CN203471145U - Laser processing device - Google Patents
Laser processing device Download PDFInfo
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- CN203471145U CN203471145U CN201320429466.4U CN201320429466U CN203471145U CN 203471145 U CN203471145 U CN 203471145U CN 201320429466 U CN201320429466 U CN 201320429466U CN 203471145 U CN203471145 U CN 203471145U
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Abstract
The utility model provides a laser processing device. The laser processing device comprises a lathe bed, a crossbeam and a laser processing system, wherein the laser processing system comprises a laser processing assembly; at least two movable positioning working platforms are arranged on the lathe bed; the laser processing assembly is movably arranged on the crossbeam and positioned above the positioning working platforms. Workpieces to be processed on the two positioning working platforms are continuously processed by the laser processing assembly, so the replacing time of the workpieces to be processed is saved; the laser processing assembly can work continuously, so the processing efficiency is improved greatly.
Description
Technical field
The utility model relates to laser technology field, relates in particular to a kind of laser processing device.
Background technology
Along with the demand of machine and instrument and equipment increases severely day by day, such as, at electronics, automobile, the industries such as space flight and experiments of measuring equipment, the demand of wiring board also increases day by day, its application is also more and more extensive, miniaturization due to machine and instrument and equipment, and the required precision of processing, requirement to PCB is also more and more higher, yet, the processing method of pcb board of the prior art is that pcb board is placed on a workbench, after processing, sending into subsequent processing again by artificial or complicated conveyer adds, laser-processing system need to stop, treat that next workbench is sent to machining area and carries out the processing of next round again.At present, also have in the industry pcb board is arranged on a plurality of workbenches, but it is to adopt many cover laser-processing systems to process, need equally laser-processing system break-off, thereby make product in process, need to process discontinuously, the efficiency of product processing is also low, can not meet the demand in market.
Utility model content
The technical problems to be solved in the utility model is: for the deficiencies in the prior art, and provide a kind of laser processing device, it can solve the inefficient problem of Laser Processing in prior art.
The utility model solves the technical scheme that its technical problem adopts: a kind of laser processing device is provided, comprise lathe bed, crossbeam and laser-processing system, this laser-processing system comprises Laser Processing assembly, wherein: on described lathe bed, be provided with at least two and movably locate workbench; Described Laser Processing assembly is movably set on crossbeam, and is positioned at the top of location workbench.
The further preferred version of the utility model is: described Laser Processing assembly is a set of, by this set of Laser Processing assembly, the workpiece on the workbench of at least plural location is processed.
The further preferred version of the utility model is: on described crossbeam, be provided with on the ，GaiXZhou unit, X-axis unit of laser optical path transmission and location and be provided with Z axis unit, described Laser Processing assembly is arranged on this Z axis unit; On described lathe bed, be provided with for carrying the Y-axis unit of location workbench.
The further preferred version of the utility model is: described X-axis unit comprises X-axis guide assembly, X-axis power set, X-axis fixed head, and described Z axis unit is arranged on this X-axis fixed head, and these X-axis power set drive Z axis unit to do X-direction motion.
The further preferred version of the utility model is: described Laser Processing assembly comprises device laser instrument, CCD navigation system, focus lamp, and galvanometer scanning system, described CCD navigation system, focus lamp and galvanometer scanning system are installed on Z axis unit, and described laser instrument is installed on crossbeam.
The further preferred version of the utility model is: described laser-processing system also comprises optics conducting system, it comprises beam expanding lens, the first speculum, the second speculum, the 3rd speculum and the 4th speculum, described beam expanding lens, the first speculum, the second speculum are installed on crossbeam, the 3rd described speculum is installed on X-axis unit, and the 4th described speculum is installed on Z axis unit.
The further preferred version of the utility model is: described Z axis unit comprises Z axis power set and Z axis base plate, described the 4th speculum, CCD navigation system, galvanometer scanning system and focus lamp is arranged on this Z axis base plate, and these Z axis power set drive Z axis base plate to do Z-direction motion.
The further preferred version of the utility model is: described Y-axis unit comprises Y-axis guide assembly and Y-axis power set, described location workbench is movably set on this Y-axis guide assembly, by Y-axis power set, drives location workbench to do the motion of Y direction.
The further preferred version of the utility model is: described Y-axis unit comprises Y1 axle unit and Y2 axle unit, and this Y1 axle unit comprises Y1 axle power set and Y1 axis rail assembly, and this Y2 axle unit comprises Y2 axle power set and Y2 axis rail assembly; Described location workbench is two, is arranged at respectively on this Y1 guide assembly and Y2 axis rail assembly, drives these two location workbenches to move respectively by Y1 axle power set and Y2 axle power set.
