CN101142052B - Laser machining apparatus, program generating device and laser processing method - Google Patents
Laser machining apparatus, program generating device and laser processing method Download PDFInfo
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- CN101142052B CN101142052B CN2006800000378A CN200680000037A CN101142052B CN 101142052 B CN101142052 B CN 101142052B CN 2006800000378 A CN2006800000378 A CN 2006800000378A CN 200680000037 A CN200680000037 A CN 200680000037A CN 101142052 B CN101142052 B CN 101142052B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
- B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
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- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
A laser machining device does a plurality of perforating machining to the machining with multiple repeating the machining mode of the following circulation, the circulation is changing the irradiating the position of laser and at the same time each irradiating one to a plurality of times of laser to a plurality of machining position of the machining object, and the device comprises the following components: an irradiating position moving part which moves the laser excited from the laser oscillation part to the irradiation position of the machining object; and a control part which controls the exciting timing of the laser excited from the laser oscillation part and the irradiation position of the laser moved by the irradiation position moving part, the control part controls the irradiation position moving part in order that the irradiation position moving part leads to the moving path of the irradiation position moving to the perforating machining position of the first hole when laser is irradiated in the first circulation, the second circulation and the following circulations to be an identical path.
Description
Technical field
The present invention relates to utilize pulse laser machined object to be carried out laser processing device, program creating device and the laser processing of Laser Processing.
Background technology
In recent years, along with the high-density installationization of electronic product, require the printed circuit board (PCB) miniaturization of the formation wiring layer of electronic product.In order to realize the miniaturization of printed circuit board (PCB), must form (punching) accurately and be used for by conductive layer the through hole (via hole) that connects between the substrate.
In order to form this through hole accurately, for example use the laser processing device of pulse excitation type, this device utilizes by the pulse laser beam after the lens focusing and punches.In the perforation processing of utilizing this laser processing device that machined objects such as printed base plate are carried out,, carry out repeatedly the laser irradiation to same Working position in order to shorten process time.But, if same Working position is carried out the laser irradiation continuously, then can be in that machined object be on the part of molten condition by the irradiation of before laser, proceed the laser irradiation, according to the difference of employed material and the flowability of machined object increases, thereby can't obtain having the machined object of high-precision machining shape.Therefore, same Working position is being carried out repeatedly under the situation of laser irradiation, must after the partial coagulation of fusion, carry out laser irradiation next time again by before laser irradiation.
The laser processing of being put down in writing in the patent documentation 1 is that a plurality of perforation processing position that is set on the machined object is scanned successively, each hole is carried out the laser irradiation.That is to say, after the 1st punch position being carried out the 1st laser irradiation, reach punch position afterwards to the 2nd and carry out the 1st laser irradiation, return the 1st punch position again, carry out the 2nd laser irradiation, punch position after then the 2nd being reached carries out the 2nd laser irradiation, carries out such processing repeatedly.
Patent documentation 1: the spy opens flat 11-192571 communique
Summary of the invention
But, in above-mentioned prior art, because laser irradiating position moves on each punch position so that each punch position is repeatedly shone, so for a punch position, be easy to generate the position deviation of irradiation each time.Therefore, existence can not be processed the problem of the machining shape of machined object accurately.
The present invention in view of the above problems, its purpose is to obtain a kind of laser processing device, program creating device and laser processing that can process the machining shape of machined object accurately.
In order to solve above-mentioned problem, realize above-mentioned purpose, the present invention is a kind of laser processing device, and it carries out a plurality of perforation processing repeatedly to repeat the cooked mode of following circulation to machined object, this circulation is, the irradiation position of laser is changed, on one side to the each irradiation 1 of a plurality of Working positions of aforementioned machined object to laser several times, it is characterized in that, have: laser oscillating part, it motivates laser; The irradiation position moving part, it makes the laser that is motivated by the aforementioned laser oscillating portion move to the irradiation position of aforementioned machined object; And control part, the excitation of the laser that its control aforementioned laser oscillating portion motivates regularly, and the irradiation position of the laser that moves it of aforementioned irradiation position moving part, aforementioned control part is controlled aforementioned irradiation position moving part, so that in first circulation when the 1st hole irradiation aforementioned laser, aforementioned irradiation position moving part makes its irradiation position mobile route that moves to the perforation processing position in aforementioned the 1st hole, with the 2nd and after circulation in when aforementioned laser is shone in the 1st hole, aforementioned irradiation position moving part makes its irradiation position mobile route that moves to the perforation processing position in the 1st hole, is same path.
The effect of invention
The laser processing device that the present invention relates to, because can reduce the position deviation amount of laser irradiating position in the 1st hole in first circulation and the 2nd and after circulation in the position deviation amount of laser irradiating position in the 1st hole between departure poor, so can play the effect of the machining shape of processing machined object accurately.
Description of drawings
Fig. 1 is the oblique view of the internal structure of the laser processing device that the present invention relates to of expression.
Fig. 2 is the functional block diagram of the structure of the laser processing device that the present invention relates to of expression.
Fig. 3 is the flow chart of the course of action of the laser processing device that relates to of expression embodiment 1.
Fig. 4 is the figure of the order of the laser irradiating position that is used to illustrate that embodiment 1 relates to.
Fig. 5 is used to illustrate that automatically controlled scanning position instructs and the figure of the relation of laser output.
Fig. 6 is used to illustrate that automatically controlled scanning position instructs and the figure of the error relation of Working position.
Fig. 7 is the functional block diagram of other structure example of expression laser processing device.
Fig. 8 is the figure of an example of expression procedure.
Fig. 9 is the flow chart of the course of action of the laser processing device that relates to of expression embodiment 2.
Figure 10 is the figure of the order of the laser irradiating position that is used to illustrate that embodiment 2 relates to.
Figure 11 is the functional block diagram of the structure of the Laser Processing position that relates to of expression embodiment 3.
Figure 12 is the figure that is used to illustrate to the automatically controlled scanning area of machining object.
Figure 13 is the figure of an example of the employed existing procedure of laser processing device of expression embodiment 3.
The specific embodiment
Below, describe the embodiment of laser processing device, program creating device and the laser processing that the present invention relates to reference to the accompanying drawings in detail.In addition, the present invention is not limited to the content that limited by this embodiment.
Fig. 1 is the oblique view of the internal structure of the laser processing device that the present invention relates to of expression.Laser processing device 1 constitutes, and can utilize the irradiation (cycle pulse pattern) of laser (pulse laser), and machined object 37 is carried out the perforation processing of micro hole, and it has: laser oscillator 21, and it motivates laser; Picture duplicates optical facilities 22, and it carries out shaping to the laser shape, simultaneously it is adjusted into desired beam shape, beam energy; Laser Processing portion 30, it carries out the Laser Processing of machined object; And Working control device 10.In addition, said here cycle pulse pattern is meant and scans a plurality of perforation processing position of setting successively on machining object, and (processing that repeats repeatedly at every turn to shine the circulation of 1 laser is handled) handled in the processing that laser irradiation is carried out with a plurality of circulations in each hole.
