TWM560126U - Boundary-joint laser-mark machine - Google Patents

Boundary-joint laser-mark machine Download PDF

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Publication number
TWM560126U
TWM560126U TW106218635U TW106218635U TWM560126U TW M560126 U TWM560126 U TW M560126U TW 106218635 U TW106218635 U TW 106218635U TW 106218635 U TW106218635 U TW 106218635U TW M560126 U TWM560126 U TW M560126U
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Taiwan
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marking
module
laser
image
partition
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TW106218635U
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Chinese (zh)
Inventor
于寧祥
柯幸宜
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新代科技股份有限公司
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Priority to TW106218635U priority Critical patent/TWM560126U/en
Publication of TWM560126U publication Critical patent/TWM560126U/en

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Abstract

A boundary-Joint Laser-mark machine includes a laser marking device, a laser source device and a visual device, wherein the laser marking device has a user interface for drawing figures and loading request data, and the arithmetic module according to the figures and the request data output readable data, galvanometer module used to drive the laser source device, the controller module to receive the controller module readable data and the galvanometer module sent by the information, and using them to compute then to obtain the preset value. The laser source device receives the preset value and then performs the marking on the workpiece.

Description

雷射打標分區接合裝置 Laser marking partitioning device

本新型有關於一種雷射打標裝置,特別是利用影像分區接合方法以進行雷射打標的雷射打標分區接合裝置。 The invention relates to a laser marking device, in particular to a laser marking partitioning device for performing laser marking using an image partitioning bonding method.

習知的雷射打標機是以雷射方式在工件表面形成文字、圖案等標記,與傳統的機械雕刻或化學蝕刻形成法相比,具有精度高、速度快、以及產生之標記具永久性等優點,因此在工業上,特別是積體電路工業中,所需的高精密度及高量產的IC標記,故雷射打標技術與裝置在工業中實屬重要。 The conventional laser marking machine forms marks, patterns and the like on the surface of the workpiece by laser, and has high precision, high speed, and permanent marking, compared with the conventional mechanical engraving or chemical etching forming method. Advantages, therefore, in the industrial, especially in the integrated circuit industry, the high precision and high volume of IC marking required, so laser marking technology and equipment is important in the industry.

一般雷射打標機包括了雷射源、控制卡與振鏡模組,其中雷射源是發出雷射光用,為配合速度快、精準度高等打標的特性,因此雷射打標機中的雷射源一般是脈衝雷射,搭配控制卡的使用,可即時的調整脈衝雷射的頻率、脈衝雷射的開關以及脈衝雷射的功率,以達到使用者的需求;控制卡則是用來發出指令,以命令以及控制振鏡模組的與雷射源的運作;振鏡模組則是調整雷射光在物體表面的成像品質用,光學模組中包括X方向振鏡模組與Y方向振鏡模組,實際打標是藉由調整兩個振鏡模組的旋轉角度,以控制雷射光點位置,但振鏡模組旋轉角度有其特定的範圍,造成雷射打標加工範圍亦有限,為達到大範圍的打標應用,會使用拼接方式,將大範圍圖形分成幾個小面積區,實際打標時是一區一區進行打標,並且 將這些區域進行拼接,即所謂分區打標,以同時滿足速度快與範圍大的需求。 The general laser marking machine includes a laser source, a control card and a galvanometer module, wherein the laser source is used for emitting laser light, and is characterized by fast speed and high precision, so that the laser marking machine The laser source is generally a pulsed laser. With the use of a control card, the frequency of the pulsed laser, the pulsed laser switch and the pulsed laser power can be adjusted in real time to meet the user's needs; the control card is used to Commands are issued to command and control the operation of the galvanometer module and the laser source; the galvanometer module is used to adjust the imaging quality of the laser light on the surface of the object, and the optical module includes the X-direction galvanometer module and the Y direction. The galvanometer module, the actual marking is to adjust the rotation angle of the two galvanometer modules to control the position of the laser spot, but the rotation angle of the galvanometer module has its specific range, resulting in the laser marking processing range. Limited, in order to achieve a wide range of marking applications, the splicing method will be used to divide the large-scale graphics into several small areas, and the actual marking is one area and one area for marking, and These areas are spliced, so-called partition marking, to meet the needs of both fast and wide range.

參考圖1,圖1是傳統雷射打標機進行打標時,雷射源在工件上照射後的軌跡示意圖。在圖1中,元件符號90是表示預計打標圖樣,指的是使用者想要在工件9上形成的圖形,此預計打標圖樣90會以電子檔案方式儲存在控制卡(圖1未示)中,控制卡會將具有預計打標圖樣90的電子檔案轉換成雷射源(圖1未示)可已讀取的訊號,以驅動雷射源進行打標。打標時,雷射源會在工件9上形成多個雷射點,不同時間下的雷射點的集合構成雷射源軌跡91,圖1顯示在打標過程中,從起始到終了的雷射源軌跡91的散布圖,打標過程從打標起點91S起始,至打標終點91E結束,但為了確保雷射源軌跡91在真正進行打標過程時,與預計打標圖樣90的打標起點91S與打標終點91E的位置一致,控制卡中會設計有延遲參數,先等待振鏡模組運作一段時間後,雷射點到達預計打標圖樣90的打標起點91S與打標終點91E再進行打標過程或停止打標過程,在打標過程中,雷射源是保持等速度移動的,但是雷射源在打標起點91S之前,或是在打標終點91E之後,始終保持開啟的狀態,如此一來,從零速加速到加工速度,或是從加工速度減速到零速,在行進速度低於加工速度的區域較慢的起終點段,就容易因為單位距離內聚集較多的雷射能量,而讓實際打標圖樣92看起來像是火柴頭,且在分區打標時,具有火柴頭形狀的實際打標圖樣92造成了區間的邊界特別的明顯,故容易造成整張圖在接圖部分具有缺陷。 Referring to FIG. 1, FIG. 1 is a schematic diagram of a trajectory of a laser source after being irradiated on a workpiece by a conventional laser marking machine. In FIG. 1, the component symbol 90 is an indication of an expected marking, and refers to a graphic that the user wants to form on the workpiece 9. The expected marking pattern 90 is stored in an electronic file on the control card (not shown in FIG. 1). In the control card, the electronic file with the expected marking pattern 90 is converted into a signal that the laser source (not shown in FIG. 1) can read to drive the laser source for marking. When marking, the laser source will form multiple laser spots on the workpiece 9. The collection of laser points at different times constitutes the laser source trajectory 91. Figure 1 shows the marking process from start to finish. The scatter diagram of the laser source trajectory 91, the marking process starts from the marking starting point 91S, and ends at the marking end point 91E, but in order to ensure that the laser source trajectory 91 is actually marking the process, and the expected marking pattern 90 The marking starting point 91S is consistent with the marking end point 91E, and the delay parameter is designed in the control card. After waiting for the galvanometer module to operate for a period of time, the laser point reaches the marking starting point 91S and marking of the expected marking pattern 90. At the end point 91E, the marking process is repeated or the marking process is stopped. During the marking process, the laser source is kept moving at the same speed, but the laser source is always before the marking start point 91S or after the marking end point 91E. Keep it open, so that it accelerates from zero speed to machining speed, or decelerates from machining speed to zero speed. It is easy to gather in unit distance at the slower starting point in the area where the traveling speed is lower than the machining speed. More laser energy, let The marking pattern 92 looks like a match head, and when marking the partition, the actual marking pattern 92 with the shape of the match head causes the boundary of the section to be particularly conspicuous, so that the entire drawing is likely to have defects in the connecting part. .

另外,由於控制卡發送命令與振鏡模組(圖1未示)實際動作的不同步,以及伺服落後與雷射開關光落後,造成打標打不到目標位置,在開關光的邊界出現沒加工到的縫隙,造成分區接縫明顯。舉例而言,預計打標圖樣90的起始點處,伺服落後造成振鏡模組較晚到位,使打標起點91S 較預計打標圖樣90的起點往前,較常發生雷射出光過慢比伺服落後量更多;而雷射源軌跡91E較預計打標圖樣90的終點往後,目標起點處沒有加工到;在終點處,伺服落後造成實際關光點往前,雷射關光落後則讓實際關光點往後,而較常發生雷射關光快於伺服落後量,實際關光點較命令關光點更前面,目標終點處沒有加工到。 In addition, because the control card sends commands and the oscillating mirror module (not shown in Figure 1), the actual operation is not synchronized, and the servo is behind and the laser switch is behind, causing the marking to fail to hit the target position, and there is no boundary at the switching light. The gaps are processed, resulting in obvious seams in the partition. For example, it is expected that at the starting point of the marking pattern 90, the servo lag will cause the galvanometer module to be late, so that the marking starting point is 91S. Compared with the starting point of the expected marking pattern 90, the laser light emission is more slowly than the servo backward amount; while the laser source trajectory 91E is later than the end point of the expected marking pattern 90, the target starting point is not processed; At the end point, the servo is behind and the actual light-off point is forward. When the laser is off, the actual light-off point is backward. The laser light is more frequent than the servo backward. The actual light-off point is closer to the command. The point is further ahead and the target end point is not processed.

再者,於另一習知技術則是影像拼接打標方式,如圖2所示,圖2是傳統雷射打標機使用拼接方式進行打標的示意圖,當使用者提出預計打標圖樣98時,雷射打標機內的控制卡會將預計打標圖樣98拆成兩部分,即預計打標圖樣第一部分98A與預計打標圖樣第二部分98B,實際進行打標過程時,雷射源會在工件上根據預計打標圖樣第一部分98A與預計打標圖樣第二部分98B形成雷射源軌跡第一部分99A與雷射源軌跡第二部分99B,其中這兩者具有雷射源軌跡重疊部分99C。此雷射源軌跡重疊部分99C會進行兩次雷射打標,以讓原本打標過程中較不清晰的地方打標兩次以使其更清晰,最終以形成實際打標圖樣99,此方法通過雷射源軌跡重疊部分去接合分區圖形,使打標清晰,但是雷射源軌跡重疊部分99C容易對位不明,所以在雷射源軌跡重疊部分99C容易接圖錯誤與打標錯誤,且無處理加減速的起終點,在雷射源軌跡重疊部分99C容易發生如圖1中實際打標圖樣92所表示的火柴頭圖形。 Furthermore, another conventional technique is an image mosaic marking method, as shown in FIG. 2, and FIG. 2 is a schematic diagram of a conventional laser marking machine using a splicing method for marking, when the user proposes an expected marking pattern 98. The control card in the laser marking machine will split the expected marking pattern 98 into two parts, that is, the first part of the marking pattern 98A and the second part of the expected marking pattern 98B, when the marking process is actually performed, the laser source A laser source trajectory first portion 99A and a laser source trajectory second portion 99B are formed on the workpiece according to the predicted marking pattern first portion 98A and the predicted marking pattern second portion 98B, wherein the two have overlapping portions of the laser source trajectory 99C. The laser source track overlap portion 99C performs two laser markings to mark the less clear places in the original marking process to make it clearer, and finally forms the actual marking pattern 99. Through the overlap of the laser source trajectory to join the partition pattern, the marking is clear, but the overlapping of the laser source trajectory 99C is easy to align, so the 99C in the overlap of the laser source trajectory is easy to connect and the marking error, and no When the start and end of the acceleration/deceleration are processed, the match head pattern represented by the actual marking pattern 92 in Fig. 1 is likely to occur in the laser source track overlapping portion 99C.

有鑑於上述習知技術的缺失,本創作的主要目的是利用雷射打標分區接合裝置,不但可透過一再的分區打標以修正分區打標影像外,同時更經由視覺裝置以電腦判定分區打標影像的良窳,大幅減少人為判別之誤 差,修正時更考慮了振鏡模組的資料,進行插值運算以考慮到預設值,避免接圖錯誤以及打標錯誤。 In view of the above-mentioned shortcomings of the prior art, the main purpose of the present invention is to use the laser marking partitioning device to not only correct the partition marking image through repeated partition marking, but also to determine the partition by computer using a visual device. The good image of the standard image greatly reduces the mistake of human discrimination Poor, the correction of the galvanometer module data, interpolation calculations to take into account the default value, to avoid connection errors and marking errors.

本創作的另一目的在於:使用本創作所提供的雷射打標分區接合裝置,可以即時的反饋分區打標影像的判定結果,且使用者可以根據警示訊號即時輸入請求資料調整打標分區打標影像,不需要等待整個打標影像完成後即可以即時調整。 Another purpose of the creation is to use the laser marking partitioning device provided by the present invention to instantly feedback the determination result of the zone marking image, and the user can instantly input the request data according to the warning signal to adjust the marking zone. The target image can be adjusted instantly without waiting for the entire marked image to be completed.

本創作的另一目的在於:使用本創作所提出的雷射打標分區接合方法,藉由將原始多個打標節點增加了不開光的多個挪動節點延伸段,不但可以維持原來分區打標時雷射源裝置的等速度運動,並且防止原來分區打標時所造成的火柴頭現象。 Another purpose of the present invention is to use the laser marking partition bonding method proposed by the present invention to maintain the original partition marking by adding a plurality of moving node extensions that do not open the original plurality of marking nodes. The equal-speed movement of the laser source device and the prevention of the match head phenomenon caused by the original partition marking.

因此根據上述目的,本創作揭露一種雷射打標分區接合裝置,包括雷射打標裝置、雷射源裝置及視覺裝置,其中雷射打標裝置具有:使用者介面用以繪製圖形與匯入請求資料、運算模組根據圖形與請求資料輸出可讀資料、振鏡模組用以帶動雷射源裝置、控制器模組接收可讀資料與振鏡模組所傳送的振鏡資料後,對可讀資料及振鏡模組所傳送的振鏡資料進行插值運算,以得到接圖參數預設值;雷射源裝置,接收接圖參數預設值後,在工件上進行分區打標。 Therefore, according to the above object, the present invention discloses a laser marking partitioning device, including a laser marking device, a laser source device and a visual device, wherein the laser marking device has a user interface for drawing graphics and importing The request data and the operation module output the readable data according to the graphic and the request data, and the galvanometer module is used to drive the laser source device and the controller module to receive the readable data and the galvanometer data transmitted by the galvanometer module, The readable data and the galvanometer data transmitted by the galvanometer module are interpolated to obtain a preset value of the connection parameter; the laser source device receives the preset value of the connection parameter and performs zone marking on the workpiece.

根據上述目的,本創作另外提供一種雷射打標分區接合方法,包括:取得圖形的第一分區;根據圖形的第一分區,規劃多個第一打標節點,並決定第一打標節點中的等速度段起點與一等速度段終點;將第一打標節點賦予座標值與能量值;將賦予座標值與能量值的第一打標節點與振鏡模組的座標值插值運算,以獲得第一接圖參數預設值;雷射源裝置根據第一接圖參數預設值對於工件進行第一分區打標;取得圖形的另一分區,並根據圖形的另一分區,規劃多個第二打標節點,並決定第二打標節點中的一 等速度段起點與一等速度段終點,並將第二打標節點賦予座標值與能量值,其中第二打標節點中的等速度段起點與第一打標節點中的等速度段終點的座標值相同;將具有座標值與能量值的第二打標節點與振鏡模組的座標值插值運算,以獲得第二接圖參數預設值;以及雷射源裝置根據第二接圖參數預設值進行另一分區打標。 According to the above object, the present invention further provides a laser marking partition bonding method, comprising: obtaining a first partition of a graphic; planning a plurality of first marking nodes according to a first partition of the graphic, and determining the first marking node The starting point of the constant velocity segment and the end point of the first velocity segment; assigning the first marking node to the coordinate value and the energy value; interpolating the coordinate value of the first marking node and the galvanometer module of the coordinate value and the energy value to Obtaining a preset value of the first connection parameter; the laser source device performs first partition marking on the workpiece according to the preset value of the first connection parameter; acquiring another partition of the graphic, and planning multiple according to another partition of the graphic a second marking node and determining one of the second marking nodes The starting point of the constant velocity segment and the end point of the first velocity segment, and the second marking node is given a coordinate value and an energy value, wherein the starting point of the constant velocity segment in the second marking node and the end point of the constant velocity segment in the first marking node The coordinate value is the same; the coordinate value of the second marking node having the coordinate value and the energy value and the coordinate value of the galvanometer module are interpolated to obtain the preset value of the second connection parameter; and the laser source device according to the second connection parameter The preset value is marked for another partition.

1‧‧‧雷射打標分區接合裝置 1‧‧‧Laser marking partition joint device

100‧‧‧第一分區預計打標圖樣 100‧‧‧The first division is expected to mark the pattern

102‧‧‧第一分區實際打標圖樣 102‧‧‧The actual marking pattern of the first division

11‧‧‧雷射打標裝置 11‧‧‧Laser marking device

111‧‧‧使用者介面 111‧‧‧User interface

112‧‧‧運算模組 112‧‧‧ Computing Module

1121‧‧‧路徑規劃模組 1121‧‧‧Path Planning Module

1122‧‧‧能量運算模組 1122‧‧‧Energy computing module

113‧‧‧控制器模組 113‧‧‧Controller Module

1131‧‧‧插值計算模組 1131‧‧‧Interpolation calculation module

1132‧‧‧命令輸出模組 1132‧‧‧Command Output Module

114‧‧‧振鏡模組 114‧‧‧ galvanometer module

12‧‧‧視覺裝置 12‧‧‧Visual device

121‧‧‧影像擷取模組 121‧‧‧Image capture module

122‧‧‧影像比對模組 122‧‧‧Image comparison module

1221‧‧‧影像處理模組 1221‧‧‧Image Processing Module

1222‧‧‧辨識模組 1222‧‧‧ Identification Module

1223‧‧‧比對模組 1223‧‧‧ alignment module

1223A‧‧‧資料庫 1223A‧‧ ‧ Database

13‧‧‧雷射源裝置 13‧‧‧Laser source device

9,14‧‧‧工件 9,14‧‧‧Workpiece

14A‧‧‧打標節點、第一打標節點、第二打標節點 14A‧‧‧ marking node, first marking node, second marking node

14B‧‧‧挪動節點 14B‧‧‧Nove the node

14C‧‧‧等速度段起點 14C‧‧‧ and other speed segment starting points

14D‧‧‧等速度段終點 End of speed segment such as 14D‧‧‧

14S‧‧‧加速度段 14S‧‧ acceleration section

14M‧‧‧等速度段 Speed range of 14M‧‧‧

14E‧‧‧減速度段 14E‧‧‧Deceleration section

t‧‧‧距離 Distance from t‧‧‧

90‧‧‧預計打標圖樣 90‧‧‧ Expected marking pattern

98‧‧‧預計打標圖樣 98‧‧‧ Expected marking pattern

98A‧‧‧預計打標圖樣第一部分 98A‧‧‧ Expected marking part 1

98B‧‧‧預計打標圖樣第二部分 98B‧‧‧ Expected marking part 2

91‧‧‧雷射源軌跡 91‧‧‧Laser source track

91S‧‧‧打標起點 91S‧‧‧ marking starting point

91E‧‧‧打標終點 91E‧‧‧Marking end point

92‧‧‧實際打標圖樣 92‧‧‧ actual marking pattern

99‧‧‧實際打標圖樣 99‧‧‧ actual marking pattern

99A‧‧‧雷射源軌跡第一部分 99A‧‧‧Laser source track first part

99B‧‧‧雷射源軌跡第二部分 99B‧‧‧Laser source track second part

99C‧‧‧雷射源軌跡重疊部分 99C‧‧‧Laser source track overlap

F1~F10‧‧‧雷射打標分區接合方法執行流程 F1~F10‧‧‧ laser marking partitioning method execution process

圖1是表示傳統雷射打標機進行打標時,雷射源在工件上照射後的軌跡示意圖;圖2是表示傳統雷射打標機使用拼接方式進行打標的示意圖;圖3是根據本創作所揭露的技術,表示本創作所提供之雷射打標分區接合裝置及內部構件之示意圖;圖4是根據本創作所揭露的技術,表示本創作所提供之雷射打標分區接合裝置在進行分區打標時之示意圖;圖5是根據本創作所揭露的技術,表示本創作所提供之雷射打標分區接合裝置在進行分區打標時,另一實施例之示意圖;圖6A至圖6D是根據本創作所揭露的技術,表示本創作所提供之雷射打標分區接合方法的運作時,打標節點的示意圖;以及圖7是根據本創作所揭露的技術,表示本創作所提供之雷射打標分區接合方法之執行步驟流程圖。 1 is a schematic view showing a trajectory of a laser source after being irradiated on a workpiece by a conventional laser marking machine; FIG. 2 is a schematic view showing a conventional laser marking machine using a splicing method for marking; FIG. The technology disclosed in the creation represents a schematic diagram of the laser marking partition joint device and internal components provided by the present creation; FIG. 4 is a technique according to the present disclosure, showing that the laser marking partition joint device provided by the present invention is FIG. 5 is a schematic diagram showing another embodiment of the laser marking partitioning device provided by the present invention when partition marking is performed according to the technology disclosed in the present invention; FIG. 6A to FIG. 6D is a schematic diagram of a marking node when the laser marking partition bonding method provided by the present invention is operated according to the technology disclosed in the present invention; and FIG. 7 is a technique according to the present disclosure, which is provided by the present invention. A flow chart of the execution steps of the laser marking partition bonding method.

為使貴審查委員對於本創作之結構目的和功效有更進一步之了解與認同,茲配合圖示詳細說明如後。以下將參照圖式來描述為達成本創作目的所使用的技術手段與功效,而以下圖式所列舉之實施例僅為輔助說明,以利貴審查委員瞭解,但本案之技術手段並不限於所列舉圖式。 In order to enable your review committee to have a better understanding and recognition of the structural purpose and efficacy of this creation, please refer to the detailed description of the illustration as follows. The technical means and functions used to achieve the purpose of the present invention will be described below with reference to the drawings, and the embodiments listed in the following drawings are only for the purpose of explanation, and are to be understood by the reviewing committee, but the technical means of the present invention are not limited to the enumerated figure.

首先請參考圖3,圖3表示本創作所提供之雷射打標分區接合裝置1的內部構件示意圖。雷射打標分區接合裝置1用以在工件14上進行分區打標,其包括雷射打標裝置11、視覺裝置12及雷射源裝置13。雷射打標分區接合裝置1可為一殼體(圖未示),用以包覆住雷射打標裝置11、視覺裝置12及雷射源裝置13,雷射打標裝置11、視覺裝置12及雷射源裝置13都是以模組(module)的方式設置在雷射打標分區裝置1的殼體內,該些裝置可為空間獨立,但三者裝置電性相連。另外,雷射源裝置13與工件14以無線方式電性連接,視覺裝置12與工件14電性連接。在本創作的實施例中,雷射打標裝置11用以驅動雷射源裝置13,雷射源裝置13接收由雷射打標裝置11所傳送的接圖參數預設值後,在工件14上進行分區打標,視覺裝置12用以擷取工件14上的分區打標影像,並進行比對,以將比對後的影像判別結果回傳給雷射打標裝置11,雷射打標裝置11、視覺裝置12、雷射源裝置13在工件14上的詳細操作如下所述。 First, please refer to FIG. 3. FIG. 3 is a schematic diagram showing the internal components of the laser marking zone bonding device 1 provided by the present invention. The laser marking zone bonding device 1 is used for zone marking on the workpiece 14, which comprises a laser marking device 11, a vision device 12 and a laser source device 13. The laser marking partitioning device 1 can be a casing (not shown) for covering the laser marking device 11, the visual device 12 and the laser source device 13, the laser marking device 11, and the visual device. 12 and the laser source device 13 are all disposed in the casing of the laser marking partitioning device 1 in a modular manner. The devices may be spatially independent, but the three devices are electrically connected. In addition, the laser source device 13 is electrically connected to the workpiece 14 in a wireless manner, and the vision device 12 is electrically connected to the workpiece 14 . In the embodiment of the present invention, the laser marking device 11 is used to drive the laser source device 13, and the laser source device 13 receives the preset values of the interface parameters transmitted by the laser marking device 11 after the workpiece 14 is The partitioning is performed on the partitioning device, and the visual device 12 is configured to capture the partition marking image on the workpiece 14 and perform comparison to return the compared image discriminating result to the laser marking device 11, and the laser marking device The detailed operation of the device 11, the vision device 12, and the laser source device 13 on the workpiece 14 is as follows.

在使用者開啟(turn on)此雷射打標分區接合裝置1後,會先繪製圖形,雷射打標分區接合裝置1就會依照圖形與雷射打標裝置11所傳來的請求資料於工件14中進行第一分區打標,在本創作中,分區打標指的是將圖形中的某一個區域以雷射轉印的方式轉印到工件14上,在本創作的一個實施例中,若圖形是一個英文字”Word”時,則雷射打標分區接合裝置1就會將具有Word的圖形分成兩個分區,第一分區是”Wor”及第二分區,是”rd”,此雷射打標分區接合裝置1就會針對第一分區,在工件14上進行”Wor”打 標,對第一分區打標的時間在本實施例中定義為第一時間;在下一個時間,即第二時間針對第二分區,在工件14上進行”rd”打標。在此要說明的是,對於圖形上,圖形上分區的數量並不在本創作所限制的範圍內,圖形要如何分區也可以由使用者來定義,因此,於另一實施例中,針對英文字”Word”的第一分區可以是”Wo”,第二分區可以是”ord”,其分區的原則是在第一分區與第二分區之間需要有重覆的字元或是圖形;如前述實施例中,第一分區為”Wor”及第二分區為”rd”,兩者之間重覆的字元或是圖形則是”r”;於另一實施例中,第一分區為”Wo”及第二分區為”ord”則兩者之間重覆的字元或是圖形則是”o”。 After the user turns on the laser marking zone bonding device 1, the graphic is drawn first, and the laser marking zone bonding device 1 follows the graphics and the request data transmitted by the laser marking device 11. The first partition marking is performed in the workpiece 14. In the present creation, the partition marking refers to transferring a certain area in the graphic to the workpiece 14 by laser transfer, in one embodiment of the present creation. If the graphic is an English word "Word", the laser marking partitioning device 1 divides the graphic with Word into two partitions, the first partition is "Wor" and the second partition is "rd". The laser marking zone bonding device 1 will perform a "Wor" on the workpiece 14 for the first partition. The time for marking the first partition is defined as the first time in this embodiment; at the next time, that is, the second time, the "rd" is marked on the workpiece 14 for the second partition. It should be noted that, for the graphic, the number of partitions on the graphic is not within the scope of the present invention, and how the graphics are partitioned can also be defined by the user. Therefore, in another embodiment, the English word is used. The first partition of "Word" may be "Wo", and the second partition may be "ord". The principle of partitioning is that there is a need for repeated characters or graphics between the first partition and the second partition; In an embodiment, the first partition is "Wor" and the second partition is "rd", and the repeated characters or graphics between the two are "r"; in another embodiment, the first partition is "" Wo" and the second partition are "ord", then the repeated characters or graphics between the two are "o".

在第一分區於工件14進行打標之後,雷射打標分區接合裝置1中的視覺裝置12就會對工件上的打標圖像與儲存在視覺裝置中的預定影像進行比對,並將比對之後得到的影像判別結果回傳給雷射打標裝置11,此時雷射打標裝置11會發出警示訊息,此警示訊息包括正常提示、接漏提示與火柴頭提示,此警示訊息可以是一種燈號訊息,例如正常提示是連續閃爍的綠燈燈號、接漏提示是連續閃爍的黃燈燈號,與火柴頭提示連續閃爍的紅燈燈號。使用者可根據警示訊息的內容,在下一時間向雷射打標裝置11提出請求資料。在一實施例中,當使用者接收到的警示訊息為正常提示時,即表示影像判別結果是打標圖樣和實際圖樣相符合,就會向雷射打標分區接合裝置1提出繼續工作的請求資料;於另一實施例,當使用者接收到的警示訊息為接漏提示時,表示打標圖樣和實際圖樣之間有部份字元或是圖形有缺陷無法接續,此時,就會向雷射打標分區接合裝置1提出增加雷射能量的請求資料;於另一實施例中,當使用者接收到的警示訊息為火柴頭提示時,表示施加的雷射能量過多而造成打標圖樣大於實際圖樣,造成打標圖樣中就會有火柴頭圖形出現,這時就會向雷射打標分區接合裝置1提出減少 雷射能量的請求資料,經過向雷射打標分區接合裝置1多次的提出請求資料後,若是使用者得到正常提示時,並向雷射打標分區接合裝置1提出繼續工作的請求資料後,就可結束上述調整程序,雷射打標分區接合裝置1接著就會自行運作以完成該圖形”Word”的整體打標影像,即將”Word”中的第一分區”Wor”與第二分區”rd”完成接合,此即為所謂的分區接合。 After the first zone is marked on the workpiece 14, the vision device 12 in the laser marking zone bonding device 1 compares the marking image on the workpiece with the predetermined image stored in the visual device, and The image discriminating result obtained after the comparison is transmitted back to the laser marking device 11, and the laser marking device 11 sends a warning message, the warning message includes a normal prompt, a leak prompt and a match head prompt, and the warning message can be It is a kind of signal message. For example, the normal prompt is a continuous flashing green light, the leak prompt is a continuous flashing yellow light, and the red light of the match head prompts continuously flashing. The user can make a request for the information to the laser marking device 11 at the next time according to the content of the warning message. In an embodiment, when the warning message received by the user is a normal prompt, that is, the image discrimination result is that the marking pattern is consistent with the actual pattern, the laser marking partitioning device 1 is requested to continue working. In another embodiment, when the warning message received by the user is a leak indication, it indicates that some characters or patterns between the marking pattern and the actual pattern cannot be connected, and then, The laser marking partitioning device 1 proposes a request material for increasing the laser energy; in another embodiment, when the warning message received by the user is a match head prompt, it indicates that the applied laser energy is excessive and the marking pattern is caused. If it is larger than the actual pattern, there will be a match head pattern in the marking pattern. At this time, the laser marking partitioning device 1 will be reduced. The request data of the laser energy is sent to the laser marking partitioning device 1 for a plurality of requests, and if the user obtains the normal information, and the laser marking partitioning device 1 is requested to continue working, The above adjustment procedure can be ended, and the laser marking partitioning device 1 will then operate by itself to complete the overall marking image of the graphic "Word", that is, the first partition "Wor" and the second partition in "Word" "rd" completes the joint, which is the so-called partition joint.

接著請參考圖4,圖4表示本創作所提供之雷射打標分區接合裝置1在進行分區打標時的示意圖。在此要說明的是,於本創作中,在圖4中並未將雷射打標分區接合裝置1的全部構件顯示出來,僅將與本實施例中相關的元件標示出。雷射打標裝置11具有使用者介面111、運算模組112、控制器模組113以及振鏡模組114,使用者介面111用以供使用者繪製圖形與匯入請求資料,在本創作的一實施例中,使用者介面111是由觸控式螢幕以及軟體圖形介面(GUI)所組成,使用者可將其所想要實現的打標軌跡直接繪製在使用者介面111上以形成圖形,或是將圖形預先在其他的終端裝置上繪製完成後,以檔案形式,經由使用者介面111輸入至雷射打標裝置11。另外,匯入請求資料指的是使用者將一些分區打標時所要運用到的參數,透過使用者介面111輸入至雷射打標裝置11,這些參數例如是雷射能量大小或是打標時間等;運算模組112則根據上述圖形與匯入請求資料以輸出可讀資料,此可讀資料中所稱的「可讀」,指的是控制器模組113可讀的(readable)資料格式。 Next, please refer to FIG. 4. FIG. 4 is a schematic diagram showing the laser marking partition bonding apparatus 1 provided by the present invention when performing partition marking. It is to be noted that, in the present creation, all the members of the laser marking zone joining device 1 are not shown in Fig. 4, and only the elements related to the present embodiment are indicated. The laser marking device 11 has a user interface 111, a computing module 112, a controller module 113, and a galvanometer module 114. The user interface 111 is used for the user to draw graphics and import request data. In one embodiment, the user interface 111 is composed of a touch screen and a software graphics interface (GUI), and the user can directly draw the marking track that is desired to be implemented on the user interface 111 to form a graphic. Alternatively, the graphics are pre-printed on other terminal devices, and then input to the laser marking device 11 via the user interface 111 in the form of a file. In addition, the import request data refers to parameters that are used by the user when marking some partitions, and are input to the laser marking device 11 through the user interface 111, such as the laser energy size or the marking time. The computing module 112 outputs the readable data according to the graphics and the import request data. The readable data in the readable data refers to the readable data format of the controller module 113. .

請繼續參考圖4,運算模組112具有路徑規劃模組1121與能量運算模組1122,路徑規劃模組1121用以規劃雷射源裝置13進行分區打標時的多個打標節點(圖4未示)的多個座標,每一個打標節點對應一個座標。例如圖形是一個圓形時,路徑規劃模組1121就會將此圓形拆解成20個節點,節點與節點之間距離至少1mm,並以此圓形的圓心為原點,根據X-Y座標系,將此20個節點都給予一個特定的座標值,並將此20個節點分別以定義,例 如形成第一個節點是A1(1,0)、第二個節點是A2(2,0),以此類推至第20個節點是A20(20,0),以供雷射源裝置13在進行分區打標時對準用,座標值是採用圖形座標系,此座標系是以卡式座標系的X-Y座標系定義,原點是在圖形的質心;能量運算模組1122則用以安排打標節點14A的能量值陣列,並將打標節點14A的座標與能量值陣列打包,打包就是形成封包(packaging)轉成控制器模組113的可讀資料,並將此可讀資料傳送至控制器模組113,在本創作的實施例中,可讀資料可以是數值控制碼,即NC碼,所謂數值控制碼就是將使用者所需要的各種控制資料,例如:主軸轉速、加工的條件以及工件的尺寸等,製作成一系列的數值指令,輸入控制器內,形成電腦數值控制工具機(CNC machine)可讀的資料,以控制該工具機運作。打標節點14A的能量值陣列可以是一個5*5的矩陣,在此陣列中,每一個元素編排順序是按照上述路徑規劃模組1121的命名順序,由左至右且由上而下排列,每一個元素表示一個雷射能量值,代表此特定節點所需要的雷射能量。 Referring to FIG. 4, the computing module 112 has a path planning module 1121 and an energy computing module 1122. The path planning module 1121 is used to plan multiple marking nodes when the laser source device 13 performs zone marking (FIG. 4). A plurality of coordinates, not shown, each of which corresponds to a coordinate. For example, when the graphic is a circle, the path planning module 1121 will disassemble the circle into 20 nodes, and the distance between the node and the node is at least 1 mm, and the center of the circle is taken as the origin, according to the XY coordinate system. , all 20 nodes are given a specific coordinate value, and the 20 nodes are respectively defined, for example, the first node is A 1 (1, 0), and the second node is A 2 (2, 0) ), and so on to the 20th node is A 20 (20,0) for the laser source device 13 to align when performing zone marking, the coordinate value is a graphic coordinate system, the coordinate system is a card type The XY coordinate system of the coordinate system is defined, and the origin is at the centroid of the graphic; the energy operation module 1122 is used to arrange the energy value array of the marking node 14A, and package and coordinate the coordinate and the energy value array of the marking node 14A. That is, the readable data that is converted into the controller module 113 is formed, and the readable data is transmitted to the controller module 113. In the embodiment of the present invention, the readable data may be a numerical control code, that is, The NC code, the so-called numerical control code, is the various control data that the user needs, such as: The spindle speed, the machining conditions, and the size of the workpiece are created into a series of numerical commands that are input into the controller to form a computer-readable information machine (CNC machine) to control the operation of the machine. The array of energy values of the marking node 14A may be a 5*5 matrix. In this array, each element is arranged in the order of the path planning module 1121, from left to right and from top to bottom. Each element represents a laser energy value that represents the laser energy required for that particular node.

請繼續參考圖4,雷射打標裝置11中控制器模組113更包含插值計算模組1131與命令輸出模組1132。控制器模組113接收由能量運算模組1122所傳送的可讀資料以及振鏡模組114所傳送的振鏡資料後,利用插值計算模組1131將可讀資料與振鏡模組114所傳送的振鏡資料進行插值運算之後,得到接圖參數預設值,接著利用命令輸出模組1132將接圖參數預設值傳送給雷射源裝置13。雷射源裝置13接收接圖參數預設值之後,就會根據接圖參數預設值發出雷射光,並且在工件14上進行分區打標。要說明的是,接圖參數預設值是參考了原始使用者所設定的資料與振鏡模組114以及雷射源裝置13的振鏡資料所形成的,因此使分區打標的精確度提升。 Referring to FIG. 4 , the controller module 113 of the laser marking device 11 further includes an interpolation calculation module 1131 and a command output module 1132 . The controller module 113 receives the readable data transmitted by the energy calculation module 1122 and the galvanometer data transmitted by the galvanometer module 114, and then transmits the readable data and the galvanometer module 114 by using the interpolation calculation module 1131. After the galvanometer data is subjected to the interpolation operation, the preset value of the connection parameter is obtained, and then the command output module 1132 is used to transmit the preset value of the connection parameter to the laser source device 13. After receiving the preset value of the connection parameter, the laser source device 13 emits laser light according to the preset value of the connection parameter, and performs zone marking on the workpiece 14. It should be noted that the preset value of the connection parameter is formed by referring to the data set by the original user and the galvanometer module 114 and the galvanometer data of the laser source device 13, thereby improving the accuracy of the partition marking.

雷射打標裝置11中的振鏡模組114用以帶動雷射源裝置13,此振鏡模組114架構是相同於習知的雷射打標機,具有振鏡電機(圖未示)與振鏡 鏡片(圖未示)。振鏡模組114在未進行分區打標時,仍具有一些初始值(preset value/default),例如振鏡電機與振鏡鏡片的原始位置;在打標後會時或打標後會存在處理值(process value),例如振鏡電機與振鏡鏡片在打標時不同時間的不同位置,這些初始值以及處理值構成了所謂的振鏡資料。在不同次打標時,加入振鏡資料可以動態的調整打標,讓打標點更能符合使用者所需。 The galvanometer module 114 in the laser marking device 11 is used to drive the laser source device 13. The galvanometer module 114 has the same structure as the conventional laser marking machine, and has a galvanometer motor (not shown). And galvanometer Lens (not shown). The galvanometer module 114 still has some initial values (preset value/default) when the partitioning is not performed, such as the original position of the galvanometer motor and the galvanometer lens; there will be processing after the marking or after marking The process value, such as the different positions of the galvanometer motor and the galvanometer lens at different times during the marking, these initial values and processing values constitute the so-called galvanometer data. When marking different times, adding galvanometer data can dynamically adjust the marking, so that the marking point can better meet the needs of users.

接著請參考圖5,圖5表示本創作所提供之雷射打標分區接合裝置1在進行分區打標時的另一實施例之示意圖。同樣的,圖5僅將雷射打標裝置11中的部分構件顯示出來,在此實施例中,視覺裝置12包括影像擷取模組121以及影像比對模組122,透過視覺裝置12中的影像擷取模組121擷取雷射源裝置13在工件14上進行打標之後所形成的分區打標影像,並透過影像比對模組122進行比對,將影像判別結果回傳至使用者介面111,其中視覺裝置12的擷取雷射源裝置13在工件14上所形成的分區打標影像的時間可以是在第一分區打標進行時,即時的擷取分區打標影像,也可以是在第一分區打標完成後,才擷取分區打標影像,擷取分區打標影像的時間不在本創作所限制的範圍內,只要在分區打標進行時皆可進行分區打標影像的擷取。在本實施例中,影像擷取模組121可以是影像感測器,例如CCD陣列、MMOS陣列或是光二極體陣列等可以拍攝影像的機器或是設備。另外,分區打標影像可以是一個圖形檔案,例如副檔名是jpg、tif、png、bmp的圖形檔案。 Next, please refer to FIG. 5. FIG. 5 is a schematic diagram showing another embodiment of the laser marking partition bonding apparatus 1 provided by the present invention when performing partition marking. Similarly, in FIG. 5, only some of the components in the laser marking device 11 are displayed. In this embodiment, the visual device 12 includes an image capturing module 121 and an image matching module 122, which are transmitted through the visual device 12. The image capturing module 121 captures the partition marking image formed by the laser source device 13 after marking on the workpiece 14, and compares the image matching module 122 with the image matching module 122 to transmit the image discrimination result to the user. The interface 111, wherein the time of capturing the image of the partition formed by the laser source device 13 on the workpiece 14 of the visual device 12 may be an instant capture of the partition marking image when the marking of the first partition is performed, or After the marking in the first partition is completed, the partition marking image is captured, and the time for capturing the marking image of the partition is not within the scope of the limitation of the creation, and the partition marking image can be performed as long as the partition marking is performed. Capture. In this embodiment, the image capturing module 121 may be an image sensor, such as a CCD array, an MMOS array, or a photodiode array, such as a machine or device capable of capturing images. In addition, the partition marking image may be a graphic file, for example, a graphic file whose auxiliary file name is jpg, tif, png, bmp.

請繼續參考圖5,影像比對模組122更包括影像處理模組1221、辨識模組1222及比對模組1223,其中比對模組1223更包括一資料庫1223A。圖5中的影像處理模組1221將分區打標影像處理成辨識模組1222可讀的(readable)資料格式,即稱為可辨識資料,例如影像處理模組1221將副檔名是jpg的圖形檔案(*.jpg),轉換成為一組帶有座標的二進位數字陣列,以方 便影像比對模組122進行比對,影像處理模組1221並將該轉換後的可辨識資料傳送給辨識模組1222,辨識模組1222用以判定此可辨識資料中的判斷區域,並將此判斷區域傳送至比對模組1223以進行比對。如習知技術所述,打標影像中的火柴頭圖形與需要接合的部分幾乎都出現在打標影像的邊緣處,只佔有打標影像的一部份,所以在本創作中,透過辨識模組1222的判定手段,將可辨識資料(仍保有分區打標影像的內容,相較於分區打標影像僅是資料格式改變)中需要進行後續處理的判斷區域萃取出來,以有效利用雷射打標分區接合裝置1中的資源並且節省雷射打標的時間。辨識模組1222將判斷區域傳送至比對模組1223後,比對模組1223將判斷區域與比對模組1223中的資料庫1223A中的預定影像進行比對。比對的方式是資料庫1223A將判斷區域中的某一個特定座標中的相關資料,例如是打標點半徑先呼叫(call)出來,再呼叫出此特定座標在預定影像上的相關資料,例如是打標點坐標,後續將同一座標下的判斷區域中的打標點半徑與預定影像上的打標點半徑相減,如果相減後的值大於或是等於1,則表示判斷區域等於預定影像,則輸出吻合;若相減後的值小於1,則表示判斷區域小於預定影像,則輸出失真。在此,預定影像是一個標準影像,一般使用者會透過雷射打標分區接合裝置1,將其所要提供圖形的標準影像預先儲存在資料庫1223A中,用以提供比對模組1223中來判定判斷區域是否與預定影像相互吻合。此資料庫1223A可以是一個記憶體,用來儲存多個預定影像。 Referring to FIG. 5, the image comparison module 122 further includes an image processing module 1221, an identification module 1222, and a comparison module 1223. The comparison module 1223 further includes a database 1223A. The image processing module 1221 of FIG. 5 processes the partition marking image into a readable data format readable by the recognition module 1222, which is called identifiable data. For example, the image processing module 1221 converts the auxiliary file name into a jpg graphic. Archive (*.jpg), converted into a set of binary digital arrays with coordinates, The image processing module 1221 compares the converted identifiable data to the identification module 1222, and the identification module 1222 determines the determination area in the identifiable data, and This determination area is transmitted to the comparison module 1223 for comparison. As described in the prior art, the match head pattern in the marking image and the portion to be joined almost appear at the edge of the marked image, occupying only a part of the marked image, so in the present creation, through the recognition mode The determining means of the group 1222 extracts the identifiable data (the content of the partitioned marking image is still changed only in the data format of the partition marking image), and the judgment area that needs subsequent processing is extracted to effectively utilize the laser The zone partitions the resources in the device 1 and saves time for laser marking. After the identification module 1222 transmits the determination area to the comparison module 1223, the comparison module 1223 compares the determination area with the predetermined image in the database 1223A in the comparison module 1223. The comparison method is that the database 1223A determines the relevant data in a certain coordinate in the area, for example, the call point radius is called first, and then calls the relevant information of the specific coordinate on the predetermined image, for example, Marking point coordinates, the radius of the marking point in the judgment area under the same coordinate is subtracted from the radius of the marking point on the predetermined image. If the value after subtraction is greater than or equal to 1, it indicates that the judgment area is equal to the predetermined image, then the output is If the value after subtraction is less than 1, it means that the judgment area is smaller than the predetermined image, and the distortion is output. Here, the predetermined image is a standard image. The general user will pre-store the standard image of the graphic to be provided in the database 1223A through the laser marking partition bonding device 1 to provide the comparison module 1223. It is determined whether the determination area matches the predetermined image. This database 1223A can be a memory for storing a plurality of predetermined images.

請繼續參考圖5,比對模組1223將判斷區域中的每一個座標的相關資料與預定影像的相關資料逐一的比對後,視覺裝置12將影像判別結果回傳給使用者介面111。使用者介面111接收影像判別結果之後,會發出警示訊息,用於提醒使用者判別結果,此警示訊息包括正常提示、接漏提示與火柴頭提示。在本實施例中,影像判別結果若是有50個(含)以上的吻合 時,此警示訊息就是正常提示;若是影像判別結果若是有不超過50個的吻合時,此警示訊息就是火柴頭提示;若是影像判別結果若是有任1個的失真時,此警示訊息就是接漏提示,但影像判別結果數量不限於50個,可自設定臨界值。當使用者接獲警示訊息後,會根據警示訊息的內容調整請求資料的內容;當未接獲正常提示時,使用者會一直重覆調整請求資料,直到獲得正常提示;當使用者接獲正常提示時,就會將請求資料中輸入自動提示,此時雷射打標分區接合裝置1就會自動開始運行,以將全部的圖形轉印到工件14上。 Referring to FIG. 5, the comparison module 1223 compares the related data of each coordinate in the determination area with the related data of the predetermined image one by one, and then the visual device 12 returns the image determination result to the user interface 111. After the user interface 111 receives the image discrimination result, a warning message is sent to remind the user to determine the result. The warning message includes a normal prompt, a leak prompt, and a match head prompt. In this embodiment, if the image discrimination result has an anastomosis of 50 or more The warning message is a normal prompt; if the image discrimination result is not more than 50, the warning message is a match head prompt; if the image discrimination result has any one distortion, the warning message is a leak. Note, but the number of image discrimination results is not limited to 50, and the threshold can be set. When the user receives the warning message, the content of the request data will be adjusted according to the content of the warning message; when the normal prompt is not received, the user will repeat the adjustment request data until the normal prompt is obtained; when the user receives the normal When prompted, an automatic prompt is entered in the request data, at which point the laser marking zone engagement device 1 automatically begins to operate to transfer all of the graphics to the workpiece 14.

本創作所提出的雷射打標分區接合裝置1,不但可透過一再的分區打標以修正分區打標影像,同時更經由視覺裝置12以電腦判定分區打標影像的良窳,大幅減少人為判別之誤差,修正時更考慮了振鏡模組114的資料,同時進行插值運算以考慮到預設值,避免接圖錯誤。更重要的是,此裝置可以即時的反饋分區打標影像的判定結果,且使用者可以根據警示訊號即時調整輸入的請求資料調整打標分區打標影像,不需要等待整個打標影像完成後即可以即時調整,故深具產業利用性。 The laser marking partitioning device 1 proposed by the present invention can not only correct the partition marking image through repeated partition marking, but also determine the quality of the partition marking image by the computer through the visual device 12, thereby greatly reducing the artificial discrimination. The error is corrected in consideration of the data of the galvanometer module 114, and the interpolation operation is performed at the same time to take into account the preset value and avoid the connection error. More importantly, the device can immediately feedback the determination result of the zone marking image, and the user can adjust the input request data according to the warning signal to adjust the marking target of the marking zone without waiting for the entire marking image to be completed. It can be adjusted in real time, so it has deep industrial utilization.

後續本創作提供一種雷射打標分區接合方法。請參考圖4、圖5與圖6A至圖6D,圖6A至圖6D表示本創作所提供之雷射打標分區接合方法的進行時,打標節點的示意圖。其中圖6A是使用者對於使用者介面111所輸入的圖形的一個分區,即第一分區預計打標圖樣100,圖6B是路徑規劃模組1121規劃後的多個打標節點14A的座標圖,圖6C是插值計算模組1131插值計算後的多個打標節點14A的座標圖,圖6D是影像擷取模組121所擷取的分區打標影像。首先,路徑規劃模組1121係根據圖6A使用者對於使用者介面111所輸入的圖形的一個分區進行規劃,例如第一分區,以生成多個打標節點14A。此時生成的每一個打標節點14A之間是等距離的,其距離為t,一 般t是3mm,等距離的用意是讓雷射源裝置13在打標移動時能夠進行等速度運動,故在路徑規劃模組1121中生成的多個節點是處於等速度段14M,並且路徑規劃模組1121會決定此等速度段14M中的等速度段起點14C與等速度段終點14D,以方便後續接圖用。後續這些打標節點14A經過能量運算模組1122安排後,每一個打標節點14A皆具有能量值,以提示雷射源裝置13在某一特定的打標節點14A需要產生特定能量值的輸出功率。後續控制器模組113中的插值計算模組1131接收到具有能量值的每一個打標節點14A的相關資料後,根據振鏡模組114當前的座標值與多個節點所在的等速度段14M的起點與終點,進行插值運算,所謂插值運算指的是插入一個在路徑規劃模組1121生成資料中沒有的值。插值計算模組1131會先擷取振鏡模組114當前的座標值,然後在振鏡模組當前座標值與等速度段起點14C前和等速度段終點14D後插入多個挪動節點14B,以供雷射源裝置13以及振鏡模組114對位用。此時每個挪動節點14B之間是不等距的,因為振鏡模組114從靜止加速到等速度段14M時,即在加速度段14S時有加速度產生,且振鏡模組114減速到靜止時,即減速度段14E時也會有加速度產生,所以在加速度段14S與減速度段14E中,相鄰的兩挪動節點14B是不等距的。在本創作的一個具體實施方式中,振鏡模組114在加速度段14S與減速度段14E中是進行等加速度運動,更進一步的,振鏡模組114在加速度段14S進行2km/s2的等加速度運動,在減速度段14E進行-2km/s2的等加速度運動。進行打標時,此加速度段14S與減速度段14E的雷射源裝置13是處在關光狀態,此關光狀態指的是雷射源裝置13不發出雷射光,此時加速度段14S與減速度段14E僅供振鏡模組114與雷射源裝置13對位用,所以挪動節點14B以白色圓圈示意。最後插值運算模組112獲得了此接圖參數預設值後,命令輸出模組1132傳送 此接圖參數預設值給雷射源裝置13,供雷射源裝置13在工件14上進行分區打標。 Subsequent creations provide a laser marking partition bonding method. Please refer to FIG. 4, FIG. 5 and FIG. 6A to FIG. 6D. FIG. 6A to FIG. 6D are schematic diagrams showing the marking node when the laser marking partition bonding method provided by the present invention is performed. 6A is a partition of the graphic input by the user to the user interface 111, that is, the first partition prediction marking pattern 100, and FIG. 6B is a coordinate diagram of the plurality of marking nodes 14A planned by the path planning module 1121. FIG. 6C is a coordinate diagram of a plurality of marking nodes 14A after interpolation calculation by the interpolation calculation module 1131, and FIG. 6D is a partition marking image captured by the image capturing module 121. First, the path planning module 1121 plans a partition of the graphic input by the user for the user interface 111, such as the first partition, to generate a plurality of marking nodes 14A. Each of the marking nodes 14A generated at this time is equidistant from each other, and the distance is t, and generally t is 3 mm. The purpose of the equidistant distance is to enable the laser source device 13 to perform the constant velocity movement during the marking movement, The plurality of nodes generated in the path planning module 1121 are in the equal speed segment 14M, and the path planning module 1121 determines the isokinetic segment starting point 14C and the constant velocity segment ending point 14D in the velocity segments 14M to facilitate subsequent connection. Figure used. After the marking nodes 14A are arranged by the energy computing module 1122, each of the marking nodes 14A has an energy value to indicate that the laser source device 13 needs to generate an output power of a specific energy value at a specific marking node 14A. . After the interpolation calculation module 1131 in the subsequent controller module 113 receives the relevant data of each of the marking nodes 14A having the energy value, according to the current coordinate value of the galvanometer module 114 and the equal velocity segment 14M where the plurality of nodes are located. The starting point and the end point are interpolated. The so-called interpolation operation refers to inserting a value that is not included in the data generated by the path planning module 1121. The interpolation calculation module 1131 first captures the current coordinate value of the galvanometer module 114, and then inserts a plurality of mobile nodes 14B after the current coordinate value of the galvanometer module and the start point 14C of the constant velocity segment and the end point 14D of the constant velocity segment. The laser source device 13 and the galvanometer module 114 are aligned. At this time, each of the moving nodes 14B is not equidistant, because the galvanometer module 114 accelerates from the stationary state to the equal speed segment 14M, that is, when the acceleration segment 14S is accelerated, and the galvanometer module 114 is decelerated to a standstill. At the time of the deceleration section 14E, acceleration also occurs, so in the acceleration section 14S and the deceleration section 14E, the adjacent two moving nodes 14B are not equidistant. In a specific implementation of the present invention, the galvanometer module 114 performs an equal acceleration motion in the acceleration section 14S and the deceleration section 14E. Further, the galvanometer module 114 performs 2 km/s 2 in the acceleration section 14S. For the iso-acceleration motion, an equal-acceleration motion of -2 km/s 2 is performed in the deceleration section 14E. When the marking is performed, the laser source device 13 of the acceleration segment 14S and the deceleration segment 14E is in an off state, and the off state indicates that the laser source device 13 does not emit laser light, and the acceleration segment 14S is The deceleration section 14E is only used for aligning the galvanometer module 114 with the laser source device 13, so that the moving node 14B is indicated by a white circle. After the final interpolation operation module 112 obtains the preset value of the connection parameter, the command output module 1132 transmits the preset value of the connection parameter to the laser source device 13 for the laser source device 13 to perform partitioning on the workpiece 14. Standard.

圖6D顯示了影像擷取模組121所擷取的分區打標影像。從圖6D中可以看出,在工件14上的第一分區實際打標圖樣102是相同於第一分區預計打標圖樣100,且第一分區實際打標圖樣102的兩端不會產生火柴頭圖像。另外,圖6A僅表示圖形的第一分區,後續要完成此圖形的其他分區時,如第二分區或是第三分區時,即進行接圖過程,亦可遵照上述流程進行,僅是在接圖過程中,圖6C中的第二分區等速度段起點14C必定要對準第一分區中的等速度段終點14D,以方便完成接圖步驟。 FIG. 6D shows the partition marking image captured by the image capturing module 121. As can be seen from FIG. 6D, the first zone actual marking pattern 102 on the workpiece 14 is the same as the first zone prediction marking pattern 100, and the first section of the actual marking pattern 102 does not produce a match head. image. In addition, FIG. 6A only shows the first partition of the graphic. When the other partitions of the graphic are to be completed, such as the second partition or the third partition, the connection process is performed, and the above process may be followed, but only in the connection. In the figure, the second segment equal speed segment starting point 14C in FIG. 6C must be aligned with the constant velocity segment end point 14D in the first partition to facilitate the completion of the connecting step.

最後請參考圖7,圖7表示本創作所提供之雷射打標分區接合裝置1之方法執行流程圖,以下分別詳述步驟,並請一併參考圖3至圖6D: Finally, please refer to FIG. 7. FIG. 7 is a flowchart showing the execution of the method for the laser marking partition bonding apparatus 1 provided by the present invention. The steps are respectively described in detail below, and please refer to FIG. 3 to FIG. 6D together:

步驟F1:取得圖形的第一分區。一般而言,使用者通過上述圖4所示的雷射打標分區接合裝置1中的使用者介面111輸入一個圖形後,此雷射打標分區接合裝置1中的運算模組112會對輸入的圖形進行影像處理,將此圖形分成面積相等的六個分區。在本創作中,並不限制分區的數目以及面積,可以是兩個分區、三個分區或是九個分區,只要分區數目是整數即可。此六個分區中的會分別的被編號成為第一分區至第六分區。編號的順序不在本創作的限制中。後續進行步驟F2。 Step F1: Obtain the first partition of the graphic. Generally, after the user inputs a graphic through the user interface 111 in the laser marking partition bonding apparatus 1 shown in FIG. 4, the operation module 112 in the laser marking partition bonding apparatus 1 inputs the input. The graphics are image processed, and the graphics are divided into six partitions of equal area. In this creation, the number and area of partitions are not limited. It can be two partitions, three partitions, or nine partitions, as long as the number of partitions is an integer. The six partitions are numbered separately from the first partition to the sixth partition. The order of the numbers is not within the limits of this creation. Subsequent step F2.

步驟F2:根據圖形的第一分區,規劃多個第一打標節點14A,並決定多個第一打標節點14A中的等速度段起點14C與等速度段終點14D。規劃結果如同圖6C所示,規劃是經由如上述圖4所示的雷射打標分區接合裝置1中的路徑規劃模組1121進行。後續進行步驟F3。 Step F2: According to the first partition of the graph, a plurality of first marking nodes 14A are planned, and a constant velocity segment starting point 14C and a constant velocity segment ending point 14D in the plurality of first marking nodes 14A are determined. The planning result is as shown in FIG. 6C, and the planning is performed via the path planning module 1121 in the laser marking zone bonding apparatus 1 as shown in FIG. 4 described above. Subsequent step F3.

步驟F3:將多個第一打標節點14A賦予對應的座標值與能量值。賦予意思是指將原本沒有的資料格式添加至原始資料而成為新的資料格式。 在本具體實施方式中,多個第一打標節點14A是僅有灰階的資料,例如某一個第一打標節點14A是黑色的話,該點資料是呈現(255,0),之後透過上述圖4所示的雷射打標分區接合裝置1中的能量運算模組1122,將多個第一打標節點14A分別加上座標值與能量值,例如將該點資料變成(255,0,1,2,100),使該點的資料格式轉變。座標值是採用圖形座標系,此座標系是以卡式座標系的X-Y座標系定義,原點是在圖形的中心。後續進行步驟F4。 Step F3: The plurality of first marking nodes 14A are assigned corresponding coordinate values and energy values. Giving meaning means adding a data format that was not originally added to the original material to become a new data format. In this embodiment, the plurality of first marking nodes 14A are only grayscale data. For example, if a certain first marking node 14A is black, the point data is presented (255, 0), and then transmitted through the above. The energy calculation module 1122 in the laser marking partition bonding apparatus 1 shown in FIG. 4 adds a coordinate value and an energy value to each of the plurality of first marking nodes 14A, for example, the point data is changed to (255, 0, 1,2,100), making the data format of the point change. The coordinate value is a graphical coordinate system defined by the X-Y coordinate system of the card coordinate system, and the origin is at the center of the graphic. Subsequent to step F4.

步驟F4:將賦予座標值與能量值的多個第一打標節點14A與振鏡模組114的座標值插值運算,以獲得第一接圖參數預設值。插值運算是通過圖4所示的雷射打標分區接合裝置1中的路徑規劃模組1121進行,插值運算的定義如同前述圖6C的圖說所述。插值運算後的結果如圖6C所示。步驟F2至F4完全是對於第一分區進行處理。後續進行步驟F5。 Step F4: Interpolating the coordinate values of the plurality of first marking nodes 14A and the galvanometer module 114 that give the coordinate value and the energy value to obtain a preset value of the first interface parameter. The interpolation operation is performed by the path planning module 1121 in the laser marking partition bonding apparatus 1 shown in Fig. 4, and the definition of the interpolation operation is as described above with reference to Fig. 6C. The result of the interpolation operation is as shown in Fig. 6C. Steps F2 to F4 are completely processed for the first partition. Subsequent step F5.

步驟F5:雷射源裝置13根據第一接圖參數預設值對於工件14進行第一分區打標。後續進行步驟F6。 Step F5: The laser source device 13 performs first partition marking on the workpiece 14 according to the first map parameter preset value. Subsequent to step F6.

步驟F6:取得圖形的另一分區,並根據圖形的另一分區,規劃多個第二打標節點14A,並決定多個第二打標節點14A中的等速度段起點14C與等速度段終點14D,並將多個第二打標節點14A賦予對應的座標值與能量值,其中多個第二打標節點14A中的等速度段起點14C與第一打標節點14A中的等速度段終點14D的座標值須相同。所謂另一分區指的是圖形內除了第一個分區以外的另一個分區。通過圖4所示的雷射打標分區接合裝置1中的運算模組112可以挑選另一分區是哪一個分區,在本實施例中指定了此圖形中的第二分區是另一分區。另外,在步驟F6中,是通過圖4所示的雷射打標分區接合裝置1中的路徑規劃模組1121進行規劃,需要注意的是,決定多個第二打標節點14A的座標時,多個第二打標節點14A中的等速度段起點14C 與多個第一打標節點14A中的等速度段終點14D的座標值相同,以使雷射源裝置13才能拼接此多個分區,完成整體打標。後續進行步驟F7。 Step F6: Obtain another partition of the graph, and plan a plurality of second marking nodes 14A according to another partition of the graph, and determine the starting point 14C of the constant velocity segment and the end point of the constant velocity segment in the plurality of second marking nodes 14A. 14D, and assigning a plurality of second marking nodes 14A to corresponding coordinate values and energy values, wherein the constant velocity segment starting point 14C of the plurality of second marking nodes 14A and the isokinetic segment end point in the first marking node 14A The coordinates of 14D must be the same. The so-called another partition refers to another partition in the graphics other than the first partition. The operation module 112 in the laser marking partition bonding apparatus 1 shown in FIG. 4 can select which partition the other partition is. In the present embodiment, the second partition in the figure is designated as another partition. In addition, in step F6, the planning is performed by the path planning module 1121 in the laser marking partition bonding apparatus 1 shown in FIG. 4, and it is noted that when determining the coordinates of the plurality of second marking nodes 14A, Equal velocity segment starting point 14C in a plurality of second marking nodes 14A The coordinates of the same speed segment end point 14D in the plurality of first marking nodes 14A are the same so that the laser source device 13 can splicing the plurality of partitions to complete the overall marking. Subsequent step F7.

步驟F7:將具有座標值與能量值的多個第二打標節點14A與振鏡模組114的座標值插值運算,以獲得第二接圖參數預設值,插值運算的定義及使用的裝置如同步驟F4中所述。後續進行步驟F8。 Step F7: Interpolating the coordinate values of the plurality of second marking nodes 14A and the galvanometer module 114 having the coordinate value and the energy value to obtain a preset value of the second connection parameter, the definition of the interpolation operation, and the device used As described in step F4. Subsequent step F8.

步驟F8:雷射源裝置13根據第二接圖參數預設值進行另一分區打標。後續進行步驟F9。 Step F8: The laser source device 13 performs another zone marking according to the preset value of the second map parameter. Subsequent to step F9.

步驟F9:判斷是否已完成分區打標。此步驟是判斷整體圖形是否已完成整體雷射打標。此步驟是藉由圖5所示的雷射打標接合裝置中的影像比對模組122判定。若是,則進行步驟F10;若否,則返回進行步驟F6。 Step F9: It is judged whether the partition marking has been completed. This step is to determine whether the overall graphics have completed the overall laser marking. This step is determined by the image comparison module 122 in the laser marking engagement device shown in FIG. If yes, go to step F10; if no, go back to step F6.

步驟F10:結束此流程。 Step F10: End this process.

使用本創作所提出的雷射打標分區接合方法,藉由將原始多個打標節點14A增加了不開光的多個挪動節點14B延伸段,不但可以維持原來分區打標時雷射源裝置13的等速度運動,並且防止原來分區打標時所造成的火柴頭圖形。在後續進行多個分區打標,即進行接圖步驟時,第一分區的等速度段終點14D可完全的與第二區的等速度段起點14C銜接,使得接圖結果完全吻合於原來使用者提供的圖形,減少一再修整分區打標圖形時間與減少雷射源裝置13出光浪費,並減少因為雷射命令落後伺服命令所造成的圖形尺寸不正確的現象,故兼具方便性與實用性。 By using the laser marking partition bonding method proposed by the present invention, by adding the original plurality of marking nodes 14A to the plurality of moving nodes 14B extending without opening, the laser source device 13 can be maintained not only when the original partition marking is performed. The constant velocity movement and the pattern of the match head caused by the original partition marking. In the subsequent multi-partition marking, that is, the connecting step, the first-speed iso-speed segment end point 14D can be completely connected with the second-zone iso-speed segment starting point 14C, so that the connection result completely matches the original user. The provided graphics reduce the time for finishing the marking pattern and reduce the waste of the laser source device 13, and reduce the phenomenon that the graphic size is incorrect due to the laser command being behind the servo command, so it is convenient and practical.

雖然本創作以前述之較佳實施例揭露如上,然其並非用以限定本創作,任何熟習本領域技藝者,在不脫離本創作之精神和範圍內,當可作些許之更動與潤飾,因此本創作之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the present invention has been described above with reference to the preferred embodiments thereof, it is not intended to limit the present invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. The scope of patent protection of this creation is subject to the definition of the scope of the patent application attached to this specification.

Claims (9)

一種雷射打標分區接合裝置,用以在一工件上進行一分區打標,包括一雷射打標裝置、一雷射源裝置及一視覺裝置,其中該雷射打標裝置用以驅動該雷射源裝置,其特徵在於:該雷射打標裝置,具有一使用者介面用以繪製一圖形與匯入一請求資料;一運算模組根據該圖形與該請求資料輸出一可讀資料;一振鏡模組用以帶動該雷射源裝置;一控制器模組接收該可讀資料與該振鏡模組所傳送的一振鏡資料後,對該可讀資料及該振鏡模組所傳送的該振鏡資料進行一插值運算,以得到一接圖參數預設值;該雷射源裝置,接收該接圖參數預設值後,在該工件上進行一分區打標;以及該視覺裝置,具有一影像擷取模組及一影像比對模組,該影像擷取模組用以擷取該工件上的一分區打標影像,並透過該影像比對模組進行比對,以回傳一影像判別結果給該使用者介面。 A laser marking zone bonding device for performing a zone marking on a workpiece, comprising a laser marking device, a laser source device and a vision device, wherein the laser marking device is used to drive the laser marking device The laser source device is characterized in that: the laser marking device has a user interface for drawing a graphic and importing a request data; and an operation module outputs a readable data according to the graphic and the request data; a galvanometer module is configured to drive the laser source device; a controller module receives the readable data and a galvanometer data transmitted by the galvanometer module, the readable data and the galvanometer module The transmitted galvanometer data is subjected to an interpolation operation to obtain a preset value of the interface parameter; the laser source device receives a preset value of the connection parameter, and performs a zone marking on the workpiece; The visual device has an image capturing module and an image matching module. The image capturing module is configured to capture a zone marking image on the workpiece and compare the image matching module. To return an image discrimination result to the user . 如請求項1所述的雷射打標分區接合裝置,其中該運算模組更具有一路徑規劃模組與一能量運算模組,該路徑規劃模組用以規劃該雷射源裝置進行該分區打標時的多個打標節點的多個座標,該能量運算模組用以安排該些打標節點的一能量值陣列,並將該些打標節點的座標與該能量值陣列打包成該可讀資料,傳送至該控制器模組。 The laser marking partitioning device of claim 1, wherein the computing module further comprises a path planning module and an energy computing module, wherein the path planning module is configured to plan the laser source device to perform the partitioning. a plurality of coordinates of the plurality of marking nodes at the time of marking, the energy computing module is configured to arrange an array of energy values of the marking nodes, and package the coordinates of the marking nodes and the energy value array into the Readable data is transmitted to the controller module. 如請求項1或2所述的雷射打標分區接合裝置,其中該控制器模組更具有一插值計算模組與一命令輸出模組,該插值計算模組進行該插值運算,藉此獲得該接圖參數預設值,且該命令輸出模組用以傳送該接圖參數預設值。 The laser marking partitioning device according to claim 1 or 2, wherein the controller module further has an interpolation calculation module and a command output module, and the interpolation calculation module performs the interpolation operation, thereby obtaining The interface parameter preset value, and the command output module is configured to transmit the preset value of the interface parameter. 如請求項2所述的雷射打標分區接合裝置,其中該可讀資料包括數值控制碼。 The laser marking partition bonding apparatus of claim 2, wherein the readable material comprises a numerical control code. 如請求項1所述的雷射打標分區接合裝置,其中該影像比對模組更包括一影像處理模組、一辨識模組及一比對模組,其中該影像處理模組將該分區打標影像處理成一可辨識資料;該辨識模組用以判定該可辨識資料中的一判斷區域,並將該判斷區域傳送至該比對模組以進行比對。 The laser marking partitioning device of claim 1, wherein the image matching module further comprises an image processing module, an identification module and a comparison module, wherein the image processing module partitions the partition The marking image is processed into a identifiable data; the identification module is configured to determine a determination area in the identifiable data, and transmit the determination area to the comparison module for comparison. 如請求項5所述的雷射打標分區接合裝置,其中該插值計算模組用於插入該路徑規劃模組生成資料中沒有的多個值。 The laser marking partitioning device of claim 5, wherein the interpolation computing module is configured to insert a plurality of values not included in the path planning module to generate data. 如請求項6所述的雷射打標分區接合裝置,其中該些值包括一振鏡模組當前座標值、一加速度段、一減速度段以及在該加速度段與該減速度段中的多個挪動節點。 The laser marking partitioning device of claim 6, wherein the values include a galvanometer module current coordinate value, an acceleration segment, a deceleration segment, and a plurality of the acceleration segment and the deceleration segment. Move the node. 如請求項1所述的雷射打標分區接合裝置,其中當進行該分區打標時,該雷射源裝置在一加速度段與一減速度段為一關光狀態。 The laser marking zone bonding device of claim 1, wherein the laser source device is in an off state during an acceleration segment and a deceleration segment when the zone marking is performed. 如請求項1所述的雷射打標分區接合裝置,其中該影像擷取模組是將該判斷區域與該比對模組中的一資料庫中的一預定影像進行比對。 The laser marking partitioning device of claim 1, wherein the image capturing module compares the determination area with a predetermined image in a database in the comparison module.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI666081B (en) * 2017-12-15 2019-07-21 新代科技股份有限公司 Boundary-joint laser-mark machine and the method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI666081B (en) * 2017-12-15 2019-07-21 新代科技股份有限公司 Boundary-joint laser-mark machine and the method thereof

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