beam) to the cache program converted by the user program force. The CAD conversion unit 62 adds, for example, “1” to the machining program as a parameter for instructing laser light to be turned on, and adds “0” to the cache program as a parameter for instructing laser light to be turned off. Specifically, for example, for the galvano area N1, the CAD conversion unit 62 first issues a galvano position command to “X300 Y300”, which is the machining position of the nth hole, and does not irradiate the laser beam. "0") is added to the cache program. The machining program storage unit 14 stores the Caloe program created by the CAD conversion unit 62.

The processing program is created in a format that can specify only the positioning position based on, for example, information indicating beam off, and is converted into a format that can be read by the laser processing apparatus 1.

[0057] Next, an example of a machining program will be described. FIG. 8 is a diagram showing an example of a machining program. In the machining program, in the galvano area N1 (machining area 1), the machining point of the η-th hole is, for example, Χ300 Υ300, and the default coordinate force such as the origin is also in the η-th hole. It shows that the galvano position is moved to the eye processing position. In addition, when the galvano position is moved to the first n-th hole, the laser power of the first shot is not performed. After that, the laser power of each hole in the galvano area N1 is performed by moving the galvano position to the machining point of the first hole and the machining point of the second hole in order.

[0058] The machining program here indicates that the machine then moves to the galvano area N2.

Furthermore, in the machining program, in the galvano area N2 (machining area 2), the machining point of the M-th hole (M is a natural number) is, for example, “X300 Y300”, and from the default coordinates such as the origin, It shows that the galvano position is moved to the processing position. It also shows that the laser power of the first shot is not performed when the galvano position moves to this first hole. After that, the laser caloring of each hole in the galvano area Ν2 is performed by moving the galvano position to the machining point of the first hole and the machining point of the second hole in order. Here, the carriage control device 10 controls the laser force of the laser caloe device 1 based on the machining program.

[0059] Here, it is assumed that the laser cage apparatus 1 includes the program creation device 60. The force laser cache device 1 and the program creation device 60 are configured independently of each other, and the program created by the program creation device 60 is used. The laser carriage device 1 may perform the laser force check using the program. In this case, it is possible to connect the program creation device 60 and the laser cache device 1 and send the program from the program creation device 60 to the laser cache device 1! The machined program can be input to the laser machine 1 via a portable external storage medium!

[0060] In the first embodiment, the force described in the case where the laser processing apparatus 1 performs the laser force check of the workpiece 37 in the cycle pulse mode. The laser check apparatus 1 changes the irradiation position of the laser beam. The laser force of the workpiece 37 may be measured by a caulking process that repeats a cycle of irradiating one to a plurality of shots of laser light to a plurality of machining positions of the workpiece several times.ヽ.

In the first embodiment, when the first shot of the first hole is processed, the galvano position is moved to the position of the η-th hole, and then the position force of the η-th hole Set the galvano position to the hole processing position. However, when processing the first shot of the first hole, after moving the galvano position to the position of the mth hole (m is a natural number smaller than (n−l)), It is possible to move the galvano position from the m-th hole to the n-th hole, and then move the galvano position to the machining position of the first hole.

In Embodiment 1, when processing the first shot of the first hole, after moving the galvano position to the position of the nth hole, the first hole is moved from the position of the nth hole. We decided to move the galvano position to the processing position of the eye, but when processing the first shot of the 1st hole, after moving the galvo position from the nth hole to the middle position of the processing path from the 1st hole The intermediate position force may be moved to the machining position of the first hole and the first shot of the first hole may be checked.

[0063] In order to reduce the movement distance of the galvano position from the nth hole to the first hole when processing the first shot of the first hole, the nth hole is made to the first hole. It may be set to a close hole (for example, the hole having the shortest distance between holes). If the galvano movement distance when moving from the nth hole to the 1st hole is short, the amount of displacement of the galvano position decreases. It is possible to reduce the amount of positional deviation. In addition, it is possible to shorten the movement time when the galvano position is moved from the nth hole to the first hole.

