CN113210843A - Part machining control method, controller, system and equipment - Google Patents
Part machining control method, controller, system and equipment Download PDFInfo
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- CN113210843A CN113210843A CN202110769780.6A CN202110769780A CN113210843A CN 113210843 A CN113210843 A CN 113210843A CN 202110769780 A CN202110769780 A CN 202110769780A CN 113210843 A CN113210843 A CN 113210843A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
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Abstract
The application discloses a part processing control method, a controller, a system and equipment, wherein the controller controls a five-axis motion platform to move a current sub-block into a processing range of a scanning galvanometer according to a processing track of the current sub-block; controlling the CCD assembly to detect the relative distance between a focusing lens in the dynamic focusing assembly and the current sub-block, and controlling the dynamic focusing assembly to automatically focus based on the relative distance; controlling a scanning galvanometer to process the current sub-block from the processing starting point of the current sub-block according to the processing track of the current sub-block; and after the current sub-block is processed and when the next sub-block is judged to meet the preset processing conditions, repeating the steps to process the next sub-block until the whole part to be processed is processed. The technical problems that in the prior art, the laser head and a part to be machined are kept in a constant pose by controlling the laser head in a rotating and translating mode, the machining efficiency is low, the precision is low, the laser head is heavy, and the stability and the dynamic performance of a machining device are affected are solved.
Description
Technical Field
The present application relates to the field of component processing technologies, and in particular, to a method, a controller, a system, and a device for controlling component processing.
Background
In recent years, the ultra-fast laser precision machining technology is developed at a high speed, and the characteristics of the non-hot-melting machining technology are provided, so that the negative influence caused by the thermal effect in the traditional machining is eliminated, and the ultra-fast laser precision machining technology has unique advantages in machining of hard and brittle materials such as glass, ceramics, hard alloy, crystalline silicon and the like. The hard and brittle material has the performances of corrosion resistance, high temperature resistance, high hardness, large brittleness and the like, and can not be replaced in the fields of photovoltaic power generation, aerospace, consumer electronics, semiconductors and the like. In order to improve the performance, complex microstructures such as engine blades, high-precision air film holes and microstructure arrays on the surface of a ceramic substrate must be processed by laser, and the microstructures in the hard and brittle materials directly determine the performance of components.
With the rapid development of precision manufacturing technology, the processing requirements of complex three-dimensional curved surface parts such as microstructures and the like are more and more extensive. At present, aiming at the precision machining of a complex three-dimensional curved surface part, a laser head and a part to be machined are kept in a constant pose by controlling the laser head in a rotating and translating mode, and the laser is controlled to be focused on the part to be machined. The processing mode has the defects of low processing efficiency, low precision and the like, and the laser head is heavy and influences the stability and the dynamic property of the processing device when the laser head moves in multiple angles.
Disclosure of Invention
The application provides a part machining control method, a controller, a system and equipment, which are used for improving the technical problems that in the prior art, a laser head and a part to be machined are kept in a constant pose in a rotating and translating mode by controlling the laser head, the machining efficiency is low, the precision is low, the laser head is heavy, and the stability and the dynamic performance of a machining device are influenced.
In view of the above, a first aspect of the present application provides a part machining control method applied to a controller, including:
determining the processing track of the current sub-block according to the acquired processing track of each sub-block of the part to be processed, and controlling a five-axis motion platform to move the current sub-block into the processing range of a scanning galvanometer;
controlling a CCD assembly to detect the relative distance between a focusing lens in a dynamic focusing assembly and the current sub-block, and controlling the dynamic focusing assembly to automatically focus based on the relative distance;
controlling the scanning galvanometer to process the current sub-block from the processing starting point of the current sub-block according to the processing track of the current sub-block;
and after the current sub-block is machined, when the next sub-block of the part to be machined is judged to meet preset machining conditions, taking the next sub-block of the part to be machined as the current sub-block, returning to the step of determining the machining track of the current sub-block according to the obtained machining track of each sub-block of the part to be machined, and controlling a five-axis motion platform to move the current sub-block into the machining range of the scanning galvanometer until the whole part to be machined is machined.
Optionally, the process of obtaining the processing track is as follows:
carrying out graphic blocking processing on the three-dimensional curved surface model of the part to be processed, which is input by a user, through an upper computer to obtain a plurality of sub-blocks;
and determining the processing track of the sub-block according to the processing starting point of the part to be processed and the contour information of the sub-block by the upper computer.
Optionally, the processing of the graph partitioning is carried out on the three-dimensional curved surface model of the part to be processed, which is input by the user, through the upper computer, so as to obtain a plurality of sub-blocks, including:
after a user inputs a three-dimensional curved surface model of a part to be processed, carrying out graphic blocking processing on the three-dimensional curved surface model of the part to be processed through the upper computer according to the maximum moving distance of the scanning galvanometer in the horizontal direction and the normal vector direction of each position of the three-dimensional curved surface model to obtain a plurality of sub-blocks;
the size of each sub-block in the X-axis direction and the Y-axis direction is smaller than or equal to the maximum moving distance of the scanning galvanometer in the horizontal direction, and the normal vector directions of any position on each sub-block are the same.
