TWI747641B - Laser marking system and laser marking method - Google Patents
Laser marking system and laser marking method Download PDFInfo
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Abstract
Description
本發明有關於雷射加工技術領域,特別是涉及一種雷射打標系統及雷射打標方法。 The invention relates to the technical field of laser processing, in particular to a laser marking system and a laser marking method.
習知技術中的雷射打標裝置是以雷射方式在工件表面形成文字、圖案等標記,與傳統的機械雕刻或化學蝕刻形成法相比,具有精度高、速度快、以及產生的標記具備永久性等之優點,因此在工業上,特別是積體電路工業需要高精密度及高量產的IC標記,故雷射打標技術與裝置在工業中實屬重要。 The laser marking device in the prior art uses a laser method to form characters, patterns and other marks on the surface of the workpiece. Compared with traditional mechanical engraving or chemical etching, it has high precision, high speed, and permanent marks. Therefore, the industry, especially the integrated circuit industry, requires high-precision and high-volume IC marks, so laser marking technology and devices are really important in the industry.
雷射打標裝置的雷射光源裝置一般是用以提供雷射光,雷射打標裝置的振鏡組一般是用於接收雷射光並採用預設的角速度進行旋轉,以改變雷射光的路徑方向;藉由調整振鏡組X方向振鏡及Y方向振鏡的旋轉角度,以控制雷射光點的位置,但振鏡組旋轉的角度有其特定的範圍,造成雷射打標加工範圍亦有限,為達到大範圍的打標應用,一般會使用拼接打標的方式,將大範圍圖形分成幾個小面積區,實際打標時是一區一區進行打標,並且將這些區域進行打標拼接,即所謂分區打標,以滿足打標圖形範圍大的需求。在分區打
標的情形,圖1中具有火柴頭形狀的實際打標圖樣92造成了區間的邊界特別的明顯,故容易造成整體圖形在分區銜接部分具有缺陷。
The laser light source device of the laser marking device is generally used to provide laser light, and the galvanometer group of the laser marking device is generally used to receive the laser light and rotate at a preset angular velocity to change the path direction of the laser light ; By adjusting the rotation angle of the galvanometer in the X direction and the Y direction of the galvanometer group to control the position of the laser spot, but the rotation angle of the galvanometer group has its specific range, resulting in a limited laser marking processing range In order to achieve a large-scale marking application, the method of splicing marking is generally used to divide the large-scale graphics into several small areas. In actual marking, the marking is performed in one area and one area, and these areas are marked and spliced , The so-called zone marking, to meet the needs of marking a large range of graphics. Play in the district
In the case of the target, the
參考圖1,圖1是傳統雷射打標裝置進行打標時,雷射光照射在工件上的軌跡示意圖。在圖1中,元件符號90是表示預計的打標圖樣,是指使用者想要在工件11上形成的圖形。執行雷射打標時,雷射光會在工件11上形成多個雷射點,不同時間下的雷射點的集合構成雷射光軌跡91,圖1顯示在雷射打標過程中,從起始到結束的雷射光軌跡91的散布圖。雷射打標過程從打標起點91S起始,至打標終點91E結束,在雷射打標過程中,雷射光源裝置是保持等頻率提供雷射光,而在打標起點91S之前或是在打標終點91E之後,雷射光源裝置不提供雷射光,如此一來開始雷射打標,振鏡組從停止加速到加工速度,或是從加工速度減速到停止,在低於加工速度的區域的加速段/減速段,由於振鏡組移動緩慢就容易在單位距離內聚集過多的雷射能量,而造成過度加工,讓實際打標圖樣92看起來像是火柴頭,使得圖形有明顯的分區銜接點。
Refer to Figure 1, which is a schematic diagram of the trajectory of the laser light irradiated on the workpiece when the traditional laser marking device performs marking. In FIG. 1, the
有鑑於上述習知技術的缺失,本發明的主要目的在於提供一種雷射打標系統,在進行雷射打標之前使加工頭先行加速移動,在進行雷射打標之後使加工頭減速至停止,且亦對振鏡組進行振鏡打標距離之前規劃提前旋轉、並於振鏡打標距離之後規劃延後旋轉,兩者同步實現能準確打標到每一個打標節點,且雷射打標裝置能以等速的目標加工速度進行加工,可以避免由於雷射能量集中於打標圖樣的銜接點,而過度加工成火柴頭形狀,以達到良好的雷射打標效果。 In view of the lack of the above-mentioned conventional technology, the main purpose of the present invention is to provide a laser marking system that accelerates the processing head before performing laser marking, and decelerates the processing head to a stop after laser marking. , And the galvanometer group is also planned to rotate in advance before the galvanometer marking distance, and plan to rotate after the galvanometer marking distance. The two can be synchronized to achieve accurate marking to each marking node, and laser marking The marking device can process at a constant target processing speed, which can avoid over-processing into the shape of a match head due to the laser energy being concentrated at the junction of the marking pattern, so as to achieve a good laser marking effect.
