WO2023279550A1

WO2023279550A1 - Part machining control method, controller, system and apparatus

Info

Publication number: WO2023279550A1
Application number: PCT/CN2021/121523
Authority: WO
Inventors: 高健; 周志伟; 张揽宇; 罗于恒; 陈云; 陈新
Original assignee: 广东工业大学
Priority date: 2021-07-06
Filing date: 2021-09-29
Publication date: 2023-01-12
Also published as: CN113210843B; CN113210843A

Abstract

A part machining control method, a controller, a system and an apparatus. The method comprises: the controller controlling a five-axis motion platform to move a current sub-block into the machining range of a scanning galvanometer according to a machining trajectory of the current sub-block; controlling a CCD assembly to detect the relative distance between a focusing mirror in a dynamic focusing assembly and the current sub-block, and controlling the dynamic focusing assembly to carry out automatic focusing on the basis of the relative distance; controlling the scanning galvanometer to machine the current sub-block from a machining start point of the current sub-block according to the machining trajectory of the current sub-block; and after the current sub-block is machined, when it is judged that the next sub-block meets a preset machining condition, repeating the above steps to machine the next sub-block, and when the condition is not met, adjusting the condition to machine the next sub-block until a whole part to be machined is machined. The method alleviates the technical problems in the prior art of, by means of controlling a laser head, the laser head and a part to be machined being kept in a constant pose by means of a rotation and translation mode, resulting in the machining efficiency and precision being low, the laser head being heavy, and the stability and dynamic performance of a machining device being affected.

Description

Part processing control method, controller, system and device

technical field

The present application relates to the technical field of parts processing, and in particular to a method, controller, system and equipment for controlling part processing.

Background technique

In recent years, ultra-fast laser precision processing technology has developed rapidly. Due to the characteristics of non-hot-melt processing technology, it eliminates the negative impact of thermal effects in traditional processing. processing has unique advantages. Hard and brittle materials have properties such as corrosion resistance, high temperature resistance, high hardness, and high brittleness, and are irreplaceable in the fields of photovoltaic power generation, aerospace, consumer electronics, and semiconductors. In order to improve performance, lasers must be used to process complex microstructures, such as engine blades, high-precision air film holes, and microstructure arrays on the surface of ceramic substrates, and the microstructures in hard and brittle materials directly determine the performance of components.

With the rapid development of precision manufacturing technology, the processing requirements of complex three-dimensional curved surface parts such as microstructures are becoming more and more extensive. At present, for the precision machining of complex three-dimensional curved surface parts, the laser head is usually controlled to rotate and translate to keep the laser head and the part to be processed in a constant position, and the laser is controlled to focus on the part to be processed. This processing method has disadvantages such as low processing efficiency and low precision, and the laser head is heavy, which affects the stability and dynamics of the processing device when it moves at multiple angles.

Contents of the invention

This application provides a part processing control method, controller, system and equipment, which are used to improve the existing technology. By controlling the laser head to rotate and translate to keep the laser head and the part to be processed in a constant position, the processing efficiency is low. , Low precision, and the laser head is heavy, which affects the technical problems of the stability and dynamics of the processing device.

In view of this, the first aspect of the present application provides a part processing control method applied to a controller, including:

Determine the processing trajectory of the current sub-block according to the acquired processing trajectory of each sub-block of the part to be processed, and control the five-axis motion platform to move the current sub-block to the processing range of the scanning galvanometer;

Controlling the CCD component to detect the relative distance between the focusing lens in the dynamic focusing component and the current sub-block, and controlling the dynamic focusing component to perform automatic focusing based on the relative distance;

controlling the scanning galvanometer to process the current sub-block from the processing starting point of the current sub-block according to the processing track of the current sub-block;

After the processing of the current sub-block is completed, and it is judged that the next sub-block of the part to be processed meets the preset processing conditions, the next sub-block of the part to be processed is used as the current sub-block, and returns to the Describe the step of determining the processing trajectory of the current sub-block according to the acquired processing trajectory of each sub-block of the part to be processed, and controlling the five-axis motion platform to move the current sub-block to the processing range of the scanning galvanometer until the entire to-be-processed The processed parts are processed.

Optionally, the acquisition process of the machining track is:

performing graphical block processing on the three-dimensional curved surface model of the part to be processed input by the user through the host computer to obtain several sub-blocks;

The host computer determines the machining track of the sub-block according to the machining starting point of the part to be machined and the contour information of the sub-block.

Optionally, the host computer performs graphic block processing on the three-dimensional surface model of the part to be processed input by the user to obtain several sub-blocks, including:

After the user inputs the three-dimensional surface model of the part to be processed, the three-dimensional surface model of the part to be processed is calculated by the host computer according to the maximum moving distance of the scanning galvanometer in the horizontal direction and the normal vector direction of each position of the three-dimensional surface model. The surface model is divided into graphic blocks to obtain several sub-blocks;

Wherein, the size of each sub-block in the X-axis direction and the Y-axis direction is less than or equal to the maximum moving distance of the scanning galvanometer in the horizontal direction, and the normal vector direction of any position on each of the sub-blocks is the same.