Optionally, the controlling the CCD assembly to detect a relative distance between a focusing mirror in the dynamic focusing assembly and the current sub-block, and controlling the dynamic focusing assembly to perform auto focusing based on the relative distance includes:
controlling a CCD assembly to detect the relative distance between a focusing mirror in the dynamic focusing assembly and the current sub-block;
when the relative distance does not exceed the motion range of a voice coil motor in the dynamic focusing assembly, controlling the voice coil motor to move so as to realize the automatic focusing function of the dynamic focusing assembly;
and when the relative distance exceeds the motion range of a voice coil motor in the dynamic focusing assembly, controlling the Z axis of the five-axis motion platform to move so as to reduce the relative distance between the focusing mirror and the current sub-block, and returning to the step of controlling the CCD assembly to detect the relative distance between the focusing mirror in the dynamic focusing assembly and the current sub-block.
Optionally, the process of determining whether the next sub-block of the part to be processed meets the preset processing condition is as follows:
judging whether the scanning galvanometer exceeds the maximum moving distance of the scanning galvanometer and whether the dynamic focusing assembly exceeds the maximum moving distance of the dynamic focusing assembly when the next sub-block is processed according to the processing track of the next sub-block of the part to be processed;
if the scanning galvanometer and/or the dynamic focusing assembly exceeds the corresponding maximum moving distance when the next sub-block is processed, judging that the next sub-block of the part to be processed does not meet preset processing conditions;
and if the scanning galvanometer and the dynamic focusing assembly do not exceed the corresponding maximum moving distance when the next sub-block is processed, judging that the next sub-block of the part to be processed meets the preset processing condition.
Optionally, the method further includes:
when the scanning galvanometer exceeds the corresponding maximum moving distance when the next sub-block is machined, acquiring a first target moving distance according to the maximum moving distance of the scanning galvanometer and the moving distance of the scanning galvanometer when the current sub-block is machined, and controlling the X axis and the Y axis of the five-axis motion platform and the scanning galvanometer to move according to the first target moving distance;
and/or when the dynamic focusing assembly exceeds the corresponding maximum moving distance when the next sub-block is machined, acquiring a second target moving distance according to the maximum moving distance of the dynamic focusing assembly and the moving distance of the dynamic focusing assembly when the current sub-block is machined, and controlling the dynamic focusing assembly and the Z axis of the five-axis motion platform to move according to the second target moving distance.
A second aspect of the present application provides a controller comprising:
the first control unit is used for determining the processing track of the current sub-block according to the acquired processing track of each sub-block of the part to be processed and controlling the five-axis motion platform to move the current sub-block into the processing range of the scanning galvanometer;
the second control unit is used for controlling the CCD assembly to detect the relative distance between a focusing lens in the dynamic focusing assembly and the current sub-block and controlling the dynamic focusing assembly to automatically focus based on the relative distance;
a third control unit, configured to control the scanning galvanometer to process the current sub-block from a processing start point of the current sub-block according to the processing trajectory of the current sub-block;
and the triggering unit is used for taking the next sub-block of the part to be processed as the current sub-block and triggering the first control unit until the whole part to be processed is processed completely when the current sub-block is processed and the next sub-block of the part to be processed is judged to meet the preset processing condition.
A third aspect of the present application provides a parts machining control system including: the device comprises an upper computer, a dynamic focusing assembly, a scanning galvanometer, a CCD assembly, a laser, a five-axis motion platform and the controller of the second aspect;
the upper computer, the dynamic focusing assembly, the scanning galvanometer, the CCD assembly, the laser and the five-axis motion platform are respectively in communication connection with the controller.
Optionally, the method further includes: a power supply module;
the power module is used for supplying power to the upper computer, the dynamic focusing assembly, the scanning galvanometer, the CCD assembly, the laser, the five-axis motion platform and the controller.
A fourth aspect of the present application provides a parts machining control apparatus comprising a processor and a memory;
the memory is used for storing program codes and transmitting the program codes to the processor;
the processor is configured to execute the part machining control method according to any one of the first aspect according to instructions in the program code.
According to the technical scheme, the method has the following advantages:
the application provides a part machining control method, which is applied to a controller and comprises the following steps: determining the processing track of the current sub-block according to the acquired processing track of each sub-block of the part to be processed, and controlling a five-axis motion platform to move the current sub-block into the processing range of the scanning galvanometer; controlling a CCD assembly to detect the relative distance between a focusing lens in the dynamic focusing assembly and the current sub-block, and controlling the dynamic focusing assembly to automatically focus based on the relative distance; controlling a scanning galvanometer to process the current sub-block from the processing starting point of the current sub-block according to the processing track of the current sub-block; and after the current sub-block is machined, when the next sub-block of the part to be machined is judged to meet the preset machining condition, taking the next sub-block of the part to be machined as the current sub-block, returning to the step of determining the machining track of the current sub-block according to the obtained machining track of each sub-block of the part to be machined, and controlling a five-axis motion platform to move the current sub-block into the machining range of the scanning galvanometer until the whole part to be machined is machined.
