JP5105717B2 - Laser processing equipment - Google Patents

Laser processing equipment Download PDF

Info

Publication number
JP5105717B2
JP5105717B2 JP2005149892A JP2005149892A JP5105717B2 JP 5105717 B2 JP5105717 B2 JP 5105717B2 JP 2005149892 A JP2005149892 A JP 2005149892A JP 2005149892 A JP2005149892 A JP 2005149892A JP 5105717 B2 JP5105717 B2 JP 5105717B2
Authority
JP
Japan
Prior art keywords
galvanometer
mirror
axis
processing apparatus
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2005149892A
Other languages
Japanese (ja)
Other versions
JP2006326603A (en
Inventor
信高 小林
祥瑞 竹野
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2005149892A priority Critical patent/JP5105717B2/en
Publication of JP2006326603A publication Critical patent/JP2006326603A/en
Application granted granted Critical
Publication of JP5105717B2 publication Critical patent/JP5105717B2/en
Application status is Active legal-status Critical
Anticipated expiration legal-status Critical

Links

Images

Description

  The present invention relates to a scanning method of a laser processing apparatus that scans a laser beam with a beam scanning mechanism.

  An optical system of a laser processing apparatus having a beam scanning mechanism is configured to reflect a laser beam emitted from a laser oscillator with a galvanometer as a beam scanning mechanism, and to position and irradiate the workpiece with a condensing lens for scanning. Take. A quadrangle (laser beam irradiation area) on the workpiece is a scannable area limited by the galvanometer and the scanning condenser lens. The entire area of the workpiece can be processed by performing a two-dimensional scan (hereinafter referred to as XY scan) on the XY plane of the table holding the workpiece by a table driving mechanism.

  Both the galvanometer and the table drive mechanism are XY scan mechanisms, but the galvanometer has a scanable area limited to several tens of mm square and is narrower than the driveable area of the table drive mechanism. The reason for adopting the above scanning method is to increase the speed of the laser processing apparatus.

  The table driving mechanism has a slow operation speed instead of a wide drivable area. On the other hand, the galvanometer has a high operating speed instead of a small scanable area. A scanable area is processed at high speed by a galvanometer. Thereafter, the table is scanned by the size of the scannable area. High-speed machining is performed again using a galvanometer. By repeating this series of operations sequentially, the processing time of the entire area of the workpiece is shortened.

  Various speedups of the standard type laser processing apparatus as described above have been devised. For example, with the same idea as the relationship between the galvanometer and the table drive mechanism described above, it has been proposed to use an acousto-optic deflection element that can scan faster than the galvanometer, instead of a narrower scan area than the galvanometer. (Patent Document 1). A long distance scan is performed with a table, a medium distance scan is performed with a galvanometer, and a short distance scan is performed with an acousto-optic deflection element. Thereby, the processing time of the whole workpiece is shortened.

  In addition, a proposal has been made to use a fine movement mirror operated by a piezoelectric element instead of an acousto-optic deflection element (Patent Document 2). Furthermore, the XY scan optical system part of the standard type laser processing apparatus, a plurality of galvanometers and a condensing lens for scanning are arranged in parallel, and the laser beam emitted from the laser oscillator is dispersed or chopped, and each A method of leading to an XY scan optical system has also been proposed (Patent Document 3). In this case, if two are arranged in parallel, twice the machining speed is obtained, and if three are arranged in parallel, a three times machining speed is obtained.

The galvanometer and the table driving mechanism in the above-mentioned standard type laser processing apparatus are both XY scanning mechanisms, but the scanning axial directions are the same. In contrast, a mechanism has been proposed in which the scan axis direction of the galvanometer and the scan axis direction of the table drive mechanism have an inclination, and this inclination is adjusted in accordance with the machining pattern so that the machining time is minimized (patent) Reference 4).
JP 2003-136270 A JP 2003-88986 A Japanese Patent Laid-Open No. 10-323785 JP 2002-35975 A

  However, in an optical system that scans the XY plane two-dimensionally, if an acousto-optic element that can scan faster than a galvanometer or a fine movement mirror using a piezoelectric element is used, only a short-distance scan can be performed at a high speed. High speed cannot be achieved by machining with many scans.

  Further, when a plurality of galvanometers and scanning condensing lenses are arranged in parallel, the apparatus cost becomes high. In addition, the size of the laser processing apparatus is increased. Furthermore, in the setting of the scan axis direction according to the processing pattern, there is a problem that the speed can be achieved only with a specific processing pattern, and the effect cannot be obtained with all the processing patterns.

  An object of the present invention is to provide a laser processing apparatus that uses a galvanometer and a table driving mechanism and is small in size, low-cost, and capable of high-speed scanning without being affected by a scanning distance and a processing pattern.

  The laser processing apparatus of the present invention is a laser processing apparatus that scans a laser beam oscillated from a laser oscillator and guides the laser beam to the workpiece to process the workpiece. This laser processing apparatus includes at least two galvanometers each having a galvanometer mirror provided on each axis for scanning a laser beam, and the workpiece is processed from the laser oscillator through the first galvanometer mirror and the second galvanometer mirror. At least one of the optical path to the first galvanometer and the arrangement of the first galvanometer and the second galvanometer, so that the area of the portion of the first and second galvanometer mirrors hit by the laser beam is reduced. An irradiation size suppression mechanism is provided. The beam irradiation size suppression mechanism makes the incident angle and the reflection angle of the laser beam at the two galvanometer mirrors be 45 degrees or less for both the first and second galvanometer mirrors. Here, in laser processing, a single pulse, a plurality of pulses, or a continuous oscillation laser beam is two-dimensionally scanned on a workpiece surface, positioned and irradiated, and the workpiece is burned, melted, sublimated, or discolored. Cutting, drilling, welding, heat treatment, or marking.

  As described above, by making the incident angle and reflection angle at the two galvanometer mirrors 45 degrees or less by the action of the beam irradiation size suppression mechanism, the irradiation surface of the laser beam in the galvanometer mirror is not increased more than necessary, and The area of the galvanometer mirror can be reduced without protruding from the galvanometer mirror. When the incident angle and the reflection angle exceed 45 deg, the irradiated area increases even if the cross-sectional size of the laser beam is finite, and the area of the galvanometer mirror must be increased in order to eliminate the protrusion of the laser beam. As a result of the incident angle and the reflection angle being set to 45 degrees or less, the moment of inertia can be kept small, and high-speed scanning can be performed at low cost while being small. Note that, in normal incidence and vertical reflection described later, both the incident angle and the reflection angle are zero degrees.

  By using the laser processing apparatus of the present invention, high-speed laser processing can be realized without being affected by the scan distance and the processing pattern, and with a small size and low cost.

Next, an embodiment of the present invention will be described with reference to the drawings.
(Embodiment 1)
FIG. 1 is a diagram showing a laser processing apparatus provided with a beam scanning mechanism according to Embodiment 1 of the present invention. In FIG. 1, a laser beam 12 emitted from a laser oscillator 10 is reflected by a galvanometer 14 which is a beam scanning mechanism, and is positioned and irradiated on a workpiece 17 by a condensing lens 16 for scanning. A square on the workpiece 17 is a scannable area 18 limited by the galvanometer 14 and the scanning condenser lens 16. The table 19 holding the workpiece 17 is subjected to two-dimensional scanning (hereinafter referred to as XY scanning) on the XY plane by the table driving mechanism 20, whereby the entire area of the workpiece 17 can be processed.

