JPWO2007077630A1 - Laser processing apparatus, program creation apparatus, and laser processing method - Google Patents

Abstract

A laser processing apparatus for performing a plurality of drilling operations on a workpiece in a processing mode in which a cycle of irradiating a plurality of shots of a laser beam one to a plurality of shots at a plurality of positions while changing the irradiation position of the laser light. 1, irradiation position moving units 35X and 35Y for moving the irradiation position of the laser beam oscillated by the laser beam oscillation unit 21 onto the workpiece 37, and the oscillation timing and irradiation position of the laser beam oscillated by the laser beam oscillation unit 21 And a control unit 10 for controlling the irradiation position of the laser beam moved by the moving units 35X and 35Y. When the control unit 10 irradiates the first hole with the laser beam in the first cycle, the irradiation position moving unit is the first one. The movement path of the irradiation position to be moved to the drilling position of one hole, and the irradiation position moving portion is the hole of the first hole when the first hole is irradiated with laser light after the second cycle. So that the movement path of the irradiation position is moved to the processing position is the same route, the irradiation position moving section 35X, it controls the 35Y.

Description

  The present invention relates to a laser processing apparatus, a program creation apparatus, and a laser processing method for performing laser processing of a workpiece with pulsed laser light.

  2. Description of the Related Art In recent years, it has been required to reduce the size of a printed wiring board that forms a wiring layer of an electronic device as the electronic device is densely mounted. In order to reduce the size of the printed wiring board, it is necessary to accurately form (drill) through holes (via holes) for connecting the boards with a conductive layer.

  In order to form such a through-hole with high accuracy, for example, a pulse oscillation type laser processing apparatus that uses a pulsed laser beam focused by a lens is used. In drilling a workpiece such as a printed circuit board by the laser processing apparatus, laser irradiation is performed a plurality of times on the same processing position in order to shorten the processing time. However, when laser irradiation is continuously performed on the same processing position, the laser irradiation is continued after the workpiece is melted by the previous laser irradiation, and depending on the material used, the workpiece is processed. The fluidity of the product has increased, and it has not been possible to obtain a workpiece having a precisely machined shape. For this reason, when laser irradiation is performed a plurality of times on the same processing position, the next laser irradiation must be performed after the melted portion is solidified by the previous laser irradiation.

  The laser processing method described in Patent Document 1 performs laser irradiation on each hole while sequentially scanning a plurality of drilling positions set on a workpiece. That is, after the first laser irradiation is performed on the first drilling position, the first laser irradiation is performed on the second and subsequent drilling positions, and the second drilling position is returned to the first drilling position again. Then, the second laser irradiation is repeated for the second and subsequent drilling positions.

JP 11-192571 A

  However, in the above-described prior art, the laser irradiation position moves on each drilling position and laser irradiation is performed a plurality of times at each drilling position. For this reason, there existed a problem that the process shape of a to-be-processed object could not be processed accurately.

  The present invention has been made in view of the above, and an object thereof is to obtain a laser processing apparatus, a program creation apparatus, and a laser processing method capable of processing a processed shape of a workpiece with high accuracy.

  In order to solve the above-described problems and achieve the object, the present invention provides a plurality of cycles in which one to a plurality of shots of laser light are irradiated to a plurality of processing positions of a workpiece while changing the irradiation position of the laser light. In a laser processing apparatus that performs a plurality of drilling processes on the workpiece in a processing mode that is repeated a plurality of times, a laser beam oscillation unit that oscillates laser light, and irradiation of the laser beam oscillated by the laser beam oscillation unit to the workpiece An irradiation position moving unit that moves the position; and a control unit that controls an oscillation timing of the laser beam oscillated by the laser beam oscillation unit and an irradiation position of the laser beam moved by the irradiation position moving unit, and the control unit The irradiation position moving path that the irradiation position moving unit moves to the drilling position of the first hole when the first hole is irradiated with the laser beam in the first cycle, and No. 2 The irradiation position movement is performed so that the movement path of the irradiation position moved by the irradiation position moving unit to the drilling position of the first hole when the laser light is irradiated to the first hole after the cycle of It is characterized by controlling the part.

  In the laser processing apparatus according to the present invention, the positional deviation amount of the laser light irradiation position of the first hole in the first cycle and the positional deviation amount of the laser light irradiation position of the first hole after the second cycle. Since the deviation amount difference can be reduced, there is an effect that the processed shape of the workpiece can be processed with high accuracy.

FIG. 1 is a perspective view showing an internal configuration of a laser processing apparatus according to the present invention. FIG. 2 is a functional block diagram showing the configuration of the laser processing apparatus according to the present invention. FIG. 3 is a flowchart showing an operation procedure of the laser processing apparatus according to the first embodiment. FIG. 4 is a diagram for explaining the order of the laser irradiation positions according to the first embodiment. FIG. 5 is a diagram for explaining the relationship between the galvano position command and the laser output. FIG. 6 is a diagram for explaining the relationship between the galvano position command and the machining position error. FIG. 7 is a functional block diagram showing another configuration example of the laser processing apparatus. FIG. 8 is a diagram illustrating an example of a machining program. FIG. 9 is a flowchart showing an operation procedure of the laser processing apparatus according to the second embodiment. FIG. 10 is a diagram for explaining the order of laser irradiation positions according to the second embodiment. FIG. 11 is a functional block diagram showing the configuration of the laser processing apparatus according to the third embodiment. FIG. 12 is a diagram for explaining a galvano area for a workpiece. FIG. 13 is a diagram showing an example of a conventional machining program used by the laser machining apparatus of the third embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Laser processing apparatus 10 Processing control apparatus 11 Main control part 12 Laser control part 13 XY table control part 14 Processing program memory | storage part 15 Galvano scanner control part 20 Processing drive device 21 Laser oscillator 22 Image transfer optical mechanism 23 Collimation lens 24 Mask DESCRIPTION OF SYMBOLS 30 Laser processing part 34 f- (theta) lens 35X, 35Y Galvanometer mirror 36X, 36Y Galvano scanner 37 Work piece 38 XY table 39 Observation optical mechanism 40 Processing procedure control apparatus 41 User program input part 42, 62 CAD conversion part 43 Processing Program 44 Procedure control unit 45,65 Machining program storage unit 51 Galvano area 60 Program creation device H1-Hn Machining hole

  Hereinafter, embodiments of a laser processing apparatus, a program creation apparatus, and a laser processing method according to the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a perspective view showing an internal configuration of a laser processing apparatus according to the present invention. The laser processing apparatus 1 is configured to be able to drill a minute hole in a workpiece 37 by irradiation (cycle pulse mode) of laser light (pulse laser light). A laser oscillator 21 that oscillates laser light, laser light And an image transfer optical mechanism 22 that adjusts to a desired beam shape and beam energy, a laser processing unit 30 that performs laser processing of a workpiece, and a processing control device 10. In this cycle pulse mode, a plurality of drilling positions set on the workpiece are sequentially scanned, and a laser beam is irradiated to each hole in a plurality of cycles (a cycle in which a laser beam is irradiated one shot at a time). Processing that is repeated multiple times).