Laser oscillator 21 motivates laser, and duplicates optical facilities 22 transmissions to picture.Picture duplicates optical facilities 22 and has collimating mirror 23, mask 24.Collimating mirror 23 makes from the laser convergence of laser oscillator 21 and adjusts optical axis (parallelization), and the beam shape of 24 pairs of laser of mask carries out shaping.
Laser Processing portion 30 has automatically controlled speculum 35X, 35Y, automatically controlled scanner 36X, 36Y, f-θ lens 34, machined object (workpiece) 37, X-Y workbench 38, observation optical facilities (vision sensor) 39.
Automatically controlled scanner 36X, 36Y have the track that makes laser to be changed, and makes the function that moves according to the irradiation position to machined object 37, in order to make laser at the X-Y scanning direction, makes automatically controlled speculum 35X, the 35Y angular turn with regulation.Automatically controlled speculum 35X, 35Y reflection is duplicated the laser (light beam) of mask 24 ejaculations of optical facilities 22 from picture, makes it to arbitrarily angled deflection simultaneously.Automatically controlled speculum 35X makes laser to directions X deflection, and automatically controlled speculum 35Y makes laser to the deflection of Y direction.F-θ lens 34 make laser to the surperficial vertical direction deflection of machined object 37, and make the Working position (surface) of laser convergence (irradiation) at machined object 37.
Machined object 37 is printed base plates etc., carries out a plurality of perforation processing.X-Y workbench 38 is put and is carried machined object 37, utilizes the driving of not shown X-axis motor and Y-axis motor, moves freely on 2 dimensional planes of X-axis, Y-axis.
Observation optical facilities 39 detect the height of the Z-direction of machined object 37.Utilize the height (information) of the Z-direction of observation optical facilities 39 detected machined objects 37, be transmitted to Working control device 10, Working control device 10 is controlled the short transverse of machined object 37 according to this information.
Fig. 2 is the functional block diagram of the structure of the laser processing device that the present invention relates to of expression.Laser processing device 1 has Working control device 10 and processing drive unit 20.Processing drive unit 20 is the devices that carry out Laser Processing, with laser oscillator 21 shown in Figure 1, as duplicate optical facilities 22, Laser Processing portion 30 is corresponding.
Card for laser control unit 12 carries out the control relevant with laser (excitation of laser, optical axis adjustment etc.).Card for laser control unit 12 control laser oscillators 21 are controlled collimating mirror 23, mask 24, with the optical axis adjustment and the beam shape of control laser simultaneously with the excitation of control laser (regularly, power etc.).In addition, the position of card for laser control unit 12 control f-θ lens 34 so that laser to the surperficial vertical direction deflection of machined object 37.
X-Y workbench control part 13 control X-Y workbench 38 make that the machined object 37 on the X-Y workbench moves to the X-Y direction.Automatically controlled scanner control part 15 control automatically controlled scanner 36X, 36Y are so that automatically controlled speculum 35X, 35Y scan laser with the angular turn of regulation on the X-Y direction.
In present embodiment 1, utilize X-Y workbench control part 13 to make the machined object 37 on the X-Y workbench 38 move to the X-Y direction, utilize automatically controlled scanner control part 15 that laser is scanned on the X-Y direction simultaneously, the regulation Working position of machined object 37 is carried out the laser irradiation.X-Y workbench control part 13, automatically controlled scanner control part 15 are according to procedure described later or NC program etc., and the position of control X-Y workbench 38 makes laser scan on the X-Y direction simultaneously.
Below, the sequence of movement of the Laser Processing position that embodiment 1 relates to is described.Fig. 3 is the flow chart of the course of action of the laser processing device that relates to of expression embodiment 1, and Fig. 4 is the figure of the order of the laser irradiating position that is used to illustrate that embodiment 1 relates to.
Here, as an example of Laser Processing, for example to laser processing device 1 with the cycle pulse pattern, the situation that (n for more than or equal to 2 natural number) individual machining hole Hn carries out Laser Processing from the 1st machining hole H1 to n describes.And here, an example as the Laser Processing of laser processing device 1 describes more than or equal to the individual situation in 4 (n is more than or equal to 4) machining hole.
If utilize laser processing device 1 to begin to carry out the Laser Processing processing of machined object 37, then X-Y workbench control part 13 is controlled the position of X-Y workbench 38 according to procedure and NC program in the procedure storage part 14.Thus, the machined object 37 on the X-Y workbench 38 moves on the X-Y direction, so that laser shines on the automatically controlled scanning area (by the zone of automatically controlled scanner 36X, 36Y control Working position) 51 of regulation.
As initial setting, automatically controlled scanner control part 15 control automatically controlled scanner 36X, 36Y are so that the irradiation position of laser is the default coordinate (for example initial point (central point of automatically controlled scanning area)) of automatically controlled scanning area 51.
At first, automatically controlled scanner control part 15 sends automatically controlled scanning position instruction to automatically controlled scanner 36X, 36Y, so that n Working position (machining hole Hn) is the irradiation position of laser according to procedure.Thus, automatically controlled scanner 36X, 36Y control automatically controlled speculum 35X, 35Y, so that n Working position (machining hole Hn) is the irradiation position (step S110) of laser.At this moment, card for laser control unit 12 does not make laser oscillator 21 motivate laser.
Then, automatically controlled scanner control part 15 sends instruction according to procedure to automatically controlled scanner 36X, 36Y, so that the 1st Working position (machining hole H1) is laser irradiating position.Thus, automatically controlled scanner 36X, 36Y control automatically controlled speculum 35X, 35Y, so that the 1st Working position (machining hole H1) is the irradiation position (step S120) (1) of laser.
Then, card for laser control unit 12 makes laser oscillator 21 motivate laser.Thus, laser duplicates optical facilities 22 shapings by picture, is adjusted into desired beam shape, beam energy.And the laser that sends from mask 24 utilizes automatically controlled speculum 35X, 35Y reflection and deflection, and the machining hole H1 that is radiated at machined object 37 by f-θ lens 34 goes up and imaging.Thus, machining hole H1 (the 1st hole) is carried out the processing processing of the 1st irradiation.