本發明的另一目的在於提供一種雷射打標方法,特別適用於對大範圍圖形以分區接合的方式進行雷射打標,使大範圍圖形的銜接點減少,以避免於銜接點由於雷射能量集中而雷射打標成火柴頭形狀(即過度加工),還可消除分區接合的誤差及減少分區接縫。 Another object of the present invention is to provide a laser marking method, which is particularly suitable for laser marking of large-scale graphics in a partitioned manner, so that the joint points of the large-scale graphics are reduced, and the joint points are prevented from being caused by the laser. The energy is concentrated and the laser is marked into the shape of a match head (that is, over-processing), which can also eliminate the error of the partition joint and reduce the partition joint.
因此根據上述目的,本發明揭露一種雷射打標系統,包括工件承載台,用以置放待加工工件、及雷射打標裝置,設置於工件承載台上方。雷射打標裝置包括雷射光源裝置,用以發射雷射光;加工頭,設有振鏡組用以接收雷射光,使雷射光的每一脈衝在待加工工件上形成雷射光點,以進行加工;移動單元,與加工頭連接並帶動加工頭相對於工件承載台進行移動;以及偏轉制動器,驅動振鏡組轉動,以改變所接收的雷射光的行進方向,使雷射光點以振鏡加工速度在待加工工件上前進。其中移動單元在工件承載台上進行移動時具有移動速度,當移動單元的移動速度的第一向量與振鏡加工速度的第二向量的向量總合達到所預設雷射光點的目標加工速度時,雷射打標裝置組對待加工工件進行加工。 Therefore, in accordance with the above objective, the present invention discloses a laser marking system, which includes a workpiece carrying platform for placing the workpiece to be processed, and a laser marking device, which is arranged above the workpiece carrying platform. The laser marking device includes a laser light source device to emit laser light; the processing head is equipped with a galvanometer group to receive the laser light, so that each pulse of the laser light forms a laser spot on the workpiece to be processed to perform Processing; a moving unit connected to the processing head and driving the processing head to move relative to the workpiece carrier; and a deflection brake, which drives the galvanometer group to rotate to change the direction of the received laser light, so that the laser spot is processed by the galvanometer The speed advances on the workpiece to be processed. The moving unit has a moving speed when moving on the workpiece carrier. When the sum of the vector of the first vector of the moving speed of the moving unit and the second vector of the galvanometer processing speed reaches the preset target processing speed of the laser spot , The laser marking device group processes the workpiece to be processed.
