CN112496557A

CN112496557A - Laser marking system and laser marking method

Info

Publication number: CN112496557A
Application number: CN202011395811.8A
Authority: CN
Inventors: 江禹安; 蔡昌裕
Original assignee: Syntec Technology Suzhou Co Ltd
Current assignee: Syntec Technology Suzhou Co Ltd
Priority date: 2020-12-03
Filing date: 2020-12-03
Publication date: 2021-03-16

Abstract

The invention discloses a laser marking system and a laser marking method, which comprise the following steps: a workpiece bearing table; and laser marking device, laser marking device set up in the top of work piece plummer, it includes: a laser light source device; the processing head is provided with a vibration mirror group for receiving the laser light, so that the pulse of the laser light forms a laser light spot on the workpiece to be processed for processing; the moving unit is connected with the processing head and drives the processing head to move relative to the workpiece bearing table; and a deflection stopper to change a traveling direction of the received laser light. The excessive processing into the shape of a match head due to the fact that laser energy is concentrated on the joint of the marking pattern can be avoided, and a good laser marking effect is achieved. The laser marking method is particularly suitable for laser marking of large-range patterns in a partition joint mode.

Description

Laser marking system and laser marking method

Technical Field

The invention belongs to the technical field of laser processing, and particularly relates to a laser marking system and a laser marking method.

Background

In the prior art, a laser marking device forms marks such as characters and patterns on the surface of a workpiece in a laser mode, and compared with the traditional mechanical carving or chemical etching forming method, the laser marking device has the advantages of high precision, high speed, permanence of the generated marks and the like. Laser marking techniques and apparatus are of great importance in industry, particularly the integrated circuit industry, because of the need for high precision and high volume production of IC marks.

A laser light source device of a laser marking device is generally used to provide laser light; the galvanometer group of the laser marking device is generally used for receiving laser light and rotating at a default angular speed to change the path direction of the laser light, and the position of a laser spot is controlled by adjusting the rotating angles of the galvanometer group in the X direction and the galvanometer group in the Y direction, but the rotating angle of the galvanometer group has a specific range, so that the laser marking processing range is limited. For large-scale marking applications, a splicing marking method is generally used, in which a large-scale pattern is divided into several small-area regions, and marking is performed on one region by one region during actual marking, and the regions are subjected to marking splicing (so-called partition marking) so as to meet the requirement of large-scale marking of the pattern. During the divisional marking, the actual marking pattern 92 in fig. 1 having the shape of a match head causes the boundary of the interval to be particularly conspicuous, so that the entire pattern is liable to have defects at the divisional connection portion.

Referring to fig. 1, fig. 1 is a schematic diagram of a trace of laser light irradiated on a workpiece when a conventional laser marking device performs marking. In fig. 1, reference numeral 90 denotes a desired marking pattern, which is a pattern that a user wants to form on the workpiece 11. While laser marking is performed, the laser light forms a plurality of laser points on the workpiece 11, the collection of laser points at different times constituting the laser light trajectory 91, fig. 1 also shows the scatter pattern of the laser light trajectory 91 from start to finish during the laser marking process. The laser marking process starts from a marking starting point 91S and ends at a marking end point 91E, in the laser marking process, a laser light source device keeps constant frequency to provide laser light, before the marking starting point 91S or after the marking end point 91E, the laser light source device does not provide the laser light, in this way, laser marking is started, a vibration mirror group accelerates from stop to processing speed or decelerates from processing speed to stop, in an acceleration section/deceleration section of an area lower than the processing speed, too much laser energy is easily gathered in a unit distance due to slow movement of the vibration mirror group, excessive processing is caused, the actual marking pattern 92 looks like a match head, and the pattern has obvious subarea connection points.

Disclosure of Invention

Accordingly, the present invention is directed to a laser marking system that overcomes the deficiencies of the prior art.