Then, automatically controlled scanner control part 15 sends automatically controlled scanning position instruction to automatically controlled scanner 36X, 36Y, so that the 2nd Working position (machining hole H2) becomes the irradiation position of laser according to procedure.Thus, automatically controlled scanner 36X, 36Y control automatically controlled speculum 35X, 35Y, so that the 2nd Working position (machining hole H2) becomes the irradiation position (step S140) (2) of laser.Then, card for laser control unit 12 makes laser oscillator 21 motivate laser.Thus, machining hole H2 (the 2nd hole) is carried out the processing processing (step S150) of the 1st irradiation.
Afterwards, though Fig. 3 is not shown, but automatically controlled scanner control part 15 sends automatically controlled scanning position instruction according to procedure to automatically controlled scanner 36X, 36Y, so that the 3rd and after (individual) Working position up to (n-2) become laser irradiating position, simultaneously to the 3rd and after the machining hole of (individual) processing of carrying out the 1st irradiation up to (n-2) handle.
Then, automatically controlled scanner control part 15 sends automatically controlled scanning position instruction according to procedure to automatically controlled scanner 36X, 36Y, so that (n-1) individual Working position (machining hole H (n-1)) becomes laser irradiating position.Thus, automatically controlled scanner 36X, 36Y control automatically controlled speculum 35X, 35Y, make (n-1) individual Working position (machining hole H (n-1)) become laser irradiating position (step S160) (n).
Afterwards, card for laser control unit 12 makes laser oscillator 21 motivate laser.Thus, machining hole H (n-1) ((n-1) hole) is carried out the processing processing (step S170) of the 1st irradiation.
Then, automatically controlled scanner control part 15 sends automatically controlled scanning position instruction according to procedure to automatically controlled scanner 36X, 36Y, so that n Working position (machining hole Hn) becomes laser irradiating position.Thus, automatically controlled scanner 36X, 36Y control automatically controlled speculum 35X, 35Y, so that n Working position (machining hole Hn) becomes laser irradiating position (step S180) (n+1).Afterwards, card for laser control unit 12 makes laser oscillator 21 motivate laser.Thus, machining hole Hn (n hole) is carried out the processing processing (step S190) of the 1st irradiation.
Afterwards, automatically controlled scanner control part 15 sends automatically controlled scanning position instruction according to procedure to automatically controlled scanner 36X, 36Y, so that the 2nd irradiation position that becomes laser to n Working position (machining hole H2 to Hn), simultaneously, card for laser control unit 12 makes laser oscillator 21 motivate laser at each Working position 12.Thus, automatically controlled scanner 36X, 36Y control automatically controlled speculum 35X, 35Y, so that the 2nd to n Working position (machining hole H2 to Hn) becomes laser irradiating position, carry out the processing of the 2nd irradiation of machining hole H2 to Hn (n hole, the 2nd hole to the) and handle (step S140 to S190).
Then, master control part 11 judges the Laser Processing in this automatically controlled scanning area 51 handles whether finish (step S200).Master control part 11 was carried out the processing of step S120 to S200 repeatedly before the Laser Processing processing in judging this automatically controlled scanning area 51 finishes.
If master control part 11 is judged the Laser Processing processing in this automatically controlled scanning area 51 and is finished (step S200, be), the position of then automatically controlled scanner control part 15, card for laser control unit 12 control X-Y workbench 38, thereby the Laser Processing that finishes in this automatically controlled scanning area 51 is handled, and the processing of carrying out in the next automatically controlled scanning area 51 is handled.Then, the processing of carrying out in the next automatically controlled scanning area 51 is handled.
Here, the laser output relation to automatically controlled scanning position instruction and laser describes.Fig. 5 is used to illustrate that automatically controlled scanning position instructs and the figure of the relation of laser output.As shown in Figure 5, in embodiment 1, at first, automatically controlled scanner control part 15 sends the automatically controlled scanning position instruction that moves to the n hole site to automatically controlled scanner 36X, 36Y.And, do not carry out laser output (excitation) this moment by laser oscillator 21.Then, automatically controlled scanner control part 15 sends the automatically controlled scanning position instruction that moves to the 1st hole site to automatically controlled scanner 36X, 36Y.This moment, laser oscillator 21 carried out laser output in the 1st hole site.After, send to automatically controlled scanner 36X, 36Y by automatically controlled scanner control part 15 and to move to the position command of the 2nd hole to the n hole, carry out laser output in each hole (position) by laser oscillator 21.
Thus, after the processing of finishing from the 1st hole to the n hole the 1st time irradiation is handled, carry out the processing of the 2nd irradiation and handle from the 1st hole to the n hole.That is, automatically controlled scanner control part 15 sends to automatically controlled scanner 36X, 36Y and moves to the automatically controlled scanning position instruction of the 1st hole to the n hole, carries out the laser output (the 2nd irradiation) by laser oscillator 21 in each hole.
Below, the relation between the error of automatically controlled scanning position instruction and Working position is described.Fig. 6 is the figure that is used to illustrate the relation between the error of automatically controlled scanning position instruction and Working position.If automatically controlled scanner control part 15 sends automatically controlled scanning position control instruction to automatically controlled scanner 36X, 36Y, so that the Working position of regulation is a laser irradiating position, then automatically controlled scanner 36X, 36Y control automatically controlled speculum 35X, 35Y, so that this Working position becomes laser irradiating position.
But the irradiation position of laser can produce certain position error (departure) corresponding to the mobile route that begins from before irradiation position (distance, direction).That is, between the automatically controlled scanning position (irradiation position) of automatically controlled scanning position instruction and reality, can produce deviation (overtravel or in shortage).
For example, in the process of carrying out according to prior art, carrying out the automatically controlled scanning position under the situation of processing of the 1st time of the 1st hole irradiation, is that the Working position of default coordinate to the 1st hole from initial point etc. moves.But the automatically controlled scanning position under the situation of the processing of carrying out the 2nd time of the 1st hole irradiation then is that the Working position of Working position to the 1st hole from the n hole moves.Therefore, at place, the 1st hole, the position deviation amount of actual automatically controlled scanning position is different in the 1st irradiation and the 2nd irradiation.Therefore, in the process according to prior art, observe from the finished surface of machined object 37, the 1st hole becomes elliptical shape or tumbler shape, can not process the machining shape of machined object accurately.
On the other hand, in embodiment 1, when the 1st irradiation carrying out the 1st hole adds man-hour, sending the automatically controlled scanning position instruction that moves to the n hole site after making that automatically controlled scanning position moves, send the automatically controlled scanning position instruction of the Working position that moves to the 1st hole from the position in n hole, so that automatically controlled scanning position moves.Thus, the 2nd irradiation in the position deviation amount of the actual automatically controlled scanning position of the 1st irradiation in the 1st hole and the 1st hole and the position deviation amount of actual automatically controlled scanning position afterwards are the departure of roughly the same degree.
