JP3853499B2 - Laser processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser pressurized KoSo location for processing drilling holes having different opening diameter on a substrate such as an electronic circuit board.
[0002]
[Prior art]
FIG. 1 shows a configuration of a laser processing apparatus, which is configured so that fine holes can be formed on a substrate 7 by laser irradiation. The laser beam 2 emitted from the laser oscillator 1 is guided to the XY two-axis galvanometers 4 and 5 by the reflecting mirror 3 and is incident on the fθ lens 6 by changing the irradiation direction by sweeping the galvanometers 4 and 5. A predetermined position of the substrate 7 focused by the fθ lens 6 and positioned by the XY table 9 is irradiated.
[0003]
[Problems to be solved by the invention]
As shown in the above configuration, when drilling with a laser beam focused by a lens, the laser beam has a conical shape, so that the processed hole also has a conical shape. In addition, when fine holes are made, penetrability may be impaired by the melt. To solve this problem, it is conceivable to perform multiple laser irradiations on the same processing position. However, if laser irradiation is performed continuously, laser irradiation will continue following the melted state of the previous laser irradiation. As a result, it has been found that the fluidity of the workpiece increases and the penetrability deteriorates. In other words, in order to perform laser irradiation a plurality of times at the same processing position, it is necessary to allow the next laser irradiation by providing a time for the portion melted by the previous laser irradiation to solidify.
[0004]
However, when laser irradiation is continuously performed a plurality of times with a time interval for the same hole, a processing time for processing a large number of holes in the workpiece is required. For example, the time required for one laser irradiation is 0.3 ms, the time required for positioning the galvano mirror is 5 ms, and the irradiation time interval is 10 ms. 15.6 ms is required, and at this processing speed, 64 holes / second is the upper limit.
[0005]
The present invention was devised in view of the above-mentioned problems of the prior art, and the object of the present invention is to improve the processing speed in the case of performing laser irradiation a plurality of times for one drilling process. to provide a pressurized KoSo location.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, a laser processing apparatus according to a first invention of the present application includes a laser oscillator for emitting a laser beam, a branching unit for branching the laser beam, and each laser beam branched by the branching unit. In a laser processing apparatus having a focusing means for guiding a processing position on a workpiece and a scanning means for scanning a laser beam focused by the focusing means, the scanning means and the focusing means are integrally held 2 Each laser irradiation unit cantilever supports each laser irradiation unit so that the laser irradiation regions are adjacent to each other, and the cantilever support parts of each holding mechanism are outside each other. It is arranged so that it may be located .
[0012]
According to the above configuration, the laser beam emitted from the laser oscillator is branched by the branching unit, and each of the branched laser beams is focused by the scanning unit and irradiated onto the workpiece, whereby the workpiece is processed by each laser beam. can be drilled drilling the machining position of the object, in particular, the holding mechanism of the two laser irradiation portion and cantilevered, integrated by holding the laser irradiation portion and the cantilever portion on the outside to each other that As a result, the laser irradiation regions can be made adjacent to each other, and there is no region that cannot be processed between the laser irradiation units, so that the range simultaneously processed by both laser irradiation units is also integrated.
[0013]
In the configuration of the first invention, when a different processing pattern is processed by each branched laser beam, the laser beam on the side that has been processed first is shielded by the scanning means disposed upstream from the workpiece. A laser beam shielding means for irradiating the plate can be provided. With this configuration, it is possible to quickly shield a laser beam that is no longer necessary for irradiation, and to prevent adverse effects caused by unnecessary irradiation of the laser beam.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a reference example and an embodiment of the present invention will be described with reference to the accompanying drawings for understanding of the present invention.
[0015]
FIG. 1 shows a configuration of a laser processing apparatus according to a first reference example of the present invention, in which a laser beam 2 emitted from a laser oscillator 1 is redirected by a reflecting mirror 3 and is converted into a laser beam on XY two axes. 2, galvanometers (scanning means) 4, 5, galvanometer mirrors 4 a, 5 a are incident on an fθ lens (focusing means) 6, focused by the fθ lens 6 and positioned on the XY table 9. is irradiated to a predetermined position of the pressurized Engineering product) 7, the holes in the aperture diameter corresponding to the beam diameter are processed into the irradiation position. This configuration is the same as the conventional configuration, but the conventional configuration is such that a plurality of laser irradiations are performed on the processing position of one hole in order to reduce the taper of the hole processed in the substrate 7 and improve the penetrability. It is different from the processing method. Hereinafter, the laser processing apparatus according to the first reference example will be described.