The further preferred version of the utility model is: on described Z axis base plate, be also provided with dust exhaust apparatus.
Implement the technical solution of the utility model, there is following beneficial effect: the utility model arranges to be processed of at least two carryings and movably locates workbench on lathe bed, and activity arranges Laser Processing assembly on crossbeam, when Laser Processing assembly processes after the workpiece on an one location workbench, can on crossbeam, move, the processing next one is located the workpiece on workbench continuously, thereby, save the replacing time of workpiece, Laser Processing assembly can continuous operation, has increased substantially working (machining) efficiency.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is described in further detail, in accompanying drawing:
Fig. 1 is the structural representation of the laser processing device of the utility model embodiment;
Fig. 2 be the utility model embodiment laser processing device face structural representation;
Fig. 3 is the side structure schematic diagram of the laser processing device of the utility model embodiment;
Fig. 4 is the plan structure schematic diagram of the laser processing device of the utility model embodiment;
Fig. 5 is the structural representation of the optics conducting system of the utility model embodiment.
The specific embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Refer to shown in Fig. 1 and Fig. 5, the utility model embodiment provides a kind of laser processing device, comprise lathe bed 1, crossbeam 3, laser-processing system and software control system (not shown), this laser-processing system comprises optics conducting system 2 and Laser Processing assembly, is provided with at least two and movably locates workbench 8 on described lathe bed 1; Laser Processing assembly is arranged on crossbeam 1, and can on crossbeam 1, move back and forth, and when this Laser Processing assembly processes after the workpiece on an one location workbench 8, then moves to next positioning table 8 and processes; This Laser Processing assembly is arranged at the top of location workbench 8, it is adding man-hour, be positioned at required processing location workbench 8 directly over, be convenient to the processing of Laser Processing assembly to workpiece, now Laser Processing assembly be positioned at other location workbenches oblique upper.Laser Processing assembly described in the utility model embodiment is a set of, by this set of Laser Processing assembly, the workpiece at least plural location workbench 8 is processed, thereby has greatly been improved working (machining) efficiency.
As Figure 1-4, processing unit (plant) described in the utility model embodiment comprises in order to the optic path of optics conducting system 2 laser beams and the X-axis unit 5 of location, on this X-axis unit 5, be provided with Z axis unit 7, described laser processing device is arranged on this Z axis unit 7, is provided with carrying location workbench and makes it mobile Y-axis unit 6 on described lathe bed 1.
As shown in Figure 1 and Figure 5, the optics conducting system 2 described in the utility model embodiment comprises beam expanding lens 22, the first speculum 23, the second speculum 24, the 3rd speculum 25 and the 4th speculum 26; Described beam expanding lens 22, the first speculum 23, the second speculum 24 are installed on crossbeam 3, and the 4th described speculum 26 is installed on Z axis unit 7; As shown in Figure 5, it is the laser beam process beam expanding lens 22 of launching by laser instrument 21 that the light path of optics conducting system 2 passes, and expands rear laser beam and enters galvanometer scanning system 27 through the first speculum 23, the second speculum 24, the 3rd speculum 25 and the 4th speculum 26 again.
As shown in Figure 1 and Figure 5, Laser Processing assembly described in the utility model embodiment comprises laser instrument 21, CCD navigation system 9, galvanometer scanning system 27 and focus lamp 28, the described preferred ultraviolet laser of laser instrument 21, its setting is installed on crossbeam 3, and described CCD navigation system 9 comprises CCD scanning means 91, camera lens 92 and light source 93, and described CCD navigation system 9, focus lamp 28 and galvanometer scanning system 27 are arranged on Z axis unit 7.The utility model embodiment, by laser-processing system being arranged on X-axis unit 5 and Z axis unit 7, can making laser beam be transmitted preferably and locates and realize processing effect accurately.
As Figure 1-Figure 4, location workbench 8 described in the utility model embodiment is vacuum suction location workbenches, for being adsorbed in this location workbench 8 by be processed, this location workbench 8 can be a plurality of, the present embodiment be take two as example, and it comprises the location workbench 81 and 82 being movably set on Y-axis unit 6.Described Y-axis unit 6 comprises Y1 axle unit 61 and Y2 axle unit 62, and described drive unit is Y-axis power set, and these Y-axis power set comprise Y1 axle power set 612 and Y2 axle power set 622; Described two location workbenches 81 and 82 are arranged at respectively on this Y1 axle unit 61 and Y2 axle unit 62, by Y1 axle power set 612 and Y2 axle power set 622, drive its motion respectively, in process, galvanometer scanning system 27 is done relative motion with location workbench 8, to guarantee the accuracy of processing.