In addition, in embodiment 1, the procedure storage part 14 that becomes Working control device 10 is stored procedure in advance, the structure of carrying out Laser Processing according to this procedure, but also can be that external device (ED) from Working control device 10 receives the structure that procedure uses.Below, use Fig. 7 and Fig. 8, describe obtain the situation that procedure carries out Laser Processing from external device (ED).
In this case, for example generate procedure by laser processing device 1, laser processing device 1 carries out Laser Processing according to this procedure.That is, generate the procedure in the procedure storage part 14 be stored in Working control device shown in Figure 2 10 by external device (ED), use the procedure of this generation to carry out Laser Processing.
Fig. 7 is the functional block diagram of other structure example of the laser processing device that relates to of expression embodiment 1, for the structural element of realizing same function in each structural element of Fig. 7 with laser processing device 1 shown in Figure 2, the label that mark is identical, and the repetitive description thereof will be omitted.
The laser processing device 1 here on the basis of Working control device 10 and processing drive unit 20, also has program creating device 60, and its generation is used for being stored in advance the procedure in the procedure storage part 14.
And, CAD transformation component 62 in the procedure that comes by the user program conversion, the open/close parameter of extra-instruction laser (laser beam).CAD transformation component 62 for example appends to " 1 " in the procedure, and the parameter as instruction laser is opened simultaneously, appends to " 0 " in the procedure, as the parameter of instruction laser pass.Specifically, CAD transformation component 62 is for example for automatically controlled scanning area N1, and at first indication moves to the i.e. automatically controlled scanning position instruction of " X300Y300 " of Working position in n hole, and the order of irradiating laser " 0 " does not append in the procedure simultaneously.The procedure that CAD transformation component 62 generates is by 14 storages of procedure storage part.
Procedure for example generates with following form, that is, the information that can utilize the expression light beam to close is only specified the position location, is transformed to the form of the form that can be read by laser processing device 1 again.
Below, an example of procedure is described.Fig. 8 is the figure of an example of expression procedure.What procedure was represented is that in automatically controlled scanning area N1 (machining area 1), the processing stand in n hole for example is " X300 Y300 ", makes automatically controlled scanning position move to the Working position in n hole from default coordinates such as initial points.In addition, represent automatically controlled scanning position when move in this n hole that begins most, do not carry out the Laser Processing of the 1st irradiation.Afterwards, automatically controlled scanning position is moved successively to the Working position of the processing stand in the processing stand in the 1st hole, the 2nd hole, carry out the Laser Processing in each hole in the automatically controlled scanning area N1.
The procedure here moves to automatically controlled scanning area N2 after the expression.And what procedure was represented is that in automatically controlled scanning area N2 (machining area 2), the processing stand of M hole (M is a natural number) for example is " X300 Y300 ", makes automatically controlled scanning position move to the Working position in M hole from default coordinates such as initial points.In addition, represent automatically controlled scanning position when move in this M hole that begins most, do not carry out the Laser Processing of the 1st irradiation.Afterwards, automatically controlled scanning position is moved successively to the Working position of the processing stand in the processing stand in the 1st hole, the 2nd hole, carry out the Laser Processing in each hole in the automatically controlled scanning area N2.Here, Working control device 10 is controlled the Laser Processing of laser processing device 1 according to procedure.
And, it here is the structure that laser processing device 1 has program creating device 60, but also can be the structure that makes program creating device 60 independently different with laser processing device 1, use the procedure that is generated by program creating device 60, laser processing device 1 carries out Laser Processing.Under this situation, can be that laser processing device 1 is connected with program creating device 60, send the structure of procedure to laser processing device 1 from program creating device 60, also can be to pass through movably exterior storage medium by the procedure that program creating device 60 generates, be input to the structure in the laser processing device 1.
And, in embodiment 1, the situation that laser processing device 1 is carried out the Laser Processing of machined object 37 with the cycle pulse pattern is illustrated, but laser processing device 1 also can be handled by the processing of repeatedly carrying out following circulation repeatedly, carry out the Laser Processing of machined object 37, this circulation is that the irradiation position of laser is changed, on one side to the each irradiation 1 of a plurality of Working positions of machined object to laser repeatedly.
In addition, in embodiment 1, when the 1st irradiation carrying out the 1st hole adds man-hour, make after automatically controlled scanning position moves to the position in n hole, automatically controlled scanning position is moved from the Working position of position to the 1st hole in n hole, but also can be to add man-hour when the 1st irradiation carrying out the 1st hole, make after automatically controlled scanning position moves to the position of m hole (m is the natural number less than (n-1)), make automatically controlled scanning position move to the m hole, the Working position of control irradiation position to the 1st hole moved to the n hole.
In addition, in embodiment 1, when the 1st irradiation carrying out the 1st hole adds man-hour, make after automatically controlled scanning position moves to the position in n hole, automatically controlled scanning position is moved from the Working position of position to the 1st hole in n hole, but also can be to add man-hour when the 1st irradiation carrying out the 1st hole, automatically controlled scanning position is moved to after the half-way of the machining path in 1 hole, n hole to the, automatically controlled scanning position is moved from the Working position of this half-way to the 1st hole, carry out the 1st the irradiation processing in the 1st hole.
In addition, add man-hour in order to reduce carrying out the 1st time of the 1st hole irradiation, the displacement from the automatically controlled scanning position in 1 hole, n hole to the can be set at the n hole distance near hole (for example, distance between borehole is the shortest hole), the 1st hole.Because if the displacement of the automatically controlled scanning position from the n hole when move in the 1st hole is short, then the position deviation amount of automatically controlled scanning position reduces, so can reduce the position deviation amount of the automatically controlled scanning position when the n hole moves to the 1st hole thus.In addition, can shorten and make the traveling time of automatically controlled scanning position when the n hole moves to the 1st hole.
In addition, also can reduce the displacement of automatically controlled scanning position, the n hole is set at the hole near apart from initial point (for example distance between borehole is the shortest hole) in order to add man-hour in the 1st irradiation carrying out the 1st hole from initial point to the n hole.Thus, can shorten and make the traveling time of automatically controlled scanning position when initial point moves to the n hole.
And, also can set n hole and the 1st hole in the following manner, promptly, make and add man-hour in the 1st irradiation carrying out the 1st hole, the displacement of automatically controlled scanning position from initial point to the n hole and from the total of the displacement of the automatically controlled scanning position in 1 hole, n hole to the apart from reducing (for example beeline).Thus, can shorten make automatically controlled scanning position from initial point when move in the n hole traveling time and make total ascent time of automatically controlled scanning position traveling time when move in the 1st hole from the n hole.
In addition, laser processing device 1 can be that X-Y workbench 38 is stopped, only make automatically controlled speculum 35X, 35Y rotate the workbench that makes laser scanning and stop processing, also can be simultaneously, make automatically controlled speculum 35X, 35Y move non-the stopping of the workbench that makes laser scanning and process at mobile X-Y workbench 38.