  The laser oscillator 21 oscillates a laser beam and sends it to the image transfer optical mechanism 22. The image transfer optical mechanism 22 includes a collimation lens 23 and a mask 24. The collimation lens 23 condenses the laser light from the laser oscillator 21 and adjusts (parallelizes) the optical axis, and the mask 24 shapes the beam shape of the laser light.

  The laser processing unit 30 includes galvanometer mirrors 35X and 35Y, galvanometer scanners 36X and 36Y, an f-θ lens 34, a workpiece (workpiece) 37, an XY table 38, and an observation optical mechanism (vision sensor) 39. .

  The galvano scanners 36X and 36Y have a function of moving the irradiation position of the workpiece 37 by changing the trajectory of the laser beam, and galvanometer mirrors 35X and 35Y are used to scan the laser beam in the XY direction. Is rotated to a predetermined angle. The galvanometer mirrors 35X and 35Y reflect the laser light (light beam) emitted from the mask 24 of the image transfer optical mechanism 22 and deflect it at an arbitrary angle. The galvanometer mirror 35X deflects the laser beam in the X direction, and the galvanometer mirror 35Y deflects the laser beam in the Y direction. The f-θ lens 34 deflects the laser light in a direction perpendicular to the surface of the workpiece 37 and condenses (irradiates) the laser light on the processing position (surface) of the workpiece 37.

  The workpiece 37 is a printed circuit board or the like, and a plurality of drilling processes are performed. The XY table 38 is for placing the workpiece 37, and freely moves in a two-dimensional plane of the X and Y axes by driving an X axis motor and a Y axis motor (not shown).

  The observation optical mechanism 39 detects the height of the workpiece 37 in the Z-axis direction. The height (information) of the workpiece 37 detected by the observation optical mechanism 39 in the Z-axis direction is sent to the machining control device 10, and the machining control device 10 determines the height direction of the workpiece 37 based on this information. To control.

The processing control device 10 is configured by a computer device such as a personal computer, and includes a laser oscillator 21, an image transfer optical mechanism 22, and a laser processing unit 30 that are NC (Numerical).
Control)

  With this configuration, the laser processing apparatus 1 shapes the laser light emitted from the laser oscillator 21 by the image transfer optical mechanism 22 and adjusts it to a desired beam shape and beam energy, and deflects it to an arbitrary angle by the galvanometer mirrors 35X and 35Y. Then, an image is formed and irradiated on a predetermined position of the workpiece 37 through the f-θ lens 34. Thereby, a hole (concave portion) having an opening diameter corresponding to the beam diameter of the laser beam is processed at a predetermined irradiation position of the workpiece 37. In the first embodiment, laser irradiation is performed a plurality of times on the processing position of one hole.

  FIG. 2 is a functional block diagram showing the configuration of the laser processing apparatus according to the present invention. The laser processing apparatus 1 includes a processing control device 10 and a processing drive device 20. The processing drive device 20 is means for performing laser processing, and corresponds to the laser oscillator 21, the image transfer optical mechanism 22, and the laser processing unit 30 shown in FIG.

  The processing control device 10 is a device that controls the processing drive device 20, and includes a main control unit 11, a laser control unit 12, an XY table control unit 13, a processing program storage unit 14, and a galvano scanner control unit 15. .

  The laser control unit 12 performs control related to laser light (laser light oscillation, optical axis adjustment, etc.). The laser control unit 12 controls the laser oscillator 21 to control the oscillation (timing, power, etc.) of the laser beam, and controls the collimation lens 23 and the mask 24 to control the optical axis adjustment and the beam shape of the laser beam. . Further, the laser control unit 12 controls the position of the f-θ lens 34 to deflect the laser light in a direction perpendicular to the surface of the workpiece 37.

  The XY table control unit 13 controls the XY table 38 to move the workpiece 37 on the XY table 38 in the XY direction. The galvano scanner control unit 15 controls the galvano scanners 36X and 36Y to rotate the galvano mirrors 35X and 35Y to a predetermined angle to scan the laser light in the XY direction.

  In the first embodiment, the workpiece 37 on the XY table 38 is moved in the XY direction by the XY table control unit 13, and the laser light is moved in the XY direction by the galvano scanner control unit 15. Laser scanning is performed on a predetermined processing position of the workpiece 37 by scanning. The XY table control unit 13 and the galvano scanner control unit 15 control the position of the XY table 38 and scan the laser beam in the XY direction based on a processing program, an NC program, and the like, which will be described later.

  The machining program storage unit 14 stores various programs for performing laser machining on the workpiece 37. The machining program storage unit 14 stores, for example, a machining program related to a machining procedure of the workpiece 37, an NC program, and the like. The processing program includes information on the order of galvano areas to be processed, information on the order of processing positions (holes) of the workpiece 37, information on timing of laser light irradiation, information on the number of times of laser light irradiation, and the like. The main control unit 11 controls the laser control unit 12, the XY table control unit 13, the machining program storage unit 14, and the galvano scanner control unit 15.

  Next, an operation procedure of the laser processing apparatus according to the first embodiment will be described. FIG. 3 is a flowchart showing the operation procedure of the laser processing apparatus according to the first embodiment, and FIG. 4 is a diagram for explaining the order of the laser irradiation positions according to the first embodiment.

  Here, as an example of laser processing, for example, when the laser processing apparatus 1 performs laser processing in the cycle pulse mode from the first processing hole H1 to the nth (n is a natural number of 2 or more) processing hole Hn. explain. Here, as an example of laser processing of the laser processing apparatus 1, a case where there are four or more processing holes (n is four or more) will be described.

