CN108500447B

CN108500447B - Laser processing apparatus and laser processing method

Info

Publication number: CN108500447B
Application number: CN201810095134.4A
Authority: CN
Inventors: 山本雅一; 二穴胜; 佐藤征识
Original assignee: Via Mechanics Ltd
Current assignee: Via Mechanics Ltd
Priority date: 2017-02-28
Filing date: 2018-01-31
Publication date: 2022-04-01
Anticipated expiration: 2038-01-31
Also published as: JP6783165B2; JP2018140417A; TW201832858A; CN108500447A; KR102334582B1; TWI732990B; KR20200067230A

Abstract

The present invention relates to a laser processing apparatus and a laser processing method. The present invention is directed to simultaneously ending machining using a plurality of laser irradiation units without reducing machining speed and without changing display of the same management information for each workpiece, when distributing laser pulses output from one laser oscillator to the plurality of laser irradiation units and performing both circuit machining and management machining on a workpiece placed on a table using each laser irradiation unit. A laser processing method for distributing laser pulses from a laser oscillator in a plurality of directions, moving the directions of the distributed laser pulses in two-dimensional directions, and performing both circuit processing and management processing on each of a plurality of workpieces, wherein the number of processing patterns of management information recorded in the management processing is made equal in all the management information.

Description

Laser processing apparatus and laser processing method

Technical Field

The present invention relates to a laser processing apparatus and a laser processing method for performing a piercing process using a laser beam on a workpiece such as a printed circuit board.

Background

Among machining apparatuses using laser light, there is known a so-called multi-axis type laser machining apparatus which divides laser pulses output from one laser oscillator into a plurality of laser irradiation units and simultaneously machines a printed circuit board mounted on a table using each laser irradiation unit to increase the speed of machining of the plurality of printed circuit boards.

In such a multiaxial laser processing apparatus, as the processing of the printed circuit board, both the processing of a hole or the like for an original circuit (hereinafter, referred to as circuit processing) and the processing of recording management information represented by characters, symbols or the like (hereinafter, referred to as management processing) may be performed. In the former, the processing is performed at the same coordinates and the same number of processes for each printed circuit board, but in the latter, since it is necessary to record characters, symbols, and the like differently for each printed circuit board, the processing is performed at different coordinates and different numbers of processes.

When circuit processing and management processing are performed on a plurality of printed boards, processing is simultaneously completed in each axis, and therefore, conventionally, as disclosed in patent document 1, for example, there is known a technique in which a shutter is provided in a path of a laser pulse in each axis and a laser pulse on the side where the number of processing in management processing is small is cut off using the shutter or processing in which management information is additionally processed using a laser pulse on the side where the number of processing in management processing is small is performed.

However, in the former technique, since the shutter is mechanically moved, the processing speed is reduced, and in the latter technique, the number of processed pieces of management information is different for each printed circuit board, and the same display is not performed.

Documents of the prior art

Patent document

Patent document 1: japanese patent No. 5236071.

Disclosure of Invention

Problems to be solved by the invention

Therefore, an object of the present invention is to simultaneously terminate processing using a plurality of laser irradiation units without reducing the processing speed and without changing the display of the same management information for each workpiece, in a case where laser pulses output from one laser oscillator are distributed to the plurality of laser irradiation units and both circuit processing and management processing are performed on a workpiece placed on a table using each laser irradiation unit.

Means for solving the problems

In order to solve the above problem, a typical laser processing apparatus among the inventions disclosed in the present application is a laser processing apparatus including: a laser pulse distribution unit that distributes laser pulses from the laser oscillator in a plurality of directions; a plurality of laser irradiation units each including a laser pulse scanning unit that moves the direction of the laser pulse distributed by the laser pulse distribution unit in a two-dimensional direction; a control unit configured to control both of the circuit processing and the management processing for the workpiece by using each of the plurality of laser irradiation units; and a pattern generating unit configured to generate a pattern of the management information recorded in the management processing, wherein the number of processes of the management information pattern is equal to each other in all the management information.

In addition, a typical laser processing method among the inventions disclosed in the present application is a laser processing method of distributing laser pulses from a laser oscillator in a plurality of directions, moving the directions of the distributed laser pulses in two-dimensional directions, and performing both circuit processing and management processing on each of a plurality of objects to be processed, wherein the number of processing of a pattern of management information recorded in the management processing is made equal in all the management information.

Effects of the invention

According to the present invention, when laser pulses output from one laser oscillator are distributed to a plurality of laser irradiation units and both circuit processing and management processing are performed on a workpiece placed on a table using each laser irradiation unit, processing using the plurality of laser irradiation units can be simultaneously terminated without reducing the processing speed and without changing the display of the same management information for each workpiece.

Drawings

Fig. 1 is a diagram for explaining a character pattern of management information in one embodiment of the present invention.