[0064] Also, the origin force when machining the first shot of the 1st hole is also a hole close to the origin of the nth hole (for example, the distance between holes) to reduce the movement distance of the galvano position to the nth hole. May be set to the shortest hole). This makes it possible to shorten the movement time when the galvano position is moved to the nth hole in the origin force.

[0065] In addition, the origin force when machining the first shot of the first hole The movement distance of the galvano position from the nth hole to the movement distance of the galvano position from the nth hole to the first hole The nth hole and the first hole may be set to reduce the total distance (for example, the shortest distance). As a result, the total time of the movement time when moving the galvano position from the nth hole to the first hole and the movement time when moving the galvo position from the nth hole to the nth hole can be shortened. It becomes possible.

[0066] Further, the laser carriage device 1 stops the XY table 38 for each scanning area, so that the galvanometer is stopped. It may be stage stop processing that scans the laser beam by rotating only the mirrors 35X and 35Y, or the stage that does not stop scanning the laser beam by moving the galvano mirrors 35X and 35Y while moving the X—Y table 38. Even processing.

[0067] Thus, according to the first embodiment, the positional deviation amount of the actual galvano position in the first shot of the first hole and the positional deviation of the actual galvano position in the second and subsequent shots of the first hole. The first hole can be machined into a substantially circular shape when viewed from the machining surface of the work piece 37, and the work shape of the work piece 37 can be machined with high accuracy. It becomes possible to do.

[0068] When the program creation device 60 processes the first shot of the first hole, the galvano position command is issued to the position of the nth hole to move the galvano position, and then the position of the nth hole is changed. Since a machining program is created to move the galvano position by issuing a galvano position command to the machining position of the 1st hole, the laser carriage device 1 has a positional shift amount of the actual galvano position of the first shot of the 1st hole, The displacement amount of the actual galvano position after the second shot of the 1st hole can be made to be approximately the same displacement amount. As a result, it is possible to machine the first hole into a substantially circular shape when viewed from the machining surface of the workpiece 37, and a machining program capable of machining the machining shape of the workpiece 37 with high accuracy is provided. It will be possible to provide one.

[0069] Embodiment 2.

Next, a second embodiment of the present invention will be described with reference to FIGS. In Embodiment 2, a galvano position command is issued to a predetermined default coordinate at the end of each cycle in the cycle pulse mode, and galvano position movement when machining the first hole is performed in all cycles (all the first shot including the first shot). Galvanometer mirrors 35X and 35Y are controlled so that the same path is obtained in the shot. Since the laser processing apparatus 1 of the second embodiment also has the same configuration as the laser processing apparatus 1 described in FIGS. 1 and 2 of the first embodiment, the description thereof is omitted here.

An operation procedure of the laser processing apparatus according to Embodiment 2 will be described. FIG. 9 is a flowchart showing an operation procedure of the laser processing apparatus according to the second embodiment, and FIG. 10 is a diagram for explaining the order of the laser irradiation positions according to the second embodiment. Here, as an example of laser processing, for example, the laser carriage apparatus 1 performs laser processing in the cycle pulse mode from the first processing hole HI to the nth (n is a natural number of 2 or more) processing hole Hn. Explain the case. Here, as an example of the laser force of the laser carriage device 1, processing is performed. This is explained when there are 4 or more holes (n is 4 or more).

[0071] When the laser cache processing of the object 37 to be supported by the laser cache device 1 is started, the XY table control unit 13 is based on the processing program and the NC program in the processing program storage unit 14. Then, the position of the X—Y table 38 is controlled. As a result, the target object 37 on the X—Y table 38 is moved to the X—Y so that the laser beam is irradiated to a predetermined gal non area (area where the processing position is controlled by the galvano scanner 36X, 36Y) 51. Move in the direction.

[0072] As an initial setting, the galvano scanner control unit 15 controls the galvano scanners 36X and 36Y so that the irradiation position of the laser light becomes the default coordinates (for example, the origin) of the galvano area 51 (step S310).

