TWM618075U - Laser marking device - Google Patents
Laser marking device Download PDFInfo
- Publication number
- TWM618075U TWM618075U TW110204029U TW110204029U TWM618075U TW M618075 U TWM618075 U TW M618075U TW 110204029 U TW110204029 U TW 110204029U TW 110204029 U TW110204029 U TW 110204029U TW M618075 U TWM618075 U TW M618075U
- Authority
- TW
- Taiwan
- Prior art keywords
- speed
- marking
- workpiece
- laser
- optical element
- Prior art date
Links
Images
Landscapes
- Laser Beam Processing (AREA)
Abstract
Description
本新型創作是有關於一種雷射打標裝置,且特別是有關於一種可針對輪廓形狀變化較大的工件進行連續不間斷加工的雷射打標裝置。The new creation relates to a laser marking device, and particularly to a laser marking device that can perform continuous and uninterrupted processing of workpieces with large contour changes.
在習知的技術領域,利用雷射打標裝置對輪廓形狀變化較大的工件執行打標程序時,常需要設置複雜的機構,或透過多次的、複雜的程序才能完成。通常需要設置具有高維度移動能力的振鏡,或者需要驅動工件進行多維度移動,因此提高了生產成本。或者,部分的習知技術需要提供多道的加工程序,方能完成單一工件的加工程序,也造成生產過程的困難,並降低工件加工的效率。In the conventional technical field, when a laser marking device is used to perform a marking procedure on a workpiece with a large contour shape change, it is often necessary to set up a complicated mechanism or to complete it through multiple and complicated procedures. It is usually necessary to install a galvanometer with high-dimensional movement capability, or it is necessary to drive the workpiece to move in multiple dimensions, thereby increasing the production cost. Or, some conventional technologies need to provide multiple processing procedures in order to complete the processing procedures of a single workpiece, which also causes difficulties in the production process and reduces the efficiency of workpiece processing.
本新型創作提供一種雷射打標裝置,可達到任意形狀工件連續不間斷的加工需求。This new creation provides a laser marking device that can meet the continuous and uninterrupted processing requirements of workpieces of any shape.
本新型創作的雷射打標裝置包括電機、雷射源、光學元件以及控制器。電機用以帶動工件以依據旋轉軸進行旋轉。雷射源發送雷射光束。光學元件耦接該雷射源。光學元件具有振鏡以沿第一方向以及第二方向移動來傳送雷射光束至工件。控制器耦接電機、光學元件以及雷射源。控制器用以:接收打標圖檔與工件圖檔;使打標圖檔與工件圖檔相對應以產生映射資訊;基於映射資訊,使光學元件的參考位置與工件的加工表面的距離等於預設距離;在打標程序中,根據打標圖檔以計算出規劃路徑,根據規畫路徑以及光學元件的第一速度來計算出工件的第二速度;以及,根據映射資訊、第一速度以及第二速度以計算雷射源的一啟閉時間資訊。其中,光學元件根據啟閉時間資訊以執行打標程序。The laser marking device created by the new model includes a motor, a laser source, an optical element and a controller. The motor is used to drive the workpiece to rotate according to the rotation axis. The laser source sends out a laser beam. The optical element is coupled to the laser source. The optical element has a galvanometer to move along the first direction and the second direction to transmit the laser beam to the workpiece. The controller is coupled to the motor, the optical element and the laser source. The controller is used to: receive the marking image file and the workpiece image file; make the marking image file correspond to the workpiece image file to generate mapping information; based on the mapping information, make the distance between the reference position of the optical element and the processing surface of the workpiece equal to the preset Distance; In the marking program, the planned path is calculated according to the marking drawing file, and the second speed of the workpiece is calculated according to the planned path and the first speed of the optical element; and, according to the mapping information, the first speed and the first speed The second speed is used to calculate the opening and closing time information of the laser source. Among them, the optical element executes the marking procedure according to the opening and closing time information.