According to the method, after the controller controls the five-axis motion platform to move the current sub-block of the part to be processed to the processing range of the scanning galvanometer according to the processing track of the current sub-block of the part to be processed, the dynamic focusing assembly is controlled to automatically focus in real time through the relative distance between the focusing lens and the current sub-block in the dynamic focusing assembly acquired by the CCD assembly, and the processing efficiency and the processing precision are improved; and this application processes each subblock through the scanning galvanometer that the control weight is lighter, need not process through the mode that removes the laser head, influences the stability and the dynamic nature of processingequipment when having avoided laser head multi-angle motion problem, has improved prior art and has made the laser head and wait to process the part and keep invariable position appearance through the mode of control laser head with rotation and translation, has machining efficiency low, the precision is low, and the laser head is heavier, influences the technical problem of processingequipment's stability and dynamic nature.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic flow chart of a part machining control method according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a controller according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a part machining control system according to an embodiment of the present application.
Detailed Description
The application provides a part machining control method, a controller, a system and equipment, which are used for improving the technical problems that in the prior art, a laser head and a part to be machined are kept in a constant pose in a rotating and translating mode by controlling the laser head, the machining efficiency is low, the precision is low, the laser head is heavy, and the stability and the dynamic performance of a machining device are influenced.
In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
For easy understanding, referring to fig. 1, a part machining control method provided by the embodiment of the present application is applied to a controller, and includes:
The process for acquiring the processing track in the embodiment of the application is as follows: carrying out graphic blocking processing on a three-dimensional curved surface model of a part to be processed, which is input by a user, through an upper computer to obtain a plurality of sub-blocks; and determining the processing track of the sub-block according to the processing starting point of the part to be processed and the contour information of the sub-block by the upper computer.
And the user inputs the three-dimensional curved surface model of the part to be processed into the upper computer, and the upper computer performs graphic block processing on the three-dimensional curved surface model of the part to be processed to obtain a plurality of sub-blocks. Specifically, after a user inputs a three-dimensional curved surface model of a part to be processed, the three-dimensional curved surface model of the part to be processed is subjected to graphic blocking processing through an upper computer according to the maximum moving distance of a scanning galvanometer in the horizontal direction and the normal vector direction of each position of the three-dimensional curved surface model, and a plurality of sub-blocks are obtained; the size of each sub-block in the X-axis direction and the Y-axis direction is smaller than or equal to the maximum moving distance of the scanning galvanometer in the horizontal direction, and the normal vector directions of any positions on each sub-block are the same. The normal vector directions of different sub-blocks can be the same or different; when the size of the part to be processed in the X-axis direction and the Y-axis direction is smaller than or equal to the maximum moving distance of the scanning galvanometer in the horizontal direction, and the normal vector directions of any position of the part to be processed are the same, the number of the obtained subblocks is 1.
The shape and the pattern of the part to be machined, which need to be machined, are known, that is, the machining track of the part to be machined can be directly obtained according to the shape and the pattern to be machined, the machining track comprises a machining starting point and a machining end point, that is, the machining starting point of the whole part to be machined can be obtained according to the machining track of the part to be machined, the position of the machining starting point (namely the position of the machining starting point of the first subblock) can be determined by the controller through controlling the CCD assembly by adopting a positioning algorithm, the upper computer can determine the machining track of the subblock (namely the machining track of the first subblock) according to the contour information of the subblock where the machining starting point is located and the machining starting point, wherein the machining end point of the subblock is the machining starting point of the next subblock, and the upper computer can determine the machining track of the next subblock according to the machining starting point and the contour information of the next subblock.
After the processing track of each subblock of a part to be processed is obtained, the controller controls the X axis, the Y axis, the Z axis, the A axis and the C axis of the five-axis motion platform to move the current subblock to the processing range of the scanning galvanometer according to the processing track of the current subblock, wherein the scanning galvanometer is installed in the laser head.
And 102, controlling the CCD assembly to detect the relative distance between a focusing lens in the dynamic focusing assembly and the current sub-block, and controlling the dynamic focusing assembly to automatically focus based on the relative distance.
The dynamic focusing assembly in the embodiment of the application comprises a dynamic focusing lens, a beam expander, a reflector and the like, wherein the dynamic focusing lens can be driven by an American SMAC type voice coil motor to realize precise fine adjustment of a focus in a small range, so that laser spots are focused on a part to be processed in real time, and the SMAC type voice coil motor has high resolution of 0.1um, so that focusing is precise; the beam expander has the functions of expanding and collimating the laser beam; the mirror is used to change the direction of the laser beam.