[0073] Next, the galvano scanner control unit 15 instructs the galvano scanners 36X and 36Y to make a galvano position command so that the first machining position (force hole HI) becomes the laser beam irradiation position based on the machining program. To do. As a result, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the first machining position (machining hole HI) becomes the irradiation position of the laser beam (step S320) (l) o

Then, the laser control unit 12 oscillates the laser beam from the laser oscillator 21. As a result, the laser beam is shaped by the image transfer optical mechanism 22 and adjusted to a desired beam shape and beam energy. Further, the laser light emitted from the mask 24 is reflected and deflected by the galvanometer mirrors 35X and 35Y, and is imaged and irradiated on the processing hole HI of the object 37 through the f-Θ lens 34. The As a result, the first shot of the processing hole HI (first hole) is processed (step S330).

[0075] Next, the galvano scanner control unit 15 instructs the galvano scanners 36X and 36Y to provide a galvano position command so that the second machining position (force hole H2) becomes the laser beam irradiation position based on the machining program. To do. Thus, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the second processing position (processing hole H2) becomes the irradiation position of the laser beam (step S340) (2). Then, the laser control unit 12 oscillates laser light from the laser oscillator 21. As a result, the first shot of the machining hole H2 (second hole) is processed (step S350).

Thereafter, although not shown in FIG. 9, the galvano scanner control unit 15 adds the machining program. Based on this, a galvano position command is issued to the galvano scanners 36X and 36Y so that the third and subsequent machining positions (up to the (n−2) th) position become the laser beam irradiation position, and the third and subsequent processes are performed. The first shot is processed in the (n-2) th hole.

[0077] Next, the galvano scanner control unit 15 sets the (n-1) -th processing position (processing hole H (n-1)) based on the processing program so as to be the irradiation position of the laser beam. 3 Command galvano position to 6X and 36Y. As a result, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the (n−l) -th processing position (calorie hole H (n−1)) becomes the irradiation position of the laser beam (step S360). The laser controller 12 oscillates the laser beam from the laser oscillator 21. As a result, the first shot of the processing hole H (n−l) ((n−l) hole) is processed (step S370).

[0078] Next, the galvano scanner control unit 15 instructs the galvano scanners 36X and 36Y to execute a galvano position command so that the nth machining position (force hole Hn) becomes the laser beam irradiation position based on the machining program. To do. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the n-th processing position (processing hole Hn) becomes the irradiation position of the laser beam (step S380). The laser controller 12 oscillates laser light from the laser oscillator 21. As a result, the first shot of the processing hole Hn (nth hole) is processed (step S390).

[0079] The main control unit 11 determines whether or not the laser cache processing in the galvano area 51 has been completed (step S400). Since the first embodiment is a laser calorie in the cycle pulse mode, the main control unit 11 determines that the laser caulking process in the galvano area 51 should be finished (step S400, No). .

Based on the machining program, the galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y so that the default coordinates (origin) of the galvano area 51 become the laser light irradiation position. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the origin is the irradiation position of the laser beam (step S310). At this time, the laser control unit 12 does not oscillate the laser beam from the laser oscillator 21.

[0081] Next, the galvano scanner control unit 15 controls the galvano scanners 36X and 36Y so that the first machining position (force hole HI) becomes the irradiation position of the laser beam based on the machining program. Command the galvo position. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the first processing position (processing hole HI) becomes the irradiation position of the laser beam (step S320). The laser controller 12 oscillates laser light from the laser oscillator 21. As a result, the second shot of the processing hole HI (first hole) is processed (step S330).

[0082] After that, the galvano scanner control unit 15 sets the galvano scanner so that the second to n-th machining positions (force hole H2 to Hn) become the laser beam irradiation positions based on the machining program. The galvano position command is issued to 36X and 36Y, and the laser control unit 12 oscillates the laser beam from the laser oscillator 21 at each processing position. As a result, the galvano scanners 36 X and 36Y control the galvanometer mirrors 35X and 35Y so that the 2nd to nth machining positions (force hole HI to Hn) are the irradiation positions of the laser beam, and the machining holes Hl to Hn (1st hole to nth hole) are subjected to the second shot's processing power (steps S340 to S390)

[0083] Then, the main control unit 11 determines whether or not the laser cache process in the galvano area 51 has been completed (step S400). The processing power of steps S320 to S400 is repeated until the main control unit 11 determines that the laser cache processing in the galvano area 51 has been completed. That is, in the second embodiment, when machining the hole HI after machining the machining hole Hn, the galvano position command to the machining hole HI is issued after the galvano position command to the origin, which is the process of step S310. Go ahead and take care of HI.