Optionally, the controlling CCD component detects the relative distance between the focusing mirror in the dynamic focusing component and the current sub-block, and controls the dynamic focusing component to perform automatic focusing based on the relative distance, including:

Controlling the CCD assembly to detect the relative distance between the focus lens in the dynamic focus assembly and the current sub-block;

When the relative distance does not exceed the movement range of the voice coil motor in the dynamic focus assembly, control the voice coil motor to move, so as to realize the automatic focus function of the dynamic focus assembly;

When the relative distance exceeds the movement range of the voice coil motor in the dynamic focus assembly, control the Z-axis of the five-axis motion platform to move so that the relative distance between the focus mirror and the current sub-block become smaller, and return to the step of controlling the CCD component to detect the relative distance between the focus lens in the dynamic focus component and the current sub-block.

Optionally, the process of judging whether the next sub-block of the part to be processed meets the preset processing conditions is as follows:

According to the processing trajectory of the next sub-block of the part to be processed, it is judged whether the scanning galvanometer will exceed the maximum moving distance of the scanning galvanometer when processing the next sub-block and whether the dynamic focus component is would exceed the maximum travel distance of said dynamic focus assembly;

If it is determined that the scanning galvanometer and/or the dynamic focusing assembly will exceed the corresponding maximum moving distance when processing the next sub-block, then it is determined that the next sub-block of the part to be processed does not meet the predetermined set processing conditions;

If it is determined that neither the scanning galvanometer nor the dynamic focusing assembly exceeds the corresponding maximum moving distance when processing the next sub-block, it is determined that the next sub-block of the part to be processed meets the preset Processing conditions.

Optionally, the method also includes:

When the scanning galvanometer will exceed the corresponding maximum moving distance when the next sub-block is processed, according to the maximum moving distance of the scanning galvanometer and the scanning galvanometer during processing of the current sub-block The moving distance acquires a first target moving distance, and controls the X-axis, Y-axis and the scanning galvanometer of the five-axis motion platform to move according to the first target moving distance;

And/or, when the dynamic focus component exceeds the corresponding maximum moving distance when processing the next sub-block, according to the maximum moving distance of the dynamic focus component and the current sub-block during processing The moving distance of the dynamic focusing component acquires a second target moving distance, and the dynamic focusing component and the Z-axis of the five-axis motion platform are controlled to move according to the second target moving distance.

The second aspect of the present application provides a controller, including:

The first control unit is used to determine the processing trajectory of the current sub-block according to the acquired processing trajectory of each sub-block of the part to be processed, and control the five-axis motion platform to move the current sub-block to the processing range of the scanning galvanometer;

The second control unit is used to control the CCD assembly to detect the relative distance between the focus lens in the dynamic focus assembly and the current sub-block, and control the dynamic focus assembly to perform automatic focusing based on the relative distance;

A third control unit, configured to control the scanning galvanometer to process the current sub-block from the processing starting point of the current sub-block according to the processing track of the current sub-block;

a trigger unit, configured to use the next sub-block of the part to be processed as the current A sub-block, triggering the first control unit until the entire part to be processed is processed.

The third aspect of the present application provides a part processing control system, including: a host computer, a dynamic focus assembly, a scanning galvanometer, a CCD assembly, a laser, a five-axis motion platform, and the controller described in the second aspect;

The host computer, the dynamic focus assembly, the scanning galvanometer, the CCD assembly, the laser, and the five-axis motion platform are respectively connected to the controller in communication.

Optionally, it also includes: a power module;

The power supply module is used to supply power to the upper computer, the dynamic focus assembly, the scanning galvanometer, the CCD assembly, the laser, the five-axis motion platform and the controller.

The fourth aspect of the present application provides a part processing control device, the device includes a processor and a memory;

The memory is used to store program codes and transmit the program codes to the processor;

The processor is configured to execute any one of the component processing control methods described in the first aspect according to instructions in the program code.

As can be seen from the above technical solutions, the present application has the following advantages:

The application provides a part processing control method, which is applied to the controller, including: determining the processing trajectory of the current sub-block according to the obtained processing trajectory of each sub-block of the part to be processed, and controlling the five-axis motion platform to move the current sub-block to Within the processing range of the scanning galvanometer; control the CCD component to detect the relative distance between the focusing mirror in the dynamic focus component and the current sub-block, and control the dynamic focus component to automatically focus based on the relative distance; control the scanning galvanometer according to the current sub-block The processing trajectory of the current sub-block is processed from the processing starting point of the current sub-block; after the current sub-block is processed and it is judged that the next sub-block of the part to be processed meets the preset processing conditions, the next sub-block of the part to be processed is A sub-block is used as the current sub-block, return to the step of determining the processing trajectory of the current sub-block according to the acquired processing trajectories of each sub-block of the part to be processed, and controlling the five-axis motion platform to move the current sub-block to the processing range of the scanning galvanometer , until the entire part to be processed is finished.