In order to achieve the purpose, the invention adopts the technical scheme that: a laser marking system, comprising:

the workpiece bearing platform is used for placing a workpiece to be processed; and

radium-shine mark device, radium-shine mark device set up in the top of work piece plummer, it includes:

a laser light source device for emitting laser light;

the processing head is provided with a vibration mirror group for receiving the laser light, so that the pulse of the laser light forms a laser light spot on the workpiece to be processed for processing;

the moving unit is connected with the processing head and drives the processing head to move relative to the workpiece bearing table; and

a deflection brake which drives the galvanometer group to rotate so as to change the traveling direction of the received laser light and make the laser light spot advance on the workpiece to be processed at a galvanometer processing speed;

the laser marking device comprises a workpiece bearing table, a moving unit, a laser marking device and a laser marking device, wherein the moving unit has a moving speed when moving on the workpiece bearing table, and when the vector sum of a first vector of the moving speed of the moving unit and a second vector of the galvanometer machining speed reaches the default target machining speed of the laser spot, the laser marking device machines the workpiece to be machined.

Optimally, the laser marking system further comprises a controller, wherein the controller is used for receiving coordinate information corresponding to a target image, planning an axial acceleration distance, an axial uniform speed distance and an axial deceleration distance which are provided for the mobile unit according to the coordinate information, and planning an advance distance, a galvanometer marking distance and a delay distance which are provided for the galvanometer group.

Further, the laser light source device is controlled not to provide the laser light during the advance rotation and the retard rotation of the mirror oscillating group.

Optimally, the moving speed of the moving unit comprises axial acceleration displacement, axial uniform speed displacement and axial deceleration displacement, or does not move; the laser light source device is controlled not to supply the laser light during the axial acceleration displacement and the axial deceleration displacement of the moving unit.

Optimally, the target processing speed is constant.

The invention aims to provide a laser marking method, which uses a laser marking device to process a workpiece to be processed, which is placed on a workpiece bearing table, wherein the laser marking device comprises:

a laser light source device for emitting laser light;

the moving unit is connected with the processing head and drives the processing head to move relative to the workpiece bearing table;

it is characterized by comprising the following steps:

receiving coordinate information corresponding to a target image, and planning a target processing speed of the laser light spot advancing on the workpiece to be processed;

planning the moving speed and the galvanometer processing speed of the moving unit according to the target processing speed of the laser light spot; and

and when the vector sum of the first vector of the moving speed of the moving unit and the second vector of the galvanometer processing speed reaches the target processing speed of the default laser spot, controlling the laser marking device to process the workpiece to be processed.

Optimally, it also comprises:

controlling the moving unit to perform axial acceleration displacement, axial uniform displacement and axial deceleration displacement relative to the workpiece bearing table according to the moving speed of the moving unit, or not moving; and controlling the vibration mirror group to rotate in advance, mark and rotate in a delayed mode relative to the workpiece to be processed according to the target image.

Further, it also includes:

and when the vibration mirror group rotates in advance, and/or the moving unit performs axial acceleration displacement, and when the vibration mirror group rotates in a delayed mode, and/or the moving unit performs axial deceleration displacement, controlling the laser light source device not to provide laser light.

Further, when the vibration mirror group performs marking rotation and/or the moving unit performs axial uniform displacement, the laser light source device is controlled to provide laser light.

Further, the target processing speed is constant.

Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages: the laser marking system of the invention accelerates the movement of the processing head before the laser marking, decelerates the processing head to stop after the laser marking, plans to rotate in advance before the distance of the galvanometer marking on the galvanometer group and plans to rotate after the distance of the galvanometer marking, and the laser marking device can process at a constant target processing speed (namely constant speed), thereby avoiding the excessive processing into the shape of a match head because the laser energy is concentrated on the joint of the marking pattern, and achieving good laser marking effect.

The laser marking method is particularly suitable for laser marking of large-range patterns in a partition joint mode, so that joint points of the large-range patterns are reduced, the phenomenon that the joint points are subjected to laser marking into a match head shape (namely, excessive processing) due to laser energy concentration is avoided, errors of partition joint can be eliminated, and partition joints can be reduced.