  The galvanometer 14 and the table drive mechanism 20 are both XY scan mechanisms, but the galvanometer 14 has a scanable area 18 that is limited to a size of several tens of mm square and is narrower than the driveable area of the table drive mechanism 20. The reason for adopting the above scanning method is to increase the speed of the laser processing apparatus.

  The table drive mechanism 20 has a slow operation speed instead of a wide drivable area. On the other hand, the galvanometer 14 has a high operating speed instead of a narrow scanable area 18. The scannable area 18 is processed at high speed by the galvanometer 14. Thereafter, the table 19 is scanned by the size of the scannable area 18. High-speed machining is again performed by the galvanometer 14. By sequentially repeating this series of operations, the processing time of the entire workpiece 17 is shortened. In the following embodiments of the present invention, the laser processing apparatus shown in FIG. 1 is used as a basic type unless otherwise specified for at least the biaxial galvanometer portion.

  The points in Embodiment 1 of the present invention are as follows. In order to increase the speed of the above-described standard type laser processing apparatus, it is desirable to increase the speed of the galvanometer itself, which is a beam scanning mechanism, but the operating speed of the galvanometer is approaching the limit in terms of mechanism design. Here, by reducing the galvanometer mirror at the tip of the galvanometer, the moment of inertia of the galvanometer mirror can be reduced and the speed can be improved. However, simply reducing the size also reduces the size of the laser beam reflected by the galvanometer mirror. As a result, the beam diameter of the condensing point positioned on the workpiece is increased, the processing resolution is lowered, and the processing quality is lowered. Therefore, in order to ensure good processing resolution, it is only necessary to reduce the size of the galvano mirror to the minimum and to keep the moment of inertia small while securing the required size of the laser beam. In the first embodiment of the present invention, the beam irradiation size suppression mechanism is a mechanism that makes the incident angle and reflection angle of the first and second galvanometer mirrors 15a and 15b be 30 deg to 35 deg.

  FIG. 2 shows the arrangement of two galvanometer mirrors that perform XY scanning in the laser processing apparatus according to Embodiment 1 of the present invention. FIG. 2B shows a state where the XY plane is being scanned by overwriting, and FIG. 2A shows a state where the galvano deflection angle is 0 deg. The laser beam 12 incident from the direction of the arrow 11 in the figure is scanned in the Y-axis direction on the workpiece surface (not shown) by one galvanometer mirror 15a. The laser beam 12 reflected by the galvanometer mirror 15a is scanned in the X-axis direction on the workpiece surface by the other galvanometer mirror 15b.

  Moreover, FIG. 3 is a figure which shows the galvanometer mirror of the comparative example shown for a comparison. In FIG. 3, the shape of the galvanometer mirror is represented by an ellipse or a shape close to an ellipse with a rectangular corner. The reason for using an ellipse or a shape close to a rectangular ellipse is to keep the moment of inertia of the galvanometer mirror as small as possible.

  3A and 3B, in each of the two galvanometer mirrors 15a and 15b, the laser beam 12 has a reflection angle of 45 deg (hereinafter referred to as a reflection fold angle of 90 deg) and an angle of reflection fold of 90 deg. On the other hand, in FIG. 2A, the reflection folding angle is set to an acute angle of 60 deg to 70 deg. By setting the reflection folding angle to an acute angle, the moment of inertia of the galvanometer mirror 15 can be further reduced as described below. If the reflection folding angle exceeds 70 deg, the moment of inertia is not sufficiently reduced, and if it is less than 60 deg, interference of the laser beam or the like occurs, resulting in inconvenience.

  FIG. 4A shows the shape of the galvano mirror 15a of FIG. 2 when the reflection turn-back angle of the galvano mirror 15a (hereinafter referred to as Y-axis mirror 15a) scanned in the Y-axis direction is 62 degrees. FIG. 4B also shows the shape of the galvano mirror 15a of FIG. 3 when the Y-axis mirror 15a has a reflection folding angle of 90 deg. FIG. 4C shows the shape of the galvano mirror 15b of FIG. 2 when the reflection turn-back angle of the galvano mirror 15b (hereinafter referred to as the X-axis mirror 15b) in the X-axis direction scan is 66 degrees. Further, FIG. 4 (d) shows the shape of the galvano mirror 15b of FIG. 3 when the reflection turn-back angle of the X-axis mirror 15b is 90 deg.

  The dimensions in the figure are as follows: the center interval between the two galvanometer mirrors 15 is 35 mm, the required size of the reflected circular laser beam 12 is 30 mm in diameter, the galvano deflection angle is ± 8 deg, and the beam polarization angle is ± 16 deg. This is the dimension required for each galvanometer mirror 15. Since it is a reflection phenomenon by a simple mirror, the deflection angle of the beam is twice the deflection angle of the galvanometer mirror 15. In FIG. 4, the holding margin for holding the galvanometer mirror 15 is omitted.

The moment of inertia of the galvanometer mirror shown in FIGS. 4A to 4D is approximately expressed as follows when the galvanometer mirror is relatively thin as several mm.
(Moment of inertia of Y-axis mirror 15a having a reflection folding angle of 62 deg)
= 84700tρ [g · mm 2 ]
(The moment of inertia of the Y-axis mirror 15a with a reflection folding angle of 90 deg)
= 183000tρ [g · mm 2 ]
(Moment of inertia of X-axis mirror 15b having a reflection folding angle of 66 deg)
= 234,000 tρ [g · mm 2 ]
(Inertia moment of the X-axis mirror 15b having a reflection folding angle of 90 deg)
= 494000tρ [g · mm 2 ]
Here, t is the thickness [mm] of the galvanometer mirror, and ρ is the density [g / mm 3 ] of the galvanometer mirror material.

  FIG. 5 is a graph showing the relationship between the reflection folding angle and the moments of inertia of the two galvanometer mirrors when the Y-axis mirror 15a and the X-axis mirror 15b have the same reflection folding angle. However, the moment of inertia on the vertical axis indicates the value of the coefficient before tρ in the above formula (that is, the coefficient of the expression using the thickness t of the galvanomirror and the density ρ of the material as variables). In addition, these moments of inertia are the same as above when the center distance between the two galvanometer mirrors 15 is 35 mm, the size of the laser beam 12 is 30 mm in diameter, the galvano deflection angle is ± 8 deg, and the beam polarization angle is ± 16 deg. This is calculated from the dimensions required for the Y-axis mirror 15a and the X-axis mirror 15b.

  In the graph of FIG. 5, the crosses in the graph of FIG. 5 indicate that in the Y-axis mirror, the laser beam 12 incident on the Y-axis mirror 15a interferes with the X-axis mirror 15b when the reflection turn-back angle is 60 degrees or less. In the X-axis mirror, when the reflection turn-back angle is 65 degrees or less, the laser beam 12 scanned by the X-axis mirror 15b and emitted to the condensing lens (not shown) interferes with the Y-axis mirror 15a. It means that. That is, it can be seen that when the reflection turn-back angle becomes too acute, the predetermined diameter φ30 mm of the laser beam 12 cannot be achieved.