In this application, after the controller controls the five-axis motion platform to move the current sub-block of the part to be processed to the processing range of the scanning galvanometer according to the processing track of the current sub-block of the part to be processed, the dynamic focus component obtained by the CCD component The relative distance between the focusing mirror and the current sub-block is controlled by the dynamic focusing component for real-time auto-focusing, which helps to improve processing efficiency and processing accuracy; Processing does not need to be processed by moving the laser head, which avoids the problem of affecting the stability and dynamics of the processing device when the laser head moves at multiple angles, and improves the existing technology by controlling the laser head to rotate and translate. The laser head and the parts to be processed maintain a constant posture, which has the technical problems of low processing efficiency, low precision, and heavy laser head, which affects the stability and dynamics of the processing device.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present application. Those skilled in the art can also obtain other drawings based on these drawings without any creative effort.

Fig. 1 is a schematic flow chart of a part processing control method provided by the embodiment of the present application;

FIG. 2 is a schematic structural diagram of a controller provided in an embodiment of the present application;

Fig. 3 is a schematic structural diagram of a part processing control system provided by an embodiment of the present application.

detailed description

In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiment of the application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the application. Obviously, the described embodiment is only It is a part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

For ease of understanding, please refer to Figure 1. A part processing control method provided by the embodiment of the present application is applied to the controller, including:

Step 101 : Determine the processing trajectory of the current sub-block according to the acquired processing trajectories of each sub-block of the part to be processed, and control the five-axis motion platform to move the current sub-block within the processing range of the scanning galvanometer.

The acquisition process of the processing track in the embodiment of the present application is as follows: through the host computer, the three-dimensional surface model of the part to be processed is processed by the graphic block processing to obtain several sub-blocks; The contour information determines the machining trajectory of the sub-block.

The user inputs the three-dimensional surface model of the part to be processed into the host computer, and through the host computer, the three-dimensional surface model of the part to be processed is divided into graphic blocks to obtain several sub-blocks. Specifically, after the user inputs the three-dimensional surface model of the part to be processed, the three-dimensional surface model of the part to be processed is divided into graphic blocks according to the maximum moving distance of the scanning galvanometer in the horizontal direction and the normal vector direction of each position of the three-dimensional surface model processing to obtain several sub-blocks; wherein, the size of each sub-block in the X-axis direction and the Y-axis direction is less than or equal to the maximum moving distance of the scanning galvanometer in the horizontal direction, and the direction of the normal vector at any position on each sub-block is the same. The normal vector directions of different sub-blocks can be the same or different; when the size of the part to be processed in the X-axis direction and the Y-axis direction is less than or equal to the maximum moving distance of the scanning galvanometer in the horizontal direction, and any position of the part to be processed When the direction of the normal vector is the same, the number of sub-blocks obtained at this time is 1.

The shape and pattern of the part to be processed are known, that is, the processing trajectory of the part to be processed can be directly obtained according to the shape and pattern to be processed, and the processing trajectory includes the processing starting point and the processing end point, that is, according to the processing The trajectory can obtain the processing starting point of the entire part to be processed, and the controller can determine the position of the processing starting point (that is, the position of the processing starting point of the first sub-block) by controlling the CCD component and using the positioning algorithm. The contour information of the sub-block and the processing starting point can determine the processing track of the sub-block (that is, the processing track of the first sub-block), wherein the processing end point of the sub-block is the processing starting point of the next sub-block, and the host computer according The processing starting point and contour information of the next sub-block can determine the processing track of the next sub-block.

After obtaining the processing trajectory of each sub-block of the part to be processed, according to the processing trajectory of the current sub-block, the controller controls the X-axis, Y-axis, Z-axis, A-axis and C-axis of the five-axis motion platform to move the current sub-block To the processing range of the scanning galvanometer, wherein the scanning galvanometer is installed in the laser head, the embodiment of the present application keeps the laser head still, controls the movement of the five-axis motion platform, so that the current position of the part to be processed on the five-axis motion platform The sub-block moves to the processing range of the scanning galvanometer to avoid moving the heavy laser head, which may affect the stability of the processing device.

Step 102: Control the CCD component to detect the relative distance between the focus lens in the dynamic focus component and the current sub-block, and control the dynamic focus component to perform automatic focusing based on the relative distance.

The dynamic focusing assembly in the embodiment of this application is composed of a dynamic focusing mirror, a beam expander and a reflector, etc. The dynamic focusing mirror can be driven by an American SMAC voice coil motor to achieve precise fine-tuning of the focus in a small range, so that the laser spot Focus on the parts to be processed in real time, and the SMAC voice coil motor has a high resolution of 0.1um, which makes the focus precise; the beam expander has the effect of expanding and collimating the laser beam; the mirror is used to change the direction of the laser beam .