Drawings

FIG. 1 is a schematic diagram of a prior art laser marking technique;

FIG. 2 is a schematic view of a laser marking apparatus of the present invention;

FIG. 3 is a block diagram of a laser marking apparatus of the present invention;

FIG. 4 is a schematic view of the laser marking apparatus of the present invention during zone marking;

FIG. 5 is a graph showing the speed variation of the target processing speed of the laser spot advancing on the workpiece with respect to time according to the present invention;

FIG. 6 is a flow chart of a laser marking method of the present invention;

fig. 7A to 7C are schematic views of laser marking for zone bonding according to the present invention.

Detailed Description

The following detailed description of preferred embodiments of the invention will be made.

The foregoing and other features and advantages of the invention will be apparent from the following, more particular description of preferred embodiments of the invention, as illustrated in the accompanying drawings. Directional terms as referred to in the following examples, for example: up, down, left, right, front or rear, etc., are simply directions with reference to the drawings. Accordingly, the directional terminology is used for purposes of illustration and is in no way limiting.

Referring to fig. 2 and 3, fig. 2 is a schematic diagram of a laser marking apparatus according to the present invention, and fig. 3 is a block diagram of a laser marking system according to the present invention. As shown in fig. 2 and 3, the laser marking system includes a workpiece support table 100 and a laser marking device 10, wherein a workpiece 1 to be processed is placed on the workpiece support table 100, and the laser marking device 10 is disposed above the workpiece support table 100 so that the laser marking device 10 is convenient for processing the workpiece 1 on the workpiece support table 100.

The laser marking apparatus 10 includes a laser light source device 12, a processing head 14 provided with a vibrating mirror group 141 (including an X-axis direction vibrating mirror 141X and a Y-axis direction vibrating mirror 141Y), a moving unit 16, and a deflection stopper 18. The laser light source device 12 is disposed on the Z column 110. The movement unit 16 is configured to be orthogonally connected to the Z-column 110 and to the processing head 14 such that the movement unit 16 can be used as a robot to move the processing head 14 in a horizontal axial direction relative to the workpiece carrier 100. The machining head 14 is provided with a machining head housing 140 for enclosing a vibrating mirror group 141. The mirror group 141 includes an X-axis direction mirror 141X and a Y-axis direction mirror 141Y, and the X-axis direction mirror 141X and the Y-axis direction mirror 141Y rotate at the same or different angles in the X-axis direction and the Y-axis direction, respectively. The laser light source device 12 emits laser light 120, and the laser light 120 propagates through an optical fiber connected to the processing head 14 and is received by a galvanometer group 141 in a processing head housing 140. Since the X-axis direction mirror 141X and the Y-axis direction mirror 141Y continuously rotate to change the path direction of the laser light 120, the rotation angle of the mirror group 141 is, for example, -10 ° to 10 °, and the rotation angle can be controlled so that the laser light 120 further reaches the position of the node to be marked to form a laser spot on the workpiece 1. Next, as shown in fig. 3, the laser marking apparatus 10 is configured to be electrically connected to the controller 13, control the laser light source apparatus 12 to provide the laser light 120 by the controller 13, and control the moving unit 16 to move axially above the workpiece 1 relative to the workpiece support 100. In addition, the controller 13 controls the deflection brake 18 to drive the vibration mirror set 141 to rotate above the workpiece 1, and under the influence of the rotation of the vibration mirror set 141, the laser light 120 is deflected and reflected to change the traveling direction, and the laser light spot formed after each pulse of the laser light 120 reaches the workpiece 1 advances on the workpiece 1 at the vibration mirror processing speed.

