JP3642930B2 - Multi-axis laser processing method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multi-axis laser processing method and apparatus for performing laser processing in parallel on a plurality of processing axes.
[0002]
[Prior art]
When drilling by laser processing, fine holes can be processed and the processing speed can be increased as compared with drilling. FIG. 5 shows a laser processing apparatus for performing conventional hole processing.
[0003]
As shown in FIG. 5, the laser beam b for processing emitted from the laser light source a is scan-controlled in the X direction of the XY2 directions orthogonal to each other as viewed from the plane by the X galvanometer mirror c, and While controlling scanning in the Y direction by the Y galvanometer mirror d, an image is formed at a predetermined position on the workpiece f through the f · θ lens e, and a hole g is made at the imaging position. The workpiece f is positioned at a predetermined position by an XY table h that is positioned in the XY2 direction as necessary.
[0004]
[Problems to be solved by the invention]
By the way, such laser processing is performed between various holes and different layer wiring patterns for inserting electronic component leads into a circuit board used for mounting various electronic components to manufacture an electronic circuit board. It is suitable for drilling such as providing through holes for connection, and can be achieved with high efficiency and high accuracy, and the product cost can be reduced.
[0005]
On the other hand, recently, as the number of electronic device products manufactured is steadily increasing, multi-axis machining is performed with the above-described conventional apparatus. However, this increases equipment costs and installation space, and hinders further reduction of product costs.
[0006]
An object of the present invention is to provide a multi-axis laser processing method and apparatus capable of performing multi-axis machining with simple and inexpensive equipment, reducing the installation cost of the equipment, and reducing the product cost.
[0007]
[Means for Solving the Problems]
To achieve the above object, multiple axes laser processing method of the invention of claim 1 is first branched Les laser light into a plurality of leads to a plurality of scan optical systems, the plurality of scan optical irradiating the portion to be processed for each scanning optical system by common scan control system, we are an first, characterized in that processing in parallel a plurality of the processing unit.
[0008]
Thus, the emission control of the record laser light, by the scan control of the scan optical system for forming a predetermined position on the machined portion of the laser beam, a plurality machining a predetermined laser processing on the work unit subjected in parallel with the axis, can be accomplished with high accuracy in a conventional street high efficiency, in particular, leads to branching Les laser light to scan the optical system at a plurality machining axis corresponding to a plurality of the machined portion, since performing the concurrent pressure engineering, although the scanning optical system need only a number corresponding to the machined portion, to the laser light source may be one, the extraction control also need only for one laser source, Multiple scanning optical systems can also be aggregated in a range where multiple workpiece parts can be centrally arranged, and in inverse proportion to the number of branches of laser light, the required equipment and control are simplified, and the installation space for equipment is reduced. Product cost can be reduced. In addition, individual laser processing using a plurality of processing axes of each processed portion is based on the emission control of one laser beam, and there is an advantage that a processing error due to laser beam emission control deviation does not occur between the processed portions.
[0010]
The method of the invention of claim 1, further the laser beam on each machining axis machining mark on the different positions, respectively for each workpiece unit to the light shielding at different scanning times by one This is the second feature. As a result, the laser beam is branched and the laser processing common to the plurality of workpieces on the plurality of machining axes is performed, and the workpieces for each of the plurality of machining axes are differentiated under different position conditions. With the machining axis identification mark, it is possible to discriminate which machining axis is machined by the differentiation, and the difference in dirt on the optical system after branching, scan control deviation of the scanning optical system, etc. Individual process management corresponding to is easy.
[0011]
Multiple axes laser processing apparatus of the invention of claim 2, one respectively scan controlling the laser beam and branching means for branching to a plurality, each branched laser beam from the laser light emitting source, the respective via fθ lens a plurality of scanning optical system for performing irradiation with the laser machining at a predetermined position on the workpiece, and the extraction control means for controlling the emission of Les chromatography the light emitting source, a scan control for controlling the common scan control multiple scan optical system further comprising a means in which a first feature.