As Figure 1-4, X-axis unit 5 described in the utility model embodiment comprises X-axis guide assembly, X-axis grating scale 52, X-axis power set 53 and X-axis fixed head 54, this X-axis guide assembly comprises X-axis guide rail 51 and X-axis slide block 54, described X-axis guide assembly, X-axis grating scale 52 are arranged on crossbeam 3, described X-axis power set 53 are movably set on this X-axis guide assembly, and the 3rd speculum 23 is arranged on this X-axis fixed head 54.
As Figure 1-4, Y-axis unit 6 described in the utility model embodiment comprises Y1 axle unit 61 and Y2 axle unit 62, described Y1 axle unit 61 comprises Y1 axis rail assembly, Y1 axle power set 612, Y1 axle grating scale 613 and Y1 spindle motor fixed head 614, this Y1 axis rail assembly comprises Y1 axis rail 611 and Y1 axle slide block 615; Described Y2 axle unit 62 comprises Y2 axis rail assembly, Y2 axle power set 622, Y2 axle grating scale 623 and Y2 spindle motor fixed head 624, and this Y2 axis rail assembly comprises Y2 axis rail 621 and Y2 axis rail slide block 625; Described Y1 axis rail assembly, Y2 axis rail assembly, Y1 axle grating scale and Y2 axle grating scale are installed on lathe bed 1, and described Y1 axle power set 612 and Y2 axle power set 622 are arranged at respectively on Y1 axis rail assembly and Y2 axis rail assembly.Described Y1 axle power set 612 and Y2 axle power set 622 drive respectively 8 motions of two location workbenches.
As Figure 1-4, Z axis unit 7 described in the utility model embodiment is arranged on X-axis fixed head 54, this Z axis unit 7 comprises Z axis power set 71, Z axis base plate 72, Z axis guide rail 73 and Z axis slide block 74, these Z axis power set 71 are arranged on X-axis fixed head 54, and described the 4th speculum 26, galvanometer scanning system 27 and focus lamp 28 is arranged on this Z axis base plate 72; On X-axis guide assembly described in the utility model embodiment, be movably set with X-axis fixed head 54, this X-axis fixed head 54 can move back and forth on X-axis guide assembly, and described Z axis unit 7 is arranged on X-axis unit 5 by this X-axis fixed head 54.On described Z axis base plate, be also provided with dust exhaust apparatus 10, this dust exhaust apparatus 10 is for the dust suction to location workbench 8 in process.
The utility model embodiment can be applicable to the laser cutting of field of lasers, laser marking, and laser drill etc., below take the laser cutting of pcb board and its operating process are described as example.
As shown in Figure 1 and Figure 5, the processing unit (plant) of the utility model embodiment also comprises software control system, when pcb board is carried out to cutting processing, pcb board carries out paster in advance, first the laser beam that laser instrument 21 penetrates enters galvanometer scanning system 27 by 2 reflections of optics conducting system, then by galvanometer scanning system 27 reflections, enter focus lamp 28, the laser beam focusing that focus lamp 28 penetrates laser instrument 21 again becomes very little hot spot, two-dimensional coordinate and the precision of spot on the workbench 8 of location controlled in the swing of galvanometer scanning system 27, the hot spot that galvanometer scanning system 27 utilizes focus lamp 28 to focus on is processed.The utility model embodiment software control system arranges the initial parameter of pcb board to be processed, and the laser energy of described laser instrument 21 outputs is set, the figure of processing, the location of CCD navigation system 9, alternately the movement of loading and unloading workbench 8 is by software control system unified allocation of resources.
The utility model embodiment, when pcb board is cut, is applicable to the PCB soft board of SMT paster industry, the Laser cutting of hardboard and Rigid Flex, adopt 2 above workbench alternate turns to process, a set of laser-processing system is processed, and adopts linear electric motors to drive, fast response time, can save the loading and unloading time, significantly improved working (machining) efficiency, and Laser Processing neat in edge is clean, without burr, form accuracy is high, can reach +/-0.020mm.Simultaneously the utility model can additional lambda line manipulator, realizes automatic loading/unloading, saves manually, realizes automated production completely.