After the current sub-block moves to the processing range of the scanning galvanometer, the controller controls the laser to emit laser beams and controls the CCD assembly to detect the relative distance between the focusing mirror in the dynamic focusing assembly and the current sub-block; when the relative distance does not exceed the motion range of a voice coil motor in the dynamic focusing assembly, controlling the voice coil motor to move so as to realize the automatic focusing function of the dynamic focusing assembly; and when the relative distance exceeds the motion range of a voice coil motor in the dynamic focusing assembly, controlling the Z axis of the five-axis motion platform to move so as to reduce the relative distance between the focusing mirror and the current sub-block, and returning to the step of controlling the CCD assembly to detect the relative distance between the focusing mirror and the current sub-block in the dynamic focusing assembly.
Specifically, the CCD assembly automatically identifies the relative distance between the focusing mirror and the current sub-block based on the high-speed visual image information of the laser spot size. If the CCD assembly identifies that the relative distance does not exceed the motion range of the voice coil motor in the dynamic focusing assembly, namely the relative distance is smaller than or equal to the maximum moving distance of the voice coil motor of the dynamic focusing assembly, the controller controls the voice coil motor in the dynamic focusing assembly to perform precise micro-motion to realize the automatic focusing function; if the CCD assembly identifies that the relative distance exceeds the movement range of the voice coil motor in the dynamic focusing assembly, namely the relative distance is larger than the maximum movement distance of the voice coil motor of the dynamic focusing assembly, the controller firstly controls the Z axis of the five-axis movement platform to move in a large range, so that the relative distance between the focusing mirror and the current sub-block is reduced, and when the relative distance is equal to the maximum movement distance of the voice coil motor of the dynamic focusing assembly, the voice coil motor of the dynamic focusing assembly is controlled to perform precise micro-movement.
When focusing is carried out on a scanning galvanometer in the prior art, the influence of the movement range of the device is easily received, the focusing range is limited, the focusing effect is poor, the processing efficiency and the processing precision are influenced, the embodiment of the application carries out small-range precise fine adjustment through large-range movement of a Z shaft of a five-shaft movement platform and a voice coil motor of a dynamic focusing assembly, real-time automatic focusing is realized, the influence of the focusing range of the dynamic focusing assembly is avoided, the focusing effect is good, and the processing efficiency and the processing precision are favorably improved.
And 103, controlling the scanning galvanometer to process the current sub-block from the processing start point of the current sub-block according to the processing track of the current sub-block.
And after the controller controls the dynamic focusing assembly to focus well, the scanning galvanometer is controlled to process the current sub-block from the processing starting point along the X direction and the Y direction of the plane according to the processing track of the current sub-block. When the current sub-block is the first sub-block, the controller positions the processing starting point of the first sub-block by controlling the CCD assembly, and then controls the scanning galvanometer to process the first sub-block from the processing starting point along the X direction and the Y direction of the plane according to the processing track of the first sub-block. When the current sub-block is not the first sub-block, the positioning of the processing starting point by the CCD assembly is not needed.
In the embodiment of the application, the controller controls the X axis, the Y axis, the Z axis, the A axis and the C axis of the five-axis motion platform to move the current sub-block to the processing range of the scanning galvanometer, so that variable normal vector processing can be realized; in addition, the normal vector directions of any positions of the subblocks after being partitioned are the same, so that the scanning galvanometer is processed with a fixed normal vector when processing each subblock, namely the scanning galvanometer does not need to change the normal vector when processing each subblock, and only when processing the next subblock, whether the normal vector is changed or not needs to be considered, so that the processing efficiency is improved.
And step 104, after the current sub-block is processed and when the next sub-block of the part to be processed is judged to meet the preset processing condition, taking the next sub-block of the part to be processed as the current sub-block, and returning to the step 101 until the whole part to be processed is processed.
After the current sub-block is processed, preparation is made for a next sub-block of the part to be processed, and whether the next sub-block meets preset processing conditions or not needs to be judged in advance according to a processing track of the next sub-block. In particular, the method comprises the following steps of,
judging whether the scanning galvanometer exceeds the maximum moving distance of the scanning galvanometer and whether the dynamic focusing assembly exceeds the maximum moving distance of the dynamic focusing assembly when the next sub-block is processed according to the processing track of the next sub-block of the part to be processed; if the scanning galvanometer and/or the dynamic focusing assembly exceed the corresponding maximum moving distance when the next sub-block is processed, judging that the next sub-block of the part to be processed does not meet the preset processing condition; and if the scanning galvanometer and the dynamic focusing assembly do not exceed the corresponding maximum moving distance when the next sub-block is processed, judging that the next sub-block of the part to be processed meets the preset processing condition.
Further, when the scanning galvanometer exceeds the corresponding maximum moving distance when the next sub-block is processed, obtaining a first target moving distance according to the maximum moving distance of the scanning galvanometer and the moving distance of the scanning galvanometer when the current sub-block is processed, and controlling the X axis and the Y axis of the five-axis motion platform and the scanning galvanometer to move according to the first target moving distance; and/or when the dynamic focusing assembly exceeds the corresponding maximum moving distance when the next sub-block is machined, acquiring a second target moving distance according to the maximum moving distance of the dynamic focusing assembly and the moving distance of the dynamic focusing assembly when the current sub-block is machined, and controlling the dynamic focusing assembly and the Z axis of the five-axis motion platform to move according to the second target moving distance.
