TWI747641B - Laser marking system and laser marking method - Google Patents

Laser marking system and laser marking method Download PDF

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TWI747641B
TWI747641B TW109142536A TW109142536A TWI747641B TW I747641 B TWI747641 B TW I747641B TW 109142536 A TW109142536 A TW 109142536A TW 109142536 A TW109142536 A TW 109142536A TW I747641 B TWI747641 B TW I747641B
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laser
marking
workpiece
laser light
galvanometer
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TW109142536A
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TW202222598A (en
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江禹安
蔡昌裕
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新代科技股份有限公司
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Abstract

A laser marking system is provided, including a laser source for the emission of laser beams, galvanometers for controlling the direction of laser beams, and a moving unit that moves the galvanometers. The galvanometers control the received laser beams by deflecting/reflecting them onto the workpieces as a light spot. The light spot will move at a velocity relative to workpieces when controlled by the galvanometers, defined as a marking velocity. Additionally, when the moving unit brings the galvanometers in motion relative to a supporter of workpieces, the light spot will have another velocity, independent of the marking velocity vector, defined as a moving velocity. The laser marking device will only commence a marking process when sum of vectors of the moving velocity and the marking velocity reaches a predefined threshold which targets a constant. The threshold helps prevent a starting and ending location of the marking process from gathering excess amount of a laser energy. As a result, the laser energy is spread much more evenly; hence stitching effect in laser marking is obscure.

Description

雷射打標系統及雷射打標方法 Laser marking system and laser marking method

本發明有關於雷射加工技術領域,特別是涉及一種雷射打標系統及雷射打標方法。 The invention relates to the technical field of laser processing, in particular to a laser marking system and a laser marking method.

習知技術中的雷射打標裝置是以雷射方式在工件表面形成文字、圖案等標記,與傳統的機械雕刻或化學蝕刻形成法相比,具有精度高、速度快、以及產生的標記具備永久性等之優點,因此在工業上,特別是積體電路工業需要高精密度及高量產的IC標記,故雷射打標技術與裝置在工業中實屬重要。 The laser marking device in the prior art uses a laser method to form characters, patterns and other marks on the surface of the workpiece. Compared with traditional mechanical engraving or chemical etching, it has high precision, high speed, and permanent marks. Therefore, the industry, especially the integrated circuit industry, requires high-precision and high-volume IC marks, so laser marking technology and devices are really important in the industry.

雷射打標裝置的雷射光源裝置一般是用以提供雷射光,雷射打標裝置的振鏡組一般是用於接收雷射光並採用預設的角速度進行旋轉,以改變雷射光的路徑方向;藉由調整振鏡組X方向振鏡及Y方向振鏡的旋轉角度,以控制雷射光點的位置,但振鏡組旋轉的角度有其特定的範圍,造成雷射打標加工範圍亦有限,為達到大範圍的打標應用,一般會使用拼接打標的方式,將大範圍圖形分成幾個小面積區,實際打標時是一區一區進行打標,並且將這些區域進行打標拼接,即所謂分區打標,以滿足打標圖形範圍大的需求。在分區打 標的情形,圖1中具有火柴頭形狀的實際打標圖樣92造成了區間的邊界特別的明顯,故容易造成整體圖形在分區銜接部分具有缺陷。 The laser light source device of the laser marking device is generally used to provide laser light, and the galvanometer group of the laser marking device is generally used to receive the laser light and rotate at a preset angular velocity to change the path direction of the laser light ; By adjusting the rotation angle of the galvanometer in the X direction and the Y direction of the galvanometer group to control the position of the laser spot, but the rotation angle of the galvanometer group has its specific range, resulting in a limited laser marking processing range In order to achieve a large-scale marking application, the method of splicing marking is generally used to divide the large-scale graphics into several small areas. In actual marking, the marking is performed in one area and one area, and these areas are marked and spliced , The so-called zone marking, to meet the needs of marking a large range of graphics. Play in the district In the case of the target, the actual marking pattern 92 in the shape of the match head in FIG. 1 causes the boundary of the interval to be particularly obvious, so it is easy to cause the overall pattern to have defects in the joint part of the partition.

參考圖1,圖1是傳統雷射打標裝置進行打標時,雷射光照射在工件上的軌跡示意圖。在圖1中,元件符號90是表示預計的打標圖樣,是指使用者想要在工件11上形成的圖形。執行雷射打標時,雷射光會在工件11上形成多個雷射點,不同時間下的雷射點的集合構成雷射光軌跡91,圖1顯示在雷射打標過程中,從起始到結束的雷射光軌跡91的散布圖。雷射打標過程從打標起點91S起始,至打標終點91E結束,在雷射打標過程中,雷射光源裝置是保持等頻率提供雷射光,而在打標起點91S之前或是在打標終點91E之後,雷射光源裝置不提供雷射光,如此一來開始雷射打標,振鏡組從停止加速到加工速度,或是從加工速度減速到停止,在低於加工速度的區域的加速段/減速段,由於振鏡組移動緩慢就容易在單位距離內聚集過多的雷射能量,而造成過度加工,讓實際打標圖樣92看起來像是火柴頭,使得圖形有明顯的分區銜接點。 Refer to Figure 1, which is a schematic diagram of the trajectory of the laser light irradiated on the workpiece when the traditional laser marking device performs marking. In FIG. 1, the component symbol 90 indicates the expected marking pattern, and refers to the pattern that the user wants to form on the workpiece 11. When performing laser marking, the laser light will form multiple laser points on the workpiece 11. The collection of laser points at different times constitutes the laser light trajectory 91. Figure 1 shows the laser marking process from the beginning The scatter diagram of the laser light trajectory 91 to the end. The laser marking process starts from the marking start point 91S and ends at the marking end point 91E. During the laser marking process, the laser light source device maintains the same frequency to provide laser light, and before or before the marking start point 91S After marking the end point 91E, the laser light source device does not provide laser light, so the laser marking starts, the galvanometer group accelerates from the stop to the processing speed, or from the processing speed to the stop, in the area below the processing speed In the acceleration/deceleration section, the slow movement of the galvanometer group tends to accumulate too much laser energy within a unit distance, resulting in over-processing, making the actual marking pattern 92 look like a match head, making the graphics have obvious divisions Convergence point.

有鑑於上述習知技術的缺失,本發明的主要目的在於提供一種雷射打標系統,在進行雷射打標之前使加工頭先行加速移動,在進行雷射打標之後使加工頭減速至停止,且亦對振鏡組進行振鏡打標距離之前規劃提前旋轉、並於振鏡打標距離之後規劃延後旋轉,兩者同步實現能準確打標到每一個打標節點,且雷射打標裝置能以等速的目標加工速度進行加工,可以避免由於雷射能量集中於打標圖樣的銜接點,而過度加工成火柴頭形狀,以達到良好的雷射打標效果。 In view of the lack of the above-mentioned conventional technology, the main purpose of the present invention is to provide a laser marking system that accelerates the processing head before performing laser marking, and decelerates the processing head to a stop after laser marking. , And the galvanometer group is also planned to rotate in advance before the galvanometer marking distance, and plan to rotate after the galvanometer marking distance. The two can be synchronized to achieve accurate marking to each marking node, and laser marking The marking device can process at a constant target processing speed, which can avoid over-processing into the shape of a match head due to the laser energy being concentrated at the junction of the marking pattern, so as to achieve a good laser marking effect.