根據上述目的,本發明提出的雷射打標方法,使用雷射打標裝置對置放於工件承載台上的待加工工件進行加工,雷射打標裝置包括用以發射雷射光的雷射光源裝置;加工頭,設有振鏡組用以接收雷射光,使雷射光的每一脈衝在待加工工件上形成雷射光點,以進行加工;移動單元,與加工頭連接並帶動加工頭相對於工件承載台進行移動;以及偏轉制動器,驅動振鏡組轉動,以改變所接收的雷射光的行進方向,使雷射光點以振鏡加工速度在待加工工件上前進。雷射打標方法包括:接收目標圖像所對應的座標資訊,並規劃雷射光點於待加工工件上前進的目標加工速度;根據雷射光點的目標加工速度規劃移動單元進行移動的移動速度及振鏡加工速度;以及當移動單元的移動速度 的第一向量與振鏡加工速度的第二向量的向量總合達到所預設雷射光點的目標加工速度時,控制雷射打標裝置對待加工工件進行加工。 According to the above objective, the laser marking method proposed by the present invention uses a laser marking device to process the workpiece to be processed placed on the workpiece carrier. The laser marking device includes a laser light source for emitting laser light. Device; processing head, equipped with a galvanometer group to receive laser light, so that each pulse of laser light forms a laser spot on the workpiece to be processed for processing; moving unit, connected to the processing head and drives the processing head relative to The workpiece bearing table moves; and the deflection brake drives the galvanometer group to rotate to change the direction of the received laser light, so that the laser spot advances on the workpiece to be processed at the galvanometer processing speed. The laser marking method includes: receiving the coordinate information corresponding to the target image, and planning the target processing speed of the laser spot on the workpiece to be processed; planning the moving speed of the moving unit according to the target processing speed of the laser spot and Galvo processing speed; and when the moving speed of the moving unit When the sum of the vector of the first vector of and the second vector of the galvanometer processing speed reaches the preset target processing speed of the laser spot, the laser marking device is controlled to process the workpiece to be processed.
1、11:工件 1.11: Workpiece
2:目標圖像 2: target image
10:雷射打標裝置 10: Laser marking device
12:雷射光源裝置 12: Laser light source device
13:控制器 13: Controller
14:加工頭 14: Processing head
16:移動單元 16: mobile unit
18:偏轉制動器 18: Deflection brake
130:命令輸出模組 130: Command output module
131:雷射光致發模組 131: Laser light emitting module
133:路徑規劃模組 133: Path Planning Module
120:雷射光 120: Laser light
P:第一打標路徑 P: The first marking path
Q:第二打標路徑 Q: The second marking path
R:第七打標路徑 R: seventh marking path
S:第八打標路徑 S: Eighth marking path
22:打標路徑 22: Marking path
100:工件承載台 100: Workpiece carrying table
110:Z柱 110: Z-pillar
90:預計打標圖樣 90: Expected marking pattern
91:雷射光軌跡 91: Laser light trail
91E:打標終點 91E: marking the end point
101:第一圖形 101: The first figure
102:第二圖形 102: second graphic
101A、102A:第一座標 101A, 102A: first coordinate
101B、102B:第二座標 101B, 102B: second coordinate
101S、102S:總加速位移 101S, 102S: total acceleration displacement
101M、102M:等速位移 101M, 102M: Constant velocity displacement
101E、102E:總減速位移 101E, 102E: total deceleration displacement
101C、102C:打標節點 101C, 102C: marking node
210、220、230、240、250、260:步驟 210, 220, 230, 240, 250, 260: steps
91S:打標起點 91S: starting point for marking
92:實際打標圖樣 92: Actual marking pattern
141:振鏡組 141: Galvanometer group
141x:X方向振鏡 141x: X-direction galvanometer
141y:Y方向振鏡 141y: Y direction galvanometer
140:加工頭殼體 140: Processing head housing
200:流程 200: process
圖1是表示習知的雷射打標技術;圖2是根據本發明所揭露的技術,表示雷射打標裝置的示意圖;圖3是根據本發明所揭露的技術,表示雷射打標裝置的方塊圖;圖4是根據本發明所揭露的技術,表示雷射打標裝置在進行分區打標時的示意圖;圖5是根據本發明所揭露的技術,表示雷射光點在工件上前進的目標加工速度相對於時間的速度變化關係圖;圖6是根據本發明所揭露的技術,表示雷射打標方法的流程圖;以及圖7A至圖7C是根據本發明所揭露的技術,表示在進行分區接合的雷射打標的示意圖。 Fig. 1 shows a conventional laser marking technology; Fig. 2 is a schematic diagram showing a laser marking device according to the disclosed technology of the present invention; Fig. 3 is a schematic diagram showing a laser marking device according to the disclosed technology of the present invention Fig. 4 is a schematic diagram of the laser marking device during zone marking according to the technology disclosed in the present invention; Fig. 5 is a schematic diagram of the technology disclosed in the present invention, showing the progress of the laser spot on the workpiece Figure 6 is a flow chart of the laser marking method according to the technology disclosed in the present invention; and Figures 7A to 7C are based on the technology disclosed in the present invention. Schematic diagram of laser marking for zone joining.