After the current sub-block moves to the processing range of the scanning galvanometer, the controller controls the laser to emit the laser beam, and controls the CCD component to detect the relative distance between the focusing mirror in the dynamic focusing component and the current sub-block; when the relative distance does not exceed the dynamic When the movement range of the voice coil motor in the focusing component, control the movement of the voice coil motor to realize the automatic focusing function of the dynamic focusing component; when the relative distance exceeds the moving range of the voice coil motor in the dynamic focusing component, control the five-axis The Z-axis of the motion platform moves to make the relative distance between the focusing lens and the current sub-block smaller, and returns to the step of controlling the CCD component to detect the relative distance between the focusing lens in the dynamic focusing component and the current sub-block.

Specifically, the CCD component automatically recognizes the relative distance between the focusing mirror and the current sub-block based on the high-speed visual image information of the laser spot size. If the CCD component recognizes that the relative distance does not exceed the movement range of the voice coil motor in the dynamic focus component, that is, the relative distance is less than or equal to the maximum moving distance of the voice coil motor in the dynamic focus component, the controller controls the voice coil motor in the dynamic focus component The coil motor performs precise micro-motion to realize the automatic focus function; if the CCD component recognizes that the relative distance exceeds the range of motion of the voice coil motor in the dynamic focus component, that is, the relative distance is greater than the maximum moving distance of the voice coil motor in the dynamic focus component, then The controller first controls the Z-axis of the five-axis motion platform to move in a large range, so that the relative distance between the focusing mirror and the current sub-block becomes smaller. When the relative distance is equal to the maximum moving distance of the voice coil motor of the dynamic focusing component, then control The voice coil motor of the dynamic focus component performs precise micro-motion.

In the prior art, when focusing on the scanning galvanometer, it is easily affected by the range of motion of the device. The focusing range is limited, and the focusing effect is poor, which affects the processing efficiency and processing accuracy. The embodiment of the present application combines the five-axis motion The large-range movement of the Z-axis of the platform and the small-scale precision fine-tuning of the voice coil motor of the dynamic focus component realize real-time automatic focus, which is not affected by the focus range of the dynamic focus component, and the focusing effect is good, which helps to improve processing efficiency and machining accuracy.

Step 103, controlling the scanning galvanometer to process the current sub-block from the processing starting point of the current sub-block according to the processing track of the current sub-block.

After controlling the dynamic focusing component to adjust the focus, the controller controls the scanning galvanometer to process the current sub-block from the processing starting point along the X and Y directions of the plane according to the processing track of the current sub-block. When the current sub-block is the first sub-block, the controller controls the CCD component to locate the processing starting point of the first sub-block, and then controls the scanning vibrating mirror to start from the processing starting point along the processing track of the first sub-block. The first sub-block is processed in the X and Y directions of the plane. When the current sub-block is not the first sub-block, there is no need to locate the starting point of processing through the CCD assembly.

In the embodiment of the present application, the controller controls the X-axis, Y-axis, Z-axis, A-axis and C-axis of the five-axis motion platform to move the current sub-block to the processing range of the scanning galvanometer, which can realize variable normal vector processing; and, because The direction of the normal vector at any position of each sub-block after division is the same. Therefore, the scanning galvanometer processes each sub-block with a fixed normal vector, that is, the scanning galvanometer does not process each sub-block. If the normal vector needs to be changed, only when the next sub-block is processed, it is necessary to consider whether to change the normal vector, which improves the processing efficiency.

Step 104: After the current sub-block is processed, and it is judged that the next sub-block of the part to be processed meets the preset processing conditions, the next sub-block of the part to be processed is used as the current sub-block, and returns to step 101 until the entire part to be processed The processed parts are processed.

After the current sub-block is processed, to prepare for the next sub-block of the part to be processed, it is necessary to judge in advance whether the next sub-block satisfies the preset processing conditions according to the processing track of the next sub-block. specific,

According to the processing trajectory of the next sub-block of the part to be processed, it is judged whether the scanning galvanometer will exceed the maximum moving distance of the scanning galvanometer and whether the dynamic focusing component will exceed the maximum moving distance of the dynamic focusing component when processing the next sub-block; If it is judged that the scanning galvanometer and/or the dynamic focus assembly will exceed the corresponding maximum moving distance when processing the next sub-block, it is determined that the next sub-block of the part to be processed does not meet the preset processing conditions; When the scanning galvanometer and the dynamic focusing assembly will not exceed the corresponding maximum moving distance when the next sub-block is processed, it is determined that the next sub-block of the part to be processed meets the preset processing conditions.

Further, when the scanning galvanometer will exceed the corresponding maximum moving distance when processing the next sub-block, the first target moving distance is obtained according to the maximum moving distance of the scanning galvanometer and the moving distance of the scanning galvanometer during processing of the current sub-block , and control the X-axis, Y-axis and scanning mirror of the five-axis motion platform to move according to the first target moving distance; and/or, when the next sub-block is processed, the dynamic focus component will exceed the corresponding maximum moving distance , obtain the second target moving distance according to the maximum moving distance of the dynamic focusing component and the moving distance of the dynamic focusing component during processing of the current sub-block, and control the dynamic focusing component and the Z-axis of the five-axis motion platform to move according to the second target moving distance .

