WO2015046926A1

WO2015046926A1 - Continuous laser processing method using multiple positioning control, and system applying same

Info

Publication number: WO2015046926A1
Application number: PCT/KR2014/008981
Authority: WO
Inventors: 이태경; 박현주; 김석규; 이혜진
Original assignee: 주식회사 이오테크닉스
Priority date: 2013-09-30
Filing date: 2014-09-25
Publication date: 2015-04-02

Abstract

Disclosed are a laser processing method and a laser processing system applying the same. The laser processing method comprises the steps of: driving a low-rate driver having a workpiece mounted and moving, to the pattern formation position (target position) of the workpiece, the processing region of a high-rate driver which laser-processes the workpiece; laser-processing if the pattern formation position of the workpiece enters into the processing region of the high-rate driver; and transferring the low-rate driver to the next pattern formation position of the workpiece during the laser-processing. DRWAING: FIG. 1: 110 Control host 120 Laser drive 130 Laser system 140 Scanner control part 150 Scanner system 160 Stage control part 170 Stage system AA Feedback (FB)

Description

Continuous Laser Processing Method Using Multi-Position Control and Its System

The present invention relates to a continuous processing method using a laser beam, and more particularly, to a laser processing method by a multi-position control of a low speed driver and a high speed drive, and a laser processing system using the same.

One of the conventional methods is a method in which the entire processing target area is paneled into a small area to fit the processing range of the high speed driver, and then the low speed driver is moved to each panel position and processed with the high speed driver. This method takes a considerable amount of time to move and stop the panel position of the low speed actuator and is not efficient in the way that the boundary must be separated according to the machining data.

In order to solve this problem, a method of processing a combination of a low speed driver and a high speed driver has been devised, and a method of giving a position command simultaneously by filtering the processing path at a high speed and a low speed for continuous processing. The problem with this method is that it is difficult to determine the speed when processing the movement path between machining pattern positions corresponding to the simple movement without machining. If there is a guarantee that the next pattern is within the range of the high speed drive in consideration of the machining time, the simple moving speed can be set to the maximum speed of the high speed drive. At this time, if the determination of the moving speed is wrong and the low speed driver is set to the speed of the high speed driver for the path that cannot be followed, processing defects will occur. You have no choice but to set the movement speed, which reduces productivity. In addition, all the paths must be moved, causing unnecessary movement and vibration.

The present invention proposes a method capable of maximum high speed machining by fully utilizing the processing range of the high speed driver by effective feedback control of the high speed driver and the low speed driver.

Laser processing method according to one type of the invention:

In a method for performing laser processing using a high speed driver and a low speed driver,

Moving the low speed driver to a first target position;

Performing laser processing if at least one processing pattern of the workpiece is located within a processing region of the high speed driver while the low speed driver is moved to a first target position; And

And after the high speed driver processes the pattern, the low speed driver moves to a second target position.

According to an embodiment of the present invention, while the low speed driver moves to the first target position, the high speed driver receives feedback of the movement of the low speed driver and corrects the position.

According to another embodiment of the present invention, the pattern is a shape that is drawn from the time when the laser processing On (On) to the off (Off) in the laser processing.

According to another embodiment of the present invention, the first target position or the second target position is determined in consideration of the next machining pattern position of the workpiece.

According to another embodiment of the present invention, when the high speed driver merely moves without performing laser processing, the high speed driver is located at the boundary of the processing region.

According to another embodiment of the present invention, in determining the first target position or the second target position, the determination is made in consideration of the difference between the moving speeds of the high speed driver and the low speed driver.

Laser processing method according to another type of the invention:

Driving the low speed driver on which the workpiece is mounted to move the machining region of the high speed driver that performs laser processing on the workpiece to a pattern forming position (target position) of the workpiece;

Performing laser processing when the patterning position of the workpiece is in the machining region of the high speed driver; And

And transferring the low speed driver to a next pattern forming position for the workpiece while the laser processing is being performed.

The laser processing method according to the present invention may further include correcting a position of the high speed driver by feeding back position information of the low speed driver.

In addition, according to an embodiment of the laser processing method according to the present invention, the laser exit point of the high speed driver is located at the boundary of the processing area facing the pattern formation position when the low speed driver is transferred, The pattern forming region for the workpiece is entered into the processing region of the high speed driver to immediately start laser processing.

According to a specific embodiment of the present invention, the high speed driver is a galvanometer, and the low speed driver is a stage.