基於上述,本新型創作實施例透過光學元件上的振鏡在不同方向上的移動,配合電機以帶動工件旋轉,來對工件進行雷射打標動作。基於維持光學元件上的一參考位置與工件的加工表面的距離,本新型創作的雷射打標裝置可有效的針對可具有任意形狀的工件進行連續不間斷的雷射打標動作,減低雷射打標動作的複雜度,並節省打標動作所需要的時間。Based on the above, the creative embodiment of the present invention performs laser marking on the workpiece by moving the galvanometer on the optical element in different directions and cooperating with the motor to drive the workpiece to rotate. Based on maintaining the distance between a reference position on the optical element and the processing surface of the workpiece, the laser marking device created by the new invention can effectively perform continuous and uninterrupted laser marking actions on workpieces that can have any shape, reducing the laser The complexity of the marking action and save the time required for the marking action.
請參照圖1,圖1繪示本新型創作一實施例的雷射打標裝置的示意圖。雷射打標裝置100包括電機110、雷射源120、光學元件130以及控制器150。電機110耦接至工件160。電機110用以帶動工件160以依據旋轉軸進行旋轉。雷射源120則用以發送一雷射光束LBA。光學元件130耦接至雷射源120。光學元件130具有振鏡140用以傳送雷射光束LB至工件160的表面,並針對工件160的表面執行一雷射打標(雕刻)程序。在本實施例中,控制器150控制光學元件130可使振鏡140產生移動(例如轉動),使雷射光束LB以沿第一方向以及第二方向移動以在工件160上進行一二維空間的掃描動作,以執行打標程序。其中,上述的第一方向以及第二方向可以相互正交。Please refer to FIG. 1. FIG. 1 is a schematic diagram of a laser marking device according to an embodiment of the present invention. The
在本實施例中,工件160的形狀沒有固定的限制。也就是說,工件160可以為一異形工件,即工件外部輪廓可以是任意形狀。透過光學元件130使雷射光束LB產生二維空間的移動,並搭配電機110驅動工件160進行的旋轉,可使雷射打標裝置100在工件160上執行三維的打標程序。In this embodiment, there is no fixed limit to the shape of the
在另一方面,控制器150耦接至電機110、光學元件130以及雷射源120。控制器150用以控制電機110、光學元件130以及雷射源120的動作,以執行打標程序。在動作細節上,控制器150可接收打標圖檔MF1以及工件圖檔WSF1。其中,打標圖檔MF1中記錄一個或多個打標圖案,以及打標圖案間的距離資訊。工件圖檔WSF1則可記錄工件160的形狀等機構上的相關資訊。例中,打標圖檔MF1以及工件圖檔WSF1可以為2維圖檔或3維圖檔。On the other hand, the
控制器150並用以使打標圖檔MF1與工件圖檔WSF1相對應以產生一映射資訊。在此請同步參照圖2以及圖1,其中圖2繪示本新型創作實施例的打標圖檔與工件圖檔間的映射資訊的產生方式的示意圖。在圖2中,打標圖檔MF1中可記錄多個打標圖案OB1~OB3以及打標圖案OB1~OB3間的距離資訊,其中打標圖案OB1~OB3間的距離資訊可依據打標圖案OB1~OB3所分別對應的多個特徵位置來獲得。工件圖檔WSF1中則可記錄工件160的輪廓描述資訊。控制器150可在打標圖檔中設定第一參考點,並在工件圖檔中設定第二參考點O。透過使打標圖檔MF1中的第一參考點與工件圖檔WSF1中的第二參考點O相重合,再透過對應打標圖案OB1~OB3以及工件160的輪廓描述資訊並執行幾何運算,可以獲得打標圖檔MF1與工件圖檔WSF1相對應以產生一映射資訊MAF。其中,控制器150可透過執行應用程式以沿著工件150的輪廓計算長度,並將打標圖案OB1~OB3對應到工件160的表面上。在本實施例中,打標圖案OB1~OB3間的距離資訊包括長度資訊L1~L3以及深度資訊D1~D3。The
其中,以第二參考點O為原點,根據打標圖檔MF1中的打標圖案OB1~OB3的多個特徵位置以及第二參考點O間的位置對應關係,控制器150可計算出打標圖案OB1在工件160的輪廓延伸方向上的座標為長度資訊L1,打標圖案OB1的深度座標為深度資訊D1;打標圖案OB2在工件160的輪廓延伸方向上的座標為長度資訊L2,打標圖案OB2的深度座標為深度資訊D2;打標圖案OB3在工件160的輪廓延伸方向上的座標為長度資訊L3,打標圖案OB3的深度座標為深度資訊D3,並藉此產生映射資訊MAF。Among them, taking the second reference point O as the origin, according to the multiple characteristic positions of the marking patterns OB1 to OB3 in the marking drawing file MF1 and the position correspondence between the second reference point O, the
當然,上述打標圖檔MF1中記錄三個打標圖案OB1~OB3僅只是說明用的範例。在本新型創作其他實施例中,打標圖檔中記錄的打標圖案可以是一個或是多個,沒有固定的限制。Of course, the three marking patterns OB1~OB3 recorded in the above marking image file MF1 are only examples for illustration. In other embodiments of the present invention, there may be one or more marking patterns recorded in the marking image file, and there is no fixed limit.