[0016]
First, the substrate 7 is positioned at a predetermined position by the XY table 9, and the galvanometers 4a and 5a respectively guide the laser beam 2 to the processing position on the substrate 7 and are focused by the fθ lens 6 for the first time. The hole is processed by laser irradiation. Next, with either one of the galvanometers 4 and 5 fixed, the laser beam 2 is guided to another processing position by scanning the other to process the next hole. For example, when the X-axis galvanometer 4 is fixed and the galvanometer mirror 5a is rotated by the Y-axis galvanometer 5, the laser beam 2 moves in the Y-axis direction. The laser beam 2 is guided to another machining position, and the first hole machining is performed on the other machining position. After that, the irradiation position of the laser beam 2 is returned to the previous processing position by the galvanometer 5 and the second laser irradiation is performed, and the drilled state or penetrability caused by the first laser irradiation is lowered. The state like this is resolved. Similarly, the second laser irradiation is performed on other processing positions to improve the drilling of the next hole.
[0017]
The above is a case where drilling is performed a plurality of times at two machining positions in the Y-axis direction. Similarly, a plurality of laser irradiations are sequentially scanned at three or more machining positions in the XY direction. It can be carried out. The time required for the movement of the laser beam 2 to the processing position by the galvanometers 4 and 5 is sufficient if it is 5 ms. Therefore, when the second laser irradiation is performed for the plurality of processing positions by the first laser irradiation, a time of 10 ms or more has elapsed. Yes, during this time, the hole melted by the first laser irradiation is solidified, and there is no decrease in penetrability due to the increase in fluidity due to the second laser irradiation being performed in the molten state. The taper and penetrability reduction state caused by irradiation can be eliminated by the second laser irradiation. The time required for this one hole drilling process is 5.6 ms, which is the sum of the laser irradiation time of 2 times 0.3 ms × 2 and the movement time of the laser beam 2 of 5 ms. In this case, it is possible to perform high-speed processing when irradiation is performed twice.
[0018]
FIG. 2 shows a configuration of a second reference example of the present invention, and two substrates for the same type of substrate 17 having a large area are processed using the laser processing apparatus according to the first reference example. A configuration capable of laser processing at the same time is shown. In addition, the same code | symbol is attached | subjected to the element which is common in the structure shown in FIG. 1, and the description is abbreviate | omitted.
[0019]
In FIG. 2, a laser beam 2 emitted from a laser oscillator 1 is branched into two by a beam splitter (branching means) 10, and two sets of lasers including XY two-axis galvanometers 4 and 5 and an fθ lens 6. Guided to the irradiation units A and B. The optical path lengths at which the laser beams 2a and 2b branched by the beam splitter 10 reach the focusing points by the fθ lenses 6 of the laser irradiation portions A and B are set to be the same distance. That is, the laser beam 2a branched by the beam splitter 10 is reflected by the reflecting mirrors 3b and 3c and is incident on the galvano mirror 4a, and the laser beam 2b branched by the beam splitter 10 is reflected by the reflecting mirrors 3d, 3e and 3f. The optical path length incident on the galvano mirror 4a is the same length. By matching the optical path lengths in this way, the focused states of the laser beams 2a and 2b in the laser irradiation parts A and B are the same, and simultaneous processing on the two substrates 17 can be performed with high accuracy.
[0020]
The substrates 17 and 17 processed by the laser irradiation structure are held at predetermined positions on the XY table 19. Since the processing range of the substrate 17 is wider than the scanning area of each laser irradiation part A, B, the processing range is divided into a plurality of parts as shown by broken lines, and one processing range is scanned by scanning with each laser irradiation part A, B. When the processing is completed, the next processing range is moved below the laser irradiation units A and B by the XY table 19. In the drilling by laser processing, taper reduction and penetrability are improved by the laser processing method shown in the first reference example .
[0021]
FIG. 3 shows the configuration of the first embodiment of the present invention. Two lasers are applied to one substrate 18 using the laser processing method in the laser processing apparatus according to the first reference example. The structure which can carry out laser processing simultaneously with the beams 2a and 2b is shown.