Like this, according to embodiment 1, because can make the position deviation amount of actual automatically controlled scanning position of the 1st time of the 1st hole irradiation and the 1st hole the 2nd irradiation and after the position deviation amount of actual automatically controlled scanning position, departure for roughly the same degree, observe the shape that is roughly circle so the 1st hole can be processed into, can process the machining shape of machined object 37 accurately from the finished surface of machined object 37.
In addition, because program creating device 60 generates following procedure, promptly, when the 1st irradiation carrying out the 1st hole adds man-hour, sending the automatically controlled scanning position instruction that moves to the n hole site and making after automatically controlled scanning position moves, send the automatically controlled scanning position instruction of the Working position that moves to the 1st hole from the n hole site, automatically controlled scanning position is moved, so processing unit (plant) 1 can be so that the position deviation amount of the actual automatically controlled scanning position of the 1st irradiation in the 1st hole, with the 2nd time of the 1st hole irradiation and after the position deviation amount of actual automatically controlled scanning position be the departure of roughly the same degree.Thus, can provide a kind of like this procedure, that is, the 1st hole can be processed into from the surface of machined object 37 and observe the shape that is roughly circle, can process the machining shape of machined object 37 accurately to laser processing device 1.
Below, use Fig. 1,2 and Fig. 9,10 pairs of embodiment of the present invention 2 describe.In embodiment 2, a circulation in each cycle pulse pattern finishes, send the automatically controlled scanning position instruction of the default coordinate that moves to regulation, control automatically controlled speculum 35X, 35Y, add the automatically controlled scanning position in man-hour and move so that carry out the 1st hole, in all circulations (full illumination that comprises the 1st irradiation), all become same path.Because the laser processing device 1 of embodiment 2, also has the same structure of laser processing device illustrated among the Fig. 1,2 with embodiment 11, so omit its explanation here.
The course of action of the laser processing device that embodiment 2 relates to is described.Fig. 9 is the flow chart of the course of action of the laser processing device that relates to of expression embodiment 2, and Figure 10 is the figure of the order of the laser irradiating position that is used to illustrate that embodiment 2 relates to.Here, as an example of Laser Processing, to for example laser processing device 1 is with the cycle pulse pattern, the situation that (n is the natural number more than or equal to 2) individual machining hole Hn from the 1st machining hole H1 to n is carried out Laser Processing describes.In addition, here as an example of the Laser Processing of laser processing device 1, to describing for situation more than or equal to 4 (n is more than or equal to 4) machining holes.
If beginning is handled by the Laser Processing that laser processing device 1 carries out machined object 37, then X-Y workbench control part 13 is controlled the position of X-Y workbench 38 according to procedure in the procedure storage part 14 and NC program.Thus, the machined object 37 on the X-Y workbench 38 moves to the X-Y direction, so that laser shines on the automatically controlled scanning area (by the zone of automatically controlled scanner 36X, 36Y control Working position) 51 of regulation.
As initial setting, automatically controlled scanner control part 15 control automatically controlled scanner 36X, 36Y are so that the irradiation position of laser is the default coordinate (for example initial point) (step S310) of automatically controlled scanning area 51.
Then, automatically controlled scanner control part 15 sends automatically controlled scanning position instruction according to procedure to automatically controlled scanner 36X, 36Y, so that the 1st Working position (machining hole H1) is the irradiation position of laser.Thus, automatically controlled scanner 36X, 36Y control automatically controlled speculum 35X, 35Y, so that the 1st Working position (machining hole H1) is the irradiation position (step S320) (1) of laser.
Then, card for laser control unit 12 makes laser oscillator 21 motivate laser.Thus, laser duplicates optical facilities 22 shapings by picture, is adjusted into desired beam shape, beam energy.And, from the laser that mask 24 sends, utilizing automatically controlled speculum 35X, 35Y reflection and deflect, the machining hole H1 that shines machined object 37 by f-θ lens 34 goes up and imaging.Thus, machining hole H1 (the 1st hole) is carried out the processing processing (step S330) of the 1st irradiation.
Then, automatically controlled scanner control part 15 sends instruction according to procedure to automatically controlled scanner 36X, 36Y, so that the 2nd Working position (machining hole H2) becomes the irradiation position of laser.Thus, automatically controlled scanner 36X, 36Y control automatically controlled speculum 35X, 35Y, so that the 2nd Working position (machining hole H2) is the irradiation position (step S340) (2) of laser.And card for laser control unit 12 makes laser oscillator 21 motivate laser.Thus, machining hole H2 (the 2nd hole) is carried out the processing processing (step S350) of the 1st irradiation.
Afterwards, though Fig. 9 is not shown, but automatically controlled scanner control part 15 sends automatically controlled scanning position instruction according to procedure to automatically controlled scanner 36X, 36Y, so that the 3rd and after the Working position of (individual) up to (n-2) become laser irradiating position, simultaneously to the 3rd and after the machining hole of (individual) processing of carrying out the 1st irradiation up to (n-2) handle.
Then, automatically controlled scanner control part 15 sends automatically controlled scanning position instruction according to procedure to automatically controlled scanner 36X, 36Y, so that (n-1) individual Working position (machining hole H (n-1)) becomes the irradiation position of laser.Thus, automatically controlled scanner 36X, 36Y control automatically controlled speculum 35X, 35Y, so that (n-1) individual Working position (machining hole H (n-1)) becomes laser irradiating position (step S360).Afterwards, card for laser control unit 12 makes laser oscillator 21 motivate laser, thus machining hole H (n-1) ((n-1) hole) is carried out the 1st irradiation processing and handles (step S370).
Then, automatically controlled scanner control part 15 sends automatically controlled scanning position instruction according to procedure to automatically controlled scanner 36X, 36Y, so that n Working position (machining hole Hn) becomes laser irradiating position.Thus, automatically controlled scanner 36X, 36Y control automatically controlled speculum 35X, 35Y, so that n Working position (machining hole Hn) becomes laser irradiating position (step S380).Then, card for laser control unit 12 makes laser oscillator 21 motivate laser.Thus, machining hole Hn (n hole) is carried out the 1st irradiation processing and handle (step S390).
Automatically controlled scanner control part 15 sends automatically controlled scanning position instruction to automatically controlled scanner 36X, 36Y, so that the default coordinate (initial point) of automatically controlled scanning area 51 is the irradiation position of laser according to procedure.Thus, automatically controlled scanner 36X, 36Y control automatically controlled speculum 35X, 35Y, so that initial point is the irradiation position (step S310) of laser.At this moment, card for laser control unit 12 makes laser oscillator 21 not motivate laser.