  When the laser processing of the workpiece 37 by the laser processing apparatus 1 is started, the XY table control unit 13 reads the XY table 38 based on the processing program and the NC program in the processing program storage unit 14. Control the position. As a result, the workpiece 37 on the XY table 38 moves in the XY direction so that the laser beam is irradiated onto a predetermined galvano area (area where the machining position is controlled by the galvano scanners 36X and 36Y) 51. To do.

  As an initial setting, the galvano scanner control unit 15 controls the galvano scanners 36X and 36Y so that the irradiation position of the laser light becomes the default coordinates of the galvano area 51 (for example, the origin (the center point of the galvano area)).

  First, the galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y so that the nth machining position (machining hole Hn) becomes the irradiation position of the laser beam based on the machining program. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the n-th processing position (processing hole Hn) becomes the irradiation position of the laser beam (step S110). At this time, the laser control unit 12 does not oscillate the laser beam from the laser oscillator 21.

  Next, the galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y so that the first machining position (machining hole H1) becomes the irradiation position of the laser beam based on the machining program. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the first processing position (processing hole H1) becomes the irradiation position of the laser beam (step S120) (1).

  Then, the laser control unit 12 oscillates laser light from the laser oscillator 21. Thus, the laser light is shaped by the image transfer optical mechanism 22 and adjusted to a desired beam shape and beam energy. Further, the laser light emitted from the mask 24 is reflected and deflected by the galvanometer mirrors 35X and 35Y, and is imaged and irradiated onto the processing hole H1 of the workpiece 37 through the f-θ lens 34. As a result, the first shot of processing is performed on the processing hole H1 (first hole) (step S130).

  Next, the galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y so that the second machining position (machining hole H2) becomes the irradiation position of the laser beam based on the machining program. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the second processing position (processing hole H2) becomes the irradiation position of the laser beam (step S140) (2). Then, the laser control unit 12 oscillates laser light from the laser oscillator 21. As a result, the first shot is processed in the processing hole H2 (second hole) (step S150).

  Thereafter, although not shown in FIG. 3, the galvano scanner control unit 15 causes the third and subsequent (up to (n−2)) th machining positions to be the laser light irradiation positions based on the machining program. In addition, a galvano position command is given to the galvano scanners 36X and 36Y, and the first shot is processed in the third and subsequent (up to (n-2)) th processing holes.

  Next, the galvano scanner control unit 15 makes the galvano scanners 36X and 36Y based on the machining program so that the (n-1) -th machining position (machining hole H (n-1)) becomes the irradiation position of the laser beam. The galvano position command is issued. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the (n-1) -th processing position (processing hole H2) is the irradiation position of the laser beam (step S160) (n).

  Then, the laser control unit 12 oscillates laser light from the laser oscillator 21. As a result, the first shot is processed in the processed hole H (n−1) ((n−1) th hole) (step S170).

  Next, the galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y so that the nth machining position (machining hole Hn) becomes the irradiation position of the laser beam based on the machining program. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the n-th processing position (processing hole H2) becomes the irradiation position of the laser beam (step S180) (n + 1). Then, the laser control unit 12 oscillates laser light from the laser oscillator 21. As a result, the first shot of processing is performed on the processing hole Hn (nth hole) (step S190).

  The main control unit 11 determines whether or not the laser processing in the galvano area 51 has been completed (step S200). Since the first embodiment is laser processing in the cycle pulse mode, the main control unit 11 determines that the laser processing in the galvano area 51 has not ended (No in step S200). Then, the galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y so that the first processing position (processing hole H1) becomes the irradiation position of the laser beam based on the processing program. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the first processing position (processing hole H1) becomes the irradiation position of the laser beam (step S120). Then, the laser control unit 12 oscillates laser light from the laser oscillator 21. As a result, the second shot of processing is performed on the processing hole H1 (first hole) (step S130).

  Thereafter, the galvano scanner control unit 15 causes the galvano scanners 36X and 36Y to position the galvano position so that the second to n-th machining positions (machining holes H2 to Hn) become the irradiation positions of the laser light based on the machining program. While giving a command, the laser controller 12 oscillates laser light from the laser oscillator 21 at each processing position. Accordingly, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the second to n-th processing positions (processing holes H1 to Hn) are the irradiation positions of the laser light, and the processing holes H1 to Hn. Processing of the second shot is performed on (the first hole to the nth hole) (steps S140 to S190).

  Then, the main control unit 11 determines whether or not the laser processing in the galvano area 51 has been completed (step S200). The processes in steps S120 to S200 are repeated until the main control unit 11 determines that the laser processing in the galvano area 51 has been completed.

  When the main control unit 11 determines that the laser processing in the galvano area 51 has been completed (step S200, Yes), the galvano scanner control unit 15 and the laser control unit 12 perform the laser processing in the galvano area 51. Then, the position of the XY table 38 is controlled so that the next galvano area 51 can be processed. Then, the next galvano area 51 is processed.

  Here, the relationship between the galvano position command and the laser output of the laser beam will be described. FIG. 5 is a diagram for explaining the relationship between the galvano position command and the laser output. As shown in FIG. 5, in the first embodiment, first, the galvano scanner control unit 15 issues a galvano position command to the position of the n-th hole with respect to the galvano scanners 36X and 36Y. At this time, laser output (oscillation) by the laser oscillator 21 is not performed. Next, the galvano scanner control unit 15 issues a galvano position command to the position of the first hole for the galvano scanners 36X and 36Y. At this time, the laser oscillator 21 performs laser output at the position of the first hole. Thereafter, a galvano position command is issued from the galvano scanner controller 15 to the galvano scanners 36X and 36Y from the second hole to the nth hole, and laser output from the laser oscillator 21 is performed at each hole (position).

  Thereby, the first shot processing from the first hole to the nth hole is completed, and the second shot processing from the first hole to the nth hole is performed. That is, the galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y from the first hole to the n-th hole, and laser output (second shot) is performed by the laser oscillator 21 in each hole.

  Next, the relationship between the galvano position command and the machining position error will be described. FIG. 6 is a diagram for explaining the relationship between the galvano position command and the machining position error. When the galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y so that the predetermined processing position becomes the irradiation position of the laser beam, the galvano scanner 36X so that the processing position becomes the irradiation position of the laser beam. , 36Y control the galvanometer mirrors 35X, 35Y.