As depicted in figs. 1 and 2, the processing unit (plant) operating process of the present embodiment is: first by the SMT paster pcb board of needs processing, be adsorbed on the workbench 8 of location, the file of the required processing of SMT paster PCB is imported to software control system, just can start to arrange the initial parameter of processing, main initial parameter comprises the thickness of laser frequency, pulse width, process velocity, plate.Set the location light that just can utilize Laser output after parameter, find the starting point that needs processing, after choosing, click and start button.One of them location workbench is driven the SMT paster PCB of needs processing is delivered to machining area by linear motor, and software control system controls laser instrument 21 Emission Lasers, galvanometer scanning system 27 simultaneously, locate workbench 8 moves to process.Add man-hour, the laser beam that laser instrument 21 is launched is through beam expanding lens 22, expand rear laser beam and enter galvanometer scanning system 27 through the first speculum 23, the second speculum 24, the 3rd speculum 25 and the 4th speculum 26, outgoing beam enters focus lamp 28 again.Focus lamp 28 becomes a little luminous point by laser beam focusing, then utilizes this little luminous point to process.After machining, click conversion processing button, another location workbench 8 drives by linear motor equally, the SMT paster PCB of needs processing is delivered to machining area, the SMT paster PCB simultaneously a first location workbench 8 being processed sends out, then changes the SMT paster PCB that needs processing.Repeat aforesaid operations, save the loading and unloading time.CCD navigation system 9 makes to process plate and platform can not produce and relatively move; The laser instrument 21 of high frequency can reach the good processing effect that obtains; The galvanometer scanning system 27 running up has improved the speed of processing; High-precision galvanometer scanning system 27 and location workbench 8 relative motions have guaranteed the high accuracy of workpiece size.Dust exhaust apparatus 10 has been taken away the dust producing, thereby has avoided dust to the pollution of environment and the injury to human body generation.
Laser instrument described in the utility model embodiment is ultraviolet laser, green laser or optical fiber laser; Described power set are drive unit or transmission device, but described drive unit linear drive motor, screw mandrel drive motors etc.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in claim scope of the present utility model.
Claims (10)
1. a laser processing device, comprises lathe bed, crossbeam and laser-processing system, and this laser-processing system comprises Laser Processing assembly, it is characterized in that: on described lathe bed, be provided with at least two and movably locate workbench; Described Laser Processing assembly is movably set on crossbeam, and is positioned at the top of location workbench.
2. laser processing device according to claim 1, is characterized in that: described Laser Processing assembly is a set of, by this set of Laser Processing assembly, the workpiece on the workbench of at least plural location is processed.
3. laser processing device according to claim 1 and 2, is characterized in that: on described crossbeam, be provided with on the ，GaiXZhou unit, X-axis unit of laser optical path transmission and location and be provided with Z axis unit, described Laser Processing assembly is arranged on this Z axis unit; On described lathe bed, be provided with for carrying the Y-axis unit of location workbench.
4. laser processing device according to claim 3, it is characterized in that: described X-axis unit comprises X-axis guide assembly, X-axis power set, X-axis fixed head, described Z axis unit is arranged on this X-axis fixed head, and these X-axis power set drive Z axis unit to do X-direction motion.
5. laser processing device according to claim 4, it is characterized in that: described Laser Processing assembly comprises device laser instrument, CCD navigation system, focus lamp, and galvanometer scanning system, described CCD navigation system, focus lamp and galvanometer scanning system are installed on Z axis unit, and described laser instrument is installed on crossbeam.
6. laser processing device according to claim 5, it is characterized in that: described laser-processing system also comprises optics conducting system, it comprises beam expanding lens, the first speculum, the second speculum, the 3rd speculum and the 4th speculum, described beam expanding lens, the first speculum, the second speculum are installed on crossbeam, the 3rd described speculum is installed on X-axis unit, and the 4th described speculum is installed on Z axis unit.
7. laser processing device according to claim 6, it is characterized in that: described Z axis unit comprises Z axis power set and Z axis base plate, described the 4th speculum, CCD navigation system, galvanometer scanning system and focus lamp is arranged on this Z axis base plate, and these Z axis power set drive Z axis base plate to do the motion of Z direction of principal axis.
8. laser processing device according to claim 3, it is characterized in that: described Y-axis unit comprises Y-axis guide assembly and Y-axis power set, described location workbench is movably set on this Y-axis guide assembly, by Y-axis power set, drives location workbench to do the motion of Y direction.