為了對於本發明之結構目的和功效有更進一步之了解與認同,茲配合圖示詳細說明如後。以下將參照圖式來描述為達成本發明目的所使用的技術手段與功效,而以下圖式所列舉之實施例僅為輔助說明,本案之技術手段並不限於所列舉圖式。 In order to have a further understanding and recognition of the structural purpose and effects of the present invention, detailed descriptions are given below in conjunction with the drawings. The technical means and effects used to achieve the purpose of the invention will be described below with reference to the drawings, and the embodiments listed in the following drawings are merely auxiliary explanations, and the technical means of this case are not limited to the drawings listed.
首先請參考圖2及圖3,圖2表示本發明所之雷射打標裝置的示意圖及圖3表示本發明所之雷射打標系統的方塊圖。如圖2及圖3所示,雷射打標系統包括待加工的工件1放置於工件承載台100上,雷射打標裝置10設置於工件
承載台100上方,使得雷射打標裝置10便於對工件承載台100上的工件1進行加工。雷射打標裝置10包括雷射光源裝置12、配置振鏡組141(包含X方向振鏡141x與Y方向振鏡141y)的加工頭14、移動單元16、及偏轉制動器18。雷射光源裝置12設置於Z柱110上,移動單元16建構為與Z柱110正交連接,並與加工頭14連接,使得移動單元16可以如機械手臂般帶動加工頭14相對於工件承載台100進行水平的軸向移動。加工頭14設有加工頭殼體140用以包覆振鏡組141。振鏡組141包括X方向振鏡141x與Y方向振鏡141y,X方向振鏡141x、Y方向振鏡141y分別在X方向、Y方向上以相同或不同的角度進行旋轉。雷射光源裝置12用以發射雷射光120,雷射光120經由與加工頭14連接的光纖傳播,由加工頭殼體140內的振鏡組141承接雷射光120。由於X方向振鏡141x及Y方向振鏡141y不停地旋轉而改變雷射光120的路徑方向,振鏡組141的旋轉角度例如是-10°至10°,可控制旋轉角度以使雷射光120進一步抵達欲打標之節點的位置,以在工件1上形成雷射光點。接著如圖3所示,雷射打標裝置10建構為電性連接至控制器13,藉由控制器13控制雷射光源裝置12提供雷射光120,並控制移動單元16在工件1上方相對於工件承載台100進行軸向移動。另外,控制器13還控制偏轉制動器18驅動振鏡組141在工件1上方進行轉動,受到振鏡組141轉動的影響,雷射光120受到偏轉反射而改變行進方向,雷射光120的每一脈衝抵達工件1後所形成的雷射光點是以振鏡加工速度在工件1上前進。
First, please refer to FIGS. 2 and 3. FIG. 2 is a schematic diagram of the laser marking device of the present invention and FIG. 3 is a block diagram of the laser marking system of the present invention. As shown in Figures 2 and 3, the laser marking system includes a
一般振鏡組141的旋轉角度有特定的範圍,因此工件1上雷射光點的位置也會受限於一定的範圍內。當加工時需要對工件1雷射打標大範圍圖形,則採用雷射打標分區接合的方式,請參考圖4,如圖4所示,對大範圍圖形規劃多個打標路徑22,雷射打標裝置10依序對第一打標路徑P、第二打標路徑Q至第七打標路徑R進行雷射打標;之後再對第八打標路徑S進行雷射打標與第一打標路徑P接合。在每一個打標路徑22的起點往前設定一段提前距離,供以在