  However, the irradiation position of the laser beam causes a predetermined positioning error (deviation amount) according to the movement path (distance, direction) from the previous irradiation position. That is, a shift (overshoot or undershoot) occurs between the galvano position command and the actual galvano position (irradiation position).

  For example, in a conventional processing procedure, the galvano position when processing the first shot of the first hole moves from the default coordinates such as the origin to the processing position of the first hole. However, the galvano position when processing the second shot of the first hole moves from the processing position of the nth hole to the processing position of the first hole. For this reason, in the first hole, the actual positional deviation of the galvano position differs between the first shot and the second shot. Thus, in the conventional machining procedure, the first hole has an elliptical shape or a dharma shape when viewed from the machining surface of the workpiece 37, and the machining shape of the workpiece cannot be machined with high accuracy.

  On the other hand, in the first embodiment, when the first shot of the first hole is processed, the galvano position command is issued to the position of the nth hole to move the galvano position, and then the first hole is moved from the position of the nth hole. A galvano position command is issued to the hole machining position to move the galvano position. As a result, the positional deviation amount of the actual galvano position in the first shot of the first hole and the actual positional deviation amount of the second and subsequent shots of the first hole are substantially the same.

  In the first embodiment, the machining program storage unit 14 of the machining control device 10 stores the machining program in advance and performs laser machining based on the machining program. However, the machining program is stored in the machining control device 10. It is good also as a structure which receives and uses from the external apparatus of this. Hereinafter, a case where laser processing is performed by acquiring a processing program from an external device will be described with reference to FIGS. 7 and 8.

  In this case, for example, a machining program is created by the laser machining apparatus 1, and the laser machining apparatus 1 performs laser machining based on this machining program. That is, a machining program stored in the machining program storage unit 14 of the machining control device 10 shown in FIG. 2 is created by an external device, and laser machining is performed using the created machining program.

  FIG. 7 is a functional block diagram showing another configuration example of the laser processing apparatus according to the first embodiment. Among the constituent elements in FIG. 7, the constituent elements that achieve the same function as the laser processing apparatus 1 shown in FIG. Are given the same numbers, and redundant explanations are omitted.

  In addition to the machining control device 10 and the machining drive device 20, the laser machining device 1 here includes a program creation device 60 that creates a machining program to be stored in the machining program storage unit 14.

  The program creation device 60 is configured by a device such as a personal computer, and includes a user program input unit 41 and a CAD (Computer Aided Design) conversion unit 62. The user program input unit 41 inputs a user program (gerber format coordinate program) indicating a drilling position (coordinates) on the workpiece 37.

  The CAD conversion unit 62 converts the user program from the user program input unit 41 into a machining program having an appropriate format suitable for the laser machining apparatus 1. The CAD conversion unit 62 is configured to allow the user to specify the galvano area range, conversion format, etc. (main movement in the X direction, main movement in the Y direction, and the movement path with the shortest distance) according to the processing purpose.

  Further, the CAD conversion unit 62 adds a parameter for commanding on / off of the laser beam (laser beam) to the machining program converted from the user program. For example, the CAD conversion unit 62 adds “1” to the machining program as a parameter for instructing laser light on, and adds “0” to the machining program as a parameter for instructing laser light off. Specifically, the CAD conversion unit 62 first issues a galvano position command to “X300 Y300”, which is the machining position of the n-th hole, for example, for the galvano area N1, and a command not to irradiate a laser beam (“0 ]) Is added to the machining program. The machining program storage unit 14 stores the machining program created by the CAD conversion unit 62.

  The machining program is created in a format in which only the positioning position can be specified by information indicating beam-off, for example, and is converted into a format that can be read by the laser machining apparatus 1.

  Next, an example of a machining program will be described. FIG. 8 is a diagram illustrating an example of a machining program. In the machining program, in the galvano area N1 (machining area 1), the machining point of the nth hole is, for example, “X300 Y300”, and the galvano position is moved from the default coordinates such as the origin to the machining position of the nth hole. It is shown that. In addition, when the galvano position is moved to the first n-th hole, the first shot laser processing is not performed. Thereafter, the processing of the first hole, the processing point of the second hole, and the galvano position are sequentially moved to the processing position, and laser processing of each hole in the galvano area N1 is performed.

  The machining program here indicates that the machine then moves to the galvano area N2. Further, in the machining program, in the galvano area N2 (machining area 2), the machining point of the Mth hole (M is a natural number) is “X300 Y300”, for example, and the machining of the Mth hole from the default coordinates such as the origin It shows that the galvano position is moved to the position. Further, it is shown that the laser processing for the first shot is not performed when the galvano position is moved to the first Mth hole. Thereafter, the processing point of the first hole, the processing point of the second hole, and the galvano position are sequentially moved to the processing position, and laser processing of each hole in the galvano area N2 is performed. Here, the processing control device 10 controls the laser processing of the laser processing device 1 based on the processing program.

  Here, the laser processing apparatus 1 is configured to include the program creation device 60. However, the laser processing device 1 and the program creation device 60 are configured to be different from each other, and laser processing is performed using a processing program created by the program creation device 60. The apparatus 1 may perform laser processing. In this case, the program creation device 60 and the laser machining device 1 may be connected to transmit a machining program from the program creation device 60 to the laser machining device 1, or the machining program created by the program creation device 60 may be portable. It is good also as a structure input into the laser processing apparatus 1 via an external storage medium.

  In the first embodiment, the case where the laser processing apparatus 1 performs laser processing of the workpiece 37 in the cycle pulse mode has been described. However, the laser processing apparatus 1 changes the irradiation position of the laser light while changing the irradiation position of the laser beam. The laser beam machining of the workpiece 37 may be performed by a machining process in which a cycle of irradiating a plurality of shots with one to a plurality of shots is repeated multiple times.

  In Embodiment 1, when the first shot of the first hole is processed, the galvano position is moved to the position of the nth hole, and then the position of the first hole is changed from the position of the nth hole. Although the galvano position is moved, when the first shot of the first hole is processed, the galvano position is moved to the position of the m-th hole (m is a natural number smaller than (n-1)). The galvano position may be moved from the m-th hole to the n-th hole, and then the galvano position may be moved to the processing position of the first hole.

  In the first embodiment, when the first shot of the first hole is processed, after the galvano position is moved to the position of the nth hole, the position of the first hole is changed to the processing position of the first hole. Although the galvano position is moved, when the first shot of the first hole is machined, the galvano position is moved from the nth hole to the midway position of the machining path of the first hole, and then from this midway position. The first shot of the first hole may be processed by moving the galvano position to the processing position of the first hole.