Then, automatically controlled scanner control part 15 sends instruction according to procedure to automatically controlled scanner 36X, 36Y, so that the 1st Working position (machining hole H1) is laser irradiating position.Thus, automatically controlled scanner 36X, 36Y control automatically controlled speculum 35X, 35Y, so that the 1st Working position (machining hole H1) is the irradiation position (step S320) of laser.And card for laser control unit 12 makes laser oscillator 21 motivate laser, thus machining hole H1 (the 1st hole) is carried out the processing processing (step S330) of the 2nd irradiation.
Afterwards, automatically controlled scanner control part 15 sends automatically controlled scanning position instruction according to procedure to automatically controlled scanner 36X, 36Y, so that the 2nd to n Working position (machining hole H2 to Hn) becomes laser irradiating position, simultaneously, card for laser control unit 12 makes laser oscillator 21 motivate laser on each Working position.Thus, automatically controlled scanner 36X, 36Y control automatically controlled speculum 35X, 35Y, so that the 2nd to n Working position (machining hole H2 to Hn) becomes laser irradiating position, carry out the processing of the 2nd irradiation of machining hole H2 to Hn (n hole, the 2nd hole to the) and handle (step S340 to S390).
Then, master control part 11 judges the Laser Processing in this automatically controlled scanning area 51 handles whether finish (step S400).Master control part 11 was carried out the processing of step S320 to S400 repeatedly before the Laser Processing processing in judging this automatically controlled scanning area 51 finishes.Promptly, in embodiment 2, under the situation of after machining hole Hn is processed, machining hole H1 being processed, after the automatically controlled scanning position instruction that moves to initial point is promptly sent in step S310 processing, send the automatically controlled scanning position instruction that moves to machining hole H1, carry out the processing of machining hole H1.
If master control part 11 is judged the Laser Processing processing in this automatically controlled scanning area 51 and is finished (step S400, be), the Laser Processing that then automatically controlled scanner control part 15, card for laser control unit 12 finish in this automatically controlled scanning area 51 is handled, handle with the processing of carrying out in the next automatically controlled scanning area 51 position of control X-Y workbench 38.Then, the processing of carrying out in the next automatically controlled scanning area 51 is handled.
And, in embodiment 2,, the 1st hole can be set at the hole near (for example distance between borehole is the shortest hole) apart from initial point in order to reduce from the displacement of the automatically controlled scanning position in initial point to the 1 hole.In addition, in order to reduce the displacement of automatically controlled scanning position, the n hole can be set at the hole near (for example distance between borehole is the shortest hole) apart from initial point from the n hole to initial point.And, can set n hole and the 1st hole like this, that is, make to add man-hour in the 1st irradiation carrying out the 1st hole, from the total of the displacement of the displacement of the automatically controlled scanning position in initial point to the 1 hole and automatically controlled scanning position from the n hole to initial point apart from reducing (for example being beeline).Thus, can shorten make automatically controlled scanning position from the n hole traveling time when initial point moves, make automatically controlled scanning position from initial point when move in the 1st hole traveling time and the total ascent time of these traveling times.
In addition, embodiment 2 also with embodiment 1 similarly, the procedure storage part 14 that is not limited to Working control device 10 is stored procedure in advance, according to the structure that this procedure carries out Laser Processing, also can be to receive the structure that procedure uses from the external device (ED) of Working control device 10.
Thus, in embodiment 2,, make after automatically controlled scanning position moves to initial point sending automatically controlled scanning position move, send automatically controlled scanning position move again and make automatically controlled scanning position move to the Working position in the 1st hole from initial point when processing during the 1st hole.Thus, the 2nd irradiation in the position deviation amount of the actual automatically controlled scanning position of the 1st irradiation in the 1st hole and the 1st hole and the position deviation amount of actual automatically controlled scanning position afterwards are the departure of roughly the same degree.
Like this, according to embodiment 2, because can make the position deviation amount of actual automatically controlled scanning position of the 1st time of the 1st hole irradiation and the 1st hole the 2nd time and after the position deviation amount of automatically controlled scanning position of reality of irradiation, departure for roughly the same degree, observe the shape that is roughly circle so the 1st hole can be processed into, can process the machining shape of machined object 37 accurately from the finished surface of machined object 37.
Embodiment 3.
Below, use Figure 11 to Figure 13 that embodiments of the present invention 3 are described.In embodiment 3, employed procedure before using (makes the 1st irradiation carrying out the 1st hole add the automatically controlled scanning position in man-hour, directly move to the process of the Working position in the 1st hole from the default coordinate of initial point etc.), utilize the control device (process control device described later) of regulation simultaneously, according to the process (moving process of automatically controlled scanning position and the irradiation of laser regularly) same with embodiment 1 and embodiment 2, control laser processing device 1 is to carry out Laser Processing.
Promptly, in embodiment 3, for example add man-hour when carry out the 1st time of the 1st hole irradiation in each automatically controlled scanning area, in the automatically controlled scanning position instruction of sending the position that moves to the n hole and make after automatically controlled scanning position moves, send automatically controlled scanning position instruction, so that automatically controlled scanning position moves to the Working position in the 1st hole from the position in n hole.Then, after process in, employed procedure before using carries out Laser Processing and handles (process corresponding with embodiment 1).
Figure 11 is the functional block diagram of the structure of the laser processing device that relates to of expression embodiment 3.To realizing in each structural element of Figure 11 and the structural element of laser processing device 1 identical function of embodiment 1,2 shown in Figure 2, mark identical label, and the repetitive description thereof will be omitted.
The existing procedure 43 that process control portion 44 is stored for procedure storage part 45, when the 1st irradiation carrying out the 1st hole in each automatically controlled scanning area adds man-hour, send indication information to Working control device 10 (master control part 11), to send the automatically controlled scanning position instruction that moves to the n hole site, simultaneously send indication information, do not shine so that do not carry out laser in the position in n hole to Working control device 10.And, process control portion 44 sends indication information to Working control device 10, to send the automatically controlled scanning position instruction of the position that moves to the 1st hole, automatically controlled scanning position is moved to the 1st hole Working position from the position in n hole, afterwards, carry out handling (the 1st the laser irradiation in the 1st hole) by the processing of existing procedure.
Below, the course of action of the process control device 40 that embodiment 3 relates to is described.In order to begin to carry out the Laser Processing of machined object 37 by laser processing device 1, the user of laser processing device 1, (for example the user program of 500mm * 500mm) (size of machined object 37) and punch position is input in the user program input part 41 of process control device 40 with specifying punch position zone on machined object 37 coordinates.
Figure 12 is the figure that is used to illustrate the automatically controlled scanning area in the machined object.Punch position zone on machined object 37 coordinates is the size of machined object 37, by the size formation of for example 500mm * 500mm.
