JP2001205467A - Machine for laser machining and method of machining - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a machine for laser machining with which a machining area is shifted and the machinable area is not reduced in the machining even when the area is located at a remote position from the center of a galvanoscan area when a deep hole machining is carried out in an area where the inclined angle of a laser beam does not take place. SOLUTION: A galvanocontrol means and a control means for a machining table are additionally provided with a means which adds an offset value, and an addition is performed when an offset control is carried out, thus a deep-hole machining is easily performed even when the maehinable area is located off the center of a galvanoscan area.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing machine for performing processing using an optical device such as a galvanometer mirror or an f.theta. Lens for positioning a laser beam.

[0002]

2. Description of the Related Art Conventionally, a laser beam machine which performs processing using an optical device for positioning a laser beam, such as a galvanometer mirror or an fθ lens, is configured as shown in FIGS.

A laser oscillator 1 outputs a laser beam A.

[0004] Reference numerals 21 (a) and (b) denote reflection mirrors, which apply the laser beam A output from the laser oscillator 1 to the reflection mirror 2
1 guides to the galvanometer mirror 31.

[0005] The galvanometer mirror 31 has a two-axis configuration and includes 31 (a) and 31 (b), which are connected to galvanometer motors 32 (a) and 32 (b), respectively.

By changing the angle between the galvanomirrors 31 (a) and 31 (b), the path of the laser beam A is changed according to the combination thereof to perform positioning.

Reference numeral 33 denotes a galvano control unit, which comprises a galvano control unit 34.

The galvanometer control unit 34 controls the galvanomirror 3 to position the laser beam A at a desired position.
A drive command for changing the angle of 1 is output to the galvano motor 32.

The f / θ lens 4 includes the galvanomirror 3
The laser beam A positioned by 1 is incident, is condensed on the work 6, and processes the work 6.

The range to be processed is determined by the combination of the galvanometer mirror 31 and the f · θ lens 4. This is the galvano scan area B. When the processing is completed, the processing table controller 52 sends the X-axis motor 53 and the Y-axis motor A drive command is output to 54 and the processing table 51 is driven to change the processing range to the next galvano scan area.

By repeating this, all the drilling operations on the work 6 are executed.

The processing will be further described with reference to the flowchart of FIG.

The drill program 701 has an area division 70
2, the area is divided into galvano coordinates and machining table coordinates for each galvano scan area.

The machining table coordinates are converted into machining table position information by machining table coordinate conversion 704, a drive command is generated by a machining table drive command 705, and output to the machining table 706.

The area-divided galvano coordinates are converted into the angle of a galvanometer mirror by a galvano data converter 707, a drive command is generated by a galvano drive command 708, and output to a galvano scanner 709.

The galvano scanner 709 comprises a galvanometer mirror and a galvanometer motor.

When a galvano drive command is generated, a laser oscillation control command is also generated.
Output to 0. Thereby, the laser beam is positioned and drilling is performed.

[0018]

In the above-mentioned conventional laser beam machine, the laser beam positioned by the two-axis galvanometer mirror 31 is a laser beam inclined with respect to the perpendicular to the workpiece 6.

This is corrected by the fθ lens so that it becomes a laser beam perpendicular to the work 6 and focused on the work 6 for processing.

However, the correction by the fθ lens does not completely correct the inclination, and as shown in FIG.
The laser beam is condensed on the work 6 and processed with a slight amount of inclination as the distance from the center of the θ lens increases.

This slight amount of inclination is called a tilt angle.

When the depth of the machined hole of the work 6 is shallow due to the presence of the falling angle, trouble-free machining can be performed as shown in FIG. When the depth is deep, the positions of the upper hole and the lower hole are shifted as shown in FIG. If the falling angle is 2 °, FIG.
If the resin thickness of (b) is 0.8 mm, about 0.028 m
The positions of the upper hole and the lower hole are shifted by m.

As described above, when the depth of the machined hole is deep, the position of the upper hole and the position of the lower hole are displaced. Therefore, an area where the amount of displacement is within an allowable range is searched for. It is necessary to process within.