  In this way, by setting the reflection folding angle to an acute angle of 60 deg to 70 deg, the moment of inertia of the galvanometer mirror can be suppressed to about half compared to the case where the reflection folding angle is 90 deg. If the galvanometer shown in the standard type laser processing apparatus has the same performance and operation speed, the processing speed of the laser processing apparatus becomes faster when the moment of inertia of the galvanometer mirror is smaller.

  When the galvanometer mirror shown in FIGS. 4A to 4D is created, and the number of times that positioning can be repeated with a 1 mm pitch on the workpiece surface with the same positioning accuracy is defined as the scanning speed, the scanning speed is measured. 3, about 775 times / second and about 1180 times / second were achieved with the optical system of FIG.

(Embodiment 2)
2 and 3, since the X-axis mirror 15b needs to reflect the laser beam 12 scanned by the Y-axis mirror 15a without spilling, the size (area) is always larger than the Y-axis mirror 15a, and the moment of inertia Also grows. If the moment of inertia of the X-axis mirror 15b can be reduced, the speed of the laser processing apparatus can be improved more effectively.

  FIG. 6 shows an optical system when a lens is inserted between the Y-axis mirror 15a and the X-axis mirror 15b. In FIG. 6A, the laser beam 12 scanned by the Y-axis mirror 15a continues to irradiate the same point without moving, although the incident angle changes with respect to the X-axis mirror 15b by the action of the lens 21a. By suppressing the shake of the laser beam 12 due to scanning by the lens 21a, the size and moment of inertia of the X-axis mirror 15b can be suppressed to a small value. The beam irradiation size suppression mechanism also has a function of setting the reflection folding angle at the Y-axis mirror (first galvanometer mirror) 15a and the X-axis mirror (second galvanometer mirror) 15b to 90 degrees or less. In particular, the lens 21a functions as a beam irradiation size suppression mechanism for the X-axis mirror (second galvanometer mirror) 15b.

  In FIG. 6A, the lens 21a has a substantially symmetrical structure. Therefore, as shown in FIG. 6B, the optical path is turned back by the reflection mirror 22, and the Y-axis mirror 15a and the X-axis mirror 15b are shifted in the vertical direction with respect to the optical axis of the lens 21b, respectively, thereby FIG. ), The optical system can be downsized. The number of lenses can be reduced by half, and the cost can be reduced.

  Similar to the first embodiment, the required size of the reflected circular laser beam 12 is 30 mm in diameter, the galvano deflection angle is ± 8 deg, and the beam polarization angle is ± 16 deg. As a result of the measurement, a scanning speed of about 1.4 times that of the optical system of FIG. 3 was achieved at about 1100 times / second.

  In the optical system of FIG. 6, for the sake of simplicity, the reflection folding angles of the two galvanometer mirrors 15a and 15b are both set to 90 degrees. However, as shown in FIG. 2, the galvanometer and galvanometer mirror 15 are arranged so that the reflection folding angle is an acute angle. If it arrange | positions, the processing speed of a laser processing apparatus will improve further.

(Embodiment 3)
In FIG. 2, when each of the reflection fold angles of the two galvanometer mirrors 15a and 15b that perform XY scanning is set to an acute angle of 60 degrees to 70 degrees, the moment of inertia of the galvanometer mirrors 15a and 15b can be suppressed, and as a result, the laser processing apparatus It has been shown that speed improvements can be achieved. If an acute angle of 60 degrees or less can be obtained, the moment of inertia can be further suppressed. Ideally, it is desirable that the reflection fold angle is 0 deg at which the laser beam 12 is perpendicularly incident and vertically reflected with respect to the galvanometer mirrors 15a and 15b.
However, it is difficult to achieve a reflection folding angle of 60 degrees or less with the structure of FIG. As shown in FIG. 5, when the reflection folding angle is set to 60 degrees or less, the incident laser beam 12 interferes with the X-axis mirror 15b or is scanned by the X-axis mirror 15b and is not shown in the figure. This is because the laser beam 12 emitted to the lens for use interferes with the Y-axis mirror 15a.

  However, if the center distance between the two galvanometer mirrors 15 can be further increased, or the required size of the reflected circular laser beam 12 can be further reduced, a reflection folding angle of 60 degrees or less can be achieved. However, both of these lead to a reduction in the quality of laser processing. In FIG. 2, the center distance between the two galvanometer mirrors 15 may be increased to 35 mm, and the reflected circular laser beam 12 needs to have a diameter of 30 mm. Under such conditions, the minimum value of the reflection folding angle is about 60 deg.

  FIG. 7 is a diagram showing a galvanometer mirror of the laser processing apparatus according to Embodiment 3 of the present invention. In FIG. 7, galvanometer mirrors 15a and 15b that perform XY scanning are optical systems for achieving a reflection folding angle of 0 deg. The Y-axis mirror 15a and the X-axis 15b are arranged to face each other, and a polarization separation optical element 23 and two λ / 4 plates 24a and 24b are provided therebetween. Hereinafter, the operation of this optical system will be described.

  First, linearly polarized light is used for the laser beam 12 and is incident on the polarization separation element 23 as S-polarized light. The laser beam 12 reflected by the polarization separation element 23 is converted into circularly polarized light by the λ / 4 plate 24a and is incident on the Y-axis mirror 15a. The circularly polarized beam reflected by the Y-axis mirror 15 a passes through the λ / 4 plate 24 a again, and is changed to P-polarized light and is transmitted through the polarization separation element 23. The laser beam 12 that has passed through the polarization separation element 23 is changed into circularly polarized light again by the λ / 4 plate 24b in front of the X-axis mirror 15b, and is reflected by the X-axis galvanometer mirror 15b. The circularly polarized beam reflected by the X-axis mirror 15b returns to the S-polarized light by passing through the λ / 4 plate 24b again, so that it is reflected by the polarization separation element 23 and is not shown in the figure. Head to. In order to improve the quality of laser processing, another λ / 4 plate may be inserted between the optical system and the condensing lens, and S-polarized light may be changed to circularly polarized light again.

  As described above, a reflection folding angle of 0 deg can be achieved by using an optical system including a beam irradiation size suppression mechanism including a polarization separation element and two λ / 4 plates. Although the cubic type polarization separation element 23 is used in FIG. 7, a flat plate type polarization separation element may be disposed. However, when a flat plate type polarization separation element is used, since the deflection of the laser beam 12 on the X axis mirror 15b due to the scan of the Y axis mirror 15a becomes larger than in the case of the cubic type, the X axis mirror 15b is also used. Larger moment of inertia. On the other hand, in the cubic type, since the medium having a higher refractive index than air occupies a larger space, the vibration of the laser beam 12 on the X-axis mirror 15b can be reduced. For the same reason, the cubic-type polarization separation element 23 can also suppress the X-axis mirror 15b and reduce the moment of inertia as the refractive index of the material increases.