Generally, the rotation angle of the oscillating mirror set 141 has a specific range, so the position of the laser spot on the workpiece 1 is limited within a specific range. When a large-scale pattern needs to be laser-marked on the workpiece 1 during processing, a laser marking partition bonding mode is adopted, please refer to fig. 4. As shown in fig. 4, a plurality of marking paths 22 are planned for a large-scale pattern, and the laser marking device 10 performs laser marking on a first marking path P, a second marking path Q, and a seventh marking path R in sequence; and then carrying out laser marking on the eighth marking path S to be jointed with the first marking path P. A distance ahead is set at the starting point of each marking path 22, so that the vibrating mirror set 141 rotates ahead before the laser light source device 12 starts laser light; a delay distance is set at the rear of the end point of each marking path 22, so that after the laser light source device 12 turns off the laser light, the vibrating mirror group 141 additionally performs delay rotation; at the marking distance of each marking path 22, the galvanometer group 141 performs a so-called marking rotation; the dashed line thus represents the path of rotation of the mirror group 141 relative to the marking path 22. While the arrow direction in the lower part of fig. 4 indicates a path along which the processing head 14 is driven by the moving unit 16 to move at a moving speed relative to the workpiece carrier 100, before the moving unit 16 drives the processing head 14 to move to reach the first marking path P, an axial acceleration distance is default, so that the moving unit 16 drives the processing head 14 to perform axial acceleration displacement from a standstill until the moving speed reaches a uniform speed; then, during a preset axial uniform distance, namely, during the process from the first marking path P, the second marking path Q to the seventh marking path R, the moving unit 16 drives the processing head 14 to perform axial uniform displacement; finally, after the moving unit 16 drives the processing head 14 to move to the seventh marking path R, an axial deceleration distance is defaulted, so that the moving unit 16 drives the processing head 14 to perform axial deceleration displacement until the moving speed is decelerated from a constant speed to a standstill. The present invention is not limited to the case where the moving unit 16 is moved, and in the actual operation, the processing head 14 is fixed even when the moving unit 16 is not moved. In order to avoid the occurrence of the match head due to the excessive concentration of the laser energy at the marking start point and the marking end point of the marking paths 22 and to reduce the obvious splicing phenomenon of the splicing point between the two marking paths 22, once the advancing speed of the laser spot on the workpiece reaches the target processing speed with a uniform speed, that is, the vector sum of the first vector of the moving speed of the moving unit 16 and the second vector of the galvanometer processing speed is the same as the vector of the target processing speed of the default laser spot, the controller 13 controls the laser light source device 12 of the laser marking device 10 to provide the laser light 120 to process the workpiece 1, so that the match head cannot occur at the splicing point between the first marking path P and the eighth marking path S, and the effect of the invention can be achieved.

With continued reference to fig. 3, the controller 13 is electrically connected to the laser light source device 12, the moving unit 16 and the deflection brake 18. The controller 13 at least comprises a command output module 130, a laser light-emitting module 131 and a path planning module 133. The laser photoluminescence module 131 and the path planning module 133 are electrically connected to the command output module 130, respectively. The operation of each module designed by the controller 13 is described below: the coordinate information such as the start time of laser marking and the first coordinate (so-called marking start point) and the second coordinate (so-called marking end point) of the target image 2 may be preset in the controller 13 by a user, or may be automatically generated in the controller 13 by acquiring the target image by an advanced artificial intelligence technique, and the present invention is not limited thereto.

The laser light emitting module 131 is configured to determine that each marking node given by the coordinate information between the first coordinate and the second coordinate of the target image provides laser energy corresponding to a pulse period, and provide laser light when the moving speed of the moving unit 16 and the galvanometer processing speed are independent, synchronous, or synthesized to be a uniform speed, and transmit a corresponding signal to the command output module 130. The command output module 130 receives the signal to transmit a light on/off command to the laser light source device 12, so as to prompt the laser light source device 12 to generate an output power with a specific energy value at a plurality of marking nodes, the laser light source device 12 emits laser light 120 corresponding to the laser energy value, and the laser light is not provided when the moving speed of the moving unit 16 and the galvanometer processing speed are independent or synchronous. That is, the laser light source device 12 does not provide the laser light 120 during the axial acceleration displacement and the axial deceleration displacement of the moving unit 16 and during the advanced rotation and the retarded rotation of the galvanometer group 141 according to the on/off command.