雷射光源裝置12開啟雷射光之前,振鏡組141先進行提前旋轉;並在每個打標路徑22的終點往後設定一段延後距離,供以雷射光源裝置12關閉雷射光之後,振鏡組141追加進行延後旋轉,而於振鏡打標距離,振鏡組141進行所謂的打標旋轉。因此虛線表示振鏡組141相對於打標路徑22進行旋轉的路徑。而圖4下方的箭頭方向表示移動單元16帶動加工頭14以移動速度相對於工件承載台100進行移動的路徑,在移動單元16帶動加工頭14移動到達第一打標路徑P之前,預設一段軸向加速距離,使得移動單元16帶動加工頭14從靜止開始進行軸向加速位移,直到移動速度到達等速;接著,在預設的軸向等速距離,即從第一打標路徑P、第二打標路徑Q至第七打標路徑R進行加工之期間,移動單元16帶動加工頭14進行軸向等速位移;最後,移動單元16帶動加工頭14移動到第七打標路徑R之後,預設一段軸向減速距離,使得移動單元16帶動加工頭14進行軸向減速位移直到移動速度從等速減速至靜止。本發明不侷限於移動單元16一定要移動,實際操作也有移動單元16不移動的情形,則加工頭14固定不動。為了避免打標路徑22的打標起點、打標終點的雷射能量過度集中而出現火柴頭,並要減少兩個打標路徑22之間的銜接點有明顯的拼接現象,一旦雷射光點於工件上前進的速度達到等速的目標加工速度,亦即移動單元16的移動速度的第一向量與振鏡加工速度的第二向量之向量總和與所預設雷射光點的目標加工速度的向量相同時,控制器13會控制雷射打標裝置10的雷射光源裝置12提供雷射光120以對工件1進行加工,則不會在第一打標路徑P與第八打標路徑S之間的銜接點出現火柴頭,即能達成本發明的功效。
Generally, the rotation angle of the galvanometer group 141 has a specific range, so the position of the laser spot on the
請繼續參考圖3,控制器13與雷射光源裝置12、移動單元16、及偏轉制動器18電性連接。控制器13至少包括命令輸出模組130、雷射光致發模組131、及路徑規劃模組133。雷射光致發模組131、路徑規劃模組133分別電性連接至命令輸出模組130。以下說明控制器13所設計的各個模組的運作方式,
其中,雷射打標的起始時間點、及目標圖像2的第一座標(所謂打標起點)、第二座標(所謂打標終點)等等的座標資訊可以由使用者預先設定給控制器13,也可以導入高階的人工智慧技術經由取得目標圖像而於控制器13自動生成,本發明並不侷限於此。
Please continue to refer to FIG. 3, the
雷射光致發模組131用以決定在目標圖像的第一座標與第二座標之間的多個座標資訊所賦予的每一個打標節點提供對應於脈衝周期的雷射能量,且當移動單元16的移動速度、振鏡加工速度單獨、同步或合成為等速時才提供雷射光,並傳送相對應的訊號至命令輸出模組130。命令輸出模組130接收此訊號據以傳送光開啟關閉命令至雷射光源裝置12,以提示雷射光源裝置12在多個打標節點需要產生特定能量值的輸出功率,由雷射光源裝置12發出對應於雷射能量值的雷射光120,而在移動單元16的移動速度、振鏡加工速度單獨或同步為非等速時則不提供雷射光。也就是說,雷射光源裝置12根據光開啟關閉命令於移動單元16進行軸向加速位移及軸向減速位移之期間、及於振鏡組141進行提前旋轉及延後旋轉之期間不提供雷射光120。
The laser photo-emitting module 131 is used to determine that each marking node given by multiple coordinate information between the first coordinate and the second coordinate of the target image provides laser energy corresponding to the pulse period, and when moving When the moving speed of the
路徑規劃模組133用以接收欲雷射打標的目標圖像2的第一座標、第二座標的座標資訊,根據目標圖像2的多個座標資訊規劃將要產生的雷射光點於工件1上前進的目標加工速度,並根據所預設雷射光點的目標加工速度規劃決定振鏡加工速度及移動單元16帶動加工頭14在工件承載台100上進行移動的移動速度。並計算移動單元16的軸向加速距離、軸向等速距離、及軸向減速距離;及/或計算振鏡組141的提前距離、振鏡打標距離、及延後距離。路徑規劃模組133據以相對應的訊號傳送至命令輸出模組130,命令輸出模組130接收此訊號後據以傳送振鏡轉動命令至偏轉制動器18、及/或傳送軸向移動命令至移動單元16。且於目標圖像2的第一座標、第二座標之間規劃多個打標節點,對每一個打標節點賦予座標資訊。則從目標圖像2的第一座標往前延伸一
段總加速位移而產生第一預移座標(所謂總加速位移的起點);從目標圖像2的第二座標往後延伸一段總減速位移而產生第二預移座標(所謂總減速位移的終點)。
The path planning module 133 is used to receive the coordinate information of the first coordinate and the second coordinate of the