(Embodiment 4)
FIG. 6 shows that the moment of inertia of the X-axis mirror 15b can be reduced by suppressing the shake of the laser beam 12 on the X-axis mirror 15b by the scanning of the Y-axis mirror 15a by the lenses 21a and 21b. In both galvanometer mirrors 15a and 15b that perform XY scanning, it was shown that the moment of inertia can be similarly suppressed by setting the reflection folding angle to 0 deg.

  By combining these two optical systems, the size of both galvanometer mirrors 15a and 15b that perform XY scanning can be made substantially close to the required size of the laser beam 12. FIG. 8 is a diagram showing a galvanometer mirror of the laser processing apparatus according to the fourth embodiment of the present invention. FIG. 8 shows a new optical system in which two optical systems are combined. Hereinafter, the operation of this optical system will be described.

  In FIG. 8A, the laser beam 12 incident on the polarization separation element 23a as S-polarized linearly polarized light is reflected by the polarization separation element 23a, then reflected by the Y-axis mirror 15a, and returns to the polarization separation element 23a again. . During this time, since the laser beam 12 passes through the λ / 4 plate 24a twice, the laser beam 12 is changed to P-polarized light, and this time passes through the polarization separation element 23a. The laser beam 12 that has passed through the lens 21b is reflected by the reflecting mirror 22, passes through the lens 21b again, and reaches the polarization separation element 23b. Since the laser beam 12 is still P-polarized light at this time, it passes through the polarization separation element 23b, is reflected by the X-axis mirror 15b, and returns to the polarization separation element 23b again. Similar to the reflection by the Y-axis mirror 15a, the laser beam 12 passes through the λ / 4 plate 24b twice during this time, so that it changes to S-polarized light. The laser beam 12 that has become S-polarized light is reflected by the polarization separation element 23b, and travels toward a condensing lens and a workpiece that are not shown. In addition, although illustration is abbreviate | omitted, in FIG. 8A, although the two polarization separation elements 23a and 23b were arranged side by side in the horizontal direction, they can also be arranged side by side in the vertical direction. The polarization separation elements 23a and 23b, the λ / 4 plates 24a and 24b, and the reflection mirror 22 constitute a beam irradiation size suppression mechanism together with the arrangement of the biaxial galvanometer. In the optical system shown in FIG. 8B as well, the corresponding component similarly constitutes the beam irradiation size suppression mechanism.

  FIG. 8B shows that the polarization separation elements 23a and 23b, which were two in FIG. 8A, can be integrated into one. Similarly, the laser beam 12 incident on the polarization separation element 23 as S-polarized linearly polarized light is reflected by the polarization separation element 23 toward the lens 21b. The laser beam 12 that has passed through the lens 21b again by the reflection mirror 22 is scanned by the Y-axis mirror 15a, and then travels back and forth through the lens 21b to return to the polarization separation element 23. During this time, the laser beam 12 has passed through the λ / 4 plate 24a twice, so that it has changed to P-polarized light. The laser beam 12 that has become P-polarized light passes through the polarization separation element 23, is reflected by the X-axis mirror 15b, and returns to the polarization separation element 23 again. During this time, the laser beam 12 has passed through the λ / 4 plate 24b twice, so that it has changed to S-polarized light. The laser beam that has become S-polarized light is reflected by the polarization separation element 23 and travels toward a condensing lens (not shown) and a workpiece. FIG. 8 shows an example in which the optical system of FIG. 6B and the optical system of FIG. 7 are combined, but the optical system of FIG. 6A and the optical system of FIG. 7 are combined in a similar manner. Is also possible.

  In this way, by suppressing the shake of the laser beam 12 on the X-axis mirror 15b due to the scan of the Y-axis mirror 15a and realizing a reflection folding angle of 0 deg, the sizes of both galvanometer mirrors 15a and 15b that perform XY scan can be reduced. Thus, the laser beam 12 can be reduced to the required size. FIG. 9 shows the galvanometer mirror shape in this case. The dimensions in the figure are the dimensions required for the galvanometer mirrors 15a and 15b when the required size of the reflected circular laser beam 12 is φ30 mm in diameter, the galvano deflection angle is ± 8 deg, and the beam polarization angle is ± 16 deg. In addition, the holding cost for holding the galvanometer mirror 15 is omitted.

The moment of inertia of the galvanometer mirror shown in FIGS. 9A to 9B is approximately expressed as follows when the galvanometer mirror is relatively thin as several millimeters.
(Inertia moment of Y-axis mirror 15a with reflection folding angle 0 deg)
= 41000tρ [g · mm 2 ]
(Inertia moment of the X-axis mirror 15b with a reflection folding angle of 0 deg)
= 42700 tρ [g · mm 2 ]
Here, t is the thickness [mm] of the galvanometer mirror, and ρ is the density [g / mm 3 ] of the galvanometer mirror material.

  Looking at the Y-axis mirror 15a, the moment of inertia can be reduced to less than half compared to when the reflection turn-back angle is 62 deg, and less than 1/4 compared to when the reflection fold angle is 62 deg. Looking at the X-axis mirror 15b, the moment of inertia can be reduced to 1/5 or less compared to when the reflection turn-back angle is 62 deg, and to 1/10 or less compared to when the reflection fold angle is 62 deg.

  In this way, the deflection of the laser beam 12 on the X-axis mirror 15b due to the scan of the Y-axis mirror 15a is suppressed by the lenses 21a and 21b, the polarization separation elements 23, 23a and 23b, the λ / 4 plates 24a and 24b, the linearly polarized light Is used to realize vertical incidence and vertical reflection with a reflection folding angle of 0 deg. Thereby, the moment of inertia of the galvanometer mirror 15 can be reduced to 1/4 to 1/10 or less, and the speed improvement of the laser processing apparatus can be achieved.

(Embodiment 5)
The conventional XY scan is an optical system in which two orthogonal galvanometers 14 and a galvanometer mirror 15 are used. The galvanometer 14 capable of scanning in two directions perpendicular to the X axis and the Y axis shown in FIG. 10A covers the entire scannable area 18a, and the surface is processed instead of on a line.

Here, for example, when scanning on the X axis and the Y axis, if the galvano deflection angle that can be swung in the unit minute time Δt is Δθ, the deflection angle of the laser beam 12 that is actually swung is doubled 2Δθ. . As shown in the first embodiment, since the inertia moments of the Y-axis mirror 15a and the X-axis mirror 15b are different, the operation speed is originally different, but for the sake of simplicity, the same operation speed Δθ / Δt is assumed. It is known that the moving distance Δd 0 of the laser beam 12 when scanning on the X-axis and the Y-axis at this time is approximately proportional to the focal length f of the condensing lens 16, and is expressed as follows. Is done.

Δd 0 = C × f × 2Δθ = 2CfΔθ
Here, C in the equation is a proportionality constant.

In such an optical system, when the laser beam 12 is scanned in the diagonal direction of the scannable area 18a which is the quadrangle in FIG. 10A, the Y-axis mirror 15a and the X-axis mirror 15b are scanned by the same distance. Therefore, the distance Δd 0 ′ that can be moved per unit minute time Δt is as follows.