According to a specific embodiment of the present invention, the low speed driver is any one of the XY table, hybrid stage or gantry stage.

Laser processing system according to one type of the invention:

As a system for performing the laser processing method,

A low speed driver on which the workpiece is mounted;

A high speed driver for performing laser processing on the workpiece mounted on the low speed driver;

An encoder provided to the low speed driver so that the low speed driver feeds back position information;

And a control host controlling the low speed driver and the high speed driver to correct the position of the high speed driver using the position information.

Laser processing system according to another type of the invention:

In the laser processing apparatus comprising a high speed driver and a low speed driver,

The low speed driver is moved to a first target position, and while the low speed driver is moved to a first target position, laser processing is performed if at least one processing pattern of a workpiece is located in a processing area of the high speed driver. After the high speed driver processes the pattern, the low speed driver includes a control unit for controlling to move to the second target position.

According to one embodiment of the invention, the low speed driver is mounted on the workpiece, the high speed driver includes a laser processing unit.

According to another embodiment of the present disclosure, the control unit corrects the position by receiving the movement of the low speed driver while the low speed driver moves to the first target position.

The laser processing method according to the present invention searches for the target position to be processed now and the next target position to be processed later, so that as many patterns as possible are located within the processable range of the high speed driver, By taking directionality into consideration, the low speed drive finds the optimum path (advanced position in consideration of the machining direction) to minimize movement.

In the case of simple movement, it is assumed that the maximum speed of the high speed driver is to be processed. If the position to be processed is already within the processing range, processing is performed immediately. The machining time can be shortened.

The method of checking whether the machining can be started in real time is possible by controlling the output of the high speed driver through feedback monitoring of the low speed driver. If the low speed drive is not in the position to be machined, the high speed drive can move to its machining position while compensating for the feedback of the low speed drive when it enters the machining area. By applying this operation in real time to a high speed drive, excellent machining quality and high productivity can be obtained.

In the conventional method of processing by paneling, since the low speed driver must be processed after stopping, the non-working time is considerably present, whereas the continuous processing of the present invention does not apply the concept of paneling, thereby enabling faster processing. In addition, unlike the conventional method of simply distributing the filtered continuous position data to the low speed and the high speed driver, the present invention may control the output of the high speed driver and the actual processing start time in real time in consideration of the feedback of the low speed driver. This means that the moving speed of the high speed driver can be brought quickly regardless of the distance between the unprocessed and the unprocessed sections between machining, and the overall machining time can be shortened by compensating for the error between the output of the low speed driver and the actual movement. Make it possible.

In addition, in consideration of the processing range of the high-speed drive machine to be processed in the future to search for the position of the shape to include as many shapes as possible, to shorten the movement path and to be able to move to the next position in advance. This optimal position can complement the responsiveness of the low-speed actuator and can maximize productivity by reducing unnecessary movement and time since it does not follow the machining trajectory.

1 is a perspective view of a part of a laser processing system for performing a laser processing method according to the present invention.

2 is a schematic block diagram of a laser processing system according to the present invention.

3 is a block diagram illustrating a laser processing method according to the present invention.

4 is a flowchart illustrating a laser processing method according to the present invention.

5 is a view for explaining a laser processing method according to the present invention, and illustrates a processing method when two patterns exist within a processing range.

6 is a view for explaining a laser processing method according to the present invention, and illustrates a processing method in the case where a processing target pattern exists within different processing ranges.

FIG. 7 is a view for explaining a laser machining method according to the present invention, which is a graph showing a change in the moving speed of the low speed driver in the non-processing region and a laser machining point when the target position is reached.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the laser processing method according to the present invention.

Referring to Figure 1, the laser machining system (Laser Machining System 100) is also commonly referred to as a laser marker (Marker), the stage system (hereinafter, the stage, 170) on which the workpiece 99 is mounted and the workpiece ( Laser system 130 for generating a laser beam B of a high energy state required for the mechanical processing of the laser beam 99, and a laser beam from the laser system 130 to a specific position of the workpiece. It is provided with a scanner system (hereinafter scanner) 150 having a plurality of

galvanometers

151, 152 for focusing or landing the beam. The stage 170 is a low speed driver that moves on the XY coordinates in a direction parallel to the plane of the workpiece 99, and the scanner system 150 is lasered from the laser system 130 by two galvanometers. The beam B is concentrated or landing at a specific position on the surface of the workpiece 99.