本發明的另一目的在於提供一種雷射打標方法,特別適用於對大範圍圖形以分區接合的方式進行雷射打標,使大範圍圖形的銜接點減少,以避免於銜接點由於雷射能量集中而雷射打標成火柴頭形狀(即過度加工),還可消除分區接合的誤差及減少分區接縫。 Another object of the present invention is to provide a laser marking method, which is particularly suitable for laser marking of large-scale graphics in a partitioned manner, so that the joint points of the large-scale graphics are reduced, and the joint points are prevented from being caused by the laser. The energy is concentrated and the laser is marked into the shape of a match head (that is, over-processing), which can also eliminate the error of the partition joint and reduce the partition joint.

因此根據上述目的,本發明揭露一種雷射打標系統,包括工件承載台,用以置放待加工工件、及雷射打標裝置,設置於工件承載台上方。雷射打標裝置包括雷射光源裝置,用以發射雷射光;加工頭,設有振鏡組用以接收雷射光,使雷射光的每一脈衝在待加工工件上形成雷射光點,以進行加工;移動單元,與加工頭連接並帶動加工頭相對於工件承載台進行移動;以及偏轉制動器,驅動振鏡組轉動,以改變所接收的雷射光的行進方向,使雷射光點以振鏡加工速度在待加工工件上前進。其中移動單元在工件承載台上進行移動時具有移動速度,當移動單元的移動速度的第一向量與振鏡加工速度的第二向量的向量總合達到所預設雷射光點的目標加工速度時,雷射打標裝置組對待加工工件進行加工。 Therefore, in accordance with the above objective, the present invention discloses a laser marking system, which includes a workpiece carrying platform for placing the workpiece to be processed, and a laser marking device, which is arranged above the workpiece carrying platform. The laser marking device includes a laser light source device to emit laser light; the processing head is equipped with a galvanometer group to receive the laser light, so that each pulse of the laser light forms a laser spot on the workpiece to be processed to perform Processing; a moving unit connected to the processing head and driving the processing head to move relative to the workpiece carrier; and a deflection brake, which drives the galvanometer group to rotate to change the direction of the received laser light, so that the laser spot is processed by the galvanometer The speed advances on the workpiece to be processed. The moving unit has a moving speed when moving on the workpiece carrier. When the sum of the vector of the first vector of the moving speed of the moving unit and the second vector of the galvanometer processing speed reaches the preset target processing speed of the laser spot , The laser marking device group processes the workpiece to be processed.

根據上述目的,本發明提出的雷射打標方法,使用雷射打標裝置對置放於工件承載台上的待加工工件進行加工,雷射打標裝置包括用以發射雷射光的雷射光源裝置;加工頭,設有振鏡組用以接收雷射光,使雷射光的每一脈衝在待加工工件上形成雷射光點,以進行加工;移動單元,與加工頭連接並帶動加工頭相對於工件承載台進行移動;以及偏轉制動器,驅動振鏡組轉動,以改變所接收的雷射光的行進方向,使雷射光點以振鏡加工速度在待加工工件上前進。雷射打標方法包括:接收目標圖像所對應的座標資訊,並規劃雷射光點於待加工工件上前進的目標加工速度;根據雷射光點的目標加工速度規劃移動單元進行移動的移動速度及振鏡加工速度;以及當移動單元的移動速度 的第一向量與振鏡加工速度的第二向量的向量總合達到所預設雷射光點的目標加工速度時,控制雷射打標裝置對待加工工件進行加工。 According to the above objective, the laser marking method proposed by the present invention uses a laser marking device to process the workpiece to be processed placed on the workpiece carrier. The laser marking device includes a laser light source for emitting laser light. Device; processing head, equipped with a galvanometer group to receive laser light, so that each pulse of laser light forms a laser spot on the workpiece to be processed for processing; moving unit, connected to the processing head and drives the processing head relative to The workpiece bearing table moves; and the deflection brake drives the galvanometer group to rotate to change the direction of the received laser light, so that the laser spot advances on the workpiece to be processed at the galvanometer processing speed. The laser marking method includes: receiving the coordinate information corresponding to the target image, and planning the target processing speed of the laser spot on the workpiece to be processed; planning the moving speed of the moving unit according to the target processing speed of the laser spot and Galvo processing speed; and when the moving speed of the moving unit When the sum of the vector of the first vector of and the second vector of the galvanometer processing speed reaches the preset target processing speed of the laser spot, the laser marking device is controlled to process the workpiece to be processed.

1、11:工件 1.11: Workpiece

2:目標圖像 2: target image

10:雷射打標裝置 10: Laser marking device

12:雷射光源裝置 12: Laser light source device

13:控制器 13: Controller

14:加工頭 14: Processing head

16:移動單元 16: mobile unit

18:偏轉制動器 18: Deflection brake

130:命令輸出模組 130: Command output module

131:雷射光致發模組 131: Laser light emitting module

133:路徑規劃模組 133: Path Planning Module

120:雷射光 120: Laser light

P:第一打標路徑 P: The first marking path

Q:第二打標路徑 Q: The second marking path

R:第七打標路徑 R: seventh marking path

S:第八打標路徑 S: Eighth marking path

22:打標路徑 22: Marking path

100:工件承載台 100: Workpiece carrying table

110:Z柱 110: Z-pillar

90:預計打標圖樣 90: Expected marking pattern

91:雷射光軌跡 91: Laser light trail

91E:打標終點 91E: marking the end point

101:第一圖形 101: The first figure

102:第二圖形 102: second graphic

101A、102A:第一座標 101A, 102A: first coordinate

101B、102B:第二座標 101B, 102B: second coordinate

101S、102S:總加速位移 101S, 102S: total acceleration displacement

101M、102M:等速位移 101M, 102M: Constant velocity displacement

101E、102E:總減速位移 101E, 102E: total deceleration displacement

101C、102C:打標節點 101C, 102C: marking node

210、220、230、240、250、260:步驟 210, 220, 230, 240, 250, 260: steps

91S:打標起點 91S: starting point for marking

92:實際打標圖樣 92: Actual marking pattern

141:振鏡組 141: Galvanometer group

141x:X方向振鏡 141x: X-direction galvanometer

141y:Y方向振鏡 141y: Y direction galvanometer

140:加工頭殼體 140: Processing head housing

200:流程 200: process

圖1是表示習知的雷射打標技術;圖2是根據本發明所揭露的技術,表示雷射打標裝置的示意圖;圖3是根據本發明所揭露的技術,表示雷射打標裝置的方塊圖;圖4是根據本發明所揭露的技術,表示雷射打標裝置在進行分區打標時的示意圖;圖5是根據本發明所揭露的技術,表示雷射光點在工件上前進的目標加工速度相對於時間的速度變化關係圖;圖6是根據本發明所揭露的技術,表示雷射打標方法的流程圖;以及圖7A至圖7C是根據本發明所揭露的技術,表示在進行分區接合的雷射打標的示意圖。 Fig. 1 shows a conventional laser marking technology; Fig. 2 is a schematic diagram showing a laser marking device according to the disclosed technology of the present invention; Fig. 3 is a schematic diagram showing a laser marking device according to the disclosed technology of the present invention Fig. 4 is a schematic diagram of the laser marking device during zone marking according to the technology disclosed in the present invention; Fig. 5 is a schematic diagram of the technology disclosed in the present invention, showing the progress of the laser spot on the workpiece Figure 6 is a flow chart of the laser marking method according to the technology disclosed in the present invention; and Figures 7A to 7C are based on the technology disclosed in the present invention. Schematic diagram of laser marking for zone joining.