The path planning module 133 is configured to receive coordinate information of a first coordinate and a second coordinate of a target image 2 to be laser marked, plan a target processing speed at which a laser spot to be generated advances on the workpiece 1 according to a plurality of coordinate information of the target image 2, and plan a target processing speed according to a default target processing speed of the laser spot to determine a galvanometer processing speed and a moving speed at which the moving unit 16 drives the processing head 14 to move on the workpiece carrier 100. And calculates the axial acceleration distance, axial uniform velocity distance and axial deceleration distance of the mobile unit 16; and/or calculating the advance distance, the galvanometer marking distance and the delay distance of the galvanometer group 141. The path planning module 133 transmits a corresponding signal to the command output module 130, and the command output module 130 receives the signal and transmits a mirror rotation command to the deflection actuator 18 and/or an axial movement command to the mobile unit 16. And a plurality of marking nodes are planned between the first coordinate and the second coordinate of the target image 2, and each marking node is given coordinate information. A first pre-shift coordinate (the starting point of the total acceleration displacement) is generated by extending a total acceleration displacement from the first coordinate of the target image 2; a second pre-shift coordinate (the so-called end point of the total deceleration displacement) is generated by extending a total deceleration displacement backwards from the second coordinate of the target image 2.

Next, please refer to fig. 5 for the speed variation of the advancing speed of the laser spot on the workpiece with respect to time in the laser marking process. As shown in fig. 5, before the starting time point of laser marking, the moving unit 16 performs axial acceleration displacement and/or the galvanometer group 141 performs advanced rotation, and the laser light source device 12 does not provide laser light, so that from 0 th second to the starting time point of laser marking, the node which does not emit light advances on the workpiece 11 in an accelerated manner (indicated by a dotted line), and the time period is defined as acceleration pre-shift time delay. Between the first coordinate and the second coordinate of the target image, the laser light source device 12 provides laser light 120 to perform laser marking, and a laser light spot advances on the workpiece 11 at a constant speed (indicated by a solid line), so that the time period is defined as the actual light-emitting time delay; when the laser marking is completed on the second coordinate of the target image on the workpiece 11, the laser light source device 12 does not provide the laser light 120, the moving unit 16 performs axial deceleration displacement and/or the galvanometer group 141 performs backward rotation, and then the node without emitting light advances on the workpiece 11 in a deceleration manner (indicated by a dotted line), and the time period is defined as deceleration pre-shift time delay.

The respective modules of the controller 13 are operated in relation to the laser light source device 12, the moving unit 16 and the deflection actuator 18 as described below.

The deflection brake 18 is connected to the galvanometer group 141 and the command output module 130 of the controller 13, respectively, receives the galvanometer rotation command, and drives the galvanometer group 141 to rotate in advance, in marking rotation, and in delaying rotation according to a preset advance distance, a preset galvanometer marking distance, and a preset delay distance. In order to make the laser spot advance on the workpiece 1 at a uniform speed, the path planning module 133 stores a speed algorithm to plan a target processing speed of a default laser spot as a vector sum of a default moving speed of the moving unit 16 and a default galvanometer processing speed, and stores a vector algorithm to plan a vector sum of an advance distance of the galvanometer group 141 and an axial acceleration distance of the moving unit 16 as a distance of a total acceleration displacement; the vector sum of the vibrating mirror marking distance of the vibrating mirror group 141 and the axial uniform distance of the mobile unit 16 is planned to be the distance of the uniform displacement of the laser light spot; the vector sum of the delay distance of the vibrating mirror group 141 and the axial deceleration distance of the mobile unit 16 is defined as the distance of the total deceleration displacement.

In the mirror group 141, the position of the laser spot on the workpiece 1 irradiated with the laser light 120 is changed by the X-axis direction mirror 141X and the Y-axis direction mirror 141Y. Specifically, the galvanometer group 141 transmits the current rotation coordinate value back to the path planning module 133, and the path planning module 133 performs an interpolation operation (the interpolation operation refers to inserting a value that is not included in the data generated by the path planning module 133) according to the current rotation coordinate value of the galvanometer group 141 and the coordinate values of the marking nodes. The path planning module 133 captures the coordinate value of the current rotation of the vibrating mirror set 141 before sending the command to the deflection actuator 18, and then inserts a plurality of moving nodes before the first coordinate of the target image and after the second coordinate of the target image according to the coordinate value of the current rotation of the vibrating mirror set 141, so that the laser light 120 emitted from the laser light source device 12 can be aligned with the vibrating mirror set 141 synchronously.