Specifically, when it is determined that the scanning galvanometer exceeds the maximum moving distance of the scanning galvanometer when the next sub-block is processed and it is determined that the dynamic focusing assembly exceeds the maximum moving distance of the dynamic focusing assembly when the next sub-block is processed, the scanning galvanometer and the dynamic focusing assembly cannot move in the same direction, and the controller obtains the maximum stroke of the scanning galvanometer (i.e., the maximum moving distance D of the scanning galvanometer moving along the direction of the plane X, Y)1Where) and its zero position (i.e., half D of the maximum travel distance of the scanning galvanometer1/2), and the current sub-block is addedThe moving distance D of the galvanometer along the plane X, Y is scanned during working hours2(distance of movement D)2The distance from the moving starting point to the moving end point of the scanning galvanometer during the current sub-block processing), and the relative distance D is compared12 and the moving distance D2The size of (2). When the relative distance D is1/2 is less than or equal to the moving distance D2The controller compares the relative distance D12 as a first target moving distance; when the relative distance D is12 is greater than the moving distance D2The controller will move the distance D2And controlling the X axis and the Y axis of the five-axis motion platform and the scanning galvanometer to move in the direction of the plane X, Y according to the first target moving distance. Meanwhile, the controller obtains the maximum stroke position of the dynamic focusing assembly (namely the maximum moving distance D of the voice coil motor in the dynamic focusing assembly)3Where) and its zero position (i.e., half D of the maximum travel distance of the voice coil motor in the dynamic focus assembly32) and the distance D of movement of the dynamic focusing assembly when the current sub-block is processed4(distance of movement D)4The distance from the moving start point to the moving end point of the dynamic focus module for the current sub-block processing), and comparing the relative distance with the moving distance D4The size of (2). When the relative distance D is3/2 is less than or equal to the moving distance D4The controller compares the relative distance D32 as a second target moving distance; when the relative distance D is32 is greater than the moving distance D4The controller will move the distance D4And controlling the dynamic focusing assembly and the Z axis of the five-axis motion platform to move according to the second target moving distance to enable the next sub-block to meet the preset processing condition.
When the fact that the scanning galvanometer exceeds the maximum moving distance of the scanning galvanometer when the next sub-block is machined is judged, and the fact that the dynamic focusing assembly does not exceed the maximum moving distance of the dynamic focusing assembly when the next sub-block is machined is judged, the controller controls the X axis and the Y axis of the five-axis motion platform and the scanning galvanometer to move in the direction of a plane X, Y according to the first target moving distance, the focusing assembly and the Z axis of the five-axis motion platform do not move, and the next sub-block meets the preset machining condition.
When the scanning galvanometer does not exceed the maximum moving distance of the scanning galvanometer when the next sub-block is machined and the dynamic focusing assembly exceeds the maximum moving distance of the dynamic focusing assembly when the next sub-block is machined, the controller controls the dynamic focusing assembly and the Z axis of the five-axis motion platform to move according to the second target moving distance, and the X axis, the Y axis and the scanning galvanometer of the five-axis motion platform do not move, so that the next sub-block meets the preset machining condition.
And when the next sub-block of the part to be machined meets the preset machining condition, taking the next sub-block of the part to be machined as the current sub-block, and returning to the step 101 until the whole part to be machined is machined. In the embodiment of the application, the processing range of the part to be processed is not limited by the motion ranges of the scanning galvanometer and the dynamic focusing assembly, the operable space of part processing is improved, and the flexibility and the practicability are higher.
In the embodiment of the application, after the controller controls the five-axis motion platform to move the current sub-block of the part to be processed to the processing range of the scanning galvanometer according to the processing track of the current sub-block of the part to be processed, the dynamic focusing assembly is controlled to automatically focus in real time through the relative distance between the focusing lens and the current sub-block in the dynamic focusing assembly acquired by the CCD assembly, and the processing efficiency and the processing precision are improved; and this application processes each subblock through the scanning galvanometer that the control weight is lighter, need not process through the mode that removes the laser head, influences the stability and the dynamic nature of processingequipment when having avoided laser head multi-angle motion problem, has improved prior art and has made the laser head and wait to process the part and keep invariable position appearance through the mode of control laser head with rotation and translation, has machining efficiency low, the precision is low, and the laser head is heavier, influences the technical problem of processingequipment's stability and dynamic nature.
The above is an embodiment of a part machining control method provided by the present application, and the following is an embodiment of a controller provided by the present application.