為了對於本發明之結構目的和功效有更進一步之了解與認同,茲配合圖示詳細說明如後。以下將參照圖式來描述為達成本發明目的所使用的技術手段與功效,而以下圖式所列舉之實施例僅為輔助說明,本案之技術手段並不限於所列舉圖式。 In order to have a further understanding and recognition of the structural purpose and effects of the present invention, detailed descriptions are given below in conjunction with the drawings. The technical means and effects used to achieve the purpose of the invention will be described below with reference to the drawings, and the embodiments listed in the following drawings are merely auxiliary explanations, and the technical means of this case are not limited to the drawings listed.

首先請參考圖2及圖3,圖2表示本發明所之雷射打標裝置的示意圖及圖3表示本發明所之雷射打標系統的方塊圖。如圖2及圖3所示,雷射打標系統包括待加工的工件1放置於工件承載台100上,雷射打標裝置10設置於工件 承載台100上方,使得雷射打標裝置10便於對工件承載台100上的工件1進行加工。雷射打標裝置10包括雷射光源裝置12、配置振鏡組141(包含X方向振鏡141x與Y方向振鏡141y)的加工頭14、移動單元16、及偏轉制動器18。雷射光源裝置12設置於Z柱110上,移動單元16建構為與Z柱110正交連接,並與加工頭14連接,使得移動單元16可以如機械手臂般帶動加工頭14相對於工件承載台100進行水平的軸向移動。加工頭14設有加工頭殼體140用以包覆振鏡組141。振鏡組141包括X方向振鏡141x與Y方向振鏡141y,X方向振鏡141x、Y方向振鏡141y分別在X方向、Y方向上以相同或不同的角度進行旋轉。雷射光源裝置12用以發射雷射光120,雷射光120經由與加工頭14連接的光纖傳播,由加工頭殼體140內的振鏡組141承接雷射光120。由於X方向振鏡141x及Y方向振鏡141y不停地旋轉而改變雷射光120的路徑方向,振鏡組141的旋轉角度例如是-10°至10°,可控制旋轉角度以使雷射光120進一步抵達欲打標之節點的位置,以在工件1上形成雷射光點。接著如圖3所示,雷射打標裝置10建構為電性連接至控制器13,藉由控制器13控制雷射光源裝置12提供雷射光120,並控制移動單元16在工件1上方相對於工件承載台100進行軸向移動。另外,控制器13還控制偏轉制動器18驅動振鏡組141在工件1上方進行轉動,受到振鏡組141轉動的影響,雷射光120受到偏轉反射而改變行進方向,雷射光120的每一脈衝抵達工件1後所形成的雷射光點是以振鏡加工速度在工件1上前進。 First, please refer to FIGS. 2 and 3. FIG. 2 is a schematic diagram of the laser marking device of the present invention and FIG. 3 is a block diagram of the laser marking system of the present invention. As shown in Figures 2 and 3, the laser marking system includes a workpiece 1 to be processed placed on a workpiece carrier 100, and a laser marking device 10 is provided on the workpiece Above the carrying table 100, the laser marking device 10 is convenient for processing the workpiece 1 on the workpiece carrying table 100. The laser marking device 10 includes a laser light source device 12, a processing head 14 equipped with a galvanometer group 141 (including an X-direction galvanometer 141x and a Y-direction galvanometer 141y), a moving unit 16, and a deflection brake 18. The laser light source device 12 is arranged on the Z-pillar 110, and the moving unit 16 is constructed to be orthogonally connected to the Z-pillar 110 and connected to the processing head 14, so that the moving unit 16 can drive the processing head 14 relative to the workpiece carrier like a robotic arm 100 performs horizontal axial movement. The processing head 14 is provided with a processing head housing 140 for covering the galvanometer group 141. The galvanometer group 141 includes an X-direction galvanometer 141x and a Y-direction galvanometer 141y. The X-direction galvanometer 141x and the Y-direction galvanometer 141y rotate at the same or different angles in the X direction and the Y direction, respectively. The laser light source device 12 is used to emit laser light 120, and the laser light 120 propagates through the optical fiber connected to the processing head 14, and the galvanometer group 141 in the processing head housing 140 receives the laser light 120. Since the X-direction galvanometer 141x and the Y-direction galvanometer 141y continuously rotate to change the path direction of the laser light 120, the rotation angle of the galvanometer group 141 is, for example, -10° to 10°, and the rotation angle can be controlled to make the laser light 120 It further reaches the position of the node to be marked to form a laser spot on the workpiece 1. Next, as shown in FIG. 3, the laser marking device 10 is constructed to be electrically connected to the controller 13, and the controller 13 controls the laser light source device 12 to provide the laser light 120, and controls the moving unit 16 relative to the workpiece 1 above The workpiece carrier 100 moves in the axial direction. In addition, the controller 13 also controls the deflection brake 18 to drive the galvanometer group 141 to rotate above the workpiece 1. Affected by the rotation of the galvanometer group 141, the laser light 120 is deflected and reflected to change the direction of travel, and each pulse of the laser light 120 arrives The laser spot formed behind the workpiece 1 advances on the workpiece 1 at the processing speed of the galvanometer.