請重新參照圖1,控制器150並基於映射資訊MAF,使光學元件130的參考位置REFP與工件160的一加工表面的距離維持為預設距離。在此同步參照圖1以及圖3A至圖3C,其中圖3A至圖3C繪示本新型創作實施例中,打標程序中,工件表面與光學元件的參考位置的位置關係的示意圖。基於打標程序中,工件160可依據旋轉軸CT來進行旋轉,且在工件160為異形工件的條件下,工件160接收雷射光束LB的表面會產生位置上的變化。在本實施例中,控制器150可驅使光學元件130進行位置上的調整,並使光學元件130上的參考位置REFP與工件160接收雷射光束LB的表面間的距離不變。1 again, the
在本實施例中,參考位置REFP可以為光學元件130發射射光束LB的出光口的位置。In this embodiment, the reference position REFP may be the position of the light exit port where the
細節上來說明,在圖3A中,旋轉軸CT設置在參考線REP2上,而光學元件130的參考位置REFP則設置在參考線REP1上,此時參考位置REFP與工件160的加工表面間的距離,可依據光學元件130提供雷射光束LB的焦距來產生。In detail, in FIG. 3A, the rotation axis CT is set on the reference line REP2, and the reference position REFP of the
在圖3B中,當工件160發生旋轉,並使工件160的加工表面與參考線REP1間的垂直距離變短。此時,為維持雷射光束LB發送在工件160的加工表面的能量固定,本實施例的控制器150可驅使光學元件130後退(遠離參考線RFP2),並維持參考位置REFP與工件160的加工表面間的距離不變。In FIG. 3B, when the
在圖3C中,當工件160繼續旋轉,並使工件160的加工表面與參考線REP1間的垂直距離變長。此時,同樣為維持雷射光束LB發送在工件160的加工表面的能量固定,本實施例的控制器150可驅使光學元件130前進(接近參考線RFP2),並維持參考位置REFP與工件160的加工表面間的距離不變。In FIG. 3C, when the
在本實施例中,透過動態調整光學元件130,可使雷射光束LB傳送至工件160的加工表面上的能量實質上不被改變,有效維持雷射打標品質的均勻度。In this embodiment, by dynamically adjusting the
請重新參照圖1,並且,控制器150在打標程序中,並可根據打標圖檔MF1來計算出一規劃路徑。控制器150並根據規畫路徑以及光學元件130的第一速度來計算出工件160的第二速度。在此請同步參照圖1以及圖4,其中圖4繪示本新型創作實施例的光學元件的掃描動作的示意圖。其中,光學元件130可在工件160的加工表面上進行掃描其中,光學元件130在沿第一軸向DIR1依據第一速度Vg進行移動,且工件沿第二軸向DIR2依據第二速度Va進行移動來執行掃描動作。在被掃描的工作表面上的打標圖案410具有長度L以及高度H的條件下,第二速度Va = L / t
galvo,其中t
galvo為加工表面410的掃描時間。並且,t
galvo= H*NSL / Vg + 掃描延遲時間。其中,NSL為垂直向掃描線的數量,掃描延遲時間則可以由設計者自行設定。本新型創作設定掃描延遲時間的主要目的為減少第一速度Vg與第二速度Va兩者之間的伺服落後,以提升打標的準確性。
Please refer to FIG. 1 again, and the
依據上述的說明,當控制器150設定出光學元件130沿第一軸向DIR1的移動速度(第一速度Vg)後,可應用上述的數學式計算出工件沿第二軸向DIR2的移動速度(第二速度Va),也就是工件160的移動速度。According to the above description, after the
附帶一提的,本實施例中的第一速度Vg以及第二速度Va揭可以是多個向量的總和。並且,控制器150可控制第一速度Vg在打標程序中維持等於一預設速度值。Incidentally, the first speed Vg and the second speed Va in this embodiment may be the sum of multiple vectors. In addition, the