[0084] When the main control unit 11 determines that the laser cache processing in the galvano area 51 has been completed (step S400, Yes), the galvano scanner control unit 15 and the laser control unit 12 operate in this galvano area 51. The position of the XY table 38 is controlled so that the laser-caching process is finished and the next galvano area 51 can be processed. Then, the next galvano area 51 is processed.

[0085] In the second embodiment, the origin force is also a hole close to the origin in the first hole (for example, the hole having the shortest distance between holes) in order to reduce the movement distance of the galvano position to the first hole. It may be set to. Also, the n-th hole force may be set to a hole close to the origin (for example, a hole having the shortest distance between holes) in order to reduce the movement distance of the galvano position to the origin. Furthermore, origin force when machining the first shot of the first hole Movement of the galvano position to the first hole The nth and 1st holes may be set so as to reduce the total distance of the distance and the movement distance of the galvano position from the nth hole to the origin (for example, the shortest distance). This makes it possible to shorten the movement time when moving the galvano position to the origin for the nth hole force, the movement time when moving the galvano position to the first hole, and the total time of these movement times. It becomes ability.

Further, in the second embodiment, as in the first embodiment, the machining program storage unit 14 of the machining control device 10 is not limited to the configuration in which the machining program is stored in advance and the laser calorie is performed based on the machining program. The machining program may be configured to receive the external device force of the machining control device 10 and use it.

As described above, in Embodiment 2, when machining the first hole, the galvano position command is issued to the origin to move the galvano position, and then the origin force is changed to the machining position of the first hole. Move the galvo position by issuing a galvo position command. As a result, the displacement amount of the actual galvano position for the first shot of the first hole and the displacement amount of the actual galvano position for the second and subsequent shots of the first hole are substantially the same.

[0088] Thus, according to the second embodiment, the positional deviation of the actual galvano position in the first shot of the first hole and the positional deviation of the actual galvano position after the second shot of the first hole. The first hole can be machined into a substantially circular shape when viewed from the machining surface of the work piece 37, and the work shape of the work piece 37 can be machined with high accuracy. It becomes possible to do.

[0089] Embodiment 3.

Next, Embodiment 3 of the present invention will be described with reference to FIGS. In Embodiment 3, the machining program that has been used in the past (moving the galvano position when machining the first shot of the first hole to the machining position of the first hole directly from the default coordinates such as the origin) Machining procedure), and using a predetermined control device (machining procedure control device to be described later), the same machining procedure as in the first and second embodiments (galvano position moving procedure and laser beam irradiation timing) The laser carriage device 1 is controlled so that the laser force is fed at.

That is, in the third embodiment, for example, when processing the first shot of the first hole in each galvano area, a galvano position command is issued to the position of the nth hole and the galvano position is After moving, the galvano position is moved by issuing a galvano position command to the machining position of the first hole based on the position force of the nth hole. Then, in the subsequent processing procedure, the conventional force is also used, and the laser cache process is performed using the V and the cache program (the processing procedure corresponding to the first embodiment).

FIG. 11 is a functional block diagram showing the configuration of the laser processing apparatus according to Embodiment 3.

Among the constituent elements in FIG. 11, the constituent elements that achieve the same functions as those of the laser processing apparatus 1 in the first and second embodiments shown in FIG.

The laser cafe apparatus 1 includes a processing procedure control device 40 in addition to the processing control device 10 and the carriage drive device 20. The processing procedure control device 40 is configured by a device such as a personal computer, and includes a user program input unit 41, a CAD (Computer

Aided Design) conversion unit 42, machining program storage unit 45 for storing machining program 43, and procedure control unit 44. The user program input unit 41 inputs a user program (gerber type coordinate program) indicating a drilling position (coordinates) on the workpiece 37.

The CAD conversion unit 42 has a function of converting the user program from the user program input unit 41 into a processing program 43 having an appropriate format suitable for the laser processing apparatus 1. The CAD conversion unit 42 is configured to allow the user to specify the galvano area range and conversion format (main movement in the X direction, main movement in the Y direction, and the shortest distance movement path) according to the machining purpose.