Referring to fig. 2, an embodiment of the present application provides a controller, including:
the first control unit 201 is configured to determine a processing track of a current sub-block according to the acquired processing track of each sub-block of the part to be processed, and control the five-axis motion platform to move the current sub-block into a processing range of the scanning galvanometer;
the second control unit 202 is configured to control the CCD assembly to detect a relative distance between a focusing mirror in the dynamic focusing assembly and the current sub-block, and control the dynamic focusing assembly to perform auto focusing based on the relative distance;
a third control unit 203, configured to control the scanning galvanometer to process the current sub-block from the processing start point of the current sub-block according to the processing trajectory of the current sub-block;
and the triggering unit 204 is configured to, after the current sub-block is processed and when it is determined that a next sub-block of the part to be processed meets a preset processing condition, trigger the first control unit with the next sub-block of the part to be processed as the current sub-block until the whole part to be processed is processed.
As a further improvement, the process of acquiring the processing track is as follows:
carrying out graphic blocking processing on a three-dimensional curved surface model of a part to be processed, which is input by a user, through an upper computer to obtain a plurality of sub-blocks;
and determining the processing track of the sub-block according to the processing starting point of the part to be processed and the contour information of the sub-block by the upper computer.
As a further improvement, the three-dimensional curved surface model of the part to be processed, which is input by a user, is subjected to graphic blocking processing through an upper computer to obtain a plurality of sub-blocks, including:
after a user inputs a three-dimensional curved surface model of a part to be processed, carrying out graphic blocking processing on the three-dimensional curved surface model of the part to be processed through an upper computer according to the maximum moving distance of a scanning galvanometer in the horizontal direction and the normal vector direction of each position of the three-dimensional curved surface model to obtain a plurality of sub-blocks;
the size of each sub-block in the X-axis direction and the Y-axis direction is smaller than or equal to the maximum moving distance of the scanning galvanometer in the horizontal direction, and the normal vector directions of any positions on each sub-block are the same.
As a further improvement, the second control unit 202 specifically includes:
the CCD assembly control subunit is used for controlling the CCD assembly to detect the relative distance between a focusing lens in the dynamic focusing assembly and the current sub-block;
the voice coil motor control subunit is used for controlling the voice coil motor to move when the relative distance does not exceed the movement range of the voice coil motor in the dynamic focusing assembly so as to realize the automatic focusing function of the dynamic focusing assembly;
and the five-axis motion platform control subunit is used for controlling the Z axis of the five-axis motion platform to move when the relative distance exceeds the motion range of the voice coil motor in the dynamic focusing assembly, so that the relative distance between the focusing mirror and the current sub-block is reduced, and the CCD assembly control subunit is triggered.
As a further improvement, the process of judging whether the next sub-block of the part to be machined meets the preset machining condition is as follows:
judging whether the scanning galvanometer exceeds the maximum moving distance of the scanning galvanometer and whether the dynamic focusing assembly exceeds the maximum moving distance of the dynamic focusing assembly when the next sub-block is processed according to the processing track of the next sub-block of the part to be processed;
if the scanning galvanometer and/or the dynamic focusing assembly exceed the corresponding maximum moving distance when the next sub-block is processed, judging that the next sub-block of the part to be processed does not meet the preset processing condition;
and if the scanning galvanometer and the dynamic focusing assembly do not exceed the corresponding maximum moving distance when the next sub-block is processed, judging that the next sub-block of the part to be processed meets the preset processing condition.
As a further improvement, the controller further comprises: a fourth control unit configured to:
when the scanning galvanometer exceeds the corresponding maximum moving distance when the next sub-block is processed, acquiring a first target moving distance according to the maximum moving distance of the scanning galvanometer and the moving distance of the scanning galvanometer when the current sub-block is processed, and controlling the X axis and the Y axis of the five-axis motion platform and the scanning galvanometer to move according to the first target moving distance;
and/or when the dynamic focusing assembly exceeds the corresponding maximum moving distance when the next sub-block is machined, acquiring a second target moving distance according to the maximum moving distance of the dynamic focusing assembly and the moving distance of the dynamic focusing assembly when the current sub-block is machined, and controlling the dynamic focusing assembly and the Z axis of the five-axis motion platform to move according to the second target moving distance.
In the embodiment of the application, after the controller controls the five-axis motion platform to move the current sub-block of the part to be processed to the processing range of the scanning galvanometer according to the processing track of the current sub-block of the part to be processed, the dynamic focusing assembly is controlled to automatically focus in real time through the relative distance between the focusing lens and the current sub-block in the dynamic focusing assembly acquired by the CCD assembly, and the processing efficiency and the processing precision are improved; and this application processes each subblock through the scanning galvanometer that the control weight is lighter, need not process through the mode that removes the laser head, influences the stability and the dynamic nature of processingequipment when having avoided laser head multi-angle motion problem, has improved prior art and has made the laser head and wait to process the part and keep invariable position appearance through the mode of control laser head with rotation and translation, has machining efficiency low, the precision is low, and the laser head is heavier, influences the technical problem of processingequipment's stability and dynamic nature.
The above is an embodiment of a controller provided by the present application, and the following is an embodiment of a part machining control system provided by the present application.