Automatically controlled scanning area (comprising the information Processing zone relevant with the hole coordinate is automatically controlled scanning area N1 to N3 etc.) for for example 50mm * 50mm size is cut apart by the CAD transformation component in the punch position zone of this machined object 37.And CAD transformation component 42 calculates the Working position in each automatically controlled scanning area, optimum machining path according to user program, and generates procedure 43.This procedure 43 is stored by procedure storage part 45 (procedure storage part 14).And the automatically controlled scanning area N1 to N3 here etc. are corresponding with the automatically controlled scanning area 51 shown in Figure 4 of embodiment 1.
Here, an example to existing procedure 43 describes.Figure 13 is the figure of an example of the employed existing procedure of laser processing device of expression embodiment 3.Existing procedure 43 is in automatically controlled scanning area N1 (machining area 1), the processing stand in the 1st hole (Working position) for example is " X400 Y300 ", make automatically controlled scanning position directly move to the Working position in the 1st hole, carry out the Laser Processing first time from default coordinates such as initial points.Afterwards, make automatically controlled scanning position move to the Working position of processing stand in processing stand, the 3rd hole in the 2nd hole successively, carry out the Laser Processing in each hole in the automatically controlled scanning area N1.
Afterwards, move to automatically controlled scanning area N2, make automatically controlled scanning position directly move to the Working position " X1000 Y-500 " in the 1st hole, carry out the Laser Processing of irradiation for the first time from the default coordinate of initial point etc.Then, make automatically controlled scanning position move to the 2nd hole and Working position afterwards, carry out the Laser Processing in each hole in the automatically controlled scanning area N2.
In embodiment 3, when the 1st irradiation carrying out the 1st hole in each automatically controlled scanning area (for example automatically controlled scanning area N1) adds man-hour, if process control portion 44 identifies the indication of the 1st irradiation processing carrying out the 1st hole from procedure, then send indication information to Working control device 10, to send the automatically controlled scanning position instruction that moves to the n hole site, simultaneously send instruction, with irradiating laser not in the n hole site to Working control device 10.Afterwards, process control portion 44 makes Working control device 10 carry out handling (sending the automatically controlled scanning position instruction of the position that moves to the 1st hole, the beginning Laser Processing) by the processing of procedure 43.
Thus, laser processing device 1 at first carries out Laser Processing at the 1st processing stand and handles (the 1st irradiation), carries out Laser Processing at the 2nd processing stand then and handles (the 1st irradiation).Below, according to embodiment 1 in the illustrated identical processing procedure of processing processing procedure, carry out the processing of machined object 37 and handle.
And if the processing processing for example in machining area N1 finishes, then process control portion 44 is among the automatically controlled scanning area N2 in the automatically controlled scanning area of the next one, carries out the processing identical with automatically controlled scanning area N1 and handles.Next, process control portion 44 similarly makes Working control device 10 carry out automatically controlled scanning area N2 and handles with the processing of rear region.And, after processing in, if process control portion 44 recognizes the indication of the 1st irradiation processing carrying out the 1st hole from procedure, then send indication information to processing unit (plant) 10, to send the automatically controlled scanning position instruction of the position that moves to the n hole, simultaneously send indication information, make in the n hole site not irradiating laser to Working control device 10.Then, process control portion 44 makes Working control device 10 carry out handling (sending the position command that moves to the 1st hole, the beginning Laser Processing) by the processing of procedure 43.
In addition, in embodiment 3, illustrated that the 1st irradiation that process control portion 44 carries out the 1st hole in each automatically controlled scanning area adds man-hour, control Working control device 10 is to begin processing according to the process corresponding with embodiment 1, and the situation of having used existing procedure 43 to process, but process control portion 44 also can be after each automatically controlled scanning area be carried out each irradiation processing in n hole (each circulation of each cycle pulse pattern finishes), control Working control device 10 is proceeded processing according to the process corresponding with embodiment 2, has used the processing of existing procedure 43.
In addition, in embodiment 3, the structure that laser processing device 1 is had process control device 40 is illustrated, but also can be process control device 40 structure independently different with laser processing device 1, becomes to connect the structure that makes it to move.
And, in embodiment 3, automatically controlled scanner control part 15 is illustrated with the situation of process control device 40 for different structures, also can be the structure that automatically controlled scanner control part 15 has the function of process control portion 44.Under this situation, have the automatically controlled scanner control part 15 of the function of process control portion 44, the existing procedure 43 according to procedure storage part 14 is stored carries out Laser Processing.
In addition, in embodiment 3, be the structure that process control device 40 has procedure storage part 45, but process control part 40 also can not have procedure storage part 45.Under this situation, become the structure that the procedure 43 that is generated by CAD transformation component 42 is directly imported procedure storage part 14.
Like this, according to embodiment 3, because can use existing procedure 43, carry out the Laser Processing identical with embodiment 1,2, so needn't be that the processing of each machined object 37 is handled generates new procedure, can be simply and process the machining shape of machined object 37 accurately.
Industrial applicibility
As mentioned above, the laser processing device that the present invention relates to, program creating device and laser processing are applicable to and utilize pulse laser machined object to be carried out the Laser Processing of perforation processing.
Claims (12)
1. laser processing device, it is repeatedly to repeat the cooked mode of following circulation, machined object is carried out a plurality of perforation processing, this circulation is, the irradiation position of laser is changed, on one side to the each irradiation 1 of a plurality of Working positions of aforementioned machined object to laser several times, it is characterized in that having:
Laser oscillating part, it motivates laser;
The irradiation position moving part, it makes the laser that is motivated by the aforementioned laser oscillating portion move to the irradiation position of aforementioned machined object; And
Control part, the excitation timing of the laser that its control aforementioned laser oscillating portion motivates and the irradiation position of the laser that aforementioned irradiation position moving part moves it,
Aforementioned control part is controlled aforementioned irradiation position moving part, so that in first circulation when the 1st hole irradiation aforementioned laser, aforementioned irradiation position moving part makes its irradiation position mobile route that moves to the perforation processing position in aforementioned the 1st hole, with the 2nd and after circulation in when aforementioned laser is shone in the 1st hole, aforementioned irradiation position moving part makes its irradiation position mobile route that moves to the perforation processing position in the 1st hole, is same path.
2. laser processing device as claimed in claim 1 is characterized in that,
Aforementioned control part is controlled aforementioned irradiation position moving part, so that first the circulation in before perforation processing is carried out in the 1st hole, the irradiation position of aforementioned laser moves to last perforation processing position of a circulation, simultaneously, make the irradiation position of aforementioned laser move to the perforation processing position in aforementioned the 1st hole from aforementioned last perforation processing position
And, control aforementioned irradiation position moving part, so that after the laser irradiation to aforementioned last perforation processing position of each circulation finished, the irradiation position of aforementioned laser moved to the perforation processing position in aforementioned the 1st hole.