The moving unit 16 is actually connected to the command output module 130 of the controller 13 through a driver (not shown), which receives the axial moving command to drive the moving unit 16 to drive the processing head 14 to perform the axial acceleration displacement, the axial deceleration displacement, or not move according to the default moving speed, the axial acceleration distance, the axial uniform velocity distance, and the axial deceleration distance. When the moving unit 16 does not move, the moving unit 16 does not move the processing head 14 relative to the workpiece carrier 100, and the laser light is provided for processing as long as the galvanometer processing speed reaches the target processing speed of the default laser spot. The distance of the laser light spot advancing on the workpiece 1 is the marking distance of the galvanometer, the distance of the total acceleration displacement is the advance distance of the galvanometer group 141, and the distance of the total deceleration displacement is the delay distance of the galvanometer group 141.

In one embodiment, a detailed operation of planning multiple marking paths 22 for laser marking of a target image is described with reference to fig. 6, where fig. 6 is a flow chart of a laser marking method of the present invention. As shown in fig. 6 and described in conjunction with fig. 5, a laser marking process flow 200 includes the following:

step 210 is performed first: receiving coordinate information (such as a first coordinate and a second coordinate) corresponding to the target image, planning a target processing speed of the laser spot advancing on the workpiece, and receiving a starting time point for starting laser marking.

Then, step 220 is performed: and planning the moving speed of the moving unit and the galvanometer processing speed according to the target processing speed of the default laser light spot.

Then, step 230 is performed: planning an advance distance, a galvanometer marking distance and a delay distance of the galvanometer group according to a target image on the workpiece; and planning the axial acceleration distance, the axial uniform speed distance and the axial deceleration distance of the mobile unit according to the default moving speed of the mobile unit. In this step, the advance distance, the marking distance and the delay distance of the vibrating mirror set 141, and the axial acceleration distance, the axial uniform velocity distance and the axial deceleration distance of the mobile unit 16 are preferably calculated manually or by the path planning module 133 of the controller 13 according to the coordinate information corresponding to the target image on the workpiece by using an algorithm of a software program or an empirical method of a technician. Then, step 240 and/or step 250 are performed synchronously.

Step 240: and controlling the moving unit to drive the processing head to move relative to the workpiece bearing table at the moving speed. The control driver drives the moving unit 16 to drive the processing head 14 to perform an axial acceleration displacement for an axial acceleration distance, an axial uniform displacement for an axial uniform distance, and an axial deceleration displacement for an axial deceleration distance with respect to the workpiece carrier 100, and controls the laser light source device 12 not to provide the laser light 120 during the axial acceleration displacement and the axial deceleration displacement.

Step 250: and controlling the vibration mirror group to rotate in advance, mark and rotate in a delayed way relative to the target pattern on the workpiece. The deflection actuator 18 is controlled to drive the vibrating mirror group 141 to rotate a previous distance in advance, a vibrating mirror marking distance in turn, and a delayed distance in turn with respect to the target pattern. And controls the laser light source device 12 to provide the laser light during the actual light-emitting time delay of the marking rotation, and controls the laser light source device 12 not to provide the laser light 120 during the early rotation and the late rotation.

Step 260: when the moving speed of the moving unit and the processing speed of the galvanometer are independent, synchronous or synthesized into a uniform speed, the laser light source device is controlled to provide laser light. That is, when the sum of the first vector of the moving speed of the moving unit 16 and the second vector of the galvanometer processing speed is equal to the target processing speed of the default laser spot, the laser marking device 10 processes the workpiece 1.

Next, a case of performing the laser marking by the divisional bonding will be described with reference to fig. 7A to 7C, where fig. 7A shows that a large-scale target pattern 2 is to be processed on a workpiece 1, and the large-scale target pattern 2 is planned by the laser marking method of the present invention such that the first pattern 101 is processed and then the second pattern 102 is processed, so that the first pattern 101 and the second pattern 102 are divisionally bonded into the large-scale target pattern 2.