Specifically, when it is judged that the scanning galvanometer will exceed the maximum moving distance of the scanning galvanometer when processing the next sub-block, and it is judged that the dynamic focusing component will exceed the maximum moving distance of the dynamic focusing component when processing the next sub-block , at this time the scanning galvanometer and the dynamic focusing assembly cannot move in the same direction, then the controller obtains the maximum stroke of the scanning galvanometer (that is, the maximum moving distance D ₁ of the scanning galvanometer moving along the X and Y directions of the plane) and its zero point The relative distance between the positions (that is, half of the maximum moving distance D ₁ /2 of the scanning galvanometer), and the moving distance D _{2 of the scanning galvanometer along the X and Y directions of the plane during processing of the current sub-block (moving distance D 2} _is Scanning the distance from the moving start point to the moving end point of the galvanometer during the processing of the current sub-block), and comparing the relative distance D ₁ /2 with the moving distance D ₂ . When the relative distance D ₁ /2 is less than or equal to the moving distance D ₂ , the controller takes the relative distance D ₁ /2 as the first target moving distance; when the relative distance D ₁ /2 is greater than the moving distance D ₂ , the controller _The controller takes the moving distance D2 as the first target moving distance, and according to the first target moving distance, controls the X-axis, Y-axis and scanning galvanometer of the five-axis motion platform to move in the X and Y directions of the plane. At the same time, the controller acquires the relative distance between the maximum stroke of the dynamic focus assembly (i.e. the maximum moving distance _D3 of the voice coil motor in the dynamic focus assembly) and its zero position (i.e. the maximum movement distance of the voice coil motor in the dynamic focus assembly half of the distance D ₃ /2), and the moving distance D ₄ of the dynamic focus component during processing of the current sub-block (moving distance D ₄ is the distance from the moving start point to the moving end point of the dynamic focus component during processing of the current sub-block), and compare _The size of the relative distance and the moving distance D4. When the relative distance D ₃ /2 is less than or equal to the moving distance D ₄ , the controller takes the relative distance D ₃ /2 as the second target moving distance; when the relative distance D ₃ /2 is greater than the moving distance D ₄ , the controller _The controller takes the moving distance D4 as the second target moving distance, and according to the second target moving distance, controls the dynamic focus assembly and the Z-axis of the five-axis motion platform to move so that the next sub-block meets the preset processing conditions.

When it is judged that the scanning galvanometer will exceed the maximum moving distance of the scanning galvanometer when processing the next sub-block, and when it is judged that the dynamic focusing component will not exceed the maximum moving distance of the dynamic focusing component when processing the next sub-block, Then the controller controls the X-axis and Y-axis of the five-axis motion platform and the scanning galvanometer to move in the X and Y directions of the plane according to the moving distance of the first target, and the focusing component and the Z-axis of the five-axis motion platform do not move, so that the next The sub-blocks meet the preset processing conditions.

When it is judged that the scanning galvanometer will not exceed the maximum moving distance of the scanning galvanometer when processing the next sub-block, and when it is judged that the dynamic focusing component will exceed the maximum moving distance of the dynamic focusing component when processing the next sub-block, Then the controller controls the dynamic focus component and the Z-axis of the five-axis motion platform to move according to the moving distance of the second target, and the X-axis, Y-axis and scanning galvanometer of the five-axis motion platform do not move, so that the next sub-block meets the preset Processing conditions.

When the next sub-block of the part to be processed satisfies the preset processing conditions, the next sub-block of the part to be processed is used as the current sub-block, and the process returns to step 101 until the entire part to be processed is finished. In the embodiment of the present application, the processing range of the part to be processed is not limited by the motion range of the scanning galvanometer and the dynamic focus assembly, which improves the operable space for part processing, and has high flexibility and practicability.

In the embodiment of this application, after the controller controls the five-axis motion platform to move the current sub-block of the part to be processed to the processing range of the scanning galvanometer according to the processing trajectory of the current sub-block of the part to be processed, the dynamic The relative distance between the focusing lens in the focusing component and the current sub-block, and the control of the dynamic focusing component for real-time automatic focusing helps to improve processing efficiency and processing accuracy; Blocks are processed without moving the laser head, which avoids the problem of affecting the stability and dynamics of the processing device when the laser head moves at multiple angles, and improves the existing technology by controlling the laser head to rotate and translate. This method keeps the laser head and the parts to be processed in a constant position, which has the technical problems of low processing efficiency, low precision, and heavy laser head, which affects the stability and dynamics of the processing device.

The above is an embodiment of a part processing control method provided by this application, and the following is an embodiment of a controller provided by this application.