The machining program 43 is a program obtained by converting the user program by the CAD conversion unit 42, and has been converted into a format that can be read by the laser machining apparatus 1. The machining program 43 here is the conventional machining program (when machining the 1st shot of the 1st hole, move directly to the machining position of the 1st hole from the default coordinates such as the origin. This corresponds to a program that includes a machining procedure that starts machining the first shot of the first hole. The machining program 43 is stored in the machining program storage unit 14.

[0095] The procedure control unit 44, when checking the first shot of the first hole in each galvano area with respect to the conventional machining program 43 stored in the machining program storage unit 14, Instruction information is sent to the machining control device 10 (main control unit 11) so as to give a galvano position command to the eye position, and instruction information is given to the machining control device 10 so that the laser beam is not irradiated at the position of the nth hole. put out. Furthermore, the procedure control unit 44 issues instruction information to the machining control device 10 to issue a galvano position command to the position of the first hole, and moves the galvano position from the position of the nth hole to the machining position of the first hole. Then, the processing by the conventional processing program (laser light is irradiated to the first shot of the first hole) is performed.

Next, an operation procedure of the machining procedure control apparatus 40 according to the third embodiment will be described. In order to start the laser force measurement of the workpiece 37 by the laser processing device 1, the user of the laser processing device 1 uses the drilling position area (for example, 500mm X 500mm) on the target workpiece 37 coordinate ( A user program for designating the size 37 of the workpiece 37 and the drilling position is input to the user program input unit 41 of the carpenter procedure control device 40.

FIG. 12 is a diagram for explaining a galvano area in the object. The size of the force object 37, which is the area where the hole is drilled on the mark, is composed of a size of 500mm x 500mm, for example! RU

[0098] The drilling position area of the force object 37 is, for example, 50 mm X by the CAD conversion unit 42.

Divided into galvano areas (galvano areas N1 to N3, etc. that are information areas that contain information about hole coordinates) that are 50mm in size. Furthermore, the CAD conversion unit 42 calculates the machining position and the optimum machining path in each galvano area based on the user program, and creates a cafe program 43. The machining program 43 is stored in the machining program storage unit 45 (machining program storage unit 14). Here, the galvo areas N1 to N3 isotropic force correspond to the galvo areas 51 shown in FIG.

Here, an example of the conventional machining program 43 will be described. FIG. 13 is a diagram showing an example of a conventional machining program used by the laser carriage device of the third embodiment. In the conventional machining program 43, in the galvano area N1 (machining area 1), the machining point (machining position) of the first hole is, for example, “X300 Y400”, and the first hole directly from the default coordinates such as the origin The galvano position is moved to the first machining position, and the first shot of laser machining is performed. Thereafter, the galvano position is moved to the machining position in order of the machining point of the second hole and the machining point of the third hole, and the laser power of each hole in the galvano area N1 is performed. [0100] After that, it moves to the galvano area N2, and the default coordinate force such as the origin is moved directly to the first hole machining position "X300 Y300", and the first shot of the laser is performed. It is. Thereafter, the galvano position is moved to the machining position after the second hole, and the laser power of each hole in the galvano area 2 is performed.

[0101] In the third embodiment, when checking the first shot of the first hole in each galvano area (for example, galvano area N1), the procedure control unit 44 uses the machining program force 1 shot of the first hole. When the instruction to process the eye is recognized, the instruction information is sent to the processing control device 10 so as to issue a galvano position command to the position of the η-th hole, and the processing control device is configured not to irradiate the laser beam at the position of the η-th hole. Instruction information is sent to 10. After that, the procedure control unit 44 causes the calorie control device 10 to perform processing by the cache program 43 (giving a galvano position command to the position of the first hole and starting laser processing).

[0102] As a result, the laser processing apparatus 1 first performs laser processing (first shot) at the first processing point, and then performs laser caching (first shot) at the second processing point. )I do. Hereinafter, the processing of the load 37 is performed by the same processing procedure as that described in the first embodiment.