As the low speed driver in the present invention, one of the generally known X-Y table, hybrid stage or gantry stage can be selected.

2 is a block diagram schematically showing the overall configuration of the laser processing system 100.

As described above, the laser processing system 100 according to the present invention basically includes a stage 170 on which the workpiece 99 is mounted and a stage controller 160 for driving the stage 170.

Referring to FIG. 2, the laser machining system 100 generates a high energy laser beam B required for the mechanical processing of the workpiece 99. And a stage 170 on which a laser driver 120 driving the same, a work piece 99 processed by the laser beam, and a stage controller 160 driving the stage 170 are basically included. do.

The laser processing system 100 may optically control the advancing direction of the laser beam emitted from the laser system 130 to concentrate or land the laser beam at a specific position of the workpiece 99. And a scanner controller 140 for driving the scanner 150.

In addition, the laser processing system 100 further includes a control host 110 for controlling the laser system 120 and the scanner system 130 through the laser driver 120 and the scanner controller 140. do. In the present invention, the control host may simply be referred to as a "control unit", while the control unit may include an encoder.

In the structure as described above, the stage 170 feeds back the position or coordinate information of the stage or the workpiece to be mounted to the control host 110 using an encoder provided therein.

The control host 110 or the controller may correct the position by receiving the feedback of the movement of the low speed driver while the low speed driver moves to the target position. That is, in the case of laser processing, the control host 110 which receives the feedback signal regarding the movement coordinates of the stage 170 which continuously changes the position of the workpiece in real time, the workpiece 99 on the stage 170 continuously moving. The scanner system 150 is controlled by reflecting the position information of the stage in order to accurately land the laser beam on the surface of the specific position. That is, the landing coordinates of the laser beam determined by the scanner system 150 are compensated by the travel distance by the stage 170, so that the landing of the laser beam relative to the workpiece on the stage is desired even if the stage is driven continuously. Will be done on location.

In the present invention, the position to be processed and the position to be processed later is searched so that as many patterns as possible are located within the processable processing range of the high speed drive, and the low speed drive is optimized by considering the directionality of the subsequent travel direction. Find the path (advanced position considering the machining direction) to minimize the movement. Here, the "pattern" is a shape which is drawn from a time point at which the laser is turned on to a time point at which the laser is turned off in laser processing.

In the present invention, while the low speed drive is in operation, the laser processing starts immediately when a pattern enters into the processing area of the high speed drive. At this time, the positional movement by the low speed driver is reflected in the position control of the high speed driver as feedback. Here, the low speed driver has a considerably longer response delay than the high speed driver.

The stage, which is a low speed driver, has a considerably longer acceleration time required to reach the target position and a deceleration time required to stop at the target speed, and also limits the maximum speed. Acceleration and deceleration characteristics range from 0.1g to 3g, and the maximum speed ranges from 0.5 to 2 [m / sec]. The reaction delay of this stage is usually about 20 to 400 msec. This response delay is compensated by the scanner which is a high speed driver, and in particular, the position change according to the movement of the stage is compensated by the scanner capable of high speed driving. The scanner controller determines the feedback from the stage and the position of the scanner, in which the response delay of the scanner is reflected.

The response delay of a galvanometer, which is a general high speed driver, is usually about 100 to 400us.

3 shows a schematic control flow in the laser machining system according to the invention, and FIG. 4 is an overall flowchart of the laser machining method according to the invention.

The total laser processing is calculated in the control host 110 in consideration of the processing range of the scanner 150 or the responsiveness (delay reaction) of the stage 150 based on each processing position in the entire area (S31). do. The calculation of this target position is continuously performed even in the driving period of the stage where the laser processing is performed. After calculating the target position in this way, the feedback from the low speed stage 170 is received to compare the actual machining area with respect to the entire machining area (S32). Then, the target positions of the low speed driver in consideration of the actual processing position and the processing range of the high speed driver are determined (S33, S36) and output them to the scanner and the stage. At this time, the actual position of the scanner system 150 which is the high speed driver is compensated (S34) through the feedback FB of the stage 170 which is the low speed driver. That is, the position of the scanner S150 is compensated (S34) by the distance or the position of the continuously operating stage to determine the position of the actual scanner, that is, the laser exit point. Here, the position of the scanner (laser exit point) refers to the position where the laser beam exits to the actual workpiece, within the machining range determined by the scanner's physical position relative to the workpiece, and the position where the laser beam lands. It is a point on the surface of the workpiece 99. In addition, when the processing of one pattern is completed and the process moves to the next position, processing of the processing field boundary condition which causes the position of the scanner 150 to be at the head of the travel direction to another region is performed (S35). do.