Referring to fig. 3, a part machining control system according to an embodiment of the present application includes: the device comprises an upper computer, a dynamic focusing assembly, a scanning galvanometer, a CCD assembly, a laser, a five-axis motion platform and a controller in the controller embodiment;
the upper computer, the dynamic focusing assembly, the scanning galvanometer, the CCD assembly, the laser and the five-axis motion platform are respectively in communication connection with the controller.
The upper computer in the embodiment of the application is composed of an industrial personal computer and used for sending instructions, data processing, graphic display, fault alarm and the like, and after a user inputs the three-dimensional curved surface model of the part to be processed, the upper computer is used for carrying out data processing such as blocking, planning of a track path, selection of process parameters and the like on the three-dimensional curved surface model of the part to be processed.
The controller consists of a Power PMAC motion controller and can be used for operations such as motor control, mathematical logic operation and the like, such as the operations of controlling the on-off of a laser, the motion of a five-axis motion platform, the focusing of a dynamic focusing assembly, the XY plane processing of a scanning galvanometer and the like. The laser is used for receiving the laser switch instruction output by the controller and realizing the emission of the laser beam. The dynamic focusing assembly comprises a dynamic focusing mirror, a beam expander, a reflector and the like, wherein the focusing mirror is driven by an American SMAC type voice coil motor to realize precise micro-adjustment of a focus in a small range, so that laser spots are focused on a part to be processed in real time, and the SMAC type voice coil motor has high resolution of 0.1um to realize precise focusing; the beam expander has the functions of expanding and collimating the laser beam; the mirror is used to change the direction of the laser beam.
The scanning galvanometer is used for controlling the laser beam to move in the direction of the plane X, Y; the CCD assembly is used for detecting the spatial position relation between the scanning galvanometer and the part to be processed, feeding back the relative position information of the scanning galvanometer and the part to be processed, which is automatically identified, to the controller based on the high-speed visual image information of the laser spots, and positioning the processing starting point of the part to be processed.
The five-axis motion platform consists of platforms in five directions of an X axis, a Y axis, a Z axis, an A axis and a C axis, and large-range, multi-normal-vector and high-precision machining of the part to be machined is realized by driving the part to be machined to linearly move along the X axis direction, the Y axis direction and the Z axis direction and to rotate around the X axis direction and the Z axis direction.
As a further improvement, the system further comprises: a power supply module;
and the power supply module is used for supplying power to the upper computer, the dynamic focusing assembly, the scanning galvanometer, the CCD assembly, the laser, the five-axis motion platform and the controller.
The embodiment of the application also provides part machining control equipment, which comprises a processor and a memory;
the memory is used for storing the program codes and transmitting the program codes to the processor;
the processor is configured to execute the part machining control method in the foregoing method embodiment according to instructions in the program code.
The embodiment of the application also provides a computer-readable storage medium, which is used for storing program codes, and the program codes are used for executing the part machining control method in the method embodiment.
It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be substantially implemented or contributed to by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes instructions for executing all or part of the steps of the method described in the embodiments of the present application through a computer device (which may be a personal computer, a server, or a network device). And the aforementioned storage medium includes: a U disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
The above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (10)
1. A part machining control method is applied to a controller, and the method comprises the following steps:
determining the processing track of the current sub-block according to the acquired processing track of each sub-block of the part to be processed, and controlling a five-axis motion platform to move the current sub-block into the processing range of a scanning galvanometer;
controlling a CCD assembly to detect the relative distance between a focusing lens in a dynamic focusing assembly and the current sub-block, and controlling the dynamic focusing assembly to automatically focus based on the relative distance;
controlling the scanning galvanometer to process the current sub-block from the processing starting point of the current sub-block according to the processing track of the current sub-block;
and after the current sub-block is machined, when the next sub-block of the part to be machined is judged to meet preset machining conditions, taking the next sub-block of the part to be machined as the current sub-block, returning to the step of determining the machining track of the current sub-block according to the obtained machining track of each sub-block of the part to be machined, and controlling a five-axis motion platform to move the current sub-block into the machining range of the scanning galvanometer until the whole part to be machined is machined.
2. The part machining control method according to claim 1, wherein the process of acquiring the machining trajectory is:
carrying out graphic blocking processing on the three-dimensional curved surface model of the part to be processed, which is input by a user, through an upper computer to obtain a plurality of sub-blocks;
and determining the processing track of the sub-block according to the processing starting point of the part to be processed and the contour information of the sub-block by the upper computer.
3. The part machining control method according to claim 2, wherein the step of performing graphic block division processing on the three-dimensional curved surface model of the part to be machined, which is input by a user, by using an upper computer to obtain a plurality of sub blocks comprises:
after a user inputs a three-dimensional curved surface model of a part to be processed, carrying out graphic blocking processing on the three-dimensional curved surface model of the part to be processed through the upper computer according to the maximum moving distance of the scanning galvanometer in the horizontal direction and the normal vector direction of each position of the three-dimensional curved surface model to obtain a plurality of sub-blocks;
the size of each sub-block in the X-axis direction and the Y-axis direction is smaller than or equal to the maximum moving distance of the scanning galvanometer in the horizontal direction, and the normal vector directions of any position on each sub-block are the same.
4. The part processing control method according to claim 1, wherein the controlling the CCD assembly to detect a relative distance between a focusing mirror in a dynamic focusing assembly and the current sub-block and to control the dynamic focusing assembly to perform auto-focusing based on the relative distance includes:
controlling a CCD assembly to detect the relative distance between a focusing mirror in the dynamic focusing assembly and the current sub-block;
when the relative distance does not exceed the motion range of a voice coil motor in the dynamic focusing assembly, controlling the voice coil motor to move so as to realize the automatic focusing function of the dynamic focusing assembly;
and when the relative distance exceeds the motion range of a voice coil motor in the dynamic focusing assembly, controlling the Z axis of the five-axis motion platform to move so as to reduce the relative distance between the focusing mirror and the current sub-block, and returning to the step of controlling the CCD assembly to detect the relative distance between the focusing mirror in the dynamic focusing assembly and the current sub-block.
5. The part processing control method according to claim 1, wherein the process of determining whether the next sub-block of the part to be processed satisfies a preset processing condition is:
judging whether the scanning galvanometer exceeds the maximum moving distance of the scanning galvanometer and whether the dynamic focusing assembly exceeds the maximum moving distance of the dynamic focusing assembly when the next sub-block is processed according to the processing track of the next sub-block of the part to be processed;
if the scanning galvanometer and/or the dynamic focusing assembly exceeds the corresponding maximum moving distance when the next sub-block is processed, judging that the next sub-block of the part to be processed does not meet preset processing conditions;
and if the scanning galvanometer and the dynamic focusing assembly do not exceed the corresponding maximum moving distance when the next sub-block is processed, judging that the next sub-block of the part to be processed meets the preset processing condition.
6. The parts machining control method according to claim 5, further comprising:
when the scanning galvanometer exceeds the corresponding maximum moving distance when the next sub-block is machined, acquiring a first target moving distance according to the maximum moving distance of the scanning galvanometer and the moving distance of the scanning galvanometer when the current sub-block is machined, and controlling the X axis and the Y axis of the five-axis motion platform and the scanning galvanometer to move according to the first target moving distance;
and/or when the dynamic focusing assembly exceeds the corresponding maximum moving distance when the next sub-block is machined, acquiring a second target moving distance according to the maximum moving distance of the dynamic focusing assembly and the moving distance of the dynamic focusing assembly when the current sub-block is machined, and controlling the dynamic focusing assembly and the Z axis of the five-axis motion platform to move according to the second target moving distance.
7. A controller, comprising:
the first control unit is used for determining the processing track of the current sub-block according to the acquired processing track of each sub-block of the part to be processed and controlling the five-axis motion platform to move the current sub-block into the processing range of the scanning galvanometer;
the second control unit is used for controlling the CCD assembly to detect the relative distance between a focusing lens in the dynamic focusing assembly and the current sub-block and controlling the dynamic focusing assembly to automatically focus based on the relative distance;
a third control unit, configured to control the scanning galvanometer to process the current sub-block from a processing start point of the current sub-block according to the processing trajectory of the current sub-block;
and the triggering unit is used for taking the next sub-block of the part to be processed as the current sub-block and triggering the first control unit until the whole part to be processed is processed completely when the current sub-block is processed and the next sub-block of the part to be processed is judged to meet the preset processing condition.
8. A parts machining control system, comprising: the device comprises an upper computer, a dynamic focusing assembly, a scanning galvanometer, a CCD assembly, a laser, a five-axis motion platform and the controller of claim 7;
the upper computer, the dynamic focusing assembly, the scanning galvanometer, the CCD assembly, the laser and the five-axis motion platform are respectively in communication connection with the controller.
9. The parts machining control system of claim 8, further comprising: a power supply module;
the power module is used for supplying power to the upper computer, the dynamic focusing assembly, the scanning galvanometer, the CCD assembly, the laser, the five-axis motion platform and the controller.
10. A parts machining control apparatus, comprising a processor and a memory;
the memory is used for storing program codes and transmitting the program codes to the processor;
the processor is configured to execute the part machining control method according to any one of claims 1 to 6 according to instructions in the program code.
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| CN202110769780.6A CN113210843B (en) | 2021-07-06 | 2021-07-06 | Part machining control method, controller, system and equipment |
| PCT/CN2021/121523 WO2023279550A1 (en) | 2021-07-06 | 2021-09-29 | Part machining control method, controller, system and apparatus |
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| CN202110769780.6A CN113210843B (en) | 2021-07-06 | 2021-07-06 | Part machining control method, controller, system and equipment |
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| WO2023279550A1 (en) * | 2021-07-06 | 2023-01-12 | 广东工业大学 | Part machining control method, controller, system and apparatus |
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