一般振鏡組141的旋轉角度有特定的範圍,因此工件1上雷射光點的位置也會受限於一定的範圍內。當加工時需要對工件1雷射打標大範圍圖形,則採用雷射打標分區接合的方式,請參考圖4,如圖4所示,對大範圍圖形規劃多個打標路徑22,雷射打標裝置10依序對第一打標路徑P、第二打標路徑Q至第七打標路徑R進行雷射打標;之後再對第八打標路徑S進行雷射打標與第一打標路徑P接合。在每一個打標路徑22的起點往前設定一段提前距離,供以在 雷射光源裝置12開啟雷射光之前,振鏡組141先進行提前旋轉;並在每個打標路徑22的終點往後設定一段延後距離,供以雷射光源裝置12關閉雷射光之後,振鏡組141追加進行延後旋轉,而於振鏡打標距離,振鏡組141進行所謂的打標旋轉。因此虛線表示振鏡組141相對於打標路徑22進行旋轉的路徑。而圖4下方的箭頭方向表示移動單元16帶動加工頭14以移動速度相對於工件承載台100進行移動的路徑,在移動單元16帶動加工頭14移動到達第一打標路徑P之前,預設一段軸向加速距離,使得移動單元16帶動加工頭14從靜止開始進行軸向加速位移,直到移動速度到達等速;接著,在預設的軸向等速距離,即從第一打標路徑P、第二打標路徑Q至第七打標路徑R進行加工之期間,移動單元16帶動加工頭14進行軸向等速位移;最後,移動單元16帶動加工頭14移動到第七打標路徑R之後,預設一段軸向減速距離,使得移動單元16帶動加工頭14進行軸向減速位移直到移動速度從等速減速至靜止。本發明不侷限於移動單元16一定要移動,實際操作也有移動單元16不移動的情形,則加工頭14固定不動。為了避免打標路徑22的打標起點、打標終點的雷射能量過度集中而出現火柴頭,並要減少兩個打標路徑22之間的銜接點有明顯的拼接現象,一旦雷射光點於工件上前進的速度達到等速的目標加工速度,亦即移動單元16的移動速度的第一向量與振鏡加工速度的第二向量之向量總和與所預設雷射光點的目標加工速度的向量相同時,控制器13會控制雷射打標裝置10的雷射光源裝置12提供雷射光120以對工件1進行加工,則不會在第一打標路徑P與第八打標路徑S之間的銜接點出現火柴頭,即能達成本發明的功效。 Generally, the rotation angle of the galvanometer group 141 has a specific range, so the position of the laser spot on the workpiece 1 is also limited to a certain range. When it is necessary to laser mark a large range of graphics on the workpiece 1 during processing, the laser marking method is used to join the regions. Please refer to Figure 4, as shown in Figure 4, plan multiple marking paths 22 for a large range of graphics The shooting marking device 10 sequentially performs laser marking on the first marking path P, the second marking path Q to the seventh marking path R; after that, the laser marking and the second marking path S are performed on the eighth marking path S. A marking path P is engaged. Set an advance distance before the starting point of each marking path 22 for the Before the laser light source device 12 turns on the laser light, the galvanometer group 141 is rotated in advance; and a delay distance is set after the end point of each marking path 22 for the laser light source device 12 to turn off the laser light. The mirror group 141 additionally performs a postponement rotation, and at the distance of the galvanometer marking, the galvanometer group 141 performs a so-called marking rotation. Therefore, the dotted line indicates the path through which the galvanometer group 141 rotates relative to the marking path 22. The arrow direction at the bottom of FIG. 4 represents the path that the moving unit 16 drives the processing head 14 to move relative to the workpiece carrier 100 at a moving speed. Before the moving unit 16 drives the processing head 14 to move to the first marking path P, a preset period The axial acceleration distance enables the moving unit 16 to drive the processing head 14 to perform axial acceleration displacement from a standstill until the moving speed reaches a constant velocity; then, at the preset axial constant velocity distance, that is, from the first marking path P, During the processing from the second marking path Q to the seventh marking path R, the moving unit 16 drives the processing head 14 to perform an axial constant velocity displacement; finally, the moving unit 16 drives the processing head 14 to move to after the seventh marking path R , Preset an axial deceleration distance, so that the moving unit 16 drives the processing head 14 to perform an axial deceleration displacement until the moving speed decelerates from a constant speed to a standstill. The present invention is not limited to that the moving unit 16 must be moved. In actual operation, there are cases where the moving unit 16 does not move, and the processing head 14 is fixed. In order to avoid excessive concentration of laser energy at the marking starting point and marking end of the marking path 22, the occurrence of match heads, and to reduce the obvious splicing phenomenon of the junction between the two marking paths 22, once the laser spot is on The advancement speed of the workpiece reaches the target processing speed of constant speed, that is, the vector sum of the first vector of the moving speed of the moving unit 16 and the second vector of the galvanometer processing speed and the vector of the preset target processing speed of the laser spot At the same time, the controller 13 will control the laser light source device 12 of the laser marking device 10 to provide laser light 120 to process the workpiece 1, and it will not be between the first marking path P and the eighth marking path S A match head appears at the connection point, that is, the effect of the invention can be achieved.

請繼續參考圖3,控制器13與雷射光源裝置12、移動單元16、及偏轉制動器18電性連接。控制器13至少包括命令輸出模組130、雷射光致發模組131、及路徑規劃模組133。雷射光致發模組131、路徑規劃模組133分別電性連接至命令輸出模組130。以下說明控制器13所設計的各個模組的運作方式, 其中,雷射打標的起始時間點、及目標圖像2的第一座標(所謂打標起點)、第二座標(所謂打標終點)等等的座標資訊可以由使用者預先設定給控制器13,也可以導入高階的人工智慧技術經由取得目標圖像而於控制器13自動生成,本發明並不侷限於此。 Please continue to refer to FIG. 3, the controller 13 is electrically connected to the laser light source device 12, the moving unit 16, and the deflection brake 18. The controller 13 at least includes a command output module 130, a laser photo-emitting module 131, and a path planning module 133. The laser light emitting module 131 and the path planning module 133 are electrically connected to the command output module 130, respectively. The following describes the operation mode of each module designed by the controller 13. Among them, the start time point of laser marking, and the first coordinate (the so-called marking start point) and the second coordinate (the so-called marking end point) of the target image 2 can be preset by the user to the controller. 13. It is also possible to import high-level artificial intelligence technology to automatically generate the target image by the controller 13, but the present invention is not limited to this.

雷射光致發模組131用以決定在目標圖像的第一座標與第二座標之間的多個座標資訊所賦予的每一個打標節點提供對應於脈衝周期的雷射能量,且當移動單元16的移動速度、振鏡加工速度單獨、同步或合成為等速時才提供雷射光,並傳送相對應的訊號至命令輸出模組130。命令輸出模組130接收此訊號據以傳送光開啟關閉命令至雷射光源裝置12,以提示雷射光源裝置12在多個打標節點需要產生特定能量值的輸出功率,由雷射光源裝置12發出對應於雷射能量值的雷射光120,而在移動單元16的移動速度、振鏡加工速度單獨或同步為非等速時則不提供雷射光。也就是說,雷射光源裝置12根據光開啟關閉命令於移動單元16進行軸向加速位移及軸向減速位移之期間、及於振鏡組141進行提前旋轉及延後旋轉之期間不提供雷射光120。 The laser photo-emitting module 131 is used to determine that each marking node given by multiple coordinate information between the first coordinate and the second coordinate of the target image provides laser energy corresponding to the pulse period, and when moving When the moving speed of the unit 16 and the processing speed of the galvanometer are independent, synchronized or combined into a constant speed, the laser light is provided, and the corresponding signal is sent to the command output module 130. The command output module 130 receives this signal and transmits a light on/off command to the laser light source device 12 to prompt the laser light source device 12 to generate output power with a specific energy value at multiple marking nodes. The laser light source device 12 The laser light 120 corresponding to the laser energy value is emitted, and the laser light is not provided when the moving speed of the moving unit 16 and the processing speed of the galvanometer are independent or synchronized at non-constant speed. In other words, the laser light source device 12 does not provide laser light during the period during which the moving unit 16 performs the axial acceleration displacement and the axial deceleration displacement according to the light on/off command, and during the period during which the galvanometer group 141 rotates in advance and after rotation. 120.