[0012]
Thus, Ru can be automatically achieve the method of the first aspect of the invention of claim 1.
[0013]
The apparatus according to the second aspect of the present invention has a second feature that includes a light-shielding control means for shielding and canceling the light-shielding of the branched laser beams at different times. Thus, the method of the second feature of the invention of claim 1 can be automatically achieved.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a typical embodiment of the present invention will be described with reference to FIGS.
[0015]
In the present embodiment, as shown in FIG. 1, the emitted processing laser beam 1 is branched into two or more as required. In the present embodiment, a case where the laser beam is branched into two of a pair of laser beams 1a and 1b is shown for simplicity of explanation. The laser beam 1 is branched by the beam splitter 2, but various types may be selected and used depending on the number of branches and the branching direction. Each of the branched laser beams 1a and 1b is guided to individual scanning optical systems 2a and 2b. In order to guide the branched laser beams 1a and 1b to the scanning optical systems 2a and 2b, the optical path may be appropriately bent by a reflection mirror (not shown), and a prism or other beam guide member may be used as necessary. You can also. The laser beams 1a and 1b guided to the respective scanning optical systems 2a and 2b irradiate the individual processing parts 4a and 4b on the plurality of processing axes 3a and 3b passing through the scanning optical systems 2a and 2b, and the individual processing parts 4a and 4b. Are laser processed in parallel.
[0016]
Each of the scanning optical systems 2a and 2b includes X galvanometer mirrors 2a1 and 2b1 that perform scanning control of the laser beams 1a and 1b in the X direction of XY2 orthogonal to each other when viewed from the plane, and a Y galvano mirror 2a2 that performs scanning control in the Y direction. 2b2, and the laser beams 1a and 1b that have passed through the scanning optical systems 2a and 2b are subjected to the scan-controlled XY2 of the workpieces 4a and 4b via the f · θ lenses 5a and 5b. An image is formed at a predetermined position in the direction, and hole processing is performed to open a hole 31 having a size corresponding to the image formation spot diameter of the laser beams 1a and 1b at the image formation position. However, the present invention is not limited to such a process, and various uneven patterns that are independent or continuous can be formed. However, the specific configuration of each scanning optical system 2a, 2b is not limited to that of the present embodiment, and what kind of laser processing can be performed as long as necessary laser processing is performed on the necessary portions of the processed parts 4a, 4b. Any configuration may be used.
[0017]
As a result of the above, the processing of the laser beam 1 for processing and the scan control of the scanning optical systems 2a and 2b for forming an image of the laser beam 1 at predetermined positions on the processing parts 4a and 4b are performed. Predetermined laser processing is performed on the parts 4a and 4b in parallel with the plurality of processing shafts 3a and 3b, and can be achieved with high efficiency and high accuracy as usual. In particular, the processing laser beam 1a is branched and guided to the scanning optical systems 2a and 2b of the plurality of processing axes 3a and 3b corresponding to the plurality of processed parts 4a and 4b, and the hole processing is performed. To do. Accordingly, although the scan optical systems 2a and 2b need to be in the number corresponding to the processed parts 4a and 4b, only one laser oscillator 10 or the like serving as a laser light source is required, and emission control is also performed for one laser oscillator 10 or the like. As shown in FIG. 1, each scanning optical system 2a, 2b can also be aggregated as shown in FIG. 1 to a range where the processing parts 4a, 4b can be aggregated and arranged, and in inverse proportion to the number of branches of the laser light 1, Control is simplified, installation space for equipment is reduced, and product costs can be reduced. Moreover, the individual laser processing on the plurality of processing axes 3a and 3b of the processed parts 4a and 4b is based on the emission control of one laser beam 1, and the processing is performed due to the deviation of the laser beam emission control between the processed parts 4a and 4b. There is an advantage that no error occurs.