值得一提的,在圖4的繪示中,每一垂直掃描線可包括虛線部分DLA以及實線部分SLA。在執行打標程序時,對應虛線部分DLA,控制器150可使雷射源120關閉雷射光束LBA的發送,對應實線部分SLA,控制器150則可使雷射源120開啟雷射光束LBA的發送。也就是說,控制器150可根據該映射資訊、該第一速度Vg以及第二速度Va來計算雷射源120的一啟閉時間資訊,並據以控制雷射源120的啟閉動作。It is worth mentioning that in the illustration of FIG. 4, each vertical scan line may include a dotted line part DLA and a solid line part SLA. When executing the marking procedure, corresponding to the dotted line part DLA, the
依據上述的說明可以得知,光學元件130即可根據控制器150所提供的啟閉時間資訊以發送雷射光束LB以對工件160執行打標程序。According to the above description, the
值得一提的,為了維持打標程序的實施品質,本新型創作實施例的控制器150並檢測第一速度Vg與第二速度Va間對應關係的一關係變化量。由上述的說明不難得知,本新型創作實施例中的第一速度Vg與第二速度Va需維持固定的關係。因此,控制器150可隨時的檢測第一速度Vg與第二速度Va間對應關係的變化情況。當控制器150檢測出第一速度Vg與第二速度Va間的關係變化量大於預設的一第一門檻值時,控制器150可根據關係變化量映射資訊以及加工圖檔MF1以調整第一速度Vg(例如調整為第三速度),並對應調整第二速度Va(例如調整為第四速度)以及調整雷射源120的啟閉時間資訊。在本新型創作其他實施例中,上述的第一速度Vg以及第二速度Va可以不需要同步進行調整,控制器150可依據關係變化量映射資訊以及加工圖檔MF1以調整第一速度Vg以及第二速度Va的其中之一,或針對第一速度Vg以及第二速度Va均進行調整,沒有一定的限制。It is worth mentioning that, in order to maintain the implementation quality of the marking procedure, the
在另一方面,當第一速度Vg與第二速度Va間的關係變化量大於預設的一第二門檻值時(其中第二門檻值大於第一門檻值),表示第一速度Vg與第二速度Va間的關係變化量已超過可控制的範圍,控制器150可對應產生一警示信號,並停止打標程序。警示信號可以透過燈光、聲音、震動或任意本領域具通常知識者所熟知的方式來產生,沒有一定的限制。On the other hand, when the change in the relationship between the first speed Vg and the second speed Va is greater than a preset second threshold value (where the second threshold value is greater than the first threshold value), it means that the first speed Vg and the first speed The amount of change in the relationship between the two speeds Va has exceeded the controllable range, and the
在本實施例中,第一門檻值以及第二門檻值皆可由工程人員依據實際上的需求、硬體機台的限制或其他任意因素來加以設定,沒有固定的限制。In this embodiment, both the first threshold value and the second threshold value can be set by engineers based on actual requirements, limitations of hardware devices, or other arbitrary factors, and there is no fixed limit.