  Further, in order to reduce the movement distance of the galvano position from the nth hole to the first hole when processing the first shot of the first hole, the nth hole is a hole close to the first hole (for example, You may set to the hole which the distance between holes becomes the shortest. If the galvano movement distance when moving from the n-th hole to the first hole is short, the amount of displacement of the galvano position is reduced, so that the galvano when moving from the n-th hole to the first hole is reduced. It is possible to reduce the amount of positional deviation. In addition, it is possible to shorten the movement time when moving the galvano position from the nth hole to the first hole.

  Further, in order to reduce the movement distance of the galvano position from the origin to the n-th hole when processing the first shot of the first hole, the n-th hole is close to the origin (for example, the distance between the holes is the shortest). It may be set to a hole. This makes it possible to shorten the movement time when moving the galvano position from the origin to the nth hole.

  Furthermore, the total distance of the movement distance of the galvano position from the origin to the nth hole and the movement distance of the galvano position from the nth hole to the first hole when processing the first shot of the first hole is reduced. The n-th hole and the first hole may be set so as to be (for example, the shortest distance). Thereby, it is possible to shorten the total time of the movement time when moving the galvano position from the origin to the nth hole and the movement time when moving the galvano position from the nth hole to the first hole. Become.

  The laser processing apparatus 1 may be stage stop processing in which the XY table 38 is stopped for each scanning area, and only the galvano mirrors 35X and 35Y are rotated to scan the laser beam. Stage non-stop processing may be used in which the galvanometer mirrors 35X and 35Y are moved while the table 38 is moved to scan the laser beam.

  As described above, according to the first embodiment, the positional deviation amount of the first galvano position of the first hole in the first hole and the positional deviation amount of the actual galvano position after the second shot of the first hole are substantially omitted. Since the same amount of deviation can be obtained, the first hole can be machined into a substantially circular shape when viewed from the machining surface of the workpiece 37, and the machining shape of the workpiece 37 can be machined with high accuracy. Become.

  When the program creation device 60 processes the first shot of the first hole, the galvano position command is issued to the position of the nth hole to move the galvano position, and then the first hole is moved from the position of the nth hole. Since the machining program for moving the galvano position by issuing a galvano position command to the machining position is created, the laser machining apparatus 1 detects the positional deviation amount of the actual galvano position of the first shot of the first hole and 2 of the first hole. The positional deviation amount of the actual galvano position after the shot can be made substantially the same. As a result, the laser processing apparatus 1 is provided with a machining program capable of machining the first hole into a substantially circular shape when viewed from the machining surface of the workpiece 37 and accurately machining the machining shape of the workpiece 37. It becomes possible to do.

Embodiment 2. FIG.
Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, a galvano position command is sent to a predetermined default coordinate at the end of one cycle in the cycle pulse mode, and galvano position movement when machining the first hole is performed in all cycles (all shots including the first shot). ), The galvanometer mirrors 35X and 35Y are controlled so as to have the same path. Since the laser processing apparatus 1 of the second embodiment also has the same configuration as the laser processing apparatus 1 described in FIGS. 1 and 2 of the first embodiment, the description thereof is omitted here.

  An operation procedure of the laser processing apparatus according to the second embodiment will be described. FIG. 9 is a flowchart showing an operation procedure of the laser processing apparatus according to the second embodiment, and FIG. 10 is a diagram for explaining the order of the laser irradiation positions according to the second embodiment. Here, as an example of laser processing, for example, when the laser processing apparatus 1 performs laser processing in the cycle pulse mode from the first processing hole H1 to the nth (n is a natural number of 2 or more) processing hole Hn. explain. Here, as an example of laser processing of the laser processing apparatus 1, a case where there are four or more processing holes (n is four or more) will be described.

  When the laser processing of the workpiece 37 by the laser processing apparatus 1 is started, the XY table control unit 13 reads the XY table 38 based on the processing program and the NC program in the processing program storage unit 14. Control the position. As a result, the workpiece 37 on the XY table 38 moves in the XY direction so that the laser beam is irradiated onto a predetermined galvano area (area where the machining position is controlled by the galvano scanners 36X and 36Y) 51. To do.

  As an initial setting, the galvano scanner control unit 15 controls the galvano scanners 36X and 36Y so that the irradiation position of the laser light becomes the default coordinates (for example, the origin) of the galvano area 51 (step S310).

  Next, the galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y so that the first machining position (machining hole H1) becomes the irradiation position of the laser beam based on the machining program. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the first processing position (processing hole H1) becomes the irradiation position of the laser beam (step S320) (1).

  Then, the laser control unit 12 oscillates laser light from the laser oscillator 21. Thus, the laser light is shaped by the image transfer optical mechanism 22 and adjusted to a desired beam shape and beam energy. Further, the laser light emitted from the mask 24 is reflected and deflected by the galvanometer mirrors 35X and 35Y, and is imaged and irradiated onto the processing hole H1 of the workpiece 37 through the f-θ lens 34. As a result, the first shot is processed in the processing hole H1 (first hole) (step S330).

  Next, the galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y so that the second machining position (machining hole H2) becomes the irradiation position of the laser beam based on the machining program. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the second processing position (processing hole H2) becomes the irradiation position of the laser beam (step S340) (2). Then, the laser control unit 12 oscillates laser light from the laser oscillator 21. As a result, the first shot is processed in the processing hole H2 (second hole) (step S350).

  Thereafter, although not shown in FIG. 9, the galvano scanner control unit 15 causes the third and subsequent (up to (n−2)) th processing positions to be the laser light irradiation positions based on the processing program. In addition, a galvano position command is given to the galvano scanners 36X and 36Y, and the first shot is processed in the third and subsequent (up to (n-2)) th processing holes.

  Next, the galvano scanner control unit 15 makes the galvano scanners 36X and 36Y based on the machining program so that the (n-1) -th machining position (machining hole H (n-1)) becomes the irradiation position of the laser beam. The galvano position command is issued. Accordingly, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the (n-1) -th processing position (processing hole H (n-1)) is the irradiation position of the laser beam (step S360). ). Then, the laser control unit 12 oscillates laser light from the laser oscillator 21. As a result, the first shot of the processing hole H (n-1) ((n-1) th hole) is processed (step S370).