接著,雷射打標過程中雷射光點在工件上前進的速度相對於時間的速度變化關係請參考圖5。如圖5所示,在雷射打標的起始時間點之前,移動單元16進行軸向加速位移、及/或振鏡組141進行提前旋轉,且雷射光源裝置12不提供雷射光,則從第0秒至雷射打標的起始時間點,未出光的節點在工件11上是加速地前進(以虛線表示),則此段時間定義為加速預移時延。在目標圖像的第一座標與第二座標之間,雷射光源裝置12提供雷射光120進行雷射打標,雷射光點在工件11上是等速地前進(以實線表示),則此段時間定義為實際出光時延;當工件11上目標圖像的第二座標完成雷射打標之後,雷射光源裝置12不提供雷射光120,移動單元16進行軸向減速位移、及/或振鏡組141進行延後旋轉,則未出光的節點在工件11上減速地前進(以虛線表示),此段時間定義為減速預移時延。
Next, please refer to Figure 5 for the relationship between the speed of the laser spot advancing on the workpiece during the laser marking process with respect to time. As shown in FIG. 5, before the start time point of laser marking, the moving
控制器13的各個模組對應雷射光源裝置12、移動單元16、偏轉制動器18的運作關係如以下說明。
The operating relationships of the various modules of the
對偏轉制動器18而言,分別與振鏡組141、控制器13的命令輸出模組130連接,接收振鏡轉動命令,並根據預設的提前距離、振鏡打標距離、及延後距離,驅動振鏡組141進行提前旋轉、打標旋轉、及延後旋轉。為使雷射光點在工件1上能以等速度前進,路徑規劃模組133儲存有速度演算法將所預設雷射光點的目標加工速度規劃為移動單元16預設的移動速度與預設的振鏡加工速度之向量總和,並儲存有向量演算法將振鏡組141的提前距離與移動單元16的軸向加速距離之向量總和規劃為總加速位移的距離;將振鏡組141的振鏡打標距離與移動單元16的軸向等速距離之向量總和規劃為雷射光點等速位移的
距離;將振鏡組141的延後距離與移動單元16的軸向減速距離之向量總和規劃為總減速位移的距離。
For the
對振鏡組141而言,利用X方向振鏡141x與Y方向振鏡141y改變雷射光120打在工件1上雷射光點的位置。詳細來說,振鏡組141會將當前轉動的座標值回傳至路徑規劃模組133,路徑規劃模組133根據振鏡組141當前轉動的座標值與多個打標節點所在的座標值,進行插值運算,所謂插值運算指的是插入一個在路徑規劃模組133所生成資料中沒有的值。路徑規劃模組133在發出命令至偏轉制動器18之前,會先擷取振鏡組141當前轉動的座標值,然後依據振鏡組141當前轉動的座標值,於目標圖像的第一座標之前及目標圖像的第二座標之後插入多個挪動節點,以供雷射光源裝置12發出的雷射光120能夠與振鏡組141同步對位。
For the galvanometer group 141, the
對移動單元16而言,實際上是透過驅動器(圖未繪示)與控制器13的命令輸出模組130連接,驅動器接收軸向移動命令據以驅動移動單元16根據預設的移動速度、軸向加速距離、軸向等速距離、及軸向減速距離,帶動加工頭14進行軸向加速位移、軸向等速位移、軸向減速位移、或是不移動。當移動單元16不移動時,則移動單元16不會帶動加工頭14相對於工件承載台100進行移動,則只要振鏡加工速度達到所預設雷射光點的目標加工速度即提供雷射光以進行加工。雷射光點在工件1上前進的距離即為振鏡打標距離,總加速位移的距離即為與振鏡組141的提前距離,總減速位移的距離即為振鏡組141的延後距離。
For the moving
在一實施例中,對目標圖像規劃多個打標路徑22以進行雷射打標的詳細操作請參考圖6,圖6表示本發明的雷射打標方法的流程圖。如圖6所示並配合圖5說明雷射打標方法的流程200包括以下所述:
In one embodiment, for the detailed operation of planning multiple marking
首先進行步驟210:接收目標圖像所對應的座標資訊(例如第一座標與第二座標),規劃雷射光點於工件上前進的目標加工速度,並且接收開始雷射打標的起始時間點。 First, proceed to step 210: receiving coordinate information corresponding to the target image (for example, the first coordinate and the second coordinate), planning the target processing speed of the laser spot on the workpiece, and receiving the start time point of laser marking.