關於硬體架構方面,電機110可以為依據電氣信號以驅動工件160產生移動(轉動)的任意裝置。控制器150則可以為具運算能力的任意形式的處理器電路,沒有固定的限制。Regarding the hardware architecture, the
以下請參照圖5A以及圖5B,圖5A以及圖5B繪示本新型創作實施例中,透過二維振鏡以執行打標程序的雷射打標裝置的動作示意圖。在圖5A中,在時間t1中,雷射打標裝置500透過使光學元件530透過第一方向的移動MV1,並產生沿第二方向掃描SC1的雷射光束LB,搭配工件560的旋轉,可執行工件560的第一加工表面的打標程序。在圖5B中,在另一時間t2中,雷射打標裝置500透過使光學元件530透過第一方向的移動MV2,並產生沿第二方向掃描SC2的雷射光束LB,搭配工件560的旋轉,可執行工件560的第二加工表面的打標程序。Please refer to FIG. 5A and FIG. 5B below. FIG. 5A and FIG. 5B are schematic diagrams of the operation of the laser marking device that executes the marking procedure through the two-dimensional galvanometer in the creative embodiment of the present invention. In FIG. 5A, at time t1, the laser marking device 500 transmits the
由上述說明可以得知,本新型創作實施例的光學元件530中僅需配置二維的振鏡,即可有效完成對工件560執行三維的打標程序。隨著電機控制工件560依據旋轉軸運動與振鏡的搭配,除了可讓工件560的被加工表面保持於光學元件530的雷射光束的發射方向上,還可使工件的另一表面都可以有效地進行加工,達到任意形狀連續不間斷加工的效果。It can be known from the above description that the
另外,透過光學元件530在第一方向上的移動MV1、MV2,雷射光束LB在工件560的加工表面上的焦距可以維持一致,有效控制雷射光束LB傳送至加工表面的均勻度,提升所打出的標籤圖案的品質。In addition, through the movement of the
接著請參照圖6A至圖6D,圖6A至圖6D繪示本新型創作一實施例的雷射打標程序的動作流程示意圖。首先,在圖6A中,使雷射打標裝置的控制器載入工件圖檔610,其中工件圖檔610記錄工件660的輪廓資訊。在圖6B中,則使控制器載入打標圖檔620,其中打標圖檔620記錄打標圖案OB1~OB3以及由長度資訊L1~L3以及深度資訊D1~D3所構成的距離資訊。控制器可使工件圖檔610以及打標圖檔620相對應來產生一映射資訊(如圖6A)。關於映射資訊的產生細節,在圖2的實施例中已有詳細的說明,在此不多贅述。Next, please refer to FIGS. 6A to 6D. FIGS. 6A to 6D are schematic diagrams of the action flow of the laser marking program according to an embodiment of the new creation. First, in FIG. 6A, the controller of the laser marking device is loaded into the
在圖6C中,控制器可執行機構鍊運算,以依據工件的外型以決定軸向的姿態方向。例如依據工件的多個加工表面的法線向量N1以決定軸向的姿態方向,並在當工件旋轉到不同的角度時,仍可以保持與由光學元件所發送的雷射光束保持相同的入射狀態。In FIG. 6C, the controller can execute the mechanism chain calculation to determine the axial posture direction according to the appearance of the workpiece. For example, according to the normal vector N1 of multiple processing surfaces of the workpiece to determine the axial attitude direction, and when the workpiece rotates to different angles, it can still maintain the same incident state as the laser beam sent by the optical element .
接著,在圖6D中,控制器可依據打標圖檔620計算所有振鏡的加工路徑;計算不同軸向的運動速度(如第一速度Vg以及第二速度Va);以及依據物件輪廓決定姿態。控制器並控制雷射源在單個掃描線的正確位置進行雷射光束的發送或關閉,並使光學元件中的振鏡可以保持在穩速狀態下進行加工。Then, in FIG. 6D, the controller can calculate the processing paths of all galvanometers according to the marking
關於第一速度Vg以及第二速度Va的控制細節,在圖4的實施例中有詳細的說明,此處不多贅述。The control details of the first speed Vg and the second speed Va are described in detail in the embodiment of FIG. 4, and will not be repeated here.
依據上述的說明,控制器可以有效的操控光學元件、電機以及雷射源,來對工件執行穩定的打標程序。並且,控制器並可即時監控多個不同軸向的運動速度的關係變化,並有效的進行即時的修正,維持打標程序可以正常執行。更進一步的,控制器可以在多個不同軸向的運動速度的關係變化過大時,停止打標程序的進行並發送警告信號。如此一來,工件以及雷射打標裝置都可以避免因為硬體的故障而發生損壞。而工程人員也可以即時執行維修動作,維護生產線的正常運作。According to the above description, the controller can effectively control the optical components, motors, and laser sources to perform stable marking procedures on the workpiece. In addition, the controller can instantly monitor the changes in the movement speeds of multiple different axial directions, and effectively make immediate corrections to maintain the normal execution of the marking program. Furthermore, the controller can stop the marking procedure and send a warning signal when the relationship between the movement speeds of multiple different axial directions changes too much. In this way, the workpiece and the laser marking device can be prevented from being damaged due to hardware failure. The engineering staff can also perform maintenance actions in real time to maintain the normal operation of the production line.