  Next, the galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y so that the nth machining position (machining hole Hn) becomes the irradiation position of the laser beam based on the machining program. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the nth processing position (processing hole Hn) becomes the irradiation position of the laser beam (step S380). Then, the laser control unit 12 oscillates laser light from the laser oscillator 21. As a result, the first shot processing is performed on the processing hole Hn (nth hole) (step S390).

  The main control unit 11 determines whether or not the laser processing in the galvano area 51 has been completed (step S400). Since the first embodiment is laser processing in the cycle pulse mode, the main control unit 11 determines that the laser processing in the galvano area 51 has not been completed (No in step S400).

  The galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y so that the default coordinate (origin) of the galvano area 51 becomes the irradiation position of the laser beam based on the machining program. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the origin is the irradiation position of the laser beam (step S310). At this time, the laser control unit 12 does not oscillate the laser beam from the laser oscillator 21.

  Next, the galvano scanner control unit 15 issues a galvano position command to the galvano scanners 36X and 36Y so that the first machining position (machining hole H1) becomes the irradiation position of the laser beam based on the machining program. Thereby, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the first processing position (processing hole H1) becomes the irradiation position of the laser beam (step S320). Then, the laser control unit 12 oscillates laser light from the laser oscillator 21. As a result, the second shot of processing is performed on the processing hole H1 (first hole) (step S330).

  Thereafter, the galvano scanner control unit 15 causes the galvano scanners 36X and 36Y to position the galvano position so that the second to n-th machining positions (machining holes H2 to Hn) become the irradiation positions of the laser light based on the machining program. While giving a command, the laser controller 12 oscillates laser light from the laser oscillator 21 at each processing position. Accordingly, the galvano scanners 36X and 36Y control the galvanometer mirrors 35X and 35Y so that the second to n-th processing positions (processing holes H1 to Hn) are the irradiation positions of the laser light, and the processing holes H1 to Hn. Processing of the second shot is performed on (the first hole to the nth hole) (steps S340 to S390).

  Then, the main control unit 11 determines whether or not the laser processing in the galvano area 51 is finished (step S400). Until the main control unit 11 determines that the laser processing in the galvano area 51 has been completed, the processes in steps S320 to S400 are repeated. That is, in the second embodiment, when the machining hole H1 is machined after machining the machining hole Hn, the galvano position command to the machining hole H1 is performed after the galvano position command to the origin, which is the process of step S310. The processing hole H1 is processed.

  When the main control unit 11 determines that the laser processing in the galvano area 51 has been completed (step S400, Yes), the galvano scanner control unit 15 and the laser control unit 12 perform the laser processing in the galvano area 51. Then, the position of the XY table 38 is controlled so that the next galvano area 51 can be processed. Then, the next galvano area 51 is processed.

  In the second embodiment, in order to reduce the movement distance of the galvano position from the origin to the first hole, the first hole is set to a hole close to the origin (for example, the hole having the shortest distance between holes). Also good. In order to reduce the movement distance of the galvano position from the nth hole to the origin, the nth hole may be set to a hole close to the origin (for example, a hole having the shortest distance between holes). Further, the total distance of the movement distance of the galvano position from the origin to the first hole and the movement distance of the galvano position from the nth hole to the origin when processing the first shot of the first hole is reduced (for example, the shortest). The n-th hole and the first hole may be set so as to be (distance). This makes it possible to shorten the movement time when moving the galvano position from the nth hole to the origin, the movement time when moving the galvano position from the origin to the first hole, and the total time of these movement times. It becomes.

  Further, in the second embodiment, similarly to the first embodiment, the machining program storage unit 14 of the machining control apparatus 10 stores the machining program in advance, and the machining program is not limited to the configuration in which laser machining is performed based on the machining program. It is good also as a structure which receives and uses from the external device of the process control apparatus 10. FIG.

  Thus, in the second embodiment, when the first hole is machined, the galvano position command is issued to the origin to move the galvano position, and then the galvano position command is given from the origin to the machining position of the first hole. Move the galvo position. As a result, the positional deviation amount of the actual galvano position in the first shot of the first hole and the actual positional deviation amount of the second and subsequent shots of the first hole are substantially the same.

  Thus, according to the second embodiment, the positional deviation amount of the actual galvano position in the first shot of the first hole and the positional deviation amount of the actual galvano position in the second and subsequent shots of the first hole are substantially omitted. Since the same amount of deviation can be obtained, the first hole can be machined into a substantially circular shape when viewed from the machining surface of the workpiece 37, and the machining shape of the workpiece 37 can be machined with high accuracy. Become.

Embodiment 3 FIG.
Next, a third embodiment of the present invention will be described with reference to FIGS. In the third embodiment, a conventionally used machining program (a machining procedure for moving the galvano position when machining the first shot of the first hole directly from the default coordinates such as the origin to the machining position of the first hole. ) And laser processing using a predetermined control device (processing procedure control device to be described later) in the same processing procedure (galvano position moving procedure and laser light irradiation timing) as in the first and second embodiments. The laser processing apparatus 1 is controlled to perform the above.

  That is, in the third embodiment, for example, when processing the first shot of the first hole in each galvano area, the galvano position command is issued to the position of the nth hole to move the galvano position, and then the nth A galvano position command is issued from the position of the hole to the machining position of the first hole to move the galvano position. In the subsequent processing procedure, laser processing is performed using a processing program conventionally used (processing procedure corresponding to the first embodiment).

  FIG. 11 is a functional block diagram showing the configuration of the laser processing apparatus according to the third embodiment. Among the constituent elements in FIG. 11, constituent elements that achieve the same functions as those of the laser processing apparatus 1 of Embodiments 1 and 2 shown in FIG.

The laser processing apparatus 1 includes a processing procedure control device 40 in addition to the processing control device 10 and the processing drive device 20. The processing procedure control device 40 is configured by a device such as a personal computer, and includes a user program input unit 41, a CAD (Computer
Aided Design) conversion unit 42, machining program storage unit 45 for storing machining program 43, and procedure control unit 44. The user program input unit 41 inputs a user program (gerber format coordinate program) indicating a drilling position (coordinates) on the workpiece 37.