Please refer to Figure 2, a controller provided in the embodiment of the present application, including:

The first control unit 201 is used to determine the processing trajectory of the current sub-block according to the obtained processing trajectory of each sub-block of the part to be processed, and control the five-axis motion platform to move the current sub-block to the processing range of the scanning galvanometer;

The second control unit 202 is used to control the CCD assembly to detect the relative distance between the focus lens in the dynamic focus assembly and the current sub-block, and control the dynamic focus assembly to perform automatic focusing based on the relative distance;

The third control unit 203 is used to control the scanning galvanometer to process the current sub-block from the processing starting point of the current sub-block according to the processing track of the current sub-block;

The triggering unit 204 is configured to use the next sub-block of the part to be processed as the current sub-block to trigger the first control after the current sub-block is processed and it is determined that the next sub-block of the part to be processed meets the preset processing conditions. unit until the entire part to be machined is finished.

As a further improvement, the acquisition process of the machining trajectory is:

Through the upper computer, the three-dimensional surface model of the part to be processed input by the user is divided into graphic blocks to obtain several sub-blocks;

The processing trajectory of the sub-block is determined by the host computer according to the processing starting point of the part to be processed and the contour information of the sub-block.

As a further improvement, through the host computer, the three-dimensional surface model of the part to be processed input by the user is divided into graphic blocks, and several sub-blocks are obtained, including:

After the user inputs the 3D surface model of the part to be processed, the upper computer performs graphic block processing on the 3D surface model of the part to be processed according to the maximum moving distance of the scanning galvanometer in the horizontal direction and the normal vector direction of each position of the 3D surface model. a number of sub-blocks;

Wherein, the size of each sub-block in the X-axis direction and the Y-axis direction is less than or equal to the maximum moving distance of the scanning galvanometer in the horizontal direction, and the direction of the normal vector at any position on each sub-block is the same.

As a further improvement, the second control unit 202 specifically includes:

The CCD component control subunit is used to control the CCD component to detect the relative distance between the focus lens in the dynamic focus component and the current sub-block;

The voice coil motor control subunit is used to control the voice coil motor to move when the relative distance does not exceed the movement range of the voice coil motor in the dynamic focus component, so as to realize the automatic focusing function of the dynamic focus component;

The five-axis motion platform control subunit is used to control the Z-axis of the five-axis motion platform to move when the relative distance exceeds the range of motion of the voice coil motor in the dynamic focus assembly, so that the relative distance between the focus mirror and the current sub-block becomes smaller, and triggers the CCD component to control the subunit.

As a further improvement, the process of judging whether the next sub-block of the part to be processed meets the preset processing conditions is:

According to the processing trajectory of the next sub-block of the part to be processed, it is judged whether the scanning galvanometer will exceed the maximum moving distance of the scanning galvanometer and whether the dynamic focusing component will exceed the maximum moving distance of the dynamic focusing component when processing the next sub-block;

If it is determined that the scanning galvanometer and/or the dynamic focus assembly will exceed the corresponding maximum moving distance when processing the next sub-block, it is determined that the next sub-block of the part to be processed does not meet the preset processing conditions;

As a further improvement, the controller also includes: a fourth control unit, used for:

When the scanning galvanometer will exceed the corresponding maximum moving distance when the next sub-block is processed, the first target moving distance is obtained according to the maximum moving distance of the scanning galvanometer and the moving distance of the scanning galvanometer during processing of the current sub-block, and Control the X-axis, Y-axis and scanning galvanometer of the five-axis motion platform to move according to the moving distance of the first target;

And/or, when the dynamic focus component exceeds the corresponding maximum moving distance when processing the next sub-block, acquire the second target according to the maximum moving distance of the dynamic focus component and the moving distance of the dynamic focus component during processing of the current sub-block moving distance, and control the dynamic focus assembly and the Z-axis of the five-axis motion platform to move according to the second target moving distance.

The above is an embodiment of a controller provided by this application, and the following is an embodiment of a part processing control system provided by this application.

Please refer to Figure 3, a part processing control system provided by the embodiment of the present application, including: a host computer, a dynamic focus component, a scanning galvanometer, a CCD component, a laser, a five-axis motion platform and the controller in the aforementioned controller embodiment ;

The host computer, dynamic focus component, scanning galvanometer, CCD component, laser, and five-axis motion platform are respectively connected to the controller by communication.

The upper computer in the embodiment of this application is composed of industrial computer, which is used to send instructions, data processing, graphic display, fault alarm, etc. After the user inputs the three-dimensional curved surface model of the part to be processed, the upper computer is used for the three-dimensional curved surface of the part to be processed The model performs data processing such as block division, trajectory path planning, and process parameter selection.

The controller is composed of Power PMAC motion controller, which can be used for motor control, mathematical logic operations and other operations, such as controlling the switch of the laser, the movement of the five-axis motion platform, the focusing of the dynamic focus component, and the XY plane processing of the scanning galvanometer. . The laser is used to receive the laser switch command output by the controller to realize the emission of the laser beam. The dynamic focusing component is composed of a dynamic focusing mirror, a beam expander mirror and a reflecting mirror, among which the focusing mirror is driven by an American SMAC voice coil motor to achieve precise fine-tuning of the focus within a small range, so that the laser spot can be focused on the part to be processed in real time , and the SMAC voice coil motor has a high resolution of 0.1um for precise focusing; the beam expander has the effect of expanding and collimating the laser beam; the mirror is used to change the direction of the laser beam.