以下請參照圖7A以及圖7B,圖7A以及圖7B分別繪示本新型創作實施例中,透過三維振鏡以執行打標程序的雷射打標裝置的動作示意圖。在圖7A中,雷射打標裝置710設置擴束變焦鏡712(光束調整器)以接收來自於雷射源的雷射光束LB。擴束變焦鏡712並傳送被擴大的雷射光束LB至光學元件711中。透過振鏡GV1、GV2的反射動作,再透過束光元件713的作用,可將雷射光束LB傳送至工件的加工表面。在本實施例中,透過沿方向DIR移動擴束變焦鏡712,可以調整雷射光束LB的焦距,並維持雷射光束LB傳送至工件的加工表面上的能量。其中方向DIR與雷射光束LB的傳送方向相同。Please refer to FIG. 7A and FIG. 7B below. FIG. 7A and FIG. 7B respectively illustrate the operation schematic diagram of the laser marking device that executes the marking procedure through the three-dimensional galvanometer in the creative embodiment of the present invention. In FIG. 7A, the
在本實施例中,擴束變焦鏡712可以設置在光學元件711中或也可以設置在光學元件711外。擴束變焦鏡712可以具有為第三速度的移動速度。透過振鏡GV1、GV2延不同方向的第一速度、第二速度,配合擴束變焦鏡712的第五速度,雷射打標裝置710可提供在三維空間移動的雷射光束LB。In this embodiment, the beam
在圖7B中,雷射打標裝置720設置聚焦鏡722(光束調整器)以接收來自於雷射源的雷射光束LB。聚焦鏡722並傳送被聚焦的雷射光束LB至光學元件721中。透過振鏡GV3、GV4的反射動作,再透過束光元件723的作用,可將雷射光束LB傳送至工件的加工表面。在本實施例中,同樣透過沿方向DIR(等同於雷射光束LB的發送方向)移動聚焦鏡722,可以調整雷射光束LB的焦距,並維持雷射光束LB傳送至工件的加工表面上的能量。In FIG. 7B, the
在本實施例中,聚焦鏡722可以設置在光學元件721中或也可以設置在光學元件721外。聚焦鏡722同樣可以具有為第六速度的移動速度。透過振鏡GV1、GV2延不同方向的第一速度、第二速度,配合聚焦鏡722的第三速度,雷射打標裝置720同樣可提供在三維空間移動的雷射光束LB。In this embodiment, the focusing
由圖7A以及圖7B繪示的三維振鏡的架構可以得知,透過控制振鏡GV1~GV4,可以控制雷射光束LB在第一方向、第二方向上的移動。透過控制擴束變焦鏡712、聚焦鏡722的移動,則可以控制雷射光束LB在第三方向上的移動,並使雷射光束LB產生三維的移動效果。如此一來,本新型創作實施例的雷射打標裝置710、720可針對非柱狀結構的任意形狀的工件執行雷射打標程序,並達到任意形狀連續不間斷加工的效果。It can be seen from the structure of the three-dimensional galvanometer shown in FIGS. 7A and 7B that by controlling the galvanometers GV1 to GV4, the movement of the laser beam LB in the first direction and the second direction can be controlled. By controlling the movement of the beam expanding
值得一提的,圖7A、圖7B中的實施例中,雷射打標裝置710、720中的控制器更可用以根據在單位時間中雷射光束LB在不同維度的三個方向的位移量總和來計算出擴束變焦鏡712(或聚焦鏡722)的第五速度(或第六速度),並根據第二速度以及第五速度(或第六速度)來計算雷射源的啟閉時間資訊。並且,在本實施例中,控制器更用以計算第二速度以及第五速度間(或第六速度)的關係變化量,在當關係變化量大於預設的第一門檻值時,根據關係變化量、映射資訊以及加工圖檔以決定是否調整第五速度為第七速度,並決定是否調整第二速度為第八速度,並藉此調整雷射源的啟閉時間資訊。另外,控制器更用以當關係變化量大於預設的第二門檻值時,產生警示信號並停止打標程序,其中第二門檻值大於第一門檻值。It is worth mentioning that in the embodiments in FIG. 7A and FIG. 7B, the controllers in the
請參照圖8,圖8繪示本新型創作一實施例的雷射打標的控制方法的流程圖。在步驟S810中,提供電機以帶動工件以依據旋轉軸進行旋轉。在步驟S820中,使雷射源發送雷射光束;在步驟S830中,使光學元件的振鏡以沿第一方向以及第二方向移動來傳送雷射光束至工件。在步驟S840中,接收打標圖檔與工件圖檔,並且,在步驟S850中則使打標圖檔與工件圖檔相對應以產生映射資訊。在步驟S860中,則基於映射資訊,使光學元件的參考位置工件的加工表面的距離等於預設距離。在步驟S870中,在打標程序中,根據打標圖檔以計算出規劃路徑,根據規畫路徑以及光學元件的第一速度來計算出工件的第二速度。在步驟S880中,根據映射資訊、第一速度以及第二速度以計算雷射源的啟閉時間資訊。以及,在步驟S890中,使光學元件根據啟閉時間資訊以執行打標程序。Please refer to FIG. 8. FIG. 8 shows a flowchart of a laser marking control method according to an embodiment of the present invention. In step S810, a motor is provided to drive the workpiece to rotate according to the rotation axis. In step S820, the laser source is made to send the laser beam; in step S830, the galvanometer of the optical element is moved in the first direction and the second direction to transmit the laser beam to the workpiece. In step S840, the marking image file and the workpiece image file are received, and in step S850, the marking image file is corresponding to the workpiece image file to generate mapping information. In step S860, based on the mapping information, the distance of the processing surface of the workpiece at the reference position of the optical element is made equal to the preset distance. In step S870, in the marking program, the planned path is calculated according to the marking drawing file, and the second speed of the workpiece is calculated according to the planned path and the first speed of the optical element. In step S880, the opening and closing time information of the laser source is calculated according to the mapping information, the first speed and the second speed. And, in step S890, the optical element is caused to execute the marking process according to the opening and closing time information.