Δd 0 ′ = √2 × Δd 0 ≈2.83 CfΔθ
It can be seen that the scanning speed in the diagonal direction is √2 times larger than the scanning in the axial direction, and the processing speed of laser processing is faster. It can also be seen from the above formula that the moving speed can be increased even when the focal length f of the condenser lens 16 is large. However, if the focal length f is too large, the quality of laser processing will be reduced.

  FIG. 11 is a schematic scanning diagram in the case where three galvano mirrors 15c, 15d, and 15e are used for XY scanning in the laser processing apparatus according to the fifth embodiment of the present invention. In this way, when a three-axis galvanometer that is not orthogonal to each other and forms an angle of 60 degrees with respect to the two-axis scan of the X axis and the Y axis is used, the scanable area 18b is as shown in FIG. Hexagonal. The axes when the scannable area 18a is a quadrangle as shown in FIG. 10A are called the X axis and the Y axis, whereas the scannable area 18b is a hexagon as shown in FIG. 10B. In some cases, the respective axes are referred to as the L axis, M axis, and N axis. Hereinafter, a case where such a hexagonal area is scanned will be described.

Similar to the above-described scanning by the biaxial galvanometer, the movement distance per unit minute time Δt per axis is assumed to be the same as Δd 0 = 2CfΔθ. Next, for example, when the laser beam 12 is scanned in the L-axis direction on the workpiece surface, not only the L-axis galvanometer 1 axis but also the M-axis and N-axis can be deflected simultaneously for 3 axes. . Since the angle formed by the L-axis and the M-axis, and the L-axis and the N-axis is 60 deg, the moving distance Δd per unit minute time Δt is as follows.

Δd = 2 × Δd 0 = 4CfΔθ
The above values are the same for not only scanning in the L-axis direction but also scanning in the M-axis direction and N-axis direction. That is, in the scanning in the axial direction, the moving speed is doubled in the case of the 3-axis scanning as compared with the 2-axis scanning.

  Further, for example, in the scan in the middle direction between the L axis and the M axis, the movement distance Δd ′ per minute unit time Δt is as follows because the angle formed by the L axis and the M axis is also 60 deg. .

Δd ′ = √3 × Δd 0 ≈3.46 CfΔθ
That is, a moving speed of about 1.22 times the moving distance in the diagonal direction of the biaxial scan is achieved.

In the above-described three-axis scanning optical system, when the distance that can be scanned in the axial direction is D as in the case of the two-axis scanning as shown in FIG. 10, the scanning is performed just in the middle direction between the L-axis and the M-axis. The galvano deflection angle is required to be the largest, which is as follows compared to the case of biaxial scanning.
(Maximum galvano deflection angle of 2-axis scan): (Maximum galvano deflection angle of 3-axis scan) = 3: 2
The area ratio of the scannable area is as follows.
(Area area of 2-axis scan): (Area area of 3-axis scan) = 1: √3 / 2≈1: 0.86
That is, since an area of √3 / 2 is covered with a galvano deflection angle of approximately 2/3, for example, in order to realize laser processing of the same area as the scannable area 18a by the biaxial scan, The maximum galvano deflection angle only has to be swung up to 2/3 × 2 / √3≈0.77. In the first embodiment, the maximum galvano deflection angle is set to ± 8 deg as an example, but in the case of the triaxial scan in the second embodiment, the same area is obtained with a deflection angle of ± 8 deg × 0.77≈ ± 6.2 deg. Thus, the scannable area 18b can be secured.

  In addition, as shown in FIG. 12, the hexagonal area 18b formed by the triaxial scan can fill the entire work piece 17 with no gap, like the square 18a formed by the biaxial scan. For example, considering a 4-axis scan that is a further development of the 3-axis scan, the octagonal area formed by the 4-axis scan cannot be packed without gaps, so the areas are overlapped. The need arises and waste occurs, but in the case of a hexagon, such waste does not occur and it is efficient.

  Up to now, it has been assumed that the operation speed per axis is the same in both the 2-axis scan and the 3-axis scan. However, in practice, the moment of inertia of the galvanometer mirror 15 at the tip of the galvanometer 14 varies depending on the axis, so that the operation speed varies. Considering the difference in motion speed for each axis, prioritize each axis, that is, a fast motion axis scans a longer distance, and a slow motion axis scans a shorter distance. Thus, the speed of the entire beam scanning mechanism can be maintained high.

  In the above case, the scannable area 18a by the biaxial scan in FIG. 12A is a rectangle, and the scannable area 18b by the triaxial scan in FIG. 12B is a flat hexagon. . In either case, the entire work piece 17 can be packed without any gaps.

  Further, as shown in FIG. 13, this three-axis scan can be applied to a scan of a table 19 holding a workpiece 17. That is, similarly to the beam scanning mechanism by the galvanometer 14, the angle formed between the table driving mechanisms 20 is set to 60 degrees, and the table 19 is scanned. Like the beam scanning mechanism, the workpiece 17 can be scanned at a moving speed of 1.22 to 2 times, and the maximum stroke is approximately 0.77 times longer, and the workpiece 17 having the same size as the conventional one is machined. It becomes possible.

  As described above, the galvanometer 14 and the table driving mechanism 20 that two-dimensionally scans the XY plane are scanned by three axes, which is one more axis than before, so that the beam moving speed and the table moving speed are 1.22 to 2 times. Improvement can be achieved. In the beam scanning mechanism using the galvanometer 14, the optical system for suppressing the moment of inertia of the galvanometer mirror 15 described in the first to fourth embodiments and the three-axis scanning of the fifth embodiment are combined to provide a laser processing apparatus. Further speed improvements can also be achieved.

(Embodiment 6)
In the sixth embodiment, a scanning method for improving the table moving speed without increasing the number of axes of the table driving mechanism 20 is provided. As described in Japanese Patent Application Laid-Open No. 2002-35975, conventionally, both the galvanometer and the table driving mechanism have the same scanning axial direction as in the standard type. In such a case, as shown in FIG. 14A, when laser processing is performed while repeatedly moving the scannable area 18 of the galvanometer 14, either X-axis or Y-axis table drive mechanism 20 is used for table movement. Only one of them is used, and in fact, the other axis is not working.

  FIG. 15 is a schematic diagram of table scanning in the laser processing apparatus according to the sixth embodiment of the present invention. As shown in FIG. 15, when the scan axis direction of the table driving mechanism 20 is inclined 45 degrees with respect to the scan axis direction of the galvanometer 14 (or with respect to the side of the square scanable area 18), as shown in FIG. When the laser processing of the scannable area 18 is finished and the table is moved to the next area 18, it can be seen that both the X-axis and Y-axis table drive mechanisms 20 function.

  In this case, the movement direction of the table is exactly the direction between the X axis and the Y axis table drive mechanism 20, and the same amount of table movement as in FIG. It can be seen that the movement distance of the X-axis and Y-axis table drive mechanism 20 may be 1 / √2 times the distance. That is, the table moving speed can be improved by √2.