9. laser processing device according to claim 8, it is characterized in that: described Y-axis unit comprises Y1 axle unit and Y2 axle unit, this Y1 axle unit comprises Y1 axle power set and Y1 axis rail assembly, and this Y2 axle unit comprises Y2 axle power set and Y2 axis rail assembly; Described location workbench is two, is arranged at respectively on this Y1 guide assembly and Y2 axis rail assembly, drives these two location workbenches to move respectively by Y1 axle power set and Y2 axle power set.
10. laser processing device according to claim 7, is characterized in that: on described Z axis base plate, be also provided with dust exhaust apparatus.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320429466.4U CN203471145U (en) | 2013-07-18 | 2013-07-18 | Laser processing device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201320429466.4U CN203471145U (en) | 2013-07-18 | 2013-07-18 | Laser processing device |
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| CN203471145U true CN203471145U (en) | 2014-03-12 |
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| CN201320429466.4U Expired - Lifetime CN203471145U (en) | 2013-07-18 | 2013-07-18 | Laser processing device |
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Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103406665A (en) * | 2013-07-18 | 2013-11-27 | 深圳市大族激光科技股份有限公司 | Laser processing device |
| CN105034608A (en) * | 2015-07-10 | 2015-11-11 | 辽宁科技大学 | Industrial robot laser marking machine |
| CN105364976A (en) * | 2014-08-25 | 2016-03-02 | 深圳市韵腾激光科技有限公司 | Dual SD card cutting locating device and method |
| CN105467583A (en) * | 2015-12-09 | 2016-04-06 | 苏州大学 | A small-scope laser translational scanning mirror apparatus |
| CN105798460A (en) * | 2014-12-30 | 2016-07-27 | 上海团结普瑞玛激光设备有限公司 | Laser welding system for unequal-thickness plates |
| CN105817772A (en) * | 2016-05-11 | 2016-08-03 | 苏州天弘激光股份有限公司 | Rotary dual-workbench cantilever type laser cutting machine |
| CN106077961A (en) * | 2016-07-28 | 2016-11-09 | 平湖拓伟思自动化设备有限公司 | A kind of laser marking machine |
| CN106984697A (en) * | 2017-04-20 | 2017-07-28 | 宿迁学院 | Positional punch device and method |
| CN107030394A (en) * | 2017-04-07 | 2017-08-11 | 上海嘉强自动化技术有限公司 | A kind of laser cutting machine |
| CN107160044A (en) * | 2017-07-24 | 2017-09-15 | 东莞市盛雄激光设备有限公司 | A kind of large-breadth plates laser etching machine |
| CN107498195A (en) * | 2017-08-11 | 2017-12-22 | 武汉天琪激光设备制造有限公司 | A kind of pipe cutting machine with Automatic Exchange Work Benche |
| CN107745188A (en) * | 2017-09-30 | 2018-03-02 | 深圳信息职业技术学院 | A kind of picosecond laser process equipment |
| CN107953681A (en) * | 2017-11-20 | 2018-04-24 | 苏州猎奇智能设备有限公司 | Vision guide marking machine and vision guide marking method |
| CN108406142A (en) * | 2018-03-23 | 2018-08-17 | 伊欧激光科技（苏州）有限公司 | A kind of linear movement system and the laser processing device with the linear movement system |
| CN108672947A (en) * | 2018-05-21 | 2018-10-19 | 东莞市盛雄激光设备有限公司 | A kind of laser cutting production work station |
| CN109366000A (en) * | 2018-12-24 | 2019-02-22 | 姜堰经济开发区科创中心 | A kind of laser processing double component integrated three-dimensional platforms of high speed and precision |
| CN110032147A (en) * | 2019-05-24 | 2019-07-19 | 东莞市力星激光科技有限公司 | A kind of control system of laser cutting machine |
| US10391597B2 (en) | 2014-03-31 | 2019-08-27 | Lincoln Global, Inc. | Laser workstation with endless loop conveyor and coordinated access doors |
| CN110244661A (en) * | 2019-07-02 | 2019-09-17 | 东莞市力星激光科技有限公司 | A kind of control system of the laser pipe cutter of plate pipe one |
| CN111266736A (en) * | 2020-03-09 | 2020-06-12 | 北京阿李自动化科技有限公司 | Composite welding head and laser welding machine with same |