路徑規劃模組133用以接收欲雷射打標的目標圖像2的第一座標、第二座標的座標資訊,根據目標圖像2的多個座標資訊規劃將要產生的雷射光點於工件1上前進的目標加工速度,並根據所預設雷射光點的目標加工速度規劃決定振鏡加工速度及移動單元16帶動加工頭14在工件承載台100上進行移動的移動速度。並計算移動單元16的軸向加速距離、軸向等速距離、及軸向減速距離;及/或計算振鏡組141的提前距離、振鏡打標距離、及延後距離。路徑規劃模組133據以相對應的訊號傳送至命令輸出模組130,命令輸出模組130接收此訊號後據以傳送振鏡轉動命令至偏轉制動器18、及/或傳送軸向移動命令至移動單元16。且於目標圖像2的第一座標、第二座標之間規劃多個打標節點,對每一個打標節點賦予座標資訊。則從目標圖像2的第一座標往前延伸一 段總加速位移而產生第一預移座標(所謂總加速位移的起點);從目標圖像2的第二座標往後延伸一段總減速位移而產生第二預移座標(所謂總減速位移的終點)。 The path planning module 133 is used to receive the coordinate information of the first coordinate and the second coordinate of the target image 2 to be laser marked, and plan the laser spot to be generated on the workpiece 1 according to the multiple coordinate information of the target image 2 The forward target processing speed is determined according to the preset target processing speed planning of the laser spot and the processing speed of the galvanometer and the moving speed at which the moving unit 16 drives the processing head 14 to move on the workpiece carrier 100. And calculate the axial acceleration distance, the axial constant velocity distance, and the axial deceleration distance of the mobile unit 16; and/or calculate the advance distance of the galvanometer group 141, the galvanometer marking distance, and the retard distance. The path planning module 133 transmits the corresponding signal to the command output module 130. After receiving the signal, the command output module 130 transmits the galvanometer rotation command to the deflection brake 18 and/or transmits the axial movement command to the movement. Unit 16. And a plurality of marking nodes are planned between the first coordinate and the second coordinate of the target image 2, and coordinate information is assigned to each marking node. Extend forward from the first coordinate of target image 2 by one The first pre-movement coordinates (the so-called starting point of the total acceleration displacement) are generated by the segment of the total acceleration displacement; a total deceleration displacement is extended from the second coordinate of the target image 2 to produce the second pre-movement coordinates (the so-called end point of the total deceleration displacement) ).

接著,雷射打標過程中雷射光點在工件上前進的速度相對於時間的速度變化關係請參考圖5。如圖5所示,在雷射打標的起始時間點之前,移動單元16進行軸向加速位移、及/或振鏡組141進行提前旋轉,且雷射光源裝置12不提供雷射光,則從第0秒至雷射打標的起始時間點,未出光的節點在工件11上是加速地前進(以虛線表示),則此段時間定義為加速預移時延。在目標圖像的第一座標與第二座標之間,雷射光源裝置12提供雷射光120進行雷射打標,雷射光點在工件11上是等速地前進(以實線表示),則此段時間定義為實際出光時延;當工件11上目標圖像的第二座標完成雷射打標之後,雷射光源裝置12不提供雷射光120,移動單元16進行軸向減速位移、及/或振鏡組141進行延後旋轉,則未出光的節點在工件11上減速地前進(以虛線表示),此段時間定義為減速預移時延。 Next, please refer to Figure 5 for the relationship between the speed of the laser spot advancing on the workpiece during the laser marking process with respect to time. As shown in FIG. 5, before the start time point of laser marking, the moving unit 16 performs axial acceleration displacement, and/or the galvanometer group 141 performs advance rotation, and the laser light source device 12 does not provide laser light, then From the 0th second to the start time point of laser marking, the node that does not emit light is advancing at an accelerated rate on the workpiece 11 (indicated by the dashed line), then this period of time is defined as the acceleration pre-movement time delay. Between the first coordinate and the second coordinate of the target image, the laser light source device 12 provides laser light 120 for laser marking, and the laser spot advances at a constant speed on the workpiece 11 (indicated by a solid line), then This period of time is defined as the actual light emission time delay; after the second coordinate of the target image on the workpiece 11 is laser marked, the laser light source device 12 does not provide the laser light 120, and the moving unit 16 performs axial deceleration displacement, and/ Or the galvanometer group 141 rotates backward, and the node that does not emit light advances on the workpiece 11 at a decelerating speed (indicated by a dashed line). This period of time is defined as the deceleration pre-movement time delay.

控制器13的各個模組對應雷射光源裝置12、移動單元16、偏轉制動器18的運作關係如以下說明。 The operating relationships of the various modules of the controller 13 corresponding to the laser light source device 12, the moving unit 16, and the deflection brake 18 are as follows.

對偏轉制動器18而言,分別與振鏡組141、控制器13的命令輸出模組130連接,接收振鏡轉動命令,並根據預設的提前距離、振鏡打標距離、及延後距離,驅動振鏡組141進行提前旋轉、打標旋轉、及延後旋轉。為使雷射光點在工件1上能以等速度前進,路徑規劃模組133儲存有速度演算法將所預設雷射光點的目標加工速度規劃為移動單元16預設的移動速度與預設的振鏡加工速度之向量總和,並儲存有向量演算法將振鏡組141的提前距離與移動單元16的軸向加速距離之向量總和規劃為總加速位移的距離;將振鏡組141的振鏡打標距離與移動單元16的軸向等速距離之向量總和規劃為雷射光點等速位移的 距離;將振鏡組141的延後距離與移動單元16的軸向減速距離之向量總和規劃為總減速位移的距離。 For the deflection brake 18, they are respectively connected to the galvanometer group 141 and the command output module 130 of the controller 13, to receive the galvanometer rotation command, and according to the preset advance distance, galvanometer marking distance, and delay distance, The galvanometer group 141 is driven to perform advance rotation, marking rotation, and postponement rotation. In order to enable the laser spot to advance at a constant speed on the workpiece 1, the path planning module 133 stores a speed algorithm to plan the preset target processing speed of the laser spot as the preset moving speed of the moving unit 16 and the preset The vector summation of the processing speed of the galvanometer, and a vector algorithm is stored. The vector summation of the advance distance of the galvanometer group 141 and the axial acceleration distance of the moving unit 16 is planned as the total acceleration displacement distance; the galvanometer group 141 The vector sum of the marking distance and the axial constant velocity distance of the moving unit 16 is planned as the constant velocity displacement of the laser spot Distance; the vector sum of the delay distance of the galvanometer group 141 and the axial deceleration distance of the moving unit 16 is planned as the total deceleration displacement distance.