關於上述步驟的動作細節,在前述的多個實施例中已有詳細的說明,以下不多贅述。Regarding the operation details of the foregoing steps, detailed descriptions have been made in the foregoing multiple embodiments, and will not be described in detail below.
綜上所述,本新型創作的雷射打標裝置透過控制振鏡來提供雷射光束可進行二維或三維的移動,並搭配工件的移動,可有效完成任意形狀的工件的雷射打標程序。本新型創作實施例的雷射打標裝置並可維持雷射光束發射位置與工件的加工表面的距離,有效維持雷射光束投射至工件的加工表面的能量,提升雷射打標的品質。To sum up, the laser marking device created by the new invention provides a laser beam that can be moved in two or three dimensions by controlling the galvanometer, and with the movement of the workpiece, it can effectively complete the laser marking of any shape of the workpiece. program. The laser marking device of the creative embodiment of the present invention can maintain the distance between the launch position of the laser beam and the processing surface of the workpiece, effectively maintain the energy of the laser beam projected to the processing surface of the workpiece, and improve the quality of laser marking.
100、710、720:雷射打標裝置
110:電機
120:雷射源
130、530、711、721:光學元件
140、GV1、GV2、GV3、GV4:振鏡
150:控制器
160、560、660:工件
500:雷射打標裝置
712:擴束變焦鏡
722:聚焦鏡
D1~D3:深度資訊
DIR:方向
DIR1:第一軸向
DIR2:第二軸向
DLA:虛線部分
H:高度
L:長度
L1~L3:長度資訊
LB、LBA:雷射光束
MAF:映射資訊
MF1、620:打標圖檔
MV1、MV2:移動
N1:法線向量
NSL:垂直向掃描線的數量
O:參考點
OB1~OB3、410:打標圖案
REFP:參考位置
REP1、REP2:參考線
S810~S880:控制方法的步驟
SC1、SC2:掃描
SLA:實線部分
Va:第二速度
Vg:第一速度
WSF1、610:工件圖檔100, 710, 720: laser marking device
110: Motor
120:
圖1繪示本新型創作一實施例的雷射打標裝置的示意圖。 圖2繪示本新型創作實施例的打標圖檔與工件圖檔間的映射資訊的產生方式的示意圖。 圖3A至圖3C繪示本新型創作實施例中,打標程序中,工件表面與光學元件的參考位置的位置關係的示意圖。 圖4繪示本新型創作實施例的光學元件的掃描動作的示意圖。 圖5A以及圖5B繪示本新型創作實施例中,透過二維振鏡以執行打標程序的雷射打標裝置的動作示意圖。 圖6A至圖6D繪示本新型創作一實施例的雷射打標程序的動作流程示意圖。 圖7A以及圖7B分別繪示本新型創作實施例中,透過三維振鏡以執行打標程序的雷射打標裝置的動作示意圖。 圖8繪示本新型創作一實施例的雷射打標的控制方法的流程圖。 Fig. 1 shows a schematic diagram of a laser marking device according to an embodiment of the invention. FIG. 2 is a schematic diagram of the generating method of the mapping information between the marking image file and the workpiece image file according to the creative embodiment of the present invention. 3A to 3C show schematic diagrams of the positional relationship between the surface of the workpiece and the reference position of the optical element in the marking procedure in the creative embodiment of the present invention. FIG. 4 is a schematic diagram of the scanning action of the optical element of the creative embodiment of the present invention. 5A and 5B are schematic diagrams showing the action of the laser marking device that executes the marking procedure through the two-dimensional galvanometer in the creative embodiment of the present invention. 6A to 6D are schematic diagrams showing the action flow of the laser marking program according to an embodiment of the new creation. 7A and 7B respectively show schematic diagrams of the actions of the laser marking device that executes the marking procedure through the three-dimensional galvanometer in the creative embodiment of the present invention. Fig. 8 shows a flow chart of a laser marking control method according to an embodiment of the present invention.