  The CAD conversion unit 42 has a function of converting the user program from the user program input unit 41 into a machining program 43 having an appropriate format suitable for the laser machining apparatus 1. The CAD conversion unit 42 is configured to allow the user to specify the galvano area range, conversion format (main movement in the X direction, main movement in the Y direction, and the shortest distance travel route) according to the processing purpose.

  The machining program 43 is a program in which the user program is converted by the CAD conversion unit 42, and has been converted into a format that can be read by the laser machining apparatus 1. The machining program 43 here is a conventional machining program (when the first shot of the first hole is machined, the first hole is moved directly from the default coordinates such as the origin to the first hole machining position. This corresponds to a program including a processing procedure for starting processing of the first shot. The machining program 43 is stored in the machining program storage unit 14.

  When processing the first shot of the first hole in each galvano area with respect to the conventional machining program 43 stored in the machining program storage unit 14, the procedure control unit 44 is positioned at the position of the n-th hole. The instruction information is output to the processing control apparatus 10 (main control unit 11) so as to give an instruction, and the instruction information is output to the processing control apparatus 10 so that the laser beam is not irradiated at the position of the nth hole. Further, the procedure control unit 44 issues instruction information to the machining control device 10 to issue a galvano position command to the position of the first hole, and moves the galvano position from the position of the nth hole to the machining position of the first hole. Thereafter, the processing by the conventional processing program (laser light is irradiated to the first shot of the first hole) is performed.

  Next, an operation procedure of the machining procedure control device 40 according to the third embodiment will be described. In order to start laser processing of the workpiece 37 by the laser processing apparatus 1, the user of the laser processing apparatus 1 can make a drilling position area (for example, 500 mm × 500 mm) (the size of the workpiece 37) on the coordinates of the workpiece 37. A user program for designating a drilling position is input to the user program input unit 41 of the machining procedure control device 40.

  FIG. 12 is a diagram for explaining a galvano area in a workpiece. The size of the workpiece 37, which is a drilling position area on the workpiece 37 coordinates, is, for example, a size of 500 mm × 500 mm.

  The drilling position area of the workpiece 37 is divided by the CAD conversion unit 42 into, for example, galvano areas having a size of 50 mm × 50 mm (galvano areas N1 to N3 and the like that are processing areas including information on hole coordinates). Further, the CAD conversion unit 42 calculates a machining position and an optimum machining path in each galvano area based on the user program and creates a machining program 43. The machining program 43 is stored in the machining program storage unit 45 (machining program storage unit 14). The galvano areas N1 to N3 and the like here correspond to the galvano area 51 shown in FIG. 4 of the first embodiment.

  Here, an example of the conventional machining program 43 will be described. FIG. 13 is a diagram showing an example of a conventional machining program used by the laser machining apparatus of the third embodiment. In the conventional machining program 43, in the galvano area N1 (machining area 1), the machining point (machining position) of the first hole is, for example, “X300 Y400”, and the first hole directly from the default coordinates such as the origin The galvano position is moved to the processing position, and laser processing for the first shot is performed. Thereafter, the processing point of the second hole, the processing point of the third hole, and the galvano position are sequentially moved to the processing position, and laser processing of each hole in the galvano area N1 is performed.

  Thereafter, the galvano position is moved from the default coordinates such as the origin to the galvano area N2, and the galvano position is moved directly to "X300 Y300" which is the processing position of the first hole, and the first shot laser processing is performed. Thereafter, the galvano position is moved to the machining position after the second hole, and laser machining of each hole in the galvano area N2 is performed.

  In the third embodiment, when processing the first shot of the first hole in each galvano area (for example, galvano area N1), the procedure control unit 44 instructs to process the first shot of the first hole from the processing program. Is recognized, instruction information is issued to the machining control apparatus 10 so as to give a galvano position command to the position of the nth hole, and instruction information is issued to the machining control apparatus 10 so as not to irradiate the laser beam at the position of the nth hole. . Thereafter, the procedure control unit 44 causes the machining control device 10 to perform machining processing (a galvano position command is issued at the position of the first hole and laser machining is started) by the machining program 43.

  As a result, the laser processing apparatus 1 first performs laser processing (first shot) at the first processing point, and then performs laser processing (first shot) at the second processing point. Hereinafter, the processing of the workpiece 37 is performed according to the processing procedure similar to the processing procedure described in the first embodiment.

  Further, for example, when the processing in the galvano area N1 is completed, the procedure control unit 44 causes the galvano area N2, which is the next galvano area, to perform the same processing as in the galvano area N1. Hereinafter, similarly, the procedure control unit 44 causes the machining control device 10 to perform machining processing after the galvano area N2. Also in the subsequent processing, when the procedure control unit 44 recognizes an instruction to machine the first shot of the first hole from the machining program, the procedure control unit 44 instructs the machining control apparatus 10 to issue a galvano position command to the position of the nth hole. In addition to issuing the instruction information, the instruction information is output to the processing control apparatus 10 so that the laser beam is not irradiated at the position of the nth hole. Then, the procedure control unit 44 causes the machining control device 10 to perform machining processing by the machining program 43 (giving a galvano position command to the position of the first hole and starting laser machining).

  In the third embodiment, when the procedure control unit 44 processes the first shot of the first hole in each galvano area, the processing control device 10 starts processing according to the processing procedure corresponding to the first embodiment. However, after the procedure control unit 44 has processed each shot of the nth hole in each galvano area (every cycle ends in the cycle pulse mode), the conventional processing program 43 is processed. ), The machining control device 10 may be controlled so as to continue the machining according to the machining procedure corresponding to the second embodiment, and the machining using the conventional machining program 43 may be performed.

  In the third embodiment, the case where the laser processing device 1 is configured to include the processing procedure control device 40 has been described. However, the laser processing device 1 and the processing procedure control device 40 are configured to be independent and different from each other. May be configured to operate.

  Furthermore, in the third embodiment, the case where the galvano scanner control unit 15 and the processing procedure control device 40 are configured differently has been described. However, the galvano scanner control unit 15 may have a function of the procedure control unit 44. In this case, the galvano scanner control unit 15 having the function of the procedure control unit 44 performs laser processing based on the conventional processing program 43 stored in the processing program storage unit 14.

  In the third embodiment, the machining procedure control device 40 includes the machining program storage unit 45. However, the machining procedure control device 40 may not include the machining program storage unit 45. In this case, the machining program 43 created by the CAD conversion unit 42 is directly input to the machining program storage unit 14.