  In the scan of the table 19 holding the workpiece 17, the shape of the scannable area 18 and the area 18 are packed in the entire area of the workpiece 17 without a gap even in the case of a two-axis scan with one axis instead of a three-axis scan. Considering the operation at the time, if the scan axis direction of the table driving mechanism 20 is inclined 45 degrees with respect to the scan axis direction of the galvanometer 14, a substantial improvement in the table moving speed can be achieved.

(Embodiment 7)
The seventh embodiment of the present invention provides a scanning method that extends the beam movement distance on the workpiece 17 at the same galvanometer deflection angle without increasing the number of axes of the galvanometer 14. FIG. 16 is a schematic diagram of a beam scanning mechanism in the laser processing apparatus according to the seventh embodiment. For simplicity, FIG. 16A shows only the Y-axis direction scan, and the operation will be described below.

  It is assumed that the laser beam 12 is linearly deflected and is incident as P-polarized light on the flat plate type polarization separation element 25a. The laser beam 12 that has passed through the polarization separation element 25a passes through the λ / 4 plate 26a, changes to circularly polarized light, and is reflected by the Y-axis mirror 15a. Since the reflected laser beam 12 passes through the λ / 4 plate 26a again, it is now changed to S-polarized light with respect to the polarization separation element 25a, and is then reflected. The laser beam 12 reflected by the polarization separation element 25a is again reflected and returned by the Y-axis mirror 15a, but during this time, the laser beam 12 reciprocates again through the λ / 4 plate 26a. The laser beam 12 that has become P-polarized light passes through the polarization separation element 25a.

  Here, the laser beam 12 is incident on and reflected by the same galvanometer mirror 15a twice. By reflecting twice in this manner, the beam deflection angle 4Δθ that is four times as large as the galvano deflection angle that can be swung in the same unit minute time Δt as described above is Δθ. That is, a double moving speed can be achieved without increasing the number of axes of the galvanometer 14.

  In order to perform XY scanning, the laser beam 12 incident as P-polarized light on the first Y-axis mirror 15a returns to P-polarized light again when reflected and emitted twice. It is necessary to rotate the polarization direction by 90 degrees before entering the mirror 15b. That is, as shown in FIG. 16B, a λ / 2 plate 27 may be inserted between the galvanometer mirrors 15a and 15b for the double-angle scan.

  In FIG. 16, flat-type polarization separation elements 25a and 25b are used, but the same effect can be obtained with a cubic-type polarization separation element. However, in the case of the cubic type, the distance from the galvanometer mirror 15 must be wide. For this reason, the deviation of the irradiation position on the galvano mirror 15 between the laser beam 12 reflected for the first time and the laser beam 12 reflected for the second time becomes large, and when both the laser beams 12 are not spilled, the galvano The mirror 15 becomes large and the moment of inertia becomes large. In order to suppress the moment of inertia to a smaller value, a flat plate type is used for the polarization separation elements 25a and 25b, and thinner ones are used for the λ / 4 plates 26a and 26b and the λ / 2 plate 27, and the polarization separation elements 25a and 25b It is desirable that the λ / 4 plates 26a and 26b and the galvanometer mirrors 15a and 15b be as close as possible to each other for each axis. The polarization separation elements 25a and 25b and the λ / 4 plates 26a and 26b may be attached.

  In this way, by using the polarized light separating elements 25a and 25b, the λ / 4 plates 26a and 26b, and the λ / 2 plate 27 and linearly polarized light, the same galvanometer mirror 15 repeats the reflection twice and has a double moving speed. As a result, the speed of the laser processing apparatus can be improved.

  In FIG. 16, the galvanometer mirror 15 is arranged with a reflection folding angle of 90 deg. Although it is possible to make this closer to an acute angle, it becomes more difficult to satisfy the separation characteristics of the P-polarized light and the S-polarized light of the polarization separating elements 25a and 25b as the acute angle is increased. However, the mechanism shown in FIG. 16 is combined with an optical system that suppresses the shake of the laser beam 12 on the X-axis mirror 15b due to the scanning of the Y-axis mirror 15a by the lenses 21a and 21b shown in the second embodiment, and the laser processing apparatus It is possible to achieve further speed improvements.

  Although the description may overlap with the specific examples given in the first to seventh embodiments, the embodiment of the present invention will be described below based on a higher concept than the specific examples.

  The incident angle and reflection angle at the two galvanometer mirrors can be arranged so that both the galvanometer mirrors are less than 45 degrees. Thereby, the moment of inertia of the galvanometer mirror can be further reduced.

  In the laser processing apparatus of the present invention, the incident angle and reflection angle of the galvanometer mirror at the tip of at least two axes of galvanometers can be arranged so that both galvanometer mirrors are 35 degrees or less. More desirably, the incident angle and reflection angle of the galvanometer mirror at the tip of at least two axes of galvanometers can be arranged so that both the galvanometer mirrors are 30 to 35 degrees. As a result, the area of the galvanometer mirror can be suppressed without causing interference of the laser beam, and as a result, the moment of inertia can be reduced.

  Moreover, in the laser processing apparatus of this invention, a lens can be arrange | positioned between two galvanometer mirrors and the lens can be used as the beam irradiation size suppression mechanism with respect to a 2nd galvanometer mirror. As a result, the vibration of the laser beam on the second galvanometer mirror due to the scan of the first galvanometer mirror can be suppressed, and the moment of inertia of the second galvanometer mirror can be suppressed small.

  Preferably, in the beam irradiation size suppression mechanism, the two galvanometer mirrors are arranged so as to face each other, and the polarization separation element and the λ / 4 plate are arranged in the optical path, so that the two galvanometer mirrors are both laser beams. Can be perpendicularly incident and vertically reflected. As a result, the moment of inertia of the galvanometer mirror at the tip of the galvanometer can be kept small.

  Further, in the beam irradiation size suppressing mechanism, the two galvanometer mirrors can both arrange the λ / 4 plate and the polarization separation element in front of the reflecting surface so as to face the reflecting surface. This makes it possible to obtain a beam deflection angle that is twice as large as the conventional galvano deflection angle.

  Further, a λ / 2 plate can be disposed between the two galvanometer mirrors. Thereby, it is possible to obtain a beam deflection angle twice as large as the conventional galvanometer deflection angle in the two galvanometer axes.

  Further, a triaxial galvanometer is used as the beam scanning mechanism, and the galvanometers are arranged so that the angle formed by the scan axis directions of each galvanometer is 60 deg. Thereby, a larger beam deflection angle can be obtained with a smaller galvano deflection angle.

  Further, a triaxial table drive mechanism can be used for scanning the table holding the workpiece, and the angle formed by the scan axis directions of each table drive mechanism can be set to 60 degrees. Thereby, a larger table scan amount can be obtained with a smaller stroke amount of the table driving mechanism.

  In the case of biaxial scanning, the scanning axis direction of the table driving mechanism that scans the table holding the workpiece can be arranged at an angle of 45 degrees with respect to the scanning axis direction of the galvanometer. . Thereby, the table moving speed can be substantially increased.

  The scanning method according to the embodiment of the present invention is as follows. In the first scanning method, the incident angle and reflection angle of the galvanometer mirror at the tip of the biaxial galvanometer that performs XY scanning are 30 to 35 deg for both galvanometer mirrors, and the folding angle by reflection is 60 ° to 70 °. By disposing a biaxial galvanometer so as to have an acute angle, the moment of inertia of the galvanometer mirror is suppressed to be small.

