KR101973636B1 - Cemented carbide, high-quality laser micro-discharge complex processing device - Google Patents

Abstract

The present invention relates to a cemented carbide high-quality laser compounding apparatus capable of improving the precision of a processing region of an object to be processed by blending the two processes of a laser processing machine and an electric discharge machining machine. More particularly, Accordingly, there is provided a cemented carbide high-quality laser composite processing apparatus capable of minimizing the defective rate because the surface processing of the object to be processed can be smoothly performed and at the same time minimizing the amount of material of the object to be removed by the electric discharge machining while reducing the tool wear rate of the electric discharge machine. do.

Description

[0002] Cemented carbide, a high-quality laser micro-discharge complex processing device,

The present invention relates to a cemented carbide high-quality laser compounding apparatus capable of improving the precision of a processing region of an object to be processed by blending the two processes of a laser processing machine and an electric discharge machining machine. More particularly, Accordingly, there is provided a cemented carbide high-quality laser composite processing apparatus capable of minimizing the defective rate because the surface processing of the object to be processed can be smoothly performed and at the same time minimizing the amount of material of the object to be removed by the electric discharge machining while reducing the tool wear rate of the electric discharge machine. do.

In recent years, the demand for ultra-small parts and high-precision processing machines has increased in the recent industry, and the above-mentioned processing technology is continuously studied. In particular, in the industrial fields such as inkjet and diesel engine nozzles, machine parts, ultra precision molds, There is an increasing demand for fine holes and fine shape processing.

Due to this growing demand, various methods of metal surface machining are performed, such as mechanical milling (eg diamond milling, lapping, grinding, rough cutting), chemical milling (eg chemical etching, photochemical etching) Surface processing is accomplished by energy milling (e.g., ablation or etching with high energy beams such as plasma, excimer lasers, laser diodes) and other processing methods that can remove material from the design or patterned areas.

Among the various methods described above, a method of processing an object having high hardness and strength is mainly a method using a laser and an electric discharge machining.

Electrical discharge machining (EDM) has an electrode cutting device that moves precisely on the surface of the workpiece. The heated electrode can selectively melt-etch or ablate the workpiece, transport the tool electrode, Dimensional shape can be processed.

However, the electric discharge machining has a disadvantage in that wear is caused not only in the workpiece but also in the tool electrode, and in that the limit of the slow machining speed, the depth of machining, and the accuracy are remarkably deteriorated.

In addition, although the laser processing method can be used for a wide range of workpieces, it has an advantage of a high processing speed. However, it is difficult to control the size of the processed workpiece, and only the limited width and depth can be processed. There is a disadvantage that reliability of the resultant work is lowered.

Therefore, it is necessary to develop a laser machining apparatus capable of easily removing foreign matters adhered to a workpiece during laser machining, and finely machining the surface of fine holes and fine shapes, thereby improving work reliability.

1. U.S. Patent No. 6,624,382, 'Configured-hole high-speed drilling system for micro-via pattern formation, and resulting structure' (filed on June 16, 2001) 2. JP-A-01234577, 'Removal of barriers for laser material processing' (filed on March 15, 1988) 3. Korean Patent Laid-Open Publication No. 10-2014-0043346 'Micro discharge based measurement system' (filed on May 22, 2012) 4. Korean Patent Registration No. 10-1341117 'Hybrid Cutting Device and Cutting Method Fused with Mechanical Milling and Electric Discharge Processing' (filed on October 24, 2011)

SUMMARY OF THE INVENTION The present invention has been conceived to solve the problems as described above, and it is an object of the present invention to provide a machining apparatus capable of smoothly machining the surface of an object to be processed by machining the upper and lower surfaces of the object using the same laser processing machine, And to provide a cemented carbide high-quality laser composite processing apparatus capable of smooth discharge.

Further, the present invention can improve the processing time and machining accuracy by mixing the two processes of the laser processing machine and the electric discharge machining machine, and can reduce the tool wear rate of the electric discharge machine while minimizing the material amount of the object to be machined. The present invention provides a high-quality laser composite machining apparatus which is capable of producing a cemented carbide.

The cemented carbide high-quality laser composite processing apparatus of the present invention includes a main frame 100 including a bottom plate 110 that is horizontal to the ground and a support frame 120 that is installed on the bottom plate 110; A table 200 having a predetermined thickness, on which an object to be processed S is placed and on which a machining hole 201 is formed to penetrate in a vertical direction; An X-axis moving module 300 fixed to a lower surface of the table 200 to horizontally move the table 200 in the X-axis while maintaining a predetermined spacing from the table 200; A Y-axis moving module 400 fixed to the upper end of the X-axis moving module 300 and seated on the bottom plate 110 to horizontally move the X-axis moving module 300 in the Y-axis; A laser processing machine 500 for irradiating a laser beam transmitted to the surface of the object S; An electric discharge machine 600 for receiving a voltage from the outside and discharging sparks at the same position as the surface of the object S processed from the laser processor 500 to process the object; A Z-axis movement module (not shown) that is coupled to the support frame 120 and moves up and down so as to adjust the focal point of the laser beam or the focus of the spark to be discharged, the laser processor 500 and the electric discharge machine 600, 700); A laser oscillator 800 for emitting the laser beam to the laser processor 500; A laser reflector 900 that horizontally moves in the same direction as the X-axis movement module 300 so as to selectively process a rear surface of the object S by reflecting a laser beam emitted from the laser processor 500; And a control unit (1000) for controlling the processing position of the object to be processed and the operation of the laser processing machine (500), the electric discharge machine (600), and the laser reflecting unit (900).

In the present invention, a discharge water tank 1100, which is fixed to the table 200 and on which the object S is placed, is provided, and on the upper and lower surfaces of the object S, The bottom surface of the discharge water tank 1100 is made of a material that transmits a laser beam so as to form the second processing hole S-1 and the second processing hole S-2. When the electrolytic solution is supplied to the discharge water tank 1100, The spark of the electric discharge machine 600 is discharged in the first processing hole S-1 to form a third processing hole S-3 larger than the diameter and depth of the first processing hole S-1, And burrs generated during processing are discharged to the upper side and the lower side of the object along the electrolytic solution.

Further, another embodiment of the present invention may include a second table 1200 including a discharge water tank 1100 'which is seated on the X-axis movement module 300 and has an opened upper surface; And an object moving means 1300 for grasping the laser processing object S in the table 200 and placing the object S in the discharge water tank 1000 ' The spark of the electric discharge machine 600 is discharged to the first processing hole S-1 and the third processing hole S-3, which is larger than the diameter and depth of the first processing hole S-1, And a burr generated in the laser processing is discharged to the upper side and the lower side of the object along the electrolytic solution.

The laser beam is irradiated to the upper surface of the object S through the processing hole 201 so as to be irradiated to the lower surface of the object S, A laser reflection module 910 for changing the movement path; So as to horizontally move the laser reflection module 910 in the X-axis direction so that the laser reflection module 910 receives the laser beam emitted from the laser processing machine 500 when the lower surface of the object S is processed And driving means (920) connected to the laser reflection module (910).

Further, the laser reflection module 910 of the present invention includes an upper guide tube 911 having an inner hollow and extending in the X-axis direction; A first reflective lens 912 mounted on one side of the upper guide tube 911 to receive and reflect the laser beam from the laser processing machine 500; A second reflecting lens 913 mounted on the other side of the upper guide tube 911 and reflecting a laser beam reflected from the first reflecting lens 912; A connection pipe 914 having a hollow interior and fitted with the second reflection lens 913 at one side and connected to the driving means 920; A third reflecting lens 915 mounted on the other side of the coupling tube 914 and reflecting a laser beam reflected from the second reflecting lens 913; The third reflective lens 915 is mounted on one side of the upper guide tube 911 and is symmetrical with the upper guide tube 911. The lower guide tube 915 is inserted into a spaced space between the table 200 and the X- 916); And a fourth reflecting lens 917 mounted on the other side of the lower guide tube 916 for irradiating the lower surface of the object S with the laser beam reflected from the third reflecting lens 915 .

The first reflecting lens 912 of the present invention is a beam splitter for reflecting a part of the laser beam transmitted to process the upper surface and the lower surface of the object S simultaneously and transmitting a part of the laser beam Wherein the laser beam is a laser beam.

According to the present invention, the upper and lower surfaces of an object to be processed can be individually processed by selectively adjusting the direction of the laser oscillated in the laser processing machine, thereby making it possible to smoothly process the surface of the object to be processed, There is an advantage.

Further, according to the present invention, the machining area of the electric discharge machining apparatus is reduced, so that rapid machining can be performed. When the electric discharge machining is carried out through the object to be machined, the machining debris attached to the machining hole can be easily discharged, There is an advantage that can be.

1 is a perspective view showing the overall appearance of the present invention.
2 is a perspective view showing a main configuration of an X-axis moving module of the present invention;
FIG. 3 is a perspective view showing a main structure of a Y-axis moving module and a Z-axis moving module according to the present invention. FIG.
4 is a side view showing an operation example of the laser reflecting portion of the present invention.
5 is a perspective view showing an embodiment in which a discharge water tank is placed on a table of the present invention.
6 is a perspective view showing another embodiment of the present invention.
7 is a cross-sectional view showing a processing procedure and a processing method of the object to be processed according to the present invention;
8 is a photograph showing a working example of a laser processing machine and an electric discharge machine according to the present invention.
9 is a photograph showing a working example of a laser machining apparatus and an electric discharge machining apparatus according to the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, one embodiment of a cemented carbide high-quality laser composite processing apparatus of the present invention will be described in detail with reference to the drawings.

FIG. 2 is a perspective view showing a main configuration of the X-axis moving module of the present invention. FIG. 3 is a perspective view showing a main configuration of a Y-axis moving module and a Z- FIG. 5 is a perspective view showing an embodiment in which a discharge water tank is mounted on a table according to the present invention, FIG. 6 is a perspective view showing another embodiment of the present invention, and FIG. 8 is a photograph showing a working example of a laser processing machine and an electric discharge machining machine of the present invention, and Fig. 9 is a photograph showing a processing example of the laser processing machine and the electric discharge machine of the present invention To a photograph showing an example.

Referring to FIG. 1, the cemented carbide high-quality laser composite processing apparatus of the present invention has a main frame 100. The main frame 100 includes a bottom plate 110 which is horizontal with the ground and a support frame 120 which is vertically mounted on the bottom plate 110. At the lower end of the bottom plate 110, moving means such as a moving wheel may be provided to facilitate the movement of the main frame 100.

Referring to FIG. 1, a table 200 having a predetermined thickness is formed. On the upper surface of the table 200, an object S to be processed is seated. At this time, a machining hole 201 penetrating the table 200 in the vertical direction is formed at the center of the table 200. The processing hole 201 preferably has a smaller diameter than the size of the object S to be processed.

1 and 2, the X-axis moving module 300 includes an X-axis moving module 300 in which the table 200 is seated on an upper end of the table 200. The X- (200) can be moved horizontally along the X axis. It is preferable that the table 200 and the X-axis movement module 300 are maintained at a constant spacing.

The X-axis moving module 300 includes an X-axis moving table 310 and an X-axis moving table 310 between the table 200 and the X- And an X-axis rail 320 for guiding the horizontal movement. The X-axis driving unit 330 may further include an X-axis driving unit 330 coupled to the lower end of the copper plate 310 to repeatedly move the table 200 in the X-axis direction. The X-axis driving means 330 may be a hydraulic cylinder, a pneumatic cylinder or a motor and a ball screw.

Referring to FIGS. 1 and 3, a Y-axis moving module 400 is mounted on the bottom plate 110 to horizontally move the X-axis moving module 300 in the Y-axis. That is, the Y-axis moving module 400 is fixed to the upper end of the X-axis moving module 300 in order to process the X-axis moving module 300 according to the machining position of the object S.

More specifically, the Y-axis moving module 400 includes a Y-axis movable plate 410 on which the X-axis moving module 300 is seated and fixed, a Y-axis moving plate 410 for guiding the Y- An axial rail 420 may further be provided. The Y-axis rail 420 is fixed to the bottom plate 110 and has Y-axis driving means (not shown) fixed to the lower end of the Y-axis moving plate 410 to move the Y- 430 are provided. The Y-axis driving means 430 may also have the same configuration as the X-axis driving means 330.

Referring to FIG. 1, a laser processing machine 500 for processing a surface of an object S is provided on a side surface of the main frame 100. The laser processing machine 500 is a device for performing laser beam machining. The laser processing machine 500 receives a laser beam, converts energy contained in the laser beam into heat energy, and locally heats the work to perform fine processing.

After the laser beam is transmitted from the outside to the laser processing machine 500, a part of the output is returned to the input side through the reflecting mirror, and the output is increased and irradiated to the object S to be processed. At this time, the laser beam passes through the condenser lens and is collected at one point, and the collected laser beam locally heats and melts the surface of the workpiece. Thereby, the first processing hole S-1 is formed on the surface of the object S, and the laser processing machine 500 does not directly contact with the object, so that precise processing can be performed.

Referring to FIG. 1, a laser oscillator 800 for emitting a high-power laser beam to the laser processor 500 may be provided on one side of the main frame 100. The laser beam oscillated in the laser oscillation unit 800 may be a pulsed laser or an ultrashort (light) pulse.

That is, since the first processing hole S-1 formed on the surface of the object S may be a groove, a pulsed laser or an ultrashort (light pulse) Or the like. The first processing holes S-1 may be spaced apart from each other due to the operation of the X-axis moving module 300 and the Y-axis moving module 400, and may be formed on the surface of the object S.

Referring to FIG. 1, an electric discharge machining apparatus 600 for applying a voltage from the outside to discharge a spark to the surface of a workpiece S and performing a second electric discharge machining (EDM) is provided. The electric discharge machine 600 discharges the spark at the same position as the first processing hole S-1 after the laser beam is irradiated on the surface of the object S to process the first processing hole S-1, And the second processing hole S-2 is machined on the object S. The electric discharge machine 600 can be classified into spark machining, arc machining, and corona machining depending on the type of discharge.

1 and 3, a laser processing machine 500 and an electric discharge machine 600 are fastened and fixed and a Z axis moving module 700 for moving the fixed laser machine 500 and the electric discharge machine 600 in the vertical direction . That is, the Z-axis movement module 700 is fixed to the support frame 120 and moves in the vertical direction. At this time, the Z-axis movement module 700 moves to adjust the focus of the laser beam emitted from the laser processing machine 500, And moves up and down to adjust the focus (contact point) of the spark to be discharged.

3, the Z-axis movement module 700 includes a rail body 710, a rail 720, a vertical movable plate 730, a screw 740, and a drive motor 750, which are fixed to the support frame 120 . The rail body 710 is fixed to the support frame 120 and has an internal hollow shape.

The rail 720 is fixed to one side of the rail body 710 and extends in the vertical direction along the rail body 710.

The vertical moving plate 730 can move up and down along the rail 720 and the laser processing machine 500 and the electric discharge machine 600 are fixedly installed on one side. That is, the laser processing machine 500 and the electric discharge machine 600 can move integrally with the vertical movable plate 730.

The screw 740 may be provided inside the rail body 710, and one side thereof is rotatably fixed to the inner surface of the rail body 710. The vertically movable plate 730 is coupled to the vertical plate 730 such that the vertical movable plate 730 is moved in the vertical direction according to the direction in which the screw 740 is rotated.

At this time, a female screw thread may be formed on the outer surface of the screw 740 and a male screw thread corresponding to the screw thread is formed on the vertical movable plate 730. As the screw 740 rotates, 720).

The driving motor 750 is coupled to the other side of the screw 740 to provide a rotating force to the screw 740 and a servo motor 730 that rotates in one direction or the other direction so that the vertical movable plate 730 can move in the vertical direction, motor or a stepper motor.

Referring to FIGS. 1 and 4, a laser reflector 900 is further provided for reflecting the laser beam emitted from the laser processor 500 and selectively processing the rear surface of the object S by a user. The laser reflector 900 horizontally moves in the same direction as the X-axis movement module 300. That is, when the rear surface of the object S is to be processed, the laser reflector 900 can change the path of the laser beam emitted from the laser processor 500 from the upper surface to the rear surface of the object S to be processed.

1, a control unit 1000 for controlling the machining position of the object S and the operation of the laser processing machine 500, the electric discharge machine 600, and the laser reflecting unit 900 is provided.

Referring to FIG. 5, a discharge water tank 1100, which is seated on the table 200 and fixed to the table 200, is further provided. The discharge water tank 1100 has an opened top surface and the object to be processed S can be seated therein. An electrolytic solution may be supplied to the interior of the discharge water tank 1100 for electric discharge machining of the electric discharge machine 600.

The lower surface of the discharge water tank 1100 is formed of a transparent material that transmits a laser beam. That is, after the first processing hole S-1 and the second processing hole S-2 are formed on the upper and lower surfaces of the object S through the laser processing machine 500, the laser reflecting portion 900 And horizontally moves to reflect the laser beam to the lower surface of the object S. Thereafter, the reflected laser beam passes through the discharge water tank 1100 and the lower surface of the object S can be processed.

Referring to FIG. 7, after the first processing hole S-1 is formed in the object S, an electrolytic solution is supplied to the discharge water tank 1100. Then, when the spark of the electric discharge machine 600 is discharged to the same position as the first processing hole S-1, the third processing hole S-3, which is larger than the diameter and depth of the first processing hole S-1, . Then, a burr generated in the laser processing through the laser processing machine 500 is discharged to the upper side of the object along the electrolyte.

On the other hand, after the first and second processing holes S-1 and S-2 are formed on the object S, the third processing hole S-3 is processed through the electric discharge machine 600. [ Thereafter, the first processing hole S-1 and the second processing hole S-2 are communicated with each other and the burrs remaining in the first processing hole S-1 and the second processing hole S- Burr are discharged to the upper side and the lower side of the object to be processed along with the electrolytic solution. Accordingly, the machining area is reduced during the electrical discharge machining, so that the wear of the electric discharge machine 600 can be minimized, and the burr can be removed, thereby enabling accurate machining.

Another embodiment of the present invention will be described in detail with reference to FIG.

And a second table 1200 which moves integrally with the X-axis moving module 300 are provided. The second table 1200 is formed with a second processing hole 1201 passing through the second table 1200 vertically. The second table 1200 includes a discharge water tank 1100 'whose top surface is opened.

The main frame 100 further includes an object moving means 1300 for moving the object S by gripping the object S to be processed. That is, laser processing is performed on the object S in the corresponding area of the second table 1200 on which the second processing hole 1201 is formed. Thereafter, the object moving means 1300 grasps the object to be processed S, moves it to the discharge water tank 1100 ', and supplies the electrolytic solution to the discharge water tank 1100'. Therefore, laser processing can be performed on the upper and lower surfaces of the object S through the laser reflector 900 described above. Advantages of performing discharge machining after laser machining follow the above detailed description.

Referring to FIGS. 1 to 4, the laser reflector 900 includes a laser reflection module 910 and a drive means 920. The laser reflecting portion 900 is moved in such a manner that the laser beam irradiated on the upper surface of the object S passes through the processing hole 201 and the second processing hole 1201 and is irradiated to the lower surface of the object S, Change the path.

The driving unit 920 is controlled by the control unit 1000 and horizontally moves the laser reflection module 910 in the X axis direction. Thereafter, the laser reflecting module 910 receives the laser beam emitted from the laser machining apparatus 500 and processes the lower surface of the object S to be processed.

1 to 4, the laser reflection module 910 includes an upper guide tube 911, a first reflection lens 912, a second reflection lens 913, a second reflection lens 913, a connection tube 914 A third reflective lens 915, a lower guide tube 916, and a fourth reflective lens 917.

The upper guide tube 911 has a hollow tube shape and extends in the X-axis direction, and the laser beam passes through the hollow interior.

The first reflecting lens 912 is mounted on one side of the upper guide tube 911. The laser beam is received from the laser processing machine 500 and is reflected from one side of the upper guide tube 911 in the other direction.

The second reflective lens 912 is mounted on the other side of the upper guide tube 911 and reflects the laser beam reflected from the first reflective lens 912 in the vertical direction.

The connection tube 914 is hollow inside and extends in the vertical direction. A second reflection lens 913 is mounted on one side of the coupling tube 914, and the laser beam passes through the hollow interior. And is connected to the driving means 920.

The third reflecting lens 915 is mounted on the other side of the connecting tube 914. Then, the laser beam reflected from the second reflecting lens 913 is reflected in the horizontal direction.

The lower guide tube 916 is symmetrical with the upper guide tube 911 and has a hollow tube shape inside. At this time, one side of the lower guide tube 916 is connected to the third reflecting lens 915, and the reflected laser beam passes through the hollow inside. At this time, the lower guide tube 916 is inserted into the spaced space between the table 200 and the second table 1200 and the X-axis moving module 300.

The fourth reflecting lens 917 is mounted on the other side of the lower guide tube 916 and reflects the laser beam upward so that the laser beam reflected from the third reflecting lens 915 is irradiated on the lower surface of the object S .

In this case, the first reflecting lens 911 may be a beam splitter for reflecting part of the laser beam to be transmitted and transmitting a part of the laser beam for processing the upper and lower surfaces of the object S simultaneously.

Referring to FIG. 1, the Z-axis moving module 700 is further provided with a position correcting scanner 760 that scans the machining area of the object S to be processed. More specifically, the position correcting scanner 760 divides the surface of the object S, which has been processed by the laser beam irradiation on the object to be processed S, at regular intervals and scans the object. This is to divide the surface of the object S by a specific coordinate value. The control unit 1000 operates the X and Y axis movement modules 300 and 400 to identify the machining area machined by the laser beam on the object to be machined S, And the table 200 is moved so that the spark arrival point is located on the same vertical line as the machining area processed with the laser beam.

The position correction scanner 760 scans the machining area of the first object S and transmits the scanned coordinate values to the control unit 1000 to select a position to be machined, It can be processed by car. The position correction scanner 760 can scan the upper surface of the table 200, the second table 1200, or the discharge water tanks 1100 and 1100 ', not the surface of the object S. [

A reflecting lens 770 may be further disposed between the laser oscillating unit 800 and the position correcting scanner 760. The reflecting lens 770 selectively transmits the laser beam oscillated from the laser oscillating unit 800 to a laser processor 500 or the position correcting scanner 760 in the direction in which the position correcting scanner 760 is located. The laser beam passes through the reflective lens 770 and is reflected by the position correcting scanner 760 so that a specific wavelength of the laser beam reaches the position correcting scanner 760, A filter (not shown) may be additionally provided. The laser beam arriving at the position correcting scanner 770 is irradiated in a direction in which the upper surface of the table 200, the second table 1200, or the discharge water tanks 1100 and 1100 'are located.

That is, before the laser processing machine 500 processes the object to be processed, the reflecting lens 770 oscillates the laser beam with the position correcting scanner 760, and the laser beam reaching the position correcting scanner 760, The second table 1200 or the discharge water tanks 1100 and 1100 '(hereinafter referred to as the table 200)) on the surface of the object S to which the workpiece S is seated. At this time, the position correcting scanner 760 scans the position reached at a certain point and transmits the identified data to the control unit 1000.

The reflective lens 770 reflects the laser beam to the laser processor 500 and processes the object S located on the table 200. At this time, the table 200 moves in the X-axis and Y-axis directions to process the surface of the object S. When the processing of the laser processing machine 500 is completed, the reflecting lens 770 reflects the laser beam to the position correcting scanner 760. Thereafter, the position correcting scanner 760 identifies the arrival position of the laser beam identified by the initial position correcting scanner 760 and the arrival position of the laser beam emitted from the position correcting scanner 760, To the control unit (1000).

At this time, the controller 1000 analyzes the position where the first laser beam emitted from the position correcting scanner 760 reaches and the position of the laser beam irradiated on the table 200 after laser processing is completed, The table 200 is moved so that the position of the laser beam oscillated in the first table 200 coincides with the position of the laser beam arriving at the first table 200.

Thereafter, when the table 200 is aligned with the initial starting point, the electric discharge machine 600 can process the same position of the object S processed by the laser processing machine 500 in a second order.

[Example]

Fig. 8A shows that the object S is irradiated with a laser beam to form the first machining hole S-1, and Fig. 8B shows a state in which the laser beam is irradiated to the object S in the first machining hole S- And the second machining hole S-2 is formed in the workpiece S by the electric discharge machine being operated. It can be seen that the end face of the second machining hole S-2 and the surface of the machined surface are uniform and precise machining is performed.

9A shows a state in which the laser beam is continuously irradiated onto the object S and the table 200 is moved in the X axis or the Y axis so that the first processing hole S-1 is extended, Fig. 9 (b) shows an embodiment in which the discharge machining apparatus is continuously operated to form the second machining hole S-2 in the workpiece S. Fig.

100: main frame 110: bottom plate
120: support frame 200: table
300: X axis moving module 400: Y axis moving module
500: Laser processing machine 600: Electric discharge machine
700: Z axis movement module 710: Rail body
720: rail 730: vertical copper plate
740: screw 750: drive motor
760: Position Correction Scanner 770: Reflective Lens
800: laser oscillation part 900: laser reflection part
910: laser reflection module 911: upper guide tube
912: first reflection lens 913: second reflection lens
914: Connector 915: Third reflective lens
916: lower guide tube 917: fourth reflection lens
920: driving means 1000:
1100: discharge water tank 1200: second table
1300: object moving means

Claims (6)

A main frame (100) including a bottom plate (110) horizontal to the ground and a support frame (120) installed on the bottom plate (110);
A table 200 having a predetermined thickness, on which an object to be processed S is placed and on which a machining hole 201 is formed to penetrate in a vertical direction;
An X-axis moving module 300 fixed to a lower surface of the table 200 to horizontally move the table 200 in the X-axis while maintaining a predetermined spacing from the table 200;
A Y-axis moving module 400 fixed to the upper end of the X-axis moving module 300 and seated on the bottom plate 110 to horizontally move the X-axis moving module 300 in the Y-axis;
A laser processing machine 500 for irradiating a laser beam transmitted to the surface of the object S;
An electric discharge machine 600 for receiving a voltage from the outside and discharging sparks at the same position as the surface of the object S processed from the laser processor 500 to process the object;
A Z-axis movement module (not shown) that is coupled to the support frame 120 and moves up and down so as to adjust the focal point of the laser beam or the focus of the spark to be discharged, the laser processor 500 and the electric discharge machine 600, 700);
A laser oscillator 800 for emitting the laser beam to the laser processor 500;
A laser reflector 900 that horizontally moves in the same direction as the X-axis movement module 300 so as to selectively process a rear surface of the object S by reflecting a laser beam emitted from the laser processor 500;
A control unit 1000 for controlling the machining position of the object to be processed and the operation of the laser processing machine 500, the electric discharge machine 600, and the laser reflecting unit 900;
A discharge water tank (1100) fixed to the table (200) and on which the object (S) is placed; Respectively,
The bottom surface of the discharge water tank 1100 is formed of a material that transmits a laser beam so as to form a first processing hole S-1 and a second processing hole S-2 on the upper surface and the lower surface of the object S, Lt; / RTI >
When the electrolytic solution is supplied to the discharge water tank 1100, the spark of the electric discharge machine 600 is discharged to the first processing hole S-1, And a burr formed in the processing of the laser beam is discharged to the upper side and the lower side of the object to be processed along with the electrolytic solution. delete delete The method according to claim 1,
The laser reflector 900
A laser reflection module 910 for changing the movement path of the laser beam so that a laser beam irradiated on the upper surface of the object S passes through the processing hole 201 and is irradiated to the lower surface of the object S;
So as to horizontally move the laser reflection module 910 in the X-axis direction so that the laser reflection module 910 receives the laser beam emitted from the laser processing machine 500 when the lower surface of the object S is processed A drive means 920 connected to the laser reflection module 910;
And a high-quality laser composite processing apparatus. 5. The method of claim 4,
The laser reflection module 910
An upper guide tube (911) hollow inside and extending in the X axis direction;
A first reflective lens 912 mounted on one side of the upper guide tube 911 to receive and reflect the laser beam from the laser processing machine 500;
A second reflecting lens 913 mounted on the other side of the upper guide tube 911 and reflecting a laser beam reflected from the first reflecting lens 912;
A connection pipe 914 having a hollow interior and fitted with the second reflection lens 913 at one side and connected to the driving means 920;
A third reflecting lens 915 mounted on the other side of the coupling tube 914 and reflecting a laser beam reflected from the second reflecting lens 913;
The third reflective lens 915 is mounted on one side of the upper guide tube 911 and is symmetrical with the upper guide tube 911. The lower guide tube 915 is inserted into a spaced space between the table 200 and the X- 916);
A fourth reflecting lens 917 mounted on the other side of the lower guide tube 916 to irradiate the lower surface of the object S with the laser beam reflected from the third reflecting lens 915;
And a high-quality laser composite processing apparatus. 6. The method of claim 5,
Wherein the first reflecting lens 912 is a beam splitter that reflects part of the laser beam transmitted to process the upper surface and the lower surface of the object S simultaneously and transmits a part of the laser beam. High quality laser combined processing equipment.

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