[0103] Further, for example, when the processing in the galvano area N1 is completed, the procedure control unit 44 causes the same processing as in the galvano area N1 to be performed in the galvano area Ν2, which is the next galvano area. In the same manner, the procedure control unit 44 causes the machining control device 10 to perform machining processing after the galvano area Ν2. Also in the subsequent processing, when the procedure control unit 44 recognizes an instruction to process the first shot of the Caloe program force first hole, the processing control device 10 issues a galvano position command to the position of the η hole. The instruction information is output to the processing control apparatus 10 so that the laser beam is not irradiated at the position of the η-th hole. Then, the procedure control unit 44 causes the machining control device 10 to perform a machining process (a galvano position command is issued at the position of the first hole to start the laser force measurement) by the cache program 43.

[0104] In the third embodiment, when the procedure control unit 44 processes the first hole of the first hole in each galvano area, the processing is started in accordance with the processing procedure corresponding to the first embodiment. When controlling the machining control device 10 and performing a force check using the conventional machining program 43, the force procedure control unit 44 described above makes each shot of the η-th hole through each galvano area. After machining (at the end of each cycle in the cycle pulse mode), the machining control device 10 is controlled to continue machining in accordance with the machining procedure corresponding to the second embodiment, and the force applied using the conventional machining program 43 is controlled. You can do it.

[0105] In the third embodiment, the case where the laser processing device 1 is configured to include the processing procedure control device 40 has been described. However, the laser processing device 1 and the processing procedure control device 40 are configured to be independent and different from each other. It can also be configured to operate each connected.

Furthermore, in the third embodiment, the force galvano scanner control unit 15 described above has the function of the procedure control unit 44 when the galvano scanner control unit 15 and the carpenter procedure control device 40 have different configurations. It is good also as a structure provided. In this case, the galvano scanner control unit 15 having the function of the procedure control unit 44 performs the laser power check based on the conventional processing program 43 stored in the processing program storage unit 14.

In the third embodiment, the force machining procedure control device 40 configured to include the machining program storage unit 45 may be omitted as long as the machining procedure control device 40 includes the machining program storage unit 45. In this case, the cache program 43 created by the CAD conversion unit 42 is configured to be directly input to the Caloe program storage unit 14.

As described above, according to the third embodiment, the same laser force as in the first and second embodiments is performed using the conventional machining program 43, so that each time the workpiece 37 is processed, This makes it possible to easily machine the workpiece 37 with high accuracy without creating a new force program.

Industrial applicability

As described above, the laser cache device, the program creation device, and the laser processing method that are useful in the present invention are suitable for laser force checks that drill a target object with a pulsed laser beam! /

Claims

The scope of the claims

[1] Multiple drilling forces on the workpiece in a machining mode in which the laser beam is irradiated one or more shots at multiple positions while changing the laser beam irradiation position. In the laser carriage device that performs

A laser beam oscillation unit for oscillating a laser beam;

An irradiation position moving unit for moving an irradiation position of the laser beam oscillated by the laser beam oscillation unit to the workpiece;

A control unit for controlling the oscillation timing of the laser beam oscillated by the laser beam oscillation unit and the irradiation position of the laser beam moved by the irradiation position moving unit;

With

The controller is

When irradiating the first hole with the laser light in the first cycle, the irradiation position moving unit moves the irradiation position to the first hole drilling position, and the second and subsequent cycles. Controlling the irradiation position moving unit so that the movement path of the irradiation position moved by the irradiation position moving unit to the drilling position of the first hole becomes the same path when irradiating the laser beam to one hole; A laser processing apparatus characterized by the above.

[2] The control unit moves the irradiation position of the laser beam to the last drilling position in one cycle and performs the last drilling position before performing drilling in the first hole in the first cycle. Force control the irradiation position moving unit to move the irradiation position of the laser beam to the drilling position of the first hole;

After the laser beam irradiation to the last drilling position of each cycle is completed, the irradiation position moving unit is controlled to move the laser beam irradiation position with respect to the drilling position of the first hole. The laser processing apparatus according to claim 1.

[3] The control unit sets the last drilling position so that the distance between the last drilling position and the first drilling position is the shortest among all drilling positions. The laser processing apparatus according to claim 2.