The control flow inside the control host 110 in FIG. 3 is described in detail in the overall flow of FIG.

Referring to FIGS. 3 and 4, first, in consideration of the processing range of the scanner, which is a high speed driver, or the responsiveness of the stage 170, which is a low speed driver, based on the respective machining positions with respect to the entire machining area, The optimum target position through the shortened movement path is calculated by calculating the movement path to the position (S41). This is to use the minimum movement of the stage 170 to drive at low speed and the fast characteristics of the scanner 150 to drive at high speed.

The stage 170 is moved at a low speed to the calculated target position, and the scanner 150 is moved at a high speed to a position at which actual machining starts (S42). The position where the actual machining starts is compared with the position of the current stage 170 to determine whether the current position of the stage 170 arrives (exists) within the machining range (S43), and if so, the machining is performed in the next step (S44). If it is not present in the machining area, the stage 170 is continuously moved to the target position while comparing whether the current position of the stage has arrived in the machining area (S43). At this time, the actual position of the scanner 150 to be driven at a high speed is kept at the head of the scanner moving direction at the boundary line of the entire field area of the scanner 150, so that the machining proceeds as soon as the head on the boundary line reaches the target position (S44). ). In this processing (S44), the control of the laser system is performed, and the positions of the scanner and the stage are output to the scanner and the stage in real time, and the processing in the processing area is performed. In this process, it is determined whether the processing of one pattern (a shape to be processed until the laser is turned on and off) is finished (S45), and when the processing of one pattern is finished, move to the position for processing the next pattern. By repeating the process, if the progress of the processing of all the patterns in the processing area is confirmed (S46), the processing ends.

3, the laser processing method according to the present invention receives the feedback FB from the stage 170, which is the low speed driver, in the processing host 110, and compensates the output to the scanner 150, which is the high speed driver, in real time. It is possible. The fact that the output to the scanner 150 can be changed in real time and the machining start time can be adjusted by comparing the processing areas (S32) means that the speed of the scanner in the non-processing area can be set to the maximum regardless of the processing range. it means.

Hereinafter, the embodiment of the laser processing method according to the present invention in more detail.

Referring to Figure 5 as follows. In the figure where the machining pattern P exists in the machining range 31 of a scanner, both cases (a) and (b) of right and left are shown. In this case, since the two patterns P are provided in the processing range 31 by the scanner, the maximum speed of the scanner can be moved irrespective of the distance between the unprocessed areas 32 and 33 therebetween.

5 (c) and 5 (d) show the processing speeds (hatched portions) of the two patterns for the workpiece and the change of the feed speed of the stage at this time. Here, the maximum speed of the high speed driver is based on 2000mm / sec, the maximum speed of the stage 500mm / sec, the processing speed for the workpiece 200mm / sec.

In the graph of FIG. 5 (c) showing the variation of the scanner speed in the machining of the pattern P with respect to the machining area 31 shown in FIG. 5A, the distance of the non-processing area 32 is very short and continuous. The moving speed (Vs) of the stage moving to the stage did not reach the maximum (500 mm / sec), and in the graph of (d), although it is within the processing range, the moving speed of the non-processing area 33 is long, so the stage speed is maximum. It can be seen that the value (500 mm / sec) can be reached.

Next, a case in which a plurality of processing patterns are distributed and does not exist within one processing range will be described with reference to FIG. 6.

When the two machining patterns of the rectangular shape have a non-processing area of a constant distance 41a to 43b, the stage, which is a low speed driver, moves to the first target position calculated in advance (from left to right in the drawing). At this time, the scanner, which is a high speed driver, can move at a very high speed compared to the stage, and is located at the

boundaries

41b and 42b of the processing area while moving the non-processing area. In the drawings,

reference numerals

41, 42, and 43 denote processing ranges of the scanner moving in stages. When the machining of the machining pattern 41a in the inside of the machining range 41 of the first position is completed, the scanner moves the position to the boundary 41b of the machining range 41. This position is the position closest to the next target point as the head of the traveling direction. When the stage moves in this state, the state becomes 42 from 42. As soon as the pattern 43b enters the stage 43 by the transfer of the stage within the processing range, the scanner processes the pattern at high speed, and the movement to the second target position in consideration of the next target calculated at this time is continued.