對振鏡組141而言,利用X方向振鏡141x與Y方向振鏡141y改變雷射光120打在工件1上雷射光點的位置。詳細來說,振鏡組141會將當前轉動的座標值回傳至路徑規劃模組133,路徑規劃模組133根據振鏡組141當前轉動的座標值與多個打標節點所在的座標值,進行插值運算,所謂插值運算指的是插入一個在路徑規劃模組133所生成資料中沒有的值。路徑規劃模組133在發出命令至偏轉制動器18之前,會先擷取振鏡組141當前轉動的座標值,然後依據振鏡組141當前轉動的座標值,於目標圖像的第一座標之前及目標圖像的第二座標之後插入多個挪動節點,以供雷射光源裝置12發出的雷射光120能夠與振鏡組141同步對位。 For the galvanometer group 141, the X-direction galvanometer 141x and the Y-direction galvanometer 141y are used to change the position of the laser spot on the workpiece 1 by the laser light 120. In detail, the galvanometer group 141 will return the current rotation coordinate value to the path planning module 133, and the path planning module 133 according to the current rotation coordinate value of the galvanometer group 141 and the coordinate values of the multiple marking nodes. Perform an interpolation operation. The so-called interpolation operation refers to inserting a value that is not in the data generated by the path planning module 133. Before issuing a command to the deflection brake 18, the path planning module 133 first captures the current coordinate value of the galvanometer group 141, and then according to the current coordinate value of the galvanometer group 141, before the first coordinate of the target image and After the second coordinate of the target image, multiple moving nodes are inserted so that the laser light 120 emitted by the laser light source device 12 can be aligned with the galvanometer group 141 synchronously.

對移動單元16而言,實際上是透過驅動器(圖未繪示)與控制器13的命令輸出模組130連接,驅動器接收軸向移動命令據以驅動移動單元16根據預設的移動速度、軸向加速距離、軸向等速距離、及軸向減速距離,帶動加工頭14進行軸向加速位移、軸向等速位移、軸向減速位移、或是不移動。當移動單元16不移動時,則移動單元16不會帶動加工頭14相對於工件承載台100進行移動,則只要振鏡加工速度達到所預設雷射光點的目標加工速度即提供雷射光以進行加工。雷射光點在工件1上前進的距離即為振鏡打標距離,總加速位移的距離即為與振鏡組141的提前距離,總減速位移的距離即為振鏡組141的延後距離。 For the moving unit 16, it is actually connected to the command output module 130 of the controller 13 through a driver (not shown). The driver receives an axial movement command to drive the moving unit 16 according to a preset moving speed and axis. The acceleration distance, the axial constant velocity distance, and the axial deceleration distance drive the processing head 14 to perform axial acceleration displacement, axial constant velocity displacement, axial deceleration displacement, or no movement. When the moving unit 16 is not moving, the moving unit 16 will not drive the processing head 14 to move relative to the workpiece carrier 100. As long as the processing speed of the galvanometer reaches the target processing speed of the preset laser spot, the laser light will be provided for processing. Processing. The distance that the laser spot advances on the workpiece 1 is the galvanometer marking distance, the total acceleration displacement distance is the advance distance from the galvanometer group 141, and the total deceleration displacement distance is the delay distance of the galvanometer group 141.

在一實施例中,對目標圖像規劃多個打標路徑22以進行雷射打標的詳細操作請參考圖6,圖6表示本發明的雷射打標方法的流程圖。如圖6所示並配合圖5說明雷射打標方法的流程200包括以下所述: In one embodiment, for the detailed operation of planning multiple marking paths 22 for the target image to perform laser marking, please refer to FIG. 6, which shows a flowchart of the laser marking method of the present invention. As shown in FIG. 6 and in conjunction with FIG. 5, the process 200 of describing the laser marking method includes the following:

首先進行步驟210:接收目標圖像所對應的座標資訊(例如第一座標與第二座標),規劃雷射光點於工件上前進的目標加工速度,並且接收開始雷射打標的起始時間點。 First, proceed to step 210: receiving coordinate information corresponding to the target image (for example, the first coordinate and the second coordinate), planning the target processing speed of the laser spot on the workpiece, and receiving the start time point of laser marking.

接著進行步驟220:根據所預設雷射光點的目標加工速度規劃移動單元的移動速度與振鏡加工速度。 Then proceed to step 220: planning the moving speed of the moving unit and the processing speed of the galvanometer according to the preset target processing speed of the laser spot.

接著進行步驟230:根據工件上的目標圖像規劃振鏡組的提前距離、振鏡打標距離、及延後距離;根據移動單元預設的移動速度規劃移動單元的軸向加速距離、軸向等速距離、及軸向減速距離。此步驟中較佳是利用軟體程式的演算法或技術人員的經驗法,由人工或是控制器13的路徑規劃模組133根據工件上目標圖像所對應的座標資訊規劃演算振鏡組141的提前距離、振鏡打標距離、及延後距離、移動單元16的軸向加速距離、軸向等速距離、及軸向減速距離。接著同步進行步驟240及/或步驟250。 Then proceed to step 230: plan the advance distance, the marking distance, and the retard distance of the galvanometer group according to the target image on the workpiece; plan the axial acceleration distance and the axial acceleration distance of the mobile unit according to the preset movement speed of the mobile unit Constant speed distance, and axial deceleration distance. In this step, it is better to use the algorithm of a software program or the experience method of the technical personnel. The path planning module 133 of the controller 13 plans and calculates the galvanometer group 141 manually or according to the coordinate information corresponding to the target image on the workpiece. The advance distance, the galvanometer marking distance, and the retard distance, the axial acceleration distance, the axial constant velocity distance, and the axial deceleration distance of the moving unit 16. Then step 240 and/or step 250 are performed synchronously.

步驟240:控制移動單元以移動速度帶動加工頭相對於工件承載台進行移動。控制驅動器驅動移動單元16帶動加工頭14相對於工件承載台100先進行軸向加速位移一段軸向加速距離、接著進行軸向等速位移一段軸向等速距離、及最後進行軸向減速位移一段軸向減速距離,而於軸向加速位移及軸向減速位移的期間控制雷射光源裝置12不提供雷射光120。 Step 240: Control the moving unit to drive the processing head to move relative to the workpiece carrier at a moving speed. The control driver drives the moving unit 16 to drive the processing head 14 relative to the workpiece carrier 100 to first perform an axial acceleration displacement for an axial acceleration distance, then perform an axial constant velocity displacement for an axial constant velocity distance, and finally perform an axial deceleration displacement for an axial acceleration distance. Axial deceleration distance, and the laser light source device 12 is controlled not to provide the laser light 120 during the period of the axial acceleration displacement and the axial deceleration displacement.

步驟250:控制振鏡組相對於工件上的目標圖案進行提前旋轉、打標旋轉、及延後旋轉。控制偏轉制動器18驅動振鏡組141相對於目標圖案先進行提前旋轉一段提前距離、接著進行打標旋轉一段振鏡打標距離、及最後進行延後旋轉一段延後距離。並於打標旋轉的實際出光時延控制雷射光源裝置12提供雷射光,於提前旋轉及延後旋轉的期間控制雷射光源裝置12不提供雷射光120。 Step 250: Control the galvanometer group to perform advance rotation, marking rotation, and postpone rotation relative to the target pattern on the workpiece. The deflection brake 18 is controlled to drive the galvanometer group 141 to rotate in advance relative to the target pattern by an advance distance, then perform marking rotation for a galvanometer marking distance, and finally perform a postponement rotation for a delay distance. The laser light source device 12 is controlled to provide laser light during the actual light emission time delay of the marking rotation, and the laser light source device 12 is controlled not to provide the laser light 120 during the period of the advance rotation and the delayed rotation.