  In a second scanning method according to the present invention, a lens is disposed between galvanometer mirrors at the tip of a biaxial galvanometer that performs XY scanning, and a laser beam on the second galvanometer mirror is scanned by the first galvanometer mirror. This is characterized in that the moment of inertia of the second galvanometer mirror is suppressed to be small by suppressing the vibration of the second galvanometer mirror.

  In a third scanning method according to the present invention, a galvanometer mirror at the tip of a biaxial galvanometer for performing an XY scan is disposed so as to face each other, and a polarization separation element and a λ / 4 plate are disposed between the two galvanometer mirrors. In addition, by using linearly polarized light for the laser beam, the two galvanometer mirrors are configured such that the laser beam is vertically incident and vertically reflected, thereby suppressing the moment of inertia of the galvanometer mirror.

  A fourth scanning method according to the present invention uses a triaxial galvanometer as a beam scanning mechanism, and is arranged so that an angle formed by the scan axis directions of the galvanometers is 60 deg. The scanable area of the triaxial galvanometer By using a hexagonal shape, a larger beam deflection angle can be obtained with a smaller galvano deflection angle.

  The fifth scanning method according to the present invention is not limited to the galvanometer described above, and a three-axis table driving mechanism is used for scanning the table holding the workpiece, and the angle formed between the scan axis directions of each table driving mechanism is It is characterized in that a larger table scan amount can be obtained with a smaller stroke amount by arranging it to be 60 deg.

  In the sixth scanning method according to the present invention, in the two-axis scan with one axis less than the above-described three-axis table scan, the scan axis direction of the table driving mechanism is substantially inclined by 45 degrees with respect to the scan axis direction of the galvanometer. The table moving speed is improved.

  In a seventh scanning method according to the present invention, a λ / 4 plate and a polarization separation element are arranged in front of a galvanometer mirror reflecting surface at the tip of a biaxial galvanometer for performing XY scanning, and such a λ / 4 plate and polarization separation are arranged. By arranging a λ / 2 plate between two galvanometer mirrors with elements and using linearly polarized light for the laser beam, the beam deflection angle is twice as large as the conventional galvanometer deflection angle. It is characterized by obtaining.

  Although the embodiments of the present invention have been described above, the embodiments disclosed above are merely examples, and the scope of the present invention is not limited to these embodiments. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is a figure for demonstrating the laser processing apparatus of Embodiment 1 of this invention. It is a figure for demonstrating the spatial arrangement | positioning of the galvanometer mirror in the beam scanning mechanism of the laser processing apparatus of FIG. (A) represents a state in which scanning is not performed, and (b) is a diagram illustrating a state in which scanning on the XY plane is performed by overwriting. It is a figure for demonstrating the space arrangement of the galvanometer mirror of the comparative example for comparing with the space arrangement of the galvanometer mirror of FIG. (A) is a figure which shows the case where an incident angle is 45 deg and a reflection angle is 45 deg in two galvanometer mirrors, and (b) is a larger incident angle and reflection angle. It is a figure for demonstrating the mirror shape of the galvanometer mirror by Embodiment 1, and the mirror shape of the galvanometer mirror for a comparison. (A) is when the Y axis mirror has a reflection folding angle of 62 deg, (b) is when the Y axis mirror has a reflection folding angle of 90 deg, and (c) is when the X axis mirror has a reflection folding angle of 66 deg. (D) is a figure which respectively shows the case where the reflection folding angle | corner of an X-axis mirror is 90 degrees. It is a figure showing the relationship between the reflection folding angle in a galvanometer mirror, and the moment of inertia of each of two galvanometer mirrors. It is a figure for demonstrating the beam scanning mechanism using a lens in the laser processing apparatus of Embodiment 2 of this invention. (A) is a figure which shows the case where a lens is arrange | positioned left-right symmetrically, and (b) is a case where it reduces in size by a reflective mirror. In the laser processing apparatus of Embodiment 3 of this invention, it is a figure for demonstrating the beam scanning mechanism which made the laser beam perpendicularly inject and reflect perpendicularly with respect to the galvanometer mirror. FIG. 8 is a diagram for explaining a beam scanning mechanism in which the mechanism of FIG. 6 and the mechanism of FIG. 7 are combined in the laser processing apparatus according to the fourth embodiment of the present invention. (A) is a figure which shows the case where two polarization separation elements are provided, (b) is the case where it integrates into one polarization separation element. It is a figure for demonstrating the mirror shape of the galvanometer mirror in the laser processing apparatus of Embodiment 4 of this invention. (A) is a figure which shows the shape of the Y-axis mirror in case of the folding angle 0deg, (b) is a figure which shows the shape of the X-axis mirror in case of the folding angle 0deg. In the laser processing apparatus of Embodiment 5 of this invention, it is a figure for demonstrating the scanable area of a beam scanning mechanism. (A) is a figure which shows the case where a scannable area is a rectangle, (b) is a figure which shows the case where a scannable area is a hexagon. It is a figure for demonstrating the beam scanning mechanism using the triaxial galvanometer in the laser processing apparatus of Embodiment 5 of this invention. It is a figure for demonstrating arrangement | positioning of the area which can be scanned on the to-be-processed object in the laser processing apparatus of Embodiment 5 of this invention. (A) shows a quadrangular area formed by 2-axis scanning, and (b) shows a hexagonal area formed by 3-axis scanning. It is a figure for demonstrating the triaxial table drive mechanism in the laser processing apparatus of Embodiment 5 of this invention. It is a figure for demonstrating the table movement to the next area from the scannable area on the to-be-processed object in the laser processing apparatus of Embodiment 6 of this invention. (A) is the same as the scan direction of the galvanometer and the scan direction of the table movement, and when only one scan direction of the table driving mechanism is used, (b) shows the scan direction of the galvanometer and the scan direction of the table movement. It is a figure which shows the effect | action of the table drive mechanism in the case of 45 degrees. In the laser processing apparatus of Embodiment 6 of this invention, it is a figure for demonstrating the table drive mechanism which inclined the scanning axis 45 degrees with respect to the scanning axis of a galvanometer. It is a figure for demonstrating the beam scanning mechanism of the double angle scan in the laser processing apparatus of Embodiment 7 of this invention. (A) is sectional drawing which shows advancing of the laser beam in a Y-axis mirror, (b) is a figure which shows advancing of the laser beam at the time of arrange | positioning (lambda) / 2 board between an X-axis mirror and a Y-axis mirror. It is.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Laser oscillator, 11 Laser beam incident direction, 12 Laser beam, 13 Fixed mirror, 14 Galvanometer, 15 Galvanometer mirror, 16 Condensing lens, 17 Work piece, 18 Scanable area, 19 Table, 20 Table drive mechanism , 21 lens, 22 reflecting mirror, 23 cubic polarization separation element, 24 λ / 4 plate, 25 flat plate polarization separation element, 26 λ / 4 plate, 27 λ / 2 plate.