[0022]
In FIG. 3, a laser beam 2 emitted from a laser oscillator 1 is guided by reflecting mirrors 13a, 13b, 13c and 13d and branched into two by a beam splitter (branching means) 12, and one laser beam 2a is reflected. The light is guided by mirrors 13e, 13f, and 13g, and is incident on a laser irradiation unit 15A integrally configured with scanning means and focusing means. The other laser beam 2b is guided by the reflecting mirrors 13h, 13i, 13j, and 13k and is incident on the laser irradiation unit 15B. Each of the laser irradiation units 15A and 15B is configured to include XY biaxial galvanometers 4 and 5 (scanning means) and an fθ lens 6 (focusing means) similarly to the configuration shown in FIG.
[0023]
The laser irradiators 15A and 15B are cantilevered on the outer sides adjacent to each other by the holding mechanisms 14A and 14B, respectively. It can be arranged. Accordingly, when the substrate 18 held on the XY table 16 is simultaneously processed by the laser irradiation units 15A and 15B with respect to a predetermined range of processing region positioned by the XY table 16, there is an area that cannot be processed between the two. However, a rapid machining speed can be obtained by proceeding machining simultaneously.
[0024]
Processing by the laser irradiation units 15A and 15B may be the same processing pattern or different processing patterns. When different processing patterns are simultaneously processed on one substrate by the laser irradiation units 15A and 15B, the processing time is different.
[0025]
In this case, it is necessary to stop the laser irradiation on the side where the processing has been completed first.
[0026]
Normally, a method of shielding the laser beam with a mechanical shutter is adopted. However, since this method requires at least 0.5 seconds for the operation time of the shutter, tens of unnecessary laser irradiations are performed during this time. It will be.
[0027]
FIG. 4 shows a second embodiment of the present invention in which the laser irradiation on the side where the processing has been completed is stopped. FIG. 4 shows the internal configuration of the laser irradiation unit 15A / 15B in the configuration of the first embodiment.
[0028]
As shown in the figure, a discarded pulse receiver (laser beam shielding means) 20 is provided on the support frame portion of the lens body constituting the fθ lens 6. The laser irradiation unit 15A / 15B on the side where the processing has been completed first rotates the galvanometer mirrors 4a and 5a by the sweep operation of the galvanometers 4 and 5 so that the laser beam 2 is irradiated to the discard pulse receiver 20. . When the laser irradiation is stopped, the laser beam 2 is quickly shielded, so there is no unnecessary laser irradiation, and harmful effects due to unnecessary laser irradiation are prevented.
[0029]
【The invention's effect】
As described above, according to the laser processing apparatus of the present invention, the laser irradiation regions can be adjacent to each other by integrating the cantilevered portions by the holding mechanism of the two laser irradiation units on the outside, and each laser irradiation Since there is no region that cannot be processed between the portions, processing can be performed simultaneously by two laser beams from both laser irradiation portions.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a configuration of a laser processing apparatus according to a first reference example .
FIG. 2 is a perspective view showing a configuration of a laser processing apparatus according to a second reference example .
Figure 3 is a perspective view showing the configuration of a laser machining apparatus according to the first embodiment.
Figure 4 is a perspective view showing the configuration of a laser beam shielding according to the second embodiment.
[Explanation of symbols]
1, 11 Laser oscillator 2 Laser beam 4, 5 Galvanometer (scanning means)
6 fθ lens (focusing means)
7,17,18 board (the pressure engineering products)
10, 12 Beam splitter (branching means)
14A, 14B Irradiation unit holding mechanism 15A, 15B Laser irradiation unit

Claims (2)

A laser oscillator that emits a laser beam, a branching unit that branches the laser beam, a focusing unit that guides each laser beam branched by the branching unit to a processing position on a workpiece, and a focusing unit that focuses the laser beam In a laser processing apparatus having a scanning means for scanning a laser beam,
Each holding mechanism separates each laser irradiation unit so that two laser irradiation units configured by integrally holding the scanning unit and the focusing unit have an arrangement interval in which the laser irradiation regions are adjacent to each other. A laser processing apparatus characterized by being held and supported so that the cantilevered support portions of the holding mechanisms are located outside each other. Claims provided with laser beam shielding means for irradiating a shielding plate disposed on the upstream side of the workpiece when the machining pattern different from each of the branched laser beams is machined. Item 2. A laser processing apparatus according to Item 1 .

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