Fig. 7B shows the laser spot on the workpiece 1 when the first pattern 101 is processed, and the laser spot on the workpiece 1 is shifted 101M at a constant speed between the first coordinate 101A of the first pattern 101 and the second coordinate 101B of the first pattern 101 to generate a plurality of equidistant marking nodes 101C. Before the uniform speed displacement 101M, the total acceleration displacement 101S is planned so that the mobile unit 16 performs axial acceleration displacement and/or the galvanometer group 141 performs advanced rotation; after the uniform speed displacement 101M, the total deceleration displacement 101E is planned to make the mobile unit 16 perform axial deceleration displacement and/or make the vibrating mirror group 141 perform delayed rotation. Since the laser light source device 12 does not provide laser light during the total acceleration displacement 101S and the total deceleration displacement 101E, the first pattern 101 can be prevented from being over-processed at the first coordinate 101A and the second coordinate 101B.

Fig. 7C shows the laser spot on the workpiece 1 when the second graph 102 is processed, and similarly, the laser spot on the workpiece 1 is shifted 102M at a constant speed between the first coordinate 102A of the second graph 102 and the second coordinate 102B of the second graph 102 to generate a plurality of equidistant marking nodes 102C. Before the uniform speed displacement 102M, the total acceleration displacement 102S is planned so that the mobile unit 16 performs axial acceleration displacement and/or the galvanometer group 141 performs advanced rotation; after the uniform speed displacement 102M, the total deceleration displacement 102E is planned to make the mobile unit 16 perform axial deceleration displacement and/or make the vibrating mirror group 141 perform delayed rotation. Since the laser light source device 12 does not provide laser light during the total acceleration displacement 102S and the total deceleration displacement 102E, the second pattern 102 can be prevented from being over-processed at the first coordinate 102A and the second coordinate 102B.

Since the second graph 102 is connected to the first graph 101 in a partition manner, the first coordinate 102A of the second graph 102 is adjacent to and does not overlap the second coordinate 101B of the first graph 101. Therefore, the laser marking is not repeated on the first coordinate 102A of the second graph 102 and the second coordinate 101B of the first graph 101, the laser energy given to the marking node 101C of the first graph 101 and the marking node 102C of the second graph 102 are the same, the connecting part of the first graph 101 and the second graph 102 is not over-processed, high productivity (throughput) can be provided, the splicing error is eliminated, and the partition seams are reduced.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. A laser marking system, its characterized in that, it includes:

a laser light source device for emitting laser light;

2. The laser marking system of claim 1, wherein: the laser marking system further comprises a controller, wherein the controller is used for receiving coordinate information corresponding to the target image, planning an axial acceleration distance, an axial uniform speed distance and an axial deceleration distance which are provided for the mobile unit, and planning an advance distance, a galvanometer marking distance and a delay distance which are provided for the galvanometer group.

3. The laser marking system of claim 2, wherein: the laser light source device is controlled not to provide the laser light during the advanced rotation and the delayed rotation of the vibration mirror group.

4. The laser marking system of claim 1, wherein: the moving speed of the moving unit comprises axial acceleration displacement, axial uniform displacement and axial deceleration displacement, or is not moved; the laser light source device is controlled not to supply the laser light during the axial acceleration displacement and the axial deceleration displacement of the moving unit.

5. The laser marking system of claim 1, wherein: the target processing speed is constant.

6. A laser marking method uses a laser marking device to process a workpiece to be processed which is placed on a workpiece bearing table, and the laser marking device comprises:

a laser light source device for emitting laser light;

it is characterized by comprising the following steps:

7. The laser marking method of claim 6, wherein: it still includes:

8. The laser marking method of claim 7, wherein: it still includes:

9. The laser marking method of claim 7, wherein: and when the vibration mirror group performs marking rotation and/or the moving unit performs axial uniform displacement, controlling the laser light source device to provide laser light.

10. The laser marking method of claim 7, wherein: the target processing speed is constant.