The scanning galvanometer is used to control the movement of the laser beam in the X and Y directions of the plane; the CCD component is used to detect the spatial position relationship between the scanning galvanometer and the part to be processed. Based on the high-speed visual image information of the laser spot, the automatically recognized scanning galvanometer and The relative position information of the parts to be processed is fed back to the controller and used to locate the starting point of the parts to be processed.

The five-axis motion platform is composed of platforms in five directions: X-axis, Y-axis, Z-axis, A-axis and C-axis. By driving the parts to be processed to move linearly along the X-axis, Y-axis and Z-axis Rotational motion in the Z direction and the Z axis direction realizes the large-scale, multi-normal vector and high-precision processing of the parts to be processed.

As a further improvement, the system also includes: a power module;

The power supply module is used to supply power to the host computer, dynamic focus components, scanning galvanometers, CCD components, lasers, five-axis motion platforms and controllers.

The embodiment of the present application also provides a part processing control device, the device includes a processor and a memory;

The memory is used to store the program code and transmit the program code to the processor;

The processor is configured to execute the part processing control method in the aforementioned method embodiments according to the instructions in the program code.

The embodiment of the present application also provides a computer-readable storage medium, the computer-readable storage medium is used to store program codes, and the program codes are used to execute the part processing control method in the foregoing method embodiments.

Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working process of the above-described system, device and unit can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.

In the several embodiments provided in this application, it should be understood that the disclosed devices and methods may be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or May be integrated into another system, or some features may be ignored, or not implemented. In another point, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms.

The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit. The above-mentioned integrated units can be implemented in the form of hardware or in the form of software functional units.

If the integrated unit is realized in the form of a software function unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application is essentially or part of the contribution to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium , including several instructions for executing all or part of the steps of the methods described in the various embodiments of the present application through a computer device (which may be a personal computer, a server, or a network device, etc.). The aforementioned storage media include: U disk, mobile hard disk, read-only memory (English full name: Read-Only Memory, English abbreviation: ROM), random access memory (English full name: Random Access Memory, English abbreviation: RAM), magnetic Various media that can store program codes such as discs or optical discs.

As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still understand the foregoing The technical solutions described in each embodiment are modified, or some of the technical features are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the application.

Claims

A part processing control method, characterized in that it is applied to a controller, the method comprising:

Determine the processing trajectory of the current sub-block according to the acquired processing trajectory of each sub-block of the part to be processed, and control the five-axis motion platform to move the current sub-block to the processing range of the scanning galvanometer;

Controlling the CCD component to detect the relative distance between the focusing lens in the dynamic focusing component and the current sub-block, and controlling the dynamic focusing component to perform automatic focusing based on the relative distance;

controlling the scanning galvanometer to process the current sub-block from the processing starting point of the current sub-block according to the processing track of the current sub-block;

After the processing of the current sub-block is completed, and it is judged that the next sub-block of the part to be processed meets the preset processing conditions, the next sub-block of the part to be processed is used as the current sub-block, and returns to the Describe the step of determining the processing trajectory of the current sub-block according to the acquired processing trajectory of each sub-block of the part to be processed, and controlling the five-axis motion platform to move the current sub-block to the processing range of the scanning galvanometer until the entire to-be-processed The processed parts are processed;

The process of judging whether the next sub-block of the part to be processed meets the preset processing conditions is:

According to the processing trajectory of the next sub-block of the part to be processed, it is judged whether the scanning galvanometer will exceed the maximum moving distance of the scanning galvanometer when processing the next sub-block and whether the dynamic focus component is would exceed the maximum travel distance of said dynamic focus assembly;

If it is determined that the scanning galvanometer and/or the dynamic focusing assembly will exceed the corresponding maximum moving distance when processing the next sub-block, then it is determined that the next sub-block of the part to be processed does not meet the predetermined set processing conditions;

If it is determined that neither the scanning galvanometer nor the dynamic focusing assembly exceeds the corresponding maximum moving distance when processing the next sub-block, it is determined that the next sub-block of the part to be processed meets the preset Processing conditions;

The method also includes:

When the scanning galvanometer will exceed the corresponding maximum moving distance when the next sub-block is processed, according to the maximum moving distance of the scanning galvanometer and the scanning galvanometer during processing of the current sub-block The moving distance acquires a first target moving distance, and controls the X-axis, Y-axis and the scanning galvanometer of the five-axis motion platform to move according to the first target moving distance;

