JP3114533B2 - Laser drilling apparatus and laser drilling method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus and processing.
A method, in particular a drilling and purpose, improved so that it can improve the machining speed laser
The present invention relates to a drilling apparatus and a laser drilling method .

[0002]

2. Description of the Related Art Generally, a laser processing apparatus mainly for drilling is provided with a so-called XY stage capable of horizontally moving a stage on which a work is mounted in an X-axis direction and a Y-axis direction. . This laser processing apparatus changes a processing position by a pulsed laser beam by moving a work by an XY stage. For this reason, it takes time for positioning by the XY stage, and there is a limit to the processing speed. For convenience, this laser processing apparatus is referred to as a first method.

On the other hand, as shown in FIG. 3, there is provided a laser processing apparatus in which a laser beam is oscillated using a galvano scanner to improve the processing speed. In brief, a laser beam output from a laser oscillator 41 is guided to a mask 45 via a variable attenuator 42, an expander 43, and a mirror 44. The pulsed laser light that has passed through the mask 45 is reflected downward by a dichroic mirror 47 via a lens 46. The laser light reflected by the dichroic mirror 47 is oscillated by a first galvano scanner 48 and a second galvano scanner 49. As a result, the laser light is swung through the fθ lens 50 so as to cover the entire area of the field 52 set on the work 51 arranged in the processing area.

The work 51 is placed on the XY stage 53, but illustration and description of the drive system of the XY stage 53 are omitted here. Further, an alignment system for positioning the work 51 by the lens 54 and the CCD camera 55 is provided above the dichroic mirror 47, but the description is also omitted. For convenience, this laser processing apparatus is referred to as a second method.

[0005]

In this second method,
After processing is performed by oscillating the laser beam on the field 52 on the work 51, the next work is arranged in the processing area by the XY stage 53. According to the second method, the first and second galvanometer scanners 48 and 49 are used.
The processing speed can be improved by combining the XY stage 53 and the XY stage 53, but the processing area is limited. To increase the processing area, it is sufficient to increase the diameter of the fθ lens 50. However, since a large aperture fθ lens is expensive, there is a problem in cost.

[0006] For reference, FIG.
The estimated value of the processing time according to the second method is shown. In FIG. 2, the field size is the dimension of one side of each field, and the stage step time is XY stage adjustment time ×
The number of fields and the stage communication time represent the communication time × the number of fields, and the scan time represents the hole positioning time within one field × the number of fields. The first method requires 7515 (sec) at a field size of 0.1 mm, and the second method requires 302 at a field size of 50 mm.
(Sec) and 249 (sec) when the field size was increased from 50 mm to 200 mm.

According to the present invention, there is provided a laser hole capable of further improving the processing speed by taking advantage of the above-mentioned second method.
Processing apparatus and drilling methods opened is intended to provide.

[0008]

According to the present invention, a laser beam is branched into a plurality of paths via one or more half mirrors, and each of the branched laser beams is incident on an fθ lens as a processing lens. led to a plurality of galvano scanners system arranged on the side, the laser beam swung by the plurality of optical scanner system, respectively, before the one fθ lens
A laser drilling apparatus is characterized in that the laser beam is simultaneously irradiated on the processing area through the divided area set corresponding to the branched laser light .

According to the present invention, one or more laser beams are emitted.
Through multiple half-mirrors and branch
The laser beams thus obtained are respectively used as fθ lenses as processing lenses.
To multiple galvanometer scanners located on the entrance side of the
Lasers oscillated by the plurality of galvano scanner systems
The light is split by one fθ lens
Through the divided area set according to the laser beam
Simultaneous processing by irradiating the area simultaneously
A laser drilling method is provided.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A laser drilling apparatus according to one embodiment of the present invention will be described with reference to FIG. In FIG.
A pulsed laser beam from a laser oscillator (not shown) passes through a mask 10 and is branched by a half mirror 11. The light transmitted through the half mirror 11 is guided to the dichroic mirror 12. The reflected lights of the half mirror 11 and the dichroic mirror 12 are respectively reflected by mirrors 1 arranged below them.
It is led to 3,14.