步驟260:當移動單元的移動速度、振鏡加工速度獨自、同步或合成為等速時,控制雷射光源裝置提供雷射光。亦即當移動單元16的移動速度的第一向量與振鏡加工速度的第二向量的向量總合為所預設雷射光點的目標加工速度時,雷射打標裝置10會對工件1進行加工。 Step 260: Control the laser light source device to provide laser light when the moving speed of the moving unit and the processing speed of the galvanometer mirror are independent, synchronized or combined into a constant speed. That is, when the sum of the vector of the first vector of the moving speed of the moving unit 16 and the second vector of the galvanometer processing speed is the preset target processing speed of the laser spot, the laser marking device 10 performs Processing.

接著參考圖7A至圖7C說明進行分區接合的雷射打標的情形,圖7A繪示於工件1上欲加工一個大範圍的目標圖案2,採用本發明的雷射打標方法對大範圍的目標圖案2規劃為先對第一圖形101進行加工,再對第二圖形102進行加工,而將第一圖形101、第二圖形102分區接合成為大範圍的目標圖案2。 Next, referring to Fig. 7A to Fig. 7C, the situation of laser marking for divisional joining will be described. Fig. 7A shows that a large-scale target pattern 2 is to be processed on the workpiece 1. The laser marking method of the present invention is used to target a large-scale target. The pattern 2 is planned to process the first pattern 101 first, and then process the second pattern 102, and then join the first pattern 101 and the second pattern 102 into a large-scale target pattern 2.

圖7B繪示對第一圖形101進行加工時工件1上雷射光點的情形,在第一圖形101的第一座標101A、第一圖形101的第二座標101B之間,工件1上的雷射光點進行等速位移101M,以產生多個等距的打標節點101C。並且在等速位移101M之前,規劃總加速位移101S使移動單元16進行軸向加速位移、及/或使振鏡組141進行提前旋轉;而在等速位移101M之後,規劃總減速位移101E使移動單元16進行軸向減速位移及/或使振鏡組141進行延後旋轉。由於在總加速位移101S及總減速位移101E的期間雷射光源裝置12不提供雷射光,可以避免造成第一圖形101於第一座標101A與第二座標101B的過度加工。 FIG. 7B shows the laser spot on the workpiece 1 when the first pattern 101 is processed. Between the first coordinate 101A of the first pattern 101 and the second coordinate 101B of the first pattern 101, the laser light on the workpiece 1 The points are displaced at a constant velocity by 101M to generate a plurality of equally spaced marking nodes 101C. And before the constant velocity displacement 101M, the planned total acceleration displacement 101S causes the moving unit 16 to perform axial acceleration displacement and/or the galvanometer group 141 to rotate in advance; and after the constant velocity displacement 101M, the planned total deceleration displacement 101E causes the movement The unit 16 performs an axial deceleration displacement and/or causes the galvanometer group 141 to postpone rotation. Since the laser light source device 12 does not provide laser light during the total acceleration displacement 101S and the total deceleration displacement 101E, the over-processing of the first pattern 101 at the first coordinate 101A and the second coordinate 101B can be avoided.

圖7C繪示對第二圖形102進行加工時工件1上雷射光點的情形,同理在第二圖形102的第一座標102A、第二圖形102的第二座標102B之間,工件1上的雷射光點進行等速位移102M,以產生多個等距的打標節點102C。並且在等速位移102M之前,規劃總加速位移102S使移動單元16進行軸向加速位移、及/或使振鏡組141進行提前旋轉;在等速位移102M之後,規劃總減速位移102E使移動單元16進行軸向減速位移、及/或使振鏡組141進行延後旋轉。由於在總加速位移102S及總減速位移102E的期間雷射光源裝置12不提供雷射光,可以避免第二圖形102於第一座標102A與第二座標102B的過度加工。 Fig. 7C illustrates the situation of the laser spot on the workpiece 1 when the second pattern 102 is processed. Similarly, between the first coordinate 102A of the second pattern 102 and the second coordinate 102B of the second pattern 102, the position on the workpiece 1 The laser spot undergoes a constant velocity displacement of 102M to generate a plurality of equidistant marking nodes 102C. And before the constant velocity displacement 102M, the planned total acceleration displacement 102S causes the mobile unit 16 to perform axial acceleration displacement and/or the galvanometer group 141 to rotate in advance; after the constant velocity displacement 102M, the planned total deceleration displacement 102E causes the mobile unit 16 performs an axial deceleration displacement, and/or causes the galvanometer group 141 to perform a postpone rotation. Since the laser light source device 12 does not provide laser light during the total acceleration displacement 102S and the total deceleration displacement 102E, it is possible to avoid excessive processing of the second pattern 102 on the first coordinate 102A and the second coordinate 102B.

由於第二圖形102與第一圖形101是分區接合,第二圖形102的第一座標102A與第一圖形101的第二座標101B相鄰並不重疊。因此不會在第二圖形102的第一座標102A與第一圖形101的第二座標101B重複雷射打標,賦予第一圖形101的打標節點101C及第二圖形102的打標節點102C的雷射能量皆相同,於第一圖形101與第二圖形102的銜接處不會產生過度加工,可以提供高生產率(throughput)並且消除拼接誤差及減少分區接縫。 Since the second pattern 102 and the first pattern 101 are joined in regions, the first coordinate 102A of the second pattern 102 and the second coordinate 101B of the first pattern 101 are adjacent and do not overlap. Therefore, the laser marking will not be repeated at the first coordinate 102A of the second graphic 102 and the second coordinate 101B of the first graphic 101, and the marking node 101C of the first graphic 101 and the marking node 102C of the second graphic 102 will not be repeated. The laser energy is the same, and no over-processing is produced at the junction of the first pattern 101 and the second pattern 102, which can provide high throughput and eliminate splicing errors and reduce partition seams.

本說明書所述內容僅為舉例性,而非為限制性者。任何未脫離本發明之精神與範疇,對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。 The content described in this specification is only illustrative and not restrictive. Any equivalent modification or alteration that does not depart from the spirit and scope of the present invention shall be included in the scope of the appended patent application.