Fig. 2 is a configuration diagram of a 2-axis laser processing apparatus according to an embodiment of the present invention.

Fig. 3 is a diagram for explaining a management information area for recording management information in one embodiment of the present invention.

Fig. 4 is a timing chart in a case where circuit processing is performed on a printed board in one embodiment of the present invention.

Fig. 5 is a time chart in the case of performing management processing on a printed circuit board in one embodiment of the present invention.

Detailed Description

[ examples ] A method for producing a compound

In fig. 2, 1a denotes a laser irradiation unit serving as a first axis, and 1b denotes a laser irradiation unit serving as a second axis. Reference numeral 2 denotes a laser oscillator, and 3 denotes a beam splitter (beam splitter) which splits the laser pulse L1 excited by the laser oscillator 2 in 2 directions and inputs the split laser pulses to the

laser irradiation units

1a and 1b, respectively. Each of the

laser irradiation units

1a and 1b is provided with an electronic scanner (galvano scanner) 4a and 4b that moves the direction of the light-received laser pulse L2 in a two-dimensional direction, and an

f θ lens

5a and 5b that condenses the laser pulse emitted from these.

Reference numerals

10a and 10b denote printed boards to be processed, and reference numeral 7 denotes a table on which the printed

boards

10a and 10b are placed. The table 7 is movable in the X direction, which is the horizontal direction in the figure, and the Y direction perpendicular to the paper surface by a table driving unit 8, and is thereby movable relative to the

laser irradiation units

1a and 1 b.

Fig. 3 is a view of the printed

boards

10a and 10b placed on the table 7 as viewed from above. In each of the printed

boards

10a, 10b,

management information areas

11a, 11b for recording management information represented by characters, symbols, and the like are provided at positions corresponding to each other.

Reference numeral 20 denotes an overall control unit for controlling the overall operation of the apparatus, and is realized by a control unit mainly including a processing apparatus controlled by a program, for example. Reference numeral 21 denotes a laser excitation control unit that outputs a laser excitation command signal S for controlling excitation of the laser pulse L1 in the

laser oscillator

2, 22a and 22b denote electric control units that output electric (galvano) control signals Ga and Gb for controlling the operations of the

electric scanners

4a and 4b, respectively, 23 denotes a stage control unit that outputs a stage control signal T for controlling the operation of the

stage driving unit

8, and 24 denotes a machining control unit that controls a machining operation by controlling the laser excitation control unit 21, the

electric control units

22a and 22b, and the stage control unit 23.

The

electric control units

22a and 22b acquire current irradiation position information and rotation operation status from the

electric scanners

4a and 4b, respectively, and supply the information to the processing control unit 24. Similarly, the table control unit 23 also acquires current table position information and driving operation status from the table driving unit 8 and supplies the information to the machining control unit 24. The machining control unit 24 also controls the machining operation using the information and the like.

In fig. 2, each component or connection line in the overall control unit 20 includes a part of logic realized by a program. Further, a part of each component may be provided separately from the overall control unit 20. Further, the components and the connecting lines therebetween are mainly illustrated in portions that are considered necessary for the description of the present embodiment, and not all of them are illustrated. The laser processing apparatus includes various components, connection lines, and control functions in addition to those described herein, but are omitted here.

Reference numeral 26 denotes a processing data storage unit that stores processing data for circuit processing and management processing, and stores coordinates of a plurality of punching positions in the circuit processing, a plurality of management information to be recorded in the management processing, recording positions thereof, and the like. Reference numeral 27 denotes a pattern generating section for generating a pattern of management information represented by characters, symbols, and the like used for management processing, and is constituted by, for example, a storage means. When the management information is recorded in the

management information areas

11a and 11b, the processing control unit 25 performs processing using the management information pattern read from the pattern generation unit 27. The processing data storage unit 26 and the pattern generation unit 27 are separate from the overall control unit 20, but may be included in the overall control unit 20. When the pattern generation unit 27 is included in the overall control unit 20, the management information pattern may be generated using a program without being configured by a storage unit.

Fig. 1 is a diagram for explaining a management information pattern generated in the pattern generating section 27 in fig. 2. In each of the management information patterns, management information is recorded by punching a necessary rectangular position when a predetermined number of rectangles are arranged in a matrix. In the case of character patterns in which the numbers "1" and "2" are shown in fig. 1 (a), (B), (c), and (d), respectively, and the english characters "a" and "B" are shown, the rectangles at the positions of the punched holes are all smeared. According to the present invention, the number of perforations (in other words, the number of dots) of the character pattern is equal in all the character patterns, and is 18 in the case of the present embodiment. Although the matrix is shown in fig. 1 as being arranged at equal intervals, the predetermined number of the matrices need not be arranged at arbitrary intervals.

In the case of performing circuit processing on each of the printed

boards

10a and 10b in one embodiment of the present invention, the following operation is performed. Fig. 4 is a time chart in this case.