3. laser processing device as claimed in claim 2 is characterized in that,
Aforementioned control part is set last perforation processing position like this,, makes distance between the perforation processing position in last perforation processing position and the 1st hole that is, is the shortest in all perforation processing location gap.
4. laser processing device as claimed in claim 1 is characterized in that,
Aforementioned control part is controlled aforementioned irradiation position moving part, so that in first circulation, before perforation processing is carried out in the 1st hole, the irradiation position of aforementioned laser moves to the default coordinate position of regulation, simultaneously, make the irradiation position of aforementioned laser move to the perforation processing position in aforementioned the 1st hole from aforementioned default coordinate position
And, control aforementioned irradiation position moving part, so that after the laser irradiation to last perforation processing position of each circulation finished, the irradiation position of aforementioned laser moved to the perforation processing position in aforementioned the 1st hole via aforementioned default coordinate position.
5. laser processing device as claimed in claim 4 is characterized in that,
Aforementioned control part is set in origin position with aforementioned default coordinate position.
6. laser processing device as claimed in claim 1 is characterized in that,
Aforementioned irradiation position moving part comprises automatically controlled scanner and constitutes.
7. laser processing device, it is repeatedly to repeat the cooked mode of following circulation, machined object is carried out a plurality of perforation processing, this circulation is, the irradiation position of laser is changed, on one side to the each irradiation 1 of a plurality of Working positions of aforementioned machined object to laser several times, it is characterized in that having:
Laser oscillating part, it motivates laser;
The irradiation position moving part, it makes the laser that is motivated by the aforementioned laser oscillating portion move to the irradiation position of aforementioned machined object; And
Control part, the excitation timing of the laser that its control aforementioned laser oscillating portion motivates and the irradiation position of the laser that aforementioned irradiation position moving part moves it,
Aforementioned control part is controlled aforementioned irradiation position moving part, so that first the circulation in before perforation processing is carried out in the 1st hole, the irradiation position of aforementioned laser moves between last perforation processing position in the circulation and aforementioned the 1st hole promptly path position midway, simultaneously, make the irradiation position of aforementioned laser move to the perforation processing position in aforementioned the 1st hole from aforementioned path position midway
And, control aforementioned irradiation position moving part, so that after the laser irradiation to aforementioned last perforation processing position of each circulation finished, the irradiation position of aforementioned laser moved to the perforation processing position in aforementioned the 1st hole.
8. program creating device, it generates the control program of following laser processing device, this laser processing device is repeatedly to repeat the cooked mode of following circulation, machined object is carried out a plurality of perforation processing, this circulation is, Yi Bian the irradiation position of laser is changed, a plurality of Working positions of aforementioned machined object shone 1 to laser several times at every turn on one side, it is characterized in that
Has the program generating unit, it uses the Working position coordinate in each hole, generate the control program of the aforementioned irradiation position of control, so that in first circulation when the 1st hole irradiating laser, mobile route to the perforation processing position in aforementioned the 1st hole laser that move, that motivated to the irradiation position of aforementioned machined object, with the 2nd and after circulation in when aforementioned laser is shone in the 1st hole, the mobile route of the aforementioned irradiation position that moves to the perforation processing position in aforementioned the 1st hole is same path.
9. laser processing, it is repeatedly to repeat the cooked mode of following circulation, machined object is carried out a plurality of perforation processing, this circulation is, the irradiation position of laser is changed, on one side to the each irradiation 1 of a plurality of Working positions of aforementioned machined object to laser several times, it is characterized in that, comprise following two steps:
The 1st step, this step is in first circulation, the irradiation position of aforementioned laser is moved to the 1st hole, so that in first circulation when the 1st hole irradiation aforementioned laser, the mobile route of the irradiation position that moves to the perforation processing position in aforementioned the 1st hole, with the 2nd and after circulation in during to the 1st hole irradiating laser, the mobile route of the irradiation position that moves to the perforation processing position in aforementioned the 1st hole is same path; And
The 2nd step, it carries out the irradiation of aforementioned laser to the 1st hole in aforementioned first circulation.
10. laser processing as claimed in claim 9 is characterized in that,
Comprise following operation in aforementioned the 1st step, promptly, first the circulation in before perforation processing is carried out in the 1st hole, make the irradiation position of aforementioned laser move to last perforation processing position in 1 circulation, simultaneously, make the irradiation position of aforementioned laser, from aforementioned last perforation processing position, move perforation processing position to aforementioned the 1st hole
After aforementioned the 2nd step, also have the 3rd step, this step is after the laser irradiation to aforementioned last perforation processing position of each circulation finishes, and the irradiation position of aforementioned laser is moved to the perforation processing position in aforementioned the 1st hole.
11. laser processing as claimed in claim 9 is characterized in that,
Comprise following operation in aforementioned the 1st step, promptly, first the circulation in before perforation processing is carried out in the 1st hole, make the irradiation position of aforementioned laser move to the default coordinate position of regulation, simultaneously, the irradiation position of aforementioned laser is moved to the perforation processing position in aforementioned the 1st hole from aforementioned default coordinate position
After aforementioned the 2nd step, also has the 4th step, this step is that the irradiation position that makes aforementioned laser moves to the perforation processing position in aforementioned the 1st hole via aforementioned default coordinate position after the laser irradiation to last perforation processing position of each circulation finishes.
12. laser processing as claimed in claim 9 is characterized in that,
Comprise following operation in aforementioned the 1st step, promptly, first the circulation in before perforation processing is carried out in the 1st hole, make the irradiation position of aforementioned laser move between last perforation processing position in the circulation and aforementioned the 1st hole promptly path position midway, simultaneously, the irradiation position of aforementioned laser is moved to the perforation processing position in aforementioned the 1st hole from aforementioned path position midway
After aforementioned the 2nd step, also have the 5th step, this step is after the laser irradiation to aforementioned last perforation processing position of each circulation finishes, and the irradiation position of aforementioned laser is moved to the perforation processing position in aforementioned the 1st hole.
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| PCT/JP2006/300094 WO2007077630A1 (en) | 2006-01-06 | 2006-01-06 | Laser material processing system, program creating device and laser material processing method |
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| JP特开2004-164083A 2004.06.10 |
| JP特开平11-192571A 1999.07.21 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101142052A (en) | 2008-03-12 |
| JPWO2007077630A1 (en) | 2009-06-04 |
| JP4800939B2 (en) | 2011-10-26 |
| TW200726563A (en) | 2007-07-16 |
| TWI296219B (en) | 2008-05-01 |
| WO2007077630A1 (en) | 2007-07-12 |
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