1:工件 1: Workpiece

10:雷射打標裝置 10: Laser marking device

12:雷射光源裝置 12: Laser light source device

13:控制器 13: Controller

130:命令輸出模組 130: Command output module

131:雷射光致發模組 131: Laser light emitting module

133:路徑規劃模組 133: Path Planning Module

141:振鏡組 141: Galvanometer group

120:雷射光 120: Laser light

16:移動單元 16: mobile unit

18:偏轉制動器 18: Deflection brake

Claims (6)

一種雷射打標系統,包括:一工件承載台,用以置放一待加工工件;一控制器,用以接收一目標圖像所對應的一座標資訊;及一雷射打標裝置,設置於該工件承載台上方,該雷射打標裝置包括:一雷射光源裝置,用以發射一雷射光;一加工頭,設有一振鏡組用以接收該雷射光,使該雷射光的每一脈衝在該待加工工件上形成一雷射光點,以進行一加工;一移動單元,與該加工頭連接並帶動該加工頭相對於該工件承載台進行一移動;以及一偏轉制動器,驅動該振鏡組轉動,以改變所接收的該雷射光的行進方向,使該雷射光點以一振鏡加工速度在該待加工工件上前進;其中該控制器根據該目標圖像控制該振鏡組相對於該待加工工件進行包括一提前旋轉、一打標旋轉、及一延後旋轉,並控制該移動單元在該工件承載台上進行該移動時具有一移動速度包括一軸向加速位移、一軸向等速位移、一軸向減速位移、或是不移動,當該移動單元的該移動速度的一第一向量與該振鏡加工速度的一第二向量的一向量總合達到所預設該雷射光點的一目標加工速度時,雷射打標裝置對該待加工工件進行該加工;而當該振鏡組進行該提前旋轉時、及/或該移動單元進行該軸向加速位移時、及當該振鏡組進行該延後旋轉時、及/或該移動單元進行該軸向減速位移時,控制該雷射光源裝置不提供該雷射光。 A laser marking system includes: a workpiece bearing platform for placing a workpiece to be processed; a controller for receiving a mark information corresponding to a target image; and a laser marking device provided with Above the workpiece carrier, the laser marking device includes: a laser light source device for emitting a laser light; a processing head with a galvanometer group for receiving the laser light so that each part of the laser light A pulse forms a laser spot on the workpiece to be processed for processing; a moving unit connected to the processing head and driving the processing head to move relative to the workpiece carrier; and a deflection brake to drive the The galvanometer group rotates to change the traveling direction of the received laser light, so that the laser spot advances on the workpiece to be processed at a galvanometer processing speed; wherein the controller controls the galvanometer group according to the target image Relative to the workpiece to be processed, including an advance rotation, a marking rotation, and a delayed rotation, and controlling the moving unit to have a moving speed including an axial acceleration displacement, a Axial constant velocity displacement, an axial deceleration displacement, or no movement, when a vector sum of a first vector of the moving speed of the moving unit and a second vector of the galvanometer processing speed reaches a preset value When the laser spot has a target processing speed, the laser marking device performs the processing on the workpiece to be processed; and when the galvanometer group performs the advance rotation and/or when the moving unit performs the axial acceleration displacement And when the galvanometer group performs the delayed rotation and/or when the moving unit performs the axial deceleration displacement, the laser light source device is controlled not to provide the laser light. 如請求項1所述之雷射打標系統,其中該控制器據以規劃提供給該移動單元的一軸向加速距離、一軸向等速距離、及一軸向減速距離,及規劃提供給該振鏡組的一提前距離、一振鏡打標距離、及一延後距離。 The laser marking system according to claim 1, wherein the controller plans an axial acceleration distance, an axial constant velocity distance, and an axial deceleration distance provided to the mobile unit according to the plan, and the plan is provided to An advance distance, a marking distance of the galvanometer lens, and a delay distance of the galvanometer group. 如請求項1所述之雷射打標系統,其中該目標加工速度為等速。 The laser marking system according to claim 1, wherein the target processing speed is a constant speed. 一種雷射打標方法,使用一雷射打標裝置對置放於一工件承載台上的一待加工工件進行一加工,該雷射打標裝置包括:一雷射光源裝置,用以發射一雷射光;一加工頭,設有一振鏡組用以接收該雷射光,使該雷射光的每一脈衝在該待加工工件上形成一雷射光點,以進行一加工;一移動單元,與該加工頭連接並帶動該加工頭相對於該工件承載台進行一移動;以及一偏轉制動器,驅動該振鏡組轉動,以改變所接收的該雷射光的行進方向,使該雷射光點以一振鏡加工速度在該待加工工件上前進;該雷射打標方法包括:接收一目標圖像所對應的一座標資訊,並規劃該雷射光點於該待加工工件上前進的一目標加工速度;根據該雷射光點的該目標加工速度規劃該移動單元進行該移動的一移動速度及該振鏡加工速度;其中該移動速度包括一軸向加速位移、一軸向等速位移、一軸向減速位移、或是不移動,且根據該目標圖像控制該振鏡組相對於該待加工工件進行包括一提前旋轉、一打標旋轉、及一延後旋轉;以及當該移動單元的該移動速度的一第一向量與該振鏡加工速度的一第二向量的一向量總合達到所預設該雷射光點的該目標加工速度時,控制該雷射打 標裝置對該待加工工件進行該加工;而當該振鏡組進行該提前旋轉時、及/或該移動單元進行該軸向加速位移時、及當該振鏡組進行該延後旋轉時、及/或該移動單元進行該軸向減速位移時,控制該雷射光源裝置不提供該雷射光。 A laser marking method uses a laser marking device to process a workpiece to be processed placed on a workpiece carrier. The laser marking device includes: a laser light source device for emitting a Laser light; a processing head equipped with a galvanometer group to receive the laser light, so that each pulse of the laser light forms a laser spot on the workpiece to be processed for processing; a moving unit, and the The processing head is connected to and drives the processing head to move relative to the workpiece carrier; and a deflection brake, which drives the galvanometer group to rotate, so as to change the direction of the received laser light, so that the laser spot is vibrated The mirror processing speed advances on the workpiece to be processed; the laser marking method includes: receiving a landmark information corresponding to a target image, and planning a target processing speed for the laser spot to advance on the workpiece to be processed; According to the target processing speed of the laser spot, a moving speed of the moving unit and the processing speed of the galvanometer are planned; wherein the moving speed includes an axial acceleration displacement, an axial constant velocity displacement, and an axial deceleration Displace or not move, and control the galvanometer group to perform an advance rotation, a marking rotation, and a postpone rotation relative to the workpiece to be processed according to the target image; and when the moving speed of the moving unit When the sum of a first vector of a first vector and a second vector of the galvanometer processing speed reaches the preset target processing speed of the laser spot, the laser is controlled The marking device performs the processing on the workpiece to be processed; and when the galvanometer group performs the advance rotation, and/or the moving unit performs the axial acceleration displacement, and when the galvanometer group performs the delayed rotation, And/or when the moving unit performs the axial deceleration displacement, the laser light source device is controlled not to provide the laser light. 如請求項4所述之雷射打標方法,其中當該振鏡組進行該打標旋轉時、及/或該移動單元進行該軸向等速位移時,則控制該雷射光源裝置提供該雷射光。 The laser marking method according to claim 4 , wherein when the galvanometer group performs the marking rotation and/or the moving unit performs the axial displacement at a constant velocity, the laser light source device is controlled to provide the laser. 如請求項4所述之雷射打標方法,其中該目標加工速度為等速。 The laser marking method according to claim 4 , wherein the target processing speed is a constant speed.
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