| CN111482718A (en) * | 2020-05-18 | 2020-08-04 | 名光智能科技(佛山)有限公司 | High-precision gantry laser cutting equipment |
| CN112935581A (en) * | 2021-02-02 | 2021-06-11 | 大族激光科技产业集团股份有限公司 | Laser processing apparatus |
| CN113441843A (en) * | 2020-03-26 | 2021-09-28 | 深圳市大族数控科技股份有限公司 | Laser processing system and laser processing control method thereof |
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2013
- 2013-07-18 CN CN201320429466.4U patent/CN203471145U/en not_active Expired - Lifetime
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103406665A (en) * | 2013-07-18 | 2013-11-27 | 深圳市大族激光科技股份有限公司 | Laser processing device |
| US10391597B2 (en) | 2014-03-31 | 2019-08-27 | Lincoln Global, Inc. | Laser workstation with endless loop conveyor and coordinated access doors |
| CN105364976A (en) * | 2014-08-25 | 2016-03-02 | 深圳市韵腾激光科技有限公司 | Dual SD card cutting locating device and method |
| CN105798460A (en) * | 2014-12-30 | 2016-07-27 | 上海团结普瑞玛激光设备有限公司 | Laser welding system for unequal-thickness plates |
| CN105034608A (en) * | 2015-07-10 | 2015-11-11 | 辽宁科技大学 | Industrial robot laser marking machine |
| CN105467583A (en) * | 2015-12-09 | 2016-04-06 | 苏州大学 | A small-scope laser translational scanning mirror apparatus |
| CN105817772A (en) * | 2016-05-11 | 2016-08-03 | 苏州天弘激光股份有限公司 | Rotary dual-workbench cantilever type laser cutting machine |
| CN106077961A (en) * | 2016-07-28 | 2016-11-09 | 平湖拓伟思自动化设备有限公司 | A kind of laser marking machine |
| CN107030394A (en) * | 2017-04-07 | 2017-08-11 | 上海嘉强自动化技术有限公司 | A kind of laser cutting machine |
| CN106984697A (en) * | 2017-04-20 | 2017-07-28 | 宿迁学院 | Positional punch device and method |
| CN106984697B (en) * | 2017-04-20 | 2019-02-05 | 宿迁学院 | Positional punch device and method |
| CN107160044A (en) * | 2017-07-24 | 2017-09-15 | 东莞市盛雄激光设备有限公司 | A kind of large-breadth plates laser etching machine |
| CN107498195A (en) * | 2017-08-11 | 2017-12-22 | 武汉天琪激光设备制造有限公司 | A kind of pipe cutting machine with Automatic Exchange Work Benche |
| CN107745188A (en) * | 2017-09-30 | 2018-03-02 | 深圳信息职业技术学院 | A kind of picosecond laser process equipment |
| CN107953681A (en) * | 2017-11-20 | 2018-04-24 | 苏州猎奇智能设备有限公司 | Vision guide marking machine and vision guide marking method |
| CN108406142B (en) * | 2018-03-23 | 2019-02-15 | 伊欧激光科技（苏州）有限公司 | A kind of linear movement system and the laser processing device with the linear movement system |
| CN108406142A (en) * | 2018-03-23 | 2018-08-17 | 伊欧激光科技（苏州）有限公司 | A kind of linear movement system and the laser processing device with the linear movement system |
| CN108672947A (en) * | 2018-05-21 | 2018-10-19 | 东莞市盛雄激光设备有限公司 | A kind of laser cutting production work station |
| CN109366000A (en) * | 2018-12-24 | 2019-02-22 | 姜堰经济开发区科创中心 | A kind of laser processing double component integrated three-dimensional platforms of high speed and precision |
| CN110032147A (en) * | 2019-05-24 | 2019-07-19 | 东莞市力星激光科技有限公司 | A kind of control system of laser cutting machine |
| CN110244661A (en) * | 2019-07-02 | 2019-09-17 | 东莞市力星激光科技有限公司 | A kind of control system of the laser pipe cutter of plate pipe one |
| CN111266736A (en) * | 2020-03-09 | 2020-06-12 | 北京阿李自动化科技有限公司 | Composite welding head and laser welding machine with same |
| CN113441843A (en) * | 2020-03-26 | 2021-09-28 | 深圳市大族数控科技股份有限公司 | Laser processing system and laser processing control method thereof |
| CN111482718A (en) * | 2020-05-18 | 2020-08-04 | 名光智能科技(佛山)有限公司 | High-precision gantry laser cutting equipment |
| CN112935581A (en) * | 2021-02-02 | 2021-06-11 | 大族激光科技产业集团股份有限公司 | Laser processing apparatus |
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