Claims (10)

  1. A laser processing apparatus that scans a laser beam oscillated from a laser oscillator, guides the laser beam to a workpiece, and processes the workpiece,
    To scan the laser beam, a first galvanometer first galvanometer mirror is provided at the distal end of the shaft, and a second galvanometer which the second galvano-mirror is provided at the distal end of the shaft,
    A lens and a reflection mirror disposed in an optical path between the first and second galvanometer mirrors in an optical path from the laser oscillator to the workpiece through the first and second galvanometer mirrors; ,
    The first and second galvanometer mirrors are arranged to be shifted in opposite directions with respect to the optical axis of the lens so as not to interfere with each other,
    After the laser beam reflected by the first galvanometer mirror passes through the lens, the laser beam is reflected by the reflecting mirror toward the lens and re-enters the lens, and the laser beam that has passed through the lens again. A laser processing apparatus configured to be reflected by the second galvanometer mirror.
  2.   2. The laser processing apparatus according to claim 1, wherein the first and second galvanometer mirrors are arranged such that an incident angle and a reflection angle are less than 45 degrees for both of the two galvanometer mirrors.
  3.   3. The laser processing apparatus according to claim 1, wherein the first and second galvanometer mirrors are arranged so that an incident angle and a reflection angle of each of the first and second galvanometer mirrors are 35 degrees or less. 4.
  4.   The laser according to any one of claims 1 to 3, wherein an incident angle and a reflection angle at the first and second galvanometer mirrors are arranged to be 30 to 35 deg for both the first and second galvanometer mirrors. Processing equipment.
  5.   By arranging the first and second galvanometer mirrors side by side and arranging a polarization separation element and a λ / 4 plate in the optical path, both the first and second galvanometer mirrors are vertically incident and vertically reflected. The laser processing apparatus according to claim 1, wherein
  6.   2. The laser processing apparatus according to claim 1, wherein both of the first and second galvanometer mirrors are arranged such that a λ / 4 plate and a polarization separation element face the reflecting surface before the reflecting surface.
  7.   The laser processing apparatus according to claim 6, further comprising a λ / 2 plate disposed between the first and second galvanometer mirrors.
  8. In order to scan the laser beam, a third galvanometer having a third galvanometer mirror provided at the tip of the shaft is further used, and the scan axis directions of the first, second and third galvanometers are formed. The laser processing apparatus according to claim 1, wherein corners are arranged to be 60 deg, and the scannable areas of the first, second, and third galvanometers are hexagonal.
  9.   The table according to any one of claims 1 to 8, wherein a triaxial table driving mechanism is used for scanning the table holding the workpiece, and an angle formed by the scan axis directions of each table driving mechanism is 60 degrees. The laser processing apparatus as described.
  10. The scan axis direction of a table drive mechanism that scans the table holding the workpiece is arranged to form an angle of 45 degrees with respect to the scan axis directions of the first and second galvanometers. The laser processing apparatus according to any one of 7.
JP2005149892A 2005-05-23 2005-05-23 Laser processing equipment Active JP5105717B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005149892A JP5105717B2 (en) 2005-05-23 2005-05-23 Laser processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005149892A JP5105717B2 (en) 2005-05-23 2005-05-23 Laser processing equipment

Publications (2)

Publication Number Publication Date
JP2006326603A JP2006326603A (en) 2006-12-07
JP5105717B2 true JP5105717B2 (en) 2012-12-26

Family

ID=37548872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005149892A Active JP5105717B2 (en) 2005-05-23 2005-05-23 Laser processing equipment

Country Status (1)

Country Link
JP (1) JP5105717B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104985811A (en) * 2015-06-08 2015-10-21 珠海西通电子有限公司 Photo-cured three-dimensional printer

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100957535B1 (en) 2009-07-10 2010-05-11 주식회사 엘에스텍 Apparatus for manufacturing light guide plate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3769942B2 (en) * 1997-09-02 2006-04-26 セイコーエプソン株式会社 Laser processing method and apparatus, and circuit forming method and apparatus for non-conductive transparent substrate
JP2000246479A (en) * 1999-02-25 2000-09-12 Hitachi Via Mechanics Ltd Laser beam machine
JP2001272618A (en) * 2000-03-24 2001-10-05 Shibaura Mechatronics Corp Scanning optical unit
JP3479878B2 (en) * 2000-03-27 2003-12-15 住友重機械工業株式会社 Laser processing method and processing apparatus
JP2002035975A (en) * 2000-07-19 2002-02-05 Sumitomo Heavy Ind Ltd Method and device for laser drill
JP3682295B2 (en) * 2000-08-29 2005-08-10 三菱電機株式会社 The laser processing apparatus
JP4180325B2 (en) * 2002-08-15 2008-11-12 日立建機ファインテック株式会社 Laser marking device and laser marking method
JP3822188B2 (en) * 2002-12-26 2006-09-13 日立ビアメカニクス株式会社 Multi-beam laser drilling machine
JP4318525B2 (en) * 2003-10-20 2009-08-26 住友重機械工業株式会社 Optical apparatus and laser irradiation apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104985811A (en) * 2015-06-08 2015-10-21 珠海西通电子有限公司 Photo-cured three-dimensional printer
CN104985811B (en) * 2015-06-08 2017-04-26 珠海西通电子有限公司 Photo-cured three-dimensional printer

Also Published As

Publication number Publication date
JP2006326603A (en) 2006-12-07

Similar Documents

Publication Publication Date Title
EP1271219B1 (en) Laser beam delivery system with trepanning module
US6849824B2 (en) Multibeam laser drilling apparatus
DE19983939B4 (en) laser beam machine
US20060289410A1 (en) Laser machining apparatus
US7842901B2 (en) Device for drilling and for removing material using a laser beam
US6341029B1 (en) Method and apparatus for shaping a laser-beam intensity profile by dithering
JP3213882B2 (en) Laser processing apparatus and processing method
EP1935620A2 (en) Optical modeling apparatus
US5227910A (en) High resolution laser beam scanner and method for operation thereof
US4956539A (en) Laser processing method
EP1324883B1 (en) Direct laser imaging system
JPH06283398A (en) Method and apparatus for exposing substrate
DE19834410B4 (en) Laser processing device
EP1224999A1 (en) Laser drilling method and laser drilling device
US5227607A (en) Yag laser working machine for precision working of thin-film
EP0319237B1 (en) Light-scanning reader
DE10193737B4 (en) Laser processing device
US7969636B2 (en) Laser direct imaging apparatus
US5475416A (en) Printing system for printing an image with lasers emitting diverging laser beams
DE10116059B4 (en) Moving lens lithograph and method of making digital holograms in a storage medium
WO2003028940A1 (en) Utrashort pulsed laser micromachining/submicromachining using an acoustooptic scanning device with dispersion compensation
US6410882B1 (en) Laser welding method
CN102245339A (en) Laser machining systems and methods with multiple beamlet laser beam delivery systems
CN101346208B (en) Scanning head and processor with the same
EP0288970B1 (en) Optical system for flyingspot scanning system

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070927

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20091022

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101005

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101203

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110607

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110801

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120306

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120314

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120925

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20121002

R150 Certificate of patent or registration of utility model

Ref document number: 5105717

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20151012

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250