JP3479878B2 - Laser processing method and processing apparatus - Google Patents

Laser processing method and processing apparatus

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Publication number
JP3479878B2
JP3479878B2 JP2000086109A JP2000086109A JP3479878B2 JP 3479878 B2 JP3479878 B2 JP 3479878B2 JP 2000086109 A JP2000086109 A JP 2000086109A JP 2000086109 A JP2000086109 A JP 2000086109A JP 3479878 B2 JP3479878 B2 JP 3479878B2
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Prior art keywords
laser
beam splitter
polarization
galvano
processing apparatus
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JP2000086109A
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JP2001269790A (en
Inventor
尚 桑原
史郎 浜田
次郎 竹田
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住友重機械工業株式会社
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Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing method and a processing apparatus, and more particularly to a drilling process, which has been improved so that the processing speed can be improved. The present invention relates to a laser processing method and a processing apparatus. [0002] A laser processing apparatus mainly for drilling is equipped with a so-called XY stage that can horizontally move a stage on which a workpiece is mounted in the X-axis direction and the Y-axis direction. Is. This laser processing apparatus changes the irradiation position of a pulsed laser beam by moving a workpiece by an XY stage. For this reason, positioning by the XY stage takes time, and the processing speed is limited. For convenience, this laser processing apparatus is referred to as a first method. On the other hand, there has been provided a laser processing apparatus in which a processing speed is improved by oscillating a laser beam using a galvano scanner. Briefly, the laser beam output from the laser oscillator is guided to an XY galvano scanner after passing through a mask for defining its cross-sectional shape. As is well known, the XY galvano scanner has an X-axis galvanometer mirror for oscillating an incident laser beam in the X-axis direction on a workpiece arranged in a processing region, and for oscillating it in the Y-axis direction. Y-axis galvanometer mirror. With such an XY galvano scanner, the laser beam is oscillated over the entire predetermined area set on the workpiece through the fθ lens. The workpiece is movable in the X-axis and Y-axis directions.
It is mounted on the stage. For convenience, this laser processing apparatus is referred to as a second method. In this second method, after processing is performed by oscillating a laser beam on a predetermined area on the workpiece, X
-The next workpiece is placed in the machining area by the Y stage.
According to such a second method, the processing speed can be improved by combining the XY galvano scanner and the XY stage, but the processing area is limited. To increase the processing area, the diameter of the fθ lens may be increased. However, since the large-diameter fθ lens is expensive, there is a problem in cost. On the other hand, the present inventor has proposed a laser processing apparatus (Japanese Patent Laid-Open No. 8-141769) that can solve the problems of the second method. This will be described with reference to FIG. In FIG. 8, a pulsed laser beam from a laser oscillator (not shown) is passed through a mask 20 and branched by a half mirror 21. The light transmitted through the half mirror 21 is guided to the dichroic mirror 22. Reflected light from the half mirror 21 and the dichroic mirror 22 are respectively guided to mirrors 23 and 24 disposed below them. In the present processing apparatus, the reflected light from the mirror 23 is the first and second XY galvano scanners constituting the first XY galvano scanner.
Fθ lens 2 via second galvanometer mirrors 26, 27
Introduce into half the area. On the other hand, the reflected light of the mirror 24 passes through the fθ lens 25 via the third and fourth galvanometer mirrors 28 and 29 constituting the second XY galvano scanner.
Introduced in the other half of the area. To do this, the first and third galvanometer mirrors 26, 28 are used.
Are arranged symmetrically with respect to the central axis on the incident side of the fθ lens 25, and the second and fourth galvanometer mirrors 27 and 29 are similarly arranged symmetrically. The first and second fields F1 and F2 divided into two equal parts are set in the region immediately below the fθ lens 25, and the workpieces 31 and 32 are arranged in the respective fields. These workpieces 31 and 32 are processed simultaneously. Of course, there is a case where a workpiece having a size corresponding to the first and second fields F1 and F2 is arranged and one workpiece is processed at a time by half. The workpieces 31 and 32 are placed on the XY stage 33. Above the half mirror 21 and the dichroic mirror 22, a first lens 35 and a first C are respectively provided.