In the present invention, the reflected light from the mirror 13 is introduced into a half area of the fθ lens 15 via the first and second galvano scanners 16 and 17 constituting the first galvano scanner system. On the other hand, the reflected light of the mirror 14 is
The light is introduced into the remaining half area of the fθ lens 15 via the third and fourth galvano scanners 18 and 19 constituting the second galvano scanner system. To do so, the first and third galvanometer scanners 16 and 18 are set to f
What is necessary is just to arrange | position symmetrically with respect to a center axis at the entrance side of (theta) lens 15, and to make the 2nd and 4th galvano scanners 17 and 19 symmetrically arrange | positioned similarly. The combination of the first and second galvanometer scanners 16 and 17 and the combination of the third and fourth galvanometer scanners 18 and 19 may be the same as the conventional one as shown in FIG.

In a region directly below the fθ lens 15, first and second fields F1 and F2, which are equally divided into two, are set, and works 21 and 22 are arranged in the respective fields. These works 21 and 22 are processed simultaneously. Of course, a work having a size corresponding to the first and second fields F1 and F2 may be arranged and one work may be simultaneously processed by half. The works 21 and 22 are mounted on the XY stage 23.

Above the half mirror 11 and the dichroic mirror 12, a first alignment system comprising a first lens 25 and a first CCD camera 26, a second lens 27 and a second A second alignment system with the CCD camera 28 is provided.

First and second galvanometer scanners 16 and 17
The combination of the third and fourth galvano scanners 18 and 19 is driven and controlled by a control device (not shown) so as to have the same movement. The XY stage 23 is also driven by the control device to move the work after the laser processing is completed, and horizontally moves in the X-axis direction and the Y-axis direction.

The processing position relative to the workpiece 21, 22 is determined by the command value of the rotational angle given from the controller to each galvanometer scanner, not only the holes are arranged regularly, it is also possible machining of holes of irregular sequence .

According to the device of the present invention, the second device described with reference to FIG.
75 (sec) can be further reduced as compared with the processing time by the above method.

Although the present invention has been described with reference to one embodiment, the present invention is not limited to the above embodiment.
Various modifications are possible. For example, in the embodiment, two combinations of the galvano-scanner system are used and one fθ lens is simultaneously used by １ ／ each. However, three or more combinations may be used. In this case, the fθ lens is used in a state where it is apparently divided into three equal parts or more.

[0018]

As described above, according to the present invention, a single f-theta lens can be simultaneously used by a plurality of sets of galvano scanners in a divided manner, so that the processing speed can be greatly improved. .

[Brief description of the drawings]

FIG. 1 is a diagram schematically showing a main configuration of a laser drilling apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing a result of a trial calculation of a processing time according to a conventional method.

FIG. 3 is a diagram showing a schematic configuration of a laser drilling and processing apparatus using a conventional galvano scanner.

[Explanation of symbols]

 10, 45 Mask 11 Half mirror 12 Dichroic mirror 13, 14 Mirror 15 fθ lens 16 First galvano scanner 17 Second galvano scanner 18 Third galvano scanner 19 Fourth galvano scanner 21, 22 Work 23 XY stage 26 first CCD camera 28 second CCD camera

Claims (3)

(57) [Claims] 1. A laser beam is split into a plurality of paths via one or more half mirrors, and the split laser beams are respectively sent to a plurality of galvano scanner systems arranged on an incident side of an fθ lens as a processing lens. guiding the laser beam oscillated by the plurality of optical scanner system, respectively, in response to the branched laser beams in one fθ lens
A laser drilling apparatus characterized in that a processing area is simultaneously irradiated through a set divided area . 2. A laser drilling apparatus according to claim 1, wherein the stage on which the work arranged in the processing area is mounted is an X-axis movable in the X-axis direction and the Y-axis direction.
-A laser drilling and processing device comprising a Y stage. 3. A laser beam passing through one or more half mirrors.
And splits the laser light into multiple paths.
And placed on the incident side of the fθ lens as a processing lens.
To a plurality of galvanometer scanner systems, and
Each of the laser beams oscillated by the scanner system
In the fθ lens, corresponding to the branched laser light
Simultaneously irradiate the processing area through the set divided area
Laser drilling method characterized by simultaneous processing
Law.