  As described above, according to the third embodiment, since the same laser processing as in the first and second embodiments is performed using the conventional processing program 43, a new processing program is created for each processing of the workpiece 37. It becomes possible to process the processed shape of the workpiece 37 with high accuracy without difficulty.

  As described above, the laser processing apparatus, the program creation apparatus, and the laser processing method according to the present invention are suitable for laser processing for drilling a workpiece with pulsed laser light.

Claims (12)

Laser processing for performing a plurality of drilling operations on the workpiece in a processing mode in which a cycle of irradiating a plurality of shots of laser light to a plurality of processing positions of the workpiece is repeated a plurality of times while changing the irradiation position of the laser light. In the device
A laser beam oscillation unit for oscillating a laser beam;
An irradiation position moving unit that moves an irradiation position of the laser beam oscillated by the laser beam oscillation unit to the workpiece;
A control unit for controlling the oscillation timing of the laser beam oscillated by the laser beam oscillation unit and the irradiation position of the laser beam moved by the irradiation position moving unit;
With
The controller is
The irradiation position moving part moves the irradiation position moving unit to the drilling position of the first hole when the first hole is irradiated with the laser beam in the first cycle, and the first hole after the second cycle. The irradiation position moving unit is controlled so that a moving path of the irradiation position moved by the irradiation position moving unit to the drilling position of the first hole becomes the same path when the laser beam is irradiated to the laser beam. Laser processing equipment. The control unit moves the irradiation position of the laser beam to the last drilling position in one cycle before drilling the first hole in the first cycle, and moves the first hole from the last drilling position. And controlling the irradiation position moving unit to move the irradiation position of the laser beam to the drilling position of
The irradiation position moving unit is controlled to move the irradiation position of the laser beam with respect to the drilling position of the first hole after the end of the laser beam irradiation to the last drilling position of each cycle. The laser processing apparatus according to claim 1.   The said control part sets the last drilling position so that the distance of the last drilling position and the drilling position of the 1st hole may become the shortest among all the drilling positions. Item 3. The laser processing apparatus according to Item 2. The control unit moves the irradiation position of the laser beam to a predetermined default coordinate position before drilling the first hole in the first cycle, and moves from the default coordinate position to the drilling position of the first hole. While controlling the irradiation position moving unit to move the irradiation position of the laser light,
After the laser beam irradiation to the last drilling position in each cycle is completed, the irradiation position movement is performed so that the laser beam irradiation position is moved with respect to the drilling position of the first hole via the default coordinate position. The laser processing apparatus according to claim 1, wherein a part is controlled.   The laser processing apparatus according to claim 4, wherein the control unit sets the default coordinates to an origin position.   The laser processing apparatus according to claim 1, wherein the irradiation position moving unit includes a galvano scanner. Laser processing for performing a plurality of drilling operations on the workpiece in a processing mode in which a cycle of irradiating a plurality of shots of laser light to a plurality of processing positions of the workpiece is repeated a plurality of times while changing the irradiation position of the laser light In the device
A laser beam oscillation unit for oscillating a laser beam;
An irradiation position moving unit that moves an irradiation position of the laser beam oscillated by the laser beam oscillation unit to the workpiece;
A control unit for controlling the oscillation timing of the laser beam oscillated by the laser beam oscillation unit and the irradiation position of the laser beam moved by the irradiation position moving unit;
With
The controller moves the irradiation position of the laser beam to a midway path position between the last drilling position in one cycle and the first hole before drilling the first hole in the first cycle. And controlling the irradiation position moving unit to move the irradiation position of the laser beam from the midway path position to the drilling position of the first hole,
The irradiation position moving unit is controlled to move the irradiation position of the laser beam with respect to the drilling position of the first hole after the end of the laser beam irradiation to the last drilling position of each cycle. Laser processing equipment. Laser processing for performing a plurality of drilling operations on the workpiece in a processing mode in which a cycle of irradiating a plurality of shots of laser light to a plurality of processing positions of the workpiece is repeated a plurality of times while changing the irradiation position of the laser light. In a program creation device for creating a control program for a device,
Using the processing position coordinates of each hole, the irradiation position of the oscillated laser light that is moved to the drilling position of the first hole when the first hole is irradiated with the laser light in the first cycle is determined. The irradiation path is such that the movement path and the movement path of the irradiation position moved to the drilling position of the first hole when the laser light is irradiated to the first hole after the second cycle are the same path. A program creation device comprising a program creation unit for creating a control program for controlling a position. Laser processing for performing a plurality of drilling operations on the workpiece in a processing mode in which a cycle of irradiating a plurality of shots of laser light to a plurality of processing positions of the workpiece is repeated a plurality of times while changing the irradiation position of the laser light. In the method
When the first hole is irradiated with the laser light in the first cycle, the irradiation position is moved to the drilling position of the first hole, and the first hole is irradiated with the laser light after the second cycle. A first step of moving the irradiation position of the laser beam to the first hole in the first cycle so that the movement path of the irradiation position moved to the drilling position of the first hole is the same path when
A second step of irradiating the first hole with the laser light in the first cycle;
A laser processing method comprising: In the first step, the laser beam irradiation position is moved to the last drilling position in one cycle before the first hole is drilled in the first cycle, and the first drilling position is moved from the last drilling position to the first drilling position. A step of moving the irradiation position of the laser beam to a drilling position of one hole,
After the second step, the third step of moving the irradiation position of the laser beam with respect to the drilling position of the first hole after the end of the laser beam irradiation to the final drilling position of each cycle is performed. The laser processing method according to claim 9, further comprising: The first step moves the irradiation position of the laser beam to a predetermined default coordinate position before drilling the first hole in the first cycle, and drills the first hole from the default coordinate position. A step of moving the irradiation position of the laser beam to a position,
After the second step, after the laser beam irradiation to the last drilling position in each cycle is completed, the laser beam irradiation position with respect to the drilling position of the first hole via the default coordinate position The laser processing method according to claim 9, further comprising a fourth step of moving. In the first step, before the first hole is drilled in the first cycle, the irradiation position of the laser beam is set at a midway path position between the last drilling position and the first hole in one cycle. And moving the laser beam irradiation position from the midway path position to the drilling position of the first hole,
After the second step, after the laser beam irradiation to the last drilling position in each cycle is completed, a fifth step of moving the laser beam irradiation position with respect to the drilling position of the first hole is performed. The laser processing method according to claim 9, further comprising:

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