100:雷射打標裝置 100: Laser marking device
110:電機 110: Motor
120:雷射源 120: Laser source
130:光學元件 130: optical components
140:振鏡 140: Galvanometer
150:控制器 150: Controller
160:工件 160: Workpiece
LB、LBA:雷射光束 LB, LBA: laser beam
MF1:打標圖檔 MF1: Marking image file
WSF1:工件圖檔 WSF1: Workpiece image file
REFP:參考位置 REFP: Reference position
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110204029U TWM618075U (en) | 2021-04-14 | 2021-04-14 | Laser marking device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW110204029U TWM618075U (en) | 2021-04-14 | 2021-04-14 | Laser marking device |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM618075U true TWM618075U (en) | 2021-10-11 |
Family
ID=79603269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110204029U TWM618075U (en) | 2021-04-14 | 2021-04-14 | Laser marking device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM618075U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI785562B (en) * | 2021-04-14 | 2022-12-01 | 新代科技股份有限公司 | Laser marking device and control method thereof |
-
2021
- 2021-04-14 TW TW110204029U patent/TWM618075U/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI785562B (en) * | 2021-04-14 | 2022-12-01 | 新代科技股份有限公司 | Laser marking device and control method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3263724B2 (en) | Shape feature extraction device using two-dimensional laser pattern | |
CN101269442B (en) | Laser welding apparatus and method | |
US10175684B2 (en) | Laser processing robot system and control method of laser processing robot system | |
US8633421B2 (en) | Laser processing apparatus and method | |
US10870168B2 (en) | Laser machining robot system | |
JP6588498B2 (en) | Laser processing equipment | |
CN106271044B (en) | Laser marking machine and CCD coaxial optical path localization method | |
US9170580B2 (en) | Determining trajectories of redundant actuators jointly tracking reference trajectory | |
KR20200002795A (en) | Processing method of workpiece surface using laser | |
JP6795565B2 (en) | Laser machining system | |
JP7333821B2 (en) | Industrial robotic device with improved tooling path generation and method of operating industrial robotic device according to improved tooling path | |
CN114633021B (en) | Real-time vision acquisition laser welding method and device thereof | |
JP5608074B2 (en) | Laser processing system and control method thereof | |
TWM618075U (en) | Laser marking device | |
KR101722916B1 (en) | 5-axis device fabricating surface continuously based on laser scanner and control method for the device | |
CN215034511U (en) | Laser marking device | |
KR20180115993A (en) | Multi-axis Laser Manufacturing Machine | |
TWI785562B (en) | Laser marking device and control method thereof | |
TW201713445A (en) | Laser processing apparatus and laser processing method using the laser processing apparatus | |
CN113020786B (en) | Laser marking device and control method thereof | |
US20230241720A1 (en) | Techniques for closed-loop control of a laser-engraving process | |
WO2023279550A1 (en) | Part machining control method, controller, system and apparatus | |
JP4899099B2 (en) | Work robot position measurement device | |
JP2020131267A (en) | Laser processing apparatus | |
KR101769550B1 (en) | 3d laser beam irradiating apparatus and 3d laser beam irradiating method |