A first alignment system based on the CD camera 36 and a second alignment system based on the second lens 37 and the second CCD camera 38 are arranged. The combination of the first and second galvanometer mirrors 26 and 27 and the third and fourth galvanometer mirrors 28 and 29 is driven and controlled so as to have the same movement by a control device (not shown). The XY stage 33 is also driven by the control device to move the workpiece after the laser processing is completed, and moves horizontally in the X-axis direction and the Y-axis direction. The machining position with respect to the workpieces 31 and 32 is determined by the rotation angle command value given to each galvanometer mirror from the control device, and is not limited to the regularly arranged holes, but irregularly arranged holes, as well as characters and symbols. Such stamping is also possible. The laser processing apparatus according to the above proposal has a processing speed at least twice as high as that of the second method, but the first and third galvanometer mirrors 26, 2
There is a positional restriction that the 8, second, and third galvanometer mirrors 27 and 29 are symmetrical to each other and must be arranged compactly above the fθ lens 25. In particular, the first and second galvano scanners are most preferably arranged as design positions at the pupil position of the fθ lens 25. However, since the first and second galvano scanners need to be arranged so that the galvano mirrors do not interfere mechanically, there is a problem that they must be shifted from the design position. SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a laser processing method and a processing apparatus that can realize an improvement in processing speed and that are less subject to positional restrictions of an optical system, particularly a galvano scanner. is there. [0014] The laser processing according to the present invention.
The apparatus includes a laser oscillator and a laser from the laser oscillator.
A first splitting light into a first polarization component and a second polarization component;
A polarization beam splitter and the first polarization component to be processed
At least one axis to irradiate the desired position on the member
A first galvano scanner for swinging in the direction,
Irradiating a predetermined position on the workpiece with two polarization components
The second gas for swinging in at least one axis direction
Rubano scanner and the first and second galvano scanners
The first and second polarization components from are on a common optical path
To emit two types of laser light
The second polarizing beam splitter and the second polarizing beam;
Two types of laser light from the M-splitter
And an fθ lens for irradiating the first gull
The first polarization component from the vano scanner is converted into the second polarization component.
A first image for projection as a virtual image in the optical beam splitter.
1 collimating lens and the second galvano scanner
The second polarization component from the second polarization beam sp
Second collimator to project as a virtual image in the liter
And a trender. The laser processing apparatus according to the present invention also includes a laser oscillator, a first polarization beam splitter that divides laser light from the laser oscillator into a first polarization component and a second polarization component, and the first polarization beam splitter. A first galvano scanner for oscillating at least one axis so as to irradiate a desired position on the workpiece with the polarization component, and irradiating a predetermined position on the workpiece with the second polarization component The second galvano scanner for causing the galvano scanner to swing in at least one axial direction and the first and second polarization components from the first and second galvano scanners are superimposed on each other so as to be on a common optical path. The second polarizing beam splitter for emitting different types of laser light, and an fθ lens for irradiating the workpiece with two types of laser light from the second polarizing beam splitter; Only including, the first galvanometer scanner
Between the second polarizing beam splitter and the second polarizing beam splitter
A galvano scanner and the second polarizing beam splitter;
The first and second collimating lenses are placed between
The laser light from the first and second collimating lenses
Each of the second polarized beam splits is always at a constant angle.
The second polarized beam splitter.
The lens is disposed between the fθ lens and the fθ lens.
1 and the laser light from the second galvano scanner is the fθ
A virtual image is formed at the entrance pupil position of the lens . The first and second galvano scanners swing the first and second polarization components in biaxial directions perpendicular to each other. The first and second masks for defining the cross-sectional shape of the laser beam are respectively disposed on the emission side of the first and second polarization components in the first polarization beam splitter. Is preferred. Furthermore, first and second optical means for converting linearly polarized light into circularly polarized light are arranged on the incident side of the first polarizing beam splitter and on the outgoing side of the second polarizing beam splitter, respectively. May be. The laser processing method according to the present invention comprises a laser generator.
The laser beam from the vibrator is transmitted by the first polarizing beam splitter.
Divided into a first polarization component and a second polarization component.
Are guided to a first galvano scanner, and the second
Are guided to a second galvano scanner, and the first
Galvo scanner from the second galvo scanner
Of each laser beam to the second polarizing beam splitter
Introduce two types of laser light so that they are on a common optical path
Superposition, two types from the second polarizing beam splitter
To be processed through each fθ lens
Irradiate different positions of the two at the same time,
A first galvano scanner and the second polarized beam spring;
Between the second galvano scanner and the second galvano scanner
First and second between the polarization beam splitter
A collimating lens is arranged to provide the first and second galva.
The laser beam from the non-scanner is the second polarized beam sp.
The feature is that a virtual image is formed inside the ritta.
To do . In this laser processing method , the first and second galvano scanners are respectively disposed at the entrance pupil positions of the fθ lens. In the laser processing method according to the present invention,
The laser beam from the laser oscillator is converted into the first polarized beam beam.
The splitter separates the first polarization component and the second polarization component.
The first polarization component is guided to the first galvano scanner.
The second polarization component is guided to the second galvano scanner.
The first galvano scanner, the second galvano
Each laser beam from the scanner is converted into a second polarized beam.
Two types of laser light are introduced into a splitter on a common optical path
And the second polarized beam split.
Two types of laser beams from the
Irradiate different parts of the workpiece and perform simultaneous machining
The first galvano scanner and the second polarization
Between the beam splitter, the second galvano scanner
And the second polarizing beam splitter,
The first and second collimating lenses are arranged so that the first and second collimating lenses are arranged.
Each laser beam from the two collimating lenses is always one.
It enters the second polarizing beam splitter at a constant angle.
And the second polarization beam splitter and the fθ reference.
A lens is disposed between the first and second galvos.
The laser beam from the non-scanner is the entrance pupil position of the fθ lens.
A virtual image is formed by the position. [0022] Also Oite to Re Izu the third collimating lens disposed on the incident side of the first optical scanner, wherein the entrance side of the second galvano scanner fourth collimating lens arranged May be. DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a laser processing apparatus according to the present invention will be described with reference to FIG. In FIG. 1, the laser processing apparatus includes a laser oscillator 1 and
The first polarization beam splitter 2 divides the laser light from the laser oscillator 1 into a first polarization component, for example, a P-wave polarization component, and a second polarization component, for example, an S-wave polarization component. As is well known, the first polarizing beam splitter 2 is
It has the property of transmitting the P-wave polarization component and reflecting the S-wave polarization component. The laser processing apparatus also includes a first galvano scanner 4 for swinging the first polarization component from the first polarization beam splitter 2 so as to irradiate a desired position on the work 3, and a first polarization. A second galvano scanner 5 for swinging the second polarization component from the beam splitter 2 to irradiate a predetermined position on the work 3 and the first polarization component from the first galvano scanner 4 are A first collimating lens 7 for projecting as a virtual image in the second polarizing beam splitter 6, and a second polarized component from the second galvano scanner 5 for projecting as a virtual image in the second polarizing beam splitter 7. The second collimating lens 8 and the first and second polarization components from the first and second collimating lenses 7 and 8 are superposed so as to be on a common optical path, and the first and second Including the second polarizing beam splitter 7 for emitting laser light, and a fθ lens 9 for irradiating two types of laser light from the second polarizing beam splitter 6 to the workpiece 3. Normally, the desired position by the first galvano scanner 4 and the desired position by the second galvano scanner 5 are different positions, but the same position may be irradiated. Here, in FIG. 1, each of the first and second galvano scanners 4 and 5 is symbolically shown by one galvano mirror, but in this embodiment, as explained in FIG. The incident laser beam is orthogonal to the X-axis direction and Y
So-called X that can be swung in two axial directions
-A Y galvano scanner is used. However, depending on the case, the first and second galvano scanners 4 and 5 may each be provided with only one galvanometer mirror so that the incident laser beam is swung only in one axis direction. First and second masks 11 and 12 for defining the cross-sectional shape of the laser beam are disposed on the emission side of the first and second polarization components in the first polarization beam splitter 2. Each of the first and second masks 11 and 12 usually has a circular passage hole so that a peripheral portion in the cross-sectional shape, that is, a portion having a low energy intensity is cut so that the energy density distribution in the cross-sectional shape becomes uniform. To do. A third collimating lens 13 is disposed on the incident side of the first galvano scanner 4, and the fourth collimating lens 1 is disposed on the incident side of the second galvano scanner 5.
4 is arranged. Third and fourth collimating lens 1
Reference numerals 3 and 14 are for suppressing an increase in the beam diameter of the incident laser light. Further, a first (1/4) λ plate 15 is disposed on the incident side of the first polarizing beam splitter 2, and a second (1/4) is disposed on the output side of the second polarizing beam splitter 6. A λ plate 16 is disposed. The first (1/4) λ plate 15 is
The laser light from the laser oscillator 1 is linearly polarized light having an S-wave polarization component and a P-wave polarization component, and is used to convert this linearly polarized light into circularly polarized light, which is also called a phase plate. That is, a linearly polarized light is converted into a circularly polarized light by giving a phase difference between the S wave polarized component and the P wave polarized component, or the circularly polarized light is converted into a linearly polarized light. This is to make the energy density of the first and second polarization components made 1: 1.
The first and second polarization components emitted from the first polarization beam splitter 2 are linearly polarized light. On the other hand, the second (1/4) λ plate 16 is for converting linearly polarized light from the second polarizing beam splitter 6 into circularly polarized light. The work 3 is mounted on the XY stage 17. FIG. 2 shows a configuration of FIG. 1 in which the laser beam from the laser oscillator 1 enters the first (1/4) λ plate 15 and then passes through the second (1/4) λ plate 16. Work 3
The polarization form until it is irradiated is shown. In FIG. 2, the component indicated by a circle indicates a P-wave polarization component, and the component indicated by a straight line indicates an S-wave polarization component. In the present embodiment, two types of laser beams incident on the second polarizing beam splitter 6 using the first and second collimating lenses 7 and 8 in particular are virtual images in the second polarizing beam splitter 6. And the laser beams from the first and second galvano scanners 4 and 5 are combined so as not to interfere with each other. In addition, the first and second galvano scanners 4 and 5 are respectively
The two types of laser light are focused on the work 3 by being arranged at the pupil position of the fθ lens 9, making the two types of laser light from the second polarization beam splitter 6 circularly polarized and passing through the fθ lens 9. Irradiated to tie. And work 3
For example, drilling can be performed simultaneously with two types of laser beams. Strictly speaking, the laser light from the first galvano scanner 4 is incident on the left region of the fθ lens 9 in FIG. 1, and the laser light from the second galvano scanner 5 is on the right side of the fθ lens 9 in FIG. Incident into the area. The pattern of drilling (arrangement pattern of the formed holes) may be the same or different. That is, if the control for the first and second galvano scanners 4 and 5 is the same, the drilling of the same pattern is performed,
If different controls are performed, different patterns of holes are formed. In FIG. 1, work 3 is 1
However, the same pattern or different patterns may be drilled for two workpieces. As described above, the laser light from the laser oscillator 1 is branched into two by the first polarization beam splitter 2 and is incident on the first and second galvano scanners 4 and 5.
The laser beams from the second galvano scanners 4 and 5 are sent to the first,
By projecting as a virtual image on the second polarizing beam splitter 6 by the second collimating lenses 7 and 8,
These can be arranged at the pupil position of the fθ lens 9 while avoiding mechanical interference between the first and second galvano scanners 4 and 5. FIG. 3 shows that the first polarization component by linear polarization from the first polarization beam splitter 2, that is, the laser beam of the P polarization component passes through the second polarization beam splitter 6, and the second (1 / 4) A process of being converted into circularly polarized light by the λ plate 16 and entering the fθ lens 9 is shown. FIGS. 4 and 5 show a case where a part of the S-polarized light component irradiated to the work 3 is reflected there and returned through the reverse path. That is, the S-polarized component due to the circularly polarized light reflected by the work 3 is the second (¼) λ plate 1.
6 may be converted into linearly polarized light, reflected by the second polarizing beam splitter 6, and returned to the first polarizing beam splitter 2 via each galvanometer mirror of the second galvano scanner 5. . However, in this embodiment, since there is the second mask 12, such return light is cut by the second mask 12. Therefore, the return light from the work 3 does not reach the laser oscillator 1 and adversely affect it. This is the same in the second and third embodiments described later. By the way, when the laser beam incident thereon enters the fθ lens 9 in parallel to the central axis thereof, the laser beam emitted from the fθ lens 9 is irradiated with a certain angle with respect to the horizontal plane of the work 3. There is a tendency to. When the laser beam is incident on the workpiece 3 at a certain angle, the pattern of the irradiated laser beam is deformed into an ellipse instead of a circle. This means that the shape of the hole formed in the workpiece 3 is not a perfect circle but an ellipse. However, in this embodiment, the two laser beams from the second polarization beam splitter 6 are respectively f
The incident light is not parallel to the central axis of the θ lens 9 but obliquely.
The obliquely incident laser light is emitted by the fθ lens 9 so as to be parallel to the central axis. As a result, the workpiece 3 can be drilled close to a perfect circle. A second embodiment of the present invention will be described with reference to FIG. Also in this embodiment, the first and second galvano scanners 4 and 5 are respectively arranged at the entrance pupil position of the fθ lens 9. The difference from the first embodiment of FIG. 1 is that the first and second collimating lenses 7 and 8 are omitted. Other elements are the same as those in the first embodiment, but there are cases where interference occurs between the two types of laser beams in terms of operation compared to the first embodiment. With reference to FIG. 7, a third embodiment of the present invention will be described. In this embodiment, the constituent elements are almost the same as those in the first embodiment shown in FIG.
The laser beams from the collimating lenses 7 and 8 are always incident on the second polarizing beam splitter 6 at a constant angle. Further, the second (1/4) λ plate 16 and f
A lens 18 is disposed between the θ lens 9 and the laser light from the first and second galvano scanners 4 and 5 is transmitted to the fθ lens 9.
A virtual image is formed at the entrance pupil position. According to such a configuration, the laser beam from the first and second galvano scanners 4 and 5 is always incident on the second polarization beam splitter 6 at the same incident angle regardless of how it is oscillated. This is superior to the first embodiment in that no change in rate or the like occurs. The type of laser oscillator used in the present invention is not particularly limited. For example, a CO 2 laser oscillator, a YAG laser oscillator or its second and third harmonics, a YLF laser oscillator or its Second and third harmonics are suitable. Further, workpieces that are symmetric to processing include a resin layer and a ceramic substrate in a printed wiring board, and processing is not limited to drilling. As described above, according to the present invention, two types of laser beams are incident on one fθ lens to perform simultaneous processing, and the processing speed can be improved.
By providing the polarizing beam splitter on the incident side of the lens, it is possible to provide a laser processing apparatus that can avoid the positional restrictions of optical system elements such as a galvano scanner as much as possible.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram schematically showing a main configuration of a laser processing apparatus according to a first embodiment of the present invention. 2 is a diagram for explaining an optical path of a P-wave polarization component and an S-wave polarization component and an operation of first and second (1/4) λ plates in the configuration of FIG. 1; FIG. 3 is a diagram for explaining the action of a second polarization beam splitter in the configuration of FIG. 1 with respect to a P-wave polarization component; 4 is a diagram for explaining a path of reflected light from a workpiece in the configuration of FIG. 1 with respect to an S-wave polarization component. FIG. 5 is a diagram for explaining an additional function performed by a second mask with respect to an S-wave polarization component of light reflected from the work shown in FIG. 4; FIG. FIG. 6 is a diagram schematically showing a main configuration of a laser processing apparatus according to a second embodiment of the present invention. FIG. 7 is a diagram schematically showing a main configuration of a laser processing apparatus according to a third embodiment of the present invention. FIG. 8 is a diagram schematically showing a main configuration of a laser processing apparatus according to a method proposed by the present inventor. DESCRIPTION OF SYMBOLS 1 Laser oscillator 2 1st polarization beam splitter 3, 31, 32 Work 4, 26 1st galvanometer scanner 5, 27 2nd galvanometer scanner 6 2nd polarization beam splitter 7, 8, 13, 14 Collimating lens 9, 25 fθ lens 11, 12, 20 Mask 15, 16 (1/4) λ plate 17, 33 XY stage 18 Lens 21 Half mirror 22 Dichroic mirror 23, 24 Mirror 28 Third galva mirror 29 Fourth galvano scanner 36 First CCD camera 38 Second CCD camera

──────────────────────────────────────────────────── ----- Continuation of the front page (56) References JP-A-4-354532 (JP, A) JP-A-6-246470 (JP, A) JP-A-6-663 (JP, A) JP-A-9- 29467 (JP, A) JP 2000-190087 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) B23K 26/00-26/42

Claims (1)

  1. (57) Claims 1. A laser beam from a laser oscillator is divided into a first polarization component and a second polarization component by a first polarization beam splitter, and the first polarization component is divided. The first galvano scanner, the second polarization component is guided to a second galvano scanner, the first galvano scanner, the second
    Each of the laser beams from the galvano scanner is introduced into the second polarization beam splitter so that the two types of laser beams are superimposed on a common optical path, and the two types of laser beams from the second polarization beam splitter are overlapped. The first galvano scanner and the first galvano scanner are configured to perform simultaneous processing by irradiating light to different positions on the workpiece through respective fθ lenses.
    Between the second polarizing beam splitter, the second galva
    Between the scanner and the second polarizing beam splitter
    Arrange the first and second collimating lenses,
    Laser light from the first and second galvano scanners
    A virtual image is formed inside the second polarizing beam splitter.
    A laser processing method characterized by the above . 2. The laser processing method according to claim 1, wherein
    Te, before Symbol first, respectively the second optical scanner, a laser processing method, characterized in that arranged in the entrance pupil position of the fθ lens. 3. A laser beam emitted from a laser oscillator is converted into a first polarization.
    First polarization component and second polarization by optical beam splitter
    The first polarization component is divided into first galvanos
    The second polarization component is guided to a can and a second galvanos
    The first galvano scanner, the second
    Each of the laser beams from the galvo scanners of the second
    Introduced into a polarizing beam splitter and shared two types of laser light
    So that the second polarization beam is on the light path.
    Two types of laser light from
    Irradiate different positions on the workpiece through
    The first galvano scanner and the first
    Between the second polarizing beam splitter, the second galva
    Between the scanner and the second polarizing beam splitter
    Arrange the first and second collimating lenses,
    The laser beams from the first and second collimating lenses are
    Always at a constant angle to the second polarizing beam splitter
    The second polarization beam splitter; and
    A lens is disposed between the fθ lens and the first and second lenses.
    The laser light from the galvano scanner 2 is the fθ lens.
    A laser processing method characterized in that a virtual image is formed at an entrance pupil position . 4. A laser oscillator and a laser beam emitted from the laser oscillator with a first polarization component and a second polarization component.
    A first polarization beam splitter that divides the first polarization component into a desired position on the workpiece
    A first for swinging in at least one axis direction
    A galvano scanner and the second polarization component at a predetermined position on the workpiece;
    The first to swing at least in one axis direction to irradiate
    Two galvano scanners and the first and second galvano scanners from the first and second galvano scanners.