And/or, when the dynamic focus component exceeds the corresponding maximum moving distance when processing the next sub-block, according to the maximum moving distance of the dynamic focus component and the current sub-block during processing The moving distance of the dynamic focusing component acquires a second target moving distance, and the dynamic focusing component and the Z-axis of the five-axis motion platform are controlled to move according to the second target moving distance.
The part processing control method according to claim 1, wherein the acquisition process of the processing trajectory is:

performing graphical block processing on the three-dimensional curved surface model of the part to be processed input by the user through the host computer to obtain several sub-blocks;

The host computer determines the machining track of the sub-block according to the machining starting point of the part to be machined and the contour information of the sub-block.
According to the part processing control method according to claim 2, it is characterized in that, the three-dimensional curved surface model of the part to be processed input by the user is processed by the host computer to obtain several sub-blocks, including:

After the user inputs the three-dimensional surface model of the part to be processed, the three-dimensional surface model of the part to be processed is calculated by the host computer according to the maximum moving distance of the scanning galvanometer in the horizontal direction and the normal vector direction of each position of the three-dimensional surface model. The surface model is divided into graphic blocks to obtain several sub-blocks;

Wherein, the size of each sub-block in the X-axis direction and the Y-axis direction is less than or equal to the maximum moving distance of the scanning galvanometer in the horizontal direction, and the normal vector direction of any position on each of the sub-blocks is the same.
The part processing control method according to claim 1, wherein the control CCD component detects the relative distance between the focus lens in the dynamic focus component and the current sub-block, and controls the The dynamic focus component performs automatic focusing, including:

Controlling the CCD assembly to detect the relative distance between the focus lens in the dynamic focus assembly and the current sub-block;

When the relative distance does not exceed the movement range of the voice coil motor in the dynamic focus assembly, control the voice coil motor to move, so as to realize the automatic focus function of the dynamic focus assembly;

When the relative distance exceeds the movement range of the voice coil motor in the dynamic focus assembly, control the Z-axis of the five-axis motion platform to move so that the relative distance between the focus mirror and the current sub-block become smaller, and return to the step of controlling the CCD component to detect the relative distance between the focus lens in the dynamic focus component and the current sub-block.
A controller, characterized in that it comprises:

The first control unit is used to determine the processing trajectory of the current sub-block according to the acquired processing trajectory of each sub-block of the part to be processed, and control the five-axis motion platform to move the current sub-block to the processing range of the scanning galvanometer;

The second control unit is used to control the CCD component to detect the relative distance between the focus mirror in the dynamic focus component and the current sub-block, and control the dynamic focus component to perform automatic focusing based on the relative distance;

A third control unit, configured to control the scanning galvanometer to process the current sub-block from the processing starting point of the current sub-block according to the processing track of the current sub-block;

a trigger unit, configured to use the next sub-block of the part to be processed as the current A sub-block, triggering the first control unit until the entire part to be processed is processed;

The process of judging whether the next sub-block of the part to be processed meets the preset processing conditions is:

According to the processing trajectory of the next sub-block of the part to be processed, it is judged whether the scanning galvanometer will exceed the maximum moving distance of the scanning galvanometer when processing the next sub-block and whether the dynamic focus component is would exceed the maximum travel distance of said dynamic focus assembly;

If it is determined that the scanning galvanometer and/or the dynamic focusing assembly will exceed the corresponding maximum moving distance when processing the next sub-block, then it is determined that the next sub-block of the part to be processed does not meet the predetermined set processing conditions;

If it is determined that neither the scanning galvanometer nor the dynamic focusing assembly exceeds the corresponding maximum moving distance when processing the next sub-block, it is determined that the next sub-block of the part to be processed meets the preset Processing conditions;

The controller also includes: a fourth control unit, used for:

When the scanning galvanometer will exceed the corresponding maximum moving distance when the next sub-block is processed, according to the maximum moving distance of the scanning galvanometer and the scanning galvanometer during processing of the current sub-block The moving distance acquires a first target moving distance, and controls the X-axis, Y-axis and the scanning galvanometer of the five-axis motion platform to move according to the first target moving distance;

And/or, when the dynamic focus component exceeds the corresponding maximum moving distance when processing the next sub-block, according to the maximum moving distance of the dynamic focus component and the current sub-block during processing The moving distance of the dynamic focusing component acquires a second target moving distance, and the dynamic focusing component and the Z-axis of the five-axis motion platform are controlled to move according to the second target moving distance.
A part processing control system, characterized in that it includes: a host computer, a dynamic focus assembly, a scanning galvanometer, a CCD assembly, a laser, a five-axis motion platform, and the controller according to claim 5;

The host computer, the dynamic focus assembly, the scanning galvanometer, the CCD assembly, the laser, and the five-axis motion platform are respectively connected to the controller in communication.
The part processing control system according to claim 6, further comprising: a power module;

The power supply module is used to supply power to the upper computer, the dynamic focus assembly, the scanning galvanometer, the CCD assembly, the laser, the five-axis motion platform and the controller.
A part processing control device, characterized in that the device includes a processor and a memory;

The memory is used to store program codes and transmit the program codes to the processor; the processor is used to execute the part processing control according to any one of claims 1-4 according to the instructions in the program codes method.