[0018]
In the present embodiment, the processing axes 3a and 3b that have passed through the scanning optical systems 2a and 2b are parallel to each other, and lasers are provided at predetermined positions of the processed parts 4a and 4b arranged on the same plane in the direction perpendicular to them. In order to process and support a plurality of workpieces 4 each having a plurality of workpieces 4a and 4b, they are supported by one positioning means 15 for processing. Thereby, the support structure of the workpiece 4 is simplified. The positioning means 15 of the present embodiment is an XY table that can position the workpiece 4 in the XY2 directions orthogonal to each other on the plane. By enabling the workpiece 4 to be positioned over a wide area by such an XY table 15, the workpiece 4 can be positioned over a wide area beyond the scanning range of the scanning optical systems 2a and 2b.
[0019]
Correspondingly, in the present embodiment, the scan range S of the scan optical systems 2a and 2b is the range of one processed portion 4a and 4b as shown in FIGS. 1 and 2A to 2C. In order to perform laser processing on any position of each of the processed parts 4a and 4b, it can be performed only by scanning control of the scanning optical systems 2a and 2b. The positioning control of the object 4 may be used only for switching the processed parts 4a and 4b to be laser processed, and the control is simplified. However, the present invention is not limited to such control, and the control of the processing position on the processed parts 4a and 4b is performed in combination with the scanning control of the scanning optical systems 2a and 2b and the positioning control by the XY table 15. In this case, even if the current processing position and the next processing position are far apart, the scanning positions of the laser beams 1a and 1b and the positioning positions of the processed parts 4a and 4b approach each other. By performing complex control, it is possible to cope with high speed, and it is effective for switching the processed parts 4a and 4b which tend to have a large control amount. In addition, since the workpieces 4 and 4 to be laser processed in parallel are commonly positioned by one positioning means 15 such as an XY table, the workpieces 4 and 4 or the workpieces set on them are set. There is an advantage that a processing error due to the position control deviation does not occur between the processing parts 4a and 4b.
[0020]
Further, the laser beams 1a and 1b on the processing axes 3a and 3b are different one by one as shown in FIGS. 2A and 2B, or FIGS. By canceling light shielding at the scanning time or at positions X1, Y1, X2, and Y2 and irradiating the respective corresponding portions 4a and 4b with different corresponding positions, the respective portions 4a and 4b are respectively processed. Machining axis discrimination marks 6a and 6b having different position conditions can be added. In this way, one laser beam 1 is branched into a plurality of processing axes 3a and 3b, and laser processing common to the plurality of processing parts is performed, but each processing part for each of the plurality of processing axes is different. The processing axis discriminating marks 6a and 6b, which are individualized by the position conditions X1, Y1, X2, and Y2, are attached, and depending on the difference between the position conditions X1, Y1, X2, and Y2, which machining axis is used to indicate the part to be processed. Individual processing management is easy due to differences in the contamination of the optical system after the laser beam 1 is branched into the laser beams 1a and 1b and scan operation control deviations of the scanning optical systems 2a and 2b. Become.
[0021]
In order to attach such machining axis discriminating marks 6a and 6b, as shown in FIGS. 2A to 2C, the scanning range S of the scanning optical systems 2a and 2b is changed to an actual machining range W for performing laser machining. If the portion of the non-machining range N that can be set around the actual machining range W within the scan range S is used, control different from scan control for laser machining and position control of the workpiece 4 is performed. This can be achieved without confusion, and the attached machining axis discrimination marks 6a and 6b are also effective in being easily distinguishable from the laser processed hole 31 and the like. Of course, the machining axis discrimination marks 6a and 6b can be easily distinguished from each other by machining them into an aspect such as a recess that is different from the form of the hole 31 or the like that is originally subjected to laser machining.
[0022]
In the first example shown in FIGS. 1 and 2A and 2B of the present embodiment, each workpiece is processed corresponding to the position where the machining axis discrimination marks 6a and 6b in the non-machining range N are attached. Masks 7 having holes 7a and 7b are arranged at different corresponding positions X1, Y1 and X2 and Y2 with respect to the parts 4a and 4b, and the same scanning operation is performed under the same position control of the processed parts 4a and 4b. When the laser beams 1a and 1b are made to correspond to the positions X1 and Y1 of the hole 7a as shown in FIG. 2A, the laser beam 1a on the processing axis 3a passes through the hole 7a and the non-processing range of the processing portion 4a. N is reached and a machining axis discrimination mark 6a is attached at that position, but the laser beam 1b on the machining axis 3b is shielded by the mask 7 and does not reach the non-machining range N of the workpiece 4b, so that the workpiece 4a is processed. Only the machining axis discriminating mark 6a corresponding to the machining axis 3a for laser machining is attached. There. On the other hand, when the laser beams 1a and 1b are made to correspond to the positions X2 and Y2 of the hole 7b as shown in FIG. 2B, the laser beam 1b on the processing shaft 3b passes through the hole 7b and the non-processed portion 4b is processed. The machining axis discrimination mark 6b is attached to the position after reaching the range N, but the laser beam 1a on the machining axis 3a is shielded by the mask 7 and does not reach the non-machining range N of the workpiece 4a. Only the machining axis discriminating mark 6b corresponding to the machining axis 3b that is laser machining 4b is attached. As a result, the machining axis discrimination marks 6a and 6b corresponding to the machining axes 3a and 3b laser machining the workpieces 4a and 4b in parallel differ from each other in the laser beams 1a and 1b irradiated to the non-machining range N. At this time , the light shielding is canceled, and different position conditions X1, Y1 and X2, Y2 for the respective processed parts 4a, 4b are formed.
[0023]
As a second embodiment, as shown in FIGS. 1 and 3, (a) and (b), light shielding and light shielding can be performed freely in the middle of the optical paths of the branched laser beams 1a and 1b. When the members 8a and 8b are provided, and the positions corresponding to the positions X1, Y1, X2, and Y2 to which the processing axis discrimination marks 6a and 6b are attached in the non-processing range N, the laser beams 1a and 1b are shielded from the light shielding members 8a and 8b. By removing the light shielding at different points in time , that is , at different scanning points as described above, the respective processed parts 4a, 4b are placed at different corresponding positions X1, Y1, X2, Y2 with respect to the processed parts 4a, 4b. Machining axis discrimination marks 6a and 6b corresponding to the machining axes 3a and 3b laser processed in parallel are formed at the scanning time shown in FIG. 3A and the scanning time shown in FIG. 3B. Can be done.
[0024]
The apparatus of the present embodiment uses a microcomputer 21 as shown in FIG. 4 to perform the above-described operation control. Upon receiving an appropriate start signal, the microcomputer 21 is accompanied by various position information and other inputs in accordance with a control program stored in a built-in or externally connected program file 22, and an emission control means 23 as an internal function. A scanning control means 24 for controlling the operation of the scan motors MXa, MXb, MYa, MYb corresponding to the X galvanometer mirrors 2a1, 2b1 and the Y galvanometer mirrors 2a2, 2b2 for each machining axis 3a, 3b, and an actuator for the light shielding members 8a, 8b A light shielding control means 25 for controlling on / off of certain solenoids SLa and SLb, and a positioning control means 26 for driving the XY table 15 to perform common positioning control of the workpieces 4 and 4 work in a timely manner, and are necessary each time. Control signals such as driving and driving the laser oscillator 10 Stop laser emission, emission stop signal, MXa, MXb, MYa, MYb forward / reverse drive, drive stop signal, SLa, SLb on / off signal, XY direction forward / reverse positioning drive, drive stop signal and other signals whenever necessary Output and automatically execute the various operation controls. If there is a stop signal for some reason, the automatic control stops.
[0025]
The light shielding members 8a and 8b are shielded from light and released from light shielding by the solenoids SLa and SLb being turned on and off in cooperation with the springs 9a and 9b. Of course, any other actuator may be used. In some cases, a liquid crystal shutter can be used, and depending on the response performance of shading and shading cancellation, if the shading and shading cancellation control is performed separately, not only when the processing axis discrimination marks 6a and 6b are attached. The laser processing itself can be performed differently on the respective processing axes 3a and 3b without depending on the emission control of the laser 1. Further, in the present embodiment, parallel laser processing is performed on a plurality of processing parts 4a and 4b on different workpieces 4 using a plurality of processing axes, but they are set on the same workpiece 4. It is also possible to perform parallel laser processing with a plurality of processing axes on a plurality of processing parts.
[0026]
【The invention's effect】
According to the first feature of the multi-axis laser processing method of the first aspect of the present invention, the number of scan optical systems corresponding to the part to be processed is one, but only one laser light source and one emission control are required. It is only necessary for the laser light source, and a plurality of scanning optical systems can be aggregated in a range where a plurality of parts to be processed can be centrally arranged, and the necessary apparatus and control are simplified in inverse proportion to the number of laser light branches , Equipment installation space can be reduced and product cost can be reduced. In addition, individual laser processing using a plurality of processing axes of each processed part is based on the emission control of one laser beam, and there is an advantage that a processing error due to deviation of the laser beam emission control does not occur between the processed parts.
[0028]
According to the second feature of the invention of claim 1, one laser beam is branched into a plurality of machining axes, and laser machining common to a plurality of machining parts is performed, while machining is performed for each of the plurality of machining axes. Each part is marked with a machining axis discriminating mark differentiated under different position conditions, and by this differentiation, it is possible to discriminate which machining axis was machined by the machining axis. Individual processing management due to differences in dirt on the optical system and scan control deviations at each processing axis becomes easy.
[0029]
According to the first feature of the multi-axis laser processing apparatus of the invention of claim 2, the method of the first feature of the invention of claim 1 can be automatically achieved, and according to the second feature, the method is claimed. The method of the second aspect of the invention of item 1 can be automatically achieved.
[Brief description of the drawings]
[1] first in the embodiment of the present invention, it is a perspective view showing a multiple-axis laser processing apparatus including a second embodiment.
FIGS. 2A and 2B are explanatory views showing a state in which a machining axis discrimination mark according to the first embodiment of FIG. 1 is attached, in which FIG. 2A is a diagram corresponding to the first machining axis, and FIG. 2B is a second machining axis; FIG. 8C is a plan view of a portion to be machined with a machining axis discrimination mark.
FIGS. 3A and 3B are explanatory views showing a state in which a machining axis discrimination mark according to the second embodiment of FIG. 1 is attached, in which FIG. 3A is a diagram corresponding to the first machining axis, and FIG. 3B is a second machining axis; It is a figure corresponding to.
4 is a block configuration diagram of a control circuit of the apparatus of FIG. 1. FIG.
FIG. 5 is a perspective view showing a conventional laser processing apparatus.
[Explanation of symbols]
1, 1a, 1b Laser light 2a, 2b Scanning optical system 3a, 3b Processing axis 4 Processing object 4a, 4b Processing part 5a, 5b f · θ lens 6a, 6b Processing axis discrimination mark 7a, 7b Mask 8a, 8b Member 10 Laser oscillator 15 XY table 21 Microcomputer 22 Program file 23 Emission control means 24 Scan control means 25 Shading control means 26 Positioning control means

Claims (2)

Branched Les laser light into a plurality of leads to a plurality of scan optical systems, the same laser irradiation for the workpiece section corresponding to the scan optical system by scanning control through co the plurality of scan optical systems performs multiple axis laser processing method characterized by processing the mark in each of different positions in the light for each workpiece unit shielding the scan time of the laser beam becomes different on each machining axis. Branching means for branching laser light from one laser emission source into a plurality of parts, and scanning control of each branched laser light, respectively, irradiating a predetermined position on each workpiece through an fθ lens to perform laser processing between the plurality of scanning optical system, and the extraction control means for controlling the emission of Les chromatography the light emitting source, a scan control unit for controlling the common scan control a plurality of scan optical system, the fθ lens and the workpiece shielding at different time points the laser beams each branch, further comprising a light shielding control means for releasing the light shielding multiple axes laser processing apparatus according to claim to.

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