接著進行步驟220:根據所預設雷射光點的目標加工速度規劃移動單元的移動速度與振鏡加工速度。 Then proceed to step 220: planning the moving speed of the moving unit and the processing speed of the galvanometer according to the preset target processing speed of the laser spot.
接著進行步驟230:根據工件上的目標圖像規劃振鏡組的提前距離、振鏡打標距離、及延後距離;根據移動單元預設的移動速度規劃移動單元的軸向加速距離、軸向等速距離、及軸向減速距離。此步驟中較佳是利用軟體程式的演算法或技術人員的經驗法,由人工或是控制器13的路徑規劃模組133根據工件上目標圖像所對應的座標資訊規劃演算振鏡組141的提前距離、振鏡打標距離、及延後距離、移動單元16的軸向加速距離、軸向等速距離、及軸向減速距離。接著同步進行步驟240及/或步驟250。
Then proceed to step 230: plan the advance distance, the marking distance, and the retard distance of the galvanometer group according to the target image on the workpiece; plan the axial acceleration distance and the axial acceleration distance of the mobile unit according to the preset movement speed of the mobile unit Constant speed distance, and axial deceleration distance. In this step, it is better to use the algorithm of a software program or the experience method of the technical personnel. The path planning module 133 of the
步驟240:控制移動單元以移動速度帶動加工頭相對於工件承載台進行移動。控制驅動器驅動移動單元16帶動加工頭14相對於工件承載台100先進行軸向加速位移一段軸向加速距離、接著進行軸向等速位移一段軸向等速距離、及最後進行軸向減速位移一段軸向減速距離,而於軸向加速位移及軸向減速位移的期間控制雷射光源裝置12不提供雷射光120。
Step 240: Control the moving unit to drive the processing head to move relative to the workpiece carrier at a moving speed. The control driver drives the moving
步驟250:控制振鏡組相對於工件上的目標圖案進行提前旋轉、打標旋轉、及延後旋轉。控制偏轉制動器18驅動振鏡組141相對於目標圖案先進行提前旋轉一段提前距離、接著進行打標旋轉一段振鏡打標距離、及最後進行延後旋轉一段延後距離。並於打標旋轉的實際出光時延控制雷射光源裝置12提供雷射光,於提前旋轉及延後旋轉的期間控制雷射光源裝置12不提供雷射光120。
Step 250: Control the galvanometer group to perform advance rotation, marking rotation, and postpone rotation relative to the target pattern on the workpiece. The
步驟260:當移動單元的移動速度、振鏡加工速度獨自、同步或合成為等速時,控制雷射光源裝置提供雷射光。亦即當移動單元16的移動速度的第一向量與振鏡加工速度的第二向量的向量總合為所預設雷射光點的目標加工速度時,雷射打標裝置10會對工件1進行加工。
Step 260: Control the laser light source device to provide laser light when the moving speed of the moving unit and the processing speed of the galvanometer mirror are independent, synchronized or combined into a constant speed. That is, when the sum of the vector of the first vector of the moving speed of the moving