[4] The control unit moves the irradiation position of the laser beam to a predetermined default coordinate position and performs the default coordinate position before drilling the first hole in the first cycle. Placement force While controlling the irradiation position moving unit to move the irradiation position of the laser beam to the drilling position of the first hole,

After the laser beam irradiation to the last drilling position in each cycle is completed, the irradiation position is moved so that the laser beam irradiation position is moved with respect to the drilling position of the first hole via the default coordinate position. The laser processing apparatus according to claim 1, wherein the moving unit is controlled.

[5] The control unit sets the default coordinates to an origin position.

4. The laser processing apparatus according to 4.

[6] The laser carriage device according to claim 1, wherein the irradiation position moving unit includes a galvano scanner.

[7] In a machining mode in which a cycle of irradiating one to multiple shots of laser light to a plurality of machining positions of the workpiece while changing the irradiation position of the laser light, a plurality of times are applied to the workpiece. In a laser carriage device that performs drilling force check,

A laser beam oscillation unit for oscillating a laser beam;

With

The control unit sets the irradiation position of the laser beam at a midway path position between the last drilling position in one cycle and the first hole before drilling the first hole in the first cycle. And controlling the irradiation position moving unit to move the irradiation position of the laser beam to the drilling position of the first hole,

After the laser beam irradiation to the last drilling position of each cycle is completed, the irradiation position moving unit is controlled to move the laser beam irradiation position with respect to the drilling position of the first hole. Laser processing equipment.

[8] While changing the irradiation position of the laser beam, the laser is applied to multiple processing positions of the workpiece In a program creation device for creating a control program for a laser processing device that performs a plurality of drilling operations on the workpiece in a processing mode in which a cycle of irradiating one to a plurality of shots at a time is repeated a plurality of times.

Using the processing position coordinates of each hole, the irradiation position of the oscillated laser beam that moves to the drilling position of the first hole when irradiating the first hole with the laser beam in the first cycle is determined. The movement path and the movement path of the irradiation position that is moved to the drilling position of the first hole when the laser beam is irradiated to the first hole after the second cycle are set to be the same path. A program creation device comprising a program creation unit for creating a control program for controlling an irradiation position.

[9] While changing the irradiation position of the laser beam, a plurality of processing positions of the workpiece are irradiated with one to several shots at a plurality of processing positions of the workpiece. In the laser cleaning method for drilling force check,

When the first hole is irradiated with the laser light in the first cycle, the irradiation position is moved to the drilling position of the first hole, and the first hole is irradiated with the laser light after the second cycle. A first step of moving the irradiation position of the laser beam to the first hole in the first cycle so that the movement path of the irradiation position moved to the drilling position of the first hole is the same path when ,

And a second step of irradiating the first hole with the laser light in the first cycle.

[10] In the first step, the laser beam irradiation position is moved to the last drilling position in one cycle before the first hole is drilled in the first cycle, and the last step is performed. Drilling position force including the step of moving the irradiation position of the laser beam to the drilling position of the first hole,

After the second step, after the laser beam irradiation to the last drilling position in each cycle is completed, the laser beam irradiation position is moved with respect to the drilling position of the first hole. The laser processing method according to claim 9, further comprising:

[11] The first step is a predetermined step before the first hole is drilled in the first cycle. Moving the irradiation position of the laser beam to a default coordinate position, and moving the irradiation position of the laser beam to a drilling position of the first hole, the default coordinate position force;

After the second step, after the laser beam irradiation to the last drilling position of each cycle is completed, the laser beam irradiation position with respect to the drilling position of the first hole via the default coordinate position The laser processing method according to claim 9, further comprising a fourth step of moving.

In the first step, before the first hole is drilled in the first cycle, the laser beam is placed on a halfway path position between the last drilling position in one cycle and the first hole. Moving the irradiation position and moving the irradiation position of the laser beam to the drilling position of the first hole while moving the irradiation path position force,

After the second step, after the laser beam irradiation to the last drilling position of each cycle is completed, the laser beam irradiation position is moved with respect to the drilling position of the first hole. The laser processing method according to claim 9, further comprising: