JP3479878B2 - Laser processing method and processing apparatus - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing method and a processing apparatus, and more particularly to a laser processing method and a processing apparatus whose main purpose is drilling and improved so that the processing speed can be improved.

[0002]

2. Description of the Related Art In general, a laser processing apparatus mainly intended for drilling is provided with a so-called XY stage capable of horizontally moving a stage on which a work is mounted in the X-axis direction and the Y-axis direction. . This laser processing apparatus changes the irradiation position of a pulsed laser beam by moving a work by an XY stage. Therefore, positioning by the XY stage takes time, and the processing speed is limited. For convenience, this laser processing apparatus is called the first system.

On the other hand, there is provided a laser processing apparatus which improves the processing speed by oscillating a laser beam using a galvano scanner. Briefly, a laser beam output from a laser oscillator is guided to an XY galvano scanner after passing through a mask for defining its cross-sectional shape. As is well known, the XY galvanometer scanner is designed so that an incident laser beam is swung in the X-axis direction on a workpiece arranged in a processing area, and a Y-axis galvano-mirror is used. It consists of a Y-axis galvanometer mirror. With such an XY galvano scanner, the laser light is swung so as to cover the entire predetermined area set on the work through the fθ lens. In addition, the work is XY that is movable in the X-axis direction and the Y-axis direction.
It is mounted on the stage. For convenience, this laser processing apparatus is called the second method.

In the second method, a laser beam is applied to a predetermined area on the work to perform processing, and then X
-Place the next workpiece in the processing area by the Y stage.
According to such a second method, the processing speed can be improved by combining the XY galvano scanner and the XY stage, but the processing area is limited. The processing area can be widened by increasing the diameter of the fθ lens, but since the large-diameter fθ lens is expensive, a cost problem arises.

On the other hand, the present inventor has proposed a laser processing apparatus (Japanese Patent Laid-Open No. 8-141769) which can solve the problems of the second method. This will be described with reference to FIG.

In FIG. 8, pulsed laser light from a laser oscillator (not shown) is passed through a mask 20 and branched by a half mirror 21. The transmitted light of the half mirror 21 is guided to the dichroic mirror 22. The reflected lights of the half mirror 21 and the dichroic mirror 22 are guided to the mirrors 23 and 24 arranged below them, respectively.

In this processing apparatus, the reflected light from the mirror 23 is reflected by the first, XY and galvano scanners constituting the first XY galvano scanner.
The fθ lens 2 via the second galvanometer mirrors 26 and 27
It is introduced in the area of half of 5. On the other hand, the reflected light of the mirror 24 is passed through the third and fourth galvano mirrors 28 and 29 which constitute the second XY galvano scanner, and the fθ lens 25.
We are going to introduce it to the other half of the area. To do this, the first and third galvanometer mirrors 26, 28
On the incident side of the fθ lens 25 with respect to the central axis, and the second and fourth galvanometer mirrors 27 and 29 may also be arranged symmetrically.

In a region directly below the fθ lens 25, bisected first and second fields F1 and F2 are set, and works 31 and 32 are arranged in the respective fields. These works 31, 32 are processed at the same time. Of course, there may be a case where a work having a size corresponding to the first and second fields F1 and F2 is arranged and one work is processed in half at a time. The works 31, 32 are placed on the XY stage 33.

Above the half mirror 21 and the dichroic mirror 22, a first lens 35 and a first C are provided, respectively.
A first alignment system including a CD camera 36 and a second alignment system including a second lens 37 and a second CCD camera 38 are arranged.

The combination of the first and second galvano-mirrors 26 and 27 and the third and fourth galvano-mirrors 28 and 29 is drive-controlled by a controller (not shown) so as to have the same movement. The XY stage 33 is also driven by the controller to move the work after the laser processing is completed, and horizontally moves in the X axis direction and the Y axis direction.

The machining positions for the works 31, 32 are determined by the command value of the rotation angle given to each galvano mirror from the control device, and not only the holes arranged regularly, but also the holes arranged irregularly, as well as characters and symbols. Such engraving is also possible.

[0012]

The laser processing apparatus according to the above-mentioned proposal has a processing speed at least twice as high as that of the second method, but the first and third galvano mirrors 26, 2 are used.
There is a positional restriction that the eighth, second and third galvanometer mirrors 27 and 29 must be arranged symmetrically with respect to each other and compactly arranged above the fθ lens 25. In particular, the first and second galvano scanners are most preferably arranged at the pupil position of the fθ lens 25 as a design position. However, the first and second galvano scanners need to be arranged so that the respective galvano mirrors do not mechanically interfere with each other, and thus there is a problem in that they must be displaced from their designed positions.

Therefore, an object of the present invention is to provide a laser processing method and a processing apparatus which can realize an improvement in processing speed, and which can avoid the positional restrictions of an optical system, especially a galvano scanner, as much as possible. is there.

[0014]

Laser processing according to the present invention
The device includes a laser oscillator and a laser from the laser oscillator.
A first splitting light into a first polarization component and a second polarization component
Polarization beam splitter and processing the first polarization component
At least one axis to illuminate the desired position on the member
A first galvanometer scanner for swinging in the direction;
Irradiate two polarized components to a predetermined position on the workpiece.
Second mower for swinging in at least one axial direction so that
Lubano scanner and the first and second galvano scanners
From the first and second polarization components on the common optical path
In order to emit two types of laser light
The second polarization beam splitter and the second polarization beam splitter
The two types of laser light from the optical splitter
And a fθ lens for irradiating the first gal
The first polarization component from the vano scanner is converted into the second polarization component.
The first for projecting as a virtual image in the light beam splitter.
No. 1 collimating lens and the second galvanometer scanner
The second polarization component from the second polarization beamsp
The second collimator to project as a virtual image in the liter
It is characterized by further comprising a lens.

The laser processing apparatus according to the present invention also includes a laser oscillator, a first polarization beam splitter that splits laser light from the laser oscillator into a first polarization component and a second polarization component, and the first polarization beam splitter. A first galvano scanner for oscillating the polarized component in at least one axis direction so as to irradiate the desired position on the workpiece, and the second polarized component for irradiating the predetermined position on the workpiece. A second galvano-scanner for oscillating in at least one axis direction and the first and second polarization components from the first and second galvano-scanners are superposed so as to be on a common optical path. A second polarization beam splitter for emitting two types of laser beams, and an fθ lens for irradiating the workpiece with two types of laser beams from the second polarization beam splitter. Only including, the first galvanometer scanner
Between the second polarization beam splitter and the second polarization beam splitter.
Galvano scanner and the second polarization beam splitter
And place the first and second collimating lenses between
The laser light from the first and second collimating lenses
Each of the second polarized beam splitters is always at a constant angle.
The second polarized beam splitter.
A lens between the lens and the fθ lens.
The laser light from the first and second galvano scanners is fθ
It is characterized in that a virtual image is formed at the entrance pupil position of the lens .

The first and second galvano-scanners are designed to oscillate the first and second polarized components in two axial directions orthogonal to each other.

Further, first and second masks for defining the cross-sectional shape of the laser light are arranged on the emission sides of the first and second polarization components in the first polarization beam splitter, respectively. Is preferred.

Further, first and second optical means for converting linearly polarized light into circularly polarized light are arranged on the incident side of the first polarizing beam splitter and the emitting side of the second polarizing beam splitter, respectively. May be.

The laser processing method according to the present invention uses a laser emission method.
The laser light from the oscillator is transmitted by the first polarization beam splitter.
The first polarized component and the second polarized component are separated into
Of the polarized light component of the second galvano scanner to the second galvano scanner
Of the polarized light component of the first galvano scanner to the second galvano scanner,
Galvano scanner from the second galvano scanner
Each of the laser light of the
Introducing two types of laser light so that they are on a common optical path
Superimposing, two kinds from the second polarization beam splitter
Type of laser light through fθ lens
Irradiate different positions to perform simultaneous processing.
A first galvano scanner and the second polarized beam splitter
Between the second galvanometer scanner and the second
Between the polarization beam splitter and the first and second
A collimating lens is arranged so that the first and second galvanometers are arranged.
Laser beam from the scanner
The feature is that a virtual image is formed inside the liter.
To do .

In this laser processing method , the first and second galvano scanners are respectively arranged at the entrance pupil positions of the fθ lens.

In the laser processing method according to the present invention,
In addition, the laser light from the laser oscillator
The splitter splits the first and second polarization components.
And guide the first polarized component to the first galvanometer scanner.
The second polarized component to the second galvanometer scanner.
The first galvano scanner and the second galvano scanner.
Each laser beam from the scanner is a second polarized beam
Two types of laser light can be introduced on a splitter and on a common optical path.
And the second polarized beam splitter.
The two types of laser light from the
And irradiate different positions on the workpiece to perform simultaneous machining.
In other words, the first galvanometer scanner and the second polarization
Between the beam splitter and the second galvano scanner
Between the second polarizing beam splitter and
The first and second collimating lenses are arranged so that the first and second collimating lenses are arranged.
The laser light from the two collimating lenses is always one
It will be incident on the second polarization beam splitter at a constant angle.
The second polarization beam splitter and the fθ laser.
A lens is disposed between the first and second galvanizers.
Laser beam from the scanner is at the entrance pupil position of the fθ lens.
It is characterized in that a virtual image is formed at the position.

[0022] Also Oite to Re Izu the third collimating lens disposed on the incident side of the first optical scanner, wherein the entrance side of the second galvano scanner fourth collimating lens arranged It may be done.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of a laser processing apparatus according to the present invention will be described with reference to FIG. In FIG. 1, the laser processing apparatus includes a laser oscillator 1 and
It has a first polarization beam splitter 2 that splits the laser light from the laser oscillator 1 into a first polarization component, for example a P-wave polarization component, and a second polarization component, for example an S-wave polarization component. The first polarization beam splitter 2 is, as is well known,
It has a property of transmitting a P-wave polarization component and reflecting an S-wave polarization component. The laser processing apparatus also includes a first galvanometer scanner 4 for swinging the first polarization component from the first polarization beam splitter 2 so as to irradiate a desired position on the work 3, and a first polarization. A second galvano scanner 5 for oscillating the second polarized component from the beam splitter 2 so as to irradiate a predetermined position on the work 3 and a first polarized component from the first galvano scanner 4 To project a first collimating lens 7 for projecting a virtual image in the second polarization beam splitter 6 and a second polarization component from the second galvano scanner 5 in the second polarization beam splitter 7 as a virtual image Second collimating lens 8 and the first and second polarization components from the first and second collimating lenses 7 and 8 are superposed so as to be on a common optical path, and the first and second Including the second polarizing beam splitter 7 for emitting laser light, and a fθ lens 9 for irradiating two types of laser light from the second polarizing beam splitter 6 to the workpiece 3.

Normally, the desired position by the first galvano scanner 4 and the desired position by the second galvano scanner 5 are different positions, but the same position may be irradiated.

Here, in FIG. 1, each of the first and second galvano scanners 4 and 5 is symbolically shown by one galvano mirror, but in the present embodiment, as described with reference to FIG. Incident laser light is orthogonal to the X-axis direction and Y
A so-called X that can be swung in two axial directions
A Y galvano scanner is used. However, in some cases, each of the first and second galvano scanners 4 and 5 may be provided with only one galvano mirror so that the incident laser light is swung only in one axis direction.

First and second masks 11 and 12 for defining the cross-sectional shape of the laser light are arranged on the emission sides of the first and second polarization components in the first polarization beam splitter 2, respectively. Each of the first and second masks 11 and 12 usually has a circular passage hole so that a peripheral portion in the cross-sectional shape, that is, a portion having low energy intensity is cut so that the energy density distribution in the cross-sectional shape becomes uniform. To do.

A third collimating lens 13 is arranged on the incident side of the first galvano scanner 4, and a fourth collimating lens 1 is arranged on the incident side of the second galvano scanner 5.
4 are arranged. Third and fourth collimating lens 1
Reference numerals 3 and 14 are for suppressing the beam diameter of the incident laser light from expanding.

Further, a first (1/4) λ plate 15 is arranged on the incident side of the first polarization beam splitter 2 and a second (1/4) λ plate 15 is arranged on the emission side of the second polarization beam splitter 6. A λ plate 16 is arranged. The first (1/4) λ plate 15 is
The laser light from the laser oscillator 1 is linearly polarized light having an S-wave polarization component and a P-wave polarization component, which is used to convert this linearly polarized light into circularly polarized light, and is also called a phase plate. That is, the linearly polarized light is converted into circularly polarized light or the circularly polarized light is converted into linearly polarized light by giving a phase difference between the S-wave polarized component and the P-wave polarized component. This is to make the energy densities of the generated first and second polarization components 1: 1.
The first and second polarization components emitted from the first polarization beam splitter 2 are linearly polarized light. On the other hand, the second (¼) λ plate 16 is for converting the linearly polarized light from the second polarization beam splitter 6 into circularly polarized light. The work 3 is mounted on the XY stage 17.

FIG. 2 shows that, in the configuration of FIG. 1, the laser light from the laser oscillator 1 enters the first (1/4) λ plate 15 and then passes through the second (1/4) λ plate 16. Then work 3
The polarized light morphology is shown until it is irradiated with. In FIG. 2, the circular component indicates the P-wave polarization component, and the linear component indicates the S-wave polarization component.

In the present embodiment, the two types of laser light incident on the second polarization beam splitter 6 using the first and second collimating lenses 7 and 8 are virtual images inside the second polarization beam splitter 6. The laser beams from the first and second galvano scanners 4 and 5 are combined so as not to interfere with each other. Moreover, the first and second galvano scanners 4 and 5 are respectively
The two types of laser light are focused on the work 3 by arranging them at the pupil position of the fθ lens 9 and making the two types of laser light from the second polarization beam splitter 6 circularly polarized and then passing through the fθ lens 9. It is irradiated so as to tie. And work 3
On the other hand, for example, drilling can be performed simultaneously with two types of laser light. Strictly speaking, the laser light from the first galvano scanner 4 is incident on the area on the left side of the fθ lens 9 in FIG. 1, and the laser light from the second galvano scanner 5 is on the right side of the fθ lens 9 in FIG. 1. Incident on the area.

The drilling pattern (arrangement pattern of the formed holes) may be the same or different. That is, if the same control is applied to the first and second galvano scanners 4 and 5, the same pattern of holes is drilled,
If different controls are performed, different patterns of holes will be drilled. Further, in FIG. 1, the work 3 is 1
However, two workpieces may be punched with the same pattern or different patterns.

As described above, the laser light from the laser oscillator 1 is split into two by the first polarization beam splitter 2 and is made incident on the first and second galvano scanners 4 and 5, and
The laser beams from the second galvano scanners 4 and 5
By projecting the second collimating lenses 7 and 8 as a virtual image on the second polarization beam splitter 6,
These can be arranged at the pupil position of the fθ lens 9 while avoiding mechanical interference of the first and second galvano scanners 4 and 5.

FIG. 3 shows that the laser light of the first polarization component due to the linearly polarized light, that is, the P polarization component from the first polarization beam splitter 2 passes through the second polarization beam splitter 6, and the second (1) / 4) The process of being converted into circularly polarized light by the λ plate 16 and entering the fθ lens 9 is shown.

Further, FIGS. 4 and 5 show a case where a part of the S-polarized component applied to the work 3 is reflected there and returned in the reverse path. That is, the S-polarized component due to the circularly polarized light reflected by the work 3 is the second (1/4) λ plate 1
There is a case where an optical path is formed which is converted into linearly polarized light at 6, is reflected by the second polarization beam splitter 6, and returns to the first polarization beam splitter 2 via each galvano mirror of the second galvano scanner 5. . However, in the present embodiment, since there is the second mask 12, such return light is cut by the second mask 12. Therefore, the return light from the work 3 does not reach the laser oscillator 1 and adversely affect it. This also applies to the second and third embodiments described later.

When the laser light incident on the f.theta. Lens 9 is incident parallel to the central axis of the f.theta. Lens 9, the laser light emitted from the f.theta. Lens 9 is irradiated at an angle to the horizontal plane of the work 3. Tend to Then, when the laser light is incident on the work 3 at an angle, the pattern of the irradiated laser light is deformed into an elliptical shape instead of a circular shape. This means that the shape of the hole formed in the work 3 is not a perfect circle but an ellipse. However, in the present embodiment, the two laser beams from the second polarization beam splitter 6 are respectively f
The light is incident not obliquely to the central axis of the θ lens 9 but obliquely.
The laser light thus obliquely incident is emitted by the fθ lens 9 so as to be parallel to the central axis thereof. As a result, the work 3 can be drilled in a nearly perfect circle.

A second embodiment of the present invention will be described with reference to FIG. Also in this embodiment, the first and second galvano scanners 4 and 5 are respectively arranged at the entrance pupil positions of the fθ lens 9. The difference from the first embodiment of FIG. 1 is that the first and second collimating lenses 7 and 8 are omitted. Other elements are the same as those in the first embodiment, but operationally, interference may occur between the two types of laser light as compared with the first embodiment.

A third embodiment of the present invention will be described with reference to FIG. In this embodiment, the constituent elements are almost the same as those of the first embodiment shown in FIG. 1, but the first and second embodiments are the same.
The laser beams from the collimator lenses 7 and 8 are always incident on the second polarization beam splitter 6 at a constant angle. Further, the second (1/4) λ plate 16 and f
The lens 18 is arranged between the θ lens 9 and the laser light from the first and second galvano scanners 4 and 5 so that the fθ lens 9
A virtual image is formed at the entrance pupil position of. According to this mode, since the laser light from the first and second galvano scanners 4 and 5 is always incident on the second polarization beam splitter 6 at the same incident angle, no matter how it is oscillated, It is also superior to the first embodiment in that the change in the rate does not occur.

The type of the laser oscillator used in the present invention is not particularly limited, but for example, a CO ₂ laser oscillator, a YAG laser oscillator or the second and third harmonics thereof, a YLF laser oscillator or the same. The second and third harmonics are suitable. Further, examples of the work symmetrical with respect to processing include a resin layer on a printed wiring board and a ceramic substrate, and the processing is not limited to drilling.

[0039]

As described above, according to the present invention, two types of laser beams are made incident on one fθ lens to perform simultaneous processing, thereby improving the processing speed and fθ.
By arranging the polarization beam splitter on the incident side of the lens, it is possible to provide a laser processing apparatus that is not subject to positional restrictions of optical system elements such as a galvano scanner as much as possible.

[Brief description of drawings]

FIG. 1 is a diagram schematically showing a main part configuration of a laser processing apparatus according to a first embodiment of the present invention.

2A and 2B are views for explaining the optical paths of the P-wave polarization component and the S-wave polarization component and the actions of the first and second (1/4) λ plates in the configuration of FIG.

FIG. 3 is a diagram for explaining the action of a second polarization beam splitter in the configuration of FIG. 1 for a P-wave polarization component.

FIG. 4 is a diagram for explaining a path of reflected light from a work in the configuration of FIG. 1 for an S-wave polarization component.

5 is a diagram for explaining an additional function performed by the second mask with respect to the S-wave polarization component of the reflected light from the work shown in FIG.

FIG. 6 is a diagram schematically showing a main part configuration of a laser processing apparatus according to a second embodiment of the present invention.

FIG. 7 is a diagram schematically showing a main part configuration of a laser processing apparatus according to a third embodiment of the present invention.

FIG. 8 is a diagram schematically showing a main configuration of a laser processing apparatus according to a method proposed by the present inventor.

[Explanation of symbols]

1 Laser oscillator 2 First polarization beam splitter 3, 31, 32 work 4, 26 First Galvano Scanner 5, 27 Second Galvano Scanner 6 Second polarization beam splitter 7,8,13,14 Collimating lens 9,25 fθ lens 11, 12, 20 mask 15, 16 (1/4) λ plate 17,33 XY stage 18 lenses 21 Half mirror 22 Dichroic mirror 23, 24 mirror 28 Third Galva Mirror 29 Fourth Galvano Scanner 36 First CCD camera 38 Second CCD camera

─────────────────────────────────────────────────── --- Continuation of the front page (56) Reference JP-A-4-354532 (JP, A) JP-A-6-246470 (JP, A) JP-A-6-663 (JP, A) JP-A-9- 29467 (JP, A) JP 2000-190087 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) B23K 26/00-26/42

Claims (13)

(57) [Claims] 1. A laser beam from a laser oscillator is divided into a first polarization component and a second polarization component by a first polarization beam splitter, and the first polarization component is guided to a first galvano scanner, The second polarized component is guided to a second galvano scanner, and the first galvano scanner and the second galvano scanner are connected.
The laser beams from the galvano scanner of the above are respectively introduced into the second polarization beam splitter, and the two types of laser beams are superposed so as to be on a common optical path, and the two types of laser beams from the second polarization beam splitter are overlapped. Light is applied to different positions of the workpiece through the fθ lens to perform simultaneous processing, and the first galvano scanner and the
Between the second polarization beam splitter, the second galvanic
Between the scanner and the second polarization beam splitter
The first and second collimating lenses are arranged respectively,
The laser light from the first and second galvano scanners is
Form a virtual image inside the second polarization beam splitter
A laser processing method characterized by the above . 2. The laser processing method according to claim 1.
Te, before Symbol first, respectively the second optical scanner, a laser processing method, characterized in that arranged in the entrance pupil position of the fθ lens. 3. Laser light from a laser oscillator is first polarized.
First polarization component and second polarization by the light beam splitter
The first polarized component and the first galvanic component
The second polarized component is guided to the second galvanos.
The first galvano scanner, the second
The laser light from the galvano scanner of
The two types of laser light can be
The second polarization beam is overlapped so that it is on the common optical path.
The two types of laser light from the optical splitter
Simultaneous irradiation by irradiating different positions of the workpiece through the lens
The first galvano scanner and the
Between the second polarization beam splitter, the second galvanic
Between the scanner and the second polarization beam splitter
The first and second collimating lenses are arranged respectively,
The laser light from the first and second collimating lenses is
The second polarization beam splitter is always set at a constant angle.
Incident on the second polarization beam splitter
By disposing a lens between the fθ lens and the fθ lens,
The laser light from the galvano scanner 2 is the fθ lens.
A laser processing method characterized in that a virtual image is formed at the entrance pupil position of . 4. A laser oscillator, and a laser beam from the laser oscillator having a first polarization component and a second polarization component.
And a first polarization beam splitter for dividing the first polarization component into a desired polarization position on the workpiece.
To swing in at least one axis so that
The galvano scanner and the second polarized component are placed at a predetermined position on the workpiece.
No. 1 for shaking in at least one axis to irradiate
Second galvano scanner and the first and second galvano scanners from the first and second galvano scanners.
Superimpose the two polarization components so that they are on the common optical path.
The second polarization beam for emitting two types of laser light
And beam splitter, two of the laser beam from the second polarization beam splitter
And an fθ lens for irradiating the workpiece with
Seen, the first polarization component from the first optical scanner
Projecting into the second polarization beam splitter as a virtual image
First collimating lens for causing the second polarization component from the second galvano scanner
Projecting into the second polarization beam splitter as a virtual image
And a second collimating lens for
And a laser processing device. 5. The laser processing apparatus according to claim 4,
The first and second galvano scanners are
The two polarized light components are respectively oscillated in the biaxial directions orthogonal to each other.
Laser processing apparatus, characterized in that cause et. 6. A laser processing apparatus according to claim 4 or 5.
In the first polarization beam splitter
Laser light is emitted to the emission sides of the first and second polarization components, respectively.
First and second masks for defining the cross-sectional shape of the
A laser processing device characterized by being processed. 7. A laser according to any one of claims 4 to 6.
In the processing device, the first polarization beam splitter
The incident side and the outgoing side of the second polarization beam splitter are
For converting linearly polarized light into circularly polarized light, respectively,
Laser processing apparatus characterized by optical means is placed. 8. A laser according to any one of claims 4 to 7.
In the processing apparatus, the first and second galvano scanners
And a laser processing device , each of which is arranged at the entrance pupil position of the fθ lens . 9. A laser according to any one of claims 4 to 8.
In the processing device, the incidence of the first galvano scanner
The third collimating lens is arranged on the side of
A fourth collimating lens is on the incident side of the Lubano scanner
A laser processing device characterized by being arranged . 10. A laser oscillator, and a laser beam from the laser oscillator having a first polarization component and a second polarization component.
And a first polarization beam splitter for dividing the first polarization component into a desired polarization position on the workpiece.
To swing in at least one axis so that
The galvano scanner and the second polarized component are placed at a predetermined position on the workpiece.
No. 1 for shaking in at least one axis to irradiate
Second galvano scanner and the first and second galvano scanners from the first and second galvano scanners.
Superimpose the two polarization components so that they are on the common optical path.
The second polarization beam for emitting two types of laser light
And beam splitter, two of the laser beam from the second polarization beam splitter
And an fθ lens for irradiating the workpiece with
Seen, wherein the first optical scanner second polarization beam
Between the second galvano scanner and the second printer.
The second and the second polarization beam splitters are respectively connected to the first and second
The collimating lens of the
The laser light from the lens is always forwarded at a constant angle.
Note that the second polarization beam splitter and the fθ lens are made to enter the second polarization beam splitter.
A lens is arranged between the first and second galvano scans.
Laser image from the virtual image at the entrance pupil position of the fθ lens.
The laser processing apparatus is characterized in that it is formed . 11. The laser processing apparatus according to claim 10.
There are the in the first polarization beam splitter first
Cross sections of the laser light on the emission sides of the first and second polarization components, respectively.
The first and second masks for defining the shape are arranged
Laser processing apparatus characterized by there. 12. A laser according to claim 10 or 11.
In the processing device, the first polarization beam splitter
The incident side and the outgoing side of the second polarization beam splitter are
For converting linearly polarized light into circularly polarized light, respectively,
A laser processing apparatus, wherein an optical means is arranged . 13. The method according to claim 10,
In the laser processing apparatus, the first galvano scanner
A third collimating lens is arranged on the incident side of
On the incident side of the second galvanometer scanner, a fourth collimator
Laser processing equipment characterized in that
Place