    Overlapping the two polarization components so that they are on a common optical path
    The second polarizing beam for emitting two types of laser beams
    And two types of laser light from the second polarizing beam splitter
    Including an fθ lens for irradiating the workpiece to the workpiece
    Seen, the first polarization component from the first optical scanner
    Is projected as a virtual image into the second polarizing beam splitter.
    A first collimating lens and the second polarization component from the second galvano scanner
    Is projected as a virtual image into the second polarizing beam splitter.
    And a second collimating lens for
    A laser processing apparatus characterized by the above. 5. A laser processing apparatus according to claim 4, wherein :
    The first and second galvano scanners are the first and second galvano scanners.
    The two polarization components are oscillated in the biaxial directions perpendicular to each other.
    Laser processing apparatus, characterized in that cause et. 6. A laser processing apparatus according to claim 4 or 5.
    In the first polarization beam splitter,
    Laser light is emitted on the emission side of the first and second polarization components, respectively.
    First and second masks are provided to define the cross-sectional shape of
    The laser processing apparatus characterized by the above-mentioned . 7. A laser according to any one of claims 4 to 6.
    In the processing apparatus, the first polarization beam splitter
    On the incident side, on the exit side of the second polarizing beam splitter.
    First and second for converting linearly polarized light into circularly polarized light, respectively
    Laser processing apparatus characterized by optical means is placed. 8. A laser according to claim 4, wherein
    In the processing apparatus, the first and second galvano scanners
    Are arranged at the entrance pupil position of the fθ lens, respectively . 9. A laser according to any one of claims 4 to 8.
    In a processing apparatus, incidence of the first galvano scanner
    A third collimating lens is disposed on the side, and the second glass
    The fourth collimating lens is on the incident side of the rubano scanner.
    A laser processing apparatus characterized by being arranged . 10. A laser oscillator, and a laser beam from the laser oscillator as a first polarization component and a second polarization component.
    A first polarization beam splitter that divides the first polarization component into a desired position on the workpiece
    A first for swinging in at least one axis direction
    A galvano scanner and the second polarization component at a predetermined position on the workpiece;
    The first to swing at least in one axis direction to irradiate
    Two galvano scanners and the first and second galvano scanners from the first and second galvano scanners.
    Overlapping the two polarization components so that they are on a common optical path
    The second polarizing beam for emitting two types of laser beams
    And two types of laser light from the second polarizing beam splitter
    Including an fθ lens for irradiating the workpiece to the workpiece
    Seen, wherein the first optical scanner second polarization beam
    Between the second galvano scanner and the second galvano scanner.
    First and second between two polarizing beam splitters, respectively.
    A first collimating lens and a second collimating lens.
    Each laser beam from the lens is always at a fixed angle
    The light beam is incident on the second polarization beam splitter, and the second polarization beam splitter and the fθ lens are
    The first and second galvano scanners are arranged with a lens in between.
    The laser beam from the center is a virtual image at the entrance pupil position of the fθ lens.
    A laser processing apparatus characterized in that the is formed . 11. A laser processing apparatus according to claim 10, wherein:
    There are the in the first polarization beam splitter first
    Cross sections of the laser light on the emission side of the first and second polarization components, respectively
    First and second masks for defining the shape are arranged
    Laser processing apparatus characterized by there. 12. A laser according to claim 10 or 11.
    In the processing apparatus, the first polarization beam splitter
    On the incident side, on the exit side of the second polarizing beam splitter.
    First and second for converting linearly polarized light into circularly polarized light, respectively
    A laser processing apparatus, wherein an optical means is arranged . 13. The method according to claim 10, wherein
    In the laser processing apparatus, the first galvano scanner
    A third collimating lens is disposed on the incident side of the
    The fourth collimator is on the incident side of the second galvano scanner.
    Laser processing equipment characterized in that
    Place.
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