When the angle of the galvanometer mirror 31 is set at the center of the maximum deflection angle, it is called a galvano origin.
The positional relationship between the galvanomirror and the fθ lens is adjusted so that the laser beam is perpendicularly incident on the center of the fθ lens when the galvanomirror is at the position of the galvano origin.

However, this galvanomirror and fθ
It is difficult to completely adjust the positional relationship of the lenses, and the positional relationship is slightly shifted.

Therefore, even when the galvanometer mirror is located at the origin of the galvanometer, the laser beam may be slightly deviated from the center of the fθ lens or may not be incident vertically. As a result, as shown in FIG. 13, when the depth of the processing hole is large, the center of the deep hole processing area in which the position of the upper hole and the lower hole can be processed with less displacement is set to the center of the galvano scan area. It is a place deviated from.

In the conventional laser beam machine, the area that can be machined is an area having the center of the galvano scan area as the center of the machining area. Therefore, the center of the deep hole machining area is shifted from the center of the galvano scan area. In this case, there is a problem that deep hole processing cannot be performed unless the area for deep hole processing in which deep hole processing can be performed is further reduced.

[0028]

According to a first aspect of the present invention, there is provided a laser oscillator for outputting a laser beam and a work to be machined by the laser beam.
A movable processing table, an fθ lens disposed between the laser oscillator and the work, a galvano mirror disposed between the laser oscillator and the fθ lens, and an angle of the galvanomirror variable. A laser processing machine comprising a drive unit and a control unit for controlling the drive unit, wherein the control unit is provided with a function of performing a control for adding an offset value to a drive angle of a galvanometer mirror in addition to a normal control. It was done.

Further, the invention according to claim 2 is configured such that the control means adds an offset value to the movement of the processing table in accordance with the offset value added to the drive angle of the galvanomirror. is there.

According to a third aspect of the present invention, there is provided a laser oscillator for outputting a laser beam, a work table on which a work to be processed by the laser beam is mounted, and which is movable between the laser oscillator and the work. A laser processing machine provided with an fθ lens to be used and a galvanomirror disposed between the laser oscillator and the fθ lens and having a variable angle.
A moving means for changing the position of the θ lens in a direction parallel to the workpiece, and a control means for controlling the moving means and adding an offset value to the moving value of the fθ lens in addition to the normal control are added. is there.

According to a fourth aspect of the present invention, there is provided a laser processing method for guiding a laser beam output from a laser oscillator to a work through a galvanomirror and an fθ lens, wherein (a) at least a processing position of the work. (B) determining whether to perform normal processing or offset processing; and (c) when determining to perform normal processing, changing the angle of the galvanometer mirror to the processing position of the workpiece. (D) adding an offset value to the angle of the galvanomirror during normal processing when it is determined that offset processing is performed; and
Moving the processing table on which the work is placed in accordance with the offset value, and guiding the laser light to the processing position of the work.

The invention according to claim 5 is a laser processing method for guiding and processing a laser beam output from a laser oscillator to a work via a galvanometer mirror and an fθ lens, wherein (a) at least the processing position of the work (B) determining whether to perform normal processing or offset processing, and (c) when determining to perform normal processing, changing the angle of the galvanomirror to change the processing position of the workpiece. And (d) when it is determined that offset machining is to be performed, when the laser beam is guided to the workpiece processing position by changing the angle of the galvanomirror, the fθ lens is moved in a direction parallel to the workpiece. And a step of moving to a laser beam.

[0033]

According to the present invention, according to the first aspect of the present invention, there is provided a driving means for changing an angle of a galvanomirror, and a control means for controlling the driving means, wherein the control means performs a normal control. In addition, by performing control for adding an offset value to the drive angle of the galvanomirror, there is an effect that the machining area can be easily shifted by the offset value simply by selecting the offset control.

According to the second aspect of the invention, the work is shifted by controlling the offset of the galvanometer mirror so that the machining position is not shifted by the shift of the machining area.

According to a third aspect of the present invention, the fθ lens is moved in the direction parallel to the workpiece by an amount corresponding to the offset value.
It works to eliminate the influence of optical distortion without shifting the processing area.

According to the fourth aspect of the present invention, when it is determined that the offset machining is to be performed, an offset value is added to the normal machining state, and the machining area is arbitrarily changed.

The invention described in claim 5 operates to remove the influence of optical distortion without changing the position of the processing area when it is determined that offset processing is performed.

An embodiment of the laser beam machine according to the present invention will be described below with reference to FIGS.

(Embodiment 1) Hereinafter, Embodiment 1 of the present invention will be described with reference to FIGS.

Reference numeral 1 denotes a laser oscillator which outputs a laser beam A.

21 (a) and (b) are reflection mirrors. The laser beam A output from the laser oscillator 1 is reflected by the reflection mirror 2
1 guides the light to the galvanometer mirror 31.

The galvanomirror 31 has a two-axis configuration and includes 31 (a) and 31 (b).

Numeral 32 denotes a galvano motor and a galvano mirror 3
Connected to 1.

The galvano motor 32 is also a galvano mirror 31
Similarly, it has a biaxial configuration.

By changing the angle of the galvanometer mirrors 31 (a) and 31 (b), the path of the laser beam A is changed by the combination thereof to perform two-dimensional positioning.

Reference numeral 33 denotes a galvano control unit, which comprises a galvano control unit 34 and an offset control unit 35.

The galvano control unit 34 controls the galvanomirror 3 to position the laser beam A at a desired position.
A drive command for changing the angle of 1 is output to the galvano motor 32.

The offset controller 35 controls the laser beam A
A drive command for further adding an offset to the position is output and added to the output of the galvano control unit 34.

Reference numeral 4 denotes an f.theta. Lens,
The laser beam A positioned by 1 is incident, is condensed on the work 6, and processes the work 6.

The range to be processed is determined by the combination of the galvanomirror 31 and the f / θ lens 4. This is the galvano scan area B. When the processing is completed, the processing table controller 52 sends the X-axis motor 53 and the Y-axis motor A drive command is output to 54 and the processing table 51 is driven to change the processing range to the next galvano scan area.

By controlling the offset control unit 35 to add an offset to the angle of the galvanometer mirror 31, the position of the laser beam incident on the f · θ lens 4 can be changed, and the optimum laser beam path for processing can be changed. You can choose.

(Embodiment 2) Hereinafter, Embodiment 2 of the present invention will be described with reference to FIGS.

FIGS. 3 and 4 are obtained by adding a path to the configuration of the first embodiment so that the drive command output by the offset control unit 35 is also output to the machining table control unit 52.

The machining table controller 52 includes an axis controller 55
The drive command from the offset control unit 35 is added to the drive command of the X-axis motor 53 and the Y-axis motor 54 output by the controller.

As a result, the offset applied to the galvanomirror 31 is also applied to the machining table 51. As a result, the position of the laser beam incident on the f · θ lens 4 is not changed to the position of the galvano scan area B with respect to the work 6. Can be changed, and an optimal laser beam path for processing can be selected.

Embodiment 3 Hereinafter, Embodiment 3 of the present invention will be described with reference to FIG.

FIG. 5 shows a configuration in which an axis offset control unit 56 is added to the configuration of the second embodiment, and the output of the axis offset control unit 56 is added to the output of the axis control unit 55. It is configured to output an offset control execution command to the offset control unit 56.

Thus, the offset control of the machining table 51 is executed in synchronization with the offset control of the galvanomirror 31, and the offset of the galvanomirror 31 and the offset of the machining table 51 can be optimally controlled.

(Embodiment 4) Hereinafter, Embodiment 4 of the present invention will be described with reference to FIG.

FIG. 6 shows the offset control unit 3 according to the first embodiment.
Lens drive motor 41 and lens drive motor 41 connected to a mechanism for driving f · θ lens 4 instead of removing lens 5
And a f.theta. Lens control device for outputting a drive command to the camera.

As a result, the f / θ lens 4 can be offset-controlled by the f / θ lens controller 42 and the lens driving motor 41, and only the position of the laser beam incident on the f / θ lens 4 can be changed. And the optimum laser beam path for processing can be selected.

Embodiment 5 Hereinafter, Embodiment 5 of the present invention will be described with reference to FIG.

FIG. 7 is a flowchart showing the processing method of the present invention.

The drill program 701 is divided into an area division 70
2, the area is divided into galvano coordinates and machining table coordinates for each galvano scan area.

If it is determined in the offset control determination 703 that the offset control is to be performed, the offset value addition 71
In step 1, the offset value is added to the galvano coordinates and the processing table coordinates subjected to the area division processing.

The machining table coordinates are converted into machining table position information by machining table coordinate conversion 704, a drive command is generated by a machining table drive command 705, and output to the machining table 706.

The area-separated galvano coordinates are converted to the angle of a galvanometer mirror by a galvano data converter 707, a drive command is generated by a galvano drive command 708, and output to a galvano scanner 709.

The galvano scanner 709 includes a galvanometer mirror and a galvanometer motor.

When generating a galvano drive command, a laser oscillation control command is also generated.
Output to 0.

By performing the offset control in this manner, the position at which the laser beam enters the f · θ lens can be controlled, and the optimum laser beam path for processing can be selected.

Embodiment 6 Hereinafter, Embodiment 6 of the present invention will be described with reference to FIG.

FIG. 8 shows a processing path different from the galvano coordinates and machining table coordinates by changing the position of the offset control determination 703 in the flow chart of the fifth embodiment. Calculation 712
, The amount of movement of the f · θ lens is calculated, and when the offset control is not performed, the amount of movement of the f · θ lens is set to 0, and
f · θ lens driving means 714 by θ lens driving command 713
Is performed so as to generate and output a command to drive.

Thus, the offset control can be performed only on the f / θ lens without performing the offset control on the galvanomirror and the processing table, and the position at which the laser beam enters the f / θ lens can be controlled. Thus, it is possible to select an optimal laser beam path for processing.

What is common to the first to sixth embodiments is that the position and the control of the laser beam incident on the f.theta. Lens are variable and controlled, so that processing defects due to optical distortion do not occur. It is easy to select the optimum beam path for processing.

[0075]

As is apparent from the above description, according to the first aspect of the present invention, there is provided a laser oscillator for outputting a laser beam, a processing table on which a workpiece to be processed by the laser beam is placed and movable. A fθ lens disposed between the laser oscillator and the workpiece, a galvano mirror disposed between the laser oscillator and the fθ lens, the angle of which is variable, a driving means for changing the angle of the galvanomirror, and a galvanomirror driving means Control means for performing the control of, the control means is configured to perform control to add an offset value to the drive angle of the galvanometer mirror in addition to the normal control,
The position of the laser beam incident on the fθ lens can be easily changed, and the optimum laser beam path for processing can be selected in the entire galvano scan area.

According to the invention of claim 2, according to claim 1,
In addition to the configuration of the invention, the control means can add the offset value to the movement of the processing table in accordance with the offset value added to the drive angle of the galvanomirror, thereby changing the position at which the work is processed. Without doing
Only the position of the laser beam incident on the fθ lens can be easily changed, and the optimum laser beam path for processing can be selected in the entire galvano scan area.

According to the third aspect of the present invention, a laser oscillator for outputting laser light, a work table on which a work to be processed by the laser light is mounted and movable, and a laser oscillator and the work are arranged. Lens, a galvanomirror disposed between the laser oscillator and the fθ lens, the angle of which is variable, and moving means for changing the position of the fθ lens in a direction parallel to the workpiece, and controlling the moving means. In addition to the effect of the normal control, a configuration is provided in which control means for performing control for adding an offset value to the movement value of the fθ lens is provided. Only the position of the laser beam incident on the fθ lens can be easily changed, and the optimum laser beam path for processing can be selected in the entire galvano scan area. You.

As described above, when a conventional deep hole is machined, a range where the optical distortion is small is searched for from the center of the galvano scan area, and the galvano scan area for deep hole machining is processed. The present invention according to claims 1 to 5, wherein a lens must be replaced with a high-precision fθ lens in order to make a galvano scan area for drilling as large as possible, or the optical axis must be strictly adjusted with a lot of trouble. According to this, it is possible to easily set a portion having a small optical distortion as a galvano scan area for deep hole processing, and furthermore, it is not necessary to make a high-precision fθ lens, or to perform labor-intensive and strict optical axis alignment. However, the optimum galvano scan area for deep hole machining can be easily set by offset control.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a laser processing machine according to a first embodiment of the present invention.

FIG. 2 is a detailed view of an inventive portion of the laser beam machine according to the first embodiment of the present invention.

FIG. 3 is a configuration diagram of a laser processing machine according to a second embodiment of the present invention.

FIG. 4 is a detailed view of a laser processing machine according to a second embodiment of the present invention;

FIG. 5 is a detailed view of a laser processing machine according to a third embodiment of the present invention;

FIG. 6 is a configuration diagram of a laser processing machine according to a fourth embodiment of the present invention.

FIG. 7 is a control block diagram of a laser beam machine according to a fifth embodiment of the present invention.

FIG. 8 is a control block diagram of a laser beam machine according to a sixth embodiment of the present invention.

FIG. 9 is a configuration diagram of a conventional laser beam machine.

FIG. 10 is a detailed view of a galvano control device of a conventional laser beam machine.

FIG. 11 is a control block diagram of a conventional laser beam machine.

FIG. 12 is an explanatory diagram of a tilt angle of a laser beam.

FIG. 13 is an explanatory diagram of an influence of a tilt angle of a laser beam on processing.

FIG. 14 is a relationship diagram of a galvano scan area in a deep hole machining area.

[Description of Signs] 1 Laser oscillator 21 (a), 21 (b) Reflecting mirror 31 (a), 31 (b) Galvano mirror 32 (a), 32 (b) Galvano motor 33 Galvano control unit 34 Galvano control unit 35 Offset control unit 4 f · θ lens 41 Lens drive motor 42 f · θ lens control device 51 Processing table 52 Processing table control device 53 X-axis motor 54 Y-axis motor 55 Axis control unit 56 Axis offset control unit 6 Work 701 Drill program 702 Area division 703 Offset control determination 704 Machining table coordinate conversion 705 Machining table drive command 706 Machining table 707 Galvano data conversion 708 Galvano drive command 709 Galvano scanner 710 Laser controller 711 Offset value addition 712 fθ lens position movement amount Calculation 713 fθ lens drive command 714 fθ lens drive unit

Continuation of the front page F term (reference) 2H087 KA19 KA26 LA22 4E068 AF00 CB02 CD11 CD13 CE02 CE04 9A001 HH34 JJ49 JJ61 KK54

Claims (5)

[Claims] 1. A laser oscillator for outputting laser light, a work table on which a work to be processed by the laser light is mounted and movable, an fθ lens disposed between the laser oscillator and the work, and a laser oscillator A galvanomirror arranged between the lens and the fθ lens, the angle of the galvanomirror being variable, a driving means for varying the angle of the galvanomirror, and a control means for controlling the driving means, wherein the control means comprises a normal control. In addition, a laser processing machine that performs control to add an offset value to the drive angle of the galvanometer mirror. 2. The laser beam machine according to claim 1, wherein the control means adds the offset value to the movement of the processing table in accordance with the offset value added to the drive angle of the galvanometer mirror. 3. A laser oscillator for outputting laser light, a work table on which a work to be processed by the laser light is mounted and movable, an fθ lens arranged between the laser oscillator and the work, and a laser oscillator. A moving means for changing the position of the fθ lens in a direction parallel to the workpiece, and a moving means for controlling the moving means.
A laser processing machine provided with control means for performing control for adding an offset value to a movement value of a lens. 4. A laser processing method for guiding a laser beam output from a laser oscillator to a work through a galvanometer mirror and an fθ lens, wherein: (a) setting at least a work position of the work; A) determining whether to perform normal processing or offset processing;
(C) guiding the laser beam to the processing position of the workpiece by changing the angle of the galvanomirror when it is determined to perform normal processing; and (d) performing normal processing when determining to perform offset processing. Adding an offset value to the angle of the galvanomirror, moving a processing table on which the work is mounted in accordance with the offset value, and guiding a laser beam to a processing position of the work. 5. A laser processing method for guiding a laser beam output from a laser oscillator to a work through a galvanometer mirror and an fθ lens, wherein: (a) setting at least a work position of the work; And (c) guiding the laser beam to the workpiece processing position by changing the angle of the galvanomirror when it is determined that the normal processing is performed. (D) moving the fθ lens in a direction parallel to the workpiece when changing the angle of the galvanomirror to guide the laser beam to the workpiece processing position when it is determined that the offset processing is performed. Processing method.