The electric control signals Ga, Gb rotate the

electronic scanners

4a, 4b in the on time domain, and stop them and make them stationary in the off time domain. When the electric control signals Ga and Gb are off, the laser excitation command signal S is turned on for a fixed time, and excitation of the laser pulse L1 is instructed to the laser oscillator 2. As a result, the fixed-time laser pulse L1 is excited, and when the excitation ends, the electric control signals Ga and Gb are turned on, and the

electronic scanners

4a and 4b rotate again.

The laser pulse L2 emitted from the beam splitter 3 is incident on the

stationary galvano scanners

4a and 4b, and the laser pulse L2 deflected in the respective directions is irradiated to the printed

boards

10a and 10b via the

f θ lenses

5a and 5 b.

When the printed

boards

10a and 10b are punched to be processed as a circuit, the punching is performed at the same coordinates and the same number of processes, and therefore, as shown in the figure, the electric control signals Ga and Gb are turned on and off at the same timing. As a result, the circuit processing in each of the printed

boards

10a and 10b can be completed simultaneously.

After the circuit processing is completed, the process proceeds to the management processing in the

management information areas

11a and 11b of the printed

boards

10a and 10b, and the operation is performed as follows. Fig. 5 is a time chart in this case.

The differences from fig. 4 are the following points. That is, it is common that the management information recorded in each of the

management information areas

11a, 11b is different from each other. Therefore, the electric control signals Ga and Gb are not necessarily turned on and off at the same timing, and both signals may be delayed.

For example, it is considered that the

laser irradiation units

1a and 1b record the numbers "1" and "2" in the

management information areas

11a and 11b, respectively, along the paths indicated by arrows in fig. 1 (a) and (b), respectively.

For example, it is known that: in the transfer from the fourth to the fifth perforation, the movement of the electrical scanner 4b takes more time than the movement of the electrical scanner 4 a. In such a case, if both the

galvano scanners

4a and 4b are stationary and both the electric control signals Ga and Gb are off, in other words, if the electric control signal Gb of the galvano scanner 4b at a later stationary time is off, the laser excitation command signal S is turned on to excite the laser pulse by the laser oscillator 2.

In this way, with respect to the management information, the laser oscillator 2 can excite the laser pulse and irradiate the

management information regions

11a and 11b with the laser pulse L2 at the same time. As a result, the management processing in each of the printed

boards

10a and 10b can be simultaneously completed.

According to the above embodiment, the shutter (shutter) requiring mechanical movement is not provided, and the display of the management information on the printed

boards

10a and 10b is not changed from one another, and the processing for the circuit and the processing for the management in each of the printed

boards

10a and 10b can be simultaneously completed.

In the above embodiment, the description has been made assuming that the electric control signals Ga and Gb are turned on and off at the same timing when circuit processing is performed on each of the printed

boards

10a and 10b, but it is needless to say that the laser excitation command signal S needs to be turned on and the laser oscillator 2 needs to excite the laser pulse after the later electric control signal is turned off, as in the case of performing management processing, in consideration of the fact that a slight deviation occurs in the response speed of the

electric scanners

5a and 5b even in the circuit processing.

Description of reference numerals

1a, 1 b: laser irradiation unit 2: the laser oscillator 3:

beam splitters

4a, 4 b:

electric scanners

5a, 5 b: f θ lens, 7: a workbench 8:

table driving portions

10a, 10 b: printed

boards

11a, 11 b: management information area 20: the overall control unit 21: laser

excitation control units

22a, 22 a: the electric control section 23: table control unit 24: the machining control unit 26: processing data storage unit 27: a pattern generation unit (S): laser excitation control signals Ga, Gb: an electric control signal T: stage control signals L1, L2: a laser pulse.

Claims

1. A laser processing device is provided with:

a laser pulse distribution unit that distributes laser pulses from the laser oscillator in a plurality of directions;

a plurality of laser irradiation units each including a laser pulse scanning unit that moves the direction of the laser pulse distributed by the laser pulse distribution unit in a two-dimensional direction;

a control unit configured to control both of the circuit processing and the management processing for the workpiece by using each of the plurality of laser irradiation units; and

a pattern generating unit for generating a pattern of the management information recorded in the management processing,

the laser processing apparatus is characterized in that,

the processing quantity of the management information pattern is equal in all the management information,

in the management machining, the laser oscillator excites a laser pulse based on a time at which the movement end timing is latest in each of the laser pulse scanning units.

2. A laser processing method for distributing laser pulses from a laser oscillator in a plurality of directions, moving the directions of the distributed laser pulses in two-dimensional directions, and performing both circuit processing and management processing on each of a plurality of workpieces, the laser processing method being characterized in that the number of processing of a pattern of management information recorded in the management processing is made equal in all the management information,

in the management processing, excitation of the laser pulse is activated based on a time at which the movement end time is latest in each of the laser pulse scans.