接著參考圖7A至圖7C說明進行分區接合的雷射打標的情形,圖7A繪示於工件1上欲加工一個大範圍的目標圖案2,採用本發明的雷射打標方法對大範圍的目標圖案2規劃為先對第一圖形101進行加工,再對第二圖形102進行加工,而將第一圖形101、第二圖形102分區接合成為大範圍的目標圖案2。
Next, referring to Fig. 7A to Fig. 7C, the situation of laser marking for divisional joining will be described. Fig. 7A shows that a large-
圖7B繪示對第一圖形101進行加工時工件1上雷射光點的情形,在第一圖形101的第一座標101A、第一圖形101的第二座標101B之間,工件1上的雷射光點進行等速位移101M,以產生多個等距的打標節點101C。並且在等速位移101M之前,規劃總加速位移101S使移動單元16進行軸向加速位移、及/或使振鏡組141進行提前旋轉;而在等速位移101M之後,規劃總減速位移101E使移動單元16進行軸向減速位移及/或使振鏡組141進行延後旋轉。由於在總加速位移101S及總減速位移101E的期間雷射光源裝置12不提供雷射光,可以避免造成第一圖形101於第一座標101A與第二座標101B的過度加工。
FIG. 7B shows the laser spot on the
圖7C繪示對第二圖形102進行加工時工件1上雷射光點的情形,同理在第二圖形102的第一座標102A、第二圖形102的第二座標102B之間,工件1上的雷射光點進行等速位移102M,以產生多個等距的打標節點102C。並且在等速位移102M之前,規劃總加速位移102S使移動單元16進行軸向加速位移、及/或使振鏡組141進行提前旋轉;在等速位移102M之後,規劃總減速位移102E使移動單元16進行軸向減速位移、及/或使振鏡組141進行延後旋轉。由於在總加速位移102S及總減速位移102E的期間雷射光源裝置12不提供雷射光,可以避免第二圖形102於第一座標102A與第二座標102B的過度加工。
Fig. 7C illustrates the situation of the laser spot on the
由於第二圖形102與第一圖形101是分區接合,第二圖形102的第一座標102A與第一圖形101的第二座標101B相鄰並不重疊。因此不會在第二圖形102的第一座標102A與第一圖形101的第二座標101B重複雷射打標,賦予第一圖形101的打標節點101C及第二圖形102的打標節點102C的雷射能量皆相同,於第一圖形101與第二圖形102的銜接處不會產生過度加工,可以提供高生產率(throughput)並且消除拼接誤差及減少分區接縫。
Since the
本說明書所述內容僅為舉例性,而非為限制性者。任何未脫離本發明之精神與範疇,對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。 The content described in this specification is only illustrative and not restrictive. Any equivalent modification or alteration that does not depart from the spirit and scope of the present invention shall be included in the scope of the appended patent application.
1:工件 1: Workpiece
10:雷射打標裝置 10: Laser marking device
12:雷射光源裝置 12: Laser light source device
13:控制器 13: Controller
130:命令輸出模組 130: Command output module
131:雷射光致發模組 131: Laser light emitting module
133:路徑規劃模組 133: Path Planning Module
141:振鏡組 141: Galvanometer group
120:雷射光 120: Laser light
16:移動單元 16: mobile unit
18:偏轉制動器 18: Deflection brake
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