The important point here is that as shown in Fig. 7, which is a time-velocity graph for the process of Fig. 6, the scanner waits for time 45 to arrive at the actual machining position and reach the processable range. The machining range is calculated from the difference between the feedback of the stage and the machining position, and the machining starts when the pattern is within the machining range.

As such, the present invention can be controlled at the maximum speed of the high speed drive regardless of the processing range in the non-processing area, which helps to shorten the overall processing time.

As described above, the laser processing method of the present invention enables laser processing using a scanner, which is a high speed driver, while a stage, which is a low speed driver, moves. This is possible because the actual machining position of the high speed driver receives feedback of the position change according to the movement of the stage and compensates for the actual machining position of the high speed driver.

In addition, in the laser processing method according to the present invention, when the high speed driver has a pattern to be newly processed in a part outside the processing range of the scanner, the stage is moved in the direction of the pattern to be newly processed, and at this time, the scanner is positioned at the leading boundary of the processing range. By doing this, processing can be performed as soon as the pattern enters the processing range, thereby enabling processing of the pattern at a higher speed.

Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

Claims

In a method for performing laser processing using a high speed driver and a low speed driver,
Moving the low speed driver to a first target position;
Performing laser processing if at least one processing pattern of the workpiece is located within a processing region of the high speed driver while the low speed driver is moved to a first target position; And
And the low speed driver moves to a second target position after the high speed driver processes the pattern.
The method of claim 1,
And the high speed driver receives feedback of the movement of the low speed driver and corrects the position while the low speed driver moves to the first target position.
The method of claim 1,
The pattern is a laser processing method characterized in that the shape is drawn from the time when the laser processing is turned on and off in the laser processing.
The method of claim 1,
And the first target position or the second target position is determined in consideration of the next machining pattern position of the workpiece.
The method of claim 1,
And the high speed driver is positioned at a boundary of the processing region when the high speed driver merely moves without performing laser processing.
The method of claim 1,
In determining the first target position or the second target position, the laser processing method is determined in consideration of the difference between the moving speeds of the high speed driver and the low speed driver.
Driving the low speed driver on which the workpiece is mounted to move the machining region of the high speed driver that performs laser processing on the workpiece to a pattern forming position (target position) of the workpiece;
Performing laser processing when the patterning position of the workpiece is in the machining region of the high speed driver; And
Transferring the low speed driver to a next pattern forming position with respect to the workpiece while the laser processing is being performed.
The method of claim 1,
And feeding back the position information of the low speed driver to correct the position of the high speed driver.
The method according to claim 1 or 2
When transporting the low speed driver, the laser exit point of the high speed driver is located at the boundary of the processing area facing the pattern formation position,
And the laser processing starts as soon as the pattern forming region for the workpiece is entered into the processing region of the high speed driver by the low speed driver.
The method of claim 3,
And the high speed driver is a galvanometer, and the low speed driver is a stage.
The method of claim 4, wherein
The low speed driver is any one of an XY table, a hybrid stage, and a gantry stage.
A system for performing the laser processing method according to claim 1,
A low speed driver on which the workpiece is mounted;
A high speed driver for performing laser processing on the workpiece mounted on the low speed driver;
An encoder provided to the low speed driver so that the low speed driver feeds back position information;
And a control host controlling the low speed driver and the high speed driver to correct the position of the high speed driver using the position information.
The method of claim 12,
The high speed driver is a galvanometer, and the low speed driver is a stage.
The method according to claim 12 or 13,
And the low speed driver is any one of an XY table, a hybrid stage, and a gantry stage.
In the laser processing apparatus comprising a high speed driver and a low speed driver,
The low speed driver is moved to a first target position, and while the low speed driver is moved to a first target position, laser processing is performed if at least one processing pattern of a workpiece is located in a processing area of the high speed driver. And a control unit for controlling the high speed driver to move to the second target position after processing the pattern.
The method of claim 15,
The low speed driver is mounted on the workpiece, the high speed driver comprises a laser processing unit.
The method of claim 15,
The control unit is a laser processing apparatus, characterized in that while the low speed drive is moving to the first target position, the high speed drive receives feedback